Electronic component storage package and electronic device

Abstract

This package comprises: a substrate; a frame body; an insulator; and a lead terminal. The frame body is provided on the substrate, and has a through-hole portion that penetrates the frame body between a first frame body surface and a second frame body surface and that opens wider on the first frame body surface side. The insulator is fitted into the through-hole portion from the first frame body surface side, and is joined to the frame body. The lead terminal penetrates the insulator between a first insulator surface and a second insulator surface, and is disposed so as to extend from the first frame body surface side to the second frame body surface side. The insulator is joined to the frame body with the first insulator surface protruding from the first frame body surface. At least a portion of a side surface of the insulator between the first insulator surface and the second insulator surface has a chamfered portion.

Description

Package for storing electronic components and electronic device

[0001] The present disclosure relates to a package for storing electronic components and an electronic device.

[0002] Conventionally, a package for storing electronic components for storing electronic components and an electronic device configured by storing electronic components in the package for storing electronic components are known.

[0003] For example, Patent Document 1 proposes a package for storing electronic components and an electronic device including a substrate, a frame disposed on the substrate, and input / output terminals provided through the frame.

[0004] The input / output terminals have lead terminals for electrically connecting the electronic components and an external circuit board or the like. The lead terminals are disposed via a disk-shaped ceramic holding member, and the ceramic holding member is used as an insulator that blocks an electrical connection between the lead terminals and the frame, and is fitted and joined to a frame through-hole provided in the frame.

[0005] Japanese Patent Application Laid-Open No. 2014-167995

[0006] The package for storing electronic components according to the present disclosure includes a substrate, a frame, an insulator, and lead terminals. The frame has a through-hole portion that penetrates between the first frame surface and the second frame surface and has a wide opening on the first frame surface side, and is provided on the substrate. The insulator is fitted into the through-hole portion from the first frame surface side and joined to the frame. The lead terminals penetrate between the first insulating surface and the second insulating surface of the insulator and are disposed from the first frame surface side to the second frame surface side. The insulator has a chamfer portion on at least a part of the side surface of the insulator between the first insulating surface and the second insulating surface, with the first insulating surface protruding from the first frame surface and being joined to the frame. '

[0007] The electronic device according to the present disclosure includes a package for storing electronic components, an electronic component mounted on the substrate of the package for storing electronic components, and a lid joined to the frame.

[0008] This is a partially cutaway perspective view showing the schematic configuration of the electronic component housing package of this embodiment. This is a front view showing the schematic configuration of the electronic component housing package. This is a partially cutaway enlarged perspective view showing the frame, insulator, and vicinity of the lead terminals in an enlarged view. This is an enlarged front view showing the frame, insulator, and vicinity of the lead terminals in an enlarged view. This is an enlarged cross-sectional view taken along line A-A' as seen from the positive side in the X direction, showing the frame, insulator, and lead terminals in an enlarged view. This is an enlarged perspective view showing the frame and the vicinity of the through-hole. This is a perspective view taken from the first insulator surface side showing the schematic configuration of the insulator and lead terminals. This is a perspective view taken from the second insulator surface side showing the schematic configuration of the insulator and lead terminals. This is a perspective view showing the schematic configuration of the flange and washer. This is an explanatory diagram showing a first alternative example of the arrangement of the insulator and multiple lead terminals. This is an explanatory diagram showing a second alternative example of the arrangement of the insulator and multiple lead terminals. This is an explanatory diagram showing a third alternative example of the arrangement of the insulator and multiple lead terminals. This is an explanatory diagram showing a fourth alternative example of the arrangement of the insulator and multiple lead terminals. This is an explanatory diagram showing a first alternative example of the through-hole portion of the frame. This is an explanatory diagram showing a second alternative example of the through-hole portion of the frame. This is an exploded perspective view showing the schematic configuration of the electronic device.

[0009] Embodiments of the present disclosure will be described below with reference to the drawings. However, for the sake of clarity, the drawings below are simplified to show only the main components necessary to describe the embodiments. Therefore, embodiments of the present disclosure may include any components not shown in the drawings. Furthermore, the drawings do not necessarily accurately represent the dimensional ratios of the actual components.

[0010] In this specification, the first substrate surface 11 side of the substrate 10 constituting the electronic component housing package 1 (hereinafter simply referred to as "package 1") can be defined as the upper side. The opposite side, the second substrate surface 12 side, can be defined as the lower side.

[0011] In this disclosure, the directions do not refer to the directions in actual use. Furthermore, for convenience, each direction is expressed using the Cartesian coordinate system XYZ, where the top is the positive side of the Z direction. In this disclosure, "plan view" means a view from above (the positive side of the Z direction), and includes planar perspective. Similarly, in this disclosure, "front view" means a view from the negative side of the Y direction, "rear view" means a view from the positive side of the Y direction, and "side view" means a view from the positive (or negative) side of the X direction.

