Substrate conveyance control method and substrate processing system
The substrate transfer control method minimizes particle adhesion and enhances productivity by strategically timing substrate transfers in the substrate processing system, addressing the challenge of particle adhesion during batch-to-single-wafer transitions.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- TOKYO ELECTRON LTD
- Filing Date
- 2025-12-11
- Publication Date
- 2026-07-02
AI Technical Summary
The adhesion of particles onto substrates during the transfer process in substrate processing systems is a significant challenge, particularly when transitioning from batch processing to single-wafer processing, which can lead to defects and reduced productivity.
A substrate transfer control method that involves immersing substrates in an immersion tank, transferring them to a transfer stand, and then to a single-wafer processing unit only when the unit is ready to receive them, ensuring minimal particle adhesion by maintaining a liquid film on the substrate surface during transport.
Reduces particle adhesion on substrates, enhances productivity by optimizing transfer timing, and prevents pattern collapse, thereby improving the overall processing efficiency and quality.
Smart Images
Figure JP2025043199_02072026_PF_FP_ABST
Abstract
Description
Substrate Transfer Control Method and Substrate Processing System
[0001] The present disclosure relates to a substrate transfer control method and a substrate processing system.
[0002] A substrate processing system including a batch processing unit, a single wafer processing unit, and an interface unit is known (see, for example, Patent Documents 1 to 3). The batch processing unit processes a lot including a plurality of substrates collectively. The single wafer processing unit processes the substrates of the lot one by one. The interface unit transfers the substrates from the batch processing unit to the single wafer processing unit.
[0003] Japanese Patent Application Laid-Open No. 2023-129235, Japanese Patent Application Laid-Open No. 2023-121707, Japanese Patent Application Laid-Open No. 2023-121571
[0004] The present disclosure provides a technique capable of reducing the adhesion of particles onto a substrate.
[0005] A substrate transfer control method according to an aspect of the present disclosure is a substrate transfer control method in a substrate processing system including a batch processing unit and a single wafer processing unit, for transferring and processing the substrates of a lot processed by the batch processing unit to the single wafer processing unit, the method including: a step of waiting with the substrates processed by the batch processing unit immersed in an immersion tank; a step of taking out the substrates from the immersion tank and transferring them to a transfer stand provided in the middle of a transfer path for transferring them to the single wafer processing unit; and a step of transferring the substrates on the transfer stand to the single wafer processing unit, wherein the step of transferring to the transfer stand is performed after it is determined that the single wafer processing unit is in a state capable of receiving the substrates.
[0006] According to the present disclosure, the adhesion of particles onto the substrate can be reduced.
[0007] Figure 1 is a schematic plan view showing a substrate processing system according to the embodiment. Figure 2 is a flowchart showing a substrate processing method according to the embodiment. Figure 3 is a flowchart showing a substrate transport control method according to the embodiment. Figure 4 is a diagram (1) showing a specific example of the substrate transport control method according to the embodiment. Figure 5 is a diagram (2) showing a specific example of the substrate transport control method according to the embodiment. Figure 6 is a diagram (3) showing a specific example of the substrate transport control method according to the embodiment. Figure 7 is a diagram (4) showing a specific example of the substrate transport control method according to the embodiment. Figure 8 is a diagram (1) showing another specific example of the substrate transport control method according to the embodiment. Figure 9 is a diagram (2) showing another specific example of the substrate transport control method according to the embodiment. Figure 10 is a diagram (3) showing another specific example of the substrate transport control method according to the embodiment.
[0008] Hereinafter, exemplary embodiments of the present disclosure, not limited to those described herein, will be described with reference to the attached drawings. In all attached drawings, identical or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.
[0009] [Substrate Processing System] Referring to Figure 1, the substrate processing system 1 according to the embodiment will be described. Figure 1 is a schematic plan view showing the substrate processing system 1 according to the embodiment.
[0010] As shown in Figure 1, the substrate processing system 1 comprises an input / output unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single-wafer processing unit 6, and a control circuit 9.
[0011] The loading / unloading section 2 serves as both the loading and unloading section. This allows the substrate processing system 1 to be miniaturized. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.
[0012] The load port 21 is located on the negative X-axis side of the loading / unloading section 2. Multiple load ports 21 (for example, four) are arranged along the Y-axis. The number of load ports 21 is not particularly limited. Cassettes C are placed on the load ports 21. Cassette C contains multiple (for example, 25) substrates W. Cassette C is loaded into and out of the load port 21. Inside the cassette C, the substrates W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1) which is N times the first pitch P1. N is a natural number of 2 or more, and in this embodiment it is 2, but it may be 3 or more.
