Heat dissipation device

Abstract

This heat dissipation device comprises: a heat sink including a base plate having a first storage space therein for storing a refrigerant, and a fin protruding from one surface of the base plate and having a second storage space therein, the second storage space communicating with the first storage space; and a heat transfer member provided on one surface of the base plate and having a plurality of pores through which air can pass.

Description

heat dissipation device

[0001] The present disclosure relates to a heat dissipation device having an improved structure.

[0002] Various electronic devices, such as home appliances, may be equipped with various types of electronic components integrated at high density. As an electronic device operates for a long time, the amount of heat generated by some electronic components can increase significantly, which may lead to performance degradation or permanent damage to the components. To prevent this, the electronic device may be equipped with a heat dissipation device to disperse the heat emitted by the electronic components.

[0003] For example, the heat dissipation device may include a heat sink. The heat sink can form a relatively large heat transfer surface area by having a base plate and a plurality of fin structures. Accordingly, the heat sink can effectively dissipate heat received from an external heat source.

[0004] Recently, with the rapid increase in electronic devices requiring high performance, controlling heat generation from electronic components is becoming increasingly important. Consequently, there is a growing number of attempts to improve the heat dissipation efficiency of heat dissipation devices, such as heat sinks.

[0005] One aspect of the present disclosure provides a heat dissipation device in which a heat transfer member having a plurality of pores and a heat sink are combined.

[0006] One aspect of the present disclosure provides a heat dissipation device having a relatively high heat dissipation efficiency.

[0007] The technical problems to be solved in this document are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by those skilled in the art to which this invention belongs from the description below.

[0008] A heat dissipation device according to the concept of the present disclosure comprises a base plate having a first storage space for storing a refrigerant provided therein, a heat sink including a fin protruding from one side of the base plate and having a second storage space provided therein that communicates with the first storage space, and a heat transfer member provided on the one side of the base plate having a plurality of holes through which air can pass.

[0009] A heat dissipation device according to the concept of the present disclosure comprises a heat sink including a base plate and a fin protruding from one surface of the base plate, and a heat transfer member extending along the direction in which the fin protrudes from one surface of the base plate on the one surface of the base plate, the heat transfer member having a plurality of pores through which air can pass. The heat transfer member comprises a first porous layer including some of the plurality of pores, and a second porous layer including other portions of the plurality of pores and arranged further from the base plate than the first porous layer. The first porous layer may have a smaller ppi than the second porous layer.

[0010] FIG. 1 is a perspective view illustrating a heat dissipation device according to one embodiment.

[0011] FIG. 2 is a diagram illustrating a heat dissipation device according to one embodiment performing heat dissipation.

[0012] FIG. 3 is a cross-sectional view of a heat sink according to one embodiment.

[0013] FIG. 4 illustrates an enlarged view of the internal structure of a heat sink according to one embodiment.

[0014] Figure 5 is a cross-sectional view along the line A-A' shown in Figure 1.

[0015] FIG. 6 is a cross-sectional view of a heat dissipation device according to one embodiment.

[0016] FIG. 7 is a cross-sectional view of a heat dissipation device according to one embodiment.

[0017] The embodiments described in this specification and the configurations illustrated in the drawings are merely preferred examples of the disclosed invention, and various modifications that may replace the embodiments and drawings of this specification may exist at the time of filing this application.

[0018] Additionally, the same reference numerals or symbols presented in each drawing of this specification represent parts or components that perform substantially the same function.

[0019] Furthermore, the terms used in this specification are for describing embodiments and are not intended to limit or / or restrict the disclosed invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In this specification, terms such as "comprising" or "having" are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0020] Additionally, terms including ordinal numbers, such as "first," "second," etc., as used herein may be used to describe various components, but said components are not limited by said terms, and said terms are used solely for the purpose of distinguishing one component from another. For example, without departing from the scope of the present invention, the first component may be named the second component, and similarly, the second component may be named the first component. The term "and / or" includes a combination of a plurality of related described items or any one of a plurality of related described items.

[0021] Meanwhile, the shape and position of each component are not limited by terms such as "front," "back," "left," "right," "top," and "bottom" used in the following description.

[0022] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.

[0023] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.

[0024] Hereinafter, embodiments according to the present invention will be described in detail with reference to the attached drawings.

[0025] FIG. 1 is a perspective view illustrating a heat dissipation device according to one embodiment.

