Temperature sensor assembly having improved response rate
The film-type thermistor temperature sensor assembly, lacking protective films and supported by a flexible insulating film and member, addresses the limitations of conventional sensors by enabling rapid and accurate temperature measurement with improved stability.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- LATTRON
- Filing Date
- 2025-12-10
- Publication Date
- 2026-07-09
AI Technical Summary
Conventional bulk-type temperature sensors are bulky, slow to respond, and unable to accurately measure rapid temperature changes, while film-type sensors lack mechanical stability and face issues with protective films delaying heat transfer.
A film-type thermistor temperature sensor assembly without protective films on the temperature measurement area, supported by a flexible insulating film and a support member, ensuring rapid and accurate temperature measurement with improved mechanical stability.
The assembly provides fast and accurate temperature measurement with enhanced mechanical stability, suitable for compact environments and rapid temperature changes.
Smart Images

Figure KR2025021263_09072026_PF_FP_ABST
Abstract
Description
Temperature sensor assembly with improved response speed
[0001] The present invention relates to a temperature sensor assembly.
[0002] More specifically, the invention relates to a temperature sensor assembly that can accurately and quickly measure the temperature of a target object through a fast response speed, thereby preventing overheating and other issues, and also has enhanced mechanical stability.
[0003] Generally, methods for measuring the temperature of an object include non-contact methods using infrared thermometers, thermocouples, and resistance temperature sensors.
[0004] Among these, a resistance temperature sensor refers to a sensor that measures temperature using a material whose resistance changes with temperature, and is generally installed and used inside or outside drive motors or secondary battery energy storage systems (ESS).
[0005] The component used in such resistance temperature sensors is called a thermistor (Thermally Sensitive Resistor), which refers to a resistor whose resistance value changes sensitively with temperature variations.
[0006] Thermistor devices include NTC thermistors (Negative Thermal Coefficient Thermistors), which exhibit a negative resistance temperature coefficient characteristic where the resistance value decreases as the temperature increases; PTC thermistors (Positive Thermal Coefficient Thermistors), which have a positive resistance temperature coefficient characteristic where the resistance value increases as the temperature increases; and CTR thermistors, in which the electrical resistance changes rapidly at a certain temperature.
[0007] Resistance temperature sensors using such thermistors are widely used due to their advantages of providing very high accuracy while enabling stable long-term measurements.
[0008] Figure 1 illustrates a temperature sensor assembly for a drive motor, which is one of the various applications of a temperature sensor assembly using such a thermistor, and is a drawing illustrating an example of mounting a busbar unit for a drive motor and a temperature sensor assembly using a conventional thermistor.
[0009] Referring to FIG. 1, the busbar unit (100) for the drive motor includes a holder having a receiving portion (140) formed therein and a temperature measuring module (150) provided in the receiving portion (140).
[0010] It should be noted that the term "temperature measurement module" here refers to the temperature sensor assembly intended to be referred to in the present invention.
[0011] As can be seen in FIG. 1, a temperature measuring module (150) is provided in the receiving portion (140) of the busbar unit to monitor the temperature of the drive motor, for example, the temperature of the coil, etc.
[0012] At this time, the temperature measurement module (150) can be formed in various structures capable of monitoring the temperature of the motor. For example, the temperature measurement module (150) may include a temperature sensor assembly (151) and a sensor housing (152) formed to surround the perimeter of the temperature sensor assembly (151). At this time, a conventional contact-type temperature sensor, such as a thermistor, may be used as the temperature sensor of the temperature sensor assembly, and a general thermocouple may be used.
[0013] The detailed configuration of the temperature measurement module described in FIG. 1 (hereinafter referred to as the 'temperature sensor assembly' in the present invention) will be explained with reference to FIG. 2.
[0014] FIG. 2 is a drawing that explains in detail the configuration of a conventional temperature sensor assembly used in the busbar unit of FIG. 1.
[0015] The conventional temperature sensor assembly (200) of FIG. 2 may be composed of a temperature sensor assembly case (210) that holds the overall shape, a thermistor element (220) that detects temperature, a lead terminal (230) connected to the thermistor element, a wire (240) connected to an external power source, an epoxy part (250) that fixes the lead terminal and the tip of the wire, and an external component connecting member (260) that is formed as part of the case and provides the function of being coupled with an external mechanism.
[0016] Here, the part consisting of the thermistor element, lead terminals, and wires can be called a temperature sensor.
[0017] However, in a conventional temperature sensor assembly (200) such as Fig. 2, a so-called bulk temperature sensor is generally used as a temperature sensor.
[0018] That is, the temperature sensor in Fig. 2 is a bulk-type temperature sensor that is thick and has a predetermined size and shape.
[0019] However, while these bulk temperature sensors may be advantageous in that they can provide relatively precise and robust performance due to their fixed physical size and volume, their large size makes them difficult to apply to components that are becoming increasingly sophisticated, lightweight, and compact.