[0012] Furthermore, expressions such as "constant," "orthogonal," "perpendicular," "parallel," and "same" may be used in the following descriptions. These expressions do not necessarily strictly mean "constant," "orthogonal," "perpendicular," "parallel," or "same," respectively, and may allow for deviations in manufacturing accuracy, installation accuracy, etc. Numerical ranges indicated using "~" include the values ​​before and after them as the lower and upper limits, respectively.

[0013] In electronic component housing packages and electronic devices, it is necessary to restrict the rotation of lead terminals attached to an insulator along their longitudinal axis. Furthermore, stress can concentrate in the frame to which the ceramic holding member and the insulator are joined.

[0014] The electronic component housing package and electronic device of this disclosure can restrict the rotation of lead terminals attached to an insulator and alleviate stress applied to the insulator, etc.

[0015] 1. [Package] As shown in Figure 1-9, the package 1 of this embodiment mainly comprises a substrate 10, a frame 20, an insulator 30, and lead terminals 50.

[0016] The substrate 10 is made up of, for example, a plate-shaped member, and its shape is not particularly limited. For example, the substrate 10 can be substantially rectangular in plan view.

[0017] In the package 1 of this embodiment, the substrate 10 has a first substrate surface 11 corresponding to the top surface of the substrate and a second substrate surface 12 opposite to the first substrate surface 11 and opposite to the bottom surface of the substrate, and is formed in a substantially rectangular shape in plan view.

[0018] The planar dimensions of the substrate 10 can be, for example, approximately 10 mm × 5 mm to 50 mm × 30 mm. Here, the first substrate surface 11 (top surface of the substrate) corresponds to the substrate surface in this disclosure.

[0019] The frame 20 is a frame-shaped member composed of a plurality of frame walls 24 sandwiched between a first frame surface 21 and a second frame surface 22. Here, the first frame surface 21 corresponds to the outer surface of the frame 20. On the other hand, the second frame surface 22 corresponds to the inner surface of the frame 20. The shape of the frame 20 is not particularly limited. For example, the frame 20 can be substantially rectangular in plan view. Each of the frame walls 24 constituting the frame 20 may be made of the same material, or it may be made of different materials. For example, one surface may be made of a metal material and the remaining three surfaces may be made of a ceramic material.

[0020] The frame 20 has a through-hole 23 that penetrates between the first frame surface 21 and the second frame surface 22, with the first frame surface 21 side being widely open, and is provided on the first substrate surface 11 (see Figure 6).

[0021] The planar dimensions of the frame 20 should be such that it can be placed on the first substrate surface 11 of the substrate 10, for example, it can be about 10 mm x 5 mm to 50 mm x 30 mm. Also, the thickness of the frame wall 24, which corresponds to the space between the first frame surface 21 and the second frame surface 22, can be about 0.5 to 3 mm, for example.

[0022] The through-hole portion 23 includes a recessed hole portion 25 that is recessed from the first frame surface 21 side of the frame body 20 toward the second frame surface 22 side, and a through-hole portion 26 that has a smaller opening portion than the recessed hole portion 25 and penetrates from the middle of the frame wall 24 to the second frame surface 22. The recessed hole portion 25 may be, for example, substantially rectangular in shape, and the through-hole portion 26 may be, for example, circular in shape.

[0023] Therefore, as shown in Figures 4 and 6, in a front view from the first frame surface 21 (a front view from the negative side in the Y direction), the recessed hole 25 of the through hole 23 in the package 1 of this embodiment is substantially rectangular in shape. On the other hand, in a rear view from the second frame surface 22 (a rear view from the positive side in the Y direction), the through hole 26 of the through hole 23 is circular in shape.

[0024] Furthermore, as shown in Figure 5, within the frame wall 24, the through-hole 23 changes in its opening at the boundary between the recessed hole 25 and the through-hole 26, forming a step in cross-sectional view. The shape of the through-hole 23 is not particularly limited and should be such that it restricts the rotation of the insulator 30 and allows the lead terminal 50 to pass through.

[0025] The number of through-holes 23 provided in the frame 20 is not particularly limited. For example, as shown in Figure 2, a pair of through-holes 23 can be provided in the frame wall 24 of the frame 20 in a front view.

[0026] The materials constituting the substrate 10 and the frame 20 can be various materials such as metal materials, ceramic materials, and resin materials. For example, metal materials include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloy, copper-molybdenum alloy, and iron-nickel-cobalt alloy.