[0026] Referring to FIG. 1, the heat dissipation device (1) may include a heat sink (10). The heat sink (10) may include a base plate (11) and fins (12).

[0027] The base plate (11) may be provided in the shape of a thin plate. Specifically, the base plate (11) may be extended along a first direction (D1) and a second direction (D2) that intersects the first direction (D1), and the length along the first direction (D1) and the length along the second direction (D2) may each be longer than the length along the third direction (D3) that intersects perpendicularly to the first direction (D1) and the second direction (D2), respectively.

[0028] The pin (12) may protrude from one side of the base plate (11). For example, the direction in which the pin (12) protrudes from one side of the base plate (11) may be a third direction (D3). However, the direction in which the pin (12) protrudes from one side of the base plate (11) may be different from the third direction (D3), but for convenience of explanation, the following description assumes that the pin (12) protrudes in the third direction.

[0029] The pin (12) can be formed as a thin plate. Specifically, the pin (12) can be extended along a first direction (D1) and a third direction (D3), and the length along the first direction (D1) and the length along the third direction (D3) can each be longer than the length along the second direction (D2).

[0030] A plurality of pins (12) may be provided. A plurality of pins (12) may be arranged spaced apart from each other. Specifically, a plurality of pins (12) may be arranged spaced apart from each other along a direction that intersects with the direction in which each of the plurality of pins (12) protrudes from one side of the base plate (11). Additionally, a plurality of pins (12) may be arranged spaced apart from each other along a direction that intersects with the direction in which each of the plurality of pins (12) extends. That is, a plurality of pins (12) may be arranged spaced apart from each other in a second direction (D2).

[0031] There is no special limitation on the number of pins (12). Although a total of three pins (12) are shown in the drawing, the pins (12) may be provided in four or more, or in two or fewer.

[0032] The heat dissipation device (1) may include a heat transfer member (20). The heat transfer member (20) may be combined with a heat sink (10).

[0033] The heat transfer member (20) can receive heat from the heat sink (10). The heat transfer member (20) can release the heat received from the heat sink (10). That is, the heat transfer member (20) can be provided to improve the heat transfer efficiency of the heat dissipation device (1).

[0034] A heat transfer member (20) may be provided on one side of a base plate (11). Specifically, the heat transfer member (20) may be provided on one side of a base plate (11) where a fin (12) protrudes. The heat transfer member (20) may be in contact with one side of the base plate (11).

[0035] A heat transfer member (20) may be positioned on one side of the fin (12). The heat transfer member (20) and the fin (12) may be arranged along a direction intersecting the direction in which the fin (12) protrudes from one side of the base plate (11). Additionally, the heat transfer member (20) and the fin (12) may be arranged along a direction intersecting the direction in which the fin (12) extends. That is, the heat transfer member (20) and the fin (12) may be arranged along a second direction (D2).

[0036] The heat transfer member (20) may come into contact with one side of the fin (12). Specifically, the fin (12) may include a first side (121) and a second side (122) opposite to the first side (121), and the heat transfer member (20) may come into contact with either the first side (121) or the second side (122) of the fin (12) (see FIG. 5).

[0037] The heat transfer member (20) may be extended along the direction in which the base plate (11) and the fin (12) extend. That is, the heat transfer member (20) may be extended along the first direction (D1). The length of the heat transfer member (20) along the first direction (D1) may be provided to correspond to the length of the base plate (11) or the fin (12) along the first direction (D1).

[0038] The heat transfer member (20) may extend along the direction in which the fin (12) protrudes from one side of the base plate (11). That is, the heat transfer member (20) may extend along a third direction (D3). The length of the heat transfer member (20) along the third direction (D3) may be provided to correspond to the length of the fin (12) along the third direction (D3).

[0039] A plurality of heat transfer members (20) may be provided. A plurality of heat transfer members (20) may be arranged spaced apart from each other. Specifically, a plurality of heat transfer members (20) may be arranged spaced apart from each other along a direction intersecting the direction in which the fin (12) protrudes from one side of the base plate (11). Additionally, a plurality of heat transfer members (20) may be arranged spaced apart from each other along a direction intersecting the direction in which each of the plurality of heat transfer members (20) extends. That is, a plurality of heat transfer members (20) may be arranged spaced apart from each other in a second direction (D2).

