Chuck for die level test

Abstract

The chuck for a die level test comprises: a mobile chuck supporting a plurality of dies; a chuck base disposed under the mobile chuck to support the mobile chuck; and a heating unit disposed inside the mobile chuck and the chuck base. The heating unit may comprise: heat sources disposed inside the mobile chuck; upper electrodes electrically connected to the heat sources and facing an upper surface of the chuck base; and lower electrodes disposed between the mobile chuck and the chuck base and in contact with the upper electrodes.

Description

Chuck for die level testing

[0001] The present invention relates to a chuck for die level testing.

[0002] After the manufacturing process is completed, the quality of semiconductor devices is determined through electrical characteristic testing. During this process, the die under test is loaded into test equipment, and the test is performed through contact with each probe tip of a probe card.

[0003] The probe tip contacts the electrode pad or solder bump of the die and determines electrical characteristics such as conduction status by applying a test signal to the electrical circuit connected to each electrode.

[0004] When the die is inspected by a probe tip, the die may heat up. To prevent damage to the die, the die temperature can be measured by a temperature sensor. If the measured temperature is lower than or equal to a set temperature, the die temperature can be controlled. The die temperature can be controlled through a heating unit including a heater.

[0005] The object of the present invention is to provide a chuck for die level testing capable of rapidly and precisely controlling the temperature of dies.

[0006] The problems of the present invention are not limited to those mentioned above, and other unmentioned problems will be clearly understood by a person skilled in the art to which the present invention pertains from the description below.

[0007] A chuck for die level testing according to one embodiment of the present invention comprises a mobile chuck supporting a plurality of dies, a chuck base disposed below the mobile chuck and supporting the mobile chuck, and a heating unit disposed inside the mobile chuck and the chuck base, wherein the heating unit may include a heat source disposed inside the mobile chuck, an upper electrode electrically connected to the heat source and facing the upper surface of the chuck base, and a lower electrode disposed between the mobile chuck and the chuck base and in contact with the upper electrode.

[0008] According to one embodiment of the present invention, as the heat source of the heating unit is placed inside the mobile chuck, the temperature of the dies placed on the upper surface of the mobile chuck can be rapidly controlled.

[0009] The effects of the present invention are not limited to the effects described above, and should be understood to include all effects that can be inferred from the configuration of the invention described in the detailed description or claims of the present invention.

[0010] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention.

[0011] FIGS. 2a and 2b are cross-sectional views of a chuck for die level testing corresponding to the line I-I' shown in FIG. 1.

[0012] FIG. 3 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0013] FIGS. 4a to 4k are cross-sectional views illustrating the sorter chamber shown in FIG. 3.

[0014] FIG. 5 is a plan view of the mobile chuck and dies shown in FIG. 4k.

[0015] FIG. 6 is a plan view illustrating a mobile chuck being transported by a loader.

[0016] Figure 7 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0017] FIG. 8a is a perspective view of a chuck for die level testing according to one embodiment of the present invention.

[0018] FIG. 8b is a cross-sectional view corresponding to the line II-II' shown in FIG. 8a.

[0019] FIG. 9 is a cross-sectional view of a chuck for die level testing according to one embodiment of the present invention.

[0020] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the present invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. To clearly explain the present invention, parts unrelated to the description in the drawings have been omitted, and the same reference numerals have been used throughout the specification for identical or similar components.

[0021] The words and terms used in this specification and claims are not limited to their ordinary or dictionary meanings, but should be interpreted in a meaning and concept consistent with the technical spirit of the invention in accordance with the principles by which the inventor defines terms and concepts to best describe his invention.

[0022] Therefore, the embodiments described in this specification and the configurations illustrated in the drawings correspond to preferred embodiments of the present invention and do not represent all technical ideas of the present invention; thus, various equivalents and modifications that may replace such configurations may exist at the time of filing the present invention.

[0023] In the following description, descriptions of some components may be omitted to clarify the features of the present invention.

[0024] In the following description, the term "connection" refers to one or more members being connected to each other in a manner that allows for fluid communication. In one embodiment, the connection may be formed by members such as a conduit, a pipe, or a piping system. In the following description, the term "connection" may be used interchangeably with the meaning that one or more members are "fluidly connected" to each other.

[0025] In the following description, the term "conduction" means that one or more components are connected to each other to transmit current or electrical signals. In one embodiment, the conduction may be formed in a wired form by a conductor member, etc., or in a wireless form such as Bluetooth, Wi-Fi, or RFID. In one embodiment, the conduction may include the meaning of "communication."

