Resin composition, film, polarizing sheet, and sunglasses

Abstract

The present invention can provide: a resin composition which is capable of providing a film that is capable of effectively suppressing gum and gel during the production of the film; and a film, a polarizing sheet, and sunglasses. Provided is a resin composition which contains a polyamide resin (A) that contains an alicyclic diamine unit and an aliphatic dicarboxylic acid unit and a phosphate compound (B) that has a structure represented by the formula P(=O)(O-R1)3-n(O-R2)n (wherein R1 represents a hydrogen atom or a metal atom, R2 represents a substituent other than a metal atom, and n is an integer of 1 or 2). The content of the phosphate compound (B) is 0.001-2.5 mass% in the resin composition.

Description

Resin composition, film, polarizing sheet, and sunglasses

[0001] This invention relates to resin compositions, films, polarizing sheets, and sunglasses. In particular, it relates to resin compositions mainly composed of polyamide resin, etc.

[0002] Polyamide resins are used in a wide range of applications, including electrical and electronic equipment, automobiles, machinery, and building materials, due to their excellent mechanical properties such as rigidity and strength, as well as heat resistance (Patent Documents 1-3).

[0003] Japanese Patent Publication No. 2015-129271, Japanese Patent Publication No. 2013-001906, Japanese Patent Publication No. 2012-131977

[0004] As mentioned above, polyamide resins are used in a wide range of fields, but when polyamide resins are molded into films, glue can form or the polyamide resin can gel during film manufacturing. The present invention aims to solve these problems and provides a resin composition that can provide a film that can effectively suppress glue and gel formation during film manufacturing, as well as a film, a polarizing sheet, and sunglasses.

[0005] Based on the above problems, the inventors conducted research and found that the above problems can be solved by blending a predetermined phosphate compound into a predetermined polyamide resin in a proportion of 0.001 to 2.5% by mass in the resin composition. Specifically, the above problems were solved by the following means: <1> A polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, and P(=O)(O-R １ ) ３-ｎ (O-R ２ ) ｎ The structure represented by (where R １ represents a hydrogen atom or a metal atom, R ２represents a substituent other than a metal atom, and n is an integer of 1 or 2.) A resin composition containing a phosphate compound (B), wherein the content of the phosphate compound (B) is 0.001 to 2.5% by mass in the resin composition. <2> The resin composition according to <1>, wherein the aliphatic dicarboxylic acid unit contains an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms. <3> The resin composition according to <1> or <2>, wherein the aliphatic dicarboxylic acid unit contains a sebacic acid unit and / or a dodecanedioic acid unit. <4> The resin composition according to any one of <1> to <3>, wherein the alicyclic diamine constituting the alicyclic diamine unit contains two substituted or unsubstituted cyclohexane rings. <5> The resin composition according to any one of <1> to <4>, wherein the alicyclic diamine unit contains a unit represented by the formula (PA-1). (In the formula (PA-1), R １ are each independently an alkyl group having 1 to 5 carbon atoms, and n1 are each independently an integer of 0 to 3. * is a bonding site with another unit or a terminal group.) <6> The resin composition according to any one of <1> to <5>, wherein the phosphate compound (B) contains a phosphate compound (B1) having an aliphatic group. <7> The phosphate compound (B) is P(=O)(O-R １ )(O-R ３-ｎ )(O-R ２ ), in the structure represented by, at least one of R ｎ is a linear or branched alkyl group having 10 to 30 carbon atoms. The resin composition according to any one of <1> to <6> containing a phosphate compound (B2). <8> The resin composition according to any one of <1> to <7>, wherein the phosphate compound (B) contains at least one of a compound represented by the formula (P1), a compound represented by the formula (P2), and a compound represented by the formula (P3). (In the formulas (P1) to (P3), R ｘ ​​Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, and n represents 1 or 2.) <9> The resin composition according to any one of <1> to <8>, wherein the content of the polyamide resin (A) in the resin composition is 80 to 99.9% by mass (however, the sum of the polyamide resin (A) and the phosphate compound (B) does not exceed 100% by mass). <10> The resin composition according to any one of <1> to <9>, further comprising a mold release agent. <11> The resin composition according to any one of <1> to <10>, wherein the polyamide resin (A) is amorphous or microcrystalline resin. <12> The resin composition according to any one of <1> to <11>, wherein the haze when the resin composition is molded into a film with a thickness of 300 μm is 3.0% or less. <13> The resin composition according to any one of <1> to <12>, wherein the total light transmittance when the resin composition is formed into a film with a thickness of 300 μm is 80% or more. <14> The resin composition according to any one of <1> to <13>, which is for use as a protective film for a polarizing sheet. <15> The resin composition according to any one of <1> to <14>, wherein the aliphatic dicarboxylic acid unit comprises a sebaciate unit and / or a dodecanediate unit, the alicyclic diamine unit comprises a unit represented by formula (PA-1), the phosphate compound comprises at least one of the compound represented by formula (P1), the compound represented by formula (P2), and the compound represented by formula (P3), the content of the polyamide resin (A) in the resin composition is 80.0 to 99.9% by mass (provided that the sum of the polyamide resin (A) and the phosphate compound (B) does not exceed 100% by mass), the polyamide resin (A) is amorphous or microcrystalline, the haze when the resin composition is formed into a 300 μm thick film is 3.0% or less, and the total light transmittance when the resin composition is formed into a 300 μm thick film is 80% or more, and is for use as a protective film for a polarizing sheet. (In formula (PA-1), R １ Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group. (In formulas (P1) to (P3), Rｘ Each independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, and n represents 1 or 2.) <16> Furthermore, a resin composition according to any one of <1> to <15>, which contains a release agent. <17> A film formed from the resin composition according to any one of <1> to <16>. <18> A polarizing sheet including the film according to <17> and a polarizing film. <19> Sunglasses including the polarizing sheet according to <18>.

[0006] A resin composition capable of providing a film that can effectively suppress meyan and gel during film production, as well as a film, a polarizing sheet, and sunglasses have been provided.

[0007] It is a schematic diagram for explaining an example of the layer structure of the thermally bent molded article of the present embodiment.

[0008] Hereinafter, embodiments for carrying out the present invention (hereinafter simply referred to as "this embodiment") will be described in detail. Note that this embodiment is an example for explaining the present invention, and the present invention is not limited to this embodiment. In this specification, "~" is used to mean that the numerical values ​​before and after it include the lower and upper limits. Furthermore, any combination of the upper and lower limits of the numerical values ​​in this specification is given as an example of this embodiment. In this specification, various physical properties and characteristic values ​​are given at 23°C unless otherwise specified. In the notation of groups (atomic groups) in this specification, notations that do not specify substitution or unsubstituted include both groups (atomic groups) with substituents and groups (atomic groups) without substituents. For example, "alkyl group" includes not only alkyl groups without substituents (unsubstituted alkyl groups) but also alkyl groups with substituents (substituted alkyl groups). In this specification, when notations that do not specify substitution or unsubstituted are used, unsubstituted is preferred. Examples of substituents in this specification are preferably halogen atoms, cyano groups, nitro groups, hydroxyl groups, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, heterocyclic groups, heterocyclic oxy groups, alkenyl groups, alkylsulfanyl groups, arylsulfanyl groups, acyl groups, or amino groups; more preferably halogen atoms, alkyl groups, alkoxy groups, aryl groups, aryloxy groups, alkenyl groups, or acyl groups; even more preferably alkyl groups, aryl groups, aryloxy groups, or alkenyl groups; and even more preferably alkyl groups. The formula weight of these substituents is preferably 15 or more, and preferably 200 or less. Formula weight refers to, for example, a methyl group (-CH ３ If so, the result is 15. These substituents may have further substituents, but it is preferable that they do not have substituents.

