Method for iterative o-c and c-c bond formation
By forming compounds of Formula I through specific combinations of (II) and (III), controlled C-O bond formation is achieved, addressing the challenge of iterative module linking and enabling automated purification.
WO2026143010A2PCT designated stage Publication Date: 2026-07-02THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- THE BOARD OF TRUSTEES OF THE UNIV OF ILLINOIS
- Filing Date
- 2025-12-22
- Publication Date
- 2026-07-02
AI Technical Summary
Technical Problem
The challenge lies in developing oxygen iteration handles for iterative module linking in medicines, materials, and functional molecules, as existing methods result in uncontrolled oligomerization and lack compatibility with automated purification procedures.
Method used
The method involves combining specific compounds of formulas (II) and (III) to form compounds of Formula I, utilizing boron with sp3 hybridization and various functional groups, along with palladium catalysts and bases, to facilitate controlled C-O and C-C bond formation.
Benefits of technology
Enables controlled iterative linking of modules through C-O bonds, allowing for generalized purification and automation compatibility.
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Abstract
Disclosed are methods of performing iterative O-C and C-C bond formation, methods of making compounds which enable iterative O-C and C-C bond formation, and compounds which enable iterative O-C and C-C bond formation.
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