Middle frame, electronic device, and middle frame semi-finished product

Abstract

The present application relates to the technical field of electronic products, and provides a middle frame, an electronic device, and a middle frame semi-finished product, used for solving the problem of how to enable metal portions of middle frames to take into account both molding efficiency and uniformity of appearance. The middle frame comprises a metal portion; the metal portion comprises an outer frame portion and a support portion provided on the inner side of the outer frame portion, the outer frame portion is located on the outer side of a plastic frame portion, and the support portion is provided in the plastic frame portion; two opposite end faces of the outer frame portion in the thickness direction of the middle frame are respectively a first end face and a second end face, and one end face of the support portion in the thickness direction of the middle frame is a third end face; the third end face and the second end face the same side of the middle frame, and in the thickness direction of the middle frame, the distance from the third end face to the first end face is less than the distance from the second end face to the first end face; and the third end face comprises a first planar region arranged around the inner periphery of the outer frame portion.

Description

Mid-frame, electronic devices and mid-frame semi-finished products

[0001] This application claims priority to Chinese Patent Application No. 202411999498.7, filed with the State Intellectual Property Office of China on December 31, 2024, entitled "Mid-frame, Electronic Device and Mid-frame Semi-finished Product", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic product technology, and in particular to a mid-frame, an electronic device, and a mid-frame semi-finished product. Background Technology

[0003] Electronic devices such as mobile phones, watches, tablets, and personal computers (PCs) have a mid-frame, which is a supporting skeleton inside the electronic device to support electronic components such as batteries, motherboards, cameras, ribbon cables, various sensors, microphones, and earpieces.

[0004] In existing technologies, the mid-frame typically includes a metal section to ensure structural strength. This metal section can be machined using CNC (Computerized Numerical Control) or formed by integral die casting. Compared to CNC machining, integral die casting is simpler and more efficient. However, the pore diameter and porosity of the metal section formed by integral die casting are higher, and some pores are exposed on the surface of the metal section, resulting in poor surface uniformity. Therefore, in existing technologies, it is difficult to simultaneously achieve both forming efficiency and surface uniformity in the metal section of the mid-frame. Summary of the Invention

[0005] This application provides a mid-frame, an electronic device, and a mid-frame semi-finished product, which solves the problem of how to simultaneously ensure molding efficiency and surface consistency in the metal part of the mid-frame.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] In a first aspect, embodiments of this application provide a middle frame, which includes a metal portion, the metal portion including an outer frame portion and a support portion disposed inside the outer frame portion, the outer frame portion being located outside a plastic frame portion, and the support portion being disposed inside the plastic frame portion; wherein, the opposite end faces of the outer frame portion along the thickness direction of the middle frame are respectively a first end face and a second end face, and one end face of the support portion along the thickness direction of the middle frame is a third end face; the third end face and the second end face face the same side of the middle frame, and along the thickness direction of the middle frame, the distance from the third end face to the first end face is less than the distance from the second end face to the first end face; the third end face includes a first planar region disposed around the inner periphery of the outer frame portion.

[0008] According to the mid-frame provided in this application, by making the third end face include a first planar region surrounding the inner periphery of the outer frame portion, since the distance from the third end face to the first end face is less than the distance from the second end face to the first end face, the first planar region can support the auxiliary structure disposed on the inner side of the outer frame portion. With the assistance of the auxiliary structure, it is convenient to squeeze the metal part from the outer side of the outer frame portion to reduce the pore diameter and porosity of the metal part's appearance surface, thereby improving the consistency of the metal part's appearance surface and enabling the metal part to balance molding efficiency and appearance surface consistency.

[0009] In some alternative embodiments, the minimum distance between the edge of the first planar region facing the outer frame and the edge of the first planar region away from the outer frame is greater than or equal to 0.5 mm. This ensures that the first planar region has sufficient width to improve its reliability.

[0010] In some alternative embodiments, the outer frame portion further includes a first inner side surface, which connects between the second end face and the third end face, and is in contact with the first planar region. Thus, the connection between the second and third end faces by the first inner side surface helps to provide continuous support along the thickness direction of the middle frame. When the outer surface of the outer frame portion is subjected to external forces, the first inner side surface can contact the side of the auxiliary structure to effectively disperse stress, further contributing to maintaining the structural stability of the outer frame portion during processing.

[0011] In some alternative embodiments, the outer frame portion further includes a stepped surface located between the second end face and the first inner surface, and the roughness of the stepped surface is less than that of the first inner surface. Thus, during the injection molding process of setting the plastic portion outside the metal frame portion, the stepped surface provides a smoother surface, facilitating a better sealing effect during injection molding and preventing leakage or overflow of plastic material during injection, which could affect the sealing performance and overall quality of the frame. It also facilitates accurate positioning between the injection nozzle and the stepped surface.

[0012] In some alternative embodiments, the outer frame includes a second inner side surface located between the second end face and the stepped surface, and the roughness of the second inner side surface is less than that of the first inner side surface. Thus, during the injection molding process of setting the plastic portion outside the metal frame, the second inner side surface can provide a smoother surface. This smooth surface reduces the presence of micro-gaps, preventing plastic material from leaking or overflowing from the contact surface between the injection nozzle and the second inner side surface under high pressure; simultaneously, it facilitates accurate positioning between the injection nozzle and the second inner side surface.

[0013] In some alternative embodiments, the surface of the outer frame facing away from the support is a first surface, and the surface of the support facing away from the outer frame is a second surface; from the second surface to the first surface, the porosity and pore diameter of the metal portion gradually decrease. Thus, the portion of the metal portion closer to the first surface has a smaller porosity and pore diameter, resulting in a better appearance quality for the metal portion.

[0014] In some alternative embodiments, the outer frame includes a dense metal layer forming a first surface, and the porosity of the dense metal layer is less than or equal to 5%. This results in the first surface of the outer frame having good surface quality, thereby ensuring that the outer surface of the middle frame also has good surface quality.

[0015] In some alternative embodiments, the outer frame includes a dense metal layer forming a first surface, wherein the pore diameter within the dense metal layer is less than or equal to 50 μm. This results in the first surface of the outer frame having good surface quality, thereby ensuring good surface quality of the outer surface of the middle frame.

[0016] In some alternative embodiments, the outer frame includes a dense metal layer forming a first surface, the thickness of which is greater than or equal to 0.3 mm and less than or equal to 0.5 mm. This reduces manufacturing difficulty while ensuring good appearance quality on the outer surface of the frame, thereby improving production efficiency and reducing production costs.

[0017] In some alternative embodiments, the metal portion further includes a metal middle plate located inside the support portion, with a clearance area between the metal middle plate and the support portion. Part of the metal portion can serve as the radiator of the antenna, thus providing the radiator with a good clearance environment for effective signal transmission.

[0018] In some optional embodiments, the middle frame further includes a plastic frame portion located inside the outer frame portion and outside the support portion, the plastic frame portion enclosing an installation space; the metal portion further includes at least one conductive connection portion located on the support portion, the conductive connection portion being exposed in the installation space. This facilitates electrical connection between the metal frame portion and electronic components inside the middle frame via the conductive connection portion, and the conductive connection portion further enhances the electromagnetic shielding effect of the metal frame portion, preventing external electromagnetic interference from affecting the internal circuitry.

[0019] In some optional embodiments, the conductive connection is located on the side of the support that faces away from the outer frame, and the conductive connection is disposed within the mounting space; alternatively, the surface of the support that faces away from the outer frame is a second surface, which is a portion of the inner wall of the mounting space, and the portion of the support forming the second surface constitutes the conductive connection. This arrangement of the conductive connection is reasonable and facilitates optimization of the structural layout of the middle frame.

[0020] In some alternative embodiments, the support portion is provided with a path extension section located between the second end face and the conductive connection portion. This path extension section lengthens the liquid inlet path, slows down the liquid inlet speed, and to some extent restricts moisture from reaching the conductive connection portion exposed in the installation space via the outer frame portion, and from entering the installation space inside the middle frame, thereby improving the waterproofing effect of the middle frame.

