Cooling plate
The cooling plate design addresses refrigerant leakage by using a sealing material impregnated into the joint with grooves and tapered shapes to enhance sealing, ensuring effective refrigerant retention and reducing electronic interference.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NIDEC CORP(JP)
- Filing Date
- 2025-12-25
- Publication Date
- 2026-07-02
Smart Images

Figure JP2025045494_02072026_PF_FP_ABST
Abstract
Description
Cooling plate
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[0001] The disclosed embodiment relates to a cooling plate. This application claims priority based on Japanese Patent Application No. 2024-230840 filed in Japan on December 26, 2024, and incorporates its content herein by reference.
[0002] There is a cooling plate including a first base material with a bottomed box shape having an open upper part into which a refrigerant is introduced, and a second base material joined to the first base material and having a flat plate shape for closing the opening in the first base material (see, for example, Patent Document 1).
[0003] Japanese Unexamined Patent Application Publication No. 2017-005181
[0004] However, there is room for improvement in the prior art cooling plate in terms of measures against leakage of the refrigerant to the outside.
[0005] One aspect of the embodiment has been made in view of the above, and an object thereof is to provide a cooling plate capable of improving the performance of preventing leakage of the refrigerant to the outside.
[0006] The cooling plate according to one aspect of the embodiment includes a housing and a refrigerant. A space is formed inside the housing. The refrigerant is disposed in the space. The housing has a first base material, a flat plate-shaped second base material, and a joint portion. The second base material is joined to the first base material. The joint portion joins the first base material and the second base material. The joint portion includes a sealing material impregnated from the outer side surface of the space where the refrigerant is disposed in a direction parallel to the main surface of the second base material into the inside of the side surface.
[0007] The cooling plate according to one aspect of the embodiment can improve the performance of preventing leakage of the refrigerant to the outside.
[0008] Figure 1 is an explanatory diagram showing a side cross-section of a cooling plate according to an embodiment. Figure 2 is an enlarged explanatory diagram of the joint portion of a cooling plate according to a first modified example of the embodiment. Figure 3 is an enlarged explanatory diagram of the joint portion of a cooling plate according to a second modified example of the embodiment. Figure 4 is an enlarged explanatory diagram of the joint portion of a cooling plate according to a third modified example of the embodiment. Figure 5 is an enlarged explanatory diagram of the joint portion of a cooling plate according to a fourth modified example of the embodiment. Figure 6 is an enlarged explanatory diagram of the joint portion of a cooling plate according to a fifth modified example of the embodiment.
[0009] The following describes in detail, with reference to the drawings, embodiments for carrying out the cooling plate and the method for manufacturing the cooling plate according to this disclosure (hereinafter referred to as "embodiments"). However, this disclosure is not limited by these embodiments. Furthermore, each embodiment can be combined as appropriate. In the following embodiments, components that perform the same function are denoted by the same reference numerals, and redundant descriptions are omitted.
[0010] Furthermore, in the embodiments described below, expressions such as "constant," "orthogonal," "perpendicular," or "parallel" may be used, but these expressions do not require strict adherence to "constant," "orthogonal," "perpendicular," or "parallel" conditions. In other words, each of the above expressions allows for deviations such as manufacturing accuracy or installation accuracy.
[0011] Furthermore, in the drawings referenced below, for the sake of clarity, mutually orthogonal X, Y, and Z axis directions are sometimes defined, and a Cartesian coordinate system is shown with the positive Z axis pointing vertically upward.
[0012] Figure 1 is an explanatory diagram showing a side cross-section of the cooling plate 2 according to the embodiment. The cooling plate 2 according to the embodiment is attached to a heat source to be cooled. The heat source is, for example, a heat-generating device such as a CPU (Central Processing Unit). The cooling plate 2 is a device that cools the heat source by absorbing heat from it.
[0013] As shown in Figure 1, the cooling plate 2 comprises a housing 20 and a refrigerant 21. The housing 20 has a space formed inside. The refrigerant 21 is located in the space inside the housing 20. A refrigerant circulation device (not shown) is connected to the housing 20. The refrigerant circulation device comprises a pump and a heat exchanger.