[0040] As described above, the fins (12) may be provided in multiple numbers. Multiple heat transfer members (20) may be arranged between the multiple fins (12). In other words, the multiple heat transfer members (20) and the multiple fins (12) may be arranged alternately on one side of the base plate (11).

[0041] The heat transfer member (20) may include pores (21). The pores (21) may be provided to allow air to pass through. The pores (21) may be provided in multiple numbers. For example, the heat transfer member (20) may be provided in the form of foam.

[0042] The heat transfer member (20) may include a first porous layer (20a) and a second porous layer (20b). Further details regarding this will be described later.

[0043] The heat transfer member (20) may include a metal material. Through this configuration, the thermal conductivity of the heat transfer member (20) can be increased.

[0044] Below, we will look at how the heat dissipation device (1) performs heat dissipation with reference to FIG. 1 and FIG. 2.

[0045] FIG. 2 is a diagram illustrating a heat dissipation device according to one embodiment performing heat dissipation.

[0046] Referring to FIGS. 1 and 2, the heat dissipation device (1) can be mounted on an external heat source (H). Specifically, the base plate (11) can be mounted on an external heat source (H).

[0047] A plurality of fins (12) and a plurality of heat transfer members (20) may be provided on the base plate (11). Each of the plurality of fins (12) may be provided in the shape of a thin plate, and each of the plurality of heat transfer members (20) may include a plurality of pores (21), so the heat dissipation device (1) may have a relatively high heat transfer area. In addition, since the heat transfer members (20) may include a metal material, the heat transfer efficiency of the heat dissipation device (1) may be further improved. Accordingly, the heat dissipation device (1) can effectively disperse and release heat received from an external heat source (H).

[0048] A fan (F) may be provided on one side of the heat dissipation device (1). Specifically, the fan (F) and the heat dissipation device (1) may be arranged along the direction in which the base plate (11) and the fin (12) extend. That is, the fan (F) and the heat dissipation device (1) may be arranged along the first direction (D1).

[0049] The fan (F) can blow air toward the heat dissipation device (1). At this time, the fan (F) and the heat dissipation device (1) may be arranged along a first direction (D1), and the heat transfer member (20) may include a plurality of holes (21) that allow air to pass through, so that the air blown by the fan (F) can flow through the heat dissipation device (1). Accordingly, the heat dissipation efficiency of the heat dissipation device (1) can be improved.

[0050] That is, the heat dissipation device (1) can efficiently dissipate heat received from an external heat source (H) through the structure of the heat sink (10) and the configuration of the heat transfer member (20).

[0051] The heat dissipation device (1) can further improve heat dissipation efficiency through the internal configuration of the heat sink (10) and the porous layers (20a, 20b) of the heat transfer member (20). Below, with reference to FIGS. 3 to 5, the internal configuration of the heat sink (10) and the porous layers (20a, 20b) of the heat transfer member (20) will be examined in more detail.

[0052] FIG. 3 is a cross-sectional view of a heat sink according to one embodiment.

[0053] Referring to FIG. 3, storage spaces (11a, 12a) may be provided inside the heat sink (10). Refrigerant (R) may be stored in the storage spaces (11a, 12a).

[0054] The refrigerant (R) is a medium capable of transferring heat by absorbing or releasing heat. For example, the refrigerant (R) may include water, ammonia and / or Freon, etc. The refrigerant (R) may flow within the storage space (11a, 12a).

[0055] The storage space (11a, 12a) may include a first storage space (11a). The first storage space (11a) may be provided inside the base plate (11).

[0056] The first storage space (11a) may be extended along the direction in which the base plate (11) is extended. That is, the first storage space (11a) may be extended along the first direction (D1) and the second direction (D2) (see FIG. 1).

[0057] The storage space (11a, 12a) may include a second storage space (12a). The second storage space (12a) may be provided inside the pin (12).

[0058] The second storage space (12a) may be extended along the direction in which the pin (12) is extended. That is, the second storage space (12a) may be extended along the first direction (D1) and the third direction (D3) (see FIG. 1).

[0059] The second storage space (12a) can be connected to the first storage space (11a). In other words, the second storage space (12a) can be connected to the first storage space (11a). Through this configuration, the refrigerant (R) in the second storage space (12a) can flow into the first storage space (11a), and the refrigerant (R) in the first storage space (11a) can flow into the second storage space (12a).