[0021] In some alternative embodiments, the path extension portion includes a first groove, within which a portion of the plastic frame portion is located; and / or, the path extension portion includes a first protrusion, located within the plastic frame portion. This ensures a tight fit between the path extension portion of the support portion and the plastic frame portion, which further enhances the waterproofing effect of the mid-frame.

[0022] In some alternative embodiments, the path extension section is located within the first planar region. This effectively lengthens the liquid inlet path in the first planar region, slowing the rate at which moisture from the outside of the frame enters the interior of the frame through the first planar region, thereby improving the waterproofing effect of the frame.

[0023] In some optional embodiments, the surface of the support portion facing away from the outer frame portion is a second surface. The second surface includes a first region located between the second end face and the conductive connection portion, and the path extension portion is disposed within the first region. In this way, the path extension portion can effectively lengthen the liquid inlet path at the second surface, slowing down the rate at which moisture from the outside of the middle frame enters the interior of the middle frame through the second surface, thereby improving the waterproof effect of the middle frame.

[0024] In some optional embodiments, the third end face of the support portion further includes a second planar region. This second planar region is located on the side of the first planar region facing the conductive connection portion, and along the thickness direction of the middle frame, the distance from the second planar region to the first end face is less than the distance from the first planar region to the first end face. A path extension portion is disposed within the second planar region. In this way, the path extension portion can effectively lengthen the liquid inlet path at the second planar region, slowing down the rate at which moisture from outside the middle frame enters the interior of the middle frame through the second planar region, thereby improving the waterproofing effect of the middle frame.

[0025] In some alternative embodiments, at least one end of the path extension portion connects to the clearance area along the length of the outer frame. This allows moisture entering from one end of the middle frame during use to be discharged through the clearance area from the other end, further reducing the time it takes for moisture to enter the interior of the middle frame and thus improving its waterproofing performance.

[0026] In some optional embodiments, the two ends of the path extension portion along the length of the outer frame portion are a first end and a second end, respectively; the conductive connection portion corresponding to the path extension portion is located between the first end and the second end along the length of the outer frame portion. This allows the path extension portion to cover the conductive connection portion along the length of the outer frame portion, effectively slowing down the rate at which moisture reaches the conductive connection portion and is exposed in the installation space throughout the entire area of ​​the conductive connection portion, thereby achieving good waterproof performance.

[0027] In some optional embodiments, the support includes a fourth end face opposite to the third end face, and the fourth end face and the first end face face the same side of the middle frame; along the thickness direction of the middle frame, the distance from the fourth end face to the second end face is less than the distance from the first end face to the second end face; the fourth end face includes a third planar region surrounding the inner periphery of the outer frame. Since the distance from the fourth end face to the second end face is less than the distance from the first end face to the second end face, the second planar region can also support the auxiliary structure. With the assistance of this auxiliary structure, it is further convenient to extrude the metal part from the outside of the outer frame to reduce the pore diameter and porosity of the metal part's surface, thereby improving the consistency of the metal part's surface and enabling the metal part to better balance molding efficiency and surface consistency.

[0028] Secondly, embodiments of this application provide an electronic device, which includes a screen, a back cover, and a mid-frame of any of the above technical solutions. The mid-frame is disposed between the screen and the back cover and is connected to the screen and the back cover.

[0029] Since the electronic device provided in this application includes the mid-frame as described in any of the above technical solutions, both can solve the same technical problem and achieve the same effect.

[0030] Thirdly, embodiments of this application provide a semi-finished mid-frame for processing into the mid-frame described in any of the above technical solutions. The semi-finished mid-frame includes a metal frame substrate, a metal mid-plate substrate, and a portion to be removed located between the metal frame substrate and the metal mid-plate substrate. The portion to be removed is used to obtain a clear area, and the thickness of the portion to be removed is less than the thickness of the metal mid-plate. This makes the portion to be removed easier to remove, thereby improving the processing efficiency of forming the mid-frame using the semi-finished mid-frame.

[0031] In some optional embodiments, the difference between the thickness of the part to be removed and the thickness of the metal middle plate is less than or equal to 0.5 mm. This helps reduce molding defects caused by the thickness difference between the part to be removed and the metal middle plate during the molding process of the middle frame semi-finished product, thereby improving the molding quality of the middle frame semi-finished product.

[0032] In some alternative implementations, the mid-frame semi-finished product is formed using a die-casting process. This die-casting process is more efficient and less costly than CNC machining or other forming methods, thereby improving the production efficiency and reducing the production cost of the mid-frame. Attached Figure Description

[0033] Figure 1 is a three-dimensional structural diagram of a portion of the electronic device provided in some embodiments of this application;

[0034] Figure 2 is a rear view of a portion of the structure of the electronic device shown in Figure 1;

[0035] Figure 3 is a cross-sectional view of section AA shown in Figure 2;

[0036] Figure 4 is an enlarged view of point B in Figure 3;

[0037] Figure 5 is a three-dimensional structural diagram of the middle frame provided in some embodiments of this application;

[0038] Figure 6 is an enlarged view of point C shown in Figure 5;

[0039] Figure 7 is a three-dimensional structural diagram of the middle frame shown in Figure 5 from another perspective;

[0040] Figure 8 is an enlarged view of point D shown in Figure 7;

[0041] Figure 9 is a three-dimensional structural diagram of the middle frame shown in Figure 5 from another perspective.

[0042] Figure 10 is the front view of the middle frame shown in Figure 5;

[0043] Figure 11 is a cross-sectional view of EE shown in Figure 10;

[0044] Figure 12 is an enlarged view of point J shown in Figure 11;

[0045] Figure 13 is a cross-sectional view of FF shown in Figure 10;

[0046] Figure 14 is a cross-sectional view of section GG shown in Figure 10;

[0047] Figure 15 is a three-dimensional structural diagram of the metal part provided in some embodiments of this application;

[0048] Figure 16 is an enlarged view of point H shown in Figure 15;

[0049] Figure 17 is a three-dimensional structural diagram of the metal part shown in Figure 15 from another perspective.

[0050] Figure 18 is an enlarged view of point I shown in Figure 17;

[0051] Figure 19 is a three-dimensional structural diagram of the metal part shown in Figure 15 from another perspective;

[0052] Figure 20 is a three-dimensional structural diagram of a semi-finished middle frame according to some embodiments of this application.

[0053] Reference numerals: 100, middle frame; 10, metal part; 1, metal frame part; 11, outer frame part; 111, first end face; 112, second end face; 113, first inner side face; 114, stepped surface; 115, second inner side face; 116, first surface; 117, third inner side face; 12, support part; 121, third end face; 1211, first planar area; 1212, second planar area; 122, fourth end face; 1221, third planar area; 123, second surface; 1231, first area; 124, path growth part; 13, conductive connection part; 14, buffer groove; 2, plastic frame part; 3, metal middle plate; 4, accommodating space; 5, clear area; 1000, electronic device; 20, back cover; 200, semi-finished middle frame; 201. Part to be removed; 202. Metal frame substrate; 203. Metal middle plate substrate. Detailed Implementation

[0054] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0055] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0056] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0057] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0058] This application provides an electronic device 1000, which can be user equipment (UE) or a terminal device, such as a portable Android device (PAD), a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device, an augmented reality (AR) terminal device, a wireless terminal in industrial control, a wireless terminal in self-driving, a wireless terminal in remote medical care, a wireless terminal in a smart grid, a wireless terminal in transportation safety, a wireless terminal in a smart city, or a wireless terminal in a smart home, etc. Wearable devices can include watches, wristbands, smart glasses, and smart clothing.

[0059] This application uses electronic device 1000 as an example of a handheld device with wireless communication capabilities, such as a mobile phone.