[0026] As used in the following description, the term "fluid" refers to any form of substance that flows due to an external force and whose shape or volume, etc., can be deformed. In one embodiment, the fluid may be a liquid such as water or a gas such as air.

[0027] The terms "upper side," "lower side," "left side," "right side," "front side," and "rear side" used in the following description shall be understood by referring to the coordinate system depicted throughout the attached drawings.

[0028]

[0029] FIG. 1 is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 2a and FIG. 2b are cross-sectional views of a chuck for die level testing corresponding to the line I-I' shown in FIG. 1.

[0030] For example, in FIG. 2a, the mobile chuck is separated from the chuck base, and in FIG. 2b, the mobile chuck is positioned on the upper surface of the chuck base.

[0031] Referring to FIGS. 1 and 2a, a chuck (1) for die level testing may include a chuck base (10), a mobile chuck (11), and a heating element (13). For example, the mobile chuck (11) may have a disc shape. The upper surface of the mobile chuck (11) may be parallel to a plane defined by a first direction (DR1) and a second direction (DR2). However, this is exemplary, and the shape of the mobile chuck (11) is not limited thereto.

[0032] Hereinafter, the direction that intersects substantially perpendicularly with the plane defined by the first direction (DR1) and the second direction (DR2) is defined as the third direction (DR3). The third direction (DR3) serves as a reference for distinguishing the front and back surfaces of each member. In this specification, "on a plane" may be defined as a state viewed from the third direction (DR3). Hereinafter, the first to third directions (DR1, DR2, DR3) refer to the same reference numeral in the direction indicated by the first to third direction axes, respectively.

[0033] A plurality of vacuum suction holes (110) may be defined on the upper surface of the mobile chuck (11). The vacuum suction holes (110) may be arranged in a first direction (DR1) and a second direction (DR2) on the upper surface of the mobile chuck (11). The vacuum suction holes (110) are connected to an external vacuum pump, and when the vacuum pump is operated, the vacuum suction holes (110) may be converted to a vacuum state. Accordingly, a plurality of dies (218, see FIG. 5) to be described later may be fixed on the upper surface of the mobile chuck (11).

[0034] The chuck base (12) can be placed directly on the lower surface of the mobile chuck (11). That is, the mobile chuck (11) can be placed directly on the upper surface of the chuck base (12). The chuck base (12) can have a cylindrical shape.

[0035] A plurality of grooves (121) may be defined on the upper surface of the chuck base (12). The grooves (121) may extend from the upper surface of the chuck base (12) toward the lower surface in a third direction (DR3). When viewed from the second direction (DR2), the grooves (121) may have a shape corresponding to a part of a rectangle.

[0036] When viewed from the second direction (DR2), two pairs of grooves (121) may be spaced apart from each other in the first direction (DR1). One pair of grooves (121) may be arranged in the first direction (DR1).

[0037] The heating unit (13) may be placed inside the mobile chuck (11) and the chuck base (12). The heating unit (13) may generate heat by receiving power from the outside. The heat generated from the heating unit (13) may be transferred to the dies (218, see FIG. 5) to be described later.

[0038] The heating unit (13) may include a plurality of heat sources (131), a plurality of upper electrodes (132), a plurality of connecting wires (133), a plurality of lower electrodes (134), a plurality of power lines (135), and a plurality of elastic parts (136).

[0039] Heat sources (131) can be placed inside the mobile chuck (11). Heat sources (131) can be arranged spaced apart from each other in a second direction (DR2) inside the mobile chuck (11). Heat sources (131) can generate heat by receiving current from an external power source.

[0040] For example, in FIGS. 1 to 2b, the heat sources (131) are shown as dots, but are not limited thereto, and the heat sources (131) may be heating wires.

[0041] The upper electrodes (132) may be positioned inside the mobile chuck (11). The upper electrodes (132) may be adjacent to the lower surface of the mobile chuck (11) than the heat sources (131). For example, the lower surface of the upper electrodes (132) facing the chuck base (12) may be positioned on the same plane as the lower surface of the mobile chuck (11).

[0042] Connecting wires (133) may be placed between the heat sources (131) and the upper electrodes (132). Connecting wires (133) may be connected to the heat sources (131) and the upper electrodes (132). One side of the connecting wires (133) may be connected to the heat sources (131), and the other side may be connected to the upper electrodes (132). Accordingly, the heat sources (131) and the upper electrodes (132) may be electrically connected to each other by the connecting wires (133).

