Control module for computing device, and computing device

Abstract

A control module for a computing device, and a computing device. The computing device comprises a housing assembly. The control module comprises: a control box inside which a mounting cavity is defined, the control box being detachably mounted on the housing assembly; and a control circuit board, which is arranged in the mounting cavity, the control circuit board being configured to be electrically connected to a computing module and a power module in the housing assembly. In the present application, the control circuit board is decoupled from other modules of the computing device, thereby achieving the modular configuration of the control module, and improving the scalability of the computing device; in addition, physically isolating the control module from the other modules of the computing device can eliminate adverse effects caused by heat generation of the computing module on the control circuit board, thereby facilitating stable operation of the computing device, reducing the space occupied inside the housing assembly, and helping to improve the integration level of the computing device.

Description

Control module for computing devices and computing devices

[0001] This application claims priority to Chinese Patent Application No. 2025200285207, filed on January 6, 2025, entitled "Control Module for Computing Device and Computing Device", the entire contents of which are incorporated herein by reference.

[0002] This application claims priority to Chinese Patent Application No. 2025200253742, filed on January 6, 2025, entitled “Housing Assembly for Computing Device and Computing Device”, the entire contents of which are incorporated herein by reference.

[0003] This application claims priority to Chinese Patent Application No. 2025200285512, filed on January 6, 2025, entitled “Computing Module and Computing Device”, the entire contents of which are incorporated herein by reference.

[0004] This application claims priority to Chinese Patent Application No. 2025100192616, entitled "Computing Device", filed on January 6, 2025, the entire contents of which are incorporated herein by reference.

[0005] This application claims priority to Chinese Patent Application No. 2025200256577, filed on January 6, 2025, entitled “Computing Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0006] This application relates to the field of computing device technology, and in particular to a control module for a computing device and a computing device. Background Technology

[0007] In related technologies, the control circuit board and other functional modules of a computing device are integrated together inside the housing. Due to the limited space inside the computing device housing, the control circuit board occupies installation space for other modules, reducing the internal space utilization rate and limiting the device's expandability. Furthermore, it leads to heat accumulation inside the device, reducing heat dissipation efficiency. In high-performance computing devices, heat accumulation can cause excessively high component temperatures, affecting the performance and lifespan of the computing device. Summary of the Invention

[0008] This application provides a control module for a computing device and a computing device to solve or alleviate one or more technical problems in the prior art.

[0009] As one aspect of the embodiments of this application, this application provides a control module for a computing device. The computing device includes a housing assembly, and the control module includes: a control box with an internally defined mounting cavity, the control box being detachably mounted on the housing assembly; and a control circuit board disposed within the mounting cavity, the control circuit board being used for electrical connection with a computing module and a power module within the housing assembly.

[0010] In one embodiment, the control box includes a housing and a side cover, the housing defining a mounting cavity and a lateral opening communicating with the mounting cavity, and the side cover being detachably mounted to the lateral opening.

[0011] In one embodiment, a through-hole is provided on the side cover plate for the power module cable to pass through and be electrically connected to the control circuit board.

[0012] In one embodiment, the computing device further includes a fan disposed on the housing assembly, the end of the fan having a snap-fit ​​protrusion; a snap-fit ​​hole is also provided on the side cover plate, the shape of the snap-fit ​​hole being adapted to the shape of the snap-fit ​​protrusion, the snap-fit ​​hole being used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

[0013] In one embodiment, the side cover plate has a recessed portion formed in a direction toward the mounting cavity, the recessed portion defining a cable storage groove, and both a cable passage hole and a snap-fit ​​hole are provided in the recessed portion.

[0014] In one embodiment, a snap-fit ​​hole is provided on one side of the housing assembly adjacent to the control box, and a snap-fit ​​protrusion is provided on one side of the side cover plate adjacent to the housing assembly, the snap-fit ​​protrusion being used to form a snap-fit ​​engagement with the snap-fit ​​hole; or, a snap-fit ​​protrusion is provided on one side of the housing assembly adjacent to the control box, and a snap-fit ​​hole is provided on the side cover plate, the snap-fit ​​hole being used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

[0015] In one embodiment, the housing includes an upper shell and a lower shell, with the bottom of the upper shell connected to the top of the lower shell; wherein the upper shell is made of a transparent material.

[0016] In one embodiment, the control module further includes a display screen, which is disposed within the mounting cavity and electrically connected to the control circuit board, with the display area of ​​the display screen facing the upper shell.

[0017] In one embodiment, the upper shell and the lower shell are manufactured by an integral molding process.

[0018] In one embodiment, the outer wall of the control box is provided with a snap-fit ​​part, which is correspondingly provided with a snap-fit ​​part on the cover side plate of the housing assembly.

[0019] In one embodiment, the snap-fit ​​portion is a protruding structure and the snap-fit ​​mating portion is a groove structure; or, the snap-fit ​​portion is a groove structure and the snap-fit ​​mating portion is a protruding structure.

[0020] In one embodiment, the control module further includes a communication module electrically connected to the control circuit board; a mounting through hole is provided at the bottom of the control box for mounting the communication module.

[0021] As another aspect of the embodiments of this application, the embodiments of this application also provide a computing device, including: a housing assembly for integrating and mounting a computing module and a power module; and a control module for the computing device according to any of the above embodiments, which is detachably mounted on the housing assembly and electrically connected to the computing module and the power module.

[0022] According to the control module of this application embodiment, by providing a control box for mounting the control circuit board, and the control box being detachably mounted on the housing assembly, the control circuit board can be decoupled from other modules of the computing device, realizing the modular setting of the control module. This is beneficial for subsequent maintenance and upgrades by users according to their needs, and improves the scalability of the computing device. On the other hand, it achieves physical isolation between the control module and other modules of the computing device, which can prevent the heat generated by the computing module from adversely affecting the control circuit board, thus improving the stability of the computing device's operation. Furthermore, it reduces the space occupied inside the housing assembly, thereby reducing the overall size of the housing assembly and improving the integration of the computing device.