[0027] Examples of ceramic materials include aluminum oxide sintered bodies, aluminum nitride sintered bodies, silicon carbide sintered bodies, mullite sintered bodies, and glass ceramics. Examples of resin materials include epoxy resin, polyimide, and liquid crystal polymer. When joining the insulator 30 to the frame 20, a non-conductive bonding agent such as a resin bonding agent may be used. Furthermore, if the frame 20 is an insulating material, the two can be joined using a brazing agent or solder by metallization, which involves applying a metal layer to the joining surface of the frame 20 or the joining surface of the insulator 30.

[0028] The substrate 10 and the frame 20 may be integrally formed from the same material, or they may be separately formed from different materials.

[0029] The insulator 30 is fitted into the recessed hole 25 of the through hole 23 from the first frame surface 21 side, and connected in a state in which at least a part of it is embedded in the frame 20. The insulator 30 mainly comprises a first insulator surface 31 and a second insulator surface 32 opposite to the first insulator surface 31, and further comprises an insulator side surface 33 between the first insulator surface 31 and the second insulator surface 32.

[0030] The insulator 30 can be made of a ceramic material. For example, aluminum oxide sintered body, aluminum nitride sintered body, silicon carbide sintered body, mullite sintered body, glass ceramics, etc. can be used.

[0031] The lead terminal 50 penetrates between the first insulating surface 31 and the second insulating surface 32 of the insulator 30 and is positioned from the first frame surface 21 side to the second frame surface 22 side of the frame 20.

[0032] The lead terminal 50 is a conductor and can be formed mainly from a metallic material. Examples of metallic materials include copper, tungsten, molybdenum, iron, nickel, or cobalt, or alloys thereof. Specific examples of alloys include copper-tungsten alloys, copper-molybdenum alloys, and iron-nickel-cobalt alloys.

[0033] In the package 1 of this embodiment, the insulator 30, which is fitted into the recessed hole 25 of the through hole 23 and joined to the frame 20, can restrict the rotation of the lead terminal 50.

[0034] The insulator 30 can be formed in a substantially rectangular shape to match the shape of the recessed hole 25 of the through-hole 23. As a result, the rotation of the insulator 30 is restricted by the recessed hole 25 of the joined through-hole 23 when the lead terminal 50 rotates around its longitudinal axis.

[0035] The insulator 30 is constructed so that its first insulator surface 31 protrudes from the first frame surface 21 of the frame 20. More specifically, as shown in Figures 3 and 5, in a side view taken from the positive side in the X direction, the surface positions of the first frame surface 21, which corresponds to the outer surface of the frame 20, and the first insulator surface 31 do not coincide, and the first insulator surface 31 protrudes. In other words, a part of the insulator 30 is embedded in the frame 20 while maintaining a positional relationship in which the first frame surface 21 of the frame 20 and the insulator side surface 33 of the insulator 30 intersect.

[0036] As a result, even if foreign matter is mixed in between the insulator 30 and the through-hole 23 of the frame 20, the likelihood of avoiding electrical connection between the first metal layer 37 (details to be described later) provided on the first insulating surface 31 of the insulator 30 and the frame 20 is increased.

[0037] In other words, the possibility of a short circuit due to foreign matter contamination can be reduced, and the occurrence of malfunctions associated with such a short circuit can be suppressed.

[0038] In the package 1 of this embodiment, the insulator 30 is provided with a chamfered portion 34 on at least a part of the insulator side surface 33 that connects the first insulator surface 31 and the second insulator surface 32.

[0039] The shape of the chamfered portion 34 is not particularly limited. For example, it can be a so-called "C-chamfer (corner chamfer)" shape, in which the four corners of the insulator 30, which is made of a roughly rectangular plate-like member, are cut straight at a 45° angle. Alternatively, it can be a so-called "R-chamfer (round chamfer)" shape, in which the corners are cut in a rounded curve with a predetermined curvature.

[0040] By providing the chamfered portion 34, it becomes easier to determine the fitting position when fitting the insulator 30 into the through hole 23, and the work of attaching the insulator 30 and joining it to the frame 20 can be performed stably.

[0041] Furthermore, the process of removing the joined insulator 30 from the through-hole 23 (unjoining operation) becomes easier. As a result, the manufacturing process of the package 1 can be simplified and the burden on workers can be reduced.

[0042] By providing the chamfered portion 34, the stress applied to the corners of the insulator 30 joined to the frame 20 can be distributed.

[0043] In other words, stress concentration at the corners of the insulator 30 can be avoided. This prevents problems such as cracks forming in the insulator 30.

[0044] By providing the chamfered portion 34, a gap 35 is formed between the concave hole portion 25 of the substantially rectangular through-hole portion 23 and the chamfered portion 34 of the insulator 30. As shown in FIGS. 2 and 4, such a gap 35 can be visually recognized from the front view side (negative side in the Y direction). Also, a hole bottom surface 27 that constitutes a part of the concave hole portion 25 is exposed to the outside.