[0009] In this specification, "film" refers to a molded product that is thin in thickness relative to its length and width, and is generally flat, and includes sheets. Furthermore, "film" in this specification may be single-layer or multi-layer, but single-layer is preferred. If the measurement methods, etc., described in the standards shown in this specification differ from year to year, unless otherwise specified, the standards as of January 1, 2024 shall apply. If the measurement methods, etc., described in the standards shown in this specification are obsolete as of January 1, 2024, the standards in effect at the time of obsolete shall apply. Figure 1 may not accurately reflect the actual scale, etc.

[0010] <Resin Composition> The resin composition of this embodiment comprises a polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, and P(=O)(O-R １ ) ３-ｎ (O-R ２ ) ｎ The structure represented by (where R １ represents a hydrogen atom or a metal atom, R ２represents a substituent other than a metal atom, and n is an integer of 1 or 2.) A phosphate compound (B) is included, and the content of the phosphate compound (B) is in the range of 0.001 to 2.5% by mass in the resin composition. By adopting such a configuration, a resin composition capable of providing a film that can effectively suppress meyani and gel during the production of the film can be obtained. Meyani is, for example, a deposit generated by the accumulation of polyamide resin at the die lip part during extrusion molding, and is mainly presumed to be caused by decomposition products of the polyamide resin. By blending a stabilizer such as the phosphate compound (B), the decomposition of the polyamide resin (A) can be effectively suppressed. On the other hand, gel is caused by the polyamide resin decomposing and recombining to form a polymer due to the thermal history during compounding. That is, since the polyamide resin (A) is inherently a resin that easily reacts with the active sites on the metal surface, it reacts with the active sites present on the metal surface in the molding machine, and it is considered that gel is generated due to the promotion of decomposition and recombination thereby. In this embodiment, it is presumed that the phosphate compound (B) having a predetermined structure acts on the metal active sites, effectively suppressing the polyamide resin (A) from reacting with the active sites on the metal surface, and suppressing the gelation of the polyamide resin (A). Furthermore, the resin composition of this embodiment can be excellent in transparency and can also be preferably used for optical parts. Hereinafter, the details of this embodiment will be described.

[0011] <Polyamide resin (A) containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit> The resin composition of this embodiment contains a polyamide resin (A) (hereinafter sometimes referred to as "polyamide resin (A)") containing an alicyclic diamine unit and an aliphatic dicarboxylic acid unit. The alicyclic structure of the polyamide resin (A) can improve the transparency of the polyamide resin itself, and can also improve the transparency of the obtained film. Furthermore, since the polyamide resin (A) also has excellent compatibility with the phosphate compound (B), the obtained resin composition does not impair transparency.

[0012] In this embodiment, the alicyclic diamine constituting the alicyclic diamine unit is preferably a diamine containing a five-membered ring and / or a six-membered ring. The five-membered ring and / or six-membered ring may or may not have substituents. Furthermore, it is preferable that the alicyclic diamine consists only of aliphatic hydrocarbon groups containing an alicyclic structure, except for the terminal amino group. The alicyclic diamine unit preferably contains two or three or more substituted or unsubstituted cyclohexane rings, and even more preferably two substituted or unsubstituted cyclohexane rings. It is preferable that the alicyclic diamine unit does not contain carbon-carbon double bonds or carbon-carbon triple bonds. The molecular weight of the alicyclic diamine constituting the alicyclic diamine unit is preferably 195 or more, more preferably 200 or more, preferably 500 or less, more preferably 400 or less, and even more preferably 300 or less.

[0013] In this embodiment, it is more preferable that the alicyclic diamine unit includes at least one unit represented by formula (PA-0). (In formula (PA-0), R is independently a substituent, and n is independently an integer from 0 to 5. L is a single bond or a divalent linking group. * is a bonding site with another unit or terminal group.) In formula (PA-0), R is independently a substituent, preferably an aliphatic group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 6 carbon atoms, even more preferably a linear or branched alkyl group having 1 to 6 carbon atoms, even more preferably a methyl group, an ethyl group, or a propyl group, and even more preferably a methyl group. In formula (PA-0), n is independently an integer from 0 to 5, preferably an integer of 1 or more, preferably an integer of 4 or less, more preferably an integer of 3 or less, even more preferably an integer of 2 or less, and even more preferably an integer of 1 or less. In formula (PA-0), L is a single bond or a divalent linking group, more preferably a single bond or a divalent aliphatic hydrocarbon group, more preferably a single bond or a divalent alkylene group, even more preferably a single bond or a C1-C3 alkylene group, even more preferably a single bond, a methylene group, an ethylene group, or an isopropylene group, and even more preferably a methylene group. * indicates a bonding site with another unit or terminal group. That is, it is usually bonded to -C(=O)- to form an amide bond with NH in formula (PA-0), or bonded to a hydrogen atom to form a terminal amino group with NH in formula (PA-0), or bonded to a terminal group.

[0014] In this embodiment, it is more preferable that the alicyclic diamine unit includes a unit represented by formula (PA-1). (In formula (PA-1), R １ Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group.

[0015] In formula (PA-1), R １is an alkyl group having 1 to 5 carbon atoms, preferably a linear or branched alkyl group having 1 to 5 carbon atoms, more preferably a methyl group, an ethyl group, or a propyl group, and even more preferably a methyl group. In formula (PA-1), n1 is an integer from 0 to 3, preferably an integer of 1 or more, preferably an integer of 2 or less, and even more preferably 1.

[0016] Specific examples of alicyclic diamines include 1,3-bis(aminomethyl)cyclohexane, 1,4-bis(aminomethyl)cyclohexane, 1,3-diaminocyclohexane, 1,4-diaminocyclohexane, bis(4-aminocyclohexyl)methane, bis(4-amino-3-methylcyclohexyl)methane, 2,2-bis(4-aminocyclohexyl)propane, 2,2-bis(4-amino-3-methylcyclohexyl)propane, bis(aminomethyl)decalin, and bis(aminomethyl)tricyclodecane.

[0017] The polyamide resin (A) contains alicyclic diamine units in a proportion of preferably 75 mol% or more, more preferably 80 mol% or more, even more preferably 85 mol% or more, even more preferably 90 mol% or more, even more preferably 95 mol% or more, particularly even more preferably 99 mol% or more, and 100 mol% or less of the total diamine units constituting the polyamide resin (A). The alicyclic diamine units may be one type or a combination of two or more types.

[0018] Examples of diamines other than alicyclic diamines that can be used as raw material diamines for polyamide resin (A) include aliphatic diamines such as tetramethylenediamine, pentamethylenediamine, 2-methylpentanediamine, hexamethylenediamine, heptamethylenediamine, octamethylenediamine, nonamethylenediamine, decamethylenediamine, dodecamethylenediamine, 2,2,4-trimethylhexamethylenediamine, and 2,4,4-trimethylhexamethylenediamine, as well as diamines having aromatic rings such as xylylenediamine, bis(4-aminophenyl) ether, paraphenylenediamine, and bis(aminomethyl)naphthalene. One or more of these can be used in combination.