[0023] The above overview is for illustrative purposes only and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of this application will become readily apparent from the accompanying drawings and the following detailed description. Attached Figure Description

[0024] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the various drawings denote the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings depict only some embodiments disclosed in this application and should not be construed as limiting the scope of this application.

[0025] Figure 1 is an exploded view of the control module provided as an example of an embodiment of this application.

[0026] Figure 2 is a three-dimensional structural diagram of a computing device that exemplarily provides an embodiment of this application.

[0027] Figure 3 is an exemplary assembly diagram of the control module and housing assembly of a computing device according to an embodiment of this application.

[0028] Figure 4 is an exploded view of the computing device provided as an example of this application after the outer casing has been removed.

[0029] Figure 5 is an exploded structural diagram of a computing device that exemplarily provides an embodiment of this application.

[0030] Figure 6A is a three-dimensional structural diagram of a computing device that exemplarily provides an embodiment of this application, viewed from one perspective.

[0031] Figure 6B is a three-dimensional structural diagram of a computing device that exemplarily provides an embodiment of this application, viewed from another perspective.

[0032] Figure 7 is an exemplary longitudinal cross-sectional view of a computing device according to an embodiment of this application.

[0033] Figure 8 shows a bottom view of a computing device according to an embodiment of this application.

[0034] Explanation of reference numerals in the attached drawings: 1-Computing device; 100-Housing assembly; 10-Inner shell; 20-Outer shell; 20b-Air outlet; 20c-Air inlet; 30-Mounting side panel; 30b-Snap-fit ​​hole; 40-Cover side panel; 41-Snap-fit ​​part; 60-Wireless communication unit; 70-Ambient temperature detection unit; 200-Fan; 210-Snap-fit ​​protrusion; 300-Power module; 301-Power input unit; 302-Switch unit; 400-Computing module; 500 - Control module; 510 - Control box; 511 - Housing; 511a - Mounting cavity; 5111 - Upper shell; 5112 - Lower shell; 5113 - Positioning post; 512 - Side cover plate; 512a - Cable guide hole; 512b - Snap-fit ​​hole; 512c - Mounting hole; 5121 - Snap-fit ​​protrusion; 5122 - Recess; 513 - Snap-fit ​​mating part; 520 - Display screen; 530 - Control circuit board; 530a - Positioning hole; L1 - First direction; L2 - Second direction. Detailed Implementation

[0035] In the following description, only certain exemplary embodiments are briefly described. As those skilled in the art will recognize, the described embodiments can be modified in various ways without departing from the spirit or scope of this application. Therefore, the drawings and description are considered to be exemplary in nature and not restrictive.

[0036] In related technologies, the control circuit board and other functional modules of a computing device are integrated together inside the housing. Due to the limited space inside the computing device housing, the control circuit board, located inside the housing, not only occupies the installation space of other modules, reducing the internal space utilization of the device and limiting its expandability, but may also lead to localized heat accumulation, reducing the device's heat dissipation efficiency. In high-performance devices, heat accumulation can cause excessively high component temperatures, affecting the performance and lifespan of the computing device.

[0037] Based on the aforementioned deficiencies in related technologies, this application provides a control module for a computing device. By providing a control box for mounting the control circuit board, which is detachably mounted on the housing assembly, the control circuit board can be decoupled from other modules of the computing device, achieving modular design of the control module. This facilitates subsequent maintenance and upgrades by users according to their needs, improving the scalability of the computing device. On the other hand, it achieves physical isolation between the control module and other modules of the computing device, preventing the adverse effects of the computing module's heat on the control circuit board, thus improving the stability of the computing device's operation. It also reduces the space occupied inside the housing assembly, thereby reducing the overall size of the housing assembly and improving the integration of the computing device.

[0038] Figure 1 provides an exploded view of the control module according to an embodiment of this application. Figure 2 provides an assembly diagram of the control module and housing assembly of the computing device according to an embodiment of this application. Figure 3 provides an assembly diagram of the control module and housing assembly of the computing device according to an embodiment of this application. As shown in Figures 1 to 3, in this embodiment, the computing device 1 may include a housing assembly 100 and a control module 500. The control module 500 provided in this embodiment may include a control box 510 and a control circuit board 530. The control box 510 may have a mounting cavity 511a inside, and the control box 510 is detachably mounted to the housing assembly 100 of the computing device 1. The control circuit board 530 may be disposed in the mounting cavity 511a, and the control circuit board 530 is used for electrical connection with the computing module 400 and the power module 300 inside the housing assembly 100.

[0039] In this embodiment, the control box 510 is detachably installed on the housing assembly 100 and located outside the cavity of the housing assembly 100. With this configuration, the control circuit board 530 does not occupy the internal space of the housing assembly 100, thereby isolating the control circuit board 530 from the computing module 400, the power module 300, and the fan 200.

[0040] In some examples, the control box 510 is detachably connected to the housing assembly 100 via screws or other types of fasteners.

[0041] In other examples, the control box 510 and the housing assembly 100 can be detachably connected via a snap-fit ​​structure.

[0042] It should be noted that the above description of the detachable connection between the control box 510 and the housing assembly 100 is merely exemplary and should not be construed as a limitation of this application. Those skilled in the art can flexibly configure it according to actual circumstances. For example, in other examples of this application, the control box 510 and the housing assembly 100 can be detachably connected via magnetic components.

[0043] In some examples, the housing 511 of the control box 510 can be made of a metal material, such as aluminum alloy or steel. Using a metal material ensures that the control box 510 has high strength and effectively protects the internal components.

[0044] In other examples, the housing 511 of the control box 510 can be made of a polymer material, such as plastic or resin. Using a polymer material allows the control box 510 to have a lighter weight and lower cost, making it suitable for applications with high requirements for weight and cost control.