[0043] The lower electrodes (134) can be positioned between the mobile chuck (11) and the chuck base (12). When the mobile chuck (11) is separated from the chuck base (12), the lower electrodes (134) can be positioned on the chuck base (12). The upper surface of the lower electrodes (134) can be positioned above the upper surface of the chuck base (12). When the mobile chuck (11) is separated from the chuck base (12), the lower electrodes (134) can be positioned outside the grooves (121).

[0044] Power lines (135) may be placed inside the chuck base (12). One end of the power lines (135) may be connected to the lower electrodes (134). Although not illustrated, the other end of the power lines (135) may be connected to an external power source. That is, the power lines (135) may electrically connect the lower electrodes (134) and the external power source to each other.

[0045] The elastic members (136) may be placed in the grooves (121). The elastic members (136) may be placed under the lower electrodes (134). The elastic members (136) may be in contact with the lower surface of the lower electrodes (134). The elastic members (136) may surround the power lines (135). For example, the elastic members (136) may include a coil spring.

[0046] As illustrated in FIG. 2b, when the mobile chuck (11) is placed on the upper surface of the chuck base (12), the upper electrodes (132) can come into contact with the lower electrodes (134). Accordingly, the lower electrodes (134) connected to an external power source and the heat sources (131) can be electrically connected to each other. Thus, the heat sources (131), supplied with current from external power sources, can generate heat. The heat generated from the heat sources (131) can be transferred to the dies (218, see FIG. 7) to be described later.

[0047] When the upper electrodes (132) and the lower electrodes (134) come into contact with each other, the upper electrodes (132) can apply force to the lower electrodes (134) in a direction parallel to the third direction (DR3). When force is applied to the lower electrodes (134), the elastic parts (136) can contract. As the elastic parts (136) contract, the lower electrodes (134) can be placed inside the grooves (121). The contracted elastic parts (136) can apply an elastic force to the lower electrodes (134) toward the upper electrodes (132) in a direction parallel to the third direction (DR3). Accordingly, the upper electrodes (132) and the lower electrodes (134) can come into stable contact with each other.

[0048]

[0049] FIG. 3 is a plan view of an inspection equipment including a chuck for die level testing shown in FIG. 1.

[0050] Referring to FIG. 3, the inspection equipment (2) may include a sorter chamber (21), a loader (22), and a test chamber (23). The sorter chamber (21) may place dies (218, FIG. 7) on a mobile chuck (11, FIG. 1).

[0051] The loader (22) can transfer the mobile chuck (11, see FIG. 1) from the sorter chamber (21) to the test chamber (23). The test chamber (23) can inspect the electrical characteristics of the dies (218, see FIG. 5) placed on the upper surface of the mobile chuck (11, see FIG. 1) using a probe tip (234, see FIG. 8).

[0052] The process of placing dies (218, see FIG. 5) on the upper surface of a mobile chuck (11, see FIG. 1) in a sorter chamber (21), and the inspection of the electrical characteristic state of the dies (218, see FIG. 5) in a test chamber (23) will be described in detail below.

[0053]

[0054] FIGS. 4a through 4k are cross-sectional views illustrating the sorter chamber shown in FIG. 3. FIG. 5 is a plan view of the mobile chuck and dies shown in FIG. 4k.

[0055] For example, FIGS. 4a through 4k are cross-sectional views of a sorter chamber viewed from a second direction (DR2).

[0056] For example, FIGS. 4b through 4k are cross-sectional views illustrating the process of placing dies (218) on a mobile chuck (11).

[0057] Among the components shown in FIGS. 4a to 5, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0058] Referring to FIG. 4a, the sorter chamber (21) may include a first chamber (210), an upper base (211), a picker (212), a plurality of transfer units (213), a first lower base (214), a first chuck (215), and a second chuck (216).

[0059] The first chamber (210) may define a receiving space (2101) inside. The upper base (211), picker (212), transfer parts (213), first lower base (214), first chuck (215), and second chuck (216) may be received in the receiving space (2101).

[0060] An entrance (2102) may be defined on one side adjacent to the first chuck (215) among the two sides of the first chamber (210) that are opposite each other in the first direction (DR1). The entrance (2102) may connect the outside of the first chamber (210) with the receiving space (2101). Accordingly, the film assembly (217, see FIG. 4b) and the mobile chuck (11, see FIG. 4g) may be provided to the receiving space (2101) through the entrance (2102).

