Electronic device

Abstract

The present application relates to the technical field of device heat dissipation, and specifically relates to an electronic device. The electronic device comprises: a cavity; a heat dissipation air duct arranged in the cavity and allowing an airflow to pass therethrough so as to carry away heat from the cavity; a first heat source arranged in the cavity; a third heat source arranged in the cavity, the temperature specification of the third heat source being lower than the temperature specification of the first heat source; a first heat dissipation assembly located in the heat dissipation air duct and in thermal contact with the first heat source; and a third heat dissipation assembly located in the heat dissipation air duct and in thermal contact with the third heat source, wherein the third heat dissipation assembly is isolated from the first heat dissipation assembly, and the third heat dissipation assembly is located upstream of the airflow direction of the airflow relative to the first heat dissipation assembly.

Description

electronic devices

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411964331.7, filed with the Chinese Patent Office on December 30, 2024, entitled "An Electronic Device", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This application relates to the field of device heat dissipation technology, and in particular to an electronic device. Background Technology

[0004] For co-packaged electronic devices containing multiple heat sources, heat dissipation presents a significant challenge due to limited packaging space. Co-packaged optics (CPO) serves as an example. CPO integrates a switching chip and an optical engine onto a single packaging substrate, forming a co-package of chip and module. CPO can significantly shorten the signal transmission distance, offering lower power consumption, more complete signal transmission, and faster transmission rates. Summary of the Invention

[0005] This application provides an electronic device comprising: a cavity; a heat dissipation duct disposed within the cavity and allowing airflow to pass through to remove heat from the cavity; a first heat source disposed within the cavity; a third heat source disposed within the cavity, wherein the temperature specification of the third heat source is lower than that of the first heat source; a first heat dissipation component located within the heat dissipation duct and in thermal contact with the first heat source; and a third heat dissipation component located within the heat dissipation duct and in thermal contact with the third heat source; wherein the third heat dissipation component is isolated from the first heat dissipation component, and the third heat dissipation component is located upstream of the airflow direction relative to the first heat dissipation component.

[0006] In the above embodiments, heat sources with different temperature specifications are equipped with corresponding heat dissipation components. The heat dissipation component of the heat source with lower temperature specifications is located upstream of the airflow direction, and the heat dissipation component of the heat source with lower temperature specifications is located downstream of the airflow. At the same time, the two heat dissipation components are independent of each other, thereby meeting the heat dissipation requirements of heat sources with different temperature specifications, realizing hierarchical heat dissipation management of different heat sources, and reducing thermal cross-interference between heat sources with different temperature specifications.

[0007] In one embodiment, the first heat dissipation component includes a first radiator, and the third heat dissipation component includes a third radiator; wherein, along the direction of gravity, the height of the top surface of the third radiator relative to the bottom plate of the cavity is lower than the height of the top surface of the first radiator relative to the bottom plate of the cavity.

[0008] In one embodiment, the first radiator includes a plurality of first heat dissipation fins; and / or the third radiator includes a plurality of third heat dissipation fins.

[0009] In one embodiment, the first heat dissipation component further includes a first substrate, which is disposed between the first heat source and the first heat dissipation device, and is in thermal contact with the first heat source and the first heat sink, respectively.

[0010] In one embodiment, the first substrate is also in thermal contact with the first heat source and the first heat sink, respectively.

[0011] In one embodiment, the third heat dissipation component further includes a third substrate, which is disposed between the third heat source and the third heat dissipation device, and is in thermal contact with the third heat source and the third heat sink, respectively.

[0012] In one embodiment, the third heat dissipation component further includes a third heat-conducting element, which is disposed between the third substrate and the third heat sink and makes thermal contact with the third substrate and the third heat sink respectively.

[0013] In one embodiment, a circuit board is provided inside the cavity, and the first heat source and the third heat source are fixed to the circuit board.

[0014] In one embodiment, the orthographic projections of the first heat sink and the third heat sink on the circuit board do not overlap.

[0015] In one embodiment, the electronic device further includes a second heat source disposed in the cavity and a second heat dissipation component in thermal contact with the second heat source. The second heat dissipation component is disposed in the heat dissipation duct and is located between the first heat dissipation component and the third heat dissipation component in the airflow direction. The temperature specification of the second heat source is lower than that of the first heat source and higher than that of the third heat source. The second heat dissipation component is isolated from the first heat dissipation component and the third heat dissipation component, respectively.