[0014] The refrigerant circulation device circulates the refrigerant 21 between the housing 20 and the device itself. The refrigerant circulation device cools the refrigerant 21, which has absorbed heat from the heat source, using a heat exchanger, and then pumps the cooled refrigerant 21 to the cooling plate 2. By repeating this process, the heat source is cooled.
[0015] The housing 20 includes a first base material 22, a second base material 23, and a joint portion 24. In one example, the first base material 22 and the second base material 23 are made of a metal such as copper. However, the first base material 22 and the second base material 23 may be made of a metal other than copper. Furthermore, the first base material 22 and the second base material 23 may be made of a material other than metal, such as resin.
[0016] In one example, the first base material 22 is a box-shaped member with a bottom and a rectangular top that is open when viewed from above. The second base material 23 is a flat plate-shaped member with a rectangular top when viewed from above. The second base material 23 is joined to the first base material 22. Specifically, the second base material 23 is joined to the first base material 22 to close the top opening in the first base material 22.
[0017] As a result, the cooling plate 2 has a space for the refrigerant 21 to be placed between the bottom surface and inner surface of the first base material 22 and the main surface of the second base material 23 facing the first base material 22. The main surface of the second base material 23 facing the first base material 22 is provided with a plurality of heat-absorbing fins 27 extending from the second base material 23 toward the first base material 22. However, the heat-absorbing fins 27 may also extend from the first base material 22 toward the second base material 23.
[0018] The joint 24 joins the first base material 22 and the second base material 23. Specifically, the joint 24 joins the upper end surface of the side wall portion of the first base material 22 to the lower surface of the second base material 23 which is laminated on the first base material 22. In one example, the joint 24 is made of brazing material. When the first base material 22 and the second base material 23 are diffusion bonded, the joint portion between the first base material 22 and the second base material 23 becomes the joint 24.
[0019] The cooling plate 2 needs to prevent the refrigerant 21, which is placed in the internal space, from leaking out of the cooling plate 2. A common method for preventing the leakage of the refrigerant 21 is to cover the joint 24 between the first base material 22 and the second base material 23 with a sealing material.
[0020] In the method of covering the joint 24 between the first base material 22 and the second base material 23 with a sealing material, there is a risk that the sealing material may spread to the outside of the joint 24 and adhere to surrounding electronic equipment. If the sealing material adheres to surrounding electronic equipment, it may adversely affect the electronic circuits of the electronic equipment.
[0021] Therefore, the joint 24 according to the embodiment includes a sealing material 25 impregnated into the interior of the side surface from the outer side surface of the space in which the refrigerant 21 is arranged in a direction parallel to the main surface of the second base material 23. In one example, the sealing material 25 is a waterproof resin, a water-repellent material, and an impregnating material.
[0022] In this way, the sealing material 25 is impregnated into the interior of the joint 24 and does not easily spread around the joint 24. Therefore, the cooling plate 2 can prevent the refrigerant 21 from leaking to the outside while suppressing the sealing material 25 from adversely affecting surrounding electronic equipment, thereby improving the performance of preventing the refrigerant 21 from leaking to the outside.
[0023] Next, with reference to Figure 2, a cooling plate 3 according to a first modified example of the embodiment will be described. Figure 2 is an enlarged explanatory diagram of the joint portion 24 of the cooling plate 3 according to the first modified example of the embodiment.
[0024] As shown in Figure 2, the second base material 23A of the cooling plate 3 is provided with a groove 31 wider than the joint portion 24 at the location where the first base material 22 is joined. The other configurations of the cooling plate 3 are the same as those of the cooling plate 2 shown in Figure 1. In the step of impregnating the joint portion 24 with the sealant 25, the sealant 25 is applied from the nozzle 26 of the coating device toward the groove 31.
[0025] At this time, there is a small gap in the groove 31 between the joint 24 and the second base material 23A, so the sealant 25 applied from the nozzle 26 is attracted towards the joint 24 by the surface tension of the small gap in the groove 31. As a result, the sealant 25 is less likely to scatter outside the groove 31, so that the sealant 25 can be impregnated into the joint 24 while suppressing adverse effects on surrounding electronic equipment.
[0026] Next, with reference to Figure 3, a cooling plate 4 according to a second modified example of the embodiment will be described. Figure 3 is an enlarged explanatory diagram of the joint portion 24 of the cooling plate 4 according to the second modified example of the embodiment.
