Measurement device

Abstract

The present invention suppresses an increase in the distance between a light-emitting element and a light-receiving element due to the presence of a circuit element. This measurement device comprises: a light projection optical system; a light reception optical system disposed side by side with the light projection optical system in a first direction; a light projection circuit board disposed in a second direction, orthogonal to the first direction, from the light projection optical system, and including a light-emitting element; and a light reception circuit board disposed in the second direction from the light reception optical system, and including a light-receiving element. The light projection circuit board and the light reception circuit board are disposed at different positions in the second direction, and a portion of the light projection circuit board and a portion of the light reception circuit board overlap when viewed in the second direction.

Description

Measuring device

[0001] The technology disclosed in this specification relates to a measuring device.

[0002] With the development of AD (Autonomous Driving) and ADAS (Advanced Driver-Assistance Systems), as one of the measuring devices used for grasping the surrounding environment and estimating the self-position during vehicle driving, research and development of LiDAR (Light Detection And Ranging) have been underway. LiDAR includes a light projector that projects (irradiates) laser light onto the measurement target and a light receiver that receives the reflected light reflected back from the measurement target by the laser light. LiDAR outputs information regarding the measurement target by measuring the distance to the measurement target based on the difference between the light projection timing when the light projector emits laser light and the light reception timing when the light receiver receives the reflected light (see, for example, Patent Document 1).

[0003] Some measuring devices have a configuration in which a light projection optical system and a light reception optical system are arranged side by side. In a conventional measuring device having such a configuration, a light emitting element and a light receiving element are arranged on a common circuit board.

[0004] Japanese Unexamined Patent Application Publication No. 2024-017519

[0005] In a measuring device having a configuration in which a light-emitting optical system and a light-receiving optical system are arranged side by side, the smaller the distance (parallax, distance between the centers of the optical axes) between the light-emitting element and the light-receiving element, the smaller the angular difference between the optical axis of the light emitted from the light-emitting element and the optical axis of the reflected light received by the light-receiving element, and the light emission and reception efficiency improves. However, the conventional measuring device described above has the problem that the distance between the light-emitting element and the light-receiving element becomes longer due to the presence of circuit elements on the circuit board. That is, generally, on the circuit board, circuit elements for controlling light emission, such as controlling the light emission of the light-emitting element, are arranged around the light-emitting element, and circuit elements for controlling light reception, such as controlling the light reception of the light-receiving element, are arranged around the light-receiving element. Therefore, in a configuration in which the light-emitting element and the light-receiving element are arranged on a common circuit board, both the circuit elements for controlling light emission and the circuit elements for controlling light reception are interposed between the light-emitting element and the light-receiving element, so the distance between the light-emitting element and the light-receiving element becomes longer.

[0006] This specification discloses a technology capable of solving at least one of the above-mentioned problems.

[0007] The technologies disclosed herein can be implemented, for example, in the following forms:

[0008] (1) The measuring apparatus disclosed herein comprises a light-emitting optical system, a light-receiving optical system arranged in a first direction with respect to the light-emitting optical system, a light-emitting circuit board including a light-emitting element, arranged on one side of a second direction perpendicular to the first direction with respect to the light-emitting optical system, and a light-receiving circuit board including a light-receiving element, arranged on the second side with respect to the light-receiving optical system. The light-emitting circuit board and the light-receiving circuit board are arranged at different positions from each other in the second direction, and a part of the light-emitting circuit board and a part of the light-receiving circuit board overlap each other when viewed in the second direction.

[0009] In this configuration, for example, compared to a configuration where the light-emitting element and the light-receiving element are arranged on a common circuit board, it is possible to suppress the increase in the distance between the light-emitting element and the light-receiving element caused by the presence of circuit elements.

[0010] (2) In the above measuring device, the end of the light-receiving optical system on one side in the second direction is located on the one side in the second direction of the light-emitting optical system, and the light-receiving circuit board is located on the one side in the second direction of the light-emitting circuit board. In this configuration, the end of the light-receiving optical system is located on the second side of the second direction of the end of the light-emitting optical system, and the light-emitting circuit board is located on the second side of the second direction of the light-receiving circuit board, compared to the configuration in which the overall size of the measuring device in the second direction can be suppressed.

[0011] (3) In the above measuring device, the light-emitting circuit board may be positioned closer to the light-receiving optical system than the light-receiving circuit board in the second direction. In this configuration, for example, the effect of heat generation caused by the close proximity of the light-emitting circuit board and the light-receiving circuit board can be suppressed compared to a configuration in which the light-emitting circuit board is positioned closer to the light-receiving circuit board than the light-receiving optical system in the second direction.

[0012] (4) In the above measuring device, the light receiving circuit board may be positioned on one side of the second direction relative to the light emitting circuit board, and in the view in the second direction, the tip of a part of the light emitting circuit board may be positioned between the tip of a part of the light receiving circuit board and the light receiving optical system. In this configuration, it is possible to suppress the restriction of the optical path between the light receiving optical system and the light receiving element due to the presence of the light emitting circuit board.

[0013] (5) In the above measuring device, the end of the light-emitting optical system on one side in the second direction is located on the one side in the second direction of the light-receiving optical system, and the light-emitting circuit board is located on the one side in the second direction of the light-receiving circuit board. In this configuration, the end of the light-emitting optical system is located on the second side of the light-receiving optical system, and the light-receiving circuit board is located on the second side of the light-receiving circuit board, compared to the configuration in which the overall size of the measuring device in the second direction can be suppressed.

[0014] (6) In the above measuring device, the light receiving circuit board may be positioned closer to the light emitting optical system than the light emitting circuit board in the second direction. In this configuration, for example, the effect of heat generation caused by the close proximity of the light emitting circuit board and the light receiving circuit board can be suppressed compared to a configuration in which the light receiving circuit board is positioned closer to the light emitting circuit board than the light emitting optical system in the second direction.

[0015] (7) In the above measuring device, the light-emitting circuit board may be positioned on one side of the second direction relative to the light-receiving circuit board, and in the view in the second direction, the tip of a part of the light-receiving circuit board may be positioned between the tip of a part of the light-emitting circuit board and the light-emitting optical system. In this configuration, it is possible to suppress the restriction of the optical path between the light-emitting element and the light-emitting optical system due to the presence of the light-receiving circuit board.