[0016] In one embodiment, the second heat dissipation component further includes a second heat sink, and the third heat dissipation component further includes a third substrate and a third heat sink. The third substrate is disposed between the third heat source and the third heat sink, and is in thermal contact with the third heat source and the third heat sink, respectively, and is in contact with the second heat source and the second heat sink, respectively.

[0017] In one embodiment, the second heat dissipation component further includes a second heat sink and a second heat dissipation substrate, the second substrate being disposed between the second heat source and the second heat sink, and in thermal contact with the second heat source and the second heat sink respectively.

[0018] In one embodiment, the distance between the second heat source and the first heat source, and the distance between the second heat source and the third heat source, are less than or equal to a first preset value.

[0019] In one embodiment, the first heat dissipation component includes a first heat sink, the second heat dissipation component includes a second heat sink, and the third heat dissipation component includes a third heat sink, wherein the orthographic projections of the first heat sink, the second heat sink, and the third heat sink on the circuit board of the first heat source package do not overlap.

[0020] In one embodiment, the height of the third heat sink in the direction of gravity is greater than the height of the second heat sink in the direction of gravity or the height of the first heat sink in the direction of gravity.

[0021] In one embodiment, the first heat dissipation component includes a first heat sink, the second heat dissipation component includes a second heat sink, and the third heat dissipation component includes a third heat sink, wherein the width of the third heat sink in the width direction is less than or equal to the width of the first heat sink in the width direction.

[0022] In one embodiment, the width of the second heat sink in the width direction is greater than the width of the first heat sink in the width direction and / or the width of the third heat sink in the width direction. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0025] Figure 2 is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0026] Figure 3 is a schematic diagram of the structure of a heat dissipation component according to an embodiment of this application.

[0027] Figure 4 is a schematic diagram of the structure of a heat dissipation component according to another embodiment of this application.

[0028] Figure 5 is a schematic diagram of the structure of a heat dissipation component according to another embodiment of this application.

[0029] Figure 6 is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0030] Figure 7 is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0031] Figure 8 is a top view of the heat dissipation fins of different heat sinks according to an embodiment of this application.

[0032] Figure 9 is a top view of the heat dissipation fins of different heat sinks according to an embodiment of this application.

[0033] Figure 10 is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application.

[0034] Figure 11 is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application.

[0035] Reference numerals: 100-Cavity; 110-Base plate; 120-Top plate; 130-Side plate; 200-Heat source; 210-First heat source; 211-First heating element; 220-Second heat source; 221-Second heating element; 230-Third heat source; 231-Third heating element; 300-Heat dissipation assembly; 310-Radiator; 320-Base plate; 330-Heat conductive component; 400-Circuit board; 500-Heat dissipation duct; 3 00a - First heat dissipation component; 310a - First heat sink; 320a - First substrate; 330a - First thermal conductive element; 300b - Second heat dissipation component; 310b - Second heat sink; 320b - Second substrate; 300c - Third heat dissipation component; 310c - Third heat sink; 320c - Third substrate; 330c - Third thermal conductive element; 600 - Connector; 610 - First locking accessory; 620 - Second locking accessory;

[0036] 01-Cavity. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0038] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0039] The terms "at least one," "at least one of," etc., used in the specification and claims of this application refer to any one, any two, or a combination of two or more of the included items. For example, at least one of a, b, or c can mean: "a," "b," "c," "a and b," "a and c," "b and c," and "a, b, and c," where a, b, and c can be single or multiple. Similarly, "at least two" refers to two or more items, and its meaning is similar to that of "at least one."

[0040] In the embodiments of this application, directional terms such as "upper", "lower", "lateral", "longitudinal", "horizontal" and "vertical" may be defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms can be relative concepts, used for relative description and clarification, and may change accordingly depending on the orientation of the components in the accompanying drawings.

[0041] Unless the context otherwise defines, the term "connection" in this specification and claims may refer to one element being directly connected to another element, or one element being connected to another element through an intermediate element.