[0060] As described above, the pin (12) can be provided in multiple numbers. Accordingly, the second storage space (12a) can also be provided in multiple numbers. The multiple second storage spaces (12a) can be provided inside each of the multiple pins (12).

[0061] FIG. 4 illustrates an enlarged view of the internal structure of a heat sink according to one embodiment.

[0062] Referring to FIGS. 2 to 4, the base plate (11) can receive heat from an external heat source (H). Accordingly, the refrigerant (R) stored in the first storage space (11a) can evaporate. The refrigerant (R) evaporated in the first storage space (11a) can flow to the second storage space (12a) due to natural convection.

[0063] Since the fin (12) is located farther from the external heat source (H) than the base plate (11), the temperature around the fin (12) can be lower than the temperature around the base plate (11). Accordingly, the fin (12) can transfer heat to the area around the fin (12), and the refrigerant (R) stored in the second storage space (12a) can condense. The condensed refrigerant (R) can flow to the first storage space (11a) by its own weight.

[0064] That is, the heat sink (10) can transfer heat through a refrigerant (R) that flows through a first storage space (11a) within the base plate (11) and a second storage space (12a) within the fin (12) while undergoing a phase change. Through this method of heat transfer, the heat sink (10) can transfer heat relatively faster. In addition, since storage spaces (11a, 12a) through which the refrigerant (R) can flow are provided not only inside the base plate (11) but also inside the fin (12), the heat transfer efficiency in the first direction (D1) and the second direction (D2), as well as the heat transfer efficiency in the third direction (D3), can be relatively higher. Furthermore, such a structure may be referred to as a vapor chamber.

[0065] Figure 5 is a cross-sectional view along the line A-A' shown in Figure 1.

[0066] Referring to FIG. 5, the heat transfer member (20) may include a plurality of holes (21) through which air can pass. Air passing through the plurality of holes (21) can exchange heat with the heat transfer member (20), and accordingly, the heat transfer member (20) can release heat.

[0067] The heat transfer member (20) may include a first porous layer (20a) and a second porous layer (20b). The first porous layer (20a) may include some of the plurality of pores (21). The second porous layer (20b) may include other parts of the plurality of pores (21).

[0068] The first porous layer (20a) and the second porous layer (20b) may be arranged along the direction in which the pin (12) protrudes from one side of the base plate (11). That is, the first porous layer (20a) and the second porous layer (20b) may be arranged along the third direction (D3).

[0069] The first porous layer (20a) may be provided closer to the base plate (11) than the second porous layer (20b). In other words, the second porous layer (20b) may be provided further from the base plate (11) than the first porous layer (20a). That is, the first porous layer (20a) and the second porous layer (20b) may be arranged sequentially along the direction in which the pin (12) protrudes from one side of the base plate (11).

[0070] Specifically, the first porous layer (20a) may be in contact with one side of the base plate (11) and may extend along the direction in which the pin (12) protrudes from one side of the base plate (11). The second porous layer (20b) may extend from the first porous layer (20a) along the direction in which the pin (12) protrudes from the base plate (11).

[0071] Based on the direction in which the pin (12) protrudes from one side of the base plate (11), the length (W1) of the first porous layer (20a) may be shorter than the length (W2) of the second porous layer (20b). That is, the length (W1) of the first porous layer (20a) along the third direction (D3) may be shorter than the length (W2) of the second porous layer (20b) along the third direction (D3).

[0072] The first porous layer (20a) and the second porous layer (20b) may have different ppi (pores per inch). Here, ppi refers to the number of pores per unit length. For example, if the ppi of a specific region is relatively high, the total number of pores may be large but the size of each pore may be small, and if the ppi of a specific region is relatively low, the total number of pores may be small but the size of each pore may be large.

[0073] A heat transfer formula can be used to determine the ppi of each of the first porous layer (20a) and the second porous layer (20b). The heat transfer formula is as follows.

[0074] dQ / dT = U * A * (T h - T amb )

[0075] The above dQ / dt is the heat transfer rate per unit time. The above U is the heat transfer coefficient. The above A is the heat transfer area. The above T h is the temperature of the heat source. The above T amb is the ambient temperature.

[0076] The heat transfer area of ​​a specific region can vary depending on the ppi of that region. For example, if the ppi of a specific region is relatively high, the heat transfer area may be relatively large, and if the ppi of a specific region is relatively low, the heat transfer area may be relatively small.

