Fan apparatus and computing device

Abstract

Embodiments of the present application provide a fan apparatus and a computing device. The fan apparatus comprises a housing and a fan module. The housing defines an air outlet duct. The housing is provided with a support. The support defines a slot. The fan module is accommodated in the slot. The fan module generates, during operation, an airflow flowing along the air duct. The fan module is accommodated in the slot, which can simplify the assembly of the fan module and reduce assembly difficulty.

Description

Fan unit and computing equipment

[0001] This application claims priority to Chinese Patent Application No. 202510020839X, filed on January 6, 2025, entitled "Fan Device and Computing Equipment", the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 2025200253598, filed on January 6, 2025, entitled "Fan Device and Computing Equipment", the entire contents of which are incorporated herein by reference.

[0003] This application claims priority to Chinese Patent Application No. 2025200284933, filed on January 6, 2025, entitled "Circuit Board and Computing Device", the entire contents of which are incorporated herein by reference. Technical Field

[0004] This application relates to the field of electronic equipment technology, and more particularly to a fan device and a computing device. Background Technology

[0005] Electronic devices generate a lot of heat during operation. An effective heat dissipation structure can ensure that electronic devices operate within a safe temperature range and prevent performance degradation and hardware damage due to overheating.

[0006] Related technologies utilize fans to dissipate heat from electronic devices, but the installation structure of fans is relatively complex and difficult to operate. Summary of the Invention

[0007] This application provides a fan device and a computing device to solve or alleviate one or more technical problems in the prior art.

[0008] As one aspect of the embodiments of this application, this application provides a fan device, including:

[0009] The housing has an air duct and a support frame with a slot.

[0010] The fan module is housed in a slot and generates airflow along the air duct during operation.

[0011] In one implementation, the support is disposed within the air duct.

[0012] In one embodiment, the bracket is adjacent to the air inlet of the air duct, and the impeller rotation plane of the fan module is parallel to the cross-section of the air inlet.

[0013] In one embodiment, the housing has an air inlet plate with an air vent, and a bracket is disposed inside the housing of the air inlet plate on the side near the air inlet plate.

[0014] In one embodiment, the housing includes a bottom shell and a cover disposed on the bottom shell, the bottom shell and the cover defining an air outlet; the cover has a support or the bottom shell has a support.

[0015] In one embodiment, the housing has a top plate and the bottom shell has a bottom plate, with the top plate and the bottom plate facing each other in the vertical direction;

[0016] The support extends from the inner wall of the top plate toward the bottom plate, or the support extends from the inner wall of the bottom plate toward the top plate.

[0017] In one embodiment, the bracket includes at least two partitions, which are spaced apart in a first direction, and adjacent partitions define a slot.

[0018] The first direction is parallel to the bottom plate of the housing and parallel to the impeller rotation plane of the fan module.

[0019] In one embodiment, the support includes at least two partitions extending from the inner wall surface of the top plate toward the bottom plate, or the partitions extending from the inner wall surface of the bottom plate toward the top plate.

[0020] In one embodiment, two adjacent partitions define two first walls of the slot, and a top or bottom plate located in the area between the two adjacent partitions defines a second wall of the slot.

[0021] In one embodiment, the bracket includes at least two partitions, with adjacent partitions defining a slot inlet for inserting a fan module into the slot.

[0022] In one embodiment, the bracket further includes a baffle disposed on the side of the slot in the second direction and connected between the sides of two adjacent partitions in the second direction for abutting against the fan module in the second direction; wherein the second direction is parallel to the bottom plate of the housing and perpendicular to the impeller rotation plane of the fan module.

[0023] In one embodiment, the baffle of the bracket is connected between the sides of two adjacent partitions of the bracket in the second direction.

[0024] In one embodiment, the baffle of the bracket has a vent.

[0025] In one embodiment, baffles are provided on opposite sides of the slot in the second direction.

[0026] In one embodiment, the number of fan modules is at least two, the number of partitions is at least three, the at least three partitions define at least two slots, and the at least two fan modules correspond one-to-one with the at least two slots.

[0027] In one embodiment, the fan assembly further includes a flexible protective element disposed on the outer peripheral wall of the fan module where airflow does not pass.

[0028] In one embodiment, the portion of the flexible protective member located between the fan module and the slot abuts against the inner wall of the slot, so that the fan module is snapped into the slot.

[0029] In one embodiment, the flexible protective member includes two first protective sections opposite each other in a first direction and two second protective sections opposite each other in a vertical direction. The two first protective sections abut against two first walls of the slot, and one of the second protective sections abuts against a second wall of the slot.

[0030] In one embodiment, the top plate of the housing has a guide extending toward the bottom shell, and the bottom plate of the bottom shell has a guide mating member that engages with the guide.

[0031] In one embodiment, the guide is disposed on the first side of the bracket in the second direction.

[0032] In one embodiment, a guide is disposed on a first side of a partition of a bracket in a second direction, and the guide is connected to the corresponding partition and the baffle of the bracket via a connecting plate.

[0033] In one embodiment, the fan module has a wire-clamping notch for securing the fan module's connecting wires.

[0034] In one embodiment, a notch for securing the wire is provided at the end of the fan module away from the top plate of the housing, adjacent to the first side of the fan module in the second direction.

[0035] In one embodiment, the air duct has an air inlet and an air outlet, and the housing cover or the bottom shell of the housing defines the air inlet and air outlet.

[0036] In one embodiment, the cover or bottom shell has an air inlet plate and an air outlet plate, the air inlet plate having an air inlet and the air outlet plate having an air outlet.

[0037] In one embodiment, the air inlet and the air outlet are distributed in a second direction, with the air outlet adjacent to a first side of the bracket in the second direction and the air inlet adjacent to a second side of the bracket in the second direction.

[0038] In one embodiment, the distance between the air inlet and the second side of the bracket in the second direction is less than the distance between the air outlet and the first side of the bracket in the second direction.

[0039] In one embodiment, the fan device further includes a baffle plate connected to the inner side of the top plate of the housing and extending from the outer side of the bracket in the first direction along the airflow direction.

[0040] In one embodiment, the deflector includes multiple deflector sections that are not on the same plane.

[0041] In one embodiment, along the airflow direction, the deflector includes a first deflector section adjacent to the fan module, a second deflector section extending outward from the first deflector section, and a third deflector section extending away from the second deflector section in a direction away from the fan module.

[0042] In one embodiment, the bottom shell and the cover shell are fastened together.

[0043] In one embodiment, the enclosure includes a top plate and a plurality of side plates, the upper ends of the side plates correspondingly connected to a plurality of edges of the top plate, and the lower ends of the side plates defining an opening opposite the top plate; or

[0044] The bottom shell includes a bottom plate and multiple bottom side plates. The lower ends of the multiple bottom side plates are connected to multiple edges of the bottom plate, and the upper ends of the multiple bottom side plates define an opening opposite to the bottom plate.

[0045] In one embodiment, the internal enclosed area formed after the bottom shell and the cover are assembled defines the air outlet duct.

[0046] In one embodiment, the housing has a chamber and an opening communicating with the chamber, and the bottom shell can cover the opening to close the chamber and form an air duct.

[0047] In one embodiment, the bottom shell has a rectangular outline, and the cover shell has a rectangular outline.

[0048] In one embodiment, adjacent sides of the bottom shell are connected by a circular arc surface, and adjacent sides of the cover shell are connected by a circular arc surface.

[0049] As one aspect of the embodiments of this application, this application provides a computing device, including:

[0050] The fan device of any of the above;

[0051] The computing module is located inside the air duct of the fan unit.

[0052] In one embodiment, the computing module is located downstream of the fan module of the fan unit, along the airflow direction.

[0053] In one embodiment, the computing module is located inside the bottom housing of the fan unit.

[0054] In one embodiment, the computing device further includes a filter assembly disposed at the air inlet, the filter being used to filter the airflow passing through it.

[0055] In one embodiment, the fan assembly housing has an air inlet plate with an air vent.

[0056] A space is defined between the fan unit's bracket and the air inlet plate, and the filter assembly is located within this space.

[0057] In one embodiment, the housing and the bottom shell of the fan assembly define an insertion port communicating with the receiving space, through which the filter assembly is inserted into the receiving space.

[0058] In one embodiment, the filter assembly includes a filter frame having an insertion end and a closing end, the insertion end being inserted into an accommodating space through an insertion port, and the closing end covering the insertion port.

[0059] In one embodiment, the closed end is snapped into the bottom shell.

[0060] In one embodiment, the computing device further includes an air outlet guide assembly disposed at the air outlet of the air duct for guiding the airflow.

[0061] In one embodiment, the air outlet guide assembly includes an air outlet grille, and the non-air outlet area of ​​the air outlet grille is provided with a magnetic element;

[0062] The cover has an air outlet plate, which defines an air outlet. The non-air outlet area of ​​the air outlet plate is provided with a magnetic mating part corresponding to the magnetic element. The magnetic element and the magnetic mating part generate a magnetic force that attracts each other to hold the air outlet grille plate on the air outlet plate.

[0063] In one embodiment, the air outlet grille of the air outlet guide assembly is disposed on the outside of the air outlet.

[0064] In one embodiment, the air outlet guide assembly further includes a decorative strip disposed in the non-air outlet area of ​​the air outlet grille to cover the magnetic element.

[0065] In one embodiment, the computing device further includes a control module for sending control signals to the fan module of the fan assembly.

[0066] In one implementation, the control module is located inside the air duct.

[0067] In one implementation, the control module is located downstream of the fan module along the airflow direction.

[0068] In one embodiment, the control module is located inside the top plate of the fan unit's housing.

[0069] In one implementation, the control module is parallel to the top plate.

[0070] In one embodiment, the computing device further includes a data plug connected to a control module, and the fan housing has a plug mounting portion defining a plug mounting slot in which the data plug is snapped.

[0071] In one embodiment, the plug mounting portion is disposed on the outer side of the fan assembly bracket in the first direction.

[0072] In one embodiment, the air intake plate of the housing has an insertion hole communicating with the plug mounting slot for inserting a data cable to connect to the data plug.

[0073] In one embodiment, the computing device further includes a light-emitting element disposed inside the housing of the fan assembly, adjacent to the air outlet of the air duct.

[0074] In one embodiment, the computing device further includes a light guide, which is disposed inside the housing and adjacent to the air outlet. A light-emitting element is disposed on the light guide, and the light guide is snapped into the housing.

[0075] In one embodiment, the cover defines an installation space located inside the air outlet plate, the light guide is snapped into the installation space, and the inner side of the air outlet plate has a first limiting portion, the end face of the light guide facing the bottom shell abuts against the first limiting portion.

[0076] In one embodiment, the computing device further includes a temperature sensor located near the air outlet of the air duct.

[0077] In one embodiment, the inner side of the air outlet plate has a second limiting part, and the end face of the light guide facing the bottom shell has a third limiting part. The third limiting part and the second limiting part define a limiting space, and the temperature sensor is mounted in the limiting space.

[0078] In one embodiment, the computing device further includes a display screen, with a display hole formed on the top plate of the fan housing, and the display screen disposed at the display hole.

[0079] In one embodiment, the top plate has an inwardly protruding protective portion formed on the outer periphery of the inner side of the display hole, and the display screen is accommodated within the space defined by the protective portion and the display hole.

[0080] In one embodiment, the computing device further includes a transparent cover plate, which is housed within the space defined by the protective portion and the display aperture, and covers the outside of the display screen.

[0081] In one embodiment, the computing device further includes a display protector that covers the inside of the display screen.

[0082] In one embodiment, the computing module includes a circuit board, and at least a portion of at least one surface of the circuit board is provided with a heat sink.

[0083] In one implementation, the circuit board is electrically connected to the control module, and / or the circuit board is electrically connected to the fan module of the fan assembly.

[0084] In one implementation, the circuit board is a single, unjoined board.

[0085] In one embodiment, the heat sink includes a heat-conducting plate and a plurality of heat sinks, at least one surface of the circuit board is covered with the heat-conducting plate, and the plurality of heat sinks are spaced apart on the side of the heat-conducting plate away from the circuit board.

[0086] In one embodiment, a heat dissipation channel is formed between adjacent heat sinks, and the heat dissipation channel extends along the airflow direction.

[0087] In one embodiment, the bottom housing of the fan device has a plurality of guide mating parts spaced apart in a first direction, and the heat-conducting plate and the circuit board are respectively formed with avoidance notches to avoid the plurality of guide mating parts.

[0088] In one embodiment, the guide fitting has a reinforcing plate on the side adjacent to the clearance notch in the second direction, and the reinforcing plate abuts against the clearance notch.

[0089] In one embodiment, the surface of the circuit board facing away from the bottom housing of the fan assembly has a first functional area, and the first functional area is provided with a plurality of computing chips.

[0090] The first functional area is covered with heat dissipation components.

[0091] In one embodiment, the surface of the circuit board away from the bottom housing of the fan assembly has a second functional area, which is distributed adjacent to the first functional area in a first direction, and the second functional area is provided with an electrical connector for connection to the control module.

[0092] In one embodiment, the second functional area is covered by a heat sink, or the second functional area is not covered by a heat sink.

[0093] In one embodiment, the heat sink covering the first functional area has a first heat sink area away from the second functional area and a second heat sink area adjacent to the second functional area, wherein the height dimension of the heat sink in the second heat sink area extending away from the bottom shell is smaller than the height dimension of the heat sink in the first heat sink area extending away from the bottom shell.

[0094] In one embodiment, the control module is located on the side of the second heat dissipation area and the second functional area away from the bottom shell.

[0095] In one embodiment, the control module is provided with a connection mating part that corresponds to and is connected to the electrical connector of the second functional area.

[0096] In one embodiment, one of the electrical connectors and the mating parts is a pin, and the other is a socket.

[0097] In one embodiment, there are two heat sinks, one of which covers the surface of the circuit board facing the fan housing, and the other covers the surface of the circuit board facing the bottom housing.

[0098] In one embodiment, one of the heat-conducting plate of the heat sink and the circuit board has a positioning part, and the other has a positioning mating part, and the positioning part and the positioning mating part are connected in a mating connection.

[0099] In one embodiment, the heat-conducting plate adjacent to the bottom shell has a fixing area at each of its two ends in the first direction. The fixing area is not provided with heat sinks, and the fixing area has a positioning part or a positioning mating part.

[0100] In one embodiment, one of the positioning part and the positioning mating part is a positioning post and the other is a positioning hole; a positioning post is provided on the side of the fixing area adjacent to the first functional area facing the first functional area, and the circuit board and the heat-conducting plate away from the bottom shell have positioning holes corresponding to the positioning post, and the positioning post and the positioning hole are adapted to be inserted.

[0101] In one embodiment, the positioning post is formed with a first connecting hole that penetrates the heat-conducting plate in the thickness direction of the heat-conducting plate;

[0102] The inner surface of the bottom shell has multiple fixing posts, some of which correspond to the positioning posts and have a first fixing channel corresponding to the first connecting hole. The circuit board and the heat conduction plate are fixed to the bottom shell by fasteners that pass through the positioning hole and the first connecting hole in sequence and are fastened to the first fixing channel.

[0103] In one embodiment, a fixing area adjacent to the second functional area is formed with a second connecting hole that penetrates the heat-conducting plate in the thickness direction of the heat-conducting plate, and the second functional area is formed with a third connecting hole corresponding to the second connecting hole.

[0104] Some of the fixing posts have second fixing channels corresponding to the second connecting holes. The circuit board and the heat conduction plate are fixed to the bottom shell by fasteners that pass through the third connecting hole and the second connecting hole in sequence and are fastened to the second fixing channels.

[0105] In one embodiment, a reinforcing member extending toward the heat dissipation component is provided on the inner side of the bottom shell, and the reinforcing member is connected to a plurality of fixing posts.

[0106] In one embodiment, the reinforcing member includes a reinforcing connecting plate and a reinforcing side plate connected to the outer side of the reinforcing connecting plate in a first direction. The reinforcing connecting plate includes a connecting section and a reinforcing section. The connecting section is connected between two adjacent fixed posts in a second direction, and the reinforcing section is connected to the outer side of the fixed post located on the outer side.

[0107] In one embodiment, a voltage converter and an electrical connector are provided on the circuit board of the computing module. The electrical connector is used to supply power to the voltage converter, and the voltage converter is used to supply power to the chip array according to a preset voltage range.

[0108] In one embodiment, a chip array is disposed on the board body of the computing module circuit board. The chip array includes at least two rows of chip groups, which are spaced apart in a second direction. Each row of chip groups includes a plurality of computing chips spaced apart in a first direction.

[0109] In one implementation, the number of chips in each row of chipsets is not exactly the same.

[0110] In one implementation, the number of chips in each row of chipsets is odd.