[0045] By forming the gap 35, the possibility of preventing a bonding material such as a metal brazing material used for bonding the insulator 30 from leaking to the first insulating surface 31 side of the insulator 30 can be increased. That is, a part of the bonding material used when bonding the insulator 30 to the frame body 20 can accumulate in the gap 35. Thereby, it is possible to suppress the occurrence of problems such as a short circuit due to the excess bonding material flowing to the lead terminal 50 side and electrically connecting between the lead terminal 50 and the frame body 20.

[0046] In addition, as described above, in the package 1 of the present embodiment, the first insulating surface 31 of the insulator 30 protrudes with respect to the first frame surface 21. Therefore, when bonding the insulator 30 to the frame body 20, it is possible to suppress the occurrence of problems such as a bonding material such as a metal brazing material flowing out to the first insulating surface 31 side and shorting between the lead terminal 50 and the frame body 20.

[0047] As shown in FIG. 5, a predetermined clearance 43 may be provided between the insulator 30 and the lead terminal 50 sandwiched between the flange portion 41 and the washer 42. Thereby, the operation of passing the lead terminal 50 through the insulator 30 can be simplified. That is, the efficiency of the penetration operation can be improved.

[0048] Here, as shown in FIGS. 4 and 7, the chamfered portion 34 of the insulator 30 is preferably an R-chamfered portion that has been R-chamfered. The stress can be more effectively relaxed by the R-chamfered portion processed in a curved shape with a predetermined radius of curvature.

[0049] In the package 1 of this embodiment, the insulating thickness T of the insulator 30 used is not particularly limited. For example, a thickness of about 0.5 to 5 mm can be used. Here, the insulating thickness T corresponds to the distance between the first insulating surface 31 and the second insulating surface 32 (see Figure 5). Furthermore, the protrusion height H of the insulator 30 from the first frame surface 21 to the first insulating surface 31 can be set to, for example, about 0.1 to 2.0 mm (see Figure 5).

[0050] If the protrusion height H exceeds 2.0 mm, the overall size of the package 1 including the insulator 30 will increase, which may limit its applications. If the protrusion height H is 0.1 mm or more, the possibility of the bonding material creeping up onto the first insulator surface 31 can be reduced.

[0051] Therefore, it is preferable to set the protruding height H of the insulator 30 to 1 / 2 or less of the insulator thickness T. This ensures a sufficient amount of embedding of the insulator 30 into the frame 20 relative to the thickness of the insulator 30, and stabilizes the joint state between the frame 20 and the insulator 30.

[0052] In the package 1 of this embodiment, the through-hole portion 23 of the frame 20 may be provided with chamfered corner portions 28. That is, the concave portion 25 of the substantially rectangular through-hole portion 23 can be formed by chamfering the four corner portions.

[0053] The shape of the chamfering treatment of the chamfered hole corner 28 is not particularly limited, and as already explained with respect to the insulator 30, it can be a "C chamfer (corner chamfer)" shape or a "R chamfer (round chamfer)" shape.

[0054] In package 1 of this embodiment, as shown in Figures 2 and 4, chamfered corners 28 are used. For example, if a rectangular through-hole 23 has corners at all four corners, stress tends to concentrate at these corners. As a result, cracks and the like are more likely to occur in the frame 20 (through-hole 23). However, since the through-hole 23 of package 1 of this embodiment has a recessed hole 25 with chamfered corners 28, stress does not concentrate at the corners and can be distributed. This prevents excessive load from being placed on the insulator 30 and the frame 20 having the through-hole 23, and reduces the possibility of cracks and the like occurring.

[0055] In the package 1 of this embodiment, the chamfered portion 34 of the insulator 30 is formed with an R-chamfered portion, while the chamfered hole corner portion 28 of the through hole portion 23 is formed with an R-chamfered corner portion, and these are combined to form the package 1.

[0056] This further enhances the stress relaxation effect. However, the package of this disclosure is not limited to this configuration, and may be formed by C-chamfering both the chamfered portion of the insulator and the chamfered hole corner of the through hole, or by C-chamfering either one of them.

[0057] In particular, it is preferable to set the radius of curvature of the chamfered portion 34 (R-chamfered portion) of the insulator 30 to be larger than the radius of curvature of the chamfered hole corner portion 28 (R-chamfered hole corner portion).

[0058] By setting the radius of curvature of the chamfered portion 34 and the corner portion 28 of the chamfered hole in the above-described relationship, it is possible to prevent the occurrence of problems such as the insulator 30 not being able to be fitted into the through hole portion 23.