[0016] (8) The above measuring device may further include a housing that houses the light-emitting optical system, the light-receiving optical system, the light-emitting circuit board, and the light-receiving circuit board, wherein the housing has a heat sink that constitutes the side wall on one side in the second direction relative to the light-emitting circuit board and the light-receiving circuit board, and the heat sink has a plurality of heat dissipation fins that protrude to the outside of the housing and are arranged along the first direction. With this configuration, the heat sink that constitutes the side wall of the housing on one side in the second direction relative to the light-emitting circuit board and the light-receiving circuit board makes it easier for the measuring device to dissipate heat.

[0017] (9) In the above measuring device, the heat sink may further have a plurality of heat-absorbing fins formed on the side of the circuit board located on the other side in the second direction of the light-emitting circuit board and the light-receiving circuit board, and the heat-absorbing fins may extend from the housing facing the one circuit board in the second direction toward the one circuit board. With this configuration, by further providing a heat sink on the side wall of the housing facing the side of the circuit board located on the other side in the second direction of the light-emitting circuit board and the light-receiving circuit board, the measuring device can dissipate heat even more easily.

[0018] (10) The measuring device may further include a control circuit board that includes a control circuit for controlling the light-emitting element and the light-receiving element, and the control circuit board may be positioned in a third direction that is orthogonal to both the first direction and the second direction with respect to the light-emitting circuit board and the light-receiving circuit board. With this configuration, by providing the control circuit board in a third direction with respect to the light-emitting circuit board and the light-receiving circuit board, the size of the measuring device can be further suppressed.

[0019] (11) The above measuring device may be configured to include a first communication cable that connects the light-emitting circuit board and the control circuit board so that they can communicate in the third direction, and a second communication cable that connects the light-receiving circuit board and the control circuit board so that they can communicate in the third direction. With this configuration, the light-emitting circuit board and the control circuit board are connected so that they can communicate in the shortest possible way, and the light-receiving circuit board and the control circuit board are connected so that they can communicate in the shortest possible way.

[0020] Block diagram showing the configuration of the measuring device in the first embodiment. Explanatory diagram showing the internal configuration of the measuring device in the first embodiment. Explanatory diagram showing the arrangement relationship between the light-emitting circuit board and the light-receiving circuit board as seen from the front in the first embodiment. Explanatory diagram showing the internal structure of the measuring device in a modified example. Schematic diagram of the external appearance of the measuring device in the second embodiment. Schematic diagram of the external appearance of the measuring device in the second embodiment. Explanatory diagram showing the internal configuration of the measuring device in the second embodiment. Explanatory diagram showing the internal configuration of the measuring device in the second embodiment.

[0021] A. First Embodiment: A-1. Configuration of the Measuring Device 10: Figure 1 is a schematic block diagram showing the configuration of the measuring device 10 in the first embodiment. The measuring device 10 is a flash-type LiDAR. That is, as shown in Figure 1, the measuring device 10 comprises a light emitter 20 that irradiates the object to be measured W with emitted light L1 (for example, a light beam (laser light)) and a light receiver 30 that receives reflected light L2 (return light) that is reflected back from the object to be measured W after the emitted light L1 has been reflected back. The light emitter 20 comprises a light emitter array 22 (see Figure 2 described later). The light emitter array 22 has a plurality of light-emitting elements (not shown). The plurality of light-emitting elements are arranged in a linear (one-dimensional) or grid (two-dimensional) manner. The light receiver 30 comprises a light-receiving array 32 (see Figure 2 described later). The light-receiving array 32 has a plurality of light-receiving elements (not shown). Multiple light-receiving elements are arranged in a linear (one-dimensional) or grid-like (two-dimensional) configuration. Each of the multiple light-receiving elements is arranged to correspond to one of the multiple light-emitting elements of the light emitter 20.

[0022] The measuring device 10 sequentially emits light from multiple light-emitting elements at different emission timings, and causes each of the multiple photodetectors to receive the reflected light L2 that returns to the measurement target W after the emitted light L1 emitted from each light-emitting element corresponding to each photodetector has been reflected. The measuring device 10 obtains information about the measurement target W by measuring the difference between the emission timing of each corresponding light-emitting element and the reception timing of each photodetector (this is called the time of flight of the laser light, or "TOF" (Time of Flight)).

[0023] The measuring device 10 is mounted, for example, on a vehicle (not shown) on which AD or ADAS is implemented. The measuring device 10 assists in detecting people, other vehicles, and other objects while the vehicle is in motion, and provides various types of information useful for ensuring the safety of the vehicle driver and those around the vehicle, and for reducing damage to objects in the surrounding area while the vehicle is in operation, to other devices and users.

[0024] The light emitter 20 includes a light emitter array 22, a light emitter optical system 24, a light emitter control device 26, and a current source 28.

[0025] The light-emitting array 22 is a light source in which multiple light-emitting elements are arranged linearly (one-dimensionally) or planarly (two-dimensionally). Examples of light-emitting elements include laser diodes, surface-emitting type laser light-emitting elements (e.g., VCSEL (Vertical Cavity Surface Emitting Laser, hereinafter referred to as "surface-emitting element"), and surface-emitting element arrays (e.g., VCSEL arrays) in which multiple surface-emitting elements are arranged one-dimensionally or two-dimensionally on a substrate (semiconductor substrate, ceramic substrate, etc.).

[0026] The current source 28 supplies current to the light-emitting elements constituting the light-emitting array 22 in accordance with the control signal input from the light-emitting control device 26. For example, the current source 28 supplies a periodic square wave current to the light-emitting elements to switch the current flowing through them on and off.

[0027] The light projection control device 26 controls the current (drive current) supplied from the current source 28 to the light-emitting element by generating a control signal for the current source 28 and inputting it to the current source 28. The light projection control device 26 inputs a signal indicating the timing when the light-emitting element emits light (the timing when the light-emitting element emits light; hereinafter referred to as "light projection timing") to the TOF measuring device 40. The light projection control device 26 causes the light-emitting element to emit light repeatedly and periodically by, for example, periodically switching the current flowing through the light-emitting element on and off.

[0028] The light projection optical system 24 adjusts the light distribution of the emitted light L1 by, for example, applying an optical effect (refraction, scattering, diffraction, etc.) to the light emitted by the light projection array 22. The light projection optical system 24 is constructed using various lenses such as collimating lenses and optical components such as reflectors (mirrors).

[0029] The light receiver 30 includes a light receiving array 32 and a light receiving optical system 34.

[0030] The light-receiving optical system 34 focuses the reflected light L2 that returns after the light L1 emitted from the light emitter 20 is reflected by the object to be measured W, etc., onto the light-receiving array 32. The light-receiving optical system 34 is composed of optical components such as various lenses such as focusing lenses, various filters such as wavelength filters, and reflectors (mirrors).