[0019] On the other hand, in this embodiment, the aliphatic dicarboxylic acid constituting the aliphatic dicarboxylic acid unit is preferably a linear or branched aliphatic dicarboxylic acid having 7 to 20 carbon atoms, more preferably a linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms, and even more preferably an α,ω-linear aliphatic dicarboxylic acid having 7 to 20 carbon atoms. The number of carbon atoms in the aliphatic dicarboxylic acid is preferably 8 or more, more preferably 9 or more, even more preferably 10 or more, preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, even more preferably 13 or less, and even more preferably 12 or less. The aliphatic dicarboxylic acid is HOOC-(CH ２ ) ｎ It is preferable to represent it as -COOH, where n is an integer from 5 to 18. The aliphatic dicarboxylic acid unit that can be used in this embodiment preferably includes an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms, more preferably includes at least one of a sebacic acid unit, an undecanediic acid unit, and a dodecanediic acid unit, and even more preferably includes a sebacic acid unit and / or a dodecanediic acid unit.

[0020] The polyamide resin (A) contains aliphatic dicarboxylic acid units in a proportion of preferably 75 mol% or more, more preferably 80 mol% or more, even more preferably 85 mol% or more, even more preferably 90 mol% or more, even more preferably 95 mol% or more, particularly even more preferably 99 mol% or more, and 100 mol% or less of the total dicarboxylic acid units constituting the polyamide resin (A). The aliphatic dicarboxylic acid units may be one type or a combination of two or more types.

[0021] Examples of dicarboxylic acids other than aliphatic dicarboxylic acids include phthalate compounds such as isophthalic acid, terephthalic acid, and orthophthalic acid, as well as isomers of naphthalenedicarboxylic acids such as 1,2-naphthalenedicarboxylic acid, 1,3-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,5-naphthalenedicarboxylic acid, 1,6-naphthalenedicarboxylic acid, 1,7-naphthalenedicarboxylic acid, 1,8-naphthalenedicarboxylic acid, 2,3-naphthalenedicarboxylic acid, 2,6-naphthalenedicarboxylic acid, and 2,7-naphthalenedicarboxylic acid, and can be used individually or in combination of two or more.

[0022] The polyamide resin (A) used in this embodiment may further contain aminocarboxylic acid units. Including aminocarboxylic acid units tends to further improve the hue of molded products such as films. There is no particular type of aminocarboxylic acid that constitutes the aminocarboxylic acid unit, and known aminocarboxylic acids can be used. In this embodiment, it is preferable that the aminocarboxylic acid is composed only of aliphatic hydrocarbon groups other than the terminal amino group and carboxylic acid group. The molecular weight of the aminocarboxylic acid constituting the aminocarboxylic acid unit is preferably 180 or more, more preferably 190 or more, preferably 400 or less, more preferably 300 or less, and even more preferably 250 or less.

[0023] In this embodiment, the aminocarboxylic acid constituting the aminocarboxylic acid unit is preferably represented by formula (PA-2). (In formula (PA-2), n is an integer between 5 and 20.) In formula (PA-2), n is an integer between 5 and 20, preferably 6 or more, more preferably 7 or more, even more preferably 8 or more, even more preferably 9 or more, even more preferably 10 or more, and also preferably 18 or less, more preferably 16 or less, even more preferably 14 or less, even more preferably 13 or less, and even more preferably 12 or less.

[0024] It should be noted that while polyamide resin (A) mainly contains diamine units and dicarboxylic acid units, it does not completely exclude other monomer units, and it goes without saying that it may also contain lactam units such as ε-caprolactam and laurolactam, and aliphatic aminocarboxylic acid units such as aminocaproic acid and aminoundecanoic acid. In particular, it is preferable that the polyamide resin (A) used in this embodiment contains aminocarboxylic acid units. In this embodiment, it is preferable that the total mass of diamine units, dicarboxylic acid units, and optionally included aminocarboxylic acid units among the monomer units constituting polyamide resin (A) accounts for 90% by mass or more of the total monomer units, more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 99% by mass or more. The molar ratio of diamine units to dicarboxylic acid units in polyamide resin (A) is preferably 40:60 to 60:40, and more preferably 45:55 to 55:45. Furthermore, in this embodiment, when the polyamide resin (A) contains aminocarboxylic acid units, the proportion of aminocarboxylic acid units among the total monomer units constituting the polyamide resin (A) is preferably 1 mol% or more, more preferably 5 mol% or more, even more preferably 10 mol% or more, preferably 50 mol% or less, more preferably 40 mol% or less, even more preferably 30 mol% or less, and even more preferably 20 mol% or less.

[0025] The polyamide resin (A) is preferably amorphous or microcrystalline. Being amorphous or microcrystalline improves the transparency of the resulting film. An amorphous or microcrystalline resin is a resin that does not have a clear melting point, and specifically, its enthalpy of fusion ΔHm is less than 5 J / g, preferably 3 J / g or less, and more preferably 1 J / g or less. The enthalpy of fusion ΔHm is measured in accordance with JIS K7121 and K7122 during the heating process. Specifically, the polyamide resin is heated from room temperature to 250°C at a heating rate of 10°C / min in a nitrogen stream using a differential scanning calorimeter (DSC), then immediately cooled to below room temperature, and then heated again from room temperature to 250°C at a heating rate of 10°C / min.

[0026] It is also preferable to use polyamide resin (A) manufactured using biomass raw materials (biomass polyamide resin). By using biomass polyamide resin, the environmental burden can be reduced. Polyamide resin (A) may also use monomer raw materials that have been certified under Mass Balance Certification (ISCC PLUS). Mass balance certification means that the extent to which renewable raw materials and bio-raw materials are used in each factory or production facility, and how much of the product is produced or shipped, is quantified and guaranteed along with quality. Furthermore, polyamide resin (A) may also be recycled products (including recovered products, material recycled products, chemical recycled products, etc.), rejected products, or scraps generated during the molding of polyamide resin (A) and the resin composition of this embodiment.

[0027] The weight-average molecular weight of the polyamide resin (A) used in this embodiment is preferably 5,000 or more, more preferably 8,000 or more, even more preferably 10,000 or more, preferably 100,000 or less, more preferably 80,000 or less, even more preferably 50,000 or less, and even more preferably 20,000 or less. Setting it above the lower limit tends to further improve the impact resistance of the resulting film. Setting it below the upper limit tends to further improve the fluidity of the resin composition. The weight-average molecular weight is the acrylic equivalent value measured by GPC (gel permeation chromatography). The solvent used for measurement was hexafluoroisopropanol.

[0028] In the resin composition of this embodiment, the content of polyamide resin (A) is preferably 80% by mass or more, more preferably 85% by mass or more, even more preferably 90% by mass or more, even more preferably 95% by mass or more, even more preferably 97% by mass or more, and even more preferably 99% by mass or more, based on 100% by mass of the resin composition. Setting the content of polyamide resin (A) above the lower limit tends to result in a higher glass transition temperature. Furthermore, in the resin composition of this embodiment, the content of polyamide resin (A) is preferably 99.9% by mass or less, based on 100% by mass of the resin composition. Note that in the resin composition of this embodiment, the total of polyamide resin (A) and the phosphate compound (B) described later does not exceed 100% by mass. Setting the content of polyamide resin (A) below the upper limit tends to result in a higher transparency of the resulting film. Furthermore, in the resin composition of this embodiment, all components other than the phosphate compound (B) may be polyamide resin (A). The resin composition of this embodiment may contain only one type of polyamide resin (A), or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0029] The resin composition of this embodiment may or may not contain polyamide resins other than polyamide resin (A). Examples of polyamide resins other than polyamide resin (A) include aliphatic polyamide resins other than polyamide resin (A) and aromatic polyamide resins. Examples of aliphatic polyamide resins include polyamide 4, polyamide 46, polyamide 6, polyamide 66, polyamide 666, polyamide 610, polyamide 11, polyamide 116, polyamide 12, polyamide 612, etc. Examples of aromatic polyamide resins include polyhexamethylene terephthalamide (polyamide 6T), polyhexamethylene isophthalamide (polyamide 6I), polyamide 66 / 6T, polyamide 9T, polyamide 9MT, polyamide 10T, polyamide 6I / 6T, xylylenediamine-based polyamide resins (MXD6, etc.), etc.