[0060] Please refer to Figures 1-4. Figure 1 is a three-dimensional structural diagram of a portion of the electronic device 1000 provided in some embodiments of this application. Figure 2 is a rear view of a portion of the electronic device 1000 shown in Figure 1. Figure 3 is a cross-sectional view at point AA in Figure 2. Figure 4 is an enlarged view at point B in Figure 3. In this embodiment, the electronic device 1000 is in the shape of a rectangular plate. Based on this, for the convenience of the following description, an XYZ coordinate system is established, defining the length direction of the electronic device 1000 as the Y-axis direction, the width direction of the electronic device 1000 as the X-axis direction, and the thickness direction of the electronic device 1000 as the Z-axis direction. It is understood that the coordinate system setting of the electronic device 1000 can be flexibly set according to actual needs, and is not specifically limited here. In some other embodiments, the shape of the electronic device 1000 may also be a square plate, a circular plate, an elliptical plate, etc.

[0061] Electronic device 1000 includes a screen, a back cover 20, and a mid-frame 100.

[0062] It is understood that Figures 1 and 2 schematically illustrate some of the components included in the electronic device 1000, and the actual shape, size, location and construction of these components are not limited by Figures 1 and 2.

[0063] The screen is used to display images, videos, etc. The screen may include a light-transmitting cover and a display screen. The light-transmitting cover is stacked and fixedly connected to the display screen. The light-transmitting cover primarily serves to protect the display screen and prevent dust. The materials of the light-transmitting cover include, but are not limited to, glass, acrylic, and sapphire. The display screen can be a flexible display screen or a rigid display screen. For example, the display screen can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini light-emitting diode display screen, a micro light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, or a liquid crystal display (LCD).

[0064] The back cover 20 is located on the side of the display screen opposite to the light-transmitting cover plate, and the middle frame 100 is disposed between the screen and the back cover 20 and connected to the screen and the back cover 20. In other embodiments, the back cover 20 and the frame can also be integrally formed.

[0065] In some embodiments, referring to Figures 3-4, a screen accommodating space can be formed between the mid-frame 100 and the light-transmitting cover of the screen, which is used to accommodate at least the display screen. A device accommodating space can be formed between the mid-frame 100 and the back cover 20, which is used to accommodate electronic components such as circuit boards, camera modules, batteries, speaker modules, and vibration units. Both the screen accommodating space and the device accommodating space are internal accommodating spaces of the electronic device 1000. It is understood that the internal accommodating space of the electronic device 1000 may include, in addition to the screen accommodating space and the device accommodating space, a side button circuit portion accommodating space disposed on the mid-frame.

[0066] The following section focuses on the structure of the middle frame 100.

[0067] Please refer to Figures 5-9. Figure 5 is a three-dimensional structural diagram of the middle frame 100 provided in some embodiments of this application. Figure 6 is an enlarged view of point C shown in Figure 5. Figure 7 is a three-dimensional structural diagram of the middle frame 100 shown in Figure 5 from another perspective. Figure 8 is an enlarged view of point D shown in Figure 7. Figure 9 is a three-dimensional structural diagram of the middle frame shown in Figure 5 from yet another perspective.

[0068] The middle frame 100 serves as the structural skeleton of the electronic device. The structural strength and impact resistance of the middle frame 100 determine the overall structural strength and impact resistance of the device. The middle frame 100 also supports and secures electronic components within the electronic device 1000. The structural strength of the middle frame 100 further determines the connection stability of the electronic components within the electronic device 1000. At least a portion of the middle frame 100 can also serve as a radiator for an antenna, a reference ground plane, and a heat dissipation structure for electronic components.

[0069] Based on this, the middle frame 100 may include a metal portion 10. The material of the metal portion 10 includes, but is not limited to, one or more of stainless steel, copper alloy, aluminum, aluminum alloy, magnesium, magnesium-aluminum alloy, magnesium alloy, copper, copper alloy, titanium, titanium alloy, galvanized sheet, and brass. The aluminum alloy can be any series from 1000 to 7000. The metal portion 10 can be obtained using a die-casting process. That is, the metal portion 10 is a die-cast structure. Die-casting can produce parts with complex shapes and precise dimensions, thus ensuring the dimensional accuracy of the metal portion 10 and facilitating the formation of its detailed features. Of course, in other embodiments, the metal portion 10 can also be obtained using rolling, stamping, or other forming processes. Stamping is a simple process with high production efficiency, which helps reduce the cost of the metal portion 10. The metal material has high structural strength and good impact resistance, ensuring the structural strength and impact resistance of the metal portion 10, as well as the connection stability of electronic components within the middle frame 100.

[0070] Meanwhile, the metallic material is electrically conductive, and the metallic part 10 can be used as the radiator and reference ground plane of the antenna. Moreover, the metallic material has excellent thermal conductivity, which can improve the heat dissipation and heat equalization performance of the metallic part 10 for electronic components.

[0071] Please refer to Figures 10-11 and Figures 3-4. Figure 10 is the front view of the middle frame shown in Figure 5, and Figure 11 is the cross-sectional view at EE shown in Figure 10. To facilitate the connection of the screen and back cover to the metal part, and to achieve a good sealing effect at the connection point, the middle frame 100 may also include a plastic frame portion 2. Part of the metal part 10 is located inside the plastic frame portion 2, and the light-transmitting cover of the screen and the back cover 20 can be glued and fixed to the plastic frame portion 2. The material of the plastic frame part 2 may include one or more of the following resin materials: polycarbonate (PC), polyamide (PA), PA, polyphenylene sulfide (PPS), polyphthalamide (PPA), polybutylene terephthalate (PBT), polyphenylene sulfone resins (PPSU), peek materials (PEEK), and ABS plastic (acrylonitrile butadiene styrene plastic). Organic fillers such as wood flour, shredded cloth, paper, and textile fibers may also be added to the plastic frame part 2, as well as inorganic fillers such as glass fiber (GF), diatomaceous earth, asbestos, and carbon black.

[0072] In some other embodiments, the mid-frame 100 may not include the plastic frame portion 2, and the screen's light-transmitting cover and back cover 20 may be directly fixed to the metal portion; alternatively, the mid-frame 100 may include other plastic parts besides the plastic frame portion 2, and this application does not impose specific limitations on this. This embodiment is illustrated by way of example, with the mid-frame 100 including the metal portion 100 and the plastic frame portion 2.

[0073] Please refer to Figures 12-14. Figure 12 is an enlarged view of section J shown in Figure 11, Figure 13 is a cross-sectional view of section FF shown in Figure 10, and Figure 14 is a cross-sectional view of section GG shown in Figure 10. The metal part 10 includes a metal frame part 1, which includes an outer frame part 11 and a support part 12 disposed inside the outer frame part 11. The outer frame part 11 is located outside the plastic frame part 2, and the support part 12 is disposed inside the plastic frame part 2.

[0074] The plastic frame portion 2 is at least provided on the support portion 12 of the aforementioned metal frame portion 1, such that the support portion 12 is located within the plastic frame portion 2. That is, the plastic frame portion 2 may be provided only on the support portion 12 and not on other parts of the metal portion 10, or it may be provided on the support portion 12 and also on other parts of the metal portion 10, such as the outer frame portion 11. This application uses the provision of the plastic frame portion 2 on the support portion 12 as an example for illustration, and this should not be considered a special limitation constituting this application.

[0075] Please refer to Figures 15 and 16. Figure 15 is a three-dimensional structural schematic diagram of the metal part 10 provided in some embodiments of this application, and Figure 16 is an enlarged view of point H shown in Figure 15. The metal part 10 may further include a metal middle plate 3, which is located inside the metal frame part 1 and within the area surrounded by the metal frame part 1, and is fixed to the metal frame part 1.

[0076] Please refer to Figures 17 and 18. Figure 17 is a three-dimensional structural diagram of the metal part 10 shown in Figure 15 from another perspective, and Figure 18 is an enlarged view of section I shown in Figure 17. The metal frame part 1 may also include a conductive connection part 13, which is disposed on the support part 12. The plastic frame part 2 encloses at least a portion of the mounting space 4 inside the middle frame 100, and the conductive connection part 13 is exposed in the mounting space 4, which can be used to mount devices or screens.