[0045] It should be noted that the material selection for the housing 511 of the control box 510 described above is only an example and does not constitute a limitation on this application. Those skilled in the art can make flexible settings according to the actual situation.

[0046] According to the embodiments of this application, the control module 500 includes a control box 510 for mounting the control circuit board 530. The control box 510 is detachably mounted on the housing assembly 100. On the one hand, this decouples the control circuit board 510 from other modules of the computing device 1, realizing a modular design of the control module 500. This facilitates subsequent maintenance and upgrades by users according to their needs, improving the scalability of the computing device 1. On the other hand, it achieves physical isolation between the control module 500 and other modules of the computing device 1, preventing the heat generated by the computing module 400 from adversely affecting the control circuit board 530. This helps improve the stability of the computing device 1's operation, reduces the space occupied by the housing assembly 100, thereby reducing the overall size of the housing assembly 100 and improving the integration of the computing device 1.

[0047] Figure 4 is an illustrative exploded view of the computing device according to an embodiment of this application after removing the outer casing, and Figure 5 is an illustrative exploded view of the computing device according to an embodiment of this application. As shown in Figures 4 and 5, the computing device 1 may further include multiple functional modules such as a computing module 400, a power supply module 300, and a fan 200. The control module 500, computing module 400, power supply module 300, and fan 200 may be integrated into the housing assembly 100. The housing assembly 100 can be used to provide an installation foundation and external protection for the functional modules of the computing device 1.

[0048] For example, the control module 500 is a module that implements functions such as power control, temperature monitoring and management, and data communication. Components such as the power module 300, computing module 400, and heat dissipation module can be electrically connected to the control module 500 via cables, and the control module 500 performs system monitoring and task management.

[0049] For example, the computing module 400, power supply module 300, and fan 200 can be integrated inside the housing assembly 100. The housing assembly 100 defines a cavity and an air inlet and outlet communicating with the cavity. The fan 200 is disposed within the cavity to generate airflow from the air inlet to the air outlet. The airflow passes through the computing module 400 and power supply module 300, thereby carrying away the heat generated by the computing module 400 and power supply module 300 during operation, thus cooling the computing module 400 and power supply module 300. Simultaneously, the heated airflow forms warm air and flows out from the air outlet, which can be used to heat the external environment of the computing device 1, thereby effectively utilizing the heat generated by the computing module 400 and power supply module 300.

[0050] In this embodiment, the control circuit board 530 is electrically connected to the computing module 400, the power supply module 300, and the fan 200, respectively. The power supply module 300 supplies power to the control circuit board 530, the computing module 400, and the fan 200. The control circuit board 530 controls the operating parameters of the computing module 400 and the fan 200, such as controlling the computing frequency of the computing board 410 of the computing module 400 and the rotational speed of the fan 200.

[0051] For example, the control circuit board 530 can control the rotation speed of the fan 200 according to the computing frequency of the computing board 410. For instance, when the computing frequency of the computing board 410 increases, the rotation speed of the fan 200 is increased accordingly to increase the airflow velocity, thereby improving the heat dissipation efficiency of the computing board 410 when the increased computing frequency leads to increased heat generation; conversely, when the computing frequency of the computing board 410 decreases, the rotation speed of the fan 200 is decreased accordingly to decrease the airflow velocity, thereby reducing the heat dissipation efficiency of the computing board 410 when the decreased computing frequency leads to decreased heat generation, thus saving energy consumption of the computing device.

[0052] It should be noted that the above description of the control method of the control circuit board 530 is merely an exemplary description and should not be construed as a limitation of this application. Those skilled in the art can flexibly set the control method of the control circuit board 530 according to the actual situation.

[0053] In other examples of this application, the control circuit board 530 can also control the operating parameters of the computing module 400 and the fan 200 according to the external ambient temperature of the computing device 400. For example, when the external ambient temperature is lower than a preset temperature, the control circuit board 530 can increase the heat generation of the computing board 410 and the airflow velocity generated by the fan 200 by increasing the computing frequency of the computing board 410 and the rotation speed of the fan 200, thereby increasing the air volume and air temperature of the computing device 1, and thus improving the heating effect of the computing device 1.

[0054] In this embodiment, the control circuit board 530 can be a printed circuit board (PCB). The control circuit board 530 can be electrically connected to the computing module 400 and power module 300 within the housing assembly 100 via a flexible printed circuit board (FPC) or other flexible cables. By using thin, flexible, and high-transmission-rate FPCs or other flexible cables, it can adapt to the complex layout of the modules inside the housing assembly 100, avoiding electrical connection failures caused by cable bending or stretching, and simplifying the wiring structure. The control circuit board 530 can be connected to the computing module 400 and power module 300 within the housing assembly 100 via standardized electrical connection interfaces.

[0055] For example, a vertical connector with a self-locking function can be further provided on the control circuit board 530. The cables extending from functional modules such as the computing module 400 and the power module 300 can communicate with the control circuit board 530 through gold fingers that are compatible with the vertical connector, so as to ensure stable and efficient signal transmission.

[0056] It should be noted that the above example of the electrical connection between the control circuit board 530 and the computing module 400 and the power module 300 is only for illustrative purposes and does not constitute a limitation on this application. Those skilled in the art can make flexible settings according to the actual situation.