[0013] Multiple (for example, four) stockers 22 are arranged along the Y-axis at the center of the X-axis of the loading / unloading section 2. Multiple (for example, two) stockers 22 are arranged along the Y-axis adjacent to the first interface section 3 on the positive X-axis side of the loading / unloading section 2. Stockers 22 may be arranged in multiple stages along the Z-axis. Stockers 22 temporarily store cassettes C containing substrates W before cleaning, and cassettes C that have become empty after the substrates W have been removed. The number of stockers 22 is not particularly limited.
[0014] The loader 23 is adjacent to the first interface section 3. The loader 23 is positioned on the positive X-axis side of the loading / unloading section 2. The cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. Multiple loaders 23 may be provided. The loaders 23 may be arranged in multiple stages along the Z-axis.
[0015] The cassette transport device 24 transports the cassette C between the load port 21, the stocker 22, and the loader 23. The cassette transport device 24 is, for example, a multi-joint transport robot.
[0016] The first interface unit 3 is positioned on the positive X-axis side of the loading / unloading unit 2. The first interface unit 3 transports the substrate W between the loading / unloading unit 2, the batch processing unit 4, and the single-wafer processing unit 6. The first interface unit 3 includes a substrate transfer device 31, a lot formation unit 32, and a first transfer table 33.
[0017] The substrate transfer device 31 transports the substrate W between the cassette C placed on the loader 23, the lot forming unit 32, and the first transfer table 33. The substrate transfer device 31 consists of a multi-axis (e.g., 6-axis) vertical articulated robot and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has a plurality of holding claws (not shown) capable of holding a plurality of substrates W (e.g., 25). The substrate holding arm 31a can assume any position and orientation in three-dimensional space while holding the substrate W with its holding claws.
[0018] The lot formation unit 32 is positioned on the positive X-axis side of the first interface unit 3. The lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L.
[0019] The first transfer table 33 is adjacent to the single-wafer processing unit 6. The first transfer table 33 is positioned on the positive Y-axis side of the first interface unit 3. The first transfer table 33 receives the substrate W from the fourth transport device 61 and temporarily stores it until it is handed over to the loading / unloading unit 2.
[0020] The batch processing unit 4 is located on the positive X-axis side of the first interface unit 3. The loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are arranged in this order, from the negative X-axis side to the positive X-axis side. The batch processing unit 4 processes a lot L containing multiple substrates W (for example, 50 or 100) at a first pitch P1 all at once. One lot L consists of, for example, M cassettes C with substrates W. M is a natural number greater than or equal to 2. M may be the same natural number as N, or a different natural number from N. The batch processing unit 4 includes a chemical tank 41, a rinse tank 42, a first transport device 43, a processing tool 44, and a drive device 45.
[0021] The chemical solution tank 41 and the rinse solution tank 42 are arranged along the X-axis. For example, the chemical solution tank 41 and the rinse solution tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical solution tank 41 and the rinse solution tank 42 are collectively referred to as the treatment tank. The number of chemical solution tanks 41 and rinse solution tanks 42 is not limited to that shown in Figure 1. For example, although there is one set of chemical solution tank 41 and rinse solution tank 42 in Figure 1, there may be multiple sets.
[0022] The chemical tank 41 stores the chemical solution into which the lot L is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H ３ PO ４ The phosphoric acid aqueous solution selectively etches and removes the silicon nitride film from the silicon oxide film. The chemical solution is not limited to phosphoric acid aqueous solution. The chemical solution may also be DHF (dilute hydrofluoric acid), BHF (mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (mixture of sulfuric acid, hydrogen peroxide and water), SC1 (mixture of ammonia, hydrogen peroxide and water), SC2 (mixture of hydrochloric acid, hydrogen peroxide and water), TMAH (mixture of tetramethylammonium hydroxide and water), plating solution, etc. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and may be multiple.
[0023] The rinsing solution tank 42 stores the first rinsing solution into which the lot L is immersed. The first rinsing solution is pure water that removes the chemical solution from the substrate W, for example, DIW (deionized water).
[0024] The first transport device 43 includes a guide rail 43a and a first transport arm 43b. The guide rail 43a is positioned on the negative side of the Y-axis relative to the processing tank. The guide rail 43a extends along the X-axis from the first interface unit 3 to the batch processing unit 4. The first transport arm 43b moves along the guide rail 43a. The first transport arm 43b may move along the Z-axis or rotate around the Z-axis. The first transport arm 43b transports a lot L in a single batch between the first interface unit 3 and the batch processing unit 4.