[0077] Please refer to Figure 16 and Figure 18. The two opposite end faces of the outer frame portion 11 along the thickness direction of the middle frame 100 are the first end face 111 and the second end face 112, respectively. The end face of the support portion 12 along the thickness direction of the middle frame 100 is the third end face 121. The third end face 121 and the second end face 112 face the same side of the middle frame 100, and along the thickness direction of the middle frame 100, the distance from the third end face 121 to the first end face 111 is less than the distance from the second end face 112 to the first end face 111. The third end face 121 includes a first planar region 1211 disposed around the inner periphery of the outer frame portion 11.

[0078] The surface of the outer frame portion 11 facing away from the support portion 12 is the first surface 116. The first surface 116, the first end face 111, and the second end face 112 of the outer frame portion 11 are the appearance surfaces of the metal frame portion 1. The appearance surface refers to the outer surface of the middle frame 100 that can be observed by the user when it is assembled into the electronic device 1000.

[0079] During the production and processing of the middle frame 100, due to the production process of the metal part 10, the metal part 10 adopts the die casting process. The pore diameter and porosity of the metal part after integral die casting are relatively high, and some pores are exposed on the surface of the metal part, resulting in poor consistency of the surface.

[0080] To ensure that the appearance of the metal frame 1 meets the appearance requirements of the electronic device 1000, during the production and processing of the middle frame 100, the outer side of the metal part 10 can be extruded, for example, by hot deformation forging, to reduce the pore diameter and porosity of the metal part's appearance, thereby improving its surface quality and ensuring good consistency of its appearance.

[0081] When the metal part 10 is extruded, an auxiliary structure can be provided on the inner side of the outer frame part 11. This auxiliary structure provides support to the outer frame part 11 from the inside out, thereby dispersing stress. Optionally, this auxiliary structure may be a support member or a clamp, etc.

[0082] By including a first planar region 1211 surrounding the inner periphery of the outer frame portion 11 in the third end face 121, since the distance from the third end face 121 to the first end face 111 is less than the distance from the second end face 112 to the first end face 111, the first planar region 1211 can support the auxiliary structure disposed on the inner side of the outer frame portion 11. With the assistance of the auxiliary structure, it is convenient to squeeze the metal portion 10 from the outer side of the outer frame portion 11 to reduce the pore diameter and porosity of the appearance surface of the metal portion 10, thereby improving the consistency of the appearance surface of the metal portion 10 and enabling the metal portion 10 to balance molding efficiency and appearance surface consistency.

[0083] When the metal part 10 is squeezed, the outer surface of the metal part 10 will be subjected to external force. At this time, since the distance from the third end face 121 to the first end face 111 along the thickness direction of the middle frame 100 is less than the distance from the second end face 112 to the first end face 111, the thickness of the outer frame 11 is uneven, which may cause the outer frame 11 to bend, deform, etc., which may lead to defects or scrap of the middle frame 100.

[0084] To reduce or avoid the occurrence of the above situations, the auxiliary structure can also provide stable support to the outer frame 11 from the inside, thereby reducing or avoiding bending or deformation of the outer frame 11 when the outer surface of the middle frame 100 is subjected to external forces. This helps to maintain the structural stability of the outer frame 11 during processing, thereby reducing or avoiding defects or scrap of the middle frame 100.

[0085] The first planar region 1211 is arranged around the inner periphery of the outer frame portion 11, which can be understood as the outer frame portion 11 having at least a portion of the first planar region 1211 around its periphery.

[0086] Optionally, the first planar region 1211 may be a planar region that extends continuously around the inner periphery of the frame portion 11; alternatively, the first planar region 1211 may also be a plurality of planar regions that extend discontinuously along the inner periphery of the outer frame portion 11.

[0087] For example, the middle frame 100 is rectangular, and the outer frame portion 11 is provided with a first planar region 1211 around its perimeter to improve the support stability and reliability of the first planar region 1211.

[0088] For example, the middle frame 100 is rectangular, and the four corners of the outer frame 11 are provided with a first planar region 1211 to improve the support stability and reliability of the first planar region 1211.

[0089] Please refer to Figure 19 and Figure 15. Figure 19 is a three-dimensional structural schematic diagram of the metal part shown in Figure 15 from another perspective. The other end face of the support portion 12 along the thickness direction of the middle frame 100 is a fourth end face 122. The fourth end face 122 and the first end face 111 face the same side of the middle frame 100. Along the thickness direction of the middle frame 100, the distance from the fourth end face 122 to the second end face 112 is less than the distance from the first end face 111 to the second end face 112. The fourth end face 122 includes a third planar region 1221 surrounding the inner periphery of the outer frame portion.

[0090] Similarly, when the metal part 10 is being extruded, an auxiliary structure can be provided on the inner side of the outer frame part 11. This auxiliary structure provides support to the outer frame part 11 from the inside out, thereby dispersing stress. Optionally, this auxiliary structure may be a support member or a clamp, etc.

[0091] Since the distance from the fourth end face 122 to the second end face 112 is less than the distance from the first end face 111 to the second end face 112, the second planar region 1212 can also support the auxiliary structure. With the assistance of the auxiliary structure, it is easier to squeeze the metal part 10 from the outside of the outer frame 11 to reduce the pore diameter and porosity of the metal part 10's appearance surface, thereby improving the consistency of the metal part 10's appearance surface and enabling the metal part 10 to better balance molding efficiency and appearance surface consistency.

[0092] The distances between the edge of the first planar region 1211 facing the outer frame portion 11 and the edge of the first planar region 1211 away from the outer frame portion 11 at different locations can be the same or different. That is, the width of the first planar region 1211 can be uniform or non-uniform.

[0093] The distances between the edge of the third planar region 1221 facing the outer frame 11 and the edge of the second planar region 1212 away from the outer frame 11 at different locations can be the same or different. That is, the width of the third planar region 1221 can be uniform or non-uniform.

[0094] Optionally, the structures of the third plane region 1221 and the second plane region 1212 can be the same or different.

[0095] Referring to Figures 15 and 17, in some embodiments, the minimum distance between the edge of the first planar region 1211 facing the outer frame portion 11 and the edge of the first planar region 1211 away from the outer frame portion 11 is greater than or equal to 0.5 mm. This ensures that the first planar region 1211 has sufficient width to improve its reliability. If the minimum distance between the edge of the first planar region 1211 facing the outer frame portion 11 and the edge of the first planar region 1211 away from the outer frame portion 11 is less than 0.5 mm, then at the point of minimum distance, the first planar region 1211 may not be able to stably provide support.

[0096] Please continue to refer to Figure 19. In some embodiments, the minimum distance between the edge of the third planar region 1221 facing the outer frame portion 11 and the edge of the third planar region 1221 away from the outer frame portion 11 is greater than or equal to 0.5 mm.

[0097] Referring to Figures 16 and 18, in some embodiments, the outer frame portion 11 further includes a first inner side surface 113, which connects the second end face 112 and the third end face 121, and is in contact with the first planar region 1211. Thus, the connection between the first inner side surface 113 and the second end face 112 and the third end face 121 helps to provide continuous support along the thickness direction of the middle frame 100. When the outer surface of the outer frame portion 11 is subjected to external forces, the first inner side surface 113 can contact the side of the auxiliary structure to effectively disperse stress, which helps to further maintain the structural stability of the outer frame portion 11 during processing.

[0098] Please continue to refer to Figure 19. In some embodiments, the outer frame portion 11 further includes a third inner side surface 117, which is connected between the first end face 111 and the fourth end face 122, and the third inner side surface 117 is in contact with the second planar region 1212.

[0099] Referring to Figure 5 and Figure 15, in some embodiments, a portion of the metal frame portion 1 serves as the radiator of the antenna, and the conductive connection portion 13 can be the feed point and / or ground point of the antenna.

