Optical module having integrated heat dissipation structure and having high power consumption

Abstract

An optical module having an integrated heat dissipation structure (2) and having high power consumption. The optical module comprises a base for mounting a circuit board, the circuit board being provided with a power consumption element, and further comprises a support (1) mounted on the base, the integrated heat dissipation structure (2) being detachably mounted on the side of the support (1) facing away from the base. By using the integrated heat dissipation structure (2) detachably mounted on the support, the optical module can avoid introducing a welding process on a vertical heat channel of a DSP, thereby avoiding defects caused by welding; in addition, by using the detachable connection mode, the material commonality of structural members is greatly improved while the heat dissipation problem is efficiently solved, and heat dissipation structures of different types may also be used according to requirements.

Description

A high-power optical module with an integrated heat dissipation structure Technical Field

[0001] This utility model relates to the field of optical communication technology, specifically a high-power optical module with an integrated heat dissipation structure. Background Technology

[0002] With the increasing traffic in data centers and the improved throughput of data switches, the heat generated by the power consumption of optical modules will become one of the design bottlenecks for high-speed optical modules. Currently, the DSPs of 1.6T optical modules are all BAREDIE (bare package) designs, and their high power consumption and small area result in high heat flux density, making the selection of heat dissipation solutions very challenging.

[0003] Most commercially available solutions use traditional vapor chambers (VCs) to enhance the heat dissipation of DSPs (processor chips). However, due to the shape requirements of OSPF modules, it is unavoidable to use a soldering process to fix the traditional VC to the structural components. For high heat density heat dissipation requirements, the uncertainty of the thickness of the soldering medium and the low thermal conductivity of the soldering medium will seriously affect the heat dissipation performance of the DSP, even making it inferior to a fully die-cast heat dissipation solution.

[0004] Utility Model Content

[0005] The purpose of this invention is to provide a high-power optical module with an integrated heat dissipation structure, which can at least solve some of the defects in the prior art.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a high-power optical module with an integrated heat dissipation structure, including a base for mounting a circuit board, wherein the circuit board is provided with power consumption components, and a bracket mounted on the base, wherein the integrated heat dissipation structure is detachably mounted on the side of the bracket away from the base.

[0007] Furthermore, the integrated heat dissipation structure includes a base plate and several partitions disposed on the base plate. The partitions are arranged parallel to each other, and two adjacent partitions and the base plate enclose each other to form an air duct.

[0008] Furthermore, the base plate has a mating component on the side facing the base, and the power consumption element is connected to the mating component through a thermally conductive pad.

[0009] Furthermore, the mating component is a protrusion and / or a groove.

[0010] Furthermore, the integrated heat dissipation structure includes a lower cover and an upper cover connected together, with a chamber for filling with heat dissipation agent formed between the lower cover and the upper cover.

[0011] Furthermore, the heat dissipation agent comprises copper foam and water.

[0012] Furthermore, a support column is provided between the lower cover and the upper cover.

[0013] Furthermore, the bracket has a cutout window corresponding to the position of the power consumption component on the circuit board in the base.

[0014] Furthermore, the bracket has blind holes on the side opposite to the base for assembling the integrated heat dissipation structure.

[0015] Furthermore, the integrated heat dissipation structure is either a machined integrated heat dissipation structure or a die-cast integrated heat dissipation structure.

[0016] Compared with the prior art, the beneficial effects of this utility model are: a high-power optical module with an integrated heat dissipation structure, by adopting an integrated heat dissipation structure that can be detachably mounted on a bracket, can avoid the introduction of welding process on the vertical hot channel of the DSP, thereby avoiding defects caused by welding. Moreover, by adopting a detachable connection, the material commonality of structural components is greatly enhanced while efficiently solving the heat dissipation problem. Different heat dissipation forms can also be replaced as needed, raising the upper limit of heat dissipation design. Attached Figure Description

[0017] Figure 1 is a schematic diagram of the bracket of a high-power optical module with an integrated heat dissipation structure separated from the integrated heat dissipation structure according to an embodiment of the present invention.

[0018] Figure 2 is a perspective view of a bracket for a high-power optical module with an integrated heat dissipation structure provided in an embodiment of the present invention.

[0019] Figure 3 is a schematic diagram (front view) of a machined integrated heat dissipation structure of a high-power optical module with an integrated heat dissipation structure provided in an embodiment of the present invention.

[0020] Figure 4 is a schematic diagram (reverse side) of a machined integrated heat dissipation structure for a high-power optical module with an integrated heat dissipation structure provided in an embodiment of this utility model.