[0057] In some examples, by setting reasonable control logic for the control circuit board 530, the operating parameters of each module of the computing module 4001 can be dynamically adjusted according to the real-time load of the computing device 1, so that the fan 200 can be used as a cooling device for the computing device 1. The control module 500 can be used to form an electrical connection with the computing module 400, power module 300 and fan 200 within the housing assembly 100, and can be used to perform coordinated control of each module of the computing device 1 to achieve dynamic adjustment of the heat dissipation system. Specifically, multiple load detection modules, such as temperature sensors and current sensors, can be installed at key locations of the computing module 400 and power module 300 to monitor the load of the computing module 400 and power module 300 in real time and feed the data back to the control circuit board 530. When the load condition, such as temperature or current, reaches a set threshold, the control module 500 can adjust the speed of the fan 200 or activate additional heat dissipation devices to improve heat dissipation efficiency. Conversely, when the load decreases, the control module 500 can send a signal to reduce the fan speed or temporarily shut down the air-cooling system, thereby saving energy and reducing noise. It should be noted that the above are merely illustrative examples and do not constitute a limitation on this application.

[0058] In other examples, by configuring appropriate control logic for the control circuit board 530, the computing module 400 and the fan 200 are used as heating devices, effectively utilizing the heat generated by the computing module 400 for heating while simultaneously dissipating heat from the computing device 1. It should be noted that the control module 500 can be electrically connected to the computing module 400, power module 300, and fan 200 within the housing assembly 100, and can be used to execute an intelligent heating system that coordinates the various modules of the computing device 1 to achieve the heating function. The airflow generated by the fan 200 can flow through the computing module 400 to form warm air, which can be discharged through the air outlet 20b of the outer casing 20 of the housing assembly 100 for heating. Specifically, the air inlet of the housing assembly 100 can be located on the bottom wall of the outer casing 20, and the air outlet 20b can be located on the side wall of the outer casing 20. Multiple temperature sensors can be installed at key locations on the air inlet 20 and air outlet 20b of the housing assembly 100 to detect the inlet air temperature and outlet air temperature of the housing assembly 100 in real time, and feed this information back to the control module 500. Alternatively, temperature detection units can also be installed in other locations on the computing device, such as inside the control module 500.

[0059] In the application scenario where the computing device 1 is used as a heating device, the fan 200, the computing module 400, and the power module 300 can be connected to the control circuit board 530 of the control module 500. The control circuit board 530 can automatically adjust the operating power of the computing module 400 and the speed of the fan 200, or control the power supply, according to the specified temperature requirements input by the user and real-time temperature monitoring data, so as to meet the corresponding heating needs within the normal operating range of the computing device 1.

[0060] For example, if the outlet air temperature does not reach the user-specified temperature, the control module 500 can appropriately increase the computing load within the normal operating range of the computing device 1, or reduce the fan speed 200, or temporarily shut down the air-cooling system, thereby meeting the user's heating needs. If the outlet air temperature is higher than the user-specified temperature, the control module 500 can appropriately reduce the computing load within the normal operating range of the computing device 1, or increase the fan speed 200, thereby meeting the user's temperature requirements. In other examples, when the user has no heating needs, the ambient temperature is low, and the computing load is small, the control module 500 can send a signal to reduce the fan speed or temporarily shut down the air-cooling system, thereby reducing energy consumption and improving energy efficiency. In some specific examples, an electric heating device can be installed at the air outlet 20b of the housing assembly 100 to supplement the heating with the discharged warm air.

[0061] In other specific examples, a heat collection device such as a hot air guide duct can be installed at the air outlet 20b to concentrate the heat of the discharged warm air for heating. An auxiliary fan can also be installed at the air outlet 20b to enhance the flow of hot air and ensure that the heat can be effectively transferred to the location that needs to be heated.

[0062] It should be noted that the heating methods and structures described above are merely illustrative examples and do not constitute a limitation on this application.

[0063] In this way, the control module 500 for computing device 1 in this embodiment of the application can be electrically connected to other functional modules of computing device 1, and can dynamically adjust the heat dissipation system according to the real-time load of other functional modules and the user's heating needs, so as to achieve heating while ensuring the stable operation of computing device 1.

[0064] For example, the fan 200 may be a cross-flow fan, with the air inlet direction perpendicular to the air outlet direction.

[0065] In some examples, the cross-flow fan 200 can be housed within the cavity of the housing assembly 100 and can be used to generate airflow from the inlet to the outlet. The inlet direction and outlet direction can be perpendicular to each other. Specifically, the cross-flow fan can be equipped with a cylindrical impeller with internally arranged blades. A motor drives the impeller to rotate, causing airflow to enter from the inlet and exit from the outlet. During operation, the airflow generated by the cross-flow fan rises from the bottom of the housing assembly 100, flows through the computing module 400 and power module 300 into the inlet of the fan 200, and then exits through the outlet to the outside of the housing assembly 100, thus carrying away the heat generated by the computing module 400 and power module 300.

[0066] It is understandable that a cross-flow fan, also known as a tangential flow fan or cross-flow fan, is a type of fan with a special structure. Its working principle involves causing air inside the impeller to flow radially along the impeller. Through the action of the impeller, the airflow bends within the impeller and exits at both sides of the impeller. Cross-flow fans typically have a relatively long cylindrical impeller with a relatively small diameter. Because cross-flow fans offer advantages such as uniform airflow, low noise, and compact structure, using a cross-flow fan as the fan 200 can improve the uniformity of the warm air blown from the outlet, reduce noise during the operation of the computing device 1, and also help reduce the overall size of the computing device 1, thus reducing its space occupation.

[0067] It should be noted that in other examples of this application, the fan 200 is not limited to a cross-flow fan, but may also be other types of fans such as axial flow fans, centrifugal fans, mixed flow fans, cross-flow fans or bladeless fans, to generate airflow from the air inlet to the air outlet.

[0068] In one embodiment, as shown in FIG1, the control box 510 may include a housing 511 and a side cover 512. The housing 511 may define a mounting cavity 511a and a lateral opening communicating with the mounting cavity 511a, and the side cover 512 may be detachably mounted to the lateral opening.