[0025] The processing device 44 receives and holds the lot L from the first transport arm 43b. The processing device 44 holds the multiple substrates W along the Y axis at a first pitch P1, and holds each of the multiple substrates W vertically.
[0026] The drive unit 45 moves the processing tool 44 along the X and Z axes. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then passes the lot L to the first conveying device 43.
[0027] In this embodiment, there is one unit for the processing tool 44 and the drive unit 45, but there may be multiple units. In the latter case, one unit immerses the rod L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the rod L in the first rinse solution stored in the rinse solution tank 42. In this case, the drive unit 45 only needs to move the processing tool 44 along the Z-axis, and does not need to move the processing tool 44 along the X-axis.
[0028] The second interface unit 5 is positioned on the positive Y-axis side of the batch processing unit 4. The second interface unit 5 transports the substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The second interface unit 5 includes an immersion tank 51, a second transport device 52, a third transport device 53, and a second transfer table 54.
[0029] The immersion tank 51 is positioned outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is positioned offset to the positive Y-axis relative to the processing tank. The immersion tank 51 stores the second rinse liquid into which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted out of the second rinse liquid by the third transport device 53. Since the substrate W is below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the collapse of the uneven pattern on the substrate W.
[0030] The second transport device 52 includes a Y-axis drive device 52a, a Z-axis drive device 52b, and a second transport arm 52c.
[0031] The Y-axis drive unit 52a is positioned on the positive X-axis side of the second interface unit 5. The Y-axis drive unit 52a extends along the Y-axis from the second interface unit 5 to the batch processing unit 4. The Y-axis drive unit 52a moves the Z-axis drive unit 52b and the second transport arm 52c along the Y-axis. The Y-axis drive unit 52a may include a ball screw.
[0032] The Z-axis drive unit 52b is movably mounted on the Y-axis drive unit 52a. The Z-axis drive unit 52b moves the second transport arm 52c along the Z-axis. The Z-axis drive unit 52b may include a ball screw.
[0033] The second transport arm 52c is movably mounted to the Z-axis drive unit 52b. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds multiple substrates W along the Y-axis at a first pitch P1, and holds each of the multiple substrates W vertically. The second transport arm 52c moves along the Y-axis and Z-axis by the Y-axis drive unit 52a and the Z-axis drive unit 52b. The second transport arm 52c is configured to be movable to multiple positions, including a handover position, an immersion position, and a standby position.
[0034] The transfer position is the position where the lot L is transferred between the first transport arm 43b and the second transport arm 52c. The transfer position is on the negative side of the Y axis and the positive side of the Z axis.
[0035] The immersion position is the position in which the rod L is immersed in the immersion tank 51. The immersion position is located on the positive side of the Y-axis and the negative side of the Z-axis compared to the handover position.
[0036] The standby position is the position where the second transport arm 52c waits when the lot L is not being transferred or when the lot L is not being immersed in the immersion tank 51. The standby position is directly below the transfer position (negative Z-axis side) and does not obstruct the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position by moving only upward (positive Z-axis side), thus improving throughput. The standby position may also be the same position as the immersion position. In this case, it is possible to prevent particles that may be generated as a result of the operation of the first transport device 43 from adhering to the second transport arm 52c. The standby position may also be directly above the immersion position (positive Z-axis side). In this way, by setting the standby position to a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.
[0037] The second conveying device 52 moves the second conveying arm 52c to the immersion position or standby position while the first conveying device 43 is operating. This prevents contact between the first conveying arm 43b and the second conveying arm 52c.
[0038] The third transport device 53 consists of a multi-axis (e.g., 6-axis) arm robot and has a third transport arm 53a at its tip. The third transport arm 53a has a holding claw (not shown) capable of holding one substrate W. The third transport arm 53a can take any position and orientation in three-dimensional space while holding the substrate W with the holding claw. The third transport device 53 transports the substrate W between the second transport arm 52c, which is in the immersion position, and the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a do not interfere with each other. As a result, one of the first transport device 43 and the third transport device 53 can be operated independently of the operating state of the other. Therefore, the first transport device 43 and the third transport device 53 can be operated at any timing, so the time required to transport the substrate W can be shortened. As a result, the productivity of the substrate processing system 1 is improved.