[0077] The heat transfer coefficient of a specific region may vary depending on the average velocity of air passing through multiple pores within that region. For example, if the average velocity of the air is relatively fast, the heat transfer coefficient may be relatively large, and if the average velocity of the air is relatively slow, the heat transfer coefficient may be relatively small.

[0078] In this case, the average velocity of air passing through multiple pores within a specific region can be inferred using the Darcy-Forchheimer equation. The Darcy-Forchheimer equation is as follows.

[0079] ∇p = μ*D*v + (0.5)*ρ*C*v 2

[0080] The above ∇p is the pressure drop within a specific region. The above μ is the viscosity of the air passing through the specific region. The above D is the viscous drag coefficient of the air passing through the specific region. The above v is the average velocity of the air passing through the specific region. The above ρ is the density of the air passing through the specific region. The above C is the inertial drag coefficient of the air passing through the specific region.

[0081] In this case, the viscous resistance coefficient of air passing through a specific region can decrease as the size of the pores within that region increases. In other words, the smaller the ppi of a specific region, the smaller the viscous resistance coefficient of air passing through that region can be.

[0082] Furthermore, the coefficient of inertia of air passing through a specific region can decrease as the size of the pores within that region increases. In other words, the smaller the ppi of a specific region, the smaller the coefficient of inertia of air passing through that region can be.

[0083] According to the above equation, the smaller the viscous and inertial drag coefficients of air passing through a specific region, the smaller the pressure drop within that region. Furthermore, since a pressure drop within a specific region entails a reduction in the velocity of the air passing through it, a smaller pressure drop within that region can lead to an increase in the average velocity of the air passing through it. Therefore, the smaller the viscous and inertial drag coefficients of air passing through a specific region, the faster the average velocity of the air passing through that region can be. In other words, the smaller the ppi of a specific region, the faster the average velocity of the air passing through that region can be.

[0084] As mentioned above, if the average speed of air passing through a specific region is relatively fast, the heat transfer coefficient of that region may be relatively large, and if the average speed of air passing through a specific region is relatively slow, the heat transfer coefficient of that region may be relatively small. Therefore, as the ppi of a specific region decreases, the average speed of air passing through that region may increase, and thus the heat transfer coefficient of that region may increase. Furthermore, as the ppi of a specific region increases, the average speed of air passing through that region may decrease, and thus the heat transfer coefficient of that region may decrease.

[0085] Looking again at the heat transfer formula, the amount of heat transferred per unit time within a specific region can be proportional to the heat transfer surface area and the heat transfer coefficient of that region. In this case, the heat transfer surface area and the heat transfer coefficient, respectively, of a specific region can vary depending on the ppi within that region. For example, as the ppi within a specific region increases, the heat transfer surface area of ​​that region may become larger, and the heat transfer coefficient of that region may become smaller. For example, as the ppi within a specific region decreases, the heat transfer surface area of ​​that region may become smaller, and the heat transfer coefficient of that region may become larger.

[0086] In other words, there is a trade-off between the heat transfer surface area and the heat transfer coefficient according to ppi. Therefore, to determine the ppi within a specific region, it is necessary to further consider the specific configuration or structure of that region.

[0087] Looking again at the heat dissipation device (1) according to the present disclosure, since an external heat source (H, see FIG. 2) can be mounted on the base plate (11), the temperature of the first porous layer (20a), which is arranged relatively closer to the base plate (11), may be higher than the temperature of the second porous layer (20b), which is arranged relatively further away from the base plate (11). Therefore, natural convection caused by the high temperature may occur more frequently and on a larger scale in the first porous layer (20a) than in the second porous layer (20b). At this time, if the first porous layer (20a) has a relatively small ppi, the average speed of the air passing through the first porous layer (20a) may be faster, so the air flow within the first porous layer (20a) may become more active. That is, when the first porous layer (20a) has a relatively small ppi, the heat dissipation effect through the first porous layer (20a) can be further enhanced.

[0088] Accordingly, the first porous layer (20a) may have a relatively small ppi, and the second porous layer (20b) may have a relatively large ppi. In other words, the ppi of the first porous layer (20a) may be smaller than the ppi of the second porous layer (20b), and the ppi of the second porous layer (20b) may be larger than the ppi of the first porous layer (20a).