[0069] Exemplarily, the control box 510 is detachably mounted on the exterior of the inner shell 10 of the housing assembly 100 along the first direction L1. The inner shell 10 of the housing assembly 100 may be a cuboid frame structure, and the first direction L1 may be a direction parallel to the length direction of the inner shell 10, wherein the length direction of the inner shell 10 can be understood as a straight line extending from one end of the longest side of the inner shell 10 to the other end. The control box 510 may include a housing 511 and a side cover plate 512. The interior of the housing 511 may define a mounting cavity 511a, and the control circuit board 530 may be mounted in the mounting cavity 511a of the housing 511. The housing 511 may have a lateral opening on one side along the first direction L1, and the side cover plate 512 is detachably mounted to the lateral opening to close the control box 510. It should be noted that the above description of the structure and direction of the inner shell 10 is merely exemplary and does not constitute a limitation of this application.

[0070] For example, the housing 511 may be provided with a plurality of positioning posts 5113 extending in the direction toward the side cover plate 512, and the plurality of positioning posts 5113 may be symmetrically arranged on both sides along the second direction L2. The control circuit board 530 may be provided with a plurality of positioning holes 530a corresponding one-to-one with the plurality of positioning posts 5113, and the positioning holes 530a may be used for the positioning posts 5113 to pass through. The cross-sectional shape of the positioning holes 530a may be circular or elliptical.

[0071] For example, the number of positioning posts 5113 can be four, and they can be respectively arranged adjacent to the four apex corners of the control circuit board 530. The control circuit board 530 can have four positioning holes 530a, each corresponding to one of the four positioning posts 5113, for the corresponding positioning posts 5113 to pass through, thereby achieving the installation and fixation of the control circuit board 530 relative to the housing 511. The side cover plate 512 can have multiple mounting holes 512c, each corresponding to one of the positioning posts 5113. During the installation of the side cover plate 512 onto the housing 511, the positioning posts 5113 can be inserted into the mounting holes 512c to achieve the overall installation and sealing of the control box.

[0072] Through the above implementation method, a detachable connection between the housing 511 and the side cover plate 512 is achieved, and the ease of disassembly and assembly between the two is improved.

[0073] In one embodiment, as shown in Figures 1 and 4, a through-hole 512a may be provided on the side cover plate 512. The through-hole 512a can be used for the cable of the power module 300 to pass through and be electrically connected to the control circuit board 530. The size and shape of the through-hole 512a can be optimized according to the actual application requirements, and this embodiment does not impose specific limitations.

[0074] In some examples, the inner periphery of the wire hole 512a can be rounded, such as circular or elliptical. This design avoids sharp edges on the inner periphery of the wire hole 512, thus reducing wear on the cable and providing some protection for it.

[0075] In other examples, the inner periphery of the wire hole 512a may be provided with a soft material and insulated to prevent cable abrasion or short circuit.

[0076] In some other examples, a dustproof gasket may be attached to the inner periphery of the wire hole 512a to prevent dust from entering the interior of the housing 511, ensuring the cleanliness of the control module 500 and protecting the safety and reliability of the internal electronic components. It should be noted that the above is merely an exemplary description and should not be construed as a limitation on the embodiments of this application. To avoid damage to the cable caused by the wire hole 512a, those skilled in the art can flexibly configure the inner periphery of the wire hole 512a according to the actual situation.

[0077] In one embodiment, as shown in Figures 1 and 4, the computing device 1 may further include a fan 200 disposed on the housing assembly 100, the end of the fan 200 may have a snap-fit ​​protrusion 210; a snap-fit ​​hole 512b may also be provided on the side cover plate 512, the shape of the snap-fit ​​hole 512b may be adapted to the shape of the snap-fit ​​protrusion 210, for forming a snap-fit ​​engagement with the snap-fit ​​protrusion 210.

[0078] For example, after the fan 200 is mounted on the housing assembly 100 along the first direction L1, the snap-fit ​​protrusion 210 of the fan 200 may protrude from one side of the housing assembly 100 along the first direction L1. The snap-fit ​​hole 512b on the side cover plate 512 can be aligned with the snap-fit ​​protrusion 210 at the end of the fan 200, and a certain pressure can be applied to insert the snap-fit ​​protrusion 210 into the snap-fit ​​hole 512b to form a stable snap-fit ​​fit, ensuring that the control module 500 is securely mounted on the housing assembly 100, while facilitating subsequent disassembly and maintenance of the control module 500.

[0079] In some examples, the snap-fit ​​protrusion 210 can be circular or elliptical in shape, and the snap-fit ​​hole 512b can be circular or elliptical in shape to match the snap-fit ​​protrusion 210.

[0080] In other examples, the shape of the snap-fit ​​protrusion 210 can be polygonal, such as a triangle or a quadrilateral, and the shape of the snap-fit ​​hole 512b can be a circle or an ellipse that matches the snap-fit ​​protrusion 210.

[0081] It should be noted that the shapes of the snap-fit ​​hole 512b and the snap-fit ​​protrusion 210 described above are merely illustrative examples and do not constitute a limitation on this application. Those skilled in the art can flexibly set the shapes of the snap-fit ​​hole 512b and the snap-fit ​​protrusion 210 according to actual conditions to achieve the function of plugging and mating.

[0082] In one embodiment, as shown in FIG1, the side cover plate 512 may have a recess 5122, which may be recessed in the direction toward the mounting cavity 511a. The recess 5122 may define a cable storage groove, and a cable passage hole 512a and a snap-fit ​​hole 512b may be provided in the recess 5122.

[0083] By way of example, the recess 5122 may be formed by a portion of the side cover 512 adjacent to the central region in the direction toward the mounting cavity 511a. The side of the cable storage groove defined by the recess 5122 away from the mounting cavity 511a forms an opening, and the mounting side plate 30 of the housing assembly 100 is used to close the opening so that the cable storage groove forms a relatively closed space.

[0084] Through the above implementation method, the cable storage tray can provide extra space for organizing and storing cables, making the cables more neat and orderly during the wiring process.