[0111] In one implementation, the spacing between adjacent chips in at least one row of chipsets has at least two different spacings.

[0112] In one embodiment, the extension dimension of the circuit board of the computing module in the first direction is greater than the extension dimension of the circuit board in the second direction.

[0113] In one embodiment, the ratio of the extension dimension of the plate in the first direction to the extension dimension of the plate in the second direction ranges from 1.5:1 to 3.5:1.

[0114] In one embodiment, an electrical connector is provided on the circuit board of the computing module. A row of chipsets adjacent to the electrical connector is a first chipset, and a row of chipsets away from the electrical connector is a second chipset. The electrical connector is located on a first side of the first chipset in a first direction and on the side of the first chipset away from the second chipset.

[0115] In one embodiment, the electrical connector has a power input terminal and a power ground terminal. The power input terminal is connected to a second chipset via a voltage converter, and the power ground terminal is connected to a first chipset. Multiple computing chips in the chip array are connected in series.

[0116] In one embodiment, the second side of the first chipset in the first direction is electrically connected to the second side of the second chipset in the first direction, the first side of the first chipset in the first direction is connected to the power supply ground terminal, and the first side of the second chipset in the first direction is connected to the voltage converter.

[0117] In one embodiment, the electrical connector has a signal connection end that is connected to a chip array.

[0118] In one embodiment, the signal connection terminal is connected via a signal line to the side of the first chipset of the chip array opposite to the second chipset, and is connected to the computing chip in the first chipset that is closest to the signal connection terminal.

[0119] In one embodiment, the signal line is connected to the computing chip on one side in the second direction, and connected to an adjacent computing chip on the other side in the second direction.

[0120] In one implementation, the computing chip in the first chipset that is furthest from the signal connection terminal is signal-connected to the computing chip in the second chipset that is closest to the computing chip.

[0121] In one implementation, the number of computing chips in the first chipset of the chip array is odd.

[0122] In one embodiment, the voltage converter includes a voltage regulation module, which includes a voltage control chip, an input voltage switching element, and an output voltage switching element. The voltage control chip is used to control the on / off state of the input voltage switching element and the output voltage switching element according to a preset voltage range.

[0123] In one embodiment, the input voltage switching element and the output voltage switching element are metal-oxide-semiconductor field-effect transistors.

[0124] In one embodiment, the voltage converter includes a voltage regulator module, which includes an input capacitor element, an output capacitor element, and an inductor element. The input capacitor element is connected between the power input terminal of the electrical connector and the input terminal of the input voltage switching element.

[0125] The input terminal of the inductor is connected to the output terminal of the input voltage switching element and the input terminal of the output voltage switching element, respectively. The output terminal of the inductor is connected to the input terminal of the output capacitor element and the power supply input terminal of the chip array, respectively.

[0126] According to the fan device and computing device of the present application embodiments, by designing a bracket on the housing of the fan device and using the bracket to define a slot for accommodating the fan module, the assembly of the fan module can be simplified and the assembly difficulty reduced.

[0127] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0128] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0129] Figure 1A is a schematic diagram of the three-dimensional structure of a computing device that exemplarily provides an embodiment of this application;

[0130] Figure 1B provides an exemplary structural schematic diagram of a computing device according to an embodiment of this application from one view.

[0131] Figure 1C provides an exemplary structural schematic diagram of a computing device according to an embodiment of this application from another perspective;

[0132] Figure 2 is an exploded view of a computing device that exemplarily provides an embodiment of this application.

[0133] Figure 3A is a schematic diagram of the structure of a computing device according to an embodiment of this application from one view.

[0134] Figure 3B is a schematic diagram of the structure of a computing device, which exemplarily provides an embodiment of this application, from another perspective.

[0135] Figure 3C is a schematic structural diagram of the housing of the fan device of a computing device according to an embodiment of this application.

[0136] Figure 4 is an exploded view of a computing device that exemplarily provides an embodiment of this application.

[0137] Figure 5A is a schematic diagram of the structure of a filtering component of a computing device provided as an example of an embodiment of this application;

[0138] Figure 5B provides an exploded view of the filter assembly and housing of a computing device according to an embodiment of this application.

[0139] Figure 5C provides an exemplary schematic diagram of the assembly structure of the filter component and the housing of a computing device according to an embodiment of this application.

[0140] Figure 6 is an exploded structural diagram of the air outlet guide assembly of a computing device that exemplarily provides an embodiment of this application;

[0141] Figure 7A is a schematic diagram of the combined structure of the bottom shell, computing module and heat sink of the computing device provided in an embodiment of this application;

[0142] Figure 7B is an exploded structural diagram of the bottom shell, computing module and heat sink of the computing device provided as an example of an embodiment of this application;

[0143] Figure 8A is a schematic front view of the circuit board of a computing device according to an embodiment of this application.

[0144] Figure 8B is a three-dimensional structural diagram of the circuit board of a computing device according to an embodiment of this application;

[0145] Figure 8C is a schematic front view of the circuit board of a computing device according to an embodiment of this application.

[0146] Explanation of reference numerals in the attached drawings: 100-Computing device, 10-Control module, 11-Connecting mating part, 20-Computing module, 21-Circuit board, 211-Electrical connector, 212-Positioning hole, 213-Computing chip, 214-First functional area, 215-Second functional area, 216-Third connecting hole, 217-Mating hole, 22-Heat sink, 221-Heat conduction plate, 2211-Positioning post, 22111-First connecting hole, 2212-Second fixing hole, 2213-Second connecting hole, 222-Heat sink, 2221-First fixing hole, 2222-Heat dissipation channel, 223-First heat dissipation area, 224-Second heat dissipation area, 2201-Avoidance notch; 30-Fan module, 31-Wire notch, 32-Flexible protective component, 40-Data plug, 50-Display screen, 51-Display protective component, 52-Transparent cover, 60-WiFi plug, 70-Light-emitting component, 71-Light guide component, 711-Third limiting part, 712-Bayonet, 80-Temperature sensor, 90-Connecting line; 1000-Housing, 1101-Air duct, 110-Cover, 111-Top plate, 1111-Display hole, 1112-Protective part, 15-Blower plate, 151-First guide section, 152-Second guide section, 153-Third guide section; 112-Air inlet plate, 1121-Air inlet, 1122-Insert hole, 113-Air outlet plate, 1131-Air outlet, 1132-Matching groove, 1133-First limiting part, 1134-Second limiting part, 1135-Connecting plate, 11351-Protrusion, 1136-Magnetic mating part, 114-Cover side plate, 1141-Through hole; 115-Bracket, 1151-Slot, 1152-Slot entrance, 1153-Partition, 1154-Baffle, 1155-Ventilation opening, 1156-Connecting plate, 116-Accommodation space, 117-Plug mounting part, 118-Guide, 119-First screw post; 120-Bottom shell, 121-Guide fitting, 1211-Reinforcing plate, 122-Second screw post, 123-Fixing post, 1231-First fixing channel, 1232-Second fixing channel, 124-Insert port, 125-Reinforcing member, 1251-Reinforcing connecting plate, 12511-Connecting section, 12512-Reinforcing section, 1252-Reinforcing side plate; 130-Filter assembly, 131-Filter frame, 1311-Airflow through port, 1312-Snap protrusion, 1313-Insert end, 1314-Closed end, 132-Filter element; 140-Air outlet guide assembly, 141-Air outlet grille, 1411-Mounting hole, 1412-Guide plate, 142-Decorative strip, 143-Magnetic component;2111-Power input terminal, 2112-Power ground terminal, 2113-Signal connection terminal, 210-Board body, 22-Chipset, 23-First chipset, 24-Second chipset, 25-Conductor bus, 251-First conductor bus, 252-Second conductor bus, 253-Power input terminal, 254-Power output terminal, 26-Intermediate conductor; 27-Voltage converter, 271-Input voltage switch element, 272-Output voltage switch element, 273-Voltage control main chip, 274-Voltage control auxiliary chip, 275-Diode, 276-Resistor element, 277-Input capacitor element, 278-Inductor element, 279-Output capacitor element; L1-First direction, L2-Second direction, L3-Power supply line, L4-Signal line. Detailed Implementation

[0147] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0148] This application provides a computing device, which includes a fan device and a computing module disposed in the air duct of the fan device. The fan module of the fan device can dissipate heat from the computing module, reduce the temperature of the computing module, ensure that the computing module operates within a safe temperature range, and prevent performance degradation or damage due to overheating.

[0149] In related technologies, the installation structure of the fan module is relatively complex, which increases the difficulty of assembling the fan module, and the complex installation structure is prone to interference with other components such as the computing module.

[0150] The computing device in this embodiment utilizes a bracket to define a slot for accommodating a fan module. The fan module can be directly snapped into the slot without the need for screws or other fasteners, thereby simplifying the assembly of the fan module, reducing the difficulty of assembly and disassembly, and facilitating maintenance.

[0151] The computing device 100 of the present application embodiment will be described in detail below with reference to specific embodiments and Figures 1A to 8C.

[0152] Figure 1A provides an exemplary perspective view of the computing device 100 according to an embodiment of this application. Figure 1B provides an exemplary structural view of the computing device 100 according to an embodiment of this application from one perspective. Figure 1C provides an exemplary structural view of the computing device 100 according to an embodiment of this application from another perspective. Figure 2 provides an exemplary exploded structural view of the computing device 100 according to an embodiment of this application. Figure 3A provides an exemplary structural view of the computing device 100 according to an embodiment of this application from one perspective. Figure 3B provides an exemplary structural view of the computing device 100 according to an embodiment of this application from another perspective. Figure 3C provides an exemplary structural view of the fan device housing 110 of the computing device 100 according to an embodiment of this application. Figure 4 provides an exemplary exploded structural view of the computing device 100 according to an embodiment of this application.

[0153] As shown in Figures 1A, 2 and 3A, the computing device 100 of this application embodiment may include a fan device and a computing module 20 disposed in the air duct 1101 of the fan device. During operation, the fan device can generate airflow along the air duct 1101 to improve the heat dissipation efficiency of the computing module 20.

[0154] As shown in Figures 1A, 3A, and 4, the fan device of this embodiment includes a housing 1000 and a fan module 30. The housing 1000 has a bracket 115, which defines a slot 1151. The fan module 30 is housed in the slot 1151, and the fan module 30 generates airflow along the air duct 1101 during operation. This embodiment simplifies the assembly of the fan module 30 and reduces assembly difficulty by designing the bracket 115 on the housing 1000 and defining the slot 1151 for accommodating the fan module 30.

[0155] The housing 1000 includes a bottom housing 120 and a cover 110 disposed on the bottom housing 120. The bottom housing 120 and the cover 110 define an air outlet duct 1101. The bracket 115 can be disposed on the cover 110 or on the bottom housing 120.

[0156] It should be noted that there are multiple ways to combine the bracket 115 with the cover 110 or the bottom shell 120.

[0157] In some examples, the bracket 115 can be integrally formed with the housing 110 or the base 120 to improve structural strength and assembly efficiency. In other examples, the bracket 115 can be designed separately from the housing 110 or the base 120, for example, by welding or fasteners. Of course, examples of the combination of the bracket 115 and the housing 110 or the base 120 are not limited to these.

[0158] For example, the bracket is disposed within the air duct. The housing 110 has a top plate 111, and the bottom housing 120 has a bottom plate that is vertically opposite to the top plate 111.

[0159] In the example where the bracket 115 is disposed on the housing 110, the bracket 115 extends from the inner wall surface of the top plate 111 toward the bottom plate. In the example where the bracket 115 is disposed on the bottom shell 120, the bracket 115 extends from the inner wall surface of the bottom plate toward the top plate 111.

[0160] In a specific example, as shown in Figure 4, the bracket 115 is adjacent to the air inlet 1121 of the air duct, and the impeller rotation plane of the fan module 30 is parallel to the cross-section of the air inlet 1121.

[0161] In the example shown in Figure 4, the rotation axis of the impeller of the fan module 30 is parallel to the second direction L2, the rotation plane of the impeller is a vertical plane, and the air inlet 1121 is a vertical plane. The housing 110 has an air inlet plate 112, the air inlet plate 112 forms an air inlet 1121, and the bracket 115 is disposed inside the housing near the inner side of the air inlet plate 112.

[0162] By placing the bracket 115 near the air inlet 1121 of the air duct, the fan module 30 is closer to the air inlet 1121, which can directly introduce external cold air into the air duct, quickly reduce the temperature of each component in the air duct, and prevent hot air from accumulating in the air duct, which is conducive to maintaining the stability of the temperature in the air duct.

[0163] In other examples, bracket 115 may be located adjacent to the air outlet 1131 of the duct to quickly expel hot air from inside the duct.

[0164] For example, the internal enclosed area formed by the assembly of the bottom shell 120 and the cover 110 defines an air duct. Specifically, the cover 110 has a chamber and an opening communicating with the chamber, and the bottom shell 120 can cover the opening to close the chamber and form an air duct.

[0165] For example, referring to Figure 3C, the bracket 115 includes at least two partitions 1153, which are spaced apart in the first direction L1. Adjacent partitions 1153 define a slot 1151 to limit the fan module 30 in the first direction L1, facilitating the assembly of the fan module 30. Of course, the structure of the bracket 115 is not limited to this example and can also be other structural examples capable of accommodating the fan module 30. The first direction L1 is parallel to the bottom plate of the bottom shell and parallel to the impeller rotation plane of the fan module 30.

[0166] In some examples, referring to Figure 3C, in the example where the bracket 115 is disposed on the housing 110, the partition 1153 extends from the inside of the top plate 111 toward the bottom plate of the bottom shell 120. In the example where the bracket 115 is disposed on the bottom shell 120, the partition 1153 extends from the inner wall surface of the bottom plate of the bottom shell 120 toward the top plate 111.

[0167] Two adjacent partitions 1153 define two first walls of the slot 1151, and the area of ​​the top plate 111 or bottom plate located between the two adjacent partitions 1153 defines a second wall of the slot 1151. That is, in the example where the bracket 115 is disposed on the cover 110, the top plate 111 of the bottom shell 120 and the partitions 1153 of the bracket 115 cooperate to define the slot 1151, thereby reducing the number of components of the bracket 115, simplifying the design of the bracket 115, and increasing the compactness between the cover 110 and the bottom shell 120. In the example where the bracket 115 is disposed on the bottom shell 120, the bottom plate of the bottom shell 120 and the partitions 1153 cooperate to define the slot 1151.

[0168] In other examples, the bracket 115 may also include a wall panel disposed on the top plate 111 of the bottom shell 120, the wall panel forming the second wall of the slot 1151, that is, the wall panel and two adjacent partitions 1153 define the slot 1151.

[0169] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the structure of the bracket 115 defining the slot 1151 may also include a slide rail structure, a spring clamping structure, etc., and is not limited to these.

[0170] In some examples, referring to Figure 3C, the edges of two adjacent partitions 1153 facing the bottom shell 120 define the slot inlet 1152 of the slot 1151. The slot inlet 1152 is used for the fan module 30 to be inserted into the slot 1151. That is, the edges of the two adjacent partitions 1153 facing the bottom shell 120 are open without obstruction. The fan module 30 can be quickly inserted into the slot 1151 through the opening, i.e., the slot inlet 1152. The assembly is simple and easy to operate.

[0171] In other examples, a cover plate may be connected between the edges of two adjacent partitions 1153 facing the bottom shell 120. The cover plate has a slot 1152, through which the fan module 30 can be inserted into the slot 1151. The cover plate can provide partial restraint for the fan module 30 inserted into the slot 1151.

[0172] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the card inlet 1152 can also have other limiting forms. For example, a closing plate may be connected between the sides of two adjacent partitions 1153 facing the bottom shell 120. The closing plate can be connected to the partitions 1153 via hinges or snap-fits. When the closing plate is opened, the card inlet 1152 is exposed to allow the fan module 30 to be inserted into the card slot 1151. When the closing plate is closed, the card inlet 1152 is sealed to limit the movement of the airflow module 30. This is also merely an example, and the limiting form of the card inlet 1152 is not limited to this.

[0173] For example, referring to FIG3C, the bracket 115 further includes a baffle 1154, which is disposed on the side of the slot 1151 in the second direction L2, for abutting against the fan module 30 in the second direction L2 to limit the fan module 30. The second direction L2 is parallel to the bottom plate of the bottom shell 120 and perpendicular to the impeller rotation plane of the fan module 30.

[0174] In a specific example, as shown in Figure 3C, a baffle 1154 is connected between the sides of two adjacent partitions 1153 in the second direction L2. The baffle 1154 has a vent 1155 formed on the side of the baffle 1154 facing the bottom housing 120, i.e., the side of the baffle 1154 facing away from the top plate 111. The vent 1155 allows airflow to pass through. The baffle 1154 provides a limit to the fan module 30 without obstructing airflow, thus ensuring smooth airflow.