[0061] The upper base (211) may be positioned on the upper side of the receiving space (2101). The upper base (211) may be positioned on the inner side of the first chamber (210) defining the receiving space (2101). The upper base (211) may be fixed to the inner side of the first chamber (210) to fix the fixed picker (212) and the transfer parts (213) so as to face the first chuck (215) and the second chuck (216) in the third direction (DR3).

[0062] The picker (212) is fixed to the upper base (211) and can face the first chuck (215) and the second chuck (216) in the third direction (DR3). The picker (212) can be moved back and forth in the third direction (DR3). As the picker (212) moves back and forth in the third direction (DR3), the distance between the picker (212) and the first chuck (215), and between the picker (212) and the second chuck (216) can be varied. Hereinafter, a direction parallel to the third direction (DR3) is defined as the upper direction, and a direction parallel to the opposite direction of the third direction (DR3) can be defined as the lower direction.

[0063] The transfer members (213) can be fixed to the upper base (211). For example, the transfer members (213) can be fixed to the upper base (211) in a first direction (DR1). The transfer members (213) can face each other in a third direction (DR3) with the first chuck (215) and the second chuck (216). The transfer members (213) can be reciprocated in the third direction (DR3). As the transfer members (213) reciprocate in the third direction (DR3), the distance between the transfer members (213) and the first chuck (215), and between the transfer members (213) and the second chuck (216) can be varied.

[0064] The first lower base (214) may be positioned at the bottom of the receiving space (2101). The first lower base (214) may be positioned below the picker (212) and the transfer units (213). The first lower base (214) may face the picker (212) and the transfer units (213) in a third direction (DR3).

[0065] The first lower base (214) can be reciprocated in the first direction (DR1). Accordingly, the first lower base (214) can be moved to overlap with the picker (212) or the transport units (213) in the third direction (DR3) or not overlap.

[0066] The first chuck (215) may be placed on the first lower base (214). For example, the first chuck (215) may be placed on the upper surface of the first lower base (214). As the first chuck (215) is connected to the first lower base (214), when the first lower base (214) reciprocates in the first direction (DR1), the first chuck (215) may reciprocate in the first direction (DR1).

[0067] The first chuck (215) may include a first support member (2151), a first stage (2152), and a plurality of first lifts (2153). The first support member (2151) may be disposed on the upper surface of the first lower base (214). The first support member (2151) may have a column shape extending in a third direction (DR3). The first support member (2151) may reciprocate in the third direction (DR3).

[0068] The first stage (2152) may be placed on the first support member (2151). As the first stage (2152) is placed on the first support member (2151), when the first support member (2151) moves back and forth in the third direction (DR3), the first stage (2152) may move back and forth in the third direction (DR3).

[0069] The upper surface of the first stage (2152) may be parallel to a plane defined by the first direction (DR1) and the second direction (DR2). The upper surface of the first stage (2152) may support a film assembly (217, see FIG. 4b) and a mobile chuck (11, see FIG. 4g) to be described later.

[0070] The first lifts (2153) may be positioned around the first stage (2152). Although not illustrated, when viewed in a planar view, the first lifts (2152) may be positioned adjacent to the side of the first stage (2152).

[0071] The upper surface of the first lifts (2153) may be positioned below the upper surface of the first stage (2152). The height of the upper surface of the first lifts (2153) may be positioned below the height of the upper surface of the first stage (2152).

[0072] The first lifts (2153) can be reciprocated in the third direction (DR3). Although not illustrated, the first lifts (2153) can be connected to a separate cylinder to be reciprocated in the third direction (DR3).

[0073] The second chuck (216) may be placed on the first lower base (214). For example, the second chuck (216) may be placed on the upper surface of the first lower base (214). The first chuck (215) and the second chuck (216) may be arranged in a first direction (DR1). The first chuck (215) may be closer to the entrance (2102) than the second chuck (216).

[0074] As the second chuck (216) is connected to the first lower base (214), when the first lower base (214) moves back and forth in the first direction (DR1), the second chuck (216) can also move back and forth in the first direction (DR1).

[0075] The second chuck (216) may include a second support member (2161) and a second stage (2162). The second support member (2161) may have a columnar shape extending in a third direction (DR3). The second support member (2161) may move back and forth in the third direction (DR3). The movement of the second support member (2161) will be described in detail in FIG. 4f.