[0085] In one embodiment, as shown in Figures 1 and 4, a snap-fit ​​hole 30b may be provided on the side of the housing assembly 100 adjacent to the control box 510, and a snap-fit ​​protrusion 5121 may be provided on the side of the side cover plate 512 adjacent to the housing assembly 100, the snap-fit ​​protrusion 5121 being used to form a snap-fit ​​engagement with the snap-fit ​​hole 30b; or, a snap-fit ​​protrusion may be provided on the side of the housing assembly 100 adjacent to the control box 510, and a snap-fit ​​hole may be provided on the side cover plate 512, the snap-fit ​​hole being used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

[0086] For example, when a snap-fit ​​hole 30b is provided on the side of the housing assembly 100 adjacent to the control box 510, and the side cover plate 512 is provided with a snap-fit ​​protrusion 5121, the snap-fit ​​protrusion 5121 of the control box 510 can be aligned with the snap-fit ​​hole 30b on the side of the housing assembly 100 adjacent to the control box 510, and a certain pressure is applied to insert the snap-fit ​​protrusion 5121 into the snap-fit ​​hole 30b to form a stable snap-fit ​​engagement. This application embodiment does not specifically limit the number, shape, or location of the snap-fit ​​holes 30b and the snap-fit ​​protrusions 5121.

[0087] Through the above implementation method, it can be ensured that the control module 500 is stably fixed on the housing assembly 100, and at the same time, it is convenient to disassemble and maintain the control module 500 in the future.

[0088] In one embodiment, as shown in FIG1, the housing 511 may include an upper housing 5111 and a lower housing 5112, the bottom of the upper housing 5111 may be connected to the top of the lower housing 5112; wherein, the material of the upper housing 5111 may be a transparent material.

[0089] For example, part or all of the upper shell 5111 may be made of a transparent material, specifically tempered glass, plastic, etc., so that at least a portion of the upper shell 5111 allows light to pass through, forming a transparent upper shell. In some examples, the upper shell 5111 may be made of tempered glass, suitable for applications requiring high transparency and strength.

[0090] In other examples, the top shell 5111 can be made of transparent plastic, which is suitable for applications where cost control is a high priority.

[0091] This application does not impose specific limitations on the material used for the upper shell 5111, and those skilled in the art can flexibly set it according to the actual situation.

[0092] In one embodiment, the upper shell 5111 and the lower shell 5112 can be detachably connected by fasteners such as screws.

[0093] In one embodiment, the upper shell 5111 and the lower shell 5112 can be manufactured by an integral molding process.

[0094] In some examples, the upper shell 5111 and the lower shell 5112 can be processed and molded separately, and then formed into an integral structure through a secondary injection molding process.

[0095] In other examples, the upper shell 5111 and the lower shell 5112 can be integrally formed by injection molding.

[0096] The above-described implementation method can improve the tightness of the connection between the upper shell 5111 and the lower shell 5112, eliminates the need for assembly, and also helps to improve the sealing performance of the control module 500.

[0097] In one embodiment, as shown in FIG1, the control module 500 may further include a display screen 520, which may be disposed in the mounting cavity 511a and electrically connected to the control circuit board 530. The display area of ​​the display screen 520 is directly opposite to the upper shell 5111.

[0098] For example, the housing 511 of the control box 510 may include an upper housing 5111 and a lower housing 5112. The control module 500 may also include a display screen 520, which may be disposed within the mounting cavity 511a and electrically connected to the control circuit board 530. The transparent upper housing 5111 may be positioned directly opposite the display area of ​​the display screen 520 to display the operating information of the control module 500.

[0099] In this embodiment, the display screen 520 can be an LED display screen or a liquid crystal display screen, etc. In some examples, the display screen 520 can be an LED display screen, which has high brightness, fast response speed and wide viewing angle, and is suitable for application scenarios with high requirements for high brightness and fast response.

[0100] In other examples, the display 520 can be an LCD screen, which has low power consumption, rich color performance, and high resolution, making it suitable for application scenarios with high requirements for display quality.

[0101] This application does not specifically limit the type of display screen 520, and those skilled in the art can flexibly set it according to the actual situation.

[0102] Through the above implementation method, the display screen 520 can be electrically connected to the control circuit board 530 via a flexible printed circuit board, which can adapt to the limited space within the control box 510 while ensuring stable and efficient signal transmission. The integrated design of the display screen 520 in the control module 500 enables intuitive display of information and improves the user's operating experience.

[0103] In one embodiment, the housing assembly 100 provides an installation space 25 for the control module 500. The bottom of the installation space 25 can be formed by extending the bottom wall and side wall of the housing 20 to provide support for the installation of the control module 500. The top of the installation space 25 can be opened to cooperate with the transparent upper shell 5111 of the control box 510 to display the working information of the control module 500. This setting can increase the visibility and aesthetics of the control module 500.

[0104] In this way, the control module 500 of the computing device 1 provided in this application embodiment is detachably installed in the housing assembly 100 of the computing device 1, realizing the modularity of the system control of the computing device 1, which is beneficial for users to maintain and upgrade according to their needs in the future, and improves the scalability of the computing device 1.

[0105] Figure 6A shows a three-dimensional structural schematic diagram of a computing device according to an embodiment of the present application from one perspective, and Figure 6B shows a three-dimensional structural schematic diagram of a computing device according to an embodiment of the present application from one perspective. As shown in Figures 6A and 6B, in one embodiment, the outer side wall of the control box 510 of the control module 500 is provided with a snap-fit ​​part 513, and the snap-fit ​​part 513 is correspondingly provided with a snap-fit ​​part 41 on the cover side plate 40 of the housing assembly 100.