[0020] In addition, due to their large mass and size, these bulk temperature sensors have the drawback of being unable to provide an immediate response in rapidly changing temperature environments—that is, having a slow response time—and being unable to accurately measure small temperature changes.
[0021] In order to create a temperature sensor assembly that overcomes the disadvantages of such bulk-type temperature sensors, the inventors have long been developing and manufacturing / producing a thin and flexible type of temperature sensor, which is called a film-type temperature sensor.
[0022] This term refers to a temperature sensor manufactured in the form of a film, in which a protective material is thinly coated onto a thinly fabricated temperature sensor.
[0023] These film-type temperature sensors are typically very thin with a thickness in the millimeter range and have a large surface area, so they can detect changes in temperature very quickly based on the same cross-sectional area and have the advantage of excellent space utilization.
[0024] Meanwhile, in the case of a bulk type temperature sensor, when manufacturing a temperature sensor assembly, a so-called epoxy part (250) is formed to fix / protect the leading end of the lead terminal (230) and the wire (240). Although this epoxy part (250) may be advantageous for fixing and protecting the external environment, there are additional problems such as insulation breakdown and epoxy breakage due to moisture penetration during use.
[0025] Another problem with the conventional temperature sensor assembly described in Fig. 2 is that although the epoxy part (250) that fixes the thermistor element (220), the lead terminal (230), and the tip of the wire (240) is installed inside the temperature sensor assembly case (210), it is not completely fixed and there is a possibility that the epoxy part (250) may detach from the temperature sensor assembly case (210).
[0026] If the problems of the conventional technology listed above are not resolved, the temperature sensor assembly will face issues in properly measuring the temperature of drive motors operating under harsh conditions and in rapidly changing secondary battery energy storage systems (ESS).
[0027] Meanwhile, Figure 3 is a diagram showing a general concept of a secondary battery energy storage system (300, Energy Storage System), which has been the subject of much recent research due to the development of secondary batteries.
[0028] Of course, it should be noted that the temperature sensor assembly of the present invention is an invention intended for application to such secondary battery energy storage devices (ESS).
[0029] As can be seen from FIG. 3, the secondary battery energy storage device (ESS, 300) includes a battery rack (340), a temperature sensor (370), a fire extinguishing device (360), and, if necessary, a fire curtain (350), etc.
[0030] The battery rack (340) is in the form of a housing that stores power and supplies the stored power to a load, and includes a plurality of display stands in the vertical and horizontal directions and a plurality of battery packs (315, 320, 325, 330) stored therein.
[0031] Here, the temperature sensor (370) detects when a fire occurs in the battery rack (340) or around the battery rack and notifies the Battery Management System (BMS) of abnormal high temperature or gas generation occurring in the energy storage device.
[0032] These temperature sensors (370) may be installed inside the battery rack (340) or around each of the battery packs (315, 320, 325, 330) or the PCB (Printed circuit board, not shown) connected to the battery packs. In either case, since there is a constraint that multiple temperature sensors must be installed in a limited space, there are limitations to applying conventional bulk temperature sensors, and they must be provided in a thin form as much as possible.
[0033] In FIG. 3, the temperature sensor (370) may appear to be formed in a bulk form with a large volume on the top, but in reality, it is more common for multiple sensors to be formed in a thin shape on a PCB (Printed Circuit Board) that controls the battery pack (315, 320, 325, 330).
[0034] As such, temperature sensors used in energy storage devices and battery cells of electric vehicles must have excellent responsiveness in addition to the general performance of the temperature sensors described above, as they must detect a temperature rise within a short period of time and notify the Battery Management System (BMS) or the control unit, and they must also be small in size as they must be attached to numerous secondary battery packs or PCBs.
[0035] As such, there is a film-type temperature sensor of the present inventors described above that has a thin structure with a small volume, which generally has a shape in which a thin thermistor is provided as a sensor element and the sensor element and leads are wrapped on the upper and lower surfaces with a film such as polyimide.
[0036] FIGS. 4 and FIGS. 5 show an example of a temperature sensor according to the inventors, which is disclosed in Korean Registered Patent No. 10-2696676, etc.
[0037] That is, the inventors have already recognized the need for a temperature sensor / temperature sensor assembly that has excellent temperature measurement capabilities and is small in volume, and have conducted numerous studies on this, and FIGS. 4 and 5 show one example of such.
[0038] FIG. 4 is a diagram illustrating the configuration of a flat temperature sensor assembly using a film-type thermistor temperature sensor according to an embodiment of the prior art of the present inventors, and FIG. 5 is a diagram showing the configuration of a film-type thermistor temperature sensor in the flat temperature sensor assembly of FIG. 4.
[0039] As illustrated in FIG. 4, a flat temperature sensor assembly (400) according to the inventors comprises: a sensor element (410); a lead frame connected to a pair of lead electrodes of the sensor element (410); a wire (420) connected to the lead frame; and a soldering joint (430) electrically connecting the lead frame and the wire (420); and an outer case (440) having an opening (441) formed so that the upper and lower surfaces of the head portion of the sensor element (410) are exposed.