[0030] Aliphatic polyamide resins and aromatic polyamide resins other than polyamide resin (A) are preferably manufactured using recycled resins or biomass raw materials, and polyamide resins (biomass thermoplastic resins) are also preferably used. Furthermore, it is preferable that the resin composition of this embodiment substantially contains no polyamide resins other than polyamide resin (A). Specifically, the content of polyamide resins other than polyamide resin (A) in the resin composition of this embodiment is preferably less than 10% by mass, more preferably less than 5% by mass, even more preferably less than 3% by mass, even more preferably less than 1% by mass, and still more preferably less than 0.1% by mass, based on 100% by mass of the resin composition. Furthermore, it is preferable that the resin composition of this embodiment substantially contains no thermoplastic resins other than polyamide resins (polyamide resin (A) and polyamide resins other than polyamide resin (A)). Specifically, the content of thermoplastic resins other than polyamide resins in the resin composition of this embodiment is preferably less than 10% by mass, more preferably less than 5% by mass, even more preferably less than 3% by mass, even more preferably less than 1% by mass, and even more preferably less than 0.1% by mass, based on 100% by mass of the resin composition. Examples of the thermoplastic resins include polyester resins and / or polyphenylene ether resins.

[0031] <Phosphate compound (B)> The resin composition of this embodiment is P(=O)(O-R １ ) ３-ｎ (O-R ２ ) ｎ The structure represented by (where R １ represents a hydrogen atom or a metal atom, R ２ The present invention provides a phosphate compound (B) (which may be referred to as "phosphate compound (B)" herein) having a substituent other than a metal atom, where n is an integer of 1 or 2. By using such a phosphate compound (B) in combination with the polyamide resin (A), a resin composition is obtained that can provide a film that can effectively suppress the formation of grease and gel during film production.

[0032] In this embodiment, the phosphate compound (B) is P(=O)(O-R １ ) ３-ｎ (O-R ２ ) ｎ It has a structure represented by R. １ R represents a hydrogen atom or a metal atom, with a metal atom being more preferred. １ Because the atom is a hydrogen atom or a metal atom, the phosphate compound (B) tends to interact with active sites on the metal surface in the molding machine, more effectively suppressing the formation of grease and gel. Zinc and sodium are preferred as the metal atom, with zinc being more preferred. ２ R represents a substituent other than a metal atom, preferably an aliphatic group, more preferably an aliphatic group having 10 to 30 carbon atoms, and more preferably a linear or branched alkyl group having 10 to 30 carbon atoms. ２ Preferably, at least one of the groups is a linear or branched alkyl group having 10 to 30 carbon atoms. That is, phosphate compound (B) preferably contains phosphate compound (B1) having an aliphatic group, and phosphate compound (B) is P(=O)(O-R １ ) ３-ｎ (O-R ２ ) ｎ In the structure represented by R ２ It is more preferable that at least one of the compounds (B2) is a phosphate compound in which a linear or branched alkyl group having 10 to 30 carbon atoms is present. ２ Because it has an aliphatic group, the phosphate compound (B) is more likely to appear on the film surface during film manufacturing, and it is more likely to interact with the metal active sites on the surface of the molding machine, thus tending to more effectively suppress the formation of glue and gel. １ or R ２ When there are two of them, they may be the same or different. n is an integer of 1 or 2, and 2 is preferred.

[0033] In a linear or branched alkyl group having 10 to 30 carbon atoms, the number of carbon atoms is preferably 13 or more, more preferably 15 or more, preferably 25 or less, more preferably 20 or less, even more preferably 18 or less, and most preferably 18. The linear or branched alkyl group having 10 to 30 carbon atoms is a linear or branched alkyl group, but it is preferably a linear alkyl group.

[0034] In this embodiment, it is preferable that the phosphate compound (B) includes at least one of the compounds represented by formula (P1), formula (P2), and formula (P3). (In formulas (P1) to (P3), R ｘ Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, where n represents 1 or 2.

[0035] R ｘ The number of carbon atoms is preferably 13 or more, more preferably 15 or more, preferably 25 or less, more preferably 20 or less, even more preferably 18 or less, and most preferably 18. ｘ The alkyl group can be linear or branched, but a linear alkyl group is preferred.

[0036] In this embodiment, it is more preferable that the phosphate compound (B) comprises at least one of the compound represented by formula (P1-1) and the compound represented by formula (P2-1). In this embodiment, a mixture of the compound represented by formula (P1-1) and the compound represented by formula (P2-1) is even more preferable. Formula (P1-1) Formula (P2-1)

[0037] Furthermore, in this embodiment, it is preferable that the phosphate compound (B) includes at least one compound represented by formula (P3). Formula (P3) (In formula (P3), R represents a linear or branched alkyl group having 10 to 18 carbon atoms. nx represents 1 or 2.) The number of carbon atoms in R is preferably 13 or more, more preferably 15 or more, preferably 25 or less, more preferably 20 or less, even more preferably 18 or less, and most preferably 18. R is a linear or branched alkyl group, but a linear alkyl group is preferred.

[0038] nx is 1 or 2, and preferably a mixture of 1 and 2.

[0039] The content of phosphate compound (B) in the resin composition of this embodiment is 0.001 to 2.5% by mass of the resin composition. Preferably, the content of phosphate compound (B) is 0.005% by mass or more, more preferably 0.01% by mass or more, even more preferably 0.05% by mass or more, and even more preferably 0.08% by mass or more of the resin composition. Setting the content of phosphate compound (B) above the lower limit tends to effectively suppress the generation of glue and gel during molding. Furthermore, preferably, the content of phosphate compound (B) is 2.0% by mass or less, more preferably 1.5% by mass or less, even more preferably 1.1% by mass or less, and even more preferably 0.6% by mass or less of the resin composition. Setting the content of phosphate compound (B) below the upper limit tends to improve the transparency of the resulting film. The resin composition of this embodiment may contain only one type of phosphate compound (B), or it may contain two or more types. If two or more types are included, it is preferable that the total amount falls within the above range.

[0040] Furthermore, it is preferable that the resin composition of this embodiment substantially contains no phosphate compounds other than phosphate compound (B). Specifically, the content of phosphate compounds other than phosphate compound in the resin composition of this embodiment is preferably less than 10 parts by mass, more preferably less than 5 parts by mass, even more preferably less than 3 parts by mass, even more preferably less than 1 part by mass, and even more preferably less than 0.1 parts by mass, per 100 parts by mass of phosphate compound (B).