[0039] The second transfer table 54 is adjacent to the single-wafer processing unit 6. The second transfer table 54 is located on the negative X-axis side of the second interface unit 5. The second transfer table 54 is provided in the middle of the transport path that transports the substrate W from the immersion tank 51 to the single-wafer processing unit 6. The second transfer table 54 receives the substrate W from the third transport device 53 and temporarily stores it until it is handed over to the single-wafer processing unit 6. The substrate W removed from the immersion tank 51 is placed on the second transfer table 54. It is preferable that the substrate W placed on the second transfer table 54 has its surface wet with the second rinsing liquid, for example. In this case, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the uneven pattern on the substrate W can be suppressed. There may be one or more second transfer tables 54. The second transfer tables 54 may be arranged in multiple stages (for example, three stages) along the Z-axis.
[0040] The single-wafer processing unit 6 is located on the negative X-axis side of the second interface unit 5. The single-wafer processing unit 6 is located on the positive Y-axis side of the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4. The single-wafer processing unit 6 processes the substrates W one by one. The single-wafer processing unit 6 includes a fourth transport device 61 and a liquid processing device 62.
[0041] The fourth transport device 61 includes a guide rail 61a and a fourth transport arm 61b.
[0042] The guide rail 61a is arranged on the negative Y-axis side of the sheet processing unit 6. The guide rail 61a extends along the X-axis in the sheet processing unit 6.
[0043] The fourth transfer arm 61b moves along the guide rail 61a. The fourth transfer arm 61b rotates around the Z-axis. The fourth transfer arm 61b transfers the substrate W between the second delivery table 54, the liquid processing device 62, and the first delivery table 33. The number of the fourth transfer arms 61b may be one or more. In the latter case, the fourth transfer device 61 transfers a plurality of (for example, five) substrates W at once.
[0044] The liquid processing device 62 is arranged on the positive X-axis side and positive Y-axis side of the sheet processing unit 6. The liquid processing device 62 is of a sheet type and processes each substrate W with a processing liquid one by one. The liquid processing device 62 is arranged in multiple stages (for example, three stages) along the Z-axis. Thereby, a plurality of substrates W can be processed with the processing liquid at the same time. The processing liquid may be plural, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA (isopropyl alcohol). The liquid processing device 62 rotates the substrate W and removes the drying liquid from the substrate W by spin drying that shakes off the drying liquid from the substrate W by centrifugal force and removes the drying liquid from the upper surface of the substrate W, thereby drying each substrate W one by one.
[0045] The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. A program for controlling various processes executed in the substrate processing system 1 is stored in the storage unit 92. The control circuit 9 controls the operation of the substrate processing system 1 by causing the arithmetic unit 91 to execute the program stored in the storage unit 92.
[0046] The control circuit 9 includes an electronic circuit such as a CPU, an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), and executes various control operations described in this specification by executing instruction codes stored in a memory or by circuit design for special purposes.
[0047] In the substrate processing system 1, the substrate W is conveyed from the loading / unloading unit 2 to the first interface unit 3, the batch processing unit 4, the second interface unit 5, and the single wafer processing unit 6 in this order, and then returns to the loading / unloading unit 2.
[0048] [Operation of Substrate Processing System] Referring to FIG. 2, the operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described. FIG. 2 is a flowchart showing the substrate processing method according to the embodiment. The processing shown in FIG. 2 is performed under the control of the control circuit 9.
[0049] First, the cassette C is carried into the loading / unloading unit 2 in a state of accommodating a plurality of substrates W and placed on the load port 21. Inside the cassette C, the substrates W are held horizontally and held at a second pitch P2 (P2 = N × P1) in the vertical direction. N is a natural number of 2 or more, and is 2 in this embodiment, but may be 3 or more.
[0050] Next, the cassette transfer device 24 transfers the cassette C from the load port 21 to the loader 23. The lid of the cassette C transferred to the loader 23 is opened by the lid opening / closing mechanism.
[0051] Next, the substrate transfer device 31 receives the substrate W accommodated in the cassette C (S1 in FIG. 2) and transfers it to the lot forming unit 32.
[0052] Next, the lot forming unit 32 holds a plurality of substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L (S2 in FIG. 2). One lot L is composed of, for example, the substrates W of M cassettes C. Since the pitch of the substrates W becomes narrower from the second pitch P2 to the first pitch P1, the number of substrates W to be processed in a batch can be increased.
[0053] Next, the first conveying device 43 receives the lot L from the lot forming unit 32 and conveys it to the processing device 44.