[0040] The detailed configuration of a film-type temperature sensor element used in a conventional flat-type temperature sensor assembly according to the inventors is explained in more detail using Fig. 5.
[0041] A conventional film-type sensor element (500) is composed of a thermistor sensor element (511), a lead (512), and an insulating film (514) covering the thermistor sensor element (511). When made into a temperature sensor assembly, it is common to add a protective film such as a first head protective film (513) and a second head protective film (515).
[0042] The first head protective film (513) is formed by applying it to protect the film-type thermistor sensor element (511) fixed between the leads (512). At this time, the first head protective film (513) can be formed using silicone or epoxy.
[0043] Here, the first head protective layer (513) can be omitted, but it is recommended to form the first head protective layer (513) as this has the advantage of improving the impact resistance and mechanical properties of the temperature sensor in the temperature sensor assembly.
[0044] The insulating film (514) may include a first head protective film (513) and may be formed to wrap around and insulate the positive and negative terminals of the lead (512).
[0045] At this time, the insulating film (514) is coated in the form of a polymer film. By coating the lead frame and the head portion of the thermistor sensor element with the insulating film, the temperature sensor is prevented from being damaged and the sensor elements can be configured in close contact in a narrow space.
[0046] The second head protection film (515) can be applied to further cover the head portion wrapped with the insulating film (514).
[0047] At this time, the second head protective film (515) can be formed using silicone or resin, and is also referred to as a resin layer.
[0048] In this way, by forming multiple protective films when manufacturing the film-type thermistor temperature sensor (500), the impact resistance and strength of the thin film-type thermistor temperature sensor (500) can be increased, and accordingly, the impact resistance and durability of the final product of the flat-type temperature sensor assembly (400), which is formed by insert injection molding of the film-type thermistor temperature sensor within the outer case (440), are also improved.
[0049] Here, the structure of the insulating film can be modified in various ways, and the insulating film material is not limited thereto and can be selectively applied.
[0050] As explained earlier, temperature sensors that detect temperature changes in energy storage devices and battery cells for electric vehicles must have a small volume and must accurately detect temperature changes that occur rapidly due to changes in the environment within a short period of time.
[0051] However, when a temperature sensor assembly designed to satisfy particularly fast response speeds is manufactured using a conventional bulk-type temperature sensor, the required responsiveness cannot be satisfied. Furthermore, the temperature sensor assembly using the film-type thermistor temperature sensor already invented by the inventors has also reached its limits in terms of temperature specification accuracy and responsiveness.
[0052] Therefore, there is an urgent need to develop a temperature sensor assembly that improves upon this, specifically one capable of rapid and accurate temperature measurement while simultaneously maintaining mechanical properties.
[0053] Meanwhile, it should be noted that the background technology described above is intended to explain the background in which the present invention was derived, and does not refer to technology known prior to the filing of the present invention.
[0054] The present invention relates to a temperature sensor assembly and aims to provide a temperature sensor assembly for use in components requiring accurate temperature measurement in a short time by significantly improving the responsiveness of the temperature sensor element.
[0055] Furthermore, the present invention aims to provide a temperature sensor assembly in which the mechanical properties and stability of the temperature sensor assembly are improved by additionally applying a support member that supports the temperature sensor.
[0056] In addition, another objective of the present invention is to provide a temperature sensor assembly with improved ease of installation by adding an external component connecting member that facilitates connection with a measurement target.
[0057] Meanwhile, the technical problem to be solved by the embodiments of the present invention is not limited to the technical problem described above, and other technical problems can be inferred from the following embodiments.
[0058] The present invention provides a temperature sensor assembly comprising a film-type thermistor temperature sensor comprising: a thermistor sensor element; a pair of leads connected to the thermistor sensor element; a lead frame connected to the pair of leads; a wire connected to the lead frame; and an insulating film that coats a portion of the thermistor sensor element, leads, lead frame, and wire in a film form.
[0059] The present invention also provides a temperature sensor assembly characterized by comprising: a film-type thermistor temperature sensor comprising: a thermistor sensor element; a pair of leads connected to the thermistor sensor element; a lead frame connected to the pair of leads; a wire connected to the lead frame; and an insulating film that coats a portion of the thermistor sensor element, leads, lead frame, and wire in a film form; and also comprising a support member that supports the film-type thermistor temperature sensor.
[0060] The present invention also provides a temperature sensor assembly characterized by comprising: a film-type thermistor temperature sensor comprising: a thermistor sensor element; a pair of leads connected to the thermistor sensor element; a lead frame connected to the pair of leads; a wire connected to the lead frame; and an insulating film that coats a portion of the thermistor sensor element, leads, lead frame, and wire in a film form; a support member that supports the film-type temperature sensor; and an external component connection member.