[0175] In some examples, the edge of the baffle 1154 may define a vent 1155, which may be an arc shape protruding toward the top plate 111 to form an area for airflow in the direction away from the top plate 111, thereby increasing the airflow area. Furthermore, the shape of the vent 1155 may also be a regular shape such as a rectangle, square, circle, or ellipse, or other irregular shapes, and is not limited to these.

[0176] In other examples, the vent 1155 may be an opening formed in the non-edge area of ​​the baffle 1154, and the shape of the vent 1155 may be, for example, rectangular, square, circular, elliptical or other irregular shapes, and is not limited thereto.

[0177] For example, baffles 1154 can be provided on opposite sides of the slot 1151 in the second direction L2 to limit the fan module 30 on opposite sides of the second direction L2, thereby improving the assembly stability of the fan module 30.

[0178] For example, referring to Figure 4, the outer peripheral wall of the fan module 30, where airflow does not pass, may be provided with a flexible protective element 32. Specifically, when the fan module 30 is inserted into the slot 1151, the portion of the flexible protective element 32 located between the fan module 30 and the slot 1151 abuts against the inner wall of the slot 1151, so that the fan module 30 is securely inserted into the slot 1151.

[0179] Understandably, the outer perimeter of the airflow passage area of ​​the fan module 30 must not be obstructed by any object to ensure smooth airflow. In this example, the flexible protective component 32 on the non-airflow passage outer perimeter of the fan module 30 can fill the gap between the fan module 30 and the slot 1151, allowing the fan module 30 to be securely fastened to the slot 1151. This ensures the stability of the fan module 30 without the need for screws, thus simplifying the assembly of the fan module 30 and reducing assembly difficulty. In addition, the flexible protective component 32 protects and dampens the fan module 30, reducing noise during operation.

[0180] In a specific example, the flexible protective member 32 includes two first protective sections opposite each other in a first direction and two second protective sections opposite each other in a vertical direction. The two first protective sections abut against the two first walls of the slot 1151, and one of the second protective sections abuts against the second wall of the slot 1151. In the example where the bracket 115 is disposed on the cover 110, the two first protective sections abut against the inner wall surfaces of two adjacent partitions 1153, and the second protective section away from the bottom shell 120 abuts against the inner wall surface of the top plate 111. Thus, the flexible protective member 32 protects and fills four different locations on the outer periphery of the fan module 30, increases the tightness of the fan module 30 with the slot 1151, and improves the shock absorption effect.

[0181] In some examples, the flexible protective element 32 can be EVA anti-collision padding, which is adhered to the outer peripheral wall of the fan module 30 where airflow does not pass, simplifying the connection between the flexible protective element 32 and the fan module 30. In other examples, the flexible protective element 32 can also be foam rubber, polyurethane foam, etc. It should be noted that this is only illustrative and does not constitute a limitation of this application. Those skilled in the art will understand that the flexible protective element 32 can also be silicone, polypropylene foam, memory foam, etc., and is not limited thereto.

[0182] In some examples, the fan module 30 has a wire-clamping notch to hold the connecting wires of the fan module 30 in place, thus limiting the wires and keeping them neat. Referring to Figures 3B and 4, the end of the top plate 111 facing away from the housing 110 has a wire-clamping notch 31 defined on the first side in the second direction L2. The connecting wires 90 of the fan module 30 are clamped in the wire-clamping notch 31 and are adjacent to the first side of the fan module 30 in the second direction L2. By designing the wire-clamping notch 31 at the end of the fan module 30, the connecting wires 90 can be organized, avoiding wire clutter. In addition, by designing the wire-clamping notch 31 and the connecting wires 90 to be located adjacent to the first side of the fan module 30 in the second direction L2, the empty space between the fan module 30 and the bottom housing 120 can be utilized, avoiding obstruction of airflow and avoiding affecting the arrangement of other components inside the fan device.

[0183] In some examples, the connection line 90 may extend along a first direction L1 toward the side of the fan module 30 opposite to the top plate 111 of the housing 110.

[0184] In other examples, the connection line 90 may extend from the wire notch 31 on one side of the fan module 30 in the second direction L2.

[0185] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the connection line 90 may also have other arrangements, such as extending in the first direction L1 or the second direction L2 on the side of the fan module 30 facing the top plate 111, and is not limited thereto.

[0186] For example, in order to increase the airflow within the duct 1101, the number of fan modules 30 may be at least two. In addition, for example, in order to enhance the compactness of the fan modules 30 and the bracket 115 and reduce space occupation, the number of partitions 1153 may be at least three, and the at least three partitions 1153 define at least two slots 1151, with at least two fan modules 30 corresponding one-to-one with the at least two slots 1151.

[0187] As exemplarily shown in Figures 2 to 4, there are three fan modules 30, the bracket 115 includes four partitions 1153, the four partitions 1153 define three slots 1151, and there are three flexible protective members 32, with one flexible protective member 32 wrapped around the outer peripheral wall of each fan module 30 where airflow does not pass. It should be noted that this is only an example and does not constitute a limitation on this application. The number of fan modules 30 can also be two, four, or five, etc., and is not limited thereto.

[0188] In some examples, referring to Figures 1A, 3C, and 4, the top plate 111 of the cover 110 has a guide 118 extending squarely toward the bottom shell 120. The bottom shell 120 has a guide fitting 121 that mates with the guide 118. That is, the guide 118 and the corresponding guide fitting 121 provide positioning and guidance for the assembly of the bottom shell 120 and the cover 110. The guide fitting 121 on the bottom shell 120 and the guide 118 on the cover 110 are inserted into each other to guide the installation of the bottom shell 120 and the cover 110. This simplifies the assembly process of combining the cover 110 and the bottom shell 120, prevents misassembly and misoperation, improves the reliability of the assembly, and ensures the assembly accuracy. On the other hand, it enhances the structural strength of the connection between the cover 110 and the bottom shell 120, improves the firmness and stability of the connection, and enhances the durability and impact resistance of the shell 1000.

[0189] For example, the guide 118 is disposed on the first side of the bracket 115 in the second direction L2. Specifically, as shown in FIG3C, the guide 118 can be disposed on the first side of the partition 1153 of the bracket 115 in the second direction L2. The guide 118 is connected to the corresponding partition 1153 and the baffle 1154 of the bracket 115 through the connecting plate 1156. That is, the partition 1153 and the baffle 1154 of the bracket 115 are connected to the guide 118 through the connecting plate 1156, so as to simultaneously enhance the stability of the guide 118 and the bracket 115 and improve the compactness of the overall structure.

[0190] In some examples, the guide 118 may also be set relatively independently from the two adjacent baffles 1154 in the first direction L1.

[0191] In other examples, the guide 118 can be connected between two adjacent baffles 1154 in the first direction L1 via a connecting plate 1156.

[0192] It should be noted that the connection between the partition 1153, the connecting plate 1156, and the two adjacent baffles 1154 connected thereto can form a cross shape to enhance its overall strength. In addition, the connection between the connecting plate 1156 and the two adjacent baffles 1154 connected thereto can also form an X shape, a grid shape, etc., and is not limited to these.

[0193] For example, the number of guide members 118 can be one or more, with multiple guide members 118 spaced apart in the first direction L1. Referring to Figure 3C, there are two guide members 118, which are connected to two adjacent partitions 1153 and two adjacent baffles 1154 via corresponding connecting plates 1156. This is merely an example and does not constitute a limitation of this application; the number of guide members 118 can also be three, four, etc., and is not limited thereto.

[0194] In some examples, the guide 118 shown in FIG4 can be integrally formed with the top plate 111 of the housing 110, and the guide mating part 121 (shown in FIG7A) can be integrally formed with the bottom shell 120 to improve structural strength and assembly efficiency.

[0195] In other examples, the guide 118 shown in FIG4 can be separately connected to the top plate 111, and the guide mating part 121 (shown in FIG7A) can be separately connected to the bottom shell 120, for example by welding or fasteners, and is not limited thereto.

[0196] In some examples, referring to Figures 4 and 7A, one of the guide member 118 and the guide mating member 121 can be a guide post and the other can be a guide sleeve. The guide post and the guide sleeve are inserted into each other to provide positioning and guidance for the assembly of the cover 110 and the bottom shell 120.

[0197] In other examples, one of the guide 118 and the guide mating member 121 is a protrusion and the other is a groove, with the protrusion and groove interlocking.

[0198] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the assembly and positioning of the cover 110 and the bottom cover 120 can also be achieved through the cooperation of snaps and latches, the cooperation of pins and holes, or magnetic guidance, and is not limited to these methods.

[0199] For example, the bottom shell 120 and the cover 110 are fastened together.

[0200] In some examples, the housing 110 includes a plurality of side panels, the upper ends of which are connected to a plurality of edges of the top plate, and the lower ends of which define an opening opposite the top plate.

[0201] In some examples, the bottom shell 120 includes a bottom plate and a plurality of bottom side plates, the lower ends of which are connected to a plurality of edges of the bottom plate, and the upper ends of which define an opening opposite the bottom plate.

[0202] As shown in Figure 2 and in conjunction with Figure 1A, the upper ends of the multiple bottom side plates (unlabeled) of the bottom shell 120 are inserted into the cover 110 through the opening (unlabeled) of the cover 110, and abut against the inner wall of the multiple cover side plates 114, thereby achieving a snap-fit ​​connection between the bottom shell 120 and the cover 110.

[0203] In a specific example, the housing 110 is formed by a top plate 111 and four side plates, the four side plates including two side plates 114 that are distributed opposite each other in a first direction L1 and an air inlet plate 112 and an air outlet plate 113 that are distributed opposite each other in a second direction L2.

[0204] In some examples, the outlines of the base shell 120 and the cover shell 110 are both rectangular. In one specific example, the outlines of both the base shell 120 and the cover shell 110 are rounded rectangles. That is, adjacent sides of the base shell 120 are connected by a rounded surface, and adjacent sides of the cover shell 110 are connected by a rounded surface, improving aesthetics.

[0205] In other examples, the outer contours of the bottom shell 120 and the outer contours of the cover 110 can be elliptical, circular, polygonal, etc., and are not limited to these.

[0206] In some examples, the housing 110 and the base 120 can be connected by fasteners. For example, the housing 110 has a first screw post 119 inside (see FIG. 3B), and the base 120 has a second screw post 122 opposite to the first screw post 119 on its inner side (see FIG. 7A). The housing 110 and the base 120 are assembled by screws passing through the first screw post 119 and the second screw post 122.

[0207] The number of first screw posts 119 and second screw posts 122 can be multiple. For example, each of the four corner regions inside the cover 110 has a first screw post 119, and each of the four corner regions inside the bottom shell 120 has a second screw post 122, to increase the stability of the assembly between the cover 110 and the bottom shell 120. The first screw posts 119 can be integrally formed with the cover 110 or separately connected, and the second screw posts 122 can be integrally formed with the bottom shell 120 or separately connected.

[0208] In other examples, the housing 110 and the base 120 can be connected by snaps (not shown in the figures).

[0209] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the cover 110 and the bottom cover 120 can also be connected by means of rivets, pins and latches, hinges or magnetism, etc., and are not limited to these.

[0210] In some examples, referring to Figures 3A and 4, the housing 110 defines an air inlet 1121 and an air outlet 1131 for the air duct 1101. In other examples, one of the housing 110 and the bottom housing 120 defines an air inlet 1121 and the other defines an air outlet 1131. This is merely illustrative and does not constitute a limitation of this application. The air inlet 1121 and the air outlet 1131 can also be located in other locations, such as on the bottom housing 120, and are not limited thereto.

[0211] In some examples, referring to Figure 4, the air inlet 1121 and the air outlet 1131 are distributed in the second direction L2. The air outlet 1131 is adjacent to the first side of the bracket 115 in the second direction L2, and the air inlet 1121 is adjacent to the second side of the bracket 115 in the second direction L2. The distance between the air inlet 1121 and the second side of the bracket 115 in the second direction L2 is less than the distance between the air outlet 1131 and the first side of the bracket 115 in the second direction L2. The airflow flows from the second side of the bracket 115 in the second direction L2 to the first side opposite to the second side, forming an axial airflow. Accordingly, with reference to the airflow direction and the axial relationship of the fan module 30, the fan module 30 can be an axial fan.

[0212] In other examples, the air inlet 1121 and the air outlet 1131 may be distributed in different directions, and accordingly, the fan module 30 may be a centrifugal fan, a diagonal flow fan, or a crossflow fan, etc., and is not limited to this.

[0213] For example, as shown in Figures 3B and 3C, a guide plate 15 may be connected to the inner side of the top plate 111 of the cover 110. The guide plate 15 extends from the outer side of the support 115 in the first direction L1 along the airflow direction to guide the airflow in the air duct 1101. The outer side of the support 115 in the first direction L1 can be understood as the side of the support 115 away from the center of the support 115 in the first direction L1.

[0214] In some examples, referring to Figure 3B, the air deflector 15 includes multiple air deflector sections that are not on the same plane along the airflow direction. Specifically, the air deflector 15 includes a first air deflector section 151 adjacent to the fan module 30, a second air deflector section 152 extending outward from the first air deflector section 151, and a third air deflector section 153 extending away from the fan module 30 from the second air deflector section 152. That is, along the airflow direction, the air deflector 15 first expands outward to diffuse the airflow, reduce the airflow speed and pressure, and allow the airflow to fully contact the computing module 20, thereby improving the heat dissipation effect of the computing module 20. When the air deflector 15 changes from outward expansion to inward contraction, it can re-accelerate the airflow, allowing the airflow to flow out quickly. The above design of the air deflector 15 can help the airflow transition gradually, reduce the formation of turbulence and eddies, and thus make the airflow smooth and uniform.

[0215] In other examples, the deflector 15 may first expand and then contract along the airflow direction. It should be noted that the above are merely illustrative examples and do not constitute a limitation of this application. Those skilled in the art will understand that the shape of the deflector 15 can also be other forms, such as curved or airfoil-shaped, and is not limited thereto.

[0216] As will be understood by those skilled in the art, the above examples of fan devices can be combined in any way to achieve specific design requirements and functions without departing from the spirit or scope of this application.

[0217] In some examples of the computing device 100 in this embodiment, along the airflow direction, the computing module 20 may be located downstream of the fan module 30. That is, external cold air enters the air duct 1101 through the air inlet 1121, passes through the fan module 30 first, then through the computing module 20, absorbs the heat of the computing module 20, and then flows out through the air outlet 1131.

[0218] In other examples, see Figures 3A, 4 and 7A, the computing module 20 can be located upstream of the fan module 30, that is, external cold air enters the air duct 1101 through the air inlet 1121, passes through the computing module 20, and then flows out through the fan module 30 to the air outlet 1131.

[0219] The air outlet 1131 can be connected to an external heat recovery system or directed toward a heat-consuming area. In this way, the computing device 100 can function as a heater while performing computing functions, thereby recovering and utilizing the hot air output from the air outlet 1131 to save energy.

[0220] In some examples, referring to Figure 7A, the computing module 20 can be disposed inside the bottom shell 120. This rationally allocates the placement of the fan module 30 and the computing module 20, reducing their interference during the assembly process of the casing 110 and the bottom shell 120, lowering the assembly difficulty, and improving the overall compactness of the computing device 100. In other examples, the computing module 20 can be disposed inside the casing 110. It should be noted that this is only an example and does not constitute a limitation of this application. The computing module 20 can also be disposed outside the casing 110, and is not limited thereto.

[0221] For example, referring to Figures 3A and 3B, the air duct 1101 may be provided with a control module 10 to dissipate heat from the control module 10.

[0222] In some examples, along the airflow direction, the control module 10 is located downstream of the fan module 30, that is, external cold air enters the air duct 1101 through the air inlet 1121, passes through the fan module 30 first, then through the control module 10, and then flows out through the air outlet 1131.

[0223] In other examples, the control module 10 may be located upstream of the fan module 30, meaning that external cold air enters the air duct 1101 through the air inlet 1121, passes through the control module 10, and then flows out through the fan module 30 to the air outlet 1131.

[0224] In the example where the calculation module 20 and the control module 10 are located in the air duct 1101, the positional relationship between the control module 10 and the calculation module 20 relative to the airflow direction can be flexibly set. For example, the control module 10 may be located downstream or upstream of the calculation module 20, or the airflow may flow through both the control module 10 and the calculation module 20 at the same time, and so on.

[0225] For example, referring to Figures 3A and 3B, the control module 10 can be disposed inside the top plate 111 of the housing 110 to make full use of the space inside the housing 110 and facilitate the electrical connection between the control module 10 and the computing module 20.

[0226] Understandably, the control module 10 is electrically connected to the computing module 20 and the fan module 30 respectively, so as to realize the signal transmission and power transmission between the control module 10 and the computing module 20 and the fan module 30.