[0041] <Release Agent> The resin composition of this embodiment may contain a release agent. By including a release agent, the release properties are improved and roll contamination during film manufacturing can be effectively suppressed. Examples of release agents include at least one compound selected from the group consisting of aliphatic carboxylic acids, esters of aliphatic carboxylic acids and alcohols, aliphatic hydrocarbon compounds with a number average molecular weight of 200 to 15,000, and polysiloxane-based silicone oils, with esters of aliphatic carboxylic acids and alcohols being preferred. Specific examples of esters of aliphatic carboxylic acids and alcohols include beeswax (a mixture mainly composed of myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin distearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate, and the like. In addition, as release agents, the release agents described in paragraph 0032 of Japanese Patent Publication No. 2017-226848 and paragraph 0056 of Japanese Patent Publication No. 2018-199745 can be used, and this information is incorporated herein.

[0042] If the resin composition of this embodiment contains a release agent, the content of the release agent in the resin composition is preferably 0.001 parts by mass or more, more preferably 0.01 parts by mass or more, preferably 2 parts by mass or less, more preferably 1 part by mass or less, and even more preferably 0.5 parts by mass or less, per 100 parts by mass of polyamide resin (A). Only one type of release agent may be used, or two or more types may be used. If two or more types are used, it is preferable that the total amount is within the above range.

[0043] <Polyetheramide Elastomer> The resin composition of this embodiment may also contain a polyetheramide elastomer. By using a polyetheramide elastomer in combination with a mold release agent, it is possible to effectively suppress dirt on the rolls during film manufacturing and the formation of a sharkskin-like texture on the film surface. Furthermore, haze can also be reduced. A polyetheramide elastomer is an elastomer containing a polyether structure and a polyamide structure. The polyetheramide elastomer in this embodiment is substantially free of ester structures. Substantially free of ester structures means that it is not a so-called polyester etheramide elastomer, and more specifically, the ester structure content is usually less than 1% by mass of the polyetheramide elastomer, preferably less than 0.5% by mass, more preferably less than 0.1% by mass, and even more preferably less than 0.01% by mass. The polyetheramide elastomer used in this embodiment preferably contains a polyalkylene glycol block and a polyamide block.

[0044] Polyalkylene glycol blocks are -(alkylene group -O) ｎ２ It is preferable to represent it as - (alkylene group -O) ｎ２The alkylene group in - is preferably a linear or branched alkylene group having 1 to 10 carbon atoms. The number of carbon atoms constituting the alkylene group is preferably 2 or more, more preferably 3 or more, preferably 8 or less, more preferably 6 or less, even more preferably 5 or less, and even more preferably 5 or less. A specific example of the above -(alkylene group -O)- is -(CH ２ O) -, -(CH ２ CH ２ O) -, -(CH ２ CH ２ CH ２ O)-,-(CH(CH ３ )CH ２ O) -, -(CH ２ CH ２ CH ２ CH ２ O)-,-(C(CH ３ ) ２ CH ２ O) is an example, and combinations of two or more of these are also acceptable. The aforementioned -(alkylene group-O) ｎ２ In -, n2 is preferably 1 to 200, and more preferably 3 to 100. The polyalkylene glycol block preferably includes a polypropylene glycol (PPG) block and / or a polytetramethylene ether glycol (PTMG) block.

[0045] The proportion of polyalkylene glycol in the polyetheramide elastomer is preferably 5 mol% or more, more preferably 10 mol% or more, even more preferably 15 mol% or more, and even more preferably 20 mol% or more, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Depending on the application, it may be 30 mol% or more, 40 mol% or more, 50 mol% or more, 60 mol% or more, or 65 mol% or more. Setting it above the lower limit tends to further improve the impact strength of the resin composition. Furthermore, the proportion of polyalkylene glycol in the polyetheramide elastomer used in this embodiment is preferably 90 mol% or less, more preferably 85 mol% or less, even more preferably 80 mol% or less, and even more preferably 75 mol% or less, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Setting it below the upper limit tends to make it more compatible with the polyamide resin (A). The polyetheramide elastomer may contain only one type of polyalkylene glycol, or it may contain two or more types. If two or more types are included, it is preferable that the total amount falls within the above range.

[0046] The polyamide block is preferably represented as an aliphatic polyamide block, -(NH(CH ２ ) ｎ３ C (=O) ｎ４It is preferable that the aliphatic polyamide block is represented by -. Here, n3 is preferably 3 or more, more preferably 5 or more, even more preferably 7 or more, even more preferably 9 or more, even more preferably 10 or more, and also preferably 20 or less, more preferably 18 or less, even more preferably 16 or less, even more preferably 14 or less, and even more preferably 12 or less. Furthermore, when the number of carbon atoms in the aliphatic dicarboxylic acid having 7 to 20 carbon atoms constituting the polyamide resin (A) is n5 (for example, sebacic acid has n5 = 10), it is preferable that the difference (absolute value) between the values ​​of n5 and n3 is small. More specifically, it is preferable that |n5 - n3| is 3 or less, and more preferably 2 or less. n4 is preferably 1 to 300, and more preferably 5 to 100.

[0047] The proportion of polyamide in the polyetheramide elastomer is preferably 10 mol% or more, more preferably 15 mol% or more, even more preferably 20 mol% or more, and even more preferably 25 mol% or more, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Setting it above the lower limit tends to further improve the effect of improving compatibility with the polyamide resin (A). Furthermore, the proportion of polyamide in the polyetheramide elastomer used in this embodiment is preferably 95 mol% or less, more preferably 90 mol% or less, even more preferably 85 mol% or less, and even more preferably 80 mol% or less, based on 100 mol% of the total constituent units of the polyetheramide elastomer. Depending on the application, it may also be 70 mol% or less, 60 mol% or less, 50 mol% or less, 40 mol% or less, or 35 mol% or less. Setting it below the upper limit tends to more effectively suppress the decrease in the glass transition temperature of the resin composition. The polyetheramide elastomer may contain only one type of polyamide or two or more types. If two or more types are included, it is preferable that the total amount falls within the above range.

[0048] The weight-average molecular weight of the polyetheramide elastomer is preferably 3,000 or more, more preferably 5,000 or more, preferably 100,000 or less, and more preferably 80,000 or less. Setting it above the lower limit tends to improve the toughness of the resin composition. Setting it below the upper limit tends to further improve compatibility with the polyamide resin (A). The weight-average molecular weight is an acrylic equivalent value measured by GPC (gel permeation chromatography).

[0049] The polyetheramide elastomer preferably has a total of 90% by mass or more of the polyalkylene glycol block and the polyamide block, more preferably 95% by mass or more, even more preferably 97% by mass or more, and preferably 100% by mass or less of the polyetheramide elastomer.

[0050] When the resin composition of this embodiment contains a polyetheramide elastomer, the polyetheramide elastomer content is preferably 0.1% by mass or more, more preferably 0.5% by mass or more, even more preferably 1.0% by mass or more, and even more preferably 1.5% by mass or more, based on 100% by mass of the resin composition. From the viewpoint of more effectively suppressing dirt on the rolls and the film surface becoming sharkskin-like, it is even more preferably 2.0% by mass or more, and even more preferably 3.0% by mass or more. Furthermore, the polyetheramide elastomer content in the resin composition of this embodiment is preferably 20.0% by mass or less, more preferably 15.0% by mass or less, even more preferably 10.0% by mass or less, even more preferably 8.0% by mass or less, even more preferably 7.0% by mass or less, and even more preferably 5.0% by mass or less, based on 100% by mass of the resin composition. From the viewpoint of further improving transparency, it is even more preferably 4.5% by mass or less. The resin composition of this embodiment may contain only one type of polyetheramide elastomer, or it may contain two or more types. When it contains two or more types, it is preferable that the total amount is within the above range.