[0054] Next, the processing tool 44 descends from above the chemical solution tank 41, immersing the rod L in the chemical solution and performing the chemical treatment (S3 in Figure 2). After that, the processing tool 44 rises to lift the rod L out of the chemical solution, and then moves horizontally (negative side in the X-axis direction) towards the top of the rinse solution tank 42.
[0055] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs the rinse liquid treatment (S3 in Figure 2). After that, the processing tool 44 rises to lift the lot L out of the first rinse liquid. Then, the first conveying device 43 receives the lot L from the processing tool 44 and hands it over to the second conveying device 52.
[0056] Next, the second transport arm 52c of the second transport device 52 moves horizontally (positive side of the Y-axis) and descends from above the immersion tank 51, immersing the lot L in the second rinsing liquid (S4 in Figure 2). The multiple substrates W of the lot L are held in the second rinsing liquid until they are pulled out of the second rinsing liquid by the third transport device 53. Since the substrates W are below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, preventing the collapse of the uneven pattern on the substrates W.
[0057] Next, the third transport device 53 transports the substrates W of lot L, which are held by the second transport arm 52c in the second rinsing liquid, to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54.
[0058] Next, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid processing device 62.
[0059] Next, the liquid processing apparatus 62 processes each substrate W with liquid (S5 in Figure 2). The liquid may consist of multiple liquids, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA. The liquid processing apparatus 62 supplies pure water and the drying liquid in that order to the upper surface of the substrate W, forming a liquid film of the drying liquid. Next, the liquid processing apparatus 62 dries the substrate W by spin drying.
[0060] Next, the fourth transport device 61 receives the substrate W from the liquid processing device 62 and transports it to the first transfer table 33.
[0061] Next, the substrate transfer device 31 receives the substrate W from the first transfer table 33 and stores it in the cassette C (S6 in Figure 2). The cassette C, containing multiple substrates W, is then discharged from the loading / unloading section 2. This completes the process shown in Figure 2.
[0062] [Method for controlling substrate transport] Referring to Figure 3, an example of a method for controlling the transport of substrates W when the third transport device 53 transports the substrates W of a lot L to be immersed in the immersion tank 51 to the second transfer table 54 will be described. Figure 3 is a flowchart of the method for controlling the transport of substrates W according to the embodiment. The process shown in Figure 3 is carried out under the control of the control circuit 9. The process shown in Figure 3 is carried out, for example, after the lot L processed by the batch processing unit 4 has been immersed in the immersion tank 51.
[0063] In step S31, the control circuit 9 determines whether or not there is a substrate W on the second transfer table 54. If it is determined in step S31 that there is a substrate W on the second transfer table 54 (YES in step S31), the control circuit 9 terminates the process. If it is determined in step S31 that there is no substrate W on the second transfer table 54 (NO in step S31), the control circuit 9 proceeds to step S32. That is, if there is a substrate W on the second transfer table 54, the substrate W of lot L to be immersed in the immersion tank 51 will not be transported to the second transfer table 54, but will remain in the immersion tank 51. This prevents the substrate W, which has been lifted out of the second rinsing liquid in the immersion tank 51 by the third transport device 53, from remaining held in the third transport device 53.
[0064] In step S32, the control circuit 9 determines whether the fourth transport device 61 is performing transport other than transporting the substrate W from the liquid processing device 62 to the first transfer table 33. If the control circuit 9 determines in step S32 that the fourth transport device 61 is performing transport other than transporting the substrate W from the liquid processing device 62 to the first transfer table 33 (YES in step S32), the control circuit 9 terminates processing. If the control circuit 9 determines in step S32 that the fourth transport device 61 is not performing transport other than transporting the substrate W from the liquid processing device 62 to the first transfer table 33 (NO in step S32), the control circuit 9 proceeds to step S33. That is, if the fourth transport device 61 is performing transport other than transporting the substrate W from the liquid processing device 62 to the first transfer table 33, the substrate W of lot L to be immersed in the immersion tank 51 will not be transported to the second transfer table 54, but will remain in the immersion tank 51. This prevents the substrate W, which has been lifted out of the second rinsing solution in the immersion tank 51 by the third transport device 53, from becoming stagnant on the second transfer table 54.