[0227] In some examples, the control module 10 can be connected to the fan module 30 and / or the computing module 20 via wires. In other examples, the control module 10 can be electrically connected to the fan module 30 and / or the computing module 20 via a socket and plug. These are merely illustrative examples and do not constitute a limitation of this application. Those skilled in the art will understand that the connection between the control module 10 and the fan module 30 can also be achieved through pin connections, wireless connections, terminal block connections, etc., and is not limited to these methods.

[0228] For example, referring to Figure 4, the housing 110 has an air inlet plate 112 and an air outlet plate 113. The air inlet plate 112 forms an air inlet 1121, and the air outlet plate 113 forms an air outlet 1131. The design of the air inlet 1121 and the air outlet 1131 can be varied. For example, the air inlet plate 112 and the air outlet plate 113 can each form an array of small circular holes. The multiple small circular holes of the air inlet plate 112 constitute the air inlet 1121 to evenly distribute the incoming air, increasing the flow area of ​​the incoming air inside the housing 1000 and improving the heat dissipation effect. The multiple small circular holes of the air outlet plate 113 constitute the air outlet 1131 to evenly distribute the outgoing air and increase the diffusion area of ​​the outgoing air. For example, the air inlet plate 112 and the air outlet plate 113 each have multiple elongated openings, which respectively constitute the air inlet 1121 and the air outlet 1131. The foregoing is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the design of the air inlet 1121 and the air outlet 1131 can also be square holes, polygonal holes, irregular holes, or mixed holes of multiple types, etc., and is not limited to these.

[0229] It is understandable that the relative positions of the air inlet 1121 and the air outlet 1131 are related to the structural type of the fan module 30.

[0230] In some examples, as shown in Figures 3A, 3B and 4, the fan module 30 has an axial flow structure, that is, the airflow direction in the air duct 1101 is parallel to the axis of the fan module 30. Accordingly, the air inlet 1121 and the air outlet 1131 can be distributed relative to each other in the airflow direction, that is, the air inlet plate 112 and the air outlet plate 113 can be distributed relative to each other in the airflow direction.

[0231] In other examples, the fan module 30 can be a centrifugal structure with the airflow direction perpendicular to the axis of the fan module 30. Accordingly, the air inlet 1121 and the air outlet 1131 can be vertically distributed, that is, the extension direction of the air inlet plate 112 is perpendicular to the extension direction of the air outlet plate 113.

[0232] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that, depending on the structural type of the fan module 30, the positions of the air inlet plate 112, the air outlet plate 113, the air inlet 1121, and the air outlet 1131 can vary accordingly and are not limited to the above examples.

[0233] Figure 5A provides an exemplary structural schematic diagram of the filter assembly 130 of the computing device 100 according to an embodiment of this application. Figure 5B provides an exemplary exploded structural schematic diagram of the filter assembly 130 and the housing 110 of the computing device 100 according to an embodiment of this application. Figure 5C provides an exemplary assembly structural schematic diagram of the filter assembly 130 and the housing 110 of the computing device 100 according to an embodiment of this application.

[0234] Referring to Figures 5A to 5C, a filter assembly 130 can be installed at the air inlet 1121 to filter the airflow passing through it. This prevents external dust, particles, and other impurities from entering the fan module 30 and affecting its normal operation, thus improving the reliability and lifespan of the fan module 30. Furthermore, it prevents impurities from affecting the normal operation of the control module 10 and the computing module 20 within the air duct 1101, and also improves the cleanliness of the airflow output from the air outlet 1131.

[0235] The filter assembly 130 includes a filter frame 131 and a filter element 132 disposed on the filter frame 131. The filter element 132 is used to filter the airflow passing through it. In some examples, the filter element 132 can be filter cotton, the interior of which can contain dust to improve the filtration effect. The filter cotton can be made of cotton fibers, polyurethane foam, polyester fibers, polypropylene fibers, etc., and is not limited to these. In other examples, the filter element 132 can be a filter screen, filter paper, or membrane filter, etc., which are only examples and do not constitute a limitation of this application.

[0236] In some examples, as shown in Figure 5B, the filter element 132 can be adhesively attached to the filter frame 131, making it easy to disassemble and replace. In other examples, the filter element 132 can be snap-fitted into the filter frame 131. These are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the filter element 132 can also be connected by insertion, compression, etc., and is not limited to these methods.

[0237] For example, referring to Figure 5A, the filter frame 131 should have an airflow passage 1311, and there can be multiple airflow passages 1311. The filter element 132 can cover the inside or outside of the airflow passage 1311. A filter screen can be covered at the airflow passage 1311, and the filter screen can be located inside the filter element 132 to perform secondary filtration on the airflow filtered by the filter element 132, thereby improving the filtration effect.

[0238] The number and arrangement direction of the airflow through ports 1311 can be consistent with the number and arrangement direction of the fan modules 30. For example, in an example where multiple fan modules 30 are arranged in the first direction L1, see Figures 4, 5A to 5C, where multiple airflow through ports 1311 of the filter frame 131 are arranged sequentially in the first direction L1.

[0239] In some examples, the filter assembly 130 can be plugged into the housing 1000. Specifically, referring to Figures 4 and 5B, a receiving space 116 is defined between the bracket 115 of the computing device 100 and the air inlet plate 112, and the filter assembly 130 can be disposed within the receiving space 116. The cover 110 and the bottom shell 120 define an insertion port 124 communicating with the receiving space 116, and the filter assembly 130 is inserted into the receiving space 116 through the insertion port 124. In this example, the receiving space 116 for the filter assembly 130 is defined by the bracket 115 for accommodating the fan module 30 and the air inlet plate 112 of the cover 110, which realizes the plug-in installation and removal of the filter assembly 130, improves the convenience of replacing the filter element 132, increases the compactness of the structure, and improves the utilization rate of the internal space of the housing 1000.

[0240] For example, referring to Figure 5B, the filter frame 131 has an insertion end 1313 and a closing end 1314. The insertion end 1313 is inserted into the receiving space 116 through the insertion port 124, and the closing end 1314 covers the insertion port 124. That is, the closing end 1314 cooperates with the bottom shell 120 and the cover 110 to close the insertion port 124, so as to maintain the airtightness at the insertion port 124 and prevent air leakage.

[0241] For example, referring to Figure 5B, the insertion port 124 is defined by a notch formed on the bottom shell 120 and the cover 110. That is, a notch is formed on the bottom shell 120. After the bottom shell 120 and the cover 110 are assembled, the notch of the bottom shell 120 and the cover 110 form the insertion port 124. After the filter assembly 130 is inserted into the receiving space 116 through the insertion port 124, the closed end 1314 of the filter frame 131 closes the insertion port 124.

[0242] To increase the stability of the connection between the filter assembly 130 and the housing 1000, the filter frame 131 of the filter assembly 130 can be snapped into the housing 1000. For example, referring to FIG5B, the closed end 1314 of the filter frame 131 is snapped into the bottom shell 120. For instance, the closed end 1314 of the filter frame 131 has a locking protrusion 1312 on each side of its extending direction (see FIG5A), and the bottom shell 120 has a limiting protrusion that engages with the locking protrusion 1312. The locking protrusion 1312 and the limiting protrusion abut against each other, limiting the position of the filter assembly 130 and improving its stability.

[0243] In other examples, the filter assembly 130 can be installed within the housing 1000 via fasteners or other means. It should be noted that these are merely examples and do not constitute a limitation of this application. Those skilled in the art will understand that the filter assembly 130 and the housing 1000 can also be connected via magnetic attraction, snap-fit ​​connections, etc., and are not limited to these methods.

[0244] Figure 6 is an exploded view of the air outlet and air guide assembly 140 of the computing device 100 provided in an exemplary embodiment of this application.

[0245] As shown in Figure 6, and in conjunction with Figures 1A to 4, an air outlet guide component 140 can be installed at the air outlet 1131. The air outlet guide component 140 is installed at the air outlet 1131 of the air duct and is used to guide the air outlet.

[0246] The air outlet guide assembly 140 includes an air outlet grille 141, which is disposed on the outside of the air outlet 1131 to guide the airflow and make the airflow diffuse evenly to the outside.

[0247] In some examples, the air outlet grille 141 can be magnetically connected to the housing 110. Specifically, referring to Figure 6, the non-air outlet area of ​​the air outlet grille 141 is provided with a magnetic element 143, and the non-air outlet area of ​​the air outlet plate 113 of the housing 110 is provided with a magnetic mating element 1136 corresponding to the magnetic element 143 (see Figure 3B). The magnetic element 143 and the magnetic mating element 1136 generate a magnetic force that attracts each other to hold the air outlet grille 141 on the air outlet plate 113 of the housing 110. This simplifies the assembly of the air outlet grille 141 and the housing 110 and facilitates the disassembly of the air outlet grille 141. The air outlet plate 113 of the housing 110 can be formed with a mating groove 1132 adapted to the air outlet grille 141 (see Figure 4). The air outlet grille 141 is accommodated in the mating groove 1132 to prevent the air outlet grille 141 from protruding outward and affecting the aesthetics, while also reducing the volume of the housing 1000.

[0248] For example, referring to Figures 3B and 6, the non-air outlet area of ​​the air outlet grille 141 may have a mounting hole 1411, and the magnetic component 143 may be embedded in the mounting hole 1411. The non-air outlet area of ​​the air outlet plate 113 of the cover 110 and the area corresponding to the mounting hole 1411 may have a mounting opening, and the magnetic mating component 1136 may be embedded in the mounting opening.

[0249] It is understandable that the magnetic component 143 and the magnetic mating component 1136 are two components capable of generating magnetic attraction. For example, one of the magnetic component 143 and the magnetic mating component 1136 may be a magnet and the other may be an iron sheet, but this is not a limitation.

[0250] The number of magnetic components 143 and magnetic mating components 1136 can be multiple. In the examples shown in Figures 3B and 6, a magnetic component 143 is provided at each of the four corner areas of the air outlet grille 141, and a magnetic mating component 1136 is provided at each of the four corner areas of the air outlet plate 113, so as to enhance the adsorption force between the air outlet grille 141 and the air outlet plate 113 and improve the stability of the air outlet grille 141 in the air outlet plate 113.

[0251] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the position, quantity, and shape of the magnetic element 143 and the magnetic mating element 1136 can also take other forms. For example, the magnetic element 143 and the magnetic mating element 1136 can be elongated to enhance the adsorption force; for example, the magnetic element 143 can be disposed on any one or more sides of the air outlet grille plate 141, and correspondingly, the magnetic mating element 1136 can be disposed on any one or more sides of the air outlet plate 113, and is not limited thereto.

[0252] For example, referring to Figure 6, the air outlet guide assembly 140 also includes a decorative strip 142, which is disposed in the non-air outlet area of ​​the air outlet grille 141 to cover the magnetic element 143, so as to maintain the aesthetic appearance of the air outlet guide assembly 140.

[0253] In other examples, the air vent grille 141 and the housing 110 can also be connected by fasteners. It should be noted that this is only an example and does not constitute an illustration of this application. Those skilled in the art will understand that the air vent grille 141 and the housing 110 can also be connected by riveting, pin connection, snap-fit ​​connection or welding, etc., and are not limited to these methods.

[0254] In some examples, referring to Figure 6, the air outlet grille 141 may include a frame and a guide vane 1412 disposed within the frame.

[0255] For example, there may be one guide vane 1412, which can be arranged vertically or horizontally. For instance, if the guide vane 1412 is arranged vertically, it may extend at an angle relative to the direction of the airflow from the air outlet 1131, so that the airflow can diffuse into a larger space. It should be noted that this is only an example and does not constitute a limitation of this application. When the guide vane 1412 is arranged horizontally, it may extend horizontally or at an angle relative to the direction of the airflow from the air outlet 1131, and is not limited to this.

[0256] For example, there can be multiple guide vanes 1412, and multiple guide vanes 1412 are arranged in sequence to form a grid structure. The guide vanes 1412 and the frame can be integrally formed or separately connected.

[0257] In some examples, multiple deflectors 1412 extend in the same direction, directing the airflow in the same direction and increasing the temperature in localized concentrated areas.

[0258] In other examples, the multiple guide vanes 1412 can be divided into a first guide group and a second guide group. Each guide vane 1412 in the first guide group extends in a direction parallel to one direction, and each guide vane 1412 in the second guide group extends in a direction parallel to another direction, so as to guide the airflow in different directions and make the blown airflow more dispersed and uniform.

[0259] Users can manually flip the air outlet grille 141, such as flipping it up and down, left and right, or inward and outward, to change the air outlet direction, achieve different air outlet effects, and meet different air outlet needs.

[0260] For example, as shown in Figures 3B and 4, the interior of the housing 110 may also be provided with a light-emitting element 70 adjacent to the air outlet 1131 to display the working status of the computing device to the outside.

[0261] The interior of the cover 110 is also provided with a light guide 71, and the light-emitting element 70 is disposed on the light guide 71. The light guide 71 is snapped into the cover 110 to guide the light emitted by the light-emitting element 70 toward the air outlet 1131, so as to facilitate user observation and improve the display effect.

[0262] The light-emitting element 70 can be connected to the control module 10 to display different colors according to different air outlet temperatures, so as to provide users with a more intuitive temperature indication.

[0263] In some examples, the light-emitting element 70 can be a light strip, and the light guide element 71 can be a light guide bar. In other examples, the light-emitting element 70 can be an LED bulb, and the light guide element 71 can be a light guide plate. It should be noted that these are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the light-emitting element 70 can also be an OLED panel, an electroluminescent (EL) panel, a fluorescent lamp, etc., and is not limited thereto. The light guide element 71 can also be a light guide prism, a light guide film, a reflective sheet, an optical lens, etc., and is not limited thereto.

[0264] In some examples, the light-emitting element 70 and the light guide element 71 can be connected by adhesive, strapping, or fasteners, and are not limited to these methods.

[0265] In some examples, referring to Figure 3B, the housing 110 defines an installation space located inside the air outlet plate 113. The light guide 71 is snapped into the installation space. The inner side of the air outlet plate 113 has a first limiting portion 1133. The end face of the light guide 71 facing the bottom shell 120 (see Figure 7A) abuts against the first limiting portion 1133. That is, while the light guide 71 is snapped into the installation space, the first limiting portion 1133 of the air outlet plate 113 limits the end face of the light guide 71 facing the bottom shell 120, thereby limiting the different positions of the light guide 71 and ensuring the stability of the installation of the light guide 71.

[0266] In the example shown in Figure 3B, the air outlet plate 113 of the housing 110 has connecting plates 1135 between it and the two first screw posts 119 adjacent to its two ends. The air outlet plate 113, the two connecting plates 1135, the two first screw posts 119, and the top plate of the housing 110 define a mounting groove. The light guide 71 is elongated and extends along the length of the housing 1000. The two ends of the light guide 71 in the extension direction are respectively engaged with the two connecting plates 1135 to achieve the engagement of the light guide 71 with the housing 110. For example, the two ends of the light guide 71 have a bayonet 712, and the two connecting plates 1135 have protrusions 11351 corresponding to the two bayonet 712. The bayonet 712 and the corresponding protrusion 11351 cooperate to engage the light guide 71 with the connecting plate 1135.

[0267] In other examples, the light guide 71 can be fixed to the mounting space of the housing 110 by means of fasteners, adhesives, rivets, etc., and is not limited to these.

[0268] For example, the computing device 100 also includes a temperature sensor 80 disposed near the air outlet of the air duct, as shown in Figures 3B and 4. The temperature sensor 80 may be disposed inside the air outlet 1131 to detect the air outlet temperature. It is understood that the temperature sensor 80 is connected to the control module 10. The control module 10 acquires the air outlet temperature information detected by the temperature sensor 80 and controls the light-emitting element 70 to change its color and / or brightness accordingly based on different air outlet temperatures, helping the user to intuitively understand the current air outlet temperature.

[0269] In some examples, the temperature sensor 80 may also be located at the air inlet 1121 to monitor the intake air temperature. This is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the temperature sensor 80 is not limited to the above-mentioned locations. For example, the temperature sensor 80 may be located at the heat source of the computing device 100 (e.g., the computing module 20), or at any of the different locations mentioned above, and is not limited thereto.

[0270] As shown in the example in Figure 3B, the inner side of the air outlet plate 113 also has a second limiting part 1134, and the end face of the light guide 71 facing the bottom shell 120 has a third limiting part 711. The third limiting part 711 and the second limiting part 1134 define a limiting space. The temperature sensor 80 is snapped into the limiting space. The temperature sensor 80 can be installed without the use of fasteners or tools, which is easy to operate and the installation is stable.