[0106] Exemplarily, the housing assembly 100 also includes a cover side plate 40, which is detachably mounted to a mounting opening on one side of the housing 20 in the first direction L1, for closing the mounting opening. The cover side plate 40 and the control module 500 may be located on opposite sides of the housing 20 in the first direction L1, respectively. The cover side plate 40 is provided with a snap-fit ​​portion 41, and the outer side wall of the control box 510 is provided with a snap-fit ​​mating portion 513. In two computing devices 1 arranged adjacent to each other along the first direction L1, the snap-fit ​​portion 41 of one computing device 1 may engage with the snap-fit ​​mating portion 513 of the other computing device 1.

[0107] In this embodiment, multiple computing devices 1 can be integrated to form a computing device cluster. Exemplarily, the multiple computing devices 1 can be arranged adjacently along a first direction L1, each computing device 1 having a first end and a second end in the first direction. The control module 500 of the computing device 1 is located at the first end, and the cover side plate 40 of the computing device 1 is located at the second end. In two adjacent computing devices 1, the second end of the first computing device is adjacent to the first end of the second computing device, and the snap-fit ​​portion 41 on the cover side plate 40 of the first computing device forms a snap-fit ​​engagement with the snap-fit ​​mating portion 513 on the control box 510 of the second computing device.

[0108] In some examples, the snap-fit ​​portion 41 may protrude outward from the outer side wall of the cover side plate 40 to form a protruding structure, and the snap-fit ​​mating portion 513 may be recessed inward from the outer side wall of the control box 510 to form a groove structure. Thus, the snap-fit ​​portion 41 can be inserted into the snap-fit ​​mating portion 513 to form a snap-fit ​​engagement.

[0109] In other examples, the snap-fit ​​portion 41 may be recessed inward from the outer side wall of the cover side plate 40 to form a groove structure, and the snap-fit ​​mating portion 513 may protrude outward from the outer side wall of the control module 500 to form a protrusion structure. Thus, the snap-fit ​​mating portion 513 can be inserted into the snap-fit ​​portion 41 to form a snap-fit.

[0110] It should be noted that the above is merely an illustrative example and should not be construed as a limitation of this application. In other examples of this application, the latching portion 41 and the latching mating portion 513 can also adopt other arbitrary structures, which can be flexibly set by those skilled in the art according to actual conditions. For example, one of the latching portion 41 and the latching mating portion 513 can be a protruding structure, and the other can be a matching card hole structure. As another example, the latching portion 41 and the latching mating portion 513 can also be magnetic components with mutual magnetic attraction, and the two can be attracted to each other by magnetic force so that two adjacent computing devices 1 can be fixed relative to each other.

[0111] Furthermore, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can be one or more sets correspondingly arranged, which can be flexibly configured according to the actual situation by those skilled in the art. For example, the number of snap-fit ​​parts 41 and snap-fit ​​mating parts 513 can each be one, with the snap-fit ​​part 41 disposed in the central area of ​​the cover side plate 40 and the snap-fit ​​mating part 513 disposed in the central area of ​​the control box 510. As another example, the number of snap-fit ​​parts 41 can be multiple, with multiple snap-fit ​​parts 41 arranged circumferentially adjacent to the outer periphery of the cover side plate 40, and the number of snap-fit ​​mating parts 513 can be multiple, with multiple snap-fit ​​mating parts 513 arranged circumferentially adjacent to the outer periphery of the control box 510.

[0112] In this way, the multi-point snap-fit ​​design improves the installation stability of the control module 500. The corresponding configuration of the snap-fit ​​part 41 and the snap-fit ​​mating part 513 enables the computing device 1 to be quickly disassembled and assembled in situations where frequent disassembly and assembly are required. Multiple computing devices 1 can be assembled through the cooperation of the snap-fit ​​part 41 and the snap-fit ​​mating part 513, thereby improving the scalability of the computing device 1.

[0113] In one embodiment, the control module 500 may further include a communication module electrically connected to the control circuit board 530; the bottom of the control box 510 may have a mounting through hole for mounting the communication module.

[0114] For example, the control module 500 may further include a restart module, a clock module, a communication module, etc., electrically connected to the control circuit board 530, and the above modules may be integrated and arranged at the bottom of the housing assembly 100. It should be noted that the above is only an example and does not constitute a limitation of this application.

[0115] Figure 7 is a longitudinal sectional view of a computing device according to an embodiment of this application, and Figure 8 is a bottom view of a computing device according to an embodiment of this application. Exemplarily, as shown in Figures 7 and 8, the power module 300 may have a power input unit 301 and a switching unit 302. The power input unit 301 may employ a three-phase input interface for electrical connection to a power plug. The switching unit 302 is used to enable or disable the computing device 1. The power input unit 301 and the switching unit 302 may be disposed at the bottom of the housing assembly 100.

[0116] Exemplarily, the control module 500 may further include a wireless communication unit 60 and an ambient temperature detection unit 70 electrically connected to the power module 300. A mounting area is provided at the bottom of the housing assembly 100 for mounting the wireless communication unit 60 and the ambient temperature detection unit 70. The wireless communication unit 60 may be a Bluetooth device or a wireless WIFI connection device, and the ambient temperature detection unit 70 may be a temperature sensor used to detect the ambient temperature of the environment in which the computing device 1 is located and to feed back the ambient temperature detection result to the control module 500. The control module 500 can control the computing power of the computing module 400 and / or the rotational speed of the fan 200 based on the ambient temperature detection result.

[0117] For example, if the ambient temperature is below the temperature threshold, the control module 500 can control the fan 200 to increase its speed to improve the heat exchange efficiency between the airflow and the computing module 400, or the control module 500 can control the computing module 400 to increase its operating frequency to increase the heat generation of the computing module 400, thereby increasing the outlet air temperature of the computing device 1 and improving the heating effect in low-temperature environments. Conversely, if the ambient temperature is above the temperature threshold, the control module 500 can control the computing module 400 to decrease its operating frequency or control the fan 200 to increase its speed to reduce the heat generation of the computing board 410 or improve the cooling effect of the fan 200 on the computing board 410.