[0061] The thermistor sensor element in the present invention is characterized as being an NTC (Negative Temperature Coefficient) element.
[0062] In particular, the temperature sensor assembly of the present invention is characterized in that it does not include any protective member in the portion corresponding to the temperature measurement area of the thermistor sensor element.
[0063] In the temperature sensor assembly of the present invention, the film-type thermistor temperature sensor is characterized by being formed by being bent into a "C" shape.
[0064] In addition, another feature of the present invention is that the film-type thermistor temperature sensor in the temperature sensor assembly is formed in a shape that wraps around a support member.
[0065] In the present invention, the support member is characterized by being formed of an insulating, flame-retardant, or a mixture thereof.
[0066] In addition, the support member of the present invention is characterized by having a groove formed therein, wherein the groove is either a "V" shape or a "C" shape, and furthermore, the groove is formed at a position where a thermistor sensor element reads the temperature.
[0067] The external component connecting member of the temperature sensor assembly of the present invention is further characterized by including a ring lug.
[0068] At this time, the ring lug is characterized by being made of either brass or aluminum.
[0069] According to an embodiment of the present invention, the temperature sensor assembly of the present invention can provide a temperature sensor assembly that is lightweight and easy to mount by using a film-type thermistor temperature sensor instead of a bulk-type thermistor temperature sensor of the prior art.
[0070] In addition, according to an embodiment of the present invention, the temperature sensor assembly of the present invention comprises a thermistor sensor element; a lead terminal connected to the thermistor element; and a wire connected to a temperature measuring device. In addition, the temperature sensor assembly formed in this manner does not include a protective member such as an epoxy molding, and thus can provide very fast and excellent temperature sensing performance.
[0071] According to another embodiment of the present invention, by mounting a film-type thermistor temperature sensor on a support member, a temperature sensor assembly with improved mechanical stability can be provided without delay in heat transfer to the thermistor sensor element, etc.
[0072] In addition, according to the present invention, by providing an external component connecting member connected to a temperature measurement target, the temperature sensor assembly of the present invention can be used very practically in various fields.
[0073] Figure 1 is a drawing illustrating an example of mounting a busbar unit for a drive motor and a conventional temperature sensor assembly.
[0074] FIG. 2 is a drawing that explains in detail the configuration of a conventional temperature sensor assembly used in the busbar unit of FIG. 1.
[0075] Figure 3 is a general conceptual diagram of a secondary battery energy storage system (ESS).
[0076] FIGS. 4 and FIGS. 5 are drawings showing an example of a flat (or film) temperature sensor according to the present inventor.
[0077] FIGS. 6a and FIGS. 6b are drawings showing a temperature sensor assembly of one embodiment of the present invention.
[0078] FIG. 7 is a drawing showing a temperature sensor assembly of another embodiment of the present invention.
[0079] FIGS. 8A and 8B are drawings illustrating a temperature sensor assembly further comprising an external component connecting member as another embodiment of the present invention.
[0080] FIG. 9 is a real photograph illustrating the process of forming a temperature sensor assembly according to an embodiment of the present invention.
[0081] FIG. 10 is a drawing illustrating various variations of the support member of the present invention.
[0082] Explanation of the symbols
[0083] 100: Busbar unit for drive motor
[0084] 140: Receiving section 150: Temperature measurement module
[0085] 151: Temperature sensor assembly 152: Sensor housing
[0086] 200: Conventional temperature sensor assembly
[0087] 210: Temperature sensor assembly case
[0088] 220: Thermistor element
[0089] 230: Lead terminal 240: Wire
[0090] 250: Epoxy part 260: External component connection part
[0091] 300: Secondary battery energy storage device
[0092] 315, 320, 325, 330: Battery pack
[0093] 340: Battery Rack 350: Fire Curtain
[0094] 360: Fire extinguishing device 370: Temperature sensor
[0095] 400: Flat temperature sensor assembly of the inventors' prior art
[0096] 410: Sensor element 420: Wire
[0097] 430: Soldering joint 440: External case
[0098] 441: Opening
[0099] 500: Film-type sensor element of the inventors' prior art
[0100] 510: Thermistor sensor element 512: Lead
[0101] 513: Primary head protective film 514: Insulating film
[0102] 515: Secondary Head Shield
[0103] 600: Film-type thermistor temperature sensor of the present invention
[0104] 610: Thermistor sensor element
[0105] 611, 612: Leads 620: Insulating film
[0106] 630; Lead frame 640; Wire
[0107] 700: Film-type thermistor temperature sensor of the present invention
[0108] 701; Temperature sensor assembly of the present invention
[0109] 710: (Film-type) Thermistor sensor element
[0110] 720: Insulating film 711, 712; A pair of leads
[0111] 730; Lead frame 740; Wire
[0112] 750; supporting member 751; opening
[0113] 800; Temperature sensor assembly of the present invention
[0114] 810; External component connecting member
[0115] 811; 1st fixed part 812; 2nd fixed part
[0116] 813; Ring lug
[0117] 1001; Home Department
[0118] 1002; The part where temperature measurement occurs in the thermistor sensor element
[0119] Hereinafter, embodiments of the present invention are described in detail with reference to the attached drawings so that those skilled in the art can easily implement the invention. The present invention may be embodied in various different forms and is not limited to the embodiments described herein. It should be noted that the drawings are schematic and not drawn to scale. Relative dimensions and proportions of parts in the drawings are exaggerated or reduced in size for clarity and convenience in the drawings, and any dimensions are merely illustrative and not limiting. Also, the same reference numerals are used to denote similar features for identical structures, elements, or parts appearing in two or more drawings.