[0027] As shown in Figure 3, the shape of the grooves 41 in the second base material 23B of the cooling plate 4 is different from the grooves 31 shown in Figure 2. The other components of the cooling plate 4 are the same as those of the cooling plate 3 shown in Figure 2. The grooves 41 of the cooling plate 4 become narrower from both ends in the width direction of the groove 41 toward the joint 24. In the process of impregnating the joint 24 of the cooling plate 4 with the sealant 25, the sealant 25 is applied from the nozzle 26 of the coating device toward the grooves 41.
[0028] In this case, the gap between the joint 24 and the inner surface of the groove 41 is narrower than the gap between the joint 24 and the inner surface of the groove 31 shown in Figure 2. Therefore, the surface tension acting on the sealant 25 applied to the gap between the joint 24 and the inner surface of the groove 41 is stronger than the surface tension acting on the sealant 25 applied to the gap between the joint 24 and the inner surface of the groove 31 shown in Figure 2. As a result, the sealant 25 is less likely to scatter outside the groove 41, and thus can be impregnated into the joint 24 while further suppressing the sealant 25 from adversely affecting surrounding electronic equipment.
[0029] Next, with reference to Figure 4, a cooling plate 5 according to a third modified example of the embodiment will be described. Figure 4 is an enlarged explanatory diagram of the joint portion 24 of the cooling plate 5 according to the third modified example of the embodiment.
[0030] As shown in Figure 4, the shape of the area around the joint between the first base material 22 and the second base material 23C of the cooling plate 5 differs from that of the second base material 23 shown in Figure 1. The other components of the cooling plate 5 are the same as those of the cooling plate 2 shown in Figure 1.
[0031] The second base material 23C has a groove 51 located outside the space where the refrigerant 21 is placed, and adjacent to the joint 24, where the first base material 22 is joined. In the step of impregnating the joint 24 of the cooling plate 5 with a sealant 25, the sealant 25 is applied from the nozzle 26 of the coating device toward the side of the joint 24 toward the groove 51.
[0032] At this time, even if the sealing material 25 begins to spread around the joint 24, the excess sealing material 25 that has begun to spread is pulled in by the surface tension of the small gap in the groove 51 and impregnates into the interior of the second base material 23C from the groove 51. As a result, the sealing material 25 is less likely to scatter outside the groove 51, and thus can be impregnated into the joint 24 while suppressing the sealing material 25 from adversely affecting surrounding electronic equipment.
[0033] Next, with reference to Figure 5, a cooling plate 6 according to a fourth modified example of the embodiment will be described. Figure 5 is an enlarged explanatory diagram of the joint portion 24 of the cooling plate 6 according to the fourth modified example of the embodiment.
[0034] As shown in Figure 5, the shape of the upper end of the side wall of the first base material 22A of the cooling plate 6 differs from that of the first base material 22 shown in Figure 2. The other components of the cooling plate 6 are the same as those of the cooling plate 3 shown in Figure 2. The first base material 22A has a tapered shape, becoming narrower closer to the joint portion 24 where it is joined with the second base material 23A.
[0035] In the step of impregnating the joint 24 with the sealant 25, the sealant 25 is applied from the nozzle 26 of the coating device toward the groove 31. At this time, there is a small gap in the groove 31 between the joint 24 and the second base material 23A. Moreover, the side wall of the first base material 22A has a tapered shape, becoming thinner towards the upper end, that is, closer to the second base material 23A.
[0036] As a result, the distance from the side surface of the tip on the side wall of the first base material 22A to the inner surface of the groove 31 is shorter than the distance from the side surface of the tip on the side wall of the first base material 22 to the inner surface of the groove 31 shown in Figure 2.
[0037] As a result, the surface tension of the cooling plate 6 that attracts the sealant 25 into the groove 31 is greater than the surface tension that attracts the sealant 25 into the groove 31 shown in Figure 2. Therefore, the sealant 25 applied from the nozzle 26 is less likely to scatter out of the groove 31 than the cooling plate 3 shown in Figure 2, and can be impregnated into the joint 24 while further suppressing adverse effects on surrounding electronic equipment.
[0038] Next, with reference to Figure 6, a cooling plate 7 according to a fifth modified example of the embodiment will be described. Figure 6 is an enlarged explanatory diagram of the joint portion 24 of the cooling plate 7 according to the fifth modified example of the embodiment.