[0089] In this case, the heat dissipation effect can be further enhanced as the air flow becomes more active within the first porous layer (20a), and the heat dissipation effect can be further enhanced as a large heat transfer surface area is provided within the second porous layer (20b).

[0090] Each of the first porous layer (20a) and the second porous layer (20b) can be provided with a value of 30 ppi to 50 ppi. For example, the first porous layer (20a) can be provided with a value of approximately 30 ppi, and the second porous layer (20b) can be provided with a value of approximately 50 ppi. However, the ppi of each of the first porous layer (20a) and the second porous layer (20b) is not limited thereto.

[0091] FIG. 6 is a cross-sectional view of a heat dissipation device according to one embodiment.

[0092] Hereinafter, with reference to FIG. 6, a heat dissipation device (2) according to one embodiment of the present disclosure will be described. In describing the heat dissipation device (2), the same reference numerals are assigned to components that are substantially identical to those shown in FIG. 1 to FIG. 5, and detailed descriptions may be omitted.

[0093] Referring to FIG. 6, the heat dissipation device (2) may include a heat sink (10) and a heat transfer member (30). The heat transfer member (30) may be combined with the heat sink (10).

[0094] The heat transfer member (30) may include a plurality of holes (31) through which air can pass. Air passing through the plurality of holes (31) can exchange heat with the heat transfer member (30), and accordingly, the heat transfer member (30) can release heat.

[0095] The heat transfer member (30) may include a first porous layer (30a), a second porous layer (30b), and a third porous layer (30c). The first porous layer (30a) may include some of the plurality of pores (31). The second porous layer (30b) may include other parts of the plurality of pores (31). The third porous layer (30c) may include yet another part of the plurality of pores (31).

[0096] The first porous layer (30a), the second porous layer (30b), and the third porous layer (30c) may be arranged along the direction in which the pin (12) protrudes from one side of the base plate (11). That is, the first porous layer (30a), the second porous layer (30b), and the third porous layer (30c) may be arranged along the third direction (D3).

[0097] The first porous layer (30a) may be provided closer to the base plate (11) than the second porous layer (30b) and the third porous layer (30c). The third porous layer (30c) may be provided closer to the base plate (11) than the second porous layer (30b). That is, the first porous layer (30a), the third porous layer (30c), and the second porous layer (30b) may be arranged sequentially along the direction in which the pin (12) protrudes from one side of the base plate (11). In other words, the third porous layer (30c) may be provided between the first porous layer (30a) and the second porous layer (30b).

[0098] Specifically, the first porous layer (30a) may be in contact with one side of the base plate (11) and may extend along the direction in which the pin (12) protrudes from one side of the base plate (11). The third porous layer (30c) may extend from the first porous layer (30a) along the direction in which the pin (12) protrudes from one side of the base plate (11). The second porous layer (30b) may extend from the third porous layer (30c) along the direction in which the pin (12) protrudes from one side of the base plate (11).

[0099] The ppi of the first porous layer (30a) may be smaller than the ppi of the second porous layer (30b), and the ppi of the second porous layer (30b) may be larger than the ppi of the first porous layer (30a). Additionally, the ppi of the third porous layer (30c) may be larger than the ppi of the first porous layer (30a) and smaller than the ppi of the second porous layer (30b).

[0100] In this case, the heat dissipation effect can be improved as the air flow becomes more active within the first porous layer (30a), and the heat dissipation effect can be improved as a large heat transfer surface area is provided within the second porous layer (30b). Additionally, the heat dissipation effect can be improved in the third porous layer (30c) through an intermediate level of air flow and a heat transfer surface area.

[0101] In addition, although a total of three porous layers (30a, 30b, 30c) are shown in the drawings, there is no specific limitation on the number of porous layers. That is, depending on the embodiment, four or more porous layers may be provided.

[0102] FIG. 7 is a cross-sectional view of a heat dissipation device according to one embodiment.

[0103] Hereinafter, with reference to FIG. 7, a heat dissipation device (3) according to one embodiment of the present disclosure will be described. In describing the heat dissipation device (3), the same reference numerals are assigned to components that are substantially identical to those shown in FIG. 1 to FIG. 5, and detailed descriptions may be omitted.

[0104] The heat dissipation device (3) may include a heat sink (10) and a heat transfer member (40). The heat transfer member (40) may be combined with the heat sink (10).