[0076] The second stage (2162) may be placed on the second support (2161). The upper surface of the second stage (2162) may be parallel to the plane defined by the first direction (DR1) and the second direction (DR2). The second stage (2162) may support a film assembly (217, see FIG. 4g).

[0077] Although not illustrated, the sorter chamber (21) may further include a sorter picker that aligns the dies (218, see FIG. 4k) when placing the dies (218, see FIG. 4k) described later onto the mobile chuck (11, see FIG. 4k).

[0078] Referring to FIG. 4b, a film assembly (217) and a plurality of dies (218) may be provided within a first chamber (210). The film assembly (217) and the dies (218) may be provided to a receiving space (2101) through an entrance (2102). The film assembly (217) may include a frame and a film placed on the frame. The dies (218) may be placed on the upper surface of the film.

[0079] The film assembly (217) provided in the receiving space (2101) may be provided on the first chuck (215). The film assembly (217) may be placed on the upper surface of the first stage (2152). The film assembly (217) may be placed on the first lifts (2153).

[0080] The upper surface of the film assembly (217) may have a predetermined adhesive force. Dies (218) may be placed on the film assembly (217). The film assembly (217) may secure the dies (218) with a predetermined adhesive force. Accordingly, the dies (218) may be prevented from detaching from the film assembly (217) due to external vibration or shock. Additionally, the adhesive force may have a strength adjusted so that the dies (218) can be easily separated from the film assembly (217).

[0081] Referring to FIG. 4c, the first lifts (2153) can be moved upward. As the first lifts (2153) move upward, the film assembly (217) and dies (218) placed on the first lifts (2153) can be moved upward.

[0082] The transfer units (213) can be moved downward from the upper base (211) toward the first lower base (214). As the transfer units (213) move downward and the film assembly (217) and dies (218) move upward, the distance between the film assembly (217) and the transfer units (213) can be reduced.

[0083] Referring to FIG. 4d, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the first chamber (210) that is spaced apart from the entrance (2102).

[0084] When the first lower base (214) moves in the first direction (DR1), the first chuck (215) and the second chuck (216) can be moved in the first direction (DR1). When the first chuck (215) moves in the first direction (DR1), the film assembly (217) and the dies (218) can be moved in the first direction (DR1) and placed under the transport units (213).

[0085] Referring to FIG. 4e, the transfer units (213) can lift opposite sides of the film assembly (217) in an upward direction in a first direction (DR1). The transfer units (213) can transfer the film assembly (217) and the dies (218) upward from the first chuck (215).

[0086] After the film assembly (217) and dies (218) are moved upward, the first lifts (2153) can be moved downward.

[0087] Referring to FIG. 4f, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0088] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and placed under the transfer sections (213).

[0089] After the second chuck (216) is placed below the transfer sections (213), the second support section (2161) can be moved upward. When the second support section (2161) is moved upward, the second stage (2162) can be moved upward. As the second stage (2162) moves upward, the distance to the third direction (DR3) between the transfer sections (213) and the second stage (2162) can be reduced.

[0090] The second stage (2162) moves upward toward the film assembly (217) so that the upper surface of the second stage (2162) can come into contact with the lower surface of the film assembly (217). The second stage (2162) can support the film assembly (217). The second stage (2162) can support dies (218) placed on the film assembly (217).

[0091] Referring to FIG. 4g, after the film assembly (217) and dies (218) are placed on the upper surface of the second stage (2162), the second support (2161) and the second stage (2162) can be moved downward.

[0092] The mobile chuck (11) may be provided within the first chamber (210). The mobile chuck (11) may be provided in the receiving space (2101) through the entrance (2102). When the film assembly (217) is placed on the upper surface of the second stage (2162), the mobile chuck (11) may be provided on the upper surface of the first stage (2152). The mobile chuck (11) may be placed on the first lifts (2153).

[0093] Referring to FIG. 4h, the first lower base (214) can be moved in the first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward the other side of the opposite sides of the first chamber (210).

[0094] When the first lower base (214) moves in the first direction (DR1), the second chuck (216) can be moved in the first direction (DR1). The second chuck (216) can be moved in the first direction (DR1) and overlap with the picker (212) in the third direction (DR3).

[0095] Referring to FIGS. 4i and 4j, the picker (212) can be moved downward. The picker (212) can be moved toward the film assembly (217) and the dies (218).

[0096] At least one of the second support (2161) or the picker (212) can be moved in a third direction (DR3). For example, the second support (2161) can be moved in an upward direction. When the second support (2161) is moved in an upward direction, the second stage (2162) can be moved in an upward direction. When the second stage (2162) is moved in an upward direction, the film assembly (217) and dies (218) placed on the upper surface of the second stage (2162) can be moved in an upward direction.