[0051] <Polyalkylene Glycol> The resin composition of this embodiment may also contain polyalkylene glycol having ethylene glycol units and / or propylene glycol units in a total proportion of 50 mol% or more of the total units, and a number average molecular weight of 100 to 3500. By including such polyalkylene glycol, excellent transparency can be achieved, and roll fouling during film manufacturing can be effectively suppressed.

[0052] The polyalkylene glycol contains ethylene glycol units and / or propylene glycol units totaling 50 mol% or more of the total units, preferably 60 mol% or more, more preferably 70 mol% or more, even more preferably 80 mol% or more, even more preferably 90 mol% or more, even more preferably 95 mol% or more, and particularly most preferably 99 mol% or more. Alternatively, all units other than the terminal groups may consist of ethylene glycol units and / or propylene glycol units. By setting the value above the lower limit, polyalkylene glycol tends to bleed out more easily onto the resin surface (e.g., the surface of a molded body such as a film) during molding, and the retention of the resin composition is suppressed by improved slipperiness with the inner wall of the molding machine, thereby further suppressing roll fouling. On the other hand, by setting the total amount of ethylene glycol units and / or propylene glycol units to 50 mol% or more of the total units, the polyamide resin (A) becomes more appropriately compatible, effectively suppressing excessive bleeding out of polyalkylene glycol onto the resin surface during molding, and effectively suppressing roll fouling caused by the polyalkylene glycol itself.

[0053] Polyalkylene glycols may contain other monomer units in addition to ethylene glycol units and propylene glycol units. The other monomer units are preferably alkylene glycol units other than ethylene glycol units and propylene glycol units. Examples of other alkylene glycol units include methylene glycol, butylene glycol, pentylene glycol, hexylene glycol, trimethylene glycol, tetramethylene glycol, pentamethylene glycol, neopentyl glycol, 3-methyltetramethylene glycol, and hexamethylene glycol.

[0054] Polyalkylene glycols may have their ends modified with any substituent. Furthermore, the modification may be applied to only one end of the polyalkylene glycol or to both ends. Examples of optional substituents include carboxyl groups, hydroxyl groups, alkyl ethers, aryl ethers, aralkyl ethers, fatty acid esters, and aryl esters.

[0055] The number-average molecular weight of polyalkylene glycol is 100 to 3500, with a lower limit of preferably 300 or more, more preferably 500 or more, even more preferably 800 or more, and even more preferably 1000 or more. The upper limit is preferably 3000 or less, more preferably 2000 or less, and even more preferably 1500 or less. Setting the number-average molecular weight above the lower limit tends to effectively suppress the volatilization of polyalkylene glycol. Setting the number-average molecular weight below the upper limit tends to more effectively suppress the decrease in transparency. This is presumed to be because polyalkylene glycol does not easily become completely miscible with polyamide resin (A), forming a sea-island structure. When the number-average molecular weight of polyalkylene glycol is large, the island portion expands, increasing the refractive index difference and reducing transparency. The number-average molecular weight is measured according to JIS K1577.

[0056] Specific examples of polyalkylene glycols include polyethylene glycol, polypropylene glycol, or copolymers containing ethylene glycol units and / or propylene glycol units with other alkylene glycol units. Polyethylene glycol or polypropylene glycol is preferred, and polypropylene glycol is more preferred from the viewpoint of ease of manufacture.

[0057] Polyalkylene glycol is not particularly limited and may be manufactured by known methods, or a commercially available product may be used. Examples of commercially available products include D-1000 (manufactured by NOF Corporation) and D-2000 (manufactured by NOF Corporation).

[0058] When the resin composition of this embodiment contains polyalkylene glycol, the polyalkylene glycol content is preferably 0.01% by mass or more, more preferably 0.05% by mass or more, even more preferably 0.1% by mass or more, even more preferably 0.2% by mass or more, and may be 0.4% by mass or more depending on the application, etc. Also, it is preferably 5% by mass or less, more preferably 3% by mass or less, even more preferably 2% by mass or less, even more preferably 1% by mass or less, even more preferably 0.5% by mass or less, and may be 0.3 parts by mass or less depending on the application, etc. Setting it above the lower limit tends to effectively suppress roll fouling during molding. Also, setting it below the upper limit tends to more effectively suppress the decrease in glass transition temperature and toughness of the resin composition. Note that in the resin composition of this embodiment, the total amount of polyamide resin (A) and polyalkylene glycol does not exceed 100% by mass. The resin composition of this embodiment may contain only one type of polyalkylene glycol, or it may contain two or more types. When two or more types are included, it is preferable that the total amount be within the above range. Furthermore, it is preferable that the resin composition of this embodiment substantially does not contain polyalkylene glycols other than the above-mentioned polyalkylene glycol (for example, those with a number average molecular weight of less than 100 or greater than 3500). Specifically, the content of polyalkylene glycols other than the above-mentioned polyalkylene glycol in the resin composition of this embodiment is preferably less than 10 parts by mass, more preferably less than 5 parts by mass, even more preferably less than 3 parts by mass, even more preferably less than 1 part by mass, and even more preferably less than 0.1 parts by mass, per 100 parts by mass of the above-mentioned polyalkylene glycol.

[0059] <Other Components> The resin composition of this embodiment may or may not contain other components in addition to those listed above. Examples of other components include cyclic ether compounds (preferably epoxy compounds), ultraviolet absorbers, antioxidants, heat stabilizers, flame retardants, flame retardant additives, colorants, antistatic agents, fluorescent whitening agents, antifogging agents, flow modifiers, plasticizers, dispersants, antibacterial agents, antiblocking agents, impact modifiers, sliding modifiers, hue modifiers, acid trapping agents, etc. Furthermore, the resin composition of this embodiment may contain elastomers other than polyetheramide elastomers (for example, rubbery polymers having reactive functional groups), or may contain less than 0.01% by mass of the total amount of the resin composition, or may not contain any at all. Furthermore, the resin composition of this embodiment may contain fillers, or may contain less than 1% by mass of the total amount of the resin composition, or less than 0.1% by mass of the total amount of the resin composition, or may not contain any at all. Examples of fillers include organic fillers and inorganic fillers. The resin composition of this embodiment may contain a copper-containing stabilizer, or it may contain less than 0.01% by mass of the total amount of the resin composition, or it may not contain any at all. Furthermore, the resin composition of this embodiment may be formulated with additives described in paragraphs 0047 to 0103 of International Publication No. 2021 / 241471, additives described in paragraphs 0041 to 0056 of Japanese Patent Application Publication No. 2023-61203, and additives described in paragraphs 0017 to 0021 of International Publication No. 2024 / 029515, without departing from the spirit of the present invention, and these contents are incorporated herein.

[0060] If the resin composition of this embodiment contains other components, their total content is preferably 0.001 to 3% by mass of the resin composition, more preferably less than 2% by mass, even more preferably less than 1% by mass, even more preferably less than 0.5% by mass, even more preferably less than 0.1% by mass, and may be less than 0.01% by mass. The other components may consist of only one type or two or more types. If two or more other components are included, it is preferable that the total amount falls within the above range.