[0120] The embodiments of the present invention specifically illustrate ideal embodiments of the present invention. As a result, various variations of the illustrations are expected. Accordingly, the embodiments are not limited to specific forms of the illustrated areas and include, for example, variations in form resulting from manufacturing. All technical and scientific terms used herein, unless otherwise defined, have the meaning generally understood by those skilled in the art to which the present invention pertains. All terms used herein are selected for the purpose of further clarifying the present invention and are not selected to limit the scope of rights according to the present invention.
[0121] Expressions used in this specification, such as "comprising," "comprising," and "having," should be understood as open-ended terms implying the possibility of including other embodiments, unless otherwise stated in the phrase or sentence containing such expressions. Singular expressions described in this specification may include a plural meaning unless otherwise stated, and this applies likewise to singular expressions described in the claims. Expressions used in this specification, such as "first," "second," etc., are used to distinguish multiple components from one another and do not limit the order or importance of said components.
[0122] As used in this specification, 'module' and 'part' refer to a unit that processes at least one function or operation, and may refer to hardware components such as, for example, software, an FPGA, or one or more processors. In describing embodiments of the present invention, if it is determined that a detailed description of a related known function or known configuration could unnecessarily obscure the essence of the present invention, such detailed description may be omitted.
[0123]
[0124] The present invention will be described in detail below together with the description of the drawings.
[0125] FIGS. 6A and FIGS. 6B are drawings showing a temperature sensor assembly of an embodiment of the present invention.
[0126] FIG. 6a shows a temperature sensor assembly which is a first embodiment of the present invention, and FIG. 6(B) is a detailed drawing of a film-type thermistor temperature sensor used therein.
[0127] Strictly speaking, FIG. 6a may be viewed as referring specifically to a film-type thermistor temperature sensor (600) among the temperature sensor assemblies of the present invention, but it is acceptable to view it as a temperature sensor assembly since it can be used for temperature measurement itself.
[0128] In the temperature sensor assembly of FIGS. 6a and 6b, the film-type thermistor temperature sensor (600) comprises a thermistor sensor element (610); a pair of leads (611, 612) of the thermistor sensor element (610); a lead frame (630) connected to the pair of leads; a wire (640) connected to the lead frame (630); and an insulating film (620) covering the thermistor sensor element, the pair of leads, the entire lead frame, and a portion of the wire.
[0129] As previously explained, the thermistor sensor element (610) of the present invention is a temperature sensor element manufactured in the form of a thin sheet, and its thickness is only a few millimeters, making it highly suitable for use in narrow spaces and very suitable as a temperature sensor element for components that are becoming lighter, thinner, and smaller.
[0130] The configuration of each of the first embodiments of the present invention will be described in detail below.
[0131] The thermistor sensor element (610) refers to a device whose resistance changes as the temperature changes. The thermistors used in the thermistor sensor element (610) of the present invention include an NTC (Negative Temperature Coefficient) thermistor having a negative temperature coefficient, a PTC (Positive Temperature Coefficient) thermistor having a positive temperature coefficient, and a CTR (Critical Temperature Resistor) thermistor whose electrical resistance changes rapidly at a certain temperature.
[0132] The present invention is based on the use of an NTC thermistor, but the thermistor applied to the present invention is not limited to a specific thermistor.
[0133] NTC thermistors are primarily made of metal oxide semiconductors, but they can also be made of organic, Si single crystal, or SiC materials.
[0134] The leads (611, 612) are fixed by inserting the thermistor sensor element (610) between them, and the leads (611, 612) and the thermistor sensor element (610) are fixed using means such as soldering.
[0135] Meanwhile, the insulating film (620) is formed by wrapping around the positive and negative terminals of the leads (611, 612) to insulate them, and can be formed in a structure that wraps around the entire film-type thermistor temperature sensor.
[0136] At this time, the insulating film (620) is coated in the form of a polymer film, and by coating the lead frame and, in some cases, the head of the temperature sensor with the insulating film, the lead frame is prevented from being damaged and the sensor elements can be configured in close contact in a narrow space such as a thin film.
[0137] A film-type thermistor temperature sensor according to one embodiment of the present invention is generally used to accurately measure temperature in high or low temperature environments. It is manufactured in the form of a thin film, which has the advantages of being small in size, fast in response speed, and space saving, and has the advantage of responding quickly due to high sensitivity to temperature changes.