[0065] The substrate W being transported from the second transfer table 54 to the liquid processing device 62 has a liquid film of the second rinsing liquid formed on its upper surface. Therefore, the fourth transport device 61 transports the substrate W at a low speed to prevent liquid droplets from falling from the upper surface of the substrate W when transporting it from the second transfer table 54 to the liquid processing device 62. In contrast, the substrate W being transported from the liquid processing device 62 to the first transfer table 33 is the substrate W after drying by the liquid processing device 62, and there is no liquid film on its upper surface. Therefore, the fourth transport device 61 transports the substrate W at a high speed when transporting it from the liquid processing device 62 to the first transfer table 33. As a result, the transport of the substrate W from the liquid processing device 62 to the first transfer table 33 by the fourth transport device 61 is completed before the transport of the substrate W from the immersion tank 51 to the second transfer table 54 by the third transport device 53. Therefore, from the standpoint of improving productivity, the transport of the substrate W from the liquid processing device 62 to the first transfer table 33 by the fourth transport device 61 may be excluded from the determination conditions in step S32.
[0066] In step S33, the control circuit 9 determines whether it has confirmed all the liquid processing devices 62 included in the transport flow. For example, if the transport flow includes three liquid processing devices 62, the control circuit 9 determines whether it has confirmed all three liquid processing devices 62 included in the transport flow. If it determines in step S33 that it has confirmed all the liquid processing devices 62 included in the transport flow (YES in step S33), the control circuit 9 proceeds to step S37. If it determines in step S33 that it has not confirmed all the liquid processing devices 62 included in the transport flow (NO in step S33), the control circuit 9 proceeds to step S34.
[0067] In step S34, the control circuit 9 determines whether the liquid processing device 62 is in a normal state. The determination of whether the liquid processing device 62 is in a normal state may be based on whether the preparation of the processing liquid used by the liquid processing device 62 when processing the substrate W is complete. The preparation of the processing liquid may include whether the temperature of the processing liquid has reached the set temperature. The preparation of the processing liquid may also include whether the remaining amount of processing liquid is greater than the amount used when processing one substrate W. For example, the control circuit 9 determines that the liquid processing device 62 is in a normal state if the temperature of the processing liquid used by the liquid processing device 62 when processing the substrate W has reached the set temperature and the remaining amount of the processing liquid is greater than the amount used when processing one substrate W. If the control circuit 9 determines in step S34 that the liquid processing device 62 is in a normal state (YES in step S34), the control circuit 9 proceeds to step S35. If the control circuit 9 determines in step S34 that the liquid processing device 62 is not in a normal state (NO in step S34), the control circuit 9 returns to step S33.
[0068] In step S35, the control circuit 9 determines whether or not there is a substrate W in the liquid processing device 62. If there is no substrate W in the liquid processing device 62 in step S35 (YES in step S35), the control circuit 9 proceeds to step S36. If there is a substrate W in the liquid processing device 62 in step S35 (NO in step S35), the control circuit 9 returns to step S33.
[0069] In step S36, the control circuit 9 determines whether or not dummy processing is currently being performed and is not scheduled to be performed in the liquid processing apparatus 62. Dummy processing may include initial dummy processing, periodic dummy processing, and periodic cleaning processing. Initial dummy processing is a process performed before processing the first substrate W of lot L. Initial dummy processing may be a process performed under the same conditions as processing the substrate W, but without any substrate W present in the liquid processing apparatus 62. Initial dummy processing is an example of first dummy processing. Periodic dummy processing is a process performed when processing the substrate W has not been performed in the liquid processing apparatus 62 for a given time. Periodic dummy processing may be a process performed under the same conditions as processing the substrate, but without any substrate W present in the liquid processing apparatus 62. Periodic cleaning processing is a process performed at the same timing as periodic dummy processing. Periodic cleaning processing may be a process of cleaning each part of the liquid processing apparatus 62, but without any substrate W present in the liquid processing apparatus 62. Periodic dummy processing and periodic cleaning processing are examples of second dummy processing. If, in step S36, dummy processing is not currently being performed and is not scheduled to be performed in the liquid processing device 62 (YES in step S36), the control circuit 9 proceeds to step S37. After step S36, but before proceeding to step S37, the control circuit 9 may determine whether the liquid processing device 62 has already performed the initial dummy processing for lot L. If the control circuit 9 determines that the liquid processing device 62 has already performed the initial dummy processing for lot L, the control circuit 9 proceeds to step S37. If the control circuit 9 determines that the liquid processing device 62 has not already performed the initial dummy processing for lot L, the control circuit 9 returns to step S33. If, in step S36, dummy processing is currently being performed or is scheduled to be performed in the liquid processing device 62 (NO in step S36), the control circuit 9 returns to step S33.