[0105] The heat transfer member (40) may extend along the direction in which the fin (12) protrudes from one side of the base plate (11). That is, the heat transfer member (40) may extend along a third direction (D3).

[0106] The heat transfer member (40) may include a plurality of holes (41) through which air can pass. Air passing through the plurality of holes (41) can exchange heat with the heat transfer member (40), and accordingly, the heat transfer member (40) can release heat.

[0107] The ppi of the heat transfer member (40) may increase as it moves further away from the base plate (11). In other words, the ppi of the heat transfer member (40) may increase along the direction in which the fin (12) protrudes from one side of the base plate (11). Due to this configuration, the portion of the heat transfer member (40) that is positioned closer to the base plate (11) may have a relatively small ppi, and the portion positioned further away from the base plate (11) may have a relatively small ppi.

[0108] In this case, the heat dissipation effect can be further enhanced as the air flow becomes more active in the part provided closer to the base plate (11), and the heat dissipation effect can be further enhanced as a large heat transfer surface area is provided in the part provided further from the base plate (11).

[0109] A heat dissipation device (1) according to one embodiment includes a base plate (11) having a first storage space (11a) for storing a refrigerant (R) provided inside, a heat sink (10) protruding from one side of the base plate (11) and having a second storage space (12a) provided inside that communicates with the first storage space (11a), and a heat transfer member (20, 30, 40) provided on one side of the base plate (11), the heat transfer member (20, 30, 40) having a plurality of holes (21, 31, 41) through which air can pass.

[0110] The refrigerant (R) stored in the first storage space (11a) may be arranged to evaporate by an external heat source (H). The refrigerant (R) evaporated in the first storage space (11a) may be arranged to condense in the second storage space (12a).

[0111] The heat transfer member (20, 30, 40) may be placed on one side of the pin (12).

[0112] The pin (12) may include a first surface (121) and a second surface (122) opposite to the first surface (121). The heat transfer member (20, 30, 40) may come into contact with either the first surface (121) or the second surface (122).

[0113] The heat transfer member (20, 30, 40) may extend along the direction (D3) in which the pin (12) protrudes from one side of the base plate (11).

[0114] The above pins (12) may be provided in multiple numbers. The plurality of pins (12) may be arranged spaced apart from each other along a direction (D2) that intersects with the direction (D3) in which each of the plurality of pins (12) protrudes from one side of the base plate (11).

[0115] The heat transfer members (20, 30, 40) may be provided in multiple numbers. The multiple heat transfer members (20, 30, 40) may be arranged between the multiple fins (12).

[0116] The heat transfer member (20, 30) may include a first porous layer (20a, 30a) comprising some of the plurality of pores (21, 31), and a second porous layer (20b, 30b) comprising other parts of the plurality of pores (21, 31) and having a ppi greater than that of the first porous layer (20a, 30a).

[0117] The first porous layer (20a, 30a) and the second porous layer (20b, 30b) may be arranged along the direction (D3) in which the pin (12) protrudes from one side of the base plate (11).

[0118] The first porous layer (20a, 30a) may be provided closer to the base plate (11) than the second porous layer (20b, 30b).

[0119] Based on the direction (D3) in which the pin (12) protrudes from one side of the base plate (11), the length (W1) of the first porous layer (20a) may be shorter than the length (W2) of the second porous layer (20b).

[0120] Each of the first porous layer (20a, 30a) and the second porous layer (20b, 30b) can be provided with a porosity of 30 ppi to 50 ppi.

[0121] The heat transfer members (20, 30, 40) may include a metal material.

[0122] The heat transfer member (30) may include a third porous layer (30c) that includes another portion of the plurality of porous layers (31) and has a ppi greater than that of the first porous layer (30a) and smaller than that of the second porous layer (30b). The third porous layer (30c) may be provided between the first porous layer (30a) and the second porous layer (30b).

[0123] The heat transfer member (40) may extend along the direction (D3) in which the fin (12) protrudes from one side of the base plate (11). The ppi of the heat transfer member (40) may increase as it moves away from the base plate (11).