[0271] For example, referring to FIG4, the computing device 100 also includes a display screen 50. The top plate of the housing 110 forms a display hole 1111, and the display screen 50 is disposed at the display hole 1111. The top plate forms an inwardly protruding protective portion 1112 on the outer periphery of the inner side of the display hole 1111, and the display screen 50 is accommodated within the space defined by the protective portion 1112 and the display hole 1111. The protective portion 1112 not only provides protection for the display screen 50, but also provides a mounting area for the display screen 50. The display screen 50 is located inside the display hole 1111, which can prevent the display screen 50 from being hit by external objects and ensure the safety of the display screen 50.

[0272] The space defined by the protective section 1112 and the display hole 1111 also accommodates a transparent cover plate 52, which covers the outside of the display screen 50 and protects the display screen 50. The protective section 1112 can provide protection for the display screen 50 and the transparent cover plate 52 and provide an installation area.

[0273] Referring again to Figure 4, a mounting surface is defined between the protective portion 1112 and the inner periphery of the display hole 1111. In some examples, the transparent cover 52 may be adhesively attached to the mounting surface. In other examples, the transparent cover 52 may be fixed to the mounting surface by screws or clips, etc., and is not limited to these.

[0274] For example, referring to Figures 1A and 4, the inside of the display screen 50 may be covered with a display protection member 51 to provide cushioning and protection for the display screen 50 and prevent components inside the housing 110 from damaging the display screen 50.

[0275] In some examples, the display protector 51 can be an EVA pad, which can be adhered to the inner surface of the display screen 50. In other examples, the display protector 51 can be a glass protective film, a silicone protective sleeve, a silicone pad, etc., and is not limited to these.

[0276] For example, referring to Figure 4, the control module 10 is parallel to the top plate 111. The control module 10 covers the display protective member 51 on the side facing the bottom shell 120. The control module 10 is electrically connected to the display screen 50 to realize signal transmission between the control module 10 and the display screen 50. The display screen 50 can display the air temperature, computing power, power consumption, IP information, etc., of the computing module 20. Multiple screw posts can be provided on the inner side of the top plate of the cover 110 around the protective part 1112. The control module 10 is fixed to the top plate of the cover 110 by screws fastened to the screw posts.

[0277] For example, referring to Figures 3A and 4, the data plug 40 of the computing device 100 is connected to the control module 10. For instance, the housing 110 has a plug mounting portion 117, which defines a plug mounting slot. The data plug 40 is snapped into the plug mounting slot, enabling a plug-in connection between the data plug 40 and the computing device 100 without the need for screws or other fasteners for fixation, thus facilitating assembly and disassembly.

[0278] For example, referring to Figures 3A and 4, the plug mounting portion 117 can be disposed on the outer side of the bracket 115 in the first direction L1 to utilize the space between the bracket 115 and the housing 110 to improve space utilization.

[0279] For example, referring to Figure 1B, the air inlet plate 112 of the housing 110 has an insertion hole 1122 that communicates with the plug mounting slot. The insertion hole 1122 is used for inserting a data cable to connect with the data plug 40, so as to realize the connection of the control module 10 with the external power supply and data transmission.

[0280] For example, the control module 10 of the computing device 100 can communicate with external devices via a wireless network, such as Wi-Fi or Bluetooth, or via a wired network, such as Ethernet, and is not limited thereto.

[0281] In a specific example, the control module 10 communicates with external devices via Wi-Fi. Referring to Figures 1A and 4, the computing device 100 may include a Wi-Fi plug 60 connected to the control module 10. The side plate 114 of the housing 110 has a through hole 1141 for inserting the Wi-Fi plug 60. The Wi-Fi plug 60 is inserted into the interior of the housing 110 through the through hole 1141 to connect with the control module 10, thereby realizing the transmission and wiring of wireless signals between the control module 10 and the external device.

[0282] Figure 1A shows the computing device 100 with the Wi-Fi plug 60 installed, meaning the computing device 100 communicates with external devices via the external Wi-Fi plug 60. This is merely an example and does not constitute a limitation of this application. Those skilled in the art will understand that the structure for enabling Wi-Fi communication between the computing device 100 and external devices can be the external Wi-Fi plug described above, or it can be a Wi-Fi module installed inside the computing device 100, and is not limited to this.

[0283] Figure 7A provides an exemplary schematic diagram of the combined structure of the bottom shell 120, computing module 20, and heat sink 22 of the computing device 100 according to an embodiment of this application. Figure 7B provides an exemplary exploded schematic diagram of the bottom shell 120, computing module 20, and heat sink 22 of the computing device 100 according to an embodiment of this application.

[0284] As shown in Figures 7A and 7B, the computing module 20 includes a circuit board 21 and at least one heat sink 22, with the heat sink 22 disposed on at least a portion of at least one surface of the circuit board 21.

[0285] The circuit board 21 is a single, unconnected board, eliminating the need for connectors that would otherwise be used to connect multiple boards. This increases the installation area for heat dissipation components, which on the one hand helps to increase the number of computing chips that can be placed on the board, thereby increasing computing power, and on the other hand helps to improve the heat dissipation effect of the circuit board.

[0286] In some examples, a heat sink 22 is provided on one surface of the circuit board 21, for example, on the surface of the circuit board where the computing chip 213 is located (see FIG. 8A). In other examples, heat sinks are provided on both surfaces of the circuit board 21 to improve heat dissipation. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the heat sink 22 may also be provided at the end of the circuit board 21, and is not limited thereto.

[0287] For example, referring to FIG7B, the heat sink 22 includes a heat-conducting plate 221 and a plurality of heat sinks 222. At least one surface of the circuit board 21 is covered with the heat-conducting plate 221, and the plurality of heat sinks 222 are spaced apart on the side of the heat-conducting plate 221 away from the circuit board 21 to increase the heat dissipation area and improve the heat dissipation efficiency.

[0288] For example, continuing to refer to Figure 7B, a heat dissipation channel 2222 is formed between adjacent heat sinks 222 to allow airflow to pass through and improve heat dissipation efficiency.

[0289] In some examples, the heat dissipation channel 2222 extends along the airflow direction, that is, the heat dissipation channel 2222 is parallel to the airflow direction, to ensure that the heat dissipation airflow can evenly cover all heat sinks 222. For example, the extension direction of the heat sink 222 is parallel to the airflow direction, and multiple heat sinks 222 are arranged sequentially at intervals in a direction perpendicular to the airflow direction to form a heat dissipation channel extending along the airflow direction between adjacent heat sinks 222, thereby improving heat dissipation efficiency.

[0290] In other examples, the heat dissipation channel 2222 may intersect with the airflow direction to increase the complexity of the flow path, thereby improving heat exchange efficiency.

[0291] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the heat dissipation channel 2222 and the airflow direction can also be partially parallel or partially intersecting, and are not limited to this.

[0292] As shown in Figure 7B, in an example where the bottom shell 120 has a plurality of guide mating parts 121 spaced apart in a first direction, the heat-conducting plate 221 and the circuit board 21 are respectively formed with clearance notches 2201 to avoid the plurality of guide mating parts 121, so as to increase the compactness of each component while avoiding interference between the heat-conducting plate 221 and the circuit board 21 and the guide mating parts 121.

[0293] In some examples, as shown in Figures 7B and 8A, the clearance notch 2201 is L-shaped, that is, the heat-conducting plate 221 and the circuit board 21 form a notch in the area through which the guide mating member 121 passes, while remaining intact in the area where it does not interfere with the guide mating member 121, so as to ensure the dimensions of the heat-conducting plate 221 and the circuit board 21.

[0294] In other examples, the shape of the clearance notch 2201 can match the shape of the guide mating part 121. For example, if the guide mating part 121 is cylindrical, the clearance notch 2201 is a semi-circular notch, so as to minimize the size of the clearance notch and leave more space for the heat conduction plate 221 and the circuit board 21.

[0295] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the clearance notch 2201 can also be a square notch, a U-shaped notch, or an irregularly shaped notch, and is not limited to these.

[0296] For example, referring to Figure 7B, a reinforcing plate 1211 is provided on the side of the guide fitting 121 adjacent to the clearance notch 2201 in the second direction L2. The reinforcing plate 1211 abuts against the clearance notch 2201, which not only enhances the stability of the guide fitting 121, but also makes the arrangement of each component more compact.

[0297] In some examples, the reinforcing plate 1211 can be integrally formed with the guide mating member 121 to improve structural strength and assembly efficiency. In other examples, the reinforcing plate 1211 can be designed separately from the guide mating member 121, for example, the reinforcing plate 1211 can be fixed to the guide mating member 121 by welding or fasteners, and it is not limited to this.

[0298] For example, referring to Figure 7B, the surface of the circuit board 21 facing away from the bottom shell 120 has a first functional area 214, on which multiple computing chips 213 are disposed, and the first functional area 214 is covered by a heat sink 22. In this way, the heat sink 22 dissipates heat from the computing chips 213 on the first functional area 214, ensuring the stable operation of the computing chips 213.

[0299] The computing chip 213 can be any one or more combinations of a central processing unit (CPU), a graphics processing unit (GPU), a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), a neural network processor (NPU), etc., and is not limited to these.

[0300] The circuit board 21 may also be equipped with power management units, clock and timer circuits, capacitors, inductors, resistors, and other components, and is not limited to these, to form a complete computing unit together with the chip. These components may be located in the second functional area 215 or partially located in the first functional area 214 and partially located in the second functional area 215. Compared to the heat dissipation of the chip, the heat dissipation of these components is relatively small, and even if they are located in the second functional area 215, which is not covered by the heat sink 22, their heat dissipation requirements can be met through natural convection.

[0301] For example, the surface of the circuit board 21 facing away from the bottom housing 120 also has a second functional area 215, which is distributed adjacent to the first functional area 214 in the first direction L1. The second functional area 215 is provided with an electrical connector 211 for connection with the control module 10.

[0302] In some examples, the second functional area 215 is not covered by the heat sink, meaning the second functional area 215 is exposed outside the heat sink 22. This facilitates the connection of the electrical connector 211 on the second functional area 215 to the control module 10 and avoids interference from the heat sink 22 with the connection between the circuit board 21 and the control module 10.

[0303] In other examples, the second functional area 215 may cover the heat sink, the location of which needs to provide clearance for the electrical connector 211.

[0304] In an example where there are two heat sinks 22, as shown in Figure 7B, one heat sink 22 can cover the surface of the circuit board 21 facing the housing 110, for example, covering the first functional area 214. The other heat sink 22 can cover the surface of the circuit board 21 facing the bottom housing 120. That is, a portion of the surface of the circuit board 21 facing away from the bottom housing 120, i.e., the first functional area 214, is covered by the heat sink 22. The surface of the circuit board 21 facing the bottom housing 120 can be partially or completely covered by the heat sink 22 to enhance the heat dissipation effect.

[0305] For example, referring to FIG7B, the heat sink 22 covering the first functional area 214 has a first heat sink 223 away from the second functional area 215 and a second heat sink 224 adjacent to the second functional area 215. The height dimension of the heat sink 222 of the second heat sink 224 extending away from the bottom shell 120 is smaller than the height dimension of the heat sink 222 of the first heat sink 223 extending away from the bottom shell 120. That is, the heat sink 222 of the second heat sink 224 is closer to the top plate 111 of the cover 110 than the heat sink 222 of the first heat sink 223, so as to reserve space for the arrangement of the control module 10 between the second heat sink 224 and the top plate 111, avoid interference between the heat sink 222 and the control module 10, and improve the compactness of the computing device 100 to save space.

[0306] For example, the control module 10 can be located on the side of the second heat dissipation area 224 and the second functional area 215 away from the bottom shell 120. That is, part of the control module 10 is located on the side of the second heat dissipation area 224 away from the bottom shell 120, and another part extends to the side of the second functional area 215 away from the bottom shell 120, so as to meet the size requirements of the control module 10 and facilitate the connection between the control module 10 and the circuit board 21.

[0307] In some examples, referring to Figures 4 and 7A, the control module 10 is provided with a connection mating part 11 that corresponds to and is connected to the electrical connector 211 of the second functional area 215. The electrical connector 211 is connected to the connection mating part 11 to connect the control module 10 to the circuit board 21.

[0308] The electrical connector 211 and the connecting mating part 11 can be used for a socket and pin connection to improve the convenience of electrical connection between the control module 10 and the circuit board 21. The electrical connector 211 and the connecting mating part 11 can also be used for board-to-board connection or interface connection, etc., and are not limited to these.

[0309] In other examples, the control module 10 and the computing module 20 can be connected by wires.

[0310] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the connection between the control module 10 and the computing module 20 can also be wireless, USB, magnetic, etc., and is not limited to these methods.

[0311] For example, one of the heat sink 22 and the circuit board 21 is provided with a positioning part, and the other is provided with a positioning mating part. The positioning hole part is connected with the positioning mating part to provide positioning for the installation of the circuit board 21 and the heat sink 22, so as to facilitate the assembly of the circuit board 21 and the heat sink 22.

[0312] In some examples, as shown in Figures 7B and 8A, one of the positioning part and the positioning mating part can be a positioning post 2211 and the other can be a positioning hole 212. The positioning post 2211 and the positioning hole 212 are inserted and mated to realize the installation and positioning of the circuit board 21 and the heat sink 22.

[0313] In other examples, the positioning part and the positioning mating part can be a fit between a protrusion and a groove.

[0314] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the positioning part and the positioning mating part can also be a mating of a pin and a hole, a mating of a latch and a lock, or magnetic positioning, etc., and are not limited to these.

[0315] For example, referring to FIG7B, the heat-conducting plate 221 adjacent to the bottom shell 120 has a fixing area at each of its two ends in the first direction L1. The fixing area is not provided with heat sink 222, and the fixing area has a positioning part or the positioning mating part.

[0316] In a specific example, one of the positioning part or the positioning mating part can be a positioning post, and the other can be a positioning hole. A positioning post 2211 is provided on the side of the fixing area adjacent to the first functional area 214 facing the first functional area 214. The circuit board 21 and the heat-conducting plate 221 away from the bottom shell 120 have positioning holes 212 corresponding to the positioning post 2211, and the positioning post 2211 is adapted to be inserted into the positioning hole 212. That is, by cooperating with the positioning post 2211 at the end of the heat-conducting plate 221 adjacent to the bottom shell 120 and the corresponding positioning hole 212 of the circuit board 21 and the other heat-conducting plate 221, positioning is provided for the installation of the circuit board 21 and the heat sink 22.

[0317] In some examples, referring to Figure 7B, the circuit board 21 and the heat sink 22 are secured by fasteners. For instance, a first fixing hole 2221 is defined between a plurality of heat sink fins 222 of the heat sink 22, the heat-conducting plate 221 of the heat sink 22 has a second fixing hole 2212 corresponding to the first fixing hole 2221, and the circuit board 21 is defined with a corresponding mating hole 217 (as shown in Figure 8A). The circuit board 21 and the heat sink 22 are secured by fasteners that pass sequentially through the first fixing hole 2221, the mating hole 217, and the second fixing hole 2212. The number of the first fixing hole 2221, the mating hole 217, and the second fixing hole 2212 can be one or more to enhance the stability of the fixation between the circuit board 21 and the heat sink 22.

[0318] In other examples, the circuit board 21 and the heat sink 22 are fixed together by an adhesive, such as thermally conductive adhesive.

[0319] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the circuit board 21 and the heat sink 22 can also be fixed by riveting, snap-fit ​​connection, or welding, and are not limited to these methods.

[0320] There are also various ways to fix the circuit board 21 and heat sink 22 to the bottom shell 120.

[0321] In some examples, referring to Figure 7B, the circuit board 21 and the heat sink 22 are fixed to the base shell 120 by fasteners. Specifically, the positioning post 2211 has a first connecting hole 22111 that penetrates the heat-conducting plate 221 in the thickness direction of the heat-conducting plate 221. The inner surface of the base shell 120 has multiple fixing posts 123, some of which correspond to the positioning post 2211 and have a first fixing channel 1231 corresponding to the first connecting hole 22111. The circuit board 21 and the heat-conducting plate 221 are fixed to the base shell 120 by fasteners that pass through the positioning hole 212 and the first connecting hole 22111 in sequence and are fastened to the first fixing channel 1231. That is, while positioning, the positioning post 2211 can also cooperate with the corresponding fixing post 123 of the base shell 120 to fix the circuit board 21 and the heat sink 22 to the base shell 120.