[0031] The light-receiving array 32 has multiple light-receiving elements. Examples of light-receiving elements include photodiodes, SPADs (Single Photon Avalanche Diodes), APDs (Avalanche Photodiodes), PPDs (Pixeled Photon Detectors), and balanced photodetectors. The light-receiving array 32 generates a light-receiving signal with a current level or voltage level corresponding to the intensity of the reflected light L2 by photoelectric conversion of the reflected light L2 incident from the light-receiving optical system 34. The light-receiving array 32 inputs a signal indicating the timing at which the light-receiving elements constituting the light-receiving array 32 received the reflected light L2 (hereinafter referred to as "light-receiving timing"), and the light-receiving signal generated by the light-receiving elements, to the TOF measuring device 40.

[0032] The measuring device 10 further includes a TOF measuring device 40, a control circuit 42, and a communication I / F (Interface) 50.

[0033] The TOF measuring device 40 determines the time of day (TOF) based on a signal indicating the light emission timing input from the light emission control device 26 and a signal indicating the light reception timing input from the light receiving array 32. The TOF measuring device 40 has, for example, a time measurement IC (integrated circuit) equipped with a TDC (Time to Digital Converter) circuit. The TOF measuring device 40 inputs the determined TOF and the light reception signal input from the light receiving array 32 to the control circuit 42.

[0034] The control circuit 42 includes a processor (CPU (Central Processing Unit), MPU (Micro Processing Unit), ASIC (Application Specific Integrated Circuit), FPGA (Field Programmable Gate Array), DSP (Digital Signal Processor), etc.). Based on the received light signal and TOF input from the TOF measuring device 40, the control circuit 42 generates information used for various measurements such as detection of the target W and distance measurement. This information includes, for example, a histogram used in time-correlated single-photon counting, the distance to each point on the measurement target W, and point cloud information. The control circuit 42 also controls the light projection control device 26 and the light receiving array 32. For example, by controlling the light projection control device 26 and the light receiving array 32, the control circuit 42 controls the aforementioned light projection timing and light receiving timing so that the processing for generating the histogram is accelerated or optimized. The information generated by the control circuit 42 is provided (transmitted) to devices that utilize this information (hereinafter referred to as "various utilization devices 60") via the communication I / F 50.

[0035] The various utilization devices 60 perform tasks such as creating environmental maps using point clouds and self-localization (SLAM (Simultaneous Localization and Mapping)) using scan matching algorithms (NDT (Normal Distributions Transform), ICP (Iterative Closest Point), etc.).

[0036] A-2. Internal configuration of the measuring device 10: Figure 2 shows the internal structure of the measuring device 10. Figures 2 to 4 show mutually orthogonal X, Y, and Z axes for determining direction. For convenience, in this specification, the X-axis direction is referred to as the "left-right direction," the negative Y-axis direction as the "front-back direction," and the Z-axis direction as the "up-down direction." However, the measuring device 10 may actually be installed in a different orientation. The same applies to Figures 5 and onward.

[0037] As shown in Figure 2, the measuring device 10 includes a housing 70 having an internal space 71. An opening 74 is formed on the front of the housing 70, and the opening 74 is connected to the internal space 71. The opening 74 is sealed with a light-transmitting member 76. The internal space 71 houses a light-emitting optical system 24, a light-receiving optical system 34, a light-emitting circuit board 22A, and a light-receiving circuit board 32A.

[0038] In the internal space 71 of the housing 70, the light-emitting optical system 24 and the light-receiving optical system 34 are arranged side by side in the left-right direction (X-axis direction). The central axis G1 of the light-emitting optical system 24 and the central axis G2 of the light-receiving optical system 34 are parallel to each other and are aligned in the front-back direction (Y-axis direction). The light-emitting circuit board 22A is located behind the light-emitting optical system 24, and the light-receiving circuit board 32A is located behind the light-receiving optical system 34. The left-right direction is an example of a first direction, and the front-back direction is an example of a second direction. Furthermore, the rear side is an example of one side of the second direction, and the front side is an example of the other side of the second direction.

[0039] The light projection optical system 24 includes, for example, a first light projection lens 24A and a second light projection lens 24B. The first light projection lens 24A is, for example, a collimating lens or a diffusing lens, and the second light projection lens 24B is, for example, a diffuser lens. The first light projection lens 24A and the second light projection lens 24B are aligned along the front-to-back direction. The central axis of the first light projection lens 24A and the central axis of the second light projection lens 24B are coaxial with each other (central axis G1 of the light projection optical system 24).

[0040] The light-emitting optical system 24 is fixedly positioned in the housing 70. Specifically, a light-emitting side mounting member 25A is positioned in the internal space 71 of the housing 70. The light-emitting side mounting member 25A fixes the light-emitting optical system 24 (first light-emitting lens 24A, second light-emitting lens 24B) to the housing 70. More specifically, the light-emitting side mounting member 25A is a cylindrical member with a through-passage 25B that penetrates in the front-to-back direction. The light-emitting side mounting member 25A is fixed to the inner wall surface of the housing 70 that forms the internal space 71. The first light-emitting lens 24A and the second light-emitting lens 24B are each housed within the through-passage 25B and fixed to the inner circumferential surface that forms the through-passage 25B. The first light-emitting lens 24A is positioned at the tip of the light-emitting side mound member 25A, and the second light-emitting lens 24B is positioned at the rear end of the light-emitting side mound member 25A. The inner circumferential surface forming the through passage 25B is a reflective surface that has been, for example, mirror-finished or has a reflective film formed on it.

[0041] The light-receiving optical system 34 includes, for example, five light-receiving lenses 34A to 34E. The five light-receiving lenses 34A to 34E are, for example, collimating lenses and condensing lenses. The five light-receiving lenses 34A to 34E are arranged along the front-to-back direction. The central axes of the five light-receiving lenses 34A to 34E are arranged coaxially with each other (the central axis G2 of the light-receiving optical system 34). Preferably, the front end of the light-emitting optical system 24 (the second light-emitting lens 24B furthest from the light-emitting circuit board 22A) and the front end of the light-receiving optical system 34 (the light-receiving lens 34E furthest from the light-receiving circuit board 32A) are at the same position in the front-to-back direction.