[0042] For electronic devices that incorporate multiple heat sources in a co-package, heat dissipation presents a significant challenge due to limited package space. Co-packaged optics (CPO) serve as an example. CPO integrates a switching chip and an optical engine onto the same packaging substrate (e.g., a slot), forming a co-package of chip and module. CPO can significantly shorten signal transmission distances, resulting in lower power consumption, more complete signal transmission, and faster transmission rates. However, the close integration of the switching chip and optical module makes it difficult for the heat sink, which directly contacts the switching chip, to simultaneously provide adequate heat dissipation for the optical module. Furthermore, the dense arrangement of multiple chips in a CPO, with varying temperature specifications for each chip and the optical module, limits the available package space. The resulting heat dissipation devices are often integrated heat sinks, which struggle to effectively cool multiple heat sources and cannot provide differentiated cooling solutions for heat sources with different temperature specifications. Moreover, cross-thermal interference can occur between the optical module and the switching chip.

[0043] This application provides an electronic device. Figure 1 is a schematic diagram of the structure of an embodiment of the electronic device according to this application. Referring to Figure 1, the electronic device includes a cavity 100, within which at least two heat sources 200 with different temperature specifications and at least two heat dissipation components 300 are provided. Each heat dissipation component 300 corresponds to one of the heat sources 200 and is in thermal contact with the corresponding heat source 200. The heat dissipation components 300 corresponding to the heat sources 200 with different temperature specifications are isolated from each other to ensure that the corresponding heat dissipation components 300 are independent of each other. Isolation can be physical isolation, i.e., a gap is provided between them; isolation can also be achieved through thermal insulation to reduce or avoid thermal cross-interference between heat sources 200 with different temperature specifications.

[0044] It is understood that the number of heat sources 200 with different temperature specifications in the electronic device can be two, three, or more. For example, at least two heat sources 200 include a first heat source 210 and a third heat source 230, where the temperature specification of the first heat source 210 is higher than that of the third heat source 230.

[0045] Furthermore, a second heat source 220 can be set between the first heat source 210 and the third heat source 230, with the temperature specification of the second heat source 220 being higher than that of the third heat source 230 and lower than that of the first heat source 210.

[0046] The following explanation will use at least two heat sources 200 with different temperature specifications, including three heat sources 200, as an example. The three heat sources 200 with different temperature specifications include a first heat source 210, a second heat source 220, and a third heat source 230. The temperature specification of the first heat source 210 is higher than that of the second heat source 220, and the temperature specification of the second heat source 220 is higher than that of the third heat source 230. The component in thermal contact with the first heat source 210 is the first heat dissipation component 300a, the component in thermal contact with the second heat source 220 is the second heat dissipation component 300b, and the component in thermal contact with the third heat source 230 is the third heat dissipation component 300c.

[0047] The temperature specification refers to the temperature range that the heat source 200 can provide during normal operation. This range depends on the type of heat source 200 and its design purpose. Heat sources 200 with lower temperature specifications need to operate under lower temperature conditions to maintain good operating conditions.

[0048] It is understandable that heat sources 200 with different temperature specifications are equipped with corresponding heat dissipation components 300. The heat dissipation components 300 can adopt different heat dissipation strategies according to the operating conditions and power consumption of the corresponding heat source 200, thereby providing personalized heat dissipation solutions for heat sources 200 with different temperature specifications. They can also adjust the operating status of the heat dissipation components 300 according to the different operating conditions of the heat source 200, thereby realizing graded heat dissipation management for different heat sources 200, and also playing an energy-saving role.

[0049] The electronic device can be a CPO, near-packaged optics (NPO), a switch, etc. As shown in Figure 1, the electronic device is a CPO, which includes a switching chip and an optical module (or optical engine). The switching chip is the first heat source 210, and the optical engine can be the third heat source 230. The temperature specification of the switching chip can be less than or equal to 105°C, and the temperature specification of the optical module can be less than or equal to 85°C. The switching chip can include multiple chips, which are closely arranged within the cavity 100.

[0050] Referring again to Figure 1, the electronic device includes a base plate 110, a top plate 120, and a plurality of side plates 130. The base plate 110, top plate 120, and side plates 130 are arranged to form a cavity 01, in which a switching chip and an optical module are disposed. For example, the number of side plates 130 may be four, three, two, or one.