[0059] Furthermore, by adopting this configuration, the gap 35 between the through-hole 23 and the chamfered portion 34 can be reliably formed. This makes it possible to achieve the effects and advantages already described by the configuration of the gap 35.

[0060] In the package 1 of this embodiment, the insulator 30 further includes an insulator straight section 36 that linearly connects a plurality of chamfered sections 34 provided on the insulator side surface 33. On the other hand, the recessed hole 25 of the through hole 23 includes a hole straight section 29 that connects the chamfered hole corner sections 28 formed at the four corners.

[0061] When the insulator 30 is fitted into the through-hole 23, the straight portion 36 of the insulator 30 comes into contact with the straight portion 29 of the recessed hole 25 of the through-hole 23. This restricts the movement of the insulator 30 when it is fitted into the through-hole 23.

[0062] As a result, rotation by the lead terminal 50 can be reliably restricted by contact between the straight portion 36 of the insulator and the straight portion 29 of the hole.

[0063] Here, "contact" means that at least a portion of both components are in linear contact with each other, and does not necessarily mean that they are in contact in a perfectly aligned state. In other words, some manufacturing error is permissible depending on the processing accuracy of the insulator 30 and the through-hole portion 23.

[0064] In the package 1 of this embodiment, as shown in Figure 7, the insulator 30 has a first metal layer 37 on the first insulator surface 31 side, spaced apart from the insulator side surface 33 and electrically connected to the lead terminal 50. This allows the first metal layer 37 to be formed while avoiding electrical connection between the frame 20 and the insulator side surface 33 in contact with the frame 20. Therefore, the possibility of a short circuit between the lead terminal 50 and the frame 20 can be reduced. In Figure 6, the hatched portion of the first insulator surface 31 indicates the first metal layer 37.

[0065] In the package 1 of this embodiment, as shown in Figures 7 and 8, the insulator 30 may have a second metal layer 38 formed on the insulator side surface 33. When the frame 20 is made of a metal material and the insulator 30 is joined with a brazing material or the like, having the second metal layer 38 increases the joining area with the frame 20 and improves the joining strength. In Figures 7 and 8, the hatched portion of the insulator side surface 33 indicates the second metal layer 38.

[0066] In the package 1 of this embodiment, as shown in Figure 8, the insulator 30 further comprises an inner metal layer 39 electrically connected to the lead terminal 50 on the second insulator surface 32, and an outer metal layer 40 spaced apart from the inner metal layer 39 and electrically connected to the frame 20. The outer metal layer 40 is connected to the joint surface of the through hole 23. Furthermore, the outer metal layer 40 may also be connected to the insulator side surface 33. In Figure 8, the hatched portion of the second insulator surface 32 indicates the inner metal layer 39 or the outer metal layer 40.

[0067] Here, in order to avoid electrical connection between the frame 20 and the lead terminals 50, for example, if the insulator 30 is circular in shape, the diameter of the through-hole 26 of the through-hole 23 opened in the second frame surface 22 must be set to be larger than the diameter of the inner metal layer 39 described above. Furthermore, the through-hole 26 must be set to overlap with the spaced-apart portions of the inner metal layer 39 and the outer metal layer 40, but not overlap with the outer metal layer 40. Note that the shapes of the inner metal layer 39 and the outer metal layer 40 are not limited to circular shapes, but may be rectangular, for example. Examples of materials for each metal layer include tungsten, molybdenum, manganese, or mixtures thereof. In addition, each metal layer may be nickel-plated or gold-plated. The same applies when the frame 20 is made of insulating material and metal layers are applied to it.

[0068] As described above, by providing various metal layers such as the first metal layer 37 on the first insulator surface 31, the second insulator surface 32, and the insulator side surface 33, it is possible to avoid electrical connection between the frame 20 and the lead terminals 50 and improve the bonding strength.

[0069] In the package 1 of this embodiment, as shown in Figure 7-9, a flange portion 41 that joins with the first insulating surface 31 of the insulator 30 and a washer 42 that joins with the second insulating surface 32 of the insulator 30 can be further provided. With this configuration, the insulator 30 can be sandwiched between the flange portion 41 and the washer 42 and joined to the lead terminal 50. The flange portion 41 can join with the first metal layer 37 formed on the first insulating surface 31. On the other hand, the washer 42 can join with the inner metal layer 39 formed on the second insulating surface 32. Furthermore, the distance between the flange portion 41 and the washer 42 coincides with the insulating thickness T of the insulator 30.