[0021] Figure 5 is a schematic diagram of a die-cast integrated heat dissipation structure of a high-power optical module with an integrated heat dissipation structure provided in an embodiment of the present invention.

[0022] Figure 6 is a schematic diagram of the top cover of the integrated heat dissipation structure of a high-power optical module with an integrated heat dissipation structure provided in an embodiment of the present invention.

[0023] Figure 7 is a schematic diagram of the lower cover of the integrated heat dissipation structure of a high-power optical module with an integrated heat dissipation structure provided in an embodiment of the present invention.

[0024] In the attached diagram, the following labels are used: 1-bracket; 10-hollowed-out window; 11-blind hole; 12-support ridge; 2-integrated heat dissipation structure; 20-base plate; 21-partition; 22-air duct; 23-top plate; 24-protrusion; 25-groove; 26-upper cover; 27-lower cover; 28-support column; 3-unlocking component. Detailed Implementation

[0025] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0026] Please refer to Figures 1 to 7. This embodiment of the present invention provides a high-power optical module with an integrated heat dissipation structure, including a base for mounting a circuit board. The circuit board is equipped with power consumption components. The optical module also includes a bracket 1 mounted on the base. An integrated heat dissipation structure 2 is detachably mounted on the side of the bracket 1 opposite to the base. In this embodiment, by using the integrated heat dissipation structure 2 detachably mounted on the bracket 1, the introduction of welding processes into the vertical hot channel of the DSP can be avoided, thereby avoiding defects caused by welding. Moreover, the detachable connection greatly enhances the material commonality of structural components while efficiently solving the heat dissipation problem. Different heat dissipation structures can also be replaced as needed, raising the upper limit of heat dissipation design. Specifically, the circuit board and the power consumption components on the circuit board are all prior art, such as the DSP. In the prior art, most heat dissipation structures are welded to the outer shell of the optical module, which brings many problems. This embodiment uses an integrated heat dissipation structure 2 detachably mounted on the bracket 1, which avoids the problems caused by welding processes. At the same time, different structural forms of the integrated heat dissipation structure 2 can be replaced as needed.

[0027] Please refer to Figures 1, 3, 4, and 5, which illustrate the first heat dissipation method of this utility model. The integrated heat dissipation structure 2 includes a base plate 20 and several partitions 21 disposed on the base plate 20. The partitions 21 are arranged parallel to each other, and two adjacent partitions 21 and the base plate 20 enclose each other to form an air duct 22. In this embodiment, the heat dissipation structure can be divided into the machined integrated heat dissipation structure shown in Figures 3 and 4, and the die-cast integrated heat dissipation structure shown in Figure 5, depending on the different processing technology. The common feature of both is that they have a base plate 20, partitions 21, and air ducts 22 formed by the base plate 20 and partitions 21. The design of several air ducts 22 can quickly dissipate the heat from the power consumption components, improving heat dissipation efficiency. The difference is that the die-cast integrated heat dissipation structure in Figure 5 also has a top plate 23, which can form an air duct 22 without an opening at the top. Furthermore, in terms of manufacturing process, as shown in Figures 3 and 4, the heat dissipation column can be shaped according to the actual position and height of the high-power devices. It can be made by machining copper with a higher thermal conductivity, or by using copper powder metallurgy to form an integrated FIN. Compared with the traditional zinc alloy integrated die casting, the high thermal conductivity of copper will have better heat dissipation capabilities. Compared with the existing conventional VC soldered to the top cover 26, this design avoids the risk of solder voids and abnormal solder thickness causing large thermal resistance that affects heat dissipation capabilities in the vertical heat channel. As shown in Figure 5, the top air duct 22 can be closed through integrated die casting, which also avoids soldering in the vertical heat channel.

[0028] To further optimize the above solution, please refer to Figures 1, 3, 4, and 5. The base plate 20 has a mating component on the side facing the base, and the power consumption element is connected to the mating component via a thermally conductive pad. Preferably, the mating component is a protrusion 24 and / or a groove 25, which connects the thermally conductive pad and the power consumption element. The heat from the power consumption element can be transferred to the mating component via the thermally conductive pad, and then to the base plate 20, where it can be quickly dissipated by the integrated heat dissipation structure 2. Preferably, depending on the structure of the power consumption element, structures such as protrusions 24 and grooves 25 can be used to accommodate the installation of the thermally conductive pad, avoiding interference with the layout of the power consumption element.