[0051] Figure 2 is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Referring to Figure 2, the heat dissipation assembly 300 includes a heat sink 310. Optionally, the heat sink 310 may include at least one of a liquid cooling plate, heat dissipation fins, or heat pipes. For example, the at least two heat sources 200 with different temperature specifications in Figure 2 include a first heat source 210, a second heat source 220, and a third heat source 230. Correspondingly, the first heat dissipation assembly 300a includes a first heat sink 310a, the second heat dissipation assembly 300b includes a second heat sink 310b, and the third heat dissipation assembly 300c includes a third heat sink 310c.

[0052] Along the gravitational direction Dg, the temperature specification of the heat source 200 corresponding to the lower heat sink 310 is lower than the temperature specification of the heat source 200 corresponding to the upper heat sink 310. For example, the temperature specification of the third heat source 230 is lower than that of the second heat source 220, and the third heat sink 310c is located below the second heat sink 310b. Because hot air is less dense than cold air, hot air will naturally rise, and cold air will sink. The lower temperature specification of the third heat source 230 and the lower temperature specification of the second heat source 220 and the higher temperature specification of the second heat source 220 and the higher temperature specification of the second heat sink 310b enhance this natural convection effect and improve heat dissipation efficiency. Moreover, it helps to form a more obvious temperature stratification, which can reduce thermal interference between different heat sources 200 and improve the heat dissipation effect of each heat source 200. The electronic device in this application can reduce the operating temperature of the heat source 200 and its surrounding components through more efficient heat dissipation, thereby reducing thermal stress and extending the service life of the electronic device.

[0053] Figure 3 is a schematic diagram of a heat dissipation assembly according to an embodiment of this application. Referring also to Figures 2 and 3, the heat dissipation assembly 300 further includes a substrate 320. The substrate 320 and the heat source 200 are stacked, and the heat sink 310 and the heat source 200 achieve thermal contact through the substrate 320. The substrate 320 has high thermal conductivity. The substrate 320 can be made of aluminum, copper, a vapor chamber (VC) heat spreader, or other composite materials with high thermal conductivity. When the substrate 320 is made of a composite material, it can be an aluminum substrate with a nested heat pipe, a VC welded heat pipe, or a three-dimensional vapor chamber (3DVC), etc.

[0054] It is understood that the shape and size of the substrate 320 are not limited in this application, and can be set according to actual needs.

[0055] Figure 4 is a structural schematic diagram of a heat dissipation assembly according to another embodiment of this application, and Figure 5 is a structural schematic diagram of a heat dissipation assembly according to yet another embodiment of this application. Please refer to Figures 2, 4, and 5 together. The heat dissipation assembly 300 also includes a heat-conducting element 330, and the substrate 320 and the heat sink 310 are connected through the heat-conducting element 330. The heat-conducting element 330 can be a heat pipe, a heat-conducting pad, a heat-conducting block, etc. The material used to make the heat-conducting element 330 can be a high thermal conductivity material, such as graphite, metal, or interface material.

[0056] Optionally, the heat-conducting component 330 is a flexible heat-conducting component 330, which can be flexibly set according to space and heat dissipation requirements. For example, for a heat source 200 with a low temperature specification, the corresponding heat sink 310 can be extended from the substrate 320 to the upstream of the airflow through the heat-conducting component 330, so that the heat sink 310 corresponding to the heat source 200 with a low temperature specification comes into contact with the cold airflow first, thereby obtaining the best heat dissipation conditions. Conversely, for a heat source 200 with a high temperature specification, if the heat source 200 is located downstream of the cold airflow, the corresponding heat sink 310 can be directly set on one side of the heat source 200; if the heat source 200 is not located downstream of the cold airflow, the corresponding heat sink 310 can be extended from the substrate 320 to the downstream of the airflow through the heat-conducting component 330 to save energy.