[0097] However, not limited thereto, the second support member (216) may be fixed, and the picker (212) may be moved downward toward the second support member (216). Additionally, the picker (212) may be fixed, and the second support member (216) may be moved upward toward the picker (212).

[0098] When the film assembly (217) and the dies (218) move in an upward direction, the distance in the third direction (DR3) between the dies (218) and the picker (212) can be reduced. The picker (212) can come into contact with the dies (218). The picker (212) can adsorb the dies (218). When the picker (212) adsorbs the dies (218), the second chuck (216) and the film assembly (217) can move in a downward direction. Accordingly, the dies (218) can be separated from the film assembly (217).

[0099] Referring to FIG. 4k, the first lower base (214) can be moved in a first direction (DR1). The first lower base (214) can be moved in the first direction (DR1) toward one of the opposite sides of the chamber.

[0100] The first chuck (215) placed on the first lower base (214) and the mobile chuck (11) placed on the first chuck (215) can be moved in the first direction (DR1). The mobile chuck (11) can be moved in the first direction (DR1) and placed under the picker (212).

[0101] After the mobile chuck (11) is placed below the picker (212), the first support member (2151) can be moved upward. When the first support member (2151) is moved upward, the mobile chuck (11) placed on the upper surface of the first support member (2151) can be moved upward. The distance in the third direction (DR3) between the upper surface of the mobile chuck (11) and the picker (212) can be reduced.

[0102] Referring to FIGS. 4k and FIGS. 5, the upper surface of the mobile chuck (11) may come into contact with dies (218) adsorbed to the picker (212). After the dies (218) come into contact with the upper surface of the mobile chuck (11), the picker (212) may place the dies (218) on the upper surface of the mobile chuck (11). The dies (218) may be placed directly on the upper surface of the mobile chuck (11).

[0103] Dies (218) can be placed on vacuum suction holes (110). Dies (218) can be arranged to correspond to the arrangement of vacuum suction holes (110). That is, each die (218) can be placed on a corresponding vacuum suction hole (110a) among the vacuum suction holes (110).

[0104] When the die (218) overlaps with the vacuum suction holes (110), a vacuum pump connected to the outside of the mobile chuck (11) can operate to convert the vacuum suction holes (110) into a vacuum state. Accordingly, the die (218) can be fixed on the upper surface of the mobile chuck (11).

[0105]

[0106] FIG. 6 is a plan view illustrating a mobile chuck being transported by a loader.

[0107] Among the components shown in FIG. 6, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0108] Referring to FIG. 4k and FIG. 6, after the dies (218) are placed on the upper surface of the mobile chuck (11), the mobile chuck (11) and the dies (218) can be discharged from the receiving space (2101) by a loader (22). The mobile chuck (11) and the dies (218) can be discharged from the first chamber (210) through the entrance (2102).

[0109] The mobile chuck (11) and dies (218) can be transferred from the sorter chamber (21) to the test chamber (23). Although not illustrated, a vacuum pump may be connected to the mobile chuck (11), and the vacuum suction holes (110a) may be maintained in a vacuum state. Accordingly, the position of the dies (218) can be prevented from shifting due to shaking or impact occurring during the transfer process.

[0110]

[0111] Figure 7 is a cross-sectional view illustrating the testing of electrical characteristics of dies within a test chamber.

[0112] For example, FIG. 7 is a cross-sectional view of the test chamber (23) viewed from the second direction (DR2).

[0113] Among the components shown in FIG. 7, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0114] Referring to FIGS. 6 and 7, the test chamber (23) may include a second chamber (230), a second lower base (231), a third support (232), a probe card (233), and a probe tip (234). The second chamber (230) may define an inspection space (230a) capable of accommodating the second lower base (231), the third support (232), the probe card (233), and the probe tip (234).

[0115] An inspection entrance (230b) may be defined on either side of the two opposing sides of the second chamber (230) in the first direction (DR1). The inspection entrance (230b) may connect the inspection space (230b) to the outside of the test chamber (230). In FIG. 6, a mobile chuck (11) and dies (218) may be provided to the inspection space (230a) through the inspection entrance (230b) by a loader (22).

[0116] The second lower base (231) may be placed at the bottom within the inspection space (230a). The second lower base (231) may be placed on the bottom surface of the second chamber (230).