[0118] For example, referring to FIG8, the wireless communication unit 60, the ambient temperature detection unit 70 and the air inlet 20c can be arranged at intervals on the bottom of the housing assembly 100.

[0119] As another aspect of the embodiments of this application, a computing device 1 is also provided.

[0120] As shown in Figures 2 to 5, the computing device 1 of this application embodiment may include a housing assembly 100 and a control module 500 of the above embodiments of this application. The housing assembly 100 is used to integrate and install the computing module 400 and the power module 300. The control module 500 may be any of the control modules for the computing device 1 described in the above embodiments of this application. The control module 500 is detachably installed in the housing assembly 100 and electrically connected to the computing module 400 and the power module 300.

[0121] According to the embodiments of this application, the computing device 1, by employing the control module 500 of the above embodiments of this application, can decouple the control circuit board 510 from other modules of the computing device 1, realizing the modular setting of the control module 500. This facilitates subsequent maintenance and upgrades by users according to their needs, improving the scalability of the computing device 1. On the other hand, it achieves physical isolation between the control module 500 and other modules of the computing device 1, preventing the heat generated by the computing module 400 from adversely affecting the control circuit board 530, which is beneficial to improving the operational stability of the computing device 1. It also reduces the space occupied by the housing assembly 100, thereby reducing the external dimensions of the housing assembly 100 and improving the integration of the computing device 1. In addition, the control module 500 can dynamically adjust the heat dissipation system according to the real-time load of other functional modules and the user's heating needs, achieving heating while ensuring the stable operation of the computing device 1.

[0122] The control module 500 for computing device 1 and other configurations of computing device 1 in the above embodiments can adopt various technical solutions that are now and will be known to those skilled in the art, and will not be described in detail here.

[0123] In the description of this specification, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0124] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0125] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0126] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0127] It should be noted that although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that these steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or one step may be broken down into multiple steps. The above drawings are merely illustrative of the processes included in the method according to exemplary embodiments of this application and are not intended to be limiting. It is readily understood that the processes shown in the above drawings do not indicate or limit the temporal order of these processes. Furthermore, it is readily understood that these processes may be performed synchronously or asynchronously in multiple modules, for example.

[0128] The foregoing disclosure provides many different implementations or examples for carrying out different structures of this application. To simplify the disclosure, specific examples of components and arrangements are described above. Of course, these are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples; such repetition is for simplification and clarity and does not in itself indicate a relationship between the various implementations and / or arrangements discussed.

[0129] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various variations or substitutions within the technical scope disclosed in this application, and these should all be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A control module for a computing device, characterized in that, The computing device includes a housing assembly; the control module includes: A control box, having an internally defined mounting cavity, is detachably mounted to the housing assembly; A control circuit board is disposed within the mounting cavity, and the control circuit board is used to electrically connect to the computing module and power module within the housing assembly.

2. The control module for a computing device according to claim 1, characterized in that, The control box includes a housing and a side cover, the housing defining the mounting cavity and a lateral opening communicating with the mounting cavity, and the side cover being detachably mounted to the lateral opening.

3. The control module according to claim 2, characterized in that, The side cover plate has a through-hole for the cable of the power module to pass through and be electrically connected to the control circuit board.

4. The control module according to claim 3, characterized in that, The computing device also includes a fan disposed on the housing assembly, the end of the fan having a snap-fit ​​protrusion; the side cover plate also has a snap-fit ​​hole, the shape of the snap-fit ​​hole being adapted to the shape of the snap-fit ​​protrusion, the snap-fit ​​hole being used to form a snap-fit ​​engagement with the snap-fit ​​protrusion.

5. The control module according to claim 4, characterized in that, The side cover plate has a recessed portion, which is recessed in the direction toward the mounting cavity. The recessed portion defines a cable storage groove, and the cable passage hole and the snap-fit ​​hole are both provided in the recessed portion.

6. The control module according to claim 2, characterized in that, A snap-fit ​​hole is provided on the side of the housing assembly adjacent to the control box, and a snap-fit ​​protrusion is provided on the side of the side cover plate adjacent to the housing assembly. The snap-fit ​​protrusion is used to form a snap-fit ​​engagement with the snap-fit ​​hole; or, The housing assembly has a snap-fit ​​protrusion on one side adjacent to the control box, and the side cover has a snap-fit ​​hole for engaging with the snap-fit ​​protrusion.

7. The control module according to claim 2, characterized in that, The housing includes an upper shell and a lower shell, with the bottom of the upper shell connected to the top of the lower shell; wherein the upper shell is made of a transparent material.

8. The control module according to claim 7, characterized in that, The control module also includes a display screen, which is disposed in the mounting cavity and electrically connected to the control circuit board. The display area of ​​the display screen is positioned directly opposite the upper shell.

9. The control module according to claim 7, characterized in that, The upper shell and the lower shell are manufactured by an integral molding process.

10. The control module according to claim 1, characterized in that, The outer wall of the control box is provided with a snap-fit ​​part, which is correspondingly provided with a snap-fit ​​part on the cover side plate of the housing assembly.

11. The control module according to claim 10, characterized in that, The snap-fit ​​portion is a protruding structure, and the snap-fit ​​mating portion is a groove structure; or, the snap-fit ​​portion is a groove structure, and the snap-fit ​​mating portion is a protruding structure.

12. The control module according to claim 1, characterized in that, The control module also includes a communication module electrically connected to the control circuit board; the bottom of the control box has a mounting through hole for mounting the communication module.

13. A computing device, characterized in that, include: Housing assembly for integrating and mounting computing modules and power modules; as well as, The control module as described in any one of claims 1 to 12 is detachably mounted on the housing assembly and electrically connected to the computing module and the power module.

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