[0138] Meanwhile, the most significant technical feature of the temperature sensor assembly of the present invention is that, in the case of the present invention, a film-type thermistor temperature sensor is applied without a protective film on the upper part of the film-type thermistor sensor element, particularly on the part where the thermistor reads the temperature (which is also referred to as the head part of the thermistor sensor element).
[0139] That is, as described in FIG. 5 of the prior art, in a temperature sensor assembly using a conventional film-type thermistor temperature sensor, it is common to add a protective film such as a first head protective film (513) and a second head protective film (515) to protect the thermistor sensor element (511).
[0140]
[0141] However, the significant technical feature of the present invention is that it does not include any such protective film.
[0142] In other words, conventional temperature sensor assemblies necessarily include a protective film, and while this protective film can protect the temperature sensor element and improve mechanical properties, the silicon or epoxy part used as the protective film surrounds the sensor element, causing a significant drawback in that the temperature sensor assembly cannot accurately measure the temperature of the object to be measured within a short period of time.
[0143] In the case of conventional temperature sensor assembly products having a protective film coated with epoxy, a phenomenon occurs where heat transfer is delayed due to the epoxy coating layer, resulting in the inability to accurately measure the temperature of the components to be measured within a short period of time.
[0144] Conventional temperature sensors or temperature sensor assemblies with such drawbacks have been used until now for measuring the temperature of components related to general secondary battery energy storage systems (ESS), uninterruptible power supplies (UPS), and drive motors. However, with the recent increase in high-output components and the growing demand for faster and more accurate temperature measurements in response to rapid environmental changes—such as in secondary battery energy storage systems—the inability of such conventional temperature sensor assemblies to achieve accurate temperature measurements within a short period has emerged as a significant problem.
[0145] Upon closer examination, the temperature sensor assembly of the first embodiment of the present invention shown in FIGS. 6a and 6b, that is, the film-type thermistor temperature sensor and the temperature sensor assembly using the same, is formed without integrally forming a protective film made of an epoxy part or a silicone part on the upper part of the temperature measuring part (i.e., the part where the thermistor sensor element is located), and the upper part of the film-type thermistor temperature sensor is covered with an insulating film.
[0146] A film-type thermistor temperature sensor or temperature sensor assembly manufactured in this form is of particular technical significance due to the remarkable effect of being able to accurately read the temperature of an object within a very fast response time.
[0147] Another major technical feature in manufacturing the temperature sensor assembly of the first embodiment of the present invention is that the film-type thermistor temperature sensor maintains its complete shape by bending.
[0148] In the case of conventional bulk temperature sensors, as shown in Fig. 2, it is very difficult to bend them or change their shape.
[0149] However, as shown in the first embodiment of the present invention, the temperature sensor assembly of the present invention utilizes a flexible film-type thermistor temperature sensor, so the degree of freedom of shape is very high.
[0150] When the temperature sensor assembly of Fig. 6a is bent, the total weight of the film-type thermistor sensor element is balanced so that the shape can be maintained in the bent state.
[0151] Therefore, the first embodiment of the present invention can be used as a concept of a finished product of a temperature sensor assembly, and the temperature sensor assembly of the present invention formed in this way has the significant effect of being able to accurately read the temperature of a measurement target within a very fast response time.
[0152]
[0153] Next, FIG. 7 is a drawing showing a second embodiment of the present invention.
[0154] The temperature sensor assembly of the second embodiment of the present invention is completed by further including a support member in the film-type thermistor temperature sensor (or temperature sensor assembly) of the first embodiment.
[0155] That is, the temperature sensor assembly (701) of the second embodiment of the present invention includes a film-type thermistor sensor element (710); an insulating film (720) surrounding the film-type thermistor sensor element, a pair of leads (711, 712); a lead frame (730) connected to the pair of leads; and a wire (740) connected to the lead frame (630), and includes a support member (750) that supports the film-type temperature sensor.
[0156] Although the temperature sensor assembly of the first embodiment of the present invention has the excellent effect of accurately measuring the temperature of a measurement target within a fast response time, since it takes the form of a film-type thermistor temperature sensor, there may be some lack of mechanical stability.
[0157] Accordingly, the inventors improved the completeness of the temperature sensor assembly by adding a support member (750) that supports a film-type thermistor temperature sensor to the temperature sensor assembly of the first embodiment.
[0158] That is, another temperature sensor assembly (701) of the present invention is completed by adding a support member (750) to the film-type thermistor temperature sensor (700) of the first embodiment, thereby completing a temperature sensor assembly with much stronger mechanical stability than the temperature sensor assembly of the first embodiment of the present invention.
[0159] The support member (750) used in the present invention is designed so that a thermistor sensor element (710) is positioned on the upper or lower surface of the support member (in FIG. 7, the thermistor sensor element is positioned on the upper surface of the support member, but such installation position can be changed as needed depending on the application), and the film-type thermistor temperature sensor (700) is designed to wrap around the support member while maintaining a bent state in a "C" shape, and the wire (740) is designed to come out through one end of the support member (750).