[0117] The third support member (232) may be placed on the second lower base (231). The third support member (232) may reciprocate in the third direction (DR3) on the second lower base (231).

[0118] The chuck base (12) can be placed on the third support (232). The mobile chuck (11) can be placed on the chuck base (12) by the loader (22). The mobile chuck (11) can be placed directly on the upper surface of the chuck base (12).

[0119] The probe card (233) may be positioned above the second lower base (231) and the third support (232) within the second chamber (230). The probe card (233) may face the second lower base (231) and the third support (232) in a third direction (DR3).

[0120] The probe tip (234) may be placed on the lower surface of the probe card (233) facing the second lower base (231). The probe tip (234) may extend downward from the probe card (233).

[0121] The probe card (233) may be a device that connects the dies (218) and a tester (not shown) to check the operation of the dies (218). After the probe tip (234) connected to the probe card (233) contacts the dies (218), it can determine whether the dies (218) are defective based on the signal that returns after sending electricity to the dies (218).

[0122] When the third support member (232) moves upward, the chuck base (12) and the mobile chuck (11) can be moved upward. Accordingly, the dies (218) placed on the upper surface of the mobile chuck (11) can be tested by contacting the probe tip (234).

[0123] For example, in FIG. 7, one probe tip (234) is shown, but is not limited thereto, and multiple probe tips (234) may be provided, and multiple probe tips (234) may simultaneously contact the dies (218).

[0124] Referring to FIG. 2b and FIG. 7, when the probe tip (234) applies current to the dies (218) to test their electrical characteristics, the dies (218) may heat up. Since the electrical characteristics of the dies (218) change with temperature, the temperature of the dies (218) may be measured by a temperature sensor (not shown) to obtain accurate test results.

[0125] When the temperature of the dies (218) measured by the temperature sensor is lower than the set range, the heating unit (13) may be operated. Heat is generated from the heat source (131) of the heating unit (13), and the generated heat may be transferred to the dies (218). The temperature sensor measures the temperature of the dies (218) in real time, and when the temperature of the dies (218) is higher than the set temperature, the operation of the heating unit (13) may be stopped.

[0126] As the heat sources (131) of the heating unit (13) are positioned on the mobile chuck (11), heat transfer from the heat sources (131) to the dies (218) can be facilitated. Additionally, the temperature of the dies (218) can be precisely controlled. Furthermore, heat transfer from the heat sources (131) to the dies (218) can be rapid. Therefore, temperature control of the dies (218) can be facilitated.

[0127]

[0128] FIG. 8a is a perspective view of a chuck for die level testing according to one embodiment of the present invention. FIG. 8b is a cross-sectional view corresponding to the line II-II' shown in FIG. 8a.

[0129] Among the components shown in FIGS. 8a and 8b, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0130] Referring to FIGS. 8a and 8b, the chuck (1a) for die level testing may further include a plurality of temperature sensor units (14). The temperature sensor units (14) may be placed inside the mobile chuck (11) and the chuck base (12). The temperature sensor units (14) may measure the temperature of the dies (218, see FIG. 7) placed on the upper surface of the mobile chuck (11). If the temperature of the dies (218, see FIG. 7) measured by the temperature sensor units (14) is lower than a set temperature, heat generated from the heating unit (13) may be transferred to the dies (218, see FIG. 7).

[0131] The temperature sensor units (14) may include a plurality of measuring units (141), a plurality of upper sensor electrodes (142), a plurality of sensor connection wires (143), a plurality of lower sensor electrodes (144), a plurality of power wires (145), and a plurality of sensor elastic units (146). The measuring units (141), upper sensor electrodes (142), and sensor connection wires (143) may be placed inside the mobile chuck (11). The lower sensor electrodes (1444), power wires (145), and sensor elastic units (146) may be placed inside the chuck base (12).

[0132] The measuring units (141) can measure the temperature of the dies (218, see FIG. 7) placed on the upper surface of the mobile chuck (11). The upper sensor electrodes (142) can be placed below the measuring units (141) inside the mobile chuck (11). The lower surface of the upper sensor electrodes (142) can be exposed to the outside from the mobile chuck (11). For example, the lower surface of the upper sensor electrodes (142) can be placed on the same plane as the lower surface of the mobile chuck (11). Sensor connection wiring (143) can electrically connect the measuring units (141) and the upper sensor electrodes (142) to each other.