[0322] In other examples, continuing to refer to Figure 7B, a second connecting hole 2213 is formed in the fixing area adjacent to the second functional area 215, penetrating the heat-conducting plate 221 in the thickness direction of the heat-conducting plate 221. The second functional area 215 forms a third connecting hole 216 corresponding to the second connecting hole 2213 (also see Figure 8A). A portion of the fixing post 123 has a second fixing channel 1232 corresponding to the second connecting hole 2213. The circuit board 21 and the heat-conducting plate 221 are fixed to the bottom shell 120 by fasteners that sequentially pass through the third connecting hole 216 and the second connecting hole 2213 and are fastened to the second fixing channel 1232. Thus, the circuit board 21 and the heat sink 22 are fixed to the bottom shell 120 through the cooperation of the second connecting hole 2213 of the heat-conducting plate 221, the third connecting hole 216 of the second functional area 215 of the circuit board 21, and the corresponding portion of the fixing post 123 of the bottom shell 120.

[0323] When the two examples above are combined, multiple fixing positions can be formed on the circuit board 21 and the heat sink 22 to enhance the stability of the connection between the circuit board 21 and the heat sink 22 and the bottom shell 120.

[0324] In other examples, the heat sink 22 and the base shell 120 can be fixed with adhesive.

[0325] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the heat sink 22 and the base shell 120 can also be fixed by riveting, snap-fit ​​connection, welding, or other methods, and are not limited to these.

[0326] For example, referring to Figure 7B, the inner side of the bottom shell 120 is provided with a reinforcing member 125 extending toward the heat sink 22. The reinforcing member 125 is connected to a plurality of fixing posts 123 to improve the strength and stability of the fixing posts 123.

[0327] In some examples, referring to Figure 7B, the reinforcing member 125 of the bottom shell 120 includes a reinforcing connecting plate 1251 and a reinforcing side plate 1252 connected to the outer side of the reinforcing connecting plate 1251 in the first direction L1. Thus, the reinforcing connecting plate 1251 connects the plurality of fixing posts 123 distributed on the second square L2, enhancing the stability of the fixing posts 123. The outer side of the reinforcing connecting plate 1251 in the first direction L1 refers to the side of the reinforcing connecting plate 1251 opposite to its center in the first direction L1.

[0328] For example, referring to Figure 7B, the reinforcing connecting plate 1251 may include a connecting segment 12511 and a reinforcing segment 12512. The connecting segment 12511 connects between two adjacent fixing posts 123 in the second direction L2, and the reinforcing segment 12512 connects to the outside of the fixing posts 123 distributed in the second direction L2. In this way, the reinforcing connecting plate 1251 is reinforced by the reinforcing side plate 1252, which improves the strength and stability of the reinforcing member 125. The reinforcing connecting plate 1251 and the reinforcing side plate 1252 provide support for the heat-conducting plate 221 of the heat sink 22, ensuring the overall stability of the bottom shell 120, the heat sink 22, and the circuit board 21.

[0329] In some examples, the reinforcing member 125 and the fixing post 123 can be integrally formed with the bottom shell 120 to improve structural strength and assembly efficiency.

[0330] In other examples, the reinforcement 125 and the fixing post 123 may be designed separately from the bottom shell 120, for example, by welding or fasteners, and are not limited to this.

[0331] In related technologies, a separate power supply module is used to power the circuit board of the computing device. The power supply module provides voltage within a preset range to the circuit board through voltage regulation, meeting the circuit board's operating requirements. However, the addition of a power supply module increases space occupation and weight, as well as circuit complexity and cost.

[0332] The circuit board 21 of this embodiment can eliminate the need for a separate power supply module while still meeting the power requirements of the circuit board 21. The circuit board 21 of this embodiment will be described in detail below with reference to Figures 8A to 8C.

[0333] Figure 8A provides an exemplary front view of the circuit board 21 according to an embodiment of this application; Figure 8B provides an exemplary three-dimensional view of the circuit board 21 according to an embodiment of this application; and Figure 8C provides an exemplary front view of the circuit board 21 according to an embodiment of this application.

[0334] As shown in Figure 8A, the circuit board 21 of this embodiment has a chip array, an electrical connector 211, and a voltage converter 27 on its board body 210. The electrical connector 211 supplies power to the voltage converter 27, which in turn supplies power to the chip array according to a preset voltage range. The circuit board 21 connects the voltage converter 27 to the control module 10 via the electrical connector 211. The voltage converter 27 adjusts the voltage input from the control module 10 to the voltage required by the circuit board 21, thereby eliminating the need for a power supply module while meeting the power requirements of the circuit board 21.

[0335] As shown in Figure 8A and in conjunction with Figure 7B, the chip array is disposed on the first functional area 214 of the board body 210 of the circuit board 21 away from the bottom shell 120, the electrical connector 211 and the voltage converter 27 can be disposed on the second functional area 215 of the board body 210 away from the bottom shell 120.

[0336] The voltage converter 27 can be a DC-DC converter, such as a switching buck converter that converts a higher DC voltage to a lower DC voltage, an adjustable output voltage converter, or an AC-DC converter, etc., and is not limited thereto. The electrical connector 211 can be a pin header type, a header type, a USB type, etc., and is not limited thereto.

[0337] For example, the chip array includes at least two rows of chip groups 22, which are spaced apart in a second direction L2. Each row of chip groups 22 includes a plurality of computing chips 213 spaced apart in a first direction L1 to improve computing performance.

[0338] In the example shown in Figure 8A, the chip array includes two rows of chipsets 22. In other examples, the chip array may include three or more rows of chipsets 22.

[0339] In the example shown in Figure 8A, the row of chipsets 22 adjacent to the electrical connector 211 is the first chipset 23, and the row of chipsets 22 away from the electrical connector 211 is the second chipset 24. The electrical connector 211 is disposed on the first side of the first chipset 23 in the first direction L1 and is located on the side of the first chipset 23 away from the second chipset 24. That is, the electrical connector 211 is closer to the first side of the first chipset 23 in the first direction L1, which facilitates the connection between the electrical connector 211 and the chip array.

[0340] In an example where the chip array includes two rows of chip groups 22, one row of chip groups 22 adjacent to the electrical connector 211 is the first chip group 23, and the other row of chip groups 22 is the second chip group 24. In an example where the chip array includes two or more rows of chip groups 22, the row of chip groups 22 closest to the electrical connector 211 is the first chip group 23, and the row of chip groups 22 farthest from the electrical connector 211 is the second chip group 24.

[0341] As can be understood, as shown in Figures 8A and 8C, the electrical connector 211 has a power input terminal 2111 and a power ground terminal 2112. The power input terminal 2111 is connected to the second chipset 24 via a voltage converter 27, and the power ground terminal 2112 is connected to the first chipset 23. That is, the power ground terminal 2112 is connected to the first chipset 23, which is closer to it, via a power supply line L3, shortening the length of the power supply line L3 connecting the first chipset 23 and the power ground terminal 2112, and reducing the crossing of the power supply line L3 at the ground terminal with other lines.

[0342] In some examples, multiple computing chips 213 in the chip array are connected in series, meaning the entire chip array is powered in series. In other examples, the multiple computing chips 213 in the chip array can be connected in parallel or in a hybrid series-parallel configuration.

[0343] In some examples, each computing chip 213 in the chip array may have the same model number. In other examples, each computing chip 213 in the chip array may have the same size. These are merely examples and do not constitute a limitation of this application. Each computing chip 213 in the chip array may also have the same specifications or functions, etc., and is not limited thereto.

[0344] For example, the second side of the first chipset 23 in the first direction L1 is electrically connected to the second side of the second chipset 24 in the first direction L1 (see the intermediate conductive element 26 shown in FIG8A). That is, when the chip array includes two rows of chipsets 22, the second side of the first chipset 23 in the first direction L1 is directly electrically connected to the second side of the second chipset 24 in the first direction L1. When the chip array includes two or more rows of chipsets 22, the second side of the first chipset 23 in the first direction L1 is electrically connected to the second side of the second chipset 24 in the first direction L1 through the chipset 22 between the first chipset 23 and the second chipset 24, thus realizing the series connection of each computing chip 213 in the chip array.

[0345] For example, referring to Figures 8A to 8C, the first chipset 23 is connected to the power ground terminal 2112 on the first side of the first direction L1, and the second chipset 24 is connected to the voltage converter 27 on the first side of the first direction L1. That is, the ends of the first chipset 23 and the second chipset 24 on the same side of the first direction L1, i.e. the first side, serve as the ground terminal and the power supply terminal, respectively. This facilitates the arrangement of the power supply line L3 between the electrical connector 211, the voltage converter 27, and the chip array, increases the compactness of the components on the circuit board 21, and reduces the overall size of the circuit board 21.

[0346] In some examples, the electrical connections of the individual computing chips 213 in the chip array can be made using conductive components (such as conductive copper busbars) to improve current carrying capacity and reduce resistance. Furthermore, the good thermal conductivity of these conductive components helps dissipate heat from the chips.

[0347] In other examples, the electrical connections of each computing chip 213 in the chip array can be made through power supply lines provided on the board 210. This connection method occupies little space and enables miniaturization and high integration of the circuit board 21.

[0348] It should be noted that this is merely an example and does not constitute a limitation on this application. Those skilled in the art will understand that the electrical connections of each computing chip 213 can also be made by combining conductive parts and power supply lines, and are not limited to this.

[0349] In a specific example, as shown in Figure 8A, the electrical connections of each computing chip 213 in the chip array are made through conductive elements. The board body 210 is provided with at least two conductive bars 25 and intermediate conductive elements 26. The at least two conductive bars 25 correspond one-to-one with at least two rows of chip groups 22. One conductive bar 25 is connected to multiple computing chips 213 in the corresponding row of chip groups 22. The intermediate conductive elements 26 are connected between at least two rows of chip groups 22. That is, each computing chip 213 in the chip group 22 is connected in series through the conductive bars 25, and the computing chips 213 between chip groups 22 are connected in series through the intermediate conductive elements 26.

[0350] In some examples, the conductive busbar 25 and the intermediate conductive element 26 can be integrally formed. In other examples, the conductive busbar 25 and the intermediate conductive element 26 are separate components. In the examples where the conductive busbar 25 and the intermediate conductive element 26 are separate, the conductive busbar 25 and the intermediate conductive element 26 may each include an integrally formed conductive sheet or include multiple conductive sheets. In the examples where the conductive busbar 25 includes multiple conductive sheets, and / or the intermediate conductive element 26 includes multiple conductive sheets, power supply lines can be provided in the gap areas between the multiple conductive sheets on the plate 210 to connect the multiple conductive sheets.

[0351] The conductive busbar 25, the intermediate conductive component 26 and the plate 210 can be fixed by welding, fasteners or other means, and are not limited to these.

[0352] In some examples, as shown in Figure 8C, the voltage converter 27 is connected to the busbar 25 via a power supply line, and the power ground terminal 2112 of the electrical connector 211 is connected to the busbar 25 via a power supply line L3, thereby realizing the electrical connection between the chip array and the voltage converter 27 and the electrical connector 211. In other examples, the power ground terminal 2112 of the voltage converter 27 and the electrical connector 211 are directly connected to each computing chip 213 of the chip array via the power supply line L3.

[0353] In a specific example, as shown in Figures 8A and 8C, a conductive bus 25 of the plurality of computing chips 213 connected to the first chipset 23 of the chip array is a first conductive bus 251, and a conductive bus 25 of the plurality of computing chips 213 connected to the second chipset 24 of the chip array is a second conductive bus 252. The second conductive bus 252 has a power supply input terminal 253 located on a first side of the second chipset 24 in the first direction L1, and the first conductive bus 251 has a power supply output terminal 254 located on a first side of the first chipset 23 in the first direction L1. The power supply input terminal 253 of the second conductive bus 252 is connected to a voltage converter 27, and the power supply output terminal 254 of the second conductive bus 252 is connected to the power ground terminal 2112 of the electrical connector 211.

[0354] For example, referring to Figure 8A, the intermediate conductive element 26 is disposed on the second side of at least two rows of chipsets 22 in the first direction L1 and connected between the at least two rows of chipsets 22, thereby connecting the second sides of each chipset 22 in series in the first direction L1. At the same time, the intermediate conductive element 26 is arranged separately from the electrical connector 211 and voltage converter 27 on the first side of the first direction L1, making the layout more reasonable and making full use of the space of the board 210.

[0355] For example, as shown in FIG8C, the electrical connector 211 has a signal connection end 2113, which is connected to the chip array. Through the electrical connector 211, the control module and the computing chip 213 of the chip array transmit data, so as to realize the computing chip 213 to perform calculation, analysis and other processing on the data and feedback of the data processing results.

[0356] For example, referring to FIG8C, the power ground terminal 2112, power input terminal 2111 and signal connection terminal 2113 of the electrical connector 211 are arranged in the first direction L1 to facilitate the electrical connection between the electrical connector 211 and the voltage converter 27 and the chip array.

[0357] In the example shown in Figure 8C, the electrical connector 211 can be a long strip extending along the first direction L1. The electrical connector 211 has two rows of sockets spaced apart along the second direction L2. The two rows of sockets extend along the first direction L1 respectively, and the two rows of pinholes define a power ground terminal 2112, a power input terminal 2111 and a signal connection terminal 2113 arranged sequentially along the first direction L1.

[0358] In other examples, the electrical connector 211 may be a strip extending along the second direction L2, and the electrical connector 211 may be a pin-type or a header-type.

[0359] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the electrical connector 211 can also be a regular shape such as a circle or rectangle, or an irregular shape, and is not limited thereto. The connection method of the electrical connector 211 can also be USB, and is not limited thereto.

[0360] For example, as shown in Figure 8C, the signal connection terminal 2113 is connected to the side of the first chipset 23 of the chip array away from the second chipset 24 via the signal line L4, and is connected to the computing chip 213 in the first chipset 23 that is closest to the signal connection terminal 2113. On the one hand, this allows the signal line L4 to avoid the power supply line L3 that connects the first chipset 23 to the power ground terminal 2112, thereby avoiding interference from grounding noise and ensuring the reliability and stability of the signal. On the other hand, it can shorten the length of the signal line L4, reduce signal delay, and simplify wiring design.

[0361] For example, signal line L4 connects computing chip 213 to a computing chip 213 on a first side in the second direction L2, and further connects computing chip 213 to an adjacent computing chip 213 on a second side in the second direction L2, so as to connect the computing chips 213 in the first chipset 23 and the second chipset 24 in series. Referring to Figures 8A and 8C, in the first chipset 23, signal line L4 connects the computing chip 213 from the upper side (i.e., the side of the second direction L2 away from the second chipset 24) to the rightmost computing chip 213 (i.e., the computing chip 213 closest to the signal connection terminal 2113), from the lower side (i.e., the other side in the second direction L2) to the adjacent computing chip 213 on the left, and then from the upper side of the left computing chip 213 to the next computing chip 213 on the left, and so on, so that signal line L4 connects the computing chips 213 in the first chipset 23 in series. The computing chip 213 at the end of the first chipset 23 (i.e., the leftmost computing chip 213) is then connected to the computing chip 213 in the second chipset 24, and each computing chip 213 in the second chipset 24 is then connected in sequence, thus connecting the second chipset 24 and the first chipset 23 in series.

[0362] In some examples, the computing chip 213 farthest from the signal connection terminal 2113 in the first chipset 23 is signal-connected to the computing chip 213 farthest from the signal connection terminal 2113 in the second chipset 24. That is, the signal line L4 in the first chipset 23 is transmitted from the nearest computing chip 213 to the farthest computing chip 213, and then from the farthest computing chip 213 to the computing chip 213 closest to the farthest computing chip 213 in the second chipset 24, so as to shorten the signal line L4. Referring to Figures 8A and 8C, the signal line L4 starts from the rightmost computing chip 213 in the first chipset 23, and is transmitted sequentially to each computing chip 213 on the left, then from the leftmost computing chip 213 to the leftmost computing chip 213 in the second chipset 24, and then sequentially to each computing chip 213 on the right, completing the signal transmission between the first chipset 23 and the second chipset 24.

[0363] In other examples, signal line L4 can be transmitted from a computing chip 213 located in the middle of the first chipset 23, and then sequentially transmitted to adjacent computing chips 213 and computing chips 213 in the second chipset 24.

[0364] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the transmission path of signal line L4 is not limited to the above examples. For example, signal line L4 may first pass through the second chipset 24 and then be transmitted to the first chipset 23, and then be transmitted sequentially from the computing chip 213 of the second chipset 24 to other computing chips 213 at the signal connection terminal 2113. It is not limited to this.

[0365] In some examples, the number of chips in each row of chipsets is odd. Specifically, the number of computing chips 213 in the first chipset 23 can be odd. When the number of computing chips 213 in the first chipset 23 is odd, when the signal line L4 is transmitted to the leftmost computing chip 213 of the first chipset 23, it can be led out from the lower side of the computing chip 213 (i.e., the side of the computing chip 213 closer to the second chipset 24 in the second direction L2). In this way, the signal line L4 can continue to be transmitted from the lower side of the computing chip 213 to the leftmost computing chip 213 of the second chipset 24, thereby shortening the signal line L4 and ensuring the stability of signal transmission.