[0042] The light-receiving optical system 34 is fixedly positioned in the housing 70. Specifically, a light-receiving side mount member 35A is positioned in the internal space 71 of the housing 70. The light-receiving side mount member 35A fixes the light-receiving optical system 34 (five light-receiving lenses 34A to 34E) to the housing 70. More specifically, the light-receiving side mount member 35A is a cylindrical member with a through-passage 35B that penetrates in the front-to-back direction. The light-receiving side mount member 35A is fixed to the inner wall surface of the housing 70 that forms the internal space 71. The five light-receiving lenses 34A to 34E are each housed within the through-passage 35B and fixed to the inner circumferential surface that forms the through-passage 35B. The light-receiving lens 34E is positioned at the tip of the light-receiving side mount member 35A, and the remaining light-receiving lenses 34A to 34D are positioned behind the light-receiving lens 34E at predetermined intervals. Furthermore, the inner circumferential surface that forms the through passage 35B is a reflective surface that has been, for example, mirror-finished or has a reflective film applied to it.

[0043] The light-emitting circuit board 22A includes a light-emitting array 22, a semiconductor substrate 22C, and light-emitting circuit elements 22B. The semiconductor substrate 22C is arranged substantially perpendicular to the central axis G1 of the light-emitting optical system 24. The light-emitting array 22 and a plurality of light-emitting circuit elements 22B are mounted on the front surface of the semiconductor substrate 22C. The light-emitting array 22 is located in the approximate center of the front surface of the semiconductor substrate 22C, and the plurality of light-emitting circuit elements 22B are arranged around the light-emitting array 22. The plurality of light-emitting circuit elements 22B are, for example, power charging capacitors, inductors, selector circuits (ICs, etc.) and gate circuits (FETs, etc.) for controlling the on / off state of light emission. The plurality of light-emitting circuit elements 22B may also be arranged on the rear surface of the light-emitting circuit board 22A. However, in the first embodiment, in order to improve the heat dissipation of the light-emitting circuit board 22A, no light-emitting circuit elements 22B are mounted on the rear surface of the light-emitting circuit board 22A.

[0044] The light-receiving circuit board 32A includes a light-receiving array 32, a semiconductor substrate 32C, and light-receiving circuit elements 32B. The semiconductor substrate 32C is arranged so as to be substantially orthogonal to the central axis G2 of the light-receiving optical system 34. The light-receiving array 32 is mounted on the front surface of the semiconductor substrate 32C, and a plurality of light-receiving circuit elements 32B are mounted on the rear surface of the semiconductor substrate 32C. The light-receiving array 32 is arranged at a substantially central portion on the front surface of the semiconductor substrate 32C. The plurality of light-receiving circuit elements 32B are, for example, drive circuits, output circuits, and timing control circuits. Note that the plurality of light-receiving circuit elements 32B may also be arranged on the front surface of the light-receiving circuit board 32A.

[0045] FIG. 3 shows the positional relationship between the light-projecting circuit board 22A and the light-receiving circuit board 3(2)A as viewed from the front side. As shown in FIGS. 2 and 3, the light-receiving circuit board 32A is arranged behind the light-projecting circuit board 22A. A part of the light-projecting circuit board 22A and a part of the light-receiving circuit board 32A overlap each other when viewed in the front-rear direction.

[0046] Specifically, when viewed in the front-rear direction, the right end of the light-projecting circuit board 22A is located between the left end of the light-receiving circuit board 32A and the left end of the light-receiving array 32. When viewed in the front-rear direction, the entire light-receiving array 32 is not hidden by the light-projecting circuit board 22A (semiconductor substrate 22C) and is exposed. When viewed in the front-rear direction, the light-projecting circuit board 22A does not overlap with the light-receiving optical system 34 and is arranged at positions separated from each other in the left-right direction. Therefore, the presence of the light-projecting circuit board 22A does not block the incidence of the reflected light L2 from the light-receiving optical system 34 to the light-receiving array 32. In the left-right direction, the overlapping length D1 between the light-projecting circuit board 22A and the light-receiving circuit board 32A may be a length of 1 / 10 or more, a length of / 8 or more, or a length of 1 / 6 or more with respect to the left-right width of either the light-projecting circuit board 22A or the light-receiving circuit board 32A.

[0047] As shown in FIG. 3, in a front-rear direction view, the right end portion of the light projection circuit board 22A overlaps with the circuit mounting region 32E in the light reception circuit board 32A (semiconductor substrate 32C) where the light reception circuit element 32B is arranged. In a front-rear direction view, the left end portion of the light reception circuit board 32A overlaps with the circuit mounting region 22E in the light projection circuit board 22A (semiconductor substrate 22C) where the light projection circuit element 22B is arranged.

[0048] In the first embodiment, the rear end portion of the light reception optical system 34 (the light reception lens 34A closest to the light reception circuit board 32A) is located behind the rear end portion of the light projection optical system 24 (the first light projection lens 24A closest to the light projection circuit board 22A). The light projection circuit board 22A is arranged at a position closer to the light reception optical system 34 than the light reception circuit board 32A in the front-rear direction.

[0049] The housing 70 has a heat sink that releases heat from the light projection circuit board 22A and the light reception circuit board 32A to the outside. Specifically, a plurality of heat radiation fins 72 are arranged side by side in the left-right direction on the outer surface of the wall portion (rear wall portion) located behind the light projection circuit board 22A and the light reception circuit board 32A in the housing 70.

[0050] A-3. Effects of the First Embodiment: In the first embodiment, the light projection array 22 and the light reception array 32 are respectively arranged on different individual circuit boards (the light projection circuit board 22A and the light reception circuit board 32A). The light reception circuit board 32A is arranged behind the light projection circuit board 22A. A part of the light projection circuit board 22A and a part of the light reception circuit board 32A overlap with each other in a front-rear direction view (see FIGS. 2 and 3). Therefore, for example, compared with a configuration in which the light projection array 22 and the light reception array 32 are arranged on a common circuit board, it is possible to suppress an increase in the distance between the light projection array 22 and the light reception array 32 due to the presence of circuit elements. As a result, in the measuring device 10, the angular difference between the optical axis of the emitted light L1 projected from the light projection array 22 and the optical axis of the reflected light L2 received by the light reception array 32 becomes smaller, and the light projection and reception efficiency (the degree of overlap between the irradiation range in which the light projection array 22 emits light and the light reception range in which the light reception array 32 can receive light) is improved.

[0051] In the first embodiment, the light-emitting circuit board 22A is positioned closer to the light-receiving optical system 34 than to the light-receiving circuit board 32A in the front-rear direction (see Figure 2). In the first embodiment, for example, compared to a configuration in which the light-emitting circuit board 22A is positioned closer to the light-receiving circuit board 32A than to the light-receiving optical system 34, the effect of heat generation due to the close proximity of the light-emitting circuit board 22A and the light-receiving circuit board 32A can be suppressed. In particular, in the first embodiment, since the light-receiving circuit board 32A is positioned behind the light-emitting circuit board 22A, the effect of heat dissipation associated with the light emission control of the light-emitting circuit board 22A on the light-receiving circuit board 32A can be suppressed, making it particularly effective.

