Refrigerator

The refrigerator's compact heat dissipation system for thermoelectric cooling devices addresses inefficiencies in existing designs by enhancing heat dissipation, leading to improved cooling performance and energy efficiency.

WO2026146828A1PCT designated stage Publication Date: 2026-07-09SAMSUNG ELECTRONICS CO LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
SAMSUNG ELECTRONICS CO LTD
Filing Date
2025-10-31
Publication Date
2026-07-09

AI Technical Summary

Technical Problem

Existing technologies have not effectively addressed the need for a compact and efficient heat dissipation system in refrigerators using thermoelectric cooling devices, which is crucial for maintaining optimal cooling performance.

Method used

A refrigerator design incorporating a thermoelectric cooling device with a compact heat dissipation duct and fan configuration that efficiently directs air flow to enhance heat dissipation, utilizing a heat dissipation duct and fan to manage heat generated by the thermoelectric element.

Benefits of technology

The design achieves improved cooling efficiency by effectively dissipating heat generated by the thermoelectric element, ensuring consistent refrigeration performance and energy efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

This refrigerator comprises: a body comprising a storage chamber; a thermoelectric element provided on an upper wall of the body and comprising a heat-emitting part and a heat-absorbing part; a heat dissipation sink in contact with the heat-emitting part on an upper side of the thermoelectric element; and a heat dissipation duct coupled to the upper wall. The heat dissipation duct comprises: an air inlet; and a partition part which has a height lower than the height of the heat dissipation sink, and partitions the inside of the heat dissipation duct into an inlet space and a fan accommodation space provided below the inlet space. The refrigerator further comprises a heat dissipation fan provided in the fan accommodation space. The heat dissipation duct and the heat dissipation fan are provided such that the heat dissipation fan is operable to cause air to be introduced through the air inlet, flow into the inlet space, flow into the fan accommodation space, and then flow into the heat dissipation sink.
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