[0133] When the mobile chuck (11) is placed on the upper surface of the chuck base (12), the lower sensor electrodes (144) may be placed in the receiving grooves (122) defined on the upper surface of the chuck base (12). The lower sensor electrodes (144) may be in contact with the upper sensor electrodes (142). The lower sensor electrodes (144) may be electrically connected to the measuring units (141) by the upper sensor electrodes (142) and sensor connection wiring (143). One side of the power wiring (145) may be connected to the lower sensor electrodes (144). The other side of the power wiring (145) may be connected to an external power source. The lower sensor electrodes (144) may receive current from an external power source via the power wiring (145). The lower sensor electrodes (144) may transmit the current supplied from the external power source to the measuring units (141). The sensor elastic parts (146) can be in contact with the lower surface of the lower sensor electrodes (144). The sensor elastic parts (146) can apply an elastic force to the lower sensor electrodes (144) in a direction parallel to the third direction (DR3) toward the upper sensor electrodes (142). Accordingly, the lower sensor electrodes (144) and the upper sensor electrodes (142) can be in stable contact with each other.

[0134]

[0135] FIG. 9 is a cross-sectional view of a chuck for die level testing according to one embodiment of the present invention.

[0136] Among the components shown in FIG. 9, the description of components identical to those described with reference to the aforementioned drawings will be omitted or simplified.

[0137] Referring to FIG. 9, the mobile chuck (11) may include a plate (112) and a coating layer (113). A heating element (13) may be disposed inside the plate (112). The plate (112) may support dies (218, see FIG. 7).

[0138] The coating layer (113) can be placed on the lower surface of the plate (112). The coating layer (113) can cover the lower surface of the plate (112). When the plate (112) is placed on the chuck base (12), the coating layer (113) can prevent wear on the lower surface of the plate (112).

[0139]

[0140] Although embodiments of the present invention have been described, the spirit of the present invention is not limited to the embodiments presented in this specification. Those skilled in the art who understand the spirit of the present invention may easily propose other embodiments within the scope of the same spirit by adding, changing, deleting, or adding components, and such embodiments shall also be considered to fall within the scope of the spirit of the present invention.

[0141] Since the heat source of the heating unit is positioned inside the mobile chuck, the temperature of the dies positioned on the upper surface of the mobile chuck can be rapidly controlled, so the present invention is industrially applicable.

Claims

1. A mobile chuck supporting multiple dies; A chuck base positioned below the mobile chuck to support the mobile chuck; and It includes a heating element disposed inside the mobile chuck and the chuck base, and The heating unit above is, A heat source disposed inside the mobile chuck above; An upper electrode electrically connected to the heat source and facing the upper surface of the chuck base; and A chuck for die level testing comprising a lower electrode disposed between the mobile chuck and the chuck base and in contact with the upper electrode.

2. In Paragraph 1, The heating unit above is, It further includes an elastic member disposed below the lower electrode, and The above elastic member is a chuck for die level testing disposed inside a groove defined on the upper surface of the chuck base.

3. In Paragraph 2, When the mobile chuck is spaced apart from the chuck base, the lower electrode is positioned outside the groove, and A die level test chuck in which the lower electrode is disposed inside the groove when the mobile chuck is placed on the upper surface of the chuck base.

4. In Paragraph 3, A die level test chuck in which the elastic part is compressed when the mobile chuck is placed on the chuck base.

5. In Paragraph 2, The above elastic member is a chuck for die level testing including a coil spring.

6. In Paragraph 1, The heating unit above is, Connecting wiring connecting the upper electrode and the heat source to each other; and A chuck for die level testing that further includes a power line connected to the lower electrode.

7. In Paragraph 1, The above mobile chuck is, Plate; and A chuck for die level testing comprising a coating layer disposed on the lower surface of the above plate.

8. In Paragraph 1, It further includes a temperature sensor unit disposed between the mobile chuck and the chuck base, and The above temperature sensor unit is, A measuring unit disposed inside the above mobile chuck; An upper sensor electrode electrically connected to the above measuring unit and facing the chuck base; and It includes a lower sensor electrode disposed between the mobile chuck and the chuck base, and A die-level test chuck in which the upper sensor electrode and the lower sensor electrode come into contact with each other when the mobile chuck is placed on the chuck base.

9. In Paragraph 8, The above temperature sensor unit is, A chuck for die level testing further comprising a sensor elastic member positioned below the lower sensor electrode.

10. In Paragraph 1, A die level test chuck in which the upper electrode portion and the lower electrode portion come into contact with each other when the mobile chuck is placed on the chuck base.

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