[0052] In the first embodiment, the light-emitting optical system 24 and the light-receiving optical system 34 are fixed to the housing 70. If, for example, the light-emitting optical system 24 were fixed to the light-emitting circuit board 22A, or the light-receiving optical system 34 were fixed to the light-receiving circuit board 32A, the positional relationship between the light-emitting circuit board 22A and the light-receiving circuit board 32A would be constrained by the arrangement of the light-emitting optical system 24 and the light-receiving optical system 34. In contrast, in the first embodiment, since the arrangement of the light-emitting optical system 24 and the light-receiving optical system 34 is not constrained, there is a high degree of freedom in the positional relationship between the light-emitting circuit board 22A and the light-receiving circuit board 32A.

[0053] B. Second Embodiment: The second embodiment will be described with reference to Figures 5 to 8. Figures 5 and 6 show the external appearance of the measuring device 10B of the second embodiment. Specifically, Figure 5 is a schematic view of the measuring device 10B from the left. Figure 6 is a schematic view of the measuring device 10B from the rear. Figure 7 shows the internal structure of the measuring device 10B of the second embodiment. Specifically, Figure 7 is a cross-sectional view taken along line VII-VII in Figure 5. Figure 8 shows the substrate fixing part 730, the light-emitting circuit board 22A, the light-receiving circuit board 32A, and the control circuit board 90 of the internal structure of the measuring device 10B of the second embodiment. For components of the measuring device 10B of the second embodiment that are the same as those of the measuring device 10 of the first embodiment described above, the same reference numerals are used, and their explanation is omitted. Note that the vertical direction is an example of a third direction.

[0054] B-1. Internal configuration of measuring device 10B:

[0055] As shown in Figure 5, the housing 70B of the measuring device 10B has an inverted L-shape when viewed from the left to right. The housing 70B has an optical system housing section 710, a substrate housing section 720, and a substrate fixing section 730. The housing 70B is arranged from the front in the order of optical system housing section 710, substrate housing section 720, and substrate fixing section 730.

[0056] As shown in Figure 5, the optical system housing 710 is located in front of the housing 70B. The optical system housing 710 is located above the housing 70B. The optical system housing 710 is a rectangular parallelepiped. The length of the optical system housing 710 in the front-to-back direction and the up-to-down direction are approximately the same. As shown in Figure 7, the front and rear of the optical system housing 710 are open. The front opening of the optical system housing 710 is the opening 74. The inside of the optical system housing 710 forms an internal space 71B. The light-emitting side mount member 25A and the light-receiving side mount member 35A are fixed to the inner wall surface that forms the internal space 71B. That is, the light-emitting optical system 24 and the light-receiving optical system 34 are housed in the internal space 71B.

[0057] As shown in Figure 5, the substrate housing section 720 is located on the rear side of the housing 70B. The substrate housing section 720 and the optical system housing section 710 are detachably connected. The substrate housing section 720 is a rectangular parallelepiped. The length of the substrate housing section 720 in the vertical direction and the left-right direction are approximately the same. The vertical length of the substrate housing section 720 is approximately twice the vertical length of the optical system housing section 710. As shown in Figure 7, the front and rear of the substrate housing section 720 are open. In this embodiment, the front opening of the substrate housing section 720 is formed at the top of the substrate housing section 720. When the substrate housing section 720 and the optical system housing section 710 are connected, the front opening of the substrate housing section 720 and the rear opening of the optical system housing section 710 communicate with each other. The rear surface (back) of the substrate housing section 720 is completely open. The interior of the optical system housing section 710 forms an internal space 71C. The internal space 71C houses the light-emitting circuit board 22A, the light-receiving circuit board 32A, and the control circuit board 90, which will be described later.

[0058] As shown in Figure 5, the substrate fixing portion 730 is located behind (on the back of) the substrate housing portion 720. The substrate fixing portion 730 closes the rear opening of the substrate housing portion 720 (see Figure 7). As shown in Figure 6, the substrate fixing portion 730 is a plate-shaped member extending in the vertical, horizontal, and vertical directions. The length of the substrate fixing portion 730 in the vertical, horizontal, and vertical directions is approximately the same. In this embodiment, the substrate fixing portion 730 is screwed to the rear of the substrate housing portion 720.

[0059] As shown in Figures 6 and 7, the substrate fixing portion 730 has a heat sink 80 and a plurality of mounting portions 70R.

[0060] As shown in Figures 6 and 7, the heat sink 80 is formed in front of and behind the substrate fixing portion 730. The heat sink 80 is formed above the substrate fixing portion 730. The heat sink 80 behind the substrate fixing portion 730 constitutes the rear side wall of the substrate fixing portion 730. The heat sink 80 behind the substrate fixing portion 730 is composed of a plurality of heat dissipation fins 72. The heat dissipation fins 72 protrude to the rear. The heat dissipation fins 72 are formed in the left-right direction of the substrate fixing portion 730. In this embodiment, the heat dissipation fins 72 are formed by a pair of grooves 72h. Specifically, a plurality of grooves 72h are formed in the substrate fixing portion 730. Each groove 72h is recessed in the front-rear direction. A convex-shaped member formed by a pair of grooves 72h is the heat dissipation fin 72. The plurality of heat dissipation fins 72 are integrally molded with the substrate fixing portion 730.

[0061] As shown in Figure 7, the heat sink 80 in front of the substrate fixing portion 730 is formed on the front surface of the substrate fixing portion 730 facing the rear of the light-emitting circuit board 22A. The heat sink 80 in front of the substrate fixing portion 730 is composed of a plurality of heat-absorbing fins 73. The base ends of the heat-absorbing fins 73 are on the front surface of the substrate fixing portion 730 (housing 70B). The heat-absorbing fins 73 extend toward the rear of the light-emitting circuit board 22A. In this embodiment, the light-emitting circuit board 22A is provided with a heat-dissipating sheet 23 on its rear surface. The heat-absorbing fins 73 are in contact with the heat-dissipating sheet 23. That is, the heat-absorbing fins 73 are in contact with the rear of the light-emitting circuit board 22A via the heat-dissipating sheet 23. The length of the heat-absorbing fins 73 in the vertical and horizontal directions is the same as the length of the heat-dissipating fins 72. The width of the heat-absorbing fins 73 in the front-rear direction is longer than the width of the heat-dissipating fins 72 in the front-rear direction. Furthermore, in this embodiment, the heat dissipation fins 72 and heat absorption fins 73 at the rear of the light-emitting circuit board 22A face each other in the front-to-back direction. Multiple heat absorption fins 73 are integrally molded with the substrate fixing portion 730.