[0039] As shown in Figure 6, the first base material 22A of the cooling plate 7 has the same shape as the first base material 22A shown in Figure 5. Also, the second base material 23 of the cooling plate 7 has the same shape as the second base material 23 shown in Figure 1.
[0040] In other words, the first base material 22A of the cooling plate 7 has a tapered shape, becoming narrower closer to the joint 24 where it is joined with the second base material 23. The second base material 23 of the cooling plate 7 is a flat plate-shaped member.
[0041] In the step of impregnating the joint portion 24 of the cooling plate 7 with the sealing material 25, the sealing material 25 is applied from the nozzle 26 of the coating device toward the side surface facing the outside of the space where the refrigerant 21 is located in the joint portion 24.
[0042] At this time, the distance from the side surface of the tapered portion of the first base material 22A to the second base material 23 in the cooling plate 7 is shorter than the distance from the side surface of the end portion of the first base material 22 shown in FIG. 1 to the second base material 23.
[0043] As a result, the surface tension that the cooling plate 7 attracts the sealing material 25 to the joint portion 24 becomes larger than the surface tension that attracts the sealing material 25 to the joint portion 24 shown in FIG. 1. For this reason, the sealing material 25 applied from the nozzle 26 is less likely to scatter to the outside than the cooling plate 2 shown in FIG. 1, so that it can be impregnated into the joint portion 24 while suppressing adverse effects on surrounding electronic devices.
[0044] Note that the present technology can be configured as follows. (1) A cooling plate including a housing in which a space is formed inside and a refrigerant disposed in the space, the housing having a first base material, a flat second base material joined to the first base material, and a joint portion joining the first base material and the second base material, the joint portion including a sealing material impregnated from the outer side surface of the space where the refrigerant is disposed in a direction parallel to the main surface of the second base material into the side surface. (2) The cooling plate according to (1), wherein the second base material has a groove wider than the joint portion at a location where the first base material is joined. (3) The cooling plate according to (2), wherein the groove becomes narrower as it approaches the joint portion from both ends in the width direction of the groove. (4) The cooling plate according to (1), wherein the second base material has a groove at a position outside the space where the refrigerant is disposed and adjacent to the joint portion, rather than at a location where the first base material is joined. (5) The cooling plate according to any one of (2) to (4), wherein the first base material has a tapered shape that becomes narrower closer to the joint portion joined to the second base material. (6) The cooling plate according to (1), wherein the first base material has a tapered shape that becomes narrower closer to the joint portion joined to the second base material.
[0045] Further effects and modifications can be readily derived by those skilled in the art. Therefore, broader aspects of the present invention are not limited to the specific details and representative embodiments expressed and described above. Accordingly, various modifications are possible without departing from the spirit or scope of the overall concept of the invention as defined by the appended claims and their equivalents.
[0046] 2, 3, 4, 5, 6, 7 Cooling plate 20 Housing 21 Refrigerant 22, 22A First base material 23, 23A, 23B, 23C Second base material 24 Joint 25 Sealing material 26 Nozzle 27 Heat absorption fin 31, 41, 51 Groove
Claims
1. A cooling plate comprising a housing having a space formed inside, and a refrigerant disposed in the space, wherein the housing has a first base material, a flat plate-shaped second base material joined to the first base material, and a joint that joins the first base material and the second base material, and the joint includes a sealing material impregnated into the interior of the side surface from the outer side surface of the space where the refrigerant is disposed in a direction parallel to the main surface of the second base material.
2. The cooling plate according to claim 1, wherein the second base material has a groove wider than the joint portion at the location where the first base material is joined.
3. The cooling plate according to claim 2, wherein the groove narrows in width from both ends toward the joint in the width direction of the groove.
4. The cooling plate according to claim 1, wherein the second base material has a groove located outside the space in which the refrigerant is placed, and adjacent to the joint, at a location where the first base material is joined.
5. The cooling plate according to any one of claims 2 to 4, wherein the first base material has a tapered shape that becomes narrower closer to the joint portion where it is joined with the second base material.
6. The cooling plate according to claim 1, wherein the first base material has a tapered shape, becoming narrower closer to the joint portion where it is joined with the second base material.