[0366] In other examples, the number of computing chips 213 in the first chipset 23 can be an even number.

[0367] The total number of computing chips 213 in the chip array can be determined based on the computing power required by the circuit board 21. Furthermore, the number of computing chips 213 in the first chipset 23 and the number of computing chips 213 in the second chipset 24 can be determined based on the component layout design requirements of the circuit board 21. The number of computing chips 213 in the second chipset 24 can be odd or even; this embodiment does not limit this number.

[0368] In some examples, the number of chips in each row of the chip array may not be exactly the same. Specifically, the number of computing chips 213 in the first chip group 23 is greater than the number of computing chips 213 in the second chip group 24. That is, the first chip group 23, which is closer to the signal connection terminal 2113, has more computing chips 213, while the second chip group 24, which is relatively farther from the signal connection terminal 2113, has fewer computing chips 213. This is to ensure that the signal can be transmitted to more computing chips 213 in the same amount of time, thereby improving signal transmission efficiency.

[0369] In other examples, the number of computing chips 213 in the first chipset 23 may be the same as the number of computing chips 213 in the second chipset 24.

[0370] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the number of computing chips 213 in the first chipset 23 may also be less than the number of computing chips 213 in the second chipset 24.

[0371] In some examples, the spacing between adjacent chips in at least one row of chipsets has at least two different spacings. Specifically, in the second chipset 24, the spacing between two adjacent computing chips 213 is greater than the spacing between other adjacent computing chips 213. For example, referring to FIG8A, the spacing between adjacent computing chips 213 on the first side adjacent to the first direction L1 in the second chipset 24 is greater than the spacing between adjacent computing chips 213 on the second side adjacent to the first direction L1, that is, the spacing between adjacent computing chips 213 on the right side of the second chipset 24 is greater than the spacing between adjacent computing chips 213 on the left side.

[0372] Understandably, when the board 210 reserves the same arrangement space for the first chipset 23 and the second chipset 24, if the number of computing chips 213 in the first chipset 23 is greater than the number of computing chips 213 in the second chipset 24, it is equivalent to reducing the number of chips in the second chipset 24, that is, removing some computing chips 213 in the second chipset 24 and increasing the spacing between some adjacent computing chips 213.

[0373] In the example shown in Figure 8A, the spacing between adjacent computing chips 213 in the middle region of the second chipset 24 is greater than the spacing between adjacent computing chips 213 on both sides. This can be understood as follows: if two computing chips 213 are removed from the middle region of the second chipset 24, the spacing between adjacent computing chips 213 in the remaining middle region is equivalent to twice the spacing between other adjacent computing chips 213 and the sum of the sizes of the two computing chips 213 themselves.

[0374] It should be noted that the above is merely illustrative and does not constitute a limitation on this application. Those skilled in the art will understand that the spacing between two adjacent computing chips 213 in the second chipset 24 may be uniform or partially uniform, and is not limited to this.

[0375] For example, as shown in FIG8A, a clearance notch 2201 is formed on the side of the board body 210 adjacent to the first chipset 23 in the second direction L2, and the clearance notch 2201 extends from the second side of the board body 210 in the first direction L1 toward the side adjacent to the electrical connector 211.

[0376] For example, the extension dimension of the board 210 in the first direction L1 is greater than the extension dimension of the board 210 in the second direction L2. The ratio of the extension dimension of the board 210 in the first direction L1 to the extension dimension of the board 210 in the second direction L2 can be set according to the actual design requirements of the computing device. For example, the ratio of the extension dimension of the board 210 in the first direction L1 to the extension dimension of the board 210 in the second direction L2 can fall within the range of 1.5:1 to 3.5:1, that is, the length and width dimensions of the board 210 meet the aforementioned ratio range, providing suitable space for the arrangement of chip arrays and other electronic components to match the performance and size requirements of the computing device.

[0377] Understandably, different electronic components require different operating voltages. When the computing device uses other electronic components, such as the control module, to power the circuit board 21, it needs to use the voltage converter 27 to convert the output voltage of the control module into the voltage required by the circuit board 21.

[0378] As exemplarily shown in Figure 8A, the voltage converter 27 includes a voltage regulation module, which comprises a voltage control chip, an input voltage switching element 271, and an output voltage switching element 272. The voltage control chip controls the on / off states of the input voltage switching element 271 and the output voltage switching element 272 according to a preset voltage range. The voltage control chip can monitor the output voltage of the voltage converter 27 in real time to determine whether the actual output voltage is within the preset voltage range. If the output voltage of the voltage converter 27 does not fall within the preset voltage range, the voltage control chip will adjust the on / off times of the input voltage switching element 271 and the output voltage switching element 272 to stabilize the output voltage of the voltage converter 27 and bring it within the preset voltage range, thus meeting the operating requirements of the chip array.

[0379] In some examples, the input voltage switching element 271 and the output voltage switching element 272 can be metal-oxide-semiconductor field-effect transistors, that is, the input voltage switching element 271 is a high-side MOS (Metal Oxide Semiconductor) field-effect transistor and the output voltage switching element 272 is a low-side MOS field-effect transistor, so as to reduce the on-resistance and improve the efficiency of the voltage converter 27.

[0380] In other examples, the input voltage switching element 271 can be an insulated gate bipolar transistor (IGBT) or a bipolar junction transistor (BJT), and the output voltage switching element 272 can be a freewheeling diode, but is not limited to these.

[0381] Understandably, the signal connection terminal 2113 of the electrical connector 211 can output two signals. One signal is transmitted to the chip array, enabling the computing chip 213 to perform calculations and analysis. The other signal is transmitted to the voltage control chip, enabling the voltage control chip to control the input voltage switching element 271 and the output voltage switching element 272.

[0382] For example, the voltage control chip may include a main voltage control chip 273 and a secondary voltage control chip 274. The main voltage control chip 273 is responsible for generating pulse width modulation (PWM) signals to control the on and off states of the input voltage switching element 271 and the output voltage switching element 272. The secondary voltage control chip 274 may include a startup circuit, a bias power supply, and protection circuits to provide auxiliary power management and a stable power supply for the main voltage control chip 273 and other auxiliary circuits.

[0383] The voltage regulation module also includes a resistor element 276 and a diode 275. The resistor element 276 may include a voltage divider resistor, a current monitoring resistor, and a start-up resistor. The voltage regulation module obtains a feedback signal of the output voltage of the voltage converter 27 through the voltage divider resistor. This feedback signal is input to the error amplifier in the voltage control main chip 273, compared with a preset voltage range, and generates an error signal. This error signal is input to the PWM control circuit of the voltage control main chip 273. The PWM control circuit adjusts the duty cycle of the PWM based on the error signal. The duty cycle determines the on-time and off-time of the input voltage switching element 271 and the output voltage switching element 272 to adjust the output voltage of the voltage converter 27 to the preset voltage range. The current sensing resistor monitors the current magnitude through the voltage drop across it, providing a current sensing signal for overcurrent protection and current-mode control. The start-up resistor provides the initial start-up current for the voltage control main chip 273. The diode 275 protects components in the circuit from damage caused by overvoltage or reverse voltage.

[0384] For example, the voltage converter 27 includes a voltage regulator module, which includes an input capacitor element 277, an output capacitor element 279, and an inductor element 278. The input capacitor element 277 is connected between the power input terminal 2111 of the electrical connector 211 and the input terminal of the input voltage switch element 271. The input terminal of the inductor element 278 is connected to the output terminal of the input voltage switch element 271 and the input terminal of the output voltage switch element 272, respectively. The output terminal of the inductor element 278 is connected to the input terminal of the output capacitor element 279 and the power supply input terminal 253 of the chip array, respectively.

[0385] Input capacitor 277 filters the input voltage of electrical connector 211, reducing input voltage ripple. When input voltage switch 271 is turned on, the input voltage provides energy to the chip array and output capacitor 279 through inductor 278. Output capacitor 279 filters the output voltage, reducing output voltage ripple and providing a stable DC output to the chip array. When input voltage switch 271 is turned off and output voltage switch 272 is turned on, the energy stored in inductor 278 is released through input voltage switch 271 to maintain the output voltage. Inductor 278 is responsible for storing energy and smoothing current, reducing transient current changes, and maintaining a continuous current supply.

[0386] To facilitate understanding, the voltage regulation and stabilization process of voltage converter 27 is illustrated below with a specific example.

[0387] Referring to Figures 8A to 8C, one end of the input capacitor element 277 is connected to the power input terminal 2111 of the electrical connector 211, and the other end is connected to the drain of the input voltage switch element 271. The source of the input voltage switch element 271 is connected to the drain of the inductor element 278 and the output voltage switch element 272. The gate of the input voltage switch element 271 is connected to the PWM signal output of the voltage control chip. The source of the output voltage switch element 272 is grounded, the drain of the output voltage switch element 272 is connected to the drain of the inductor element 278, and the gate is connected to the PWM output of the voltage control chip. One end of the output capacitor element 279 is connected to the output voltage of the inductor element 278, and the other end is connected to ground. The power supply input terminal of the chip array is connected to the output voltage of the inductor element 278, and the power supply output terminal is connected to ground.

[0388] Initially, input voltage switch 271 is turned on, and output voltage switch 272 is turned off. The input voltage of connector 211 provides current to the output terminal through input capacitor 277, input voltage switch 271, and inductor 278, charging output capacitor 279 and powering the chip array. Simultaneously, the current in inductor 278 increases stepwise, storing energy. During this process, the voltage control chip monitors the output voltage of voltage converter 27, obtains the output voltage signal through feedback circuit, and compares it with a preset voltage range. When the output voltage is lower than the preset voltage range, the voltage control chip increases the duty cycle, extending the on-time of input voltage switch 271; when the output voltage is higher than the preset voltage range, the voltage control chip decreases the duty cycle, shortening the on-time of input voltage switch 271.

[0389] When the PWM signal goes low, the input voltage switch 271 turns off, and the output voltage switch 272 turns on. The energy of the inductor 278 is released through the output voltage switch 272, continuing to supply current to the output terminal, while the current in the inductor 278 gradually decreases. When the PWM signal goes high, the input voltage switch 271 turns on, and the output voltage switch 272 turns off. The input voltage is transmitted to the output terminal through the input voltage switch 271 and the inductor. The input voltage switch 271 and the output voltage switch 272 cycle on and off in this periodic manner, continuously providing a stable output voltage to the chip array and meeting the power supply requirements of the chip array.

[0390] In some examples, see Figure 8A, the inductor 278 is adjacent to the first side of the second chipset 24 of the chip array in the first direction L1, so that the inductor 278 can be connected to the power supply input terminal 253 of the second chipset 24, thus shortening the power supply line.

[0391] In some examples, referring to Figure 8A, the number of input capacitor elements 277 is at least two, and the at least two input capacitor elements 277 are connected in parallel to reduce power supply noise and ripple, thereby improving the filtering effect. At the same time, multiple input capacitor elements 277 can share the current, reducing the current load of each input capacitor element 277 and extending the life of the input capacitor elements 277.

[0392] It is understood that at least two input capacitor elements 277 are disposed on the first side of the inductor element 278 in the first direction L1, and at least two input capacitor elements 277 are spaced apart in the second direction L2, so as to facilitate the connection between the input capacitor elements 277 and the inductor element 278.

[0393] In some examples, referring to Figure 8A, the number of output capacitor elements 279 is at least two, and the at least two output capacitor elements 279 are connected in parallel to reduce power supply noise and ripple, and improve the filtering effect. Multiple output capacitor elements 279 can share the current, reduce the current load of each output capacitor element 279, and extend the life of the output capacitor elements 279.

[0394] Referring again to Figure 8A, some output capacitor elements 279 are disposed on the side of the second chip group 24 of the chip array away from the first chip group 23 and on the second side of the inductor element 278 in the first direction L1. Other output capacitor elements 279 are disposed on the side of the inductor element 278 in the second direction L2 adjacent to the first chip group 23, so as to better utilize the space of the circuit board 21.

[0395] In some examples, the number of output voltage switching elements 272 is at least two, and the at least two output voltage switching elements 272 are connected in parallel to reduce conduction losses, reduce the current load of each output voltage switching element 272, thereby reducing the power consumption and heat generation of each output voltage switching element 272, providing a certain degree of redundancy protection, and improving the efficiency and reliability of the voltage converter 27.

[0396] In some examples, referring to Figure 8A, the input voltage switching element 271 and the output voltage switching element 272 are disposed in the area defined between the input capacitor element 277, the inductor element 278, the output capacitor element 279 and the voltage control chip. The distribution of each element is more concentrated, which facilitates the connection of each element and improves the space utilization of the circuit board 21.

[0397] In other examples, the input capacitor element 277, the output capacitor element 279, the input voltage switch element 271, and the output voltage switch element 272 can be freely distributed within the right side region of the plate 210 (the first side region in the first direction L1).

[0398] It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art will understand that the distribution of the above-mentioned components may also be in the upper or lower regions of the plate 210, and is not limited thereto.

[0399] Other configurations of the computing device 100 in the above exemplary embodiments may employ various technical solutions now and in the future known to those skilled in the art, and will not be described in detail here.

[0400] As will be understood by those skilled in the art, the above examples can be combined in any way to achieve specific design requirements and functions without departing from the spirit or scope of this application.

[0401] In the description of this specification, it should be understood that the terms "length", "upper", "lower", "front", "rear", "left", "right", "vertical", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0402] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0403] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" can refer to electrical connection or communication; they can be direct connection or indirect connection through an intermediate medium; they can refer to the internal connection of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0404] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0405] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0406] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A fan device, characterized in that, include: A housing defining an air outlet duct, the housing having a bracket defining a slot; A fan module is housed in the slot, and the fan module generates airflow along the air duct during operation.

2. The fan device according to claim 1, characterized in that, The bracket is installed inside the air duct.

3. The fan device according to claim 1, characterized in that, The bracket is located near the air inlet of the air duct, and the impeller rotation plane of the fan module is parallel to the cross-section of the air inlet.

4. The fan device according to claim 1, characterized in that, The housing has an air inlet plate with an air inlet, and the bracket is disposed inside the housing on the side near the air inlet plate.

5. The fan device according to claim 1, characterized in that, The housing includes a bottom shell and a cover disposed on the bottom shell, the bottom shell and the cover defining the air duct; the cover has the support or the bottom shell has the support.

6. The fan device according to claim 5, characterized in that, The cover has a top plate, the bottom cover has a bottom plate, and the top plate and the bottom plate are vertically opposite each other; The bracket extends from the inner wall surface of the top plate toward the bottom plate, or the bracket extends from the inner wall surface of the bottom plate toward the top plate.

7. The fan device according to claim 1, characterized in that, The bracket includes at least two partitions, which are spaced apart in a first direction, and adjacent two partitions define the slot. Wherein, the first direction is parallel to the bottom plate of the housing and parallel to the impeller rotation plane of the fan module.

8. The fan device according to claim 6, characterized in that, The support includes at least two partitions, which extend from the inner wall surface of the top plate toward the bottom plate, or the partitions extend from the inner wall surface of the bottom plate toward the top plate.

9. The fan device according to claim 6, characterized in that, Two adjacent partitions define two first walls of the slot, and the area of ​​the top plate or the bottom plate located between the two adjacent partitions defines a second wall of the slot.

10. The fan device according to claim 1, characterized in that, The bracket includes at least two partitions, with two adjacent partitions defining the card slot inlet, which is used for the fan module to be inserted into the card slot.

11. The fan device according to claim 1, characterized in that, The bracket also includes a baffle, which is disposed on the side of the slot in the second direction and is used to abut against the fan module in the second direction; The second direction is parallel to the bottom plate of the housing and perpendicular to the impeller rotation plane of the fan module.

12. The fan device according to claim 1, characterized in that, The baffle of the bracket is connected between the sides of two adjacent partitions of the bracket in the second direction.

13. The fan device according to claim 1, characterized in that, The bracket has a baffle with ventilation openings.

14. The fan device according to claim 11, characterized in that, The card slot is provided with baffles on opposite sides in the second direction.

15. The fan device according to claim 1, characterized in that, The number of fan modules is at least two, the number of partitions of the bracket is at least three, the at least three partitions define at least two slots, and the at least two fan modules correspond one-to-one with the at least two slots.

16. The fan device according to claim 1, characterized in that, It also includes a flexible protective component, which is disposed on the outer peripheral wall of the fan module where airflow does not pass.

17. The fan device according to claim 16, characterized in that, The portion of the flexible protective component located between the fan module and the slot abuts against the inner wall of the slot, thereby securing the fan module within the slot.

18. The fan device according to claim 17, characterized in that, The flexible protective component includes two first protective sections opposite each other in a first direction and two second protective sections opposite each other in a vertical direction. The two first protective sections abut against the two first walls of the slot, and one of the second protective sections abuts against the second wall of the slot.