[0070] This improves the bonding strength between the lead terminal 50 and the insulator 30, preventing the lead terminal 50 from falling off. The flange portion 41 and the washer 42 may be formed separately from the lead terminal 50, or one of them may be formed integrally. The sizes of the flange portion 41 and the washer 42 are not particularly limited, but for example, the flange portion 41 may be formed with a larger diameter than the washer 42. Furthermore, the thickness of the flange portion 41 may be greater than that of the washer 42.

[0071] 2. [Alternative Package Configuration] The package of this disclosure may also have the alternative configuration shown below. That is, as shown in Figure 10-13, the package may have a configuration in which multiple lead terminals are attached to a single insulator. This makes it possible to electrically connect the electronic components housed inside the package to an external circuit board via multiple paths, enabling efficient transmission and reception of various signals. Figure 10-13 is a front view of the frame from the first frame surface side, and is a simplified diagram showing the through-hole and insulator.

[0072] For example, as shown in the first alternative example in Figure 10, three lead terminals 61 can be arranged side by side at equal intervals on a substantially oval-shaped insulator 60. The insulator 60 has chamfered portions 62 at its four corners, a gap 64 is provided between the through-hole portion 63 and the corner portion of the chamfered hole, and flange portions 65 are integrally formed on the lead terminals 61.

[0073] Furthermore, as shown in the second alternative example in Figure 11, six lead terminals 71 can be arranged in parallel in two rows of three at equal intervals on a substantially rectangular insulator 70 (two-row configuration). The insulator 70 has chamfered portions 72 at its four corners, and a gap 74 is provided between the chamfered corners of the through-holes 73, and flange portions 75 are integrally formed on the lead terminals 71.

[0074] Furthermore, as shown in the third alternative example in Figure 12, a cross-shaped configuration can be achieved by alternately arranging multiple lead terminals 81 on a substantially rectangular insulator 80. Specifically, it can include a first lead terminal group 82 in which three lead terminals 81 are arranged side by side at equal intervals along a first direction of the insulator 80 (corresponding to the left-right direction of the paper in Figure 12), and a second lead terminal group 83 in which two lead terminals 81 are arranged side by side at predetermined intervals along a second direction parallel to the first direction below, and at equal intervals between adjacent lead terminals 81 of the first lead terminal group 82. The insulator 80 has chamfered portions 84 at its four corners, with gaps 86 provided between the chamfered corners of the through holes 85, and flanges 87 are integrally formed on the lead terminals 81.

[0075] In addition, as shown in the fourth alternative example in Figure 13, three lead terminals 92 can be arranged side by side at equal intervals on an elongated octagonal insulator 90 having chamfered portions 91. The insulator 90 has chamfered portions 91 at its four corners, and flanges 93 are integrally formed on the lead terminals 92. This configuration makes it easier to process and manufacture the insulator 90, improving manufacturing efficiency and reducing manufacturing costs. The insulator 90 has chamfered portions 91 at its four corners, and a gap 95 is provided between the chamfered corners of the through holes 94.

[0076] As described above, multiple lead terminals 61 can be arranged on a single insulator 60. Therefore, the shape of the through-hole provided in the frame can be formed to match the shape of the insulator 60. For example, the through-hole 63 provided in the frame that can be joined to the insulator 60 shown in Figure 10 may correspond to the positions of the three lead terminals 61 that pass through it, and as shown in Figure 14, it may have three circular through-holes 68 that penetrate from the bottom surface 67 of the recessed hole 66 toward the second frame surface. Alternatively, as shown in Figure 15, the through-hole 76 may have an oval-shaped through-hole 79 that penetrates from the bottom surface 78 of the recessed hole 77 toward the second frame surface, through which the three lead terminals 61 pass together.

[0077] In other words, the shape of the through-holes 63 and 76, such as the through-hole 68 or oval through-hole 79, can be arbitrarily designed according to the arrangement of lead terminals 61 etc. that are placed on the insulator 60 etc. Figures 14 and 15 are front views of the frame from the first frame surface side, and each shows an example of through-holes 63 and 76 that can be joined to the insulator 60 shown in Figure 10. In the case of the through-hole 63 shown in Figure 14, it is easier to maintain the strength of the frame 20. Therefore, when the number of lead terminals 61 to be arranged increases, the use of this through-hole 63 becomes preferable. On the other hand, in the case of the through-hole 76 shown in Figure 15, the processing shape is simple, making processing easier. Therefore, the manufacturing efficiency of the through-hole 76 is increased.

[0078] 3. [Electronic Device] As shown in Figure 16, the electronic device 100 mainly comprises a package 1, electronic components 101 mounted on a substrate 10, and a lid 102 joined to a frame 20. The electronic components 101 are, for example, light-emitting elements, light-receiving elements, power amplifiers, etc.

[0079] The electronic component 101 may be located on a mounting member provided on the substrate 10. The electronic component 101 may be electrically connected to lead terminals 50 or the like.