[0062] As shown in Figure 6, the multiple mounting portions 70R are arranged on the left-right sides of the substrate fixing portion 730. In this embodiment, the measuring device 10B has two pairs of mounting portions 70R arranged on the left-right sides of the substrate fixing portion 730. Each mounting portion 70R has a locking hole 70h in the center. The locking hole 70h is a hole that opens in the front-rear direction. The measuring device 10B can be attached to a vehicle (not shown) or the like by passing a locking screw through the locking hole 70h. The vertical width of the mounting portion 70R increases as it extends from the tip of the mounting portion 70R to the side of the substrate fixing portion 730. In a front-rear view, the base end of the mounting portion 70R and the side of the substrate fixing portion 730 form a gentle curve as they extend in the vertical direction. This curve prevents the locking screw from loosening due to vibrations of the vehicle body or the like. Multiple mounting portions 70R are integrally molded with the substrate fixing portion 730.

[0063] As shown in Figure 8, the measuring device 10B includes a control circuit board 90 having the control circuit 42 described above. The control circuit board 90 is arranged vertically with respect to the light-emitting circuit board 22A and the light-receiving circuit board 32A. In this embodiment, the control circuit board 90 is located below the light-emitting circuit board 22A and the light-receiving circuit board 32A.

[0064] The control circuit board 90 is connected to the light-emitting circuit board 22A via a light-emitting side communication cable 92 (an example of a first communication cable). The light-emitting side communication cable 92 extends in the vertical direction. In this embodiment, the light-emitting side communication cable 92 is connected to the front of the control circuit board 90. The control circuit board 90 is connected to the light-receiving circuit board 32A via a light-receiving side communication cable 94 (an example of a second communication cable). The light-receiving side communication cable 94 extends in the vertical direction. In this embodiment, the light-receiving side communication cable 94 is connected to the rear of the control circuit board 90. In addition, in this embodiment, the control circuit board has an external communication cable 96 at its bottom. The external communication cable 96 connects the control circuit board 90 to a communication I / F 50 and the like in a communication manner. The light-emitting side communication cable 92, the light-receiving side communication cable 94, and the external communication cable 96 are, for example, flexible circuit boards.

[0065] The light-emitting circuit board 22A, the light-receiving circuit board 32A, and the control circuit board 90 are fixed in front of the substrate fixing portion 730. In this embodiment, the light-emitting circuit board 22A is located in the upper left of the substrate fixing portion 730. The light-receiving circuit board 32A is located in the upper right of the substrate fixing portion 730. The control circuit board 90 is located below the substrate fixing portion 730. The left side of the light-emitting circuit board 22A is fixed to the substrate fixing portion 730 by a retaining member 36. The right side of the light-receiving circuit board 32A is fixed to the substrate fixing portion 730 by a retaining member 37. The right side of the light-emitting circuit board 22A and the left side of the light-receiving circuit board 32A are fixed by the same member (not shown). The left and right sides of the control circuit board 90 are fixed to the substrate fixing portion 730 by retaining members 38A and 38B.

[0066] B-2. Effects of the second embodiment: In the second embodiment, the device may further include a housing 70B that houses the light-emitting optical system 24, the light-receiving optical system 34, the light-emitting circuit board 22A, and the light-receiving circuit board 32A, wherein the housing 70B has a heat sink 80 that forms the rear side wall relative to the light-emitting circuit board 22A and the light-receiving circuit board 32A, and the heat sink 80 has a plurality of heat dissipation fins 72 that protrude to the outside of the housing 70B and are arranged along the left-right direction. With this configuration, the heat sink 80 that forms the rear side wall of the housing 70B relative to the light-emitting circuit board 22A and the light-receiving circuit board 32A makes it easier for the measuring device 10B to dissipate heat.

[0067] In the second embodiment, the heat sink 80 further has a plurality of heat-absorbing fins 73 formed on the side of the forward-positioned circuit board (22A, 32A) of the light-emitting circuit board 22A and the light-receiving circuit board 32A, and the heat-absorbing fins 73 may be configured to extend from the housing 70B facing the forward-positioned circuit board (22A, 32A) toward the one circuit board (22A, 32A). With this configuration, by further providing the heat sink 80 on the side wall (inner surface) of the housing 70B facing the forward-positioned circuit board (22A, 32A) of the light-emitting circuit board 22A and the light-receiving circuit board 32A, the measuring device 10B becomes even more efficient at dissipating heat.

[0068] In the second embodiment, the control circuit board 90 including the control circuit 42 may be further provided, and the control circuit board 90 may be positioned vertically relative to the light-emitting circuit board 22A and the light-receiving circuit board 32A. With this configuration, by providing the control circuit board 90 vertically relative to the light-emitting circuit board 22A and the light-receiving circuit board 32A, the size of the measuring device 10B can be further suppressed.

[0069] In the second embodiment, the configuration may include a light-emitting side communication cable 92 that connects the light-emitting circuit board 22A and the control circuit board 90 so that they can communicate in the vertical direction, and a light-receiving side communication cable 94 that connects the light-receiving circuit board 32A and the control circuit board 90 so that they can communicate in the vertical direction. With this configuration, the light-emitting circuit board 22A and the control circuit board 90 are connected so that they can communicate over the shortest distance, and the light-receiving circuit board 32A and the control circuit board 90 are connected so that they can communicate over the shortest distance. By making the light-emitting side communication cable 92 and the light-receiving side communication cable 94 as short as possible, the electrical resistance of each communication cable (92, 94) is minimized. As a result, power consumption can be reduced. In addition, by making each communication cable (92, 94) shorter, the measuring device 10B can be made larger.