[0100] For example, the reference ground layer of the electronic device 1000 is electrically connected to the conductive connection portion 13 via a connector such as a spring or a wire. It is understood that the reference ground layer can be formed by other structures within the electronic device 1000, such as a metal layer within the motherboard, or a back cover 20 or a metal middle plate 3 formed of a conductive material such as metal. It should be noted that the grounding point in this application is not an actual existing point; the location where the reference ground layer and the conductive connection portion 13 are electrically connected is the grounding point.

[0101] For example, the radio frequency (RF) front-end of the electronic device 1000 is electrically connected to the conductive connection portion 13. The RF front-end is used to feed RF signals to a portion of the metal frame portion 1, which serves as a radiator, and / or receive RF signals from the outside world received by the radiator. The RF front-end may include a transmitting path and a receiving path. The transmitting path includes devices such as power amplifiers and filters. The signal is amplified and filtered by the power amplifiers and filters before being transmitted to the radiator and then to the outside world. The receiving path includes devices such as low-noise amplifiers and filters. The external signals received by the radiator are amplified and filtered by the low-noise amplifiers and filters before being transmitted to the RF chip, thereby enabling communication between the electronic device 1000 and the outside world through the RF front-end and the antenna. It should be noted that the feed point in this application is not an actual existing point; the location where the RF front-end is electrically connected to the radiator is the feed point mentioned in this application. In some embodiments, the RF front-end is disposed between the metal middle plate 3 of the middle frame 100 and the back cover 20.

[0102] In this embodiment, the metal frame portion 1 includes at least one conductive connection portion 13. That is, there can be one or more conductive connection portions 13. The arrangement position of the multiple conductive connection portions 13 on the support portion 12 is not specifically limited, as long as the multiple conductive connection portions 13 are spaced apart along the extension direction of the support portion 12.

[0103] Specifically, please continue to refer to Figure 6. In some embodiments, the surface of the support portion 12 facing away from the outer frame portion 11 is a second surface 123. The second surface 123 is a part of the inner wall surface of the mounting space 4, and the portion of the support portion 12 that forms the second surface 123 constitutes the conductive connection portion 13.

[0104] Alternatively, please continue to refer to Figure 8. In some embodiments, the conductive connection portion 13 is located on the side of the support portion 12 opposite to the outer frame portion 11, and the conductive connection portion 13 is disposed within the mounting space 4.

[0105] In this way, the position of the conductive connection part 13 is set reasonably, which is conducive to optimizing the structural layout of the middle frame 100.

[0106] Please continue to refer to Figure 16 and combine with Figure 18. The surface of the support portion 12 that is opposite to the outer frame portion 11 is the second surface 123. Along the direction from the second surface 123 to the first surface 116 of the outer frame portion 11 that is opposite to the support portion 12, the area closer to the first surface 116 has a greater impact on the appearance quality of the middle frame 100, and therefore the requirements for its porosity are higher.

[0107] In some embodiments, the porosity and pore diameter of the metal portion 10 on the first surface 116 opposite to the support portion 12 of the outer frame portion 11 gradually decrease from the second surface 123 to the outer frame portion 11. This results in a smaller porosity and pore diameter in the portion of the metal portion closer to the first surface, giving the metal portion a better appearance.

[0108] Along the direction from the second surface 123 to the first surface 116, the metal frame portion 1 sequentially includes a connected metal adjacent layer and a metal dense layer. The metal dense layer is located on the side of the metal adjacent layer facing outwards from the middle frame 100. Specifically, the outer surface of the metal dense layer forms the first surface 116. Both the metal dense layer and the metal adjacent layer contain pores, but the porosity of the metal dense layer is less than that of the metal adjacent layer.

[0109] In some embodiments, the thickness of the dense metal layer along the direction from the second surface 123 to the first surface 116 is greater than or equal to 0.3 mm and less than or equal to 0.5 mm. For example, the thickness of the dense metal layer is 0.3 mm, 0.35 mm, 0.4 mm, 0.48 mm, 0.5 mm, etc. The method for measuring the thickness of the dense metal layer is as follows: a tangential section is cut into the metal portion 10 along the thickness direction of the middle frame 100; the boundary is simulated in the area with holes; the boundary line between the dense metal layer and the adjacent metal layer is drawn; and the distance between the boundary line between the dense metal layer and the adjacent metal layer and the section line of the first surface 116 is the thickness of the dense metal layer.

[0110] If the thickness of the dense metal layer is greater than 0.5 mm, the processing requirements for the middle frame 100 are higher. If the thickness of the dense metal layer is less than 0.3 mm, the quality of the outer surface of the middle frame 100 may not meet the usage requirements. By ensuring that the thickness of the dense metal layer is greater than or equal to 0.3 mm and less than or equal to 0.5 mm, the processing difficulty is reduced while ensuring good appearance quality of the outer surface of the middle frame 100, thereby improving production efficiency and reducing production costs.

[0111] In some embodiments, the porosity of the metal dense layer is less than or equal to 5%, wherein the "porosity of the metal dense layer" is calculated as follows: according to the above measurement method, a metal dense layer region is formed between the boundary line between the drawn metal dense layer and the adjacent metal layer and the cross-sectional line of the first surface 116. Within the region of the metal dense layer, the total area of ​​the region of the metal dense layer is S1, the area of ​​a single hole 103 is S11, and the number of holes is N1. The porosity of the metal dense layer = area of ​​holes within the region of the metal dense layer * number of holes / total area of ​​the region of the metal dense layer = S11 * N1 / S1.

[0112] In some embodiments, the pore diameter within the dense metal layer is less than or equal to 50 μm.

[0113] For example, the processing of the metal portion 100 of the middle frame 100 of this application may include the following steps:

[0114] S1, providing a metal substrate, the metal substrate being a die-cast part.

[0115] During the die-casting process, due to problems with the die-casting process and related molds, holes are formed on the outer surface and near the outer surface of the metal substrate.

[0116] S2, hot deformation forging is performed on the outer surface layer of the metal substrate that is away from the metal middle plate 3 to obtain a dense metal layer.

[0117] Before hot deformation forging of the outer metal layer in the metal substrate, the multiple pores in the outer metal layer are of uneven size and are randomly distributed in the area. Through hot deformation forging, this part is transformed into a dense metal layer. The porosity of the dense metal layer is small, which effectively improves the appearance quality of the metal part 100 of the middle frame 100.

[0118] S3, remove the metal allowance layer to obtain the metal portion 10.

[0119] In this embodiment, CNC (Computerized Numerical Control) machining is used to remove the excess metal layer in the metal heat-deformation layer along its thickness direction. Removing this excess metal layer helps achieve a hole-free appearance on the outer surface of the middle frame 100, thus improving its overall appearance. It is understood that the thickness of the excess metal layer can be adjusted according to actual needs.

[0120] In some embodiments, to further improve the appearance quality of the metal portion 10, an appearance layer may be prepared on the outer surface of the dense metal layer. Exemplarily, the appearance layer can be prepared by spraying or physical vapor deposition (PVD). In this embodiment, between steps S3 and S4, a step of polishing the outer surface of the dense metal layer is included to remove tool marks on the outer surface of the dense metal layer. In some embodiments, the polished metal substrate may also undergo sandblasting anodizing surface treatment to improve the adhesion of the appearance layer to the outer surface of the dense metal layer on the metal substrate, while also improving the corrosion resistance and aesthetics of the metal substrate.

[0121] Please refer to Figure 5 and Figure 15. The metal frame portion 1 may have at least one break along its length. The portion of the metal frame portion 1 between two adjacent break points can be constructed as the radiator of an antenna to realize the transmission and reception of radio frequency signals. The length direction of the metal frame portion 1 is the circumferential extension direction of the metal frame portion 1.

[0122] The plastic frame part 2 can fill the gaps to ensure the consistency of the appearance of the metal frame part 1. At the same time, the plastic frame part 2 has a lower density and lower cost, which can reduce the weight and cost of the middle frame 100.