[0080] The cover 102 is, for example, a plate-shaped member that can reduce the intrusion of foreign matter such as moisture and fine particles into the interior (cavity) of the electronic device 100. The material of the cover 102 can be, like the frame 20, for example, metal, ceramic, resin, etc.

[0081] As shown in Figure 16, the electronic device 100 may include a seal ring 103 located between the frame 20 and the lid 102. The seal ring 103 can function as a sealing material when the package 1 is hermetically sealed using the lid 102. The seal ring 103 may be formed, for example, by joining a frame-shaped metal plate containing an Fe-Ni alloy, Fe-Ni-Co alloy, etc., to a frame formed of a conductive paste containing a high-melting-point metal such as tungsten or molybdenum using metal brazing material or the like.

[0082] The electronic device 100 may also be equipped with other external terminals. These external terminals can be joined to the lead terminals 50 by a bonding material such as metal brazing material. Examples of external terminals other than the lead terminals 50 include bonding wires and terminals of a printed circuit board (PCB). The printed circuit board (PCB) may be a flexible printed circuit board (FPC). Furthermore, the lead terminals 50 are not limited to those arranged on the frame 20. For example, they may be arranged to penetrate between the first substrate surface 11 and the second substrate surface 12 of the substrate 10. Moreover, if the frame 20 is a polyhedron, the insulator 30 and the lead terminals 50 are not limited to being arranged on only one surface of the frame 20, but may be arranged on multiple surfaces.

[0083] The following are further examples of embodiments of the electronic component storage package and electronic device relating to this disclosure.

[0084] (1) One embodiment of an electronic component storage package according to the present disclosure comprises a substrate, a frame provided on the substrate having a through-hole that penetrates between a first frame surface and a second frame surface and has a widely open side on the first frame surface side, an insulator fitted into the through-hole from the first frame surface side and joined to the frame, and lead terminals that penetrate between a first insulator surface and a second insulator surface of the insulator and are arranged from the first frame surface side to the second frame surface side, wherein the insulator has its first insulator surface protruding from the first frame surface and joined to the frame, and at least a portion of the insulator side surface between the first insulator surface and the second insulator surface has a chamfered portion.

[0085] (2) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package described in (1) above, wherein the chamfered portion is an R-chamfered portion.

[0086] (3) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (1) or (2) above, wherein the through-hole portion has a chamfered corner portion.

[0087] (4) One embodiment of the electronic component storage package according to the present disclosure is an electronic component storage package according to any of (1) to (3) above, wherein the chamfered portion is an R-chamfered portion, the through-hole portion has an R-chamfered corner portion, and the radius of curvature of the R-chamfered portion is greater than the radius of curvature of the R-chamfered corner portion.

[0088] (5) One embodiment of the electronic component storage package according to the present disclosure is an electronic component storage package according to any of (1) to (4) above, wherein the insulator is joined to the frame body by the straight portion of the insulator between the chamfered portions and the straight portion of the hole of the through hole.

[0089] (6) One embodiment of the electronic component storage package according to the present disclosure is an electronic component storage package according to any of (1) to (5) above, wherein the protrusion height of the insulator from the first frame surface to the first insulator surface is 1 / 2 or less of the insulator thickness between the first insulator surface and the second insulator surface.

[0090] (7) One embodiment of the electronic component housing package according to the present disclosure is an electronic component housing package according to any of (1) to (6) above, wherein the first insulator surface has a first metal layer spaced apart from the insulator side surface and electrically connected to the lead terminals.

[0091] (8) One embodiment of the electronic component housing package according to the present disclosure is an electronic component housing package according to any of (1) to (7) above, further comprising a second metal layer formed on the side surface of the insulator.

[0092] (9) One embodiment of the electronic component housing package according to the present disclosure is an electronic component housing package according to any of (1) to (8) above, wherein the second insulating surface further comprises an inner metal layer electrically connected to the lead terminals and an outer metal layer spaced apart from the inner metal layer and electrically connected to the frame.

[0093] (10) One embodiment of the electronic component housing package relating to the present disclosure is an electronic component housing package according to any of (1) to (9) above, wherein the insulator has a plurality of lead terminals arranged on it.

[0094] (11) One embodiment of the electronic component storage package according to the present disclosure is the electronic component storage package according to (10) above, wherein the plurality of lead terminals comprises a first group of lead terminals arranged in parallel at predetermined intervals along a first direction of the insulator, and a second group of lead terminals arranged in parallel at predetermined intervals along a second direction parallel to the first direction, and between adjacent lead terminals of the first group of lead terminals.

[0095] (12) One embodiment of the electronic component storage package according to the present disclosure is an electronic component storage package according to any of (1) to (11) above, further comprising a flange portion that joins with the first insulating surface of the insulator.