19. The fan device according to claim 1, characterized in that, The top plate of the housing has a guide extending toward the bottom shell, and the bottom plate of the bottom shell has a guide fitting that mates with the guide.

20. The fan device according to claim 19, characterized in that, The guide is disposed on the first side of the bracket in the second direction.

21. The fan device according to claim 20, characterized in that, The guide is disposed on the first side of the partition of the bracket in the second direction, and the guide is connected to the corresponding partition and the baffle of the bracket through a connecting plate.

22. The fan device according to claim 1, characterized in that, The fan module has a wire-clamping notch for securing the connecting wires of the fan module.

23. The fan device according to claim 22, characterized in that, The notch for securing the wire is located at the end of the top plate of the fan module away from the housing, adjacent to the first side of the fan module in the second direction.

24. The fan device according to claim 1, characterized in that, The air duct has an air inlet and an air outlet, and the housing cover or the bottom shell of the housing defines the air inlet and the air outlet.

25. The fan device according to claim 24, characterized in that, The cover or the bottom shell has an air inlet plate and an air outlet plate, the air inlet plate forming the air inlet, and the air outlet plate forming the air outlet.

26. The fan device according to claim 24, characterized in that, The air inlet and the air outlet are distributed in a second direction, with the air outlet adjacent to the first side of the bracket in the second direction and the air inlet adjacent to the second side of the bracket in the second direction.

27. The fan device according to claim 25, characterized in that, The distance between the air inlet and the second side of the bracket in the second direction is less than the distance between the air outlet and the first side of the bracket in the second direction.

28. The fan device according to claim 1, characterized in that, It also includes a deflector plate, which is connected to the inner side of the top plate of the housing and extends from the outer side of the support in the first direction along the airflow direction.

29. The fan device according to claim 28, characterized in that, The guide vane includes multiple guide sections that are not on the same plane.

30. The fan device according to claim 28, characterized in that, Along the airflow direction, the guide vane includes a first guide section adjacent to the fan module, a second guide section extending outward from the first guide section, and a third guide section extending away from the fan module from the second guide section.

31. The fan device according to claim 6, characterized in that, The bottom shell and the cover shell are fastened together.

32. The fan device according to claim 31, characterized in that, The enclosure includes a top plate and multiple side plates, the upper ends of which are connected to multiple edges of the top plate, and the lower ends of which define an opening opposite the top plate; or, The bottom shell includes a bottom plate and a plurality of bottom side plates. The lower ends of the plurality of bottom side plates are connected to a plurality of edges of the bottom plate, and the upper ends of the plurality of bottom side plates define an opening opposite to the bottom plate.

33. The fan device according to claim 6, characterized in that, The internal enclosed area formed by the assembly of the bottom shell and the cover defines the air duct.

34. The fan device according to claim 33, characterized in that, The housing has a chamber and an opening communicating with the chamber, and the bottom shell can cover the opening to close the chamber and form the air duct.

35. The fan device according to claim 5, characterized in that, The bottom shell has a rectangular outline, and the cover shell has a rectangular outline.

36. The fan device according to claim 35, characterized in that, The adjacent sides of the bottom shell are connected by a circular arc surface, and the adjacent sides of the cover shell are connected by a circular arc surface.

37. A computing device, characterized in that, include: The fan device according to any one of claims 1 to 36; The computing module is located inside the air duct of the fan device.

38. The computing device according to claim 37, characterized in that, Along the airflow direction, the computing module is located downstream of the fan module of the fan device.

39. The computing device according to claim 37, characterized in that, The computing module is located inside the bottom shell of the fan device.

40. The computing device according to claim 37, characterized in that, It also includes a filter assembly, which is located at the air inlet of the air duct to filter the airflow passing through it.

41. The computing device according to claim 40, characterized in that, The fan device housing has an air inlet plate, and the air inlet plate forms the air intake. A receiving space is defined between the bracket of the fan device and the air inlet plate, and the filter assembly is disposed within the receiving space.

42. The computing device according to claim 41, characterized in that, The housing and the bottom shell of the fan device define an insertion port that communicates with the accommodating space, and the filter assembly is inserted into the accommodating space through the insertion port.

43. The computing device according to claim 42, characterized in that, The filter assembly includes a filter frame having an insertion end and a closed end. The insertion end is inserted into the accommodating space through the insertion port, and the closed end covers the insertion port.

44. The computing device according to claim 43, characterized in that, The closed end is engaged with the bottom shell.

45. The computing device according to claim 37, characterized in that, It also includes an air outlet guide assembly, which is disposed at the air outlet of the air duct and is used to guide the air outlet.

46. ​​The computing device according to claim 45, characterized in that, The air outlet guide assembly includes an air outlet grille, and the non-air outlet area of ​​the air outlet grille is provided with a magnetic element. The fan device housing has an air outlet plate defining the air outlet. The non-air outlet area of ​​the air outlet plate is provided with a magnetic mating member corresponding to the magnetic element. The magnetic element and the magnetic mating member are attracted and attached to each other to hold the air outlet grille plate on the air outlet plate.

47. The computing device according to claim 45, characterized in that, The air outlet grille of the air outlet guide assembly is located on the outside of the air outlet.

48. The computing device according to claim 46, characterized in that, The air outlet guide assembly also includes a decorative strip, which is disposed in the non-air outlet area of ​​the air outlet grille and is used to cover the magnetic component.

49. The computing device according to claim 37, characterized in that, It also includes a control module, which is used to send control signals to the fan module of the fan device.

50. The computing device according to claim 49, characterized in that, The control module is located inside the air duct.

51. The computing device according to claim 50, characterized in that, Along the airflow direction, the control module is located downstream of the fan module.

52. The computing device according to claim 49, characterized in that, The control module is located inside the top plate of the fan unit's housing.

53. The computing device according to claim 52, characterized in that, The control module is parallel to the top plate.

54. The computing device according to claim 37, characterized in that, It also includes a data plug that connects to the control module. The housing of the fan unit has a plug mounting portion that defines a plug mounting slot in which the data plug is snapped into the plug mounting slot.

55. The computing device according to claim 54, characterized in that, The plug mounting portion is located on the outer side of the bracket of the fan device in the first direction.

56. The computing device according to claim 54, characterized in that, The air inlet plate of the housing has an insertion hole that communicates with the plug mounting slot, the insertion hole being used for inserting a data cable to connect to the data plug.

57. The computing device according to claim 37, characterized in that, It also includes a light-emitting element, which is disposed inside the housing of the fan device, adjacent to the air outlet of the air duct.

58. The computing device according to claim 57, characterized in that, It also includes a light guide, which is disposed inside the housing and adjacent to the air outlet of the air duct. The light-emitting element is disposed on the light guide, and the light guide is snapped into the housing.

59. The computing device according to claim 58, characterized in that, The housing defines an installation space located inside the air outlet plate of the housing. The light guide is snapped into the installation space. The inner side of the air outlet plate has a first limiting portion. The end face of the light guide facing the bottom shell of the fan device abuts against the first limiting portion.

60. The computing device according to claim 37, characterized in that, It also includes a temperature sensor located near the air outlet of the air duct.

61. The computing device according to claim 60, characterized in that, The fan device housing has a second limiting part on the inner side of the air outlet plate, and the light guide has a third limiting part on the end face of the bottom shell of the fan device. The third limiting part and the second limiting part define a limiting space, and the temperature sensor is installed in the limiting space.

62. The computing device according to claim 37, characterized in that, It also includes a display screen, wherein the top plate of the fan unit's housing has a display hole, and the display screen is disposed at the display hole.

63. The computing device according to claim 62, characterized in that, The top plate has an inwardly protruding protective portion formed on the inner periphery of the display hole, and the display screen is accommodated within the space defined by the protective portion and the display hole.

64. The computing device according to claim 63, characterized in that, It also includes a transparent cover plate, which is housed within the space defined by the protective part and the display hole, and covers the outside of the display screen.

65. The computing device according to claim 62, characterized in that, It also includes a display protective element that covers the inside of the display screen.

66. The computing device according to claim 37, characterized in that, The computing module includes a circuit board, and at least a portion of at least one surface of the circuit board is provided with a heat sink.

67. The computing device according to claim 66, characterized in that, The circuit board is electrically connected to the control module, and / or the circuit board is electrically connected to the fan module of the fan device.

68. The computing device according to claim 66, characterized in that, The circuit board is a single, unjoined board.

69. The computing device according to claim 66, characterized in that, The heat dissipation component includes a heat-conducting plate and a plurality of heat sinks. At least one surface of the circuit board is covered by the heat-conducting plate, and the plurality of heat sinks are arranged at intervals on the side of the heat-conducting plate away from the circuit board.

70. The computing device according to claim 69, characterized in that, A heat dissipation channel is formed between adjacent heat sinks, and the heat dissipation channel extends along the airflow direction.

71. The computing device according to claim 69, characterized in that, The bottom shell of the fan device has a plurality of guide fittings spaced apart in a first direction, and the heat-conducting plate and the circuit board are respectively formed with avoidance notches to avoid the plurality of guide fittings.

72. The computing device according to claim 71, characterized in that, The guide fitting has a reinforcing plate on the side adjacent to the clearance notch in the second direction, and the reinforcing plate abuts against the clearance notch.

73. The computing device according to claim 66, characterized in that, The surface of the circuit board away from the bottom shell of the fan device has a first functional area, in which multiple computing chips are disposed, and the heat sink is covered.

74. The computing device according to claim 73, characterized in that, The surface of the circuit board away from the bottom shell of the fan device has a second functional area, which is adjacent to the first functional area in a first direction. The second functional area is provided with an electrical connector for connecting to the control module.

75. The computing device according to claim 74, characterized in that, The second functional area is covered by a heat sink, or the second functional area is not covered by the heat sink.

76. The computing device according to claim 74, characterized in that, The heat sink covering the first functional area has a first heat sink area away from the second functional area and a second heat sink area adjacent to the second functional area. The height dimension of the heat sink fin of the heat sink in the second heat sink area extending away from the bottom shell is smaller than the height dimension of the heat sink fin of the heat sink in the first heat sink area extending away from the bottom shell.

77. The computing device according to claim 76, characterized in that, The control module is located on the side of the second heat dissipation area and the second functional area that is away from the bottom shell.

78. The computing device according to claim 74, characterized in that, The control module is provided with a connection mating part that corresponds to and is connected to the electrical connector in the second functional area.

79. The computing device according to claim 78, characterized in that, One of the electrical connectors and the connecting mating part is a pin, and the other is a socket.

80. The computing device according to claim 66, characterized in that, There are two heat sinks, one of which covers the surface of the circuit board facing the fan assembly, and the other covers the surface of the circuit board facing the bottom of the fan assembly.

81. The computing device according to claim 66, characterized in that, One of the heat-conducting plates of the heat sink and the circuit board has a positioning part, and the other has a positioning mating part, and the positioning part and the positioning mating part are connected in a mating connection.

82. The computing device according to claim 81, characterized in that, The heat-conducting plate adjacent to the bottom shell has a fixing area at each of its two ends in the first direction. The fixing area is not provided with heat sinks, and the fixing area has the positioning part or the positioning mating part.

83. The computing device according to claim 82, characterized in that, One of the positioning part and the positioning mating part is a positioning post, and the other is a positioning hole; A positioning post is provided on the side of the fixing area of ​​the first functional area adjacent to the first functional area of ​​the circuit board. The circuit board and the heat-conducting plate away from the bottom shell have positioning holes corresponding to the positioning post. The positioning post is adapted to be inserted into the positioning hole.

84. The computing device according to claim 83, characterized in that, The positioning post has a first connecting hole that penetrates the heat-conducting plate in the thickness direction of the heat-conducting plate; The inner surface of the bottom shell has multiple fixing posts, some of which correspond to the positioning posts and have a first fixing channel corresponding to the first connecting hole. The circuit board and the heat-conducting plate are fixed to the bottom shell by fasteners that pass through the positioning hole and the first connecting hole in sequence and are fastened to the first fixing channel.

85. The computing device according to claim 84, characterized in that, The fixing area adjacent to the second functional area of ​​the circuit board has a second connecting hole that penetrates the heat-conducting plate in the thickness direction of the heat-conducting plate, and the second functional area has a third connecting hole corresponding to the second connecting hole; Some of the fixing posts have a second fixing channel corresponding to the second connecting hole, and the circuit board and the heat-conducting plate are fixed to the bottom shell by fasteners that pass through the third connecting hole and the second connecting hole in sequence and are fastened to the second fixing channel.

86. The computing device according to claim 84 or 85, characterized in that, The inner side of the bottom shell is provided with a reinforcing member extending toward the heat dissipation component, and the reinforcing member is connected to a plurality of the fixing posts.

87. The computing device according to claim 86, characterized in that, The reinforcing member includes a reinforcing connecting plate and a reinforcing side plate connected to the outer side of the reinforcing connecting plate in a first direction. The reinforcing connecting plate includes a connecting section and a reinforcing section. The connecting section connects between two adjacent fixed posts in a second direction, and the reinforcing section connects to the outer side of the fixed post located on the outer side.

88. The computing device according to claim 37, characterized in that, The circuit board of the computing module is provided with a voltage converter and an electrical connector. The electrical connector is used to supply power to the voltage converter, and the voltage converter is used to supply power to the chip array according to a preset voltage range.

89. The computing device according to claim 88, characterized in that, The circuit board of the computing module has a chip array, which includes at least two rows of chip groups. The at least two rows of chip groups are arranged at intervals in a second direction, and each row of chip groups includes a plurality of computing chips arranged at intervals in a first direction.

90. The computing device according to claim 89, characterized in that, The number of chips in each row of chipsets is not exactly the same.

91. The computing device according to claim 89, characterized in that, The number of chips in each row of chipsets is odd.

92. The computing device according to claim 89, characterized in that, In at least one row of chips, the spacing between adjacent chips has at least two different pitches.

93. The computing device according to claim 37, characterized in that, The extension dimension of the circuit board of the computing module in the first direction is greater than the extension dimension of the circuit board in the second direction.

94. The computing device according to claim 93, characterized in that, The ratio of the extension dimension of the plate in the first direction to the extension dimension of the plate in the second direction ranges from 1.5:1 to 3.5:

1.

95. The computing device according to claim 89, characterized in that, The circuit board of the computing module is provided with an electrical connector. A row of chipsets adjacent to the electrical connector is a first chipset, and a row of chipsets away from the electrical connector is a second chipset. The electrical connector is located on a first side of the first chipset in a first direction and on the side of the first chipset away from the second chipset.

96. The computing device according to claim 95, characterized in that, The electrical connector has a power input terminal and a power ground terminal. The power input terminal is connected to the second chipset via a voltage converter, and the power ground terminal is connected to the first chipset. Multiple computing chips in the chip array are connected in series.

97. The computing device according to claim 96, characterized in that, The first chipset is electrically connected to the second side of the second chipset in the first direction, the first side of the first chipset in the first direction is connected to the power ground terminal, and the second chipset in the first direction is connected to the voltage converter.

98. The computing device according to claim 89, characterized in that, The electrical connector has a signal connection end, which is connected to the chip array.

99. The computing device according to claim 98, characterized in that, The signal connection terminal is connected via a signal line to the side of the first chip group of the chip array that is away from the second chip group, and is connected to the computing chip in the first chip group that is closest to the signal connection terminal.

100. The computing device according to claim 99, characterized in that, The signal line is connected to the computing chip on one side in the second direction, and connected to an adjacent computing chip on the other side in the second direction.

101. The computing device according to claim 100, characterized in that, The computing chip in the first chipset that is furthest from the signal connection terminal is connected to the computing chip in the second chipset that is closest to the computing chip.

102. The computing device according to claim 101, characterized in that, The number of computing chips in the first chipset of the chip array is odd.

103. The computing device according to claim 88, characterized in that, The voltage converter includes a voltage regulation module, which includes a voltage control chip, an input voltage switching element, and an output voltage switching element. The voltage control chip is used to control the on / off state of the input voltage switching element and the output voltage switching element according to a preset voltage range.

104. The computing device according to claim 103, characterized in that, The input voltage switching element and the output voltage switching element are metal-oxide-semiconductor field-effect transistors.

105. The computing device according to claim 103, characterized in that, The voltage converter includes a voltage regulator module, which includes an input capacitor, an output capacitor, and an inductor. The input capacitor is connected between the power input terminal of the electrical connector and the input terminal of the input voltage switch element. The input terminal of the inductor is connected to the output terminal of the input voltage switch and the input terminal of the output voltage switch, respectively. The output terminal of the inductor is connected to the input terminal of the output capacitor and the power supply input terminal of the chip array, respectively.

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