[0124] A heat dissipation device (1) according to one embodiment includes a heat sink (10) comprising a base plate (11) and a fin (12) protruding from one side of the base plate (11), and a heat transfer member (20, 30) extending along a direction (D3) in which the fin (12) protrudes from one side of the base plate (11) on the one side of the base plate (11), and the heat transfer member (20, 30) having a plurality of holes (21, 31) through which air can pass. The heat transfer member (20, 30) comprises a first porous layer (20a, 30a) comprising some of the plurality of pores (21, 31), and a second porous layer (20b, 30b) comprising other parts of the plurality of pores (21, 31) and arranged further from the base plate (11) than the first porous layer (20a, 30a). The first porous layer (20a, 30a) may have a smaller ppi than the second porous layer (20b, 30b).

[0125] The first porous layer (20a, 30a) can come into contact with one side of the base plate (11).

[0126] Based on the direction (D3) in which the pin (12) protrudes from one side of the base plate (11), the length (W) of the first porous layer (20a) may be shorter than the length (W) of the second porous layer (20b).

[0127] Each of the above-mentioned fins (12) and the above-mentioned heat transfer members (20, 30) may be provided in multiple numbers. The plurality of fins (12) may be arranged spaced apart from each other. The plurality of heat transfer members (20, 30) may be placed between the plurality of fins (12).

[0128] The heat transfer member (20, 30) may include a metal material.

[0129] According to the concept of the present disclosure, a heat dissipation device may include a heat transfer member having a plurality of pores and a heat sink. A refrigerant may be stored inside the heat sink to accelerate heat transfer, and the heat transfer member may expand the heat transfer surface area through the plurality of pores. Accordingly, the heat dissipation device may have a relatively high heat dissipation efficiency.

[0130] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0131] Specific embodiments have been illustrated and described above. However, the invention is not limited to the embodiments described above, and those skilled in the art may make various modifications without departing from the essence of the technical concept of the invention as described in the following claims.

Claims

1. A heat sink comprising a base plate having a first storage space for storing a refrigerant provided therein and a fin protruding from one side of the base plate and having a second storage space provided therein that communicates with the first storage space; and A heat dissipation device comprising a heat transfer member having a plurality of holes through which air can pass, provided as a heat transfer member provided on one surface of the above base plate.

2. In Paragraph 1, The refrigerant stored in the first storage space is arranged to evaporate by an external heat source, and A heat dissipation device configured to condense the refrigerant evaporated in the first storage space in the second storage space.

3. In Paragraph 1, The above heat transfer member is a heat dissipation device disposed on one side of the fin.

4. In Paragraph 3, The above pin includes a first surface and a second surface opposite to the first surface, and The above heat transfer member is a heat dissipation device in contact with either the first surface or the second surface.

5. In Paragraph 3, The above heat transfer member is a heat dissipation device in which the fin extends along the direction in which it protrudes from one surface of the base plate.

6. In Paragraph 1, The above pin is provided in multiple numbers, and A heat dissipation device in which the plurality of pins are arranged spaced apart from each other along a direction that intersects with the direction in which each of the plurality of pins protrudes from one surface of the base plate.

7. In Paragraph 6, The above heat transfer members are provided in multiple numbers, and The above plurality of heat transfer members are heat dissipation devices disposed between the above plurality of fins.

8. In Paragraph 1, The above heat transfer member is, A first porous layer comprising some of the plurality of pores; and A heat dissipation device comprising a second porous layer that includes other parts of the plurality of pores and has a larger ppi (pores per inch) than the first porous layer.

9. In Paragraph 8, A heat dissipation device in which the first porous layer and the second porous layer are arranged along the direction in which the fin protrudes from one surface of the base plate.

10. In Paragraph 9, A heat dissipation device in which the first porous layer is provided closer to the base plate than the second porous layer.

11. In Paragraph 10, A heat dissipation device in which the length of the first porous layer is shorter than the length of the second porous layer, based on the direction in which the pin protrudes from the one surface of the base plate.

12. In Paragraph 8, A heat dissipation device in which each of the first porous layer and the second porous layer is provided with a porosity of 30 ppi to 50 ppi.

13. In Paragraph 1, The above heat transfer member is a heat dissipation device comprising a metal material.

14. In Paragraph 10, The above heat transfer member is, It includes another portion of the plurality of pores and includes a third porous layer having a ppi greater than the ppi of the first porous layer and smaller than the ppi of the second porous layer, The third porous layer is a heat dissipation device provided between the first porous layer and the second porous layer.

15. In Paragraph 1, The heat transfer member extends along the direction in which the fin protrudes from the one surface of the base plate, and A heat dissipation device in which the ppi of the heat transfer member increases as it moves away from the base plate.

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