[0160] With this structure, the second embodiment of the present invention provides (1) a film-type thermistor temperature sensor with only a protective film applied without applying an epoxy protective film to the upper part of the film-type thermistor temperature sensor, thereby providing a technical feature that allows the temperature of the object to be measured to be read accurately, and (2) a temperature sensor assembly that is fixed to a support member while maintaining a predetermined shape by bending the film-type thermistor temperature sensor, thereby greatly improving mechanical stability.
[0161] That is, according to the second embodiment of the present invention, accurate and fast temperature measurement, along with further shape stability and protection from the external environment of the film-type thermistor temperature sensor, can be achieved.
[0162] Meanwhile, each component of the temperature sensor in the second embodiment of the present invention is identical to the temperature sensor of the first embodiment shown in FIG. 6, but the reference numerals are different for illustrative purposes, so this should be taken into consideration.
[0163] The support member (750) of the second embodiment of the present invention is generally manufactured by an injection molding method, and it is also preferable that the support member be made of an insulating or flame-retardant material.
[0164] That is, the support member (750) can be formed from any one of the insulating materials of PVC (Polyvinyl chloride), TPV (Thermoplastic vulcanizate), PBT (Polybutylene terephthalate), and ABS (Acrylonitrile butadiene styrene).
[0165] In addition, the support member (750) may be formed from any one of the inorganic flame retardants of aluminum hydroxide, antimony-based composition, and magnesium hydroxide.
[0166] Here, insulating materials and flame-retardant materials are not limited to these and can be applied in various ways.
[0167] Meanwhile, an elongated oval opening (751) may be formed on the upper surface of the support member (750). This opening (751) is a structure that performs the function of holding the wire (740) of the film-type thermistor temperature sensor when the support member (750) is formed by the insert injection method, but it may be omitted depending on the case.
[0168] To summarize the second embodiment of the present invention, the greatest technical feature of the present invention is to accurately measure the temperature of a measurement target object within a short period of time, that is, to provide a temperature sensor assembly with an improved temperature measurement response speed. In the second embodiment, in order to ensure the mechanical stability of the temperature sensor assembly, a support member (750) that supports a film-type thermistor temperature sensor is added to the basic technical feature of the present invention, thereby improving the stability of the temperature sensor assembly.
[0169] FIGS. 8a and 8b illustrate a third embodiment of the present invention, wherein an external component connecting member (810) is additionally configured in the temperature sensor assembly of the second embodiment of the present invention.
[0170] That is, the temperature sensor assembly according to the third embodiment of the present invention comprises a film-type thermistor temperature sensor comprising: a thermistor sensor element; a pair of leads connected to the thermistor sensor element; a lead frame connected to the pair of leads; a wire connected to the lead frame; and an insulating film that coats a portion of the thermistor sensor element, leads, lead frame, and wire in a film form; wherein the temperature sensor assembly further comprises a support member that supports the film-type temperature sensor and an external component connection member.
[0171] Here, the external component connecting member (810) serves as a case covering the film-type thermistor temperature sensor attached to the support member of the present invention, but since it is a structure that facilitates connection with external components by including ring lugs, etc., to be described later, at one end and / or the bottom, it is to be named as an external component connecting member in the present invention.
[0172] However, it should be noted that even if this is called a case, there is no significant difference in its technical significance.
[0173] In addition, a temperature sensor assembly according to a third embodiment of the present invention may be a temperature sensor assembly comprising a film-type thermistor temperature sensor consisting of a thermistor sensor element; a pair of leads connected to the thermistor sensor element; a lead frame connected to the pair of leads; a wire connected to the lead frame; and an insulating film that coats a portion of the thermistor sensor element, leads, lead frame, and wire in a film form, wherein the temperature sensor assembly further comprises a support member supporting the film-type temperature sensor and an external component connection member, and wherein a ring lug is connected to the external component connection member.
[0174] A third embodiment of the present invention will be described in more detail below in accordance with the description in the drawings.
[0175] The upper part of FIG. 8a is a drawing illustrating an external component connecting member (810) including a ring lug (813), and FIG. 8b is a drawing showing a final temperature sensor assembly (800) in which a film-type temperature sensor of the present invention is coupled to the external component connecting member (810).
[0176] The temperature sensor assembly according to an embodiment of the present invention is used by being fixed to a busbar of a drive motor or a specific part of a secondary battery energy storage device (ESS). In such actual use, the convenience of use of the temperature sensor assembly of the present invention can be greatly improved by adding an external component connection member that facilitates connection with external components.
[0177] Meanwhile, a ring lug (813) may be further added to one end of the external component connecting member (810) of the present invention. In the present invention, a ring lug refers to a structure that is connected by a screw or bolt using an end portion having a ring-shaped hole.