[0061] <Physical Properties of the Resin Composition> The resin composition of this embodiment preferably has excellent transparency. Specifically, the total light transmittance of the resin composition of this embodiment when molded into a 300 μm thick film is preferably 80% or more, more preferably 85% or more, and even more preferably 90% or more. The upper limit of the total light transmittance is preferably 100%, but even 99% or less will satisfy the required performance. Furthermore, the haze of the resin composition of this embodiment when molded into a 300 μm thick film is preferably 3.0% or less, more preferably 2.0% or less, even more preferably 1.5% or less, even more preferably 1.0% or less, even more preferably 0.7% or less, even more preferably 0.5% or less, even more preferably 0.4% or less, and even more preferably 0.3% or less, 0.28% or less, and 0.25% or less. The lower limit of the haze is preferably 0%, but even 0.001% or more will satisfy the required performance. The total light transmittance and haze are measured according to the examples described later.

[0062] <Method for Manufacturing the Resin Composition> Any method can be used to manufacture the resin composition of this embodiment. For example, it can be obtained by mixing a polyamide resin (A) and a phosphate compound (B) and melt-kneading them together. More specifically, a method can be used in which the polyamide resin (A), the phosphate compound (B), and other components to be added as needed are mixed using a mixing means such as a V-type blender to prepare a batch blend, and then melt-kneaded in a vented extruder to form pellets.

[0063] <Film> The film of this embodiment is formed from the resin composition of this embodiment. The thickness of the film of this embodiment is preferably 10 μm or more, more preferably 50 μm or more, even more preferably 100 μm or more, preferably 1000 μm or less, more preferably 800 μm or less, even more preferably 700 μm or less, even more preferably 600 μm or less, and even more preferably 500 μm or less.

[0064] The film of this embodiment preferably has excellent transparency. Specifically, the film of this embodiment preferably has a total light transmittance of 80% or more, more preferably 85% or more, and even more preferably 90% or more. The upper limit of the total light transmittance of the film is preferably 100%, but it can also satisfy the required performance at 99% or less. Furthermore, the film of this embodiment preferably has a haze of 3.0% or less, more preferably 2.0% or less, even more preferably 1.5% or less, even more preferably 1.0% or less, even more preferably 0.7% or less, even more preferably 0.5% or less, even more preferably 0.4% or less, and even more preferably 0.3% or less, 0.28% or less, and 0.25% or less. The lower limit of the haze of the film is preferably 0%, but it can also satisfy the required performance at 0.001% or more. The total light transmittance and haze are measured according to the examples described later.

[0065] <Winding Body> The film of this embodiment can be in the form of a winding body wound around a core material.

[0066] <Polarizing Sheet> The film formed from the resin composition of this embodiment, or the film of this embodiment, is preferably used as a protective film for a polarizing sheet (a film that protects the polarizing film). In this embodiment, the polarizing sheet preferably includes the film of this embodiment and a polarizing film, and is a sheet laminated in the order of polarizing film, protective film, and polarizing film. That is, the film of this embodiment is preferably used as at least one of the protective films for a polarizing sheet. The protective film is usually bonded to the polarizing film via an adhesive. In this embodiment, one of the protective films of the polarizing sheet may be the film of this embodiment or another protective film. When one of the protective films of the polarizing sheet is the film of this embodiment, the other protective film of the polarizing sheet may be a known protective film for polarizing sheets, or it may be the film of this embodiment. A known polarizing film can be used, and an example is a polyvinyl alcohol (PVA) film in which iodine or a dichroic organic dye is adsorbed or impregnated. A known adhesive can be used to bond the film of this embodiment or other protective films to the polarizing film, and examples include acrylic adhesives, urethane adhesives, epoxy adhesives, silicone adhesives, polyvinyl alcohol adhesives, etc. Among these, urethane-based adhesives are preferred. The thickness of the adhesive is usually 1 μm or more, and usually 30 μm or less. In addition, the polarizing sheet of this embodiment may have a masking film or the like provided on the outside of the film of this embodiment or other protective films.

[0067] Furthermore, the polarizing sheet of this embodiment is preferably used in a heat-bent molded product. When the film of this embodiment is used in a polarizing sheet or a heat-bent molded product, the film of this embodiment may be provided on either side of the polarizing film, or on both sides. In the first embodiment, the film of this embodiment is positioned on the convex side of the polarizing film after heat bending, for example, on the side of the protective film 4 in Figure 1. In the second embodiment, the film of this embodiment is positioned on the concave side of the polarizing film after heat bending, for example, on the side of the protective film 3 in Figure 1. In the third embodiment, the film of this embodiment is positioned on both sides of the polarizing film, for example, both the protective films 3 and 4 in Figure 1 are the film of this embodiment. Note that in Figure 1, the lens 1, the polarizing film 2, and the protective films 3 and 4 are bent, but it goes without saying that polarizing sheets that are not bent are also included in this embodiment. The film of this embodiment and other protective films used in the polarizing sheet of this embodiment may or may not be stretched. In the first embodiment, stretching is preferable. Furthermore, in the second embodiment, it is preferable that the protective film is not stretched. Furthermore, in the third embodiment, it is preferable that the protective film positioned on the side of protective film 4 in Figure 1 is stretched, and it is preferable that the protective film positioned on the side of protective film 3 in Figure 1 is not stretched.

[0068] In this embodiment, the polarizing sheet is preferably used as a polarizing sheet for liquid crystal display devices, a polarizing lens (sunglasses, ski goggles, prescription eyeglass lenses, camera viewfinder lenses), a cover for various instruments, automobile glass, train glass, polarizing sheets for in-vehicle display panels and electronic device housings, an in-vehicle rearview mirror, a silver mirror for helmets, and is particularly preferably used as sunglasses.

[0069] The present invention will be described in more detail below with reference to examples. The materials, amounts used, proportions, processing content, processing procedures, etc., shown in the following examples can be modified as appropriate, as long as they do not depart from the spirit of the present invention. Therefore, the scope of the present invention is not limited to the specific examples shown below. If the measuring instruments, etc., used in the examples are difficult to obtain due to discontinuation or other reasons, measurements can be taken using other instruments with equivalent performance.

[0070] 1. Raw Materials A1: XE4805, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and dodecanediic acid, amorphous polyamide resin, weight-average molecular weight 10600 A2: XE3805, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and dodecanediic acid, amorphous polyamide resin, weight-average molecular weight 13300 A3: XE4205, manufactured by EMS, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane and sebacic acid, amorphous polyamide resin, weight-average molecular weight 15800 A4: G850, manufactured by Arkema, a polyamide resin synthesized from bis(4-amino-3-methylcyclohexyl)methane, sebacic acid, and aminoundecanoic acid (aminoundecanoic acid is 17 mol% relative to 100 mol% of the raw material monomers), amorphous polyamide resin, weight-average molecular weight 19600.

[0071] B1: JP-518Zn, manufactured by Johoku Chemical Co., Ltd., a mixture of the compounds shown below, with a molar ratio of left:right = 2:1, phosphate compound. B2: AX-71, manufactured by ADEKA, phosphate compound B3: Adekastab (AS) 2112, manufactured by ADEKA, tris(2,4-di-tert-butylphenyl) phosphite compound B4: Adekastab AO-60, manufactured by ADEKA, tetrakis[3-(3',5'-di-tert-butyl-4-hydroxyphenyl)propionic acid] pentaerythritol B5: Adekastab AO-412S, manufactured by ADEKA B6: Irganox 1098, manufactured by BASF. B7: PX-200, manufactured by Daihachi Kagaku Kogyo Co., Ltd., phosphate compound B8: EB-P, manufactured by Kao Corporation, mold release agent

[0072] 2. Examples 1-7, Comparative Examples 1-8 <Production of Resin Pellets> Each component was blended in a tumbler to achieve the composition shown in Tables 1 and 2 below (contents are shown in parts by mass in Tables 1 and 2), and the mixture was fed into a twin-screw extruder (manufactured by Japan Steel Works, TEX30α) from the base. Melt mixing was performed at a cylinder temperature of 280°C to produce the pellets of the examples and comparative examples.