[0057] Referring again to Figures 2 to 5, the first heat dissipation assembly 300a may include a first substrate 320a and a first heat sink 310a disposed on the first substrate 320a. The first heat source 210 has the highest temperature specification, and the first heat sink 310a may be disposed on the surface of the first substrate 320a opposite to the first heat source 210. Furthermore, the third heat source 230 has the lowest temperature specification, and the third heat dissipation assembly 300c may include a third substrate 320c, a third heat sink 310c, and a third heat conductor 330c. The third heat conductor 330c extends from the third substrate 320c upstream of the airflow, so that the third heat sink 310c is located upstream of the airflow, thereby allowing the third heat sink 310c to contact the cold airflow first and obtain optimal heat dissipation conditions. The second heat dissipation assembly 300b may include a second substrate 320b, a second heat sink 310b, and a second heat conductor 330b. The second heat-conducting element 330b extends upward from the second substrate 320b so that the second heat sink 310b is located above the third heat sink 310c and upstream of the airflow of the first heat sink 310a, thereby enabling the second heat sink 310b to preferentially contact the cold airflow and enhancing the natural convection effect between the second heat sink 310b and the third heat sink 310c.

[0058] Figure 6 is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Referring to Figure 6, the electronic device in this application further includes a circuit board 400, and heat sources 200 are fixedly disposed on the circuit board 400. Each heat source 200 is disposed on the same side surface of the circuit board 400. Of course, the heat sources 200 can also be fixedly disposed on the cavity 100 according to actual needs, and this application does not impose any limitations.

[0059] Figure 7 is a schematic diagram of the structure of an electronic device according to an embodiment of this application. Referring to Figures 6 and 7, the heat dissipation component 300 can be fixed to the circuit board 400 or the cavity 100. Specifically, the heat dissipation component 300 can be connected to the circuit board 400 or the cavity 100 via a connector 600. As shown in Figure 6, the second heat sink 310b is fixed to the cavity 100 via a first locking attachment 610, which can be a screw or bolt, etc. Meanwhile, the second substrate 320b is fixed to the circuit board 400 via a second locking attachment 620.

[0060] In some optional embodiments, among at least two heat dissipation components 300, one heat sink 310 is fixed to the substrate 320 to which the other heat sink 310 is connected, to achieve stress coupling. Of course, each heat dissipation component 300 can also be independently fixed to the cavity 100 or the circuit board 400 to achieve stress decoupling. It is understood that the heat dissipation component 300 can be fixedly connected to the cavity 100, the circuit board 400, or the substrate 320, or it can be floatingly connected, depending on the actual situation. The key is to ensure good contact between the heat dissipation component 300 and the heat source 200, thereby reducing thermal resistance and improving heat exchange efficiency. Furthermore, the fixed position of the heat dissipation component 300 can also be flexibly set according to the actual situation.

[0061] In some optional embodiments, the orthographic projections of two substrates 320 corresponding to heat sources 200 with different temperature specifications on the circuit board 400 do not overlap, thereby avoiding thermal cross-interference between heat sources 200 with different temperature specifications.

[0062] Referring again to Figures 2, 6, and 7, the electronic device also includes a heat dissipation duct 500, on which all heat sources 200 are located. It is understood that the cool airflow in the heat dissipation duct 500 can be natural wind or airflow generated by a fan, which can be a blower or an exhaust fan. The fan's location can be set according to actual needs.

[0063] Among them, there are two heat sources 200 with different temperature specifications whose distance is less than or equal to a first preset value. The first preset value is designed according to the actual situation, that is, the distance between the two heat sources 200 with different temperature specifications is small and the space is limited.

[0064] It should be noted that the airflow direction in the heat dissipation duct can be parallel to or perpendicular to the surface of the circuit board 400. This application does not limit it, and the specific setting is based on actual needs.

[0065] In some optional embodiments, the radiator 310 is located on the heat dissipation duct 500. Along the airflow direction D1 in the heat dissipation duct 500, the temperature specification of the heat source 200 corresponding to the radiator 310 located upstream of the airflow is lower than the temperature specification of the heat source 200 corresponding to the radiator 310 located downstream of the airflow. As shown in FIG2, along the airflow direction D1 in the heat dissipation duct 500, the third radiator 310c is located upstream of the airflow of the first radiator 310a, and the second radiator 310b is located upstream of the airflow of the first radiator 310a, so that the third radiator 310c and the second radiator 310b can come into contact with the cold airflow first, thereby providing a lower temperature specification for the third heat source 230 and the second heat source 220.

[0066] To avoid thermal cross-interference between the first radiator 310a and the second radiator 310b, the first radiator 310a is located below the second radiator 310b along the direction of gravity Dg. This enhances the convection effect between the first radiator 310a and the second radiator 310b along the direction of gravity Dg, thereby improving heat dissipation efficiency. At the same time, when the airflow direction is perpendicular to the direction of gravity Dg, the second radiator 310b and the third radiator 310c can both come into contact with the cold airflow first along the airflow direction in the heat dissipation duct 500, thus avoiding thermal cross-interference between them.