[0123] Please continue referring to Figure 16 and in conjunction with Figure 18. A buffer groove 14 is also formed on the inner side of the metal frame portion 1. For example, the buffer groove 14 is located at the corner of the metal frame portion 1. The buffer groove 14 is used to absorb energy when the electronic device 1000 is subjected to external impact. Optionally, the buffer groove 14 can be obtained by CNC (Computerized Numerical Control) machining.

[0124] Please refer to Figure 15 and Figure 17. The metal middle plate 3 is located inside the metal frame part 1, and a clearance area 5 is provided between the metal middle plate 3 and the metal frame part 1. This clearance area 5 provides a good clearance environment for the metal part 10, which is the radiator of the antenna, so that it has good signal transmission function.

[0125] In some embodiments, a portion of the metal frame 1 serves as the radiator of the antenna. A clearance area 5 is provided between the portion of the metal frame 1 and the metal middle plate 3. The other portions of the metal frame 1, excluding the portion serving as the radiator, can be connected to the metal middle plate 3 and integrally formed. In some embodiments, the clearance area 5 can be filled with dielectric material to ensure the structural integrity of the middle frame 100.

[0126] In some other embodiments, when the electronic device 1000 is an electronic device 1000 such as a watch or tablet computer, the middle frame 100 may not be provided with a metal middle plate 3, and the metal part 10 may not be provided with a metal middle plate 3. This application uses the electronic device 1000 as a mobile phone, and the middle frame 100 is provided with a metal middle plate 3 and the metal part 10 is provided with a metal middle plate 3 for illustrative purposes. This should not be regarded as a special limitation on this application.

[0127] In some embodiments, the plastic frame portion 2 can be injection molded onto the surface of the support portion 12, so that the plastic frame portion 2 and the support portion 12 are bonded together by means of the plastic frame portion 2 in the molten state.

[0128] For example, nano-molding technology (NMT) can be used to mold the plastic frame portion 2 onto the support portion 12. Specifically, a chemical solution can be used to nano-treat the surface of the support portion 12 (also known as T-treatment), and then an injection molding process can be used to mold the plastic onto the surface of the support portion 12. The nano-treating process can be as follows: first, the support portion 12 is placed in alkaline water for degreasing treatment; second, the degreased support portion 12 is placed in acidic water for neutralization treatment; then, the neutralized support portion 12 is immersed in a nano-treatment liquid (such as T-liquid) to form nanoscale micro-pits on the surface of the support portion 12; finally, the support portion 12 is immersed in water for cleaning. After the metal frame portion 1 is processed using the NMT process, the effective bonding area between the plastic frame portion 2 and the support portion 12 is larger, and the waterproof performance is better. However, the cost of processing the frame 100 using the NMT process is high, and it is not suitable for large-scale overmolding treatment. It is mostly suitable for setting the plastic frame portion 2 in local areas (such as break points) of the metal frame portion 1.

[0129] In the injection molding process, in order to ensure good sealing and precise injection, the nozzle of the injection molding machine must be tightly fitted between the surfaces of the metal frame part 1 to avoid material leakage or overflow.

[0130] In the embodiments of this application, the nozzle of the injection molding machine needs to be in close contact with the surface of the outer frame portion 11 so that at least a portion of the plastic frame portion 2 is disposed on the support portion 12.

[0131] Please refer to Figure 16 and Figure 18. The outer frame portion 11 includes a stepped surface 114 and a second inner surface 115. The stepped surface 114 is located between the second end face 112 and the first inner surface 113, and the second inner surface 115 is located between the second end face 112 and the stepped surface 114.

[0132] In some embodiments, the nozzle of the injection molding machine can be closely fitted with the step surface 114 and the second inner surface 115, which facilitates a good sealing effect during the injection molding process, prevents the plastic material from leaking or overflowing during injection and affecting the sealing performance and overall quality of the middle frame 100, and also facilitates accurate positioning between the injection nozzle and the step surface 114.

[0133] In some embodiments, the roughness of the stepped surface 114 is less than the roughness of the first inner surface 113. Exemplarily, the first inner surface 113 is the cast surface of the metal frame portion 1, and the stepped surface 114 is further processed using CNC (Computerized Numerical Control) based on the cast surface of the metal frame portion 1. The smaller the roughness of the stepped surface 114, the smoother the surface can be during injection molding, facilitating a better sealing effect and further preventing leakage or overflow of plastic material during injection.

[0134] In some alternative embodiments, a portion of the plastic frame portion 2 covers the support portion 12, and a portion of the plastic frame portion 2 covers the first inner side surface 113 and the portion of the stepped surface 114 facing the first inner side surface 113. This prevents leakage or overflow of plastic material at the junction of the stepped surface 114 and the first inner side surface 113 during injection molding.

[0135] In some embodiments, the roughness of the second inner surface 115 is less than the roughness of the first inner surface 113. Exemplarily, the first inner surface 113 is the cast surface of the metal frame portion 1, and the second inner surface 115 is further processed using CNC (Computerized Numerical Control) based on the cast surface of the metal frame portion 1. The smaller the roughness of the second inner surface 115, the smoother the stepped surface 114 can provide during injection molding, facilitating a better sealing effect and further preventing leakage or overflow of plastic material during injection.

[0136] Please refer to Figures 3 and 4. The surface of the plastic frame portion 2 facing away from the support portion 12 is also provided with mounting surfaces such as a screen mounting surface and a back cover 20 mounting surface. The screen mounting surface is used to adhere the screen, and the back cover 20 mounting surface is used to adhere the back cover 20. When the screen is mounted on the screen mounting surface and the back cover 20 is mounted on the back cover 20 mounting surface, there is a gap between the screen and the outer frame portion 11 located outside the plastic frame portion 2, and there is also a gap between the back cover 20 and the outer frame portion 11 located outside the plastic frame portion 2. Moisture from the external environment of the electronic device 1000 can easily enter these gaps.

[0137] Furthermore, since the surface of the support portion 12 inevitably has microscopic unevenness, especially the metal frame portion 1 obtained by die casting, the molten plastic material in the injection molding process has difficulty penetrating into the microscopic recessed areas of the support portion 12, resulting in uneven bonding force between the plastic frame portion 2 and the support portion 12, and a large number of pores at the joint. Moisture from the external environment can easily enter the joint between the plastic frame portion 2 and the support portion 12 through these gaps.

[0138] Furthermore, please continue to refer to Figure 5 and in conjunction with Figure 15. Since the conductive connection part 13 is located on the support part 12 and the conductive connection part 13 is exposed in the installation space 4, moisture from the external environment can easily reach the exposed position of the conductive connection part 13 through the joint between the plastic frame part 2 and the support part 12. Consequently, moisture from the external environment can easily seep into the internal installation space 4 of the electronic device 1000, resulting in low waterproof performance of the electronic device 1000 and difficulty in achieving a high waterproof rating. For example, this makes it difficult for the electronic device 1000 to achieve a waterproof rating of IPX7 or IPX8.

[0139] Based on this, please continue to refer to Figures 15-18. In order to improve the waterproof performance of the middle frame 100 while reducing its weight and cost, the support portion 12 is provided with a path extension portion 124. The path extension portion 124 is located between the outer frame portion 11 and the conductive connection portion 13. The path extension portion 124 can extend the path of water through the joint between the plastic frame portion 2 and the support portion 12 to the conductive connection portion 13.

[0140] The path extension section 124 can lengthen the liquid inlet path and slow down the liquid inlet speed, which to a certain extent restricts the water from reaching the position of the conductive connection section 13 exposed in the installation space 4 through the outer frame section 11 and from entering the installation space 4 inside the middle frame 100, thereby improving the waterproof effect of the middle frame 100.

[0141] Along the length of the outer frame portion 11, the two ends of the path extension portion 124 are a first end and a second end, respectively, and the conductive connection portion 13 corresponding to the path extension portion 124 is located between the first end and the second end. In this way, the path extension portion 124 can cover the conductive connection portion 13 along the length of the outer frame portion 11, so that the path extension portion 124 can effectively slow down the speed at which water reaches the position where the conductive connection portion 13 is exposed in the installation space 4 throughout the entire area of ​​the conductive connection portion 13, thereby achieving good waterproof performance.