[0073] <Film Manufacturing> The pellets obtained above were extruded in a molten state using a T-die melt extruder consisting of a twin-screw extruder with a vent, a screw diameter of 28 mm, and a screw L / D ratio of 40 (Shibaura Machine Co., Ltd., "TEM-26DS"), at a discharge rate of 15 kg / h and a screw rotation speed of 250 rpm. After being pressed together with the first and second rolls, the film was cooled and solidified to produce a film with a thickness of 300 μm. The cylinder temperature and die temperature were 280°C, and the first and second roll temperatures were 120°C. The details of the first and second rolls used are as follows: • First roll: Shibaura Machine Co., Ltd., UM roll dimensions: outer diameter 180 mm x roll width 400 mm • Second roll: Shibaura Machine Co., Ltd., rigid metal roll (surface: chrome treated) dimensions: outer diameter 180 mm x roll width 400 mm

[0074] <Die Slip Occurrence> After consuming 15 kg of polyamide to manufacture the film, the die slip area was visually inspected and evaluated as follows. This evaluation was performed with the die temperature set to 320°C. The evaluation was conducted by five experts and decided by majority vote. A: No die slip was observed, or some die slip was observed but at a usable level. B: Die slip occurred and was outside of a usable level.

[0075] <Gel Generation> The obtained pellets were heated in a vacuum dryer (Yamato Scientific Co., Ltd., DP23) under nitrogen at 280°C for 1.5 hours. Then, 5 g was dissolved in 50 mL of hexafluoroisopropanol and filtered by suction using a membrane filter with a filter diameter of 10 μm. The mass of the insoluble matter recovered on the filter was measured, and the gelation rate was calculated using the following formula and evaluated as follows: Gelation rate = Mass of insoluble matter / Mass of dissolved matter × 100 A: Gelation rate less than 1% by mass B: Gelation rate 1% or more by mass

[0076] <Roll Contamination> After consuming 350 kg of polyamide to manufacture the film, the surfaces of the first and second rolls were visually inspected and evaluated as follows. The evaluation was conducted by five experts and decided by majority vote. A: No roll contamination was observed, or some roll contamination was observed but at a usable level. B: Roll contamination occurred and was outside the usable level.

[0077] <Measurement of Haze and Total Light Transmittance> Using a haze meter, the haze (%) and total light transmittance (%) of the 300 μm thick film obtained above were measured under the condition of a D65 light source and a 10° field of view. The haze meter used was the "HM-150" manufactured by Murakami Color Technology Laboratory Co., Ltd.

[0078]

[0079]

[0080] As is clear from the results in Tables 1 and 2, the present invention yielded a film in which eye discharge and gel formation were effectively suppressed. In contrast, when the phosphate compound was not included (Comparative Examples 1, 4-7), or when the phosphate compound was included but outside the specified content range (Comparative Examples 2 and 3), or when a phosphate compound other than the phosphate compound (B) specified in the present invention was used (Comparative Example 8), haze was high and the total light transmittance decreased (Comparative Example 3), or eye discharge and gel formation occurred (Comparative Examples 1-8).

[0081] 1. Lens 2. Polarizing film 3. Protective film 4. Protective film

Claims

1. A polyamide resin (A) containing alicyclic diamine units and aliphatic dicarboxylic acid units, and P(=O)(O-R １ ) ３-ｎ (O-R ２ ) ｎ The structure represented by (where R １ represents a hydrogen atom or a metal atom, R ２ A resin composition comprising a phosphate compound (B) having (where represents a substituent other than a metal atom, and n is an integer of 1 or 2), wherein the content of the phosphate compound (B) is 0.001 to 2.5% by mass of the resin composition.

2. The resin composition according to claim 1, wherein the aliphatic dicarboxylic acid unit comprises an aliphatic dicarboxylic acid unit having 7 to 20 carbon atoms.

3. The resin composition according to claim 1 or 2, wherein the aliphatic dicarboxylic acid unit comprises a sebaciate unit and / or a dodecanediate unit.

4. The resin composition according to claim 1 or 2, wherein the alicyclic diamine constituting the alicyclic diamine unit comprises two substituted or unsubstituted cyclohexane rings.

5. The resin composition according to claim 1 or 2, wherein the alicyclic diamine unit includes a unit represented by formula (PA-1). (In formula (PA-1), R １ Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group.

6. The resin composition according to claim 1 or 2, wherein the phosphate compound (B) comprises a phosphate compound (B1) having an aliphatic group.

7. The phosphate compound (B) contains a phosphate compound (B2) in which at least one of R １ is a linear or branched alkyl group having 10 to 30 carbon atoms in the structure represented by P(=O)(O-R ３-ｎ )(O-R ２ ). The resin composition according to claim 1 or 2. ｎ In the structure represented by ２ ​ 8. The resin composition according to claim 1 or 2, wherein the phosphate compound (B) comprises at least one of the compound represented by formula (P1), the compound represented by formula (P2), and the compound represented by formula (P3). (In formulas (P1) to (P3), R ｘ Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, where n represents 1 or 2.

9. The resin composition according to claim 1 or 2, wherein the content of the polyamide resin (A) in the resin composition is 80 to 99.9% by mass (however, the total of the polyamide resin (A) and the phosphate compound (B) does not exceed 100% by mass).

10. The resin composition according to claim 1 or 2, further comprising a mold release agent.

11. The resin composition according to claim 1 or 2, wherein the polyamide resin (A) is an amorphous or microcrystalline resin.

12. The resin composition according to claim 1 or 2, wherein the haze when the resin composition is formed into a film with a thickness of 300 μm is 3.0% or less.

13. The resin composition according to claim 1 or 2, wherein the total light transmittance when the resin composition is formed into a film with a thickness of 300 μm is 80% or more.

14. The resin composition according to claim 1 or 2, for use as a protective film for polarizing sheets.

15. The resin composition according to claim 1, wherein the aliphatic dicarboxylic acid unit comprises a sebaciate unit and / or a dodecanediate unit, the alicyclic diamine unit comprises a unit represented by formula (PA-1), the phosphate compound comprises at least one of the compound represented by formula (P1), the compound represented by formula (P2), and the compound represented by formula (P3), the content of the polyamide resin (A) in the resin composition is 80 to 99.9% by mass (provided that the sum of the polyamide resin (A) and the phosphate compound (B) does not exceed 100% by mass), the polyamide resin (A) is amorphous or microcrystalline, the haze when the resin composition is formed into a 300 μm thick film is 3.0% or less, and the total light transmittance when the resin composition is formed into a 300 μm thick film is 80% or more, and the resin composition is for use as a protective film for a polarizing sheet. (In formula (PA-1), R １ Each of these is an alkyl group having 1 to 5 carbon atoms, and each of these is an integer from 0 to 3. * indicates a bonding site with another unit or terminal group. (In formulas (P1) to (P3), R ｘ Each of these independently represents a linear or branched alkyl group having 10 to 30 carbon atoms, where n represents 1 or 2.

16. The resin composition according to claim 15, further comprising a mold release agent.

17. A film formed from the resin composition according to claim 1, 2, 15, or 16.

18. A polarizing sheet comprising the film according to claim 17 and a polarizing film.

19. Sunglasses comprising the polarizing sheet described in claim 18.

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