[0067] Each heat source 200 may include one heating element, or two or more heating elements. The corresponding heat dissipation component 300 may include one heat sink 310, or two or more heat sinks 310, depending on the package space and heat dissipation requirements, taking into account both heat dissipation efficiency and space utilization.

[0068] Referring again to Figures 2 and 6, the second heat source 220 includes at least two second heating elements 221 spaced apart. Along the airflow direction D1 in the heat dissipation duct 500, at least one second heating element 221 is located upstream of the airflow of the first heat source 210. The at least two second heating elements 221 may surround the first heat source 210 or be positioned on one side of the first heat source 210; the specific arrangement is not limited.

[0069] As shown in Figure 2, the second heat dissipation component 300b may include a second heat sink 310b, and the two second heat-generating bodies 221 may share a second heat sink 310b. Along the airflow direction in the heat dissipation duct 500, the second heat sink 310b is located upstream of the airflow of the first heat sink 310a.

[0070] Alternatively, as shown in Figure 6, the second heat dissipation assembly 300b includes at least two second heat sinks 310b, each corresponding to a second heat-generating element 221. Each second heat sink 310b can be positioned as close as possible to its corresponding second heat-generating element 221 to shorten the heat conduction distance and thus improve heat conduction efficiency. The at least two second heat sinks 310b can share a single second substrate 320b or each correspond to an independent second substrate 320b. For example, at least one second heat sink 310b is located upstream of the airflow of the first heat sink 310a.

[0071] Of course, the first heat source 210 may include along one first heating element 211, or along two or more first heating elements 211.

[0072] Similarly, the third heat source 230 may include at least two third heating elements 231 arranged at intervals. For the specific arrangement of the third heat dissipation component 300c corresponding to the third heat source 230, please refer to the arrangement of the second heat dissipation component 300b corresponding to the second heat source 220, which will not be repeated here.

[0073] In some optional embodiments, the radiator 310 includes multiple heat dissipation fins, with adjacent fins spaced apart. Along the airflow direction in the heat dissipation duct, the spacing between heat sources 200 is relatively small. The heat dissipation fins can extend in a direction perpendicular to the airflow direction in the heat dissipation duct to increase the size of the fins or the spacing between adjacent fins. This allows the radiator 310 to obtain optimal airflow to meet the heat dissipation needs of the heat sources 200, thereby reducing the number or workload of fans and achieving energy savings.

[0074] It is understandable that the heat sink fins can also extend in other directions, as long as they can effectively utilize the package space or optimize the flow resistance of the heat sink 310, so as to improve the heat dissipation efficiency of the heat sink 310.

[0075] Figure 8 is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application; Figure 9 is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application; Figure 10 is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application; Figure 11 is a top view of the heat dissipation fins of different heat sinks in one embodiment of this application. Please refer to Figures 8 to 11 together. The shape, size and position of each heat sink 310 are set according to actual needs. Along the airflow direction D1 in the heat dissipation duct, each heat sink 310 is stacked separately to make full use of space.

[0076] As shown in Figures 8 to 11, the width of the third heat sink 310c in the width direction D2 is less than or equal to the width of the first heat sink 310a in the width direction D2.

[0077] As shown in Figure 11, the width of the second heat sink 310b in the width direction D2 is greater than the width of the first heat sink 310a in the width direction D2 and / or the width of the third heat sink 310c in the width direction D2.

[0078] In some optional embodiments, the orthographic projections of each heat sink 310 on the circuit board 400 do not overlap, so as to avoid thermal cross-interference between the heat sinks 310 and improve the heat dissipation effect.

[0079] Obviously, those skilled in the art can make various modifications and variations to the embodiments of this application without departing from the spirit and scope of this application. Therefore, if these modifications and variations of this application fall within the scope of the claims of this application and their equivalents, this application also intends to include these modifications and variations.

