Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package

Abstract

Provided is a prepreg exhibiting high reflow heat resistance while containing a component having low dielectric characteristics. Also provided are a laminate, printed wiring board, and semiconductor package, each being obtained using the prepreg. Specifically, this thermosetting resin composition contains: a maleimide resin (A) including an indane skeleton; and an acrylic resin (X) having one or more functional groups selected from the group consisting of a hydroxy group, a carboxy group, and a substituted amino group.

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