[0142] It should be noted that if there are multiple conductive connection parts 13, the path growth parts 124 can also be set to a corresponding number, and each conductive connection part 13 and the second end face 112 is provided with a path growth part.

[0143] Please continue to refer to Figure 16 and in conjunction with Figure 18. In some embodiments, the path growth section 124 is located within the first planar region 1211.

[0144] For example, the portion of the support portion 12 that forms the second surface 123 constitutes the conductive connection portion 13, and the path extension portion 124 is provided within the first planar region 1211. Thus, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the first planar region 1211 from the third end face 121, passes through the path extension portion 124, and then reaches the second surface 123. Next, it reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the second surface 123, thereby entering the internal mounting space 4.

[0145] For example, the conductive connection portion 13 is located on the side of the support portion 12 opposite to the outer frame portion 11, and the path extension portion 124 is provided within the first planar region 1211. Thus, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the first planar region 1211 from the third end face 121, passes through the path extension portion 124, and then reaches the second surface 123. Next, it reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the second surface 123, thereby entering the internal mounting space 4.

[0146] For example, the conductive connection portion 13 is located on the side of the support portion 12 opposite to the outer frame portion 11, and the path extension portion 124 is disposed within the first planar region 1211. The conductive connection portion 13 has a fifth end face facing the third end face 121, and the fifth end face and the portion of the first planar region 1211, excluding the path extension portion 124, are coplanar. Thus, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the first planar region 1211 from the third end face 121, passing through the path extension portion 124. Then, it reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the first planar region 1211, thereby entering the internal mounting space 4.

[0147] In this way, the path extension section 124 can effectively lengthen the liquid inlet path at the first planar region 1211, slowing down the speed at which water from the outside of the middle frame 100 enters the interior of the middle frame 100 through the first planar region 1211, thereby improving the waterproof effect of the middle frame 100.

[0148] Please continue to refer to Figure 18. The surface of the support portion 12 facing away from the outer frame portion 11 is the second surface 123. The second surface 123 includes a first region 1231, and the path growth portion 124 is disposed in the first region 1231.

[0149] Optionally, the second surface 123 may be connected to the third end face 121, and the second surface 123 may also be connected to the first planar region 1211.

[0150] For example, the conductive connection portion 13 is located on the side of the support portion 12 opposite to the outer frame portion 11, the second surface 123 is connected to the first planar region 1211, and the path extension portion 124 is disposed within the first region 1231. Thus, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the first planar region 1211 from the third end face 121, then reaches the second surface 123 from the first planar region 1211, and passes through the path extension portion 124 located within the first region 1231. Next, it reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the second surface 123, thereby entering the internal mounting space 4.

[0151] For example, the conductive connection portion 13 is located on the side of the support portion 12 opposite to the outer frame portion 11, the second surface 123 is connected to the third end face 121, and the path extension portion 124 is disposed within the first region 1231. Thus, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the second surface 123 from the third end face 121, passes through the path extension portion 124 located within the first region 1231, and then reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the second surface 123, thereby entering the internal mounting space 4.

[0152] In this way, the path extension section 124 can effectively lengthen the liquid inlet path at the first planar region 1211, slowing down the speed at which water from the outside of the middle frame 100 enters the interior of the middle frame 100 through the first planar region 1211, thereby improving the waterproof effect of the middle frame 100.

[0153] In some alternative embodiments, the path growth section 124 may also be provided in both the first planar region 1211 and the first region 1231.

[0154] Please refer to Figure 18. The third end face 121 of the support portion 12 also includes a second planar region 1212. The second planar region 1212 is located on the side of the first planar region 1211 facing the conductive connection portion 13, and the second planar region 1212 and the first planar region 1211 are offset along the thickness direction of the middle frame 100. The path extension portion 124 is disposed within the second planar region 1212. The offset between the second planar region 1212 and the first planar region 1211 along the thickness direction of the middle frame 100 is such that the distance from the second planar region 1212 to the first end face 111 is less than the distance from the first planar region 1211.

[0155] Optionally, the conductive connection portion 13 has a fifth end face facing the third end face 121. The fifth end face may be coplanar with the second planar region 1212, or the fifth end face may be offset from the second planar region 1212 along the thickness direction of the middle frame 100.

[0156] For example, the conductive connection portion 13 is located on the side of the support portion 12 opposite to the outer frame portion 11, and the path extension portion 124 is provided within the second planar region 1212. Thus, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the second surface 123 from the third end face 121, then from the second surface 123 to the second planar region 1212, passing through the path extension portion 124. Next, it reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the second planar region 1212, thereby entering the internal mounting space 4. Alternatively, the liquid inflow path for moisture from the external environment into the internal mounting space 4 is as follows: First, the moisture reaches the first planar region 1211 from the third end face 121, then from the first planar region 1211 to the second surface 123, then from the second surface 123 to the second planar region 1212, passing through the path extension portion 124. Next, it reaches the conductive connection portion 13 from the junction of the plastic frame portion 2 and the second planar region 1212, thereby entering the internal mounting space 4.

[0157] In this way, the path extension section 124 can effectively lengthen the liquid inlet path at the second plane region 1212, slow down the speed at which water from the outside of the middle frame 100 enters the interior of the middle frame 100 through the second plane region 1212, thereby improving the waterproof effect of the middle frame 100.

[0158] In some optional embodiments, the path growth unit 124 may be provided in any two of the first planar region 1211, the first region 1231 and the second planar region 1212. Alternatively, the path growth unit 124 may be provided in all three of the first planar region 1211, the first region 1231 and the second planar region 1212.

[0159] Please refer to Figures 11-12 and in conjunction with Figures 16 and 18. Along the length direction of the outer frame portion 11, the path extension portion 124 connects with the clearance area 5. The clearance area 5 is located between the metal middle plate 3 and the metal frame portion 1. Specifically, the clearance area 5 is located between the metal middle plate 3 and the support portion 12. The support portion 12 is located inside the plastic frame portion 2, and at least a portion of the plastic frame portion 2 is located inside the clearance area 5. Thus, the joint between the plastic frame portion 2 and the support portion 12 extends from the third end face 121 to the fourth end face 122 along the thickness direction of the middle frame 100.

[0160] By connecting the path extension 124 to the clearance area 5, moisture entering through the gap between the mounting surface of the back cover 20 and the outer frame 11 can reach the gap between the screen mounting surface and the outer frame 11 via the joint between the support 12 and the plastic frame 2, and then be discharged from there. Similarly, moisture entering through the gap between the screen mounting surface and the outer frame 11 can reach the gap between the mounting surface of the back cover 20 and the outer frame 11 via the joint between the support 12 and the plastic frame 2, and then be discharged from there, thereby further improving the waterproof performance.

[0161] In some embodiments, referring to Figures 11 and 12 and in conjunction with Figures 16 and 18, at least one end of the path extension portion 124 is connected to the clearance area 5 along the length direction of the outer frame portion 11. This connection of at least one end of the path extension portion 124 to the clearance area 5 can include several scenarios: for example, one end of the path extension portion 124 is connected to the clearance area 5 along the length direction of the outer frame portion 11; or, for another example, both ends of the path extension portion 124 are connected to the clearance area 5 along the length direction of the outer frame portion 11.

[0162] In some alternative embodiments, the path growth section 124 includes a through hole, and the path growth section 124 is connected to the clearance area 5.

[0163] In some embodiments, referring to FIG10 and in conjunction with FIGS. 15-18, the path extension portion 124 includes a first groove, and a portion of the plastic frame portion 2 is located within the first groove. This ensures a tight fit between the path extension portion 124 of the support portion 12 and the plastic frame portion 2, which further enhances the waterproof performance of the middle frame 100.

[0164] In some embodiments, the support portion 12 can be CNC machined to obtain the first groove.

[0165] In some embodiments, the path extension portion 124 includes a first protruding ridge located within the plastic frame portion 2. This ensures a tight fit between the path extension portion 124 of the support portion 12 and the plastic frame portion 2, which further enhances the waterproof performance of the middle frame 100.