[0070] In step S37, the control circuit 9 turns on the flag indicating that there is an acceptable liquid processing device.
[0071] In step S38, the control circuit 9 determines whether the "acceptable liquid processing equipment is available" flag is on. If the "acceptable liquid processing equipment is available" flag is on in step S38 (YES in step S38), the control circuit 9 proceeds to step S39. In step S39, the control circuit 9 controls the fourth transport device 61 to transport the substrate W from the immersion tank 51 to the second transfer table 54, and terminates the process. After step S39, but before terminating the process, the control circuit 9 may turn on a flag that prohibits the execution of periodic dummy processing and periodic cleaning processing until the processing of all substrates W in lot L is completed. In this case, the control circuit 9 will not perform periodic dummy processing and periodic cleaning processing until the processing of all substrates W in lot L is completed. The control circuit 9 may turn off the flag that prohibits the execution of periodic dummy processing and periodic cleaning processing when the processing of all substrates W in lot L is completed. The point in time when the processing of all substrates W in lot L is completed is, for example, when the last substrate W in lot L is transported to the first transfer table 33. If the flag indicating "acceptable liquid processing device available" is not turned on in step S38 (NO in step S38), the control circuit 9 terminates the process.
[0072] As described above, according to the substrate W transport control method of the embodiment, after it is determined that there is a liquid processing device 62 that can receive the substrate in the single-wafer processing unit 6, the fourth transport device 61 transports the substrate W from the immersion tank 51 to the second transfer table 54. In this case, the retention of the substrate W is reduced while it is being transported from the immersion tank 51 to the liquid processing device 62. As a result, the substrate W can be transported from the immersion tank 51 to the liquid processing device 62 while maintaining the liquid film of the second rinse liquid formed on the upper surface of the substrate W. Therefore, the adhesion of particles to the substrate W can be reduced without supplying the second rinse liquid to the upper surface of the substrate W during transport from the immersion tank 51 to the liquid processing device 62.
[0073] Furthermore, if the transport of the substrate W from the immersion tank 51 to the liquid processing device 62 is prohibited (YES in step S31, YES in step S32, NO in step S38), the control circuit 9 may display an alarm indicating the reason why the transport of the substrate W is prohibited.
[0074] Furthermore, the control circuit 9 may monitor the time from when the substrate W is removed from the immersion tank 51 to when the liquid processing device 62 starts processing the substrate W for each substrate W in lot L, and output an alarm if this time exceeds a threshold.
[0075] [Specific Example of Substrate Transport Control Method] Referring to Figures 4 to 7, a specific example of a substrate transport control method according to the embodiment will be described. Figures 4 to 7 are diagrams showing a specific example of a substrate transport control method according to the embodiment. In Figures 4 to 7, the second transfer table 54 is arranged in two stages, the liquid processing device 62 is arranged in three stages, and the first transfer table 33 is capable of accommodating substrates W in multiple stages will be described as an example.
[0076] Figure 4 shows the case where there is no substrate W on the second transfer table 54, all liquid processing equipment 62 are ready to accept it, and the fourth transport device 61 is not transporting any substrate W. In this case, as shown in Figure 5, the transport of substrate W from the immersion tank 51 to the liquid processing equipment 62 via the second transfer table 54 is repeated (arrows F11 and F12) until substrate W is transported to all of the ready liquid processing equipment 62.
[0077] As shown in Figure 6, once the substrates W have been transported to all the liquid processing devices 62, the substrates W in the immersion tank 51 remain in the immersion tank 51 without being removed.
[0078] As shown in Figure 7, when the substrate W is transported from the upper liquid processing apparatus 62 to the first transfer table 33 (arrow F13), the substrate W is transported from the immersion tank 51 to the second transfer table 54 (arrow F14), and the substrate W is transported from the second transfer table 54 to the upper liquid processing apparatus 62 (arrow F15).
[0079] Referring to Figures 8 to 10, another specific example of the substrate W transport control method according to the embodiment will be described. Figures 8 to 10 are diagrams showing another specific example of the substrate W transport control method according to the embodiment. In Figures 8 to 10, the second transfer table 54 is arranged in two stages, the liquid processing device 62 is arranged in three stages, and the first transfer table 33 is capable of accommodating substrates W in multiple stages will be described as an example.