[0070] Each circuit board (22A, 32A, 90) is fixed to the circuit board fixing part 730. This prevents accidental detachment of each circuit board (22A, 32A, 90) when adjusting the measuring device 10B or replacing parts. Specifically, when adjusting the measuring device 10B or replacing parts, the optical system housing part 710 and the circuit board housing part 720, which are part of the housing 70B, are removed from the measuring device 10B. The inside of the measuring device 10B (internal spaces 71B, 71C) is exposed. The light-emitting side mount member 25A and the light-receiving side mount member 35A are fixed to the optical system housing part 710. Therefore, by removing the optical system housing part 710 from the housing 70B, the light-emitting optical system 24 and the light-receiving optical system 34 can be replaced or adjusted. In addition, the circuit board housing part 720 and the circuit board fixing part 730 are separable. Even when the optical system housing 710 and the substrate housing 720 are removed from the measuring device 10B, the substrate fixing part 730 remains fixed to the vehicle body or the like by the mounting part 70R of the substrate fixing part 730. Therefore, since each substrate (22A, 32A, 90) is also fixed to the vehicle body via the substrate fixing part 730, each substrate (22A, 32A, 90) will not fall off unexpectedly.

[0071] C. Modifications: The technologies disclosed herein are not limited to the embodiments described above, and can be modified in various forms without departing from their essence, for example, the following modifications are possible.

[0072] The configuration of the measuring device 10 in the above embodiment is merely an example and can be modified in various ways. For example, in the above embodiment, the light-emitting circuit board 22A was configured to include multiple light-emitting elements, but it may also be configured to include one light-emitting element. The light-receiving circuit board 32A was configured to include multiple light-receiving elements, but it may also be configured to include one light-receiving element.

[0073] In the above embodiment, the light-emitting lenses constituting the light-emitting optical system 24 are not limited to two, but may be one or three or more. The light-emitting optical system 24 is not limited to being fixed to the housing 70, but may also be fixed to the light-emitting circuit board 22A. The light-receiving lenses constituting the light-receiving optical system 34 are not limited to five, but may be two to four, or six or more. The light-receiving optical system 34 is not limited to being fixed to the housing 70, but may also be fixed to the light-receiving circuit board 32A. The central axis G1 of the light-emitting optical system 24 and the central axis G2 of the light-receiving optical system 34 do not have to be perfectly parallel to each other, and may intersect each other. The through-passages 25B and 35B are not limited to being cylindrical, but may also be fixing members that individually fix each lens.

[0074] In the above embodiment, the light receiving circuit board 32A may be positioned in front of the light emitting circuit board 22A. However, with the configuration of the above embodiment, it is possible to suppress an increase in the size of the measuring device 10 (housing 70) in the front-to-back direction.

[0075] In the above embodiment, the light-emitting circuit board 22A was positioned behind the light-receiving optical system 34 (light-receiving lens 34A) (see Figure 2). However, the light-emitting circuit board 22A may be positioned so as to overlap the light-receiving optical system 34 when viewed from the left or right. This configuration suppresses an increase in the front-to-back size of the measuring device 10 (housing 70). In the above embodiment, the light-emitting circuit board 22A may be positioned closer to the light-receiving circuit board 32A than to the light-receiving optical system 34.

[0076] Figure 4 is an explanatory diagram showing the internal structure of the measuring device 10A in a modified example. The measuring device 10A in this modified example differs from the measuring device 10 of the above embodiment in the configuration of the light-emitting optical system 24 and the light-receiving optical system 34, and in the arrangement of the light-emitting circuit board 22A and the light-receiving circuit board 32A, but all other points are the same.

[0077] Specifically, the light projection optical system 24 includes a first light projection lens 24A and a third light projection lens 24C. The light receiving optical system 34 includes three light receiving lenses 34A to 34C. The front end of the light projection optical system 24 (the third light projection lens 24C furthest from the light projection circuit board 22A) and the front end of the light receiving optical system 34 (the light receiving lens 34C furthest from the light receiving circuit board 32A) are at the same position in the front-to-back direction. The rear end of the light projection optical system 24 (the first light projection lens 24A closest to the light projection circuit board 22A) is located behind the rear end of the light receiving optical system 34 (the light receiving lens 34A closest to the light receiving circuit board 32A).

[0078] The light-emitting circuit board 22A is positioned behind the light-receiving circuit board 32A. Parts of the light-emitting circuit board 22A and parts of the light-receiving circuit board 32A overlap when viewed in the front-to-back direction. Therefore, compared to a configuration where the light-emitting array 22 and the light-receiving array 32 are arranged on a common circuit board, for example, it is possible to suppress the increase in the distance between the light-emitting array 22 and the light-receiving array 32 due to the presence of circuit elements.

[0079] In this modification, when viewed from the front to the back, the left end of the light-receiving circuit board 32A is located between the right end of the light-emitting circuit board 22A and the right end of the light-emitting array 22. When viewed from the front to the back, the entire light-emitting array 22 is exposed and not hidden by the light-receiving circuit board 32A (semiconductor substrate 32C). When viewed from the front to the back, the light-receiving circuit board 32A does not overlap with the light-receiving array 32 and is positioned at a distance from each other in the left-right direction. Therefore, the presence of the light-receiving circuit board 32A does not obstruct the emission of light L1 from the light-emitting array 22 to the light-emitting optical system 24. In the left-right direction, the overlap length D2 between the light-receiving circuit board 22A and the light-receiving circuit board 32A may be 1 / 10 or more, 1 / 8 or more, or 1 / 6 or more of the left-right width of either the light-receiving circuit board 22A or the light-receiving circuit board 32A.

[0080] In this modification, the light-receiving circuit board 32A is positioned closer to the light-emitting optical system 24 than the light-emitting circuit board 22A in the front-to-back direction. This more effectively suppresses the obstruction of the emission of light L1 from the light-emitting array 22 to the light-emitting optical system 24.

[0081] In this modified example, the light-receiving circuit board 32A was positioned behind the light-emitting optical system 24 (first light-emitting lens 24A) (see Figure 4), but the light-receiving circuit board 32A may be positioned so as to overlap the light-emitting optical system 24 when viewed from the left or right. In this modified example, the light-receiving circuit board 32A may be positioned closer to the light-emitting optical system 24 in the front-to-back direction.

[0082] In the above embodiment, the housing 70B is composed of an optical system housing section 710, a substrate housing section 720, and a substrate fixing section 730, but these do not have to be separate components. For example, the optical system housing section 710 and the substrate housing section 720 may be integrally molded.

[0083] In the above embodiment, the substrate fixing portion 730 has four mounting portions 70R, but there may be more than that. For example, there may be six or eight mounting portions 70R. Also, although the mounting portions 70R are arranged in the left-right direction of the substrate fixing portion 730, they may also be arranged in the up-down direction.