[0166] In some embodiments, the support portion 12 can be CNC machined to obtain the first protruding ridge.

[0167] For example, the path growth section 124 may include both a first groove and a first protrusion.

[0168] Some embodiments of this application provide a mid-frame semi-finished product 200. Please refer to FIG20, which is a three-dimensional structural schematic diagram of the mid-frame semi-finished product 200 according to some embodiments of this application. The mid-frame semi-finished product 200 is used to process and form a mid-frame, and the mid-frame semi-finished product 200 includes a metal frame substrate 202 and a metal mid-plate substrate 203, and a portion 201 to be removed located between the metal frame substrate 202 and the metal mid-plate substrate 203. The portion 201 to be removed is used to remove to obtain a clear area 5. The thickness of the portion 201 to be removed is less than the thickness of the metal mid-plate 3, and the difference between the thickness of the portion 201 to be removed and the thickness of the metal mid-plate 3 is less than or equal to 0.5 mm. In this way, during the forming process of the mid-frame semi-finished product 200, the portion 201 to be removed is easy to remove, which helps to reduce forming defects caused by the difference in thickness between the portion 201 to be removed and the metal mid-plate 3, thereby improving the forming quality of the mid-frame semi-finished product 200.

[0169] The mid-frame semi-finished product 200 is formed by die casting. Compared with forming methods such as CNC machining, die casting has higher forming efficiency and lower processing cost, which helps to improve the production efficiency of the mid-frame and reduce the production cost of the mid-frame.

[0170] The metal middle plate substrate includes mating structures located on the inner periphery of the part to be removed 201. These mating structures do not require further CNC machining in the subsequent process of the middle frame, and the mating structures on the finally machined middle frame need to cooperate with the components in the mounting space 4 inside the middle frame 100.

[0171] For example, the processing of the middle frame 100 of this application may include the following steps:

[0172] N1 provides a mid-frame semi-finished product 200, which is a die-cast part and includes a metal frame substrate 202, a metal middle plate substrate 203, and a part to be removed 201 located between the metal frame substrate 202 and the metal middle plate substrate 203.

[0173] N2 uses CNC (Computerized Numerical Control) processing to remove the part 201 to be removed between the metal frame substrate 202 and the metal middle plate substrate 203.

[0174] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. A middle frame, characterized in that, include: The metal portion includes an outer frame and a support portion disposed inside the outer frame; wherein, The outer frame portion has two opposite end faces along the thickness direction of the middle frame, namely a first end face and a second end face, and the support portion has one end face along the thickness direction of the middle frame, which is a third end face; the third end face and the second end face face the same side of the middle frame, and along the thickness direction of the middle frame, the distance from the third end face to the first end face is less than the distance from the second end face to the first end face; the third end face includes a first planar region surrounding the inner periphery of the outer frame portion.

2. The middle frame according to claim 1, characterized in that, The minimum distance between the edge of the first planar region facing the outer frame and the edge of the first planar region away from the outer frame is greater than or equal to 0.5 mm.

3. The middle frame according to claim 1 or 2, characterized in that, The outer frame portion also includes a first inner side surface, which is connected between the second end face and the third end face, and the first inner side surface is in contact with the first planar region.

4. The middle frame according to claim 3, characterized in that, The outer frame portion also includes a stepped surface, which is located between the second end face and the first inner side face, and the roughness of the stepped surface is less than the roughness of the first inner side face.

5. The middle frame according to claim 4, characterized in that, The outer frame includes a second inner side surface, which is located between the second end face and the stepped surface, and the roughness of the second inner side surface is less than that of the first inner side surface.

6. The middle frame according to any one of claims 1-5, characterized in that, The surface of the outer frame that faces away from the support portion is the first surface, and the surface of the support portion that faces away from the outer frame portion is the second surface; From the second surface to the first surface, the porosity and pore diameter of the metal portion gradually decrease.

7. The middle frame according to claim 6, characterized in that, The outer frame includes a dense metal layer that forms the first surface, and the porosity of the dense metal layer is less than or equal to 5%.

8. The middle frame according to claim 6 or 7, characterized in that, The outer frame includes a dense metal layer that forms the first surface, and the pore diameter within the dense metal layer is less than or equal to 50 μm.

9. The middle frame according to any one of claims 6-8, characterized in that, The outer frame includes a dense metal layer that forms the first surface. The thickness of the dense metal layer is greater than or equal to 0.3 mm and less than or equal to 0.5 mm.

10. The middle frame according to any one of claims 1-9, characterized in that, The metal part also includes a metal middle plate, which is located inside the support part, and a clearance area is provided between the metal middle plate and the support part.

11. The middle frame according to claim 10, characterized in that, The middle frame also includes a plastic frame portion, which is located inside the outer frame portion and outside the support portion, and the plastic frame portion encloses the installation space; The metal part also includes at least one conductive connection portion disposed on the support portion, the conductive connection portion being exposed in the mounting space.

12. The middle frame according to claim 11, characterized in that, The conductive connection portion is located on the side of the support portion opposite to the outer frame portion, and the conductive connection portion is disposed within the mounting space; or, The surface of the support portion facing away from the outer frame portion is a second surface, which is a portion of the inner wall of the mounting space, and the portion of the support portion forming the second surface constitutes the conductive connection portion.

13. The middle frame according to claim 11 or 12, characterized in that, The support portion is provided with a path growth portion, which is located between the second end face and the conductive connection portion.

14. The middle frame according to claim 13, characterized in that, The path growth section includes a first groove, and a portion of the plastic frame section is located within the first groove; And / or, the path growth portion includes a first protruding ridge located within the plastic frame portion.

15. The middle frame according to claim 13 or 14, characterized in that, The path growth section is located within the first planar region.

16. The middle frame according to any one of claims 13-15, characterized in that, The surface of the support portion facing away from the outer frame portion is a second surface. The second surface includes a first region, which is located between the second end face and the conductive connection portion. The path growth portion is disposed within the first region.

17. The middle frame according to any one of claims 13-16, characterized in that, The third end face of the support portion further includes a second planar region. The second planar region is located on the side of the first planar region facing the conductive connection portion and along the thickness direction of the middle frame. The distance from the second planar region to the first end face is less than the distance from the first planar region to the first end face. The path growth portion is disposed within the second planar region.

18. The middle frame according to any one of claims 13-17, characterized in that, Along the length of the outer frame portion, at least one end of the path extension portion is connected to the clearance area.

19. The middle frame according to any one of claims 12-18, characterized in that, Along the length of the outer frame portion, the two ends of the path growth portion are a first end and a second end, respectively; Along the length direction of the outer frame portion, the conductive connection portion corresponding to the path growth portion is located between the first end and the second end.

20. The middle frame according to any one of claims 1-19, characterized in that, The support portion includes a fourth end face that is opposite to the third end face, and the fourth end face and the first end face face the same side of the middle frame; Along the thickness direction of the middle frame, the distance from the fourth end face to the second end face is less than the distance from the first end face to the second end face; The fourth end face includes a third planar region surrounding the inner periphery of the outer frame.

21. An electronic device, characterized in that, include: Screen; Back cover; The mid-frame according to any one of claims 1-20, wherein the mid-frame is disposed between the screen and the back cover, and is connected to the screen and the back cover.

22. A semi-finished middle frame, used to process and form the middle frame according to any one of claims 10-20, characterized in that, It includes a metal frame substrate, a metal middle plate substrate, and a portion to be removed located between the metal frame substrate and the metal middle plate substrate. The portion to be removed is used to remove the material to obtain the clear area. The thickness of the portion to be removed is less than the thickness of the metal middle plate.

23. The semi-finished middle frame according to claim 22, characterized in that, The difference between the thickness of the part to be removed and the thickness of the metal plate is less than or equal to 0.5 mm.

24. The semi-finished middle frame according to claim 22 or 23, characterized in that, The mid-frame semi-finished product is formed by die casting.

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