[0080] Figure 8 shows a scenario where all liquid processing devices 62 have substrates W1 of the same lot L, the immersion tank 51 has substrates W2 of a different lot L than the substrates W1 in the liquid processing devices 62, and the upper liquid processing device 62 is scheduled to perform periodic dummy processing. In this case, as shown in Figure 9, even if substrates W1 are transported from the upper liquid processing device 62 to the first transfer table 33 (arrow F21), substrates W1 are still present in the middle and lower liquid processing devices 62. Therefore, periodic dummy processing is not performed in the upper liquid processing device 62. Also, because periodic dummy processing is scheduled to be performed in the upper liquid processing device 62, substrates W are not transported from the immersion tank 51 to the second transfer table 54.
[0081] As shown in Figure 10, when the substrate W1 is transported from the middle and lower liquid processing devices 62 to the first transfer table 33 (arrow F22), a periodic dummy processing is performed in the upper liquid processing device 62. When the periodic dummy processing is completed in the upper liquid processing device 62, the substrate W2 is transported from the immersion tank 51 to the second transfer table 54 (arrow F23).
[0082] The embodiments disclosed herein should be considered in all respects to be illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.
[0083] This international application claims priority based on Japanese Patent Application No. 2024-229366, filed on 25 December 2024, and the entire contents of said application are incorporated herein by reference.
[0084] 1. Substrate processing system 4. Batch processing unit 5. Second interface unit 51. Immersion tank 54. Second transfer table 6. Single-wafer processing unit L. Lot W. Substrate
Claims
1. A substrate transport control method in a substrate processing system comprising a batch processing unit and a single-wafer processing unit, wherein a batch processing unit transports a lot of substrates processed in the batch processing unit to the single-wafer processing unit for processing, comprising: a step of keeping the substrates processed in the batch processing unit immersed in an immersion tank; a step of removing the substrates from the immersion tank and transporting them to a transfer table provided in the middle of a transport path to the single-wafer processing unit; and a step of transporting the substrates from the transfer table to the single-wafer processing unit, wherein the step of transporting to the transfer table is performed after it has been determined that the single-wafer processing unit is in a state where it can accept the substrates.
2. The substrate transport control method according to claim 1, wherein the single-wafer processing unit has a liquid processing device for processing the substrates one by one with a processing liquid, and in the step of transporting the substrates to the single-wafer processing unit, the substrates on the transfer table are transported to the liquid processing device.
3. The substrate transport control method according to claim 2, wherein the determination is made based on whether or not the liquid processing device is in a normal state.
4. The method for controlling the transport of a substrate according to claim 3, wherein the determination is made based on whether or not there is a substrate in the liquid processing apparatus.
5. The substrate transport control method according to claim 4, wherein the determination is made based on whether or not dummy processing is currently being performed and is not scheduled to be performed in the liquid processing apparatus.
6. The substrate transport control method according to claim 5, wherein the dummy processing is performed when the substrate is not present in the liquid processing apparatus.
7. The substrate transport control method according to claim 6, wherein the dummy processing includes: a first dummy processing performed before processing the first substrate of the lot; and a second dummy processing performed when the substrate has not been processed in the liquid processing device for a given time.
8. The substrate transport control method according to claim 7, wherein the step of transporting to the transfer table is performed when the liquid processing device determines that the first dummy processing has been performed on the lot.
9. A substrate transport control method according to claim 7, further comprising the step of prohibiting the execution of the second dummy processing until the processing of all the substrates in the lot has been completed, after it has been determined that the single-wafer processing unit is in a state where it can accept the substrate.
10. The method for controlling the transport of a substrate according to any one of claims 1 to 9, wherein the step of transporting to the transfer table is performed when the substrate is not present on the transfer table.
11. The substrate transport control method according to any one of claims 2 to 9, wherein the single-wafer processing unit has a transport device for transporting the substrate before processing in the liquid processing device and the substrate after processing in the liquid processing device, and the step of transporting to the transfer table is performed when transport other than transporting the substrate after processing in the liquid processing device is not being performed.
12. A substrate processing system comprising a batch processing unit and a single-wafer processing unit, wherein a batch processing unit processes a lot of substrates, and the substrate processing system transports these substrates to the single-wafer processing unit for processing, the system comprising a control circuit configured to perform the following steps: a step of immersing the substrates processed in the batch processing unit in an immersion tank; a step of removing the substrates from the immersion tank and transporting them to a transfer table provided in the middle of a transport path to the single-wafer processing unit; and a step of transporting the substrates from the transfer table to the single-wafer processing unit, wherein the control circuit is configured to perform the step of transporting to the transfer table after it has been determined that the single-wafer processing unit is in a state where it can accept the substrates.