[0096] (13) One embodiment of the electronic component storage package according to the present disclosure is an electronic component storage package according to any of (1) to (12) above, further comprising a washer that joins with the second insulating surface of the insulator.

[0097] (14) One embodiment of the electronic device relating to the present disclosure comprises an electronic component housing package according to any of (1) to (13) above, an electronic component mounted on the substrate of the electronic component housing package, and a lid joined to the frame.

[0098] Furthermore, details shown in the embodiments described above may be modified as appropriate without departing from the spirit of this disclosure. The scope of this disclosure includes the scope of the invention as described in the claims and its equivalents. Various combinations of each embodiment are not limited to the examples of embodiments described above. Combinations of each embodiment are also possible.

[0099] 1 Package (Package for housing electronic components) 10 Substrate 11 First substrate surface 12 Second substrate surface 20 Frame 21 First frame surface 22 Second frame surface 23, 63, 73, 76, 85, 94 Through-hole 24 Frame wall 25, 66, 77 ・BR>E section 26, 68 Through-hole 27, 67, 78 Hole bottom surface 28 Chamfered hole corner 29 Hole straight section 30, 60, 70, 80, 90 Insulator 31 First insulator surface 32 Second insulator surface 33 Insulator side surface 34, 62, 72 Chamfered section 35, 64, 74, 86 Gap 36 Insulator straight section 37 First metal layer 38 Second metal layer 39 Inner metal layer 40 Outer metal layer 41, 65, 75, 87, 93 Flange 42 Washer 50, 61, 71, 81, 92 Lead terminal 82 First lead terminal group 83 Second lead terminal group 90 Insulator 91 Chamfered part 100 Electronic device 101 Electronic component 102 Cover 103 Seal ring H Protrusion height T Insulator thickness

Claims

1. An electronic component housing package comprising: a substrate; a frame provided on the substrate, having a through-hole that penetrates between a first frame surface and a second frame surface and has a widely open end on the first frame surface side; an insulator fitted into the through-hole from the first frame surface side and joined to the frame; and lead terminals that penetrate between a first insulator surface and a second insulator surface of the insulator and are arranged from the first frame surface side to the second frame surface side, wherein the insulator has its first insulator surface protruding from the first frame surface and joined to the frame, and at least a portion of the insulator side surface between the first insulator surface and the second insulator surface has a chamfered portion.

2. The package for housing electronic components according to claim 1, wherein the chamfered portion is an R-chamfered portion.

3. The electronic component housing package according to claim 1 or 2, wherein the through-hole portion has a chamfered corner portion.

4. The package for housing electronic components according to any one of claims 1 to 3, wherein the chamfered portion is an R-chamfered portion, the through-hole portion has an R-chamfered corner portion, and the radius of curvature of the R-chamfered portion is greater than the radius of curvature of the corner portion of the R-chamfered hole.

5. The insulator is joined to the frame body by the straight portion of the insulator between the chamfered portions and the straight portion of the hole of the through-hole. The electronic component housing package according to any one of claims 1 to 4.

6. The electronic component housing package according to any one of claims 1 to 5, wherein the protrusion height of the insulator from the first frame surface to the first insulator surface is 1 / 2 or less of the thickness of the insulator between the first insulator surface and the second insulator surface.

7. The electronic component housing package according to any one of claims 1 to 6, wherein the first insulating surface has a first metal layer spaced apart from the insulating surface and electrically connected to the lead terminal.

8. The electronic component housing package according to any one of claims 1 to 7, further comprising a second metal layer formed on the side surface of the insulator.

9. The electronic component housing package according to any one of claims 1 to 8, wherein the second insulating surface further comprises an inner metal layer electrically connected to the lead terminals and an outer metal layer spaced apart from the inner metal layer and electrically connected to the frame.

10. The insulator is an electronic component housing package according to any one of claims 1 to 9, wherein a plurality of lead terminals are arranged on it.

11. The electronic component housing package according to claim 10, comprising: a first group of lead terminals arranged in parallel at predetermined intervals along a first direction of the insulator; and a second group of lead terminals arranged in parallel at predetermined intervals along a second direction parallel to the first direction, and between adjacent lead terminals of the first group of lead terminals.

12. The electronic component housing package according to any one of claims 1 to 11, further comprising a flange portion that joins with the first insulating surface of the insulator.

13. The electronic component housing package according to any one of claims 1 to 12, further comprising a washer that joins with the second insulating surface of the insulator.

14. An electronic device comprising: an electronic component storage package according to any one of claims 1 to 13; an electronic component mounted on the substrate of the electronic component storage package; and a lid joined to the frame.

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