Claims

1. An electronic device, comprising: cavity; A heat dissipation duct is provided in the cavity and allows airflow to pass through to remove heat from the cavity; The first heat source is located in the cavity; A third heat source is provided in the cavity, and the temperature specification of the third heat source is lower than that of the first heat source. The first heat dissipation component is located in the heat dissipation duct and is in thermal contact with the first heat source; as well as The third heat dissipation component is located in the heat dissipation duct and is in thermal contact with the third heat source; The third heat dissipation component is isolated from the first heat dissipation component, and the third heat dissipation component is located upstream of the airflow direction relative to the first heat dissipation component.

2. The electronic device according to claim 1, wherein, The first heat dissipation component includes a first radiator, and the third heat dissipation component includes a third radiator; wherein, along the direction of gravity, the height of the top surface of the third radiator relative to the bottom plate of the cavity is lower than the height of the top surface of the first radiator relative to the bottom plate of the cavity.

3. The electronic device according to claim 2, wherein, The first radiator includes a plurality of first heat dissipation fins; and / or the third radiator includes a plurality of third heat dissipation fins.

4. The electronic device according to claim 2 or 3, wherein, The first heat dissipation component further includes a first substrate, which is disposed between the first heat source and the first heat dissipation device, and is in thermal contact with the first heat source and the first heat sink respectively.

5. The electronic device according to any one of claims 4, wherein, The first substrate is also in thermal contact with the first heat source and the first heat sink, respectively.

6. The electronic device according to any one of claims 2 to 5, wherein, The third heat dissipation component further includes a third substrate, which is disposed between the third heat source and the third heat dissipation device, and is in thermal contact with the third heat source and the third heat sink respectively.

7. The electronic device according to any one of claims 2 to 6, wherein, The third heat dissipation component further includes a third heat-conducting element, which is disposed between the third substrate and the third heat sink, and is in thermal contact with the third substrate and the third heat sink respectively.

8. The electronic device according to any one of claims 2 to 7, wherein, The cavity is equipped with a circuit board, and the first heat source and the third heat source are fixed to the circuit board.

9. The electronic device according to claim 8, wherein, The orthographic projections of the first heat sink and the third heat sink on the circuit board do not overlap.

10. The electronic device according to any one of claims 1 to 9, wherein, The electronic device further includes a second heat source disposed in the cavity and a second heat dissipation component in thermal contact with the second heat source. The second heat dissipation component is disposed in the heat dissipation duct and is located between the first heat dissipation component and the third heat dissipation component in the airflow direction. The temperature specification of the second heat source is lower than that of the first heat source and higher than that of the third heat source. The second heat dissipation component is isolated from the first heat dissipation component and the third heat dissipation component, respectively.

11. The electronic device according to claim 10, wherein, The second heat dissipation component further includes a second heat sink, and the third heat dissipation component further includes a third substrate and a third heat sink. The third substrate is disposed between the third heat source and the third heat sink, and is in thermal contact with the third heat source and the third heat sink respectively, and is in contact with the second heat source and the second heat sink respectively.

12. The electronic device according to claim 10, wherein, The second heat dissipation component further includes a second heat sink and a second heat dissipation substrate. The second substrate is disposed between the second heat source and the second heat sink, and is in thermal contact with the second heat source and the second heat sink, respectively.

13. The electronic device according to any one of claims 10 to 12, wherein, The distance between the second heat source and the first heat source, and the distance between the second heat source and the third heat source, are less than or equal to a first preset value.

14. The electronic device according to any one of claims 10 to 13, wherein, The first heat dissipation component includes a first heat sink, the second heat dissipation component includes a second heat sink, and the third heat dissipation component includes a third heat sink, wherein the orthographic projections of the first heat sink, the second heat sink, and the third heat sink on the circuit board of the first heat source package do not overlap.

15. The electronic device according to claim 14, wherein, The height of the third radiator in the direction of gravity is greater than the height of the second radiator in the direction of gravity or the height of the first radiator in the direction of gravity.

16. The electronic device according to claim 10, wherein, The first heat dissipation component includes a first heat sink, the second heat dissipation component includes a second heat sink, and the third heat dissipation component includes a third heat sink, wherein the width of the third heat sink in the width direction is less than or equal to the width of the first heat sink in the width direction.

17. The electronic device according to claim 16, wherein, The width of the second heat sink in the width direction is greater than the width of the first heat sink in the width direction and / or the width of the third heat sink in the width direction.

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