[0084] In the above embodiment, the heat dissipation fins 72 are positioned on the upper rear side of the substrate fixing portion 730, but are not limited to the upper side only. For example, they may be positioned across the entire rear surface of the substrate fixing portion 730. The heat dissipation fins 72 are members that extend in the vertical direction, but are not limited to this. The heat dissipation fins 72 may also extend in the left-right direction. Multiple heat dissipation fins 72 are arranged in the left-right direction behind the substrate fixing portion 730, but are not limited to this. Multiple heat dissipation fins 72 may also be arranged in the vertical direction behind the substrate fixing portion 730. Furthermore, the tips of the heat dissipation fins 72 form the rear surface of the substrate fixing portion 730, but are not limited to this. For example, the tips of the heat dissipation fins 72 may be located in front of or behind the rear surface of the substrate fixing portion 730. The heat dissipation fins 72 are formed by a pair of grooves 72h at the rear of the substrate fixing portion 730, but are not limited to this. For example, the heat dissipation fins 72 may be positioned on the rear surface of the substrate fixing portion 730.

[0085] In the above embodiment, the heat-absorbing fins 73 are in contact with the light-emitting circuit board 22A via the heat-dissipating sheet 23, but they may also be in contact with the light-emitting circuit board 22A without the heat-dissipating sheet 23. Furthermore, the heat-absorbing fins 73 do not need to be in contact with the light-emitting circuit board 22A. In addition, the heat-absorbing fins 73 are positioned in front of the substrate fixing portion 730 behind the light-emitting circuit board 22A, but if the light-receiving circuit board 32A is positioned in front of the light-emitting circuit board 22A, the heat-absorbing fins 73 may be positioned behind the light-receiving circuit board 32A. Note that the light-emitting circuit board 22A generates more heat than the light-receiving circuit board 32A, so the above embodiment makes it easier for the measuring device 10B to dissipate heat.

[0086] This international application claims priority based on Japanese Patent Application No. 2024-226883, filed on 24 December 2024, and Japanese Patent Application No. 2025-041240, filed on 14 March 2025, and the entire contents of said Japanese Patent Application No. 2024-226883 and Japanese Patent Application No. 2025-041240 are incorporated herein by reference.

[0087] The above description of specific embodiments of the present invention is provided for illustrative purposes only. It is not intended to be exhaustive or to limit the invention to the forms described. Numerous modifications and changes are possible in light of the above description, as will be obvious to those skilled in the art.

[0088] 10, 10A, 10B: Measuring device 20: Light emitter 22: Light emitter array 22A: Light emitter circuit board 22B: Light emitter circuit element 22C, 32C: Semiconductor substrate 22E, 32E: Circuit mounting area 23: Heat dissipation sheet 24: Light emitter optical system 25A: Light emitter side mounting member 25B, 35B: Through passage 26: Light emitter control device 28: Current source 30: Light receiver 32: Light receiver array 32A: Light receiver circuit board 32B: Light receiver circuit element 34: Light receiver optical system 35A: Light receiver side mounting member 40: TOF measuring device 42: Control circuit 70, 70B: Housing 70R: Mounting part 71, 71B, 71C: Internal space 72: Heat dissipation fin 70h: Locking hole 72h: Groove 73: Heat absorption fin 74: Opening 76: Light-transmitting member 80: Heat sink 90: Control circuit board 92: Light-emitting communication cable 94: Light-receiving communication cable 96: External communication cable 710: Optical system housing 720: Substrate housing 730: Substrate fixing part L1: Emitted light L2: Reflected light W: Measurement target

Claims

1. A measuring device comprising: a light-emitting optical system; a light-receiving optical system arranged in a first direction with respect to the light-emitting optical system; a light-emitting circuit board including a light-emitting element, arranged on one side of a second direction perpendicular to the first direction with respect to the light-emitting optical system; and a light-receiving circuit board including a light-receiving element, arranged on the one side of the second direction with respect to the light-receiving optical system, wherein the light-emitting circuit board and the light-receiving circuit board are arranged at different positions from each other in the second direction, and a part of the light-emitting circuit board and a part of the light-receiving circuit board overlap each other when viewed in the second direction.

2. A measuring device according to claim 1, wherein the one end of the light-receiving optical system in the second direction is located on the one side in the second direction more than the one end of the light-emitting optical system in the second direction more than the one side in the second direction more than the light-emitting circuit board is located on the one side in the second direction more than the light-emitting circuit board.

3. A measuring device according to claim 2, wherein the light-emitting circuit board is positioned closer to the light-receiving optical system than the light-receiving circuit board in the second direction.

4. A measuring device according to claim 1 or claim 2, wherein the light-receiving circuit board is positioned on one side of the second direction relative to the light-emitting circuit board, and in the view in the second direction, the tip of a portion of the light-emitting circuit board is located between the tip of a portion of the light-receiving circuit board and the light-receiving optical system.

5. A measuring device according to claim 1, wherein the one end of the light-emitting optical system in the second direction is located on the one side in the second direction more than the one end of the light-receiving optical system in the second direction more than the one side in the second direction more than the light-receiving circuit board is located on the one side in the second direction more than the light-receiving circuit board.

6. A measuring device according to claim 5, wherein the light receiving circuit board is positioned closer to the light projection optical system than the light projection circuit board in the second direction.

7. A measuring device according to claim 1 or claim 5, wherein the light-emitting circuit board is positioned on one side of the second direction relative to the light-receiving circuit board, and in the view in the second direction, the tip of a portion of the light-receiving circuit board is located between the tip of a portion of the light-emitting circuit board and the light-emitting optical system.

8. A measuring device according to claim 1, further comprising a housing for housing the light-emitting optical system, the light-receiving optical system, the light-emitting circuit board, and the light-receiving circuit board, wherein the housing has a heat sink that constitutes the side wall on one side in the second direction relative to the light-emitting circuit board and the light-receiving circuit board, and the heat sink has a plurality of heat dissipation fins protruding from the outside of the housing arranged along the first direction.

9. A measuring device according to claim 8, wherein the heat sink further has a plurality of heat-absorbing fins formed on the side of the light-emitting circuit board and the light-receiving circuit board that is located on the other side in the second direction, and the heat-absorbing fins extend from the housing facing the one circuit board in the second direction toward the one circuit board.

10. A measuring device according to claim 1, further comprising a control circuit board including a control circuit for controlling the light-emitting element and the light-receiving element, wherein the control circuit board is arranged in a third direction perpendicular to both the first direction and the second direction with respect to the light-emitting circuit board and the light-receiving circuit board.

11. A measuring device according to claim 10, comprising: a first communication cable connecting the light-emitting circuit board and the control circuit board so that they can communicate in the third direction; and a second communication cable connecting the light-receiving circuit board and the control circuit board so that they can communicate in the third direction.

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