[0029] Please refer to Figures 6 and 7, which illustrate the second heat dissipation method of this utility model. The integrated heat dissipation structure 2 includes a lower cover 27 and an upper cover 26 connected together, with a cavity for filling with a heat sink formed between the lower cover 27 and the upper cover 26. Heat sinks can be filled into the cavity between the upper cover 26 and the lower cover 27 for heat dissipation. Preferably, the heat sink can be foamed copper and water, with pure water being preferred. The efficient gas-liquid alternation of pure water in the foamed copper allows for rapid heat conduction, resulting in a higher heat dissipation limit compared to a machined integrated heat dissipation structure made of pure copper. This solution can also be interchangeably installed on the cover base of the optical module to meet the heat dissipation requirements of high-power optical modules with more integrated heat dissipation structures. Preferably, a support column 28 is provided between the lower cover 27 and the upper cover 26. Support columns 28 of different shapes can be used to support the upper cover 26 and the lower cover 27, facilitating the formation of a cavity between them.

[0030] Please refer to Figures 1 and 2 for a detailed description of the bracket 1. The bracket 1 has a cutout window 10 corresponding to the position of the power consumption component on the circuit board in the base. In this embodiment, this cutout window 10 allows the structural design requirements to be met by simply replacing the integrated heat dissipation structure 2 on different high-power modules, enhancing the versatility of the structure. The heat from the power consumption component can be directly transferred from the cutout window 10 to the integrated heat dissipation structure 2 above. The aforementioned mating parts and thermal pads are all located within the cutout window 10.

[0031] Please refer to Figures 1 and 2 for a detailed description of the bracket 1. The bracket 1 has a blind hole 11 on its side opposite to the base for assembling the integrated heat dissipation structure 2. In this embodiment, the large-area blind hole 11 provides installation space for the integrated heat dissipation structure 2, ensuring its thickness and sufficient heat transfer capacity. Preferably, the bracket 1 has threaded holes to facilitate detachable connection of the integrated heat dissipation structure 2 to it via screws. However, the detachable connection method is not limited to screw connections; other methods include snap-fit, magnetic connection, clip connection, adhesive connection, etc. This embodiment does not impose any limitations on this method.

[0032] Please refer to Figures 1 and 2 for a detailed description of the bracket 1. The bracket 1 has a support ridge 12 on the side facing the base. The support ridge 12 serves two purposes: firstly, to support the integrated heat dissipation structure 2 above the bracket 1; secondly, to separate the holes through which the adapter passes.

[0033] Please refer to Figure 1. This optical module also includes an unlocking component 3, which includes a handle and an unlocking sheet metal. The finger at the end of the unlocking sheet metal is pulled out of the cage by pulling left and right, thereby unlocking the optical module from the cage.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A high-power optical module with an integrated heat dissipation structure, comprising a base for mounting a circuit board, wherein the circuit board is provided with power-consuming components, characterized in that: It also includes a bracket mounted on the base, and the side of the bracket opposite to the base is detachably equipped with an integrated heat dissipation structure.

2. A high-power optical module with an integrated heat dissipation structure as described in claim 1, characterized in that: The integrated heat dissipation structure includes a base plate and several partitions disposed on the base plate. The partitions are arranged parallel to each other, and two adjacent partitions and the base plate enclose each other to form an air duct.

3. A high-power optical module with an integrated heat dissipation structure as described in claim 2, characterized in that: The base plate has a mating part on the side facing the base, and the power consumption element is connected to the mating part through a thermal pad.

4. A high-power optical module with an integrated heat dissipation structure as described in claim 3, characterized in that: The mating parts are protrusions and / or grooves.

5. A high-power optical module with an integrated heat dissipation structure as described in claim 1, characterized in that: The integrated heat dissipation structure includes a lower cover and an upper cover connected together, with a chamber for filling with heat dissipation agent formed between the lower cover and the upper cover.

6. A high-power optical module with an integrated heat dissipation structure as described in claim 5, characterized in that: The heat dissipation agent comprises copper foam and water.

7. A high-power optical module with an integrated heat dissipation structure as described in claim 5, characterized in that: A support column is provided between the lower cover and the upper cover.

8. A high-power optical module with an integrated heat dissipation structure as described in claim 1, characterized in that: The bracket has a cutout window corresponding to the position of the power consumption component on the circuit board in the base.

9. A high-power optical module with an integrated heat dissipation structure as described in claim 1, characterized in that: The bracket has blind holes on the side opposite to the base for assembling the integrated heat dissipation structure.

10. A high-power optical module with an integrated heat dissipation structure as described in claim 1, characterized in that: The integrated heat dissipation structure is either a machined integrated heat dissipation structure or a die-cast integrated heat dissipation structure.

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