[0178] In the temperature sensor assembly (200) described in FIG. 2, which is a prior art, an external component connection part (260) having the function of being connected to an external mechanism was disclosed, and a ring lug can be understood as one type of connection part with such an external mechanism.
[0179] That is, the ring lug in the present invention is configured to be equivalent to the external component connection part, and the two are said to be in an equal relationship.
[0180] The ring lug can be formed integrally with the external component connecting member by extending to correspond to the bottom surface of the external component connecting member.
[0181] In the third embodiment of the present invention, such a ring lug is applied to the temperature sensor assembly of the present invention to expand the application examples of the temperature sensor assembly of the present invention to various parts.
[0182] By having this structure, the third embodiment of the present invention provides a temperature sensor assembly with greatly improved practicality by facilitating connection with an external object to be measured, and (1) a film-type thermistor sensor element having only a heat-reducing film applied without applying a protective film such as an epoxy protective film on the upper part of the film-type thermistor temperature sensor, thereby enabling the temperature of the object to be measured to be read quickly and accurately, (2) a support member that supports the film-type thermistor temperature sensor element, thereby providing excellent mechanical properties, and (3) facilitating connection with an external object to be measured.
[0183] Further features of the external component connecting member (810) of the present invention will be described below.
[0184] In the external component connecting member used in the present invention, a compression portion is generally formed to support a temperature sensor inserted therein.
[0185] In such external component connecting members (810), a compression portion is generally formed only at one end. However, in the present invention, a first fixing portion (811) that holds the middle part of the temperature sensor and a second fixing portion (812) that holds the bottom end or wire of the temperature sensor are additionally designed to simultaneously hold the body and end of the temperature sensor, thereby exhibiting characteristics of significantly improved fastening strength compared to products of the prior art.
[0186] The first fixing part (811) forms two triangular protrusions, and these two triangular protrusions are positioned in an alternating manner so that the film-type thermistor temperature sensor can be fixed more securely.
[0187] The external component connecting member of the present invention uses a material such as brass (C2680R), but is not limited to such a material as long as it is a material with excellent machinability.
[0188] The bottom surface thickness of the external component connection member (810) of the present invention, that is, the location where the temperature measuring part of the film-type thermistor temperature sensor is formed, is typically maintained at 0.25 to 0.5 mm, but it is preferable to make it as small as possible to improve the thermistor sensor element and measurement sensitivity.
[0189] Figure 9 shows an actual photograph of a temperature sensor assembly formed according to an embodiment of the present invention.
[0190] As shown in (A) of FIG. 9, with the film-type thermistor temperature sensor (600, 700) mounted on the external component connecting member (810) including the ring lug (813) and the support member (750) prepared, as shown in (B) of FIG. 9, the film-type thermistor temperature sensor (600, 700) is inserted into the external component connecting member (810), and as shown in (C) of FIG. 9, the first fixing part (811) that holds the center part of the temperature sensor is compressed, and the temperature sensor assembly of the present invention is completed as shown in (D) of FIG. 9.
[0191]
[0192] Below, additional technical features for further improving the characteristics of the temperature sensor assembly of the present invention will be described.
[0193] FIG. 10 is a drawing illustrating the diversification of the shape of the support member to improve the characteristics of the temperature sensor assembly of the present invention.
[0194] Although the temperature sensor assembly to which the film-type thermistor temperature sensor of the present invention is applied exhibits very fast temperature response compared to the prior art, there is a possibility that a delay in temperature measurement may occur when the temperature measuring part (also referred to as the head part) of the film-type thermistor sensor element is fixed to a support member during multiple or long-term temperature measurements.
[0195] Accordingly, the inventors formed a groove in the area where the thermistor sensor element is located, that is, the area where temperature measurement occurs, to further improve the accuracy of temperature measurement.
[0196] That is, as can be seen from FIG. 10, the temperature measurement part (1022) where the temperature measurement takes place is provided with a "V" shaped or "indented C" shaped groove (1001) at the bottom, thereby improving the responsiveness and accuracy of the temperature measurement of the temperature sensor assembly of the present invention.
[0197] In other words, this groove is formed at the temperature measurement location of the film-type thermistor temperature sensor, that is, at the temperature measurement location of the thermistor sensor element. It can be confirmed that this groove is very useful in that it significantly improves the temperature sensing capability of the temperature sensor by forming a groove that allows the thermistor sensor element to communicate with the outside in the film-type flat-type thermistor temperature sensor.
[0198] There are no particular restrictions on the size and shape of the home portion, and it is sufficiently effective even if only minimal space is provided to the flat film-type thermistor temperature sensor.
[0199] Table 1 compares the thermal time constant measurement results of the temperature sensor assembly of the present invention according to whether a groove is formed in the support member under the same conditions.
[0200]
[0201] As can be seen from Table 1, it can be confirmed that the thermal time constant value of the temperature sensor assembly is excellent when a groove is formed in the