Light emitting device and light emitting module
The light-emitting device and module design addresses the issue of cascade failures by using a semiconductor laser element configuration with multiple conductive members and an intervening member to ensure power is maintained to functioning devices even if some fail, enhancing reliability.
WO2026141146A1PCT designated stage Publication Date: 2026-07-02NICHIA CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NICHIA CORP
- Filing Date
- 2025-12-18
- Publication Date
- 2026-07-02
AI Technical Summary
Technical Problem
Existing light-emitting devices and modules using semiconductor laser elements are prone to becoming open-circuit due to semiconductor laser element failures during power supply, leading to a cascade failure of all connected devices.
Method used
The light-emitting device and module design includes a semiconductor laser element with a specific configuration that minimizes the likelihood of open-circuit failure by using multiple conductive members and an intervening member with closely spaced vias, ensuring power can be maintained to remaining devices even if some fail.
Benefits of technology
This configuration reduces the risk of a single failure causing all devices to stop operating, allowing the remaining devices to continue functioning, thus maintaining module operation.
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Smart Images
Figure JP2025044376_02072026_PF_FP_ABST
Abstract
This light-emitting device comprises: a semiconductor laser element having a first electrode and an upper surface on which the first electrode is provided and having a length of 1000 μm or more in a resonator longitudinal direction; a sub-mount to which the semiconductor laser element is joined; an intervening member having a first conductive layer electrically connected to the first electrode of the semiconductor laser element and having an upper surface on which the first conductive layer is provided; and a plurality of conductive members joined to the upper surface of the intervening member and electrically connected to the first conductive layer. The plurality of conductive members are configured by five or more conductive members, and the center-to-center spacing between a plurality of joining positions, which are positions at which the plurality of conductive members are joined to the intervening member, is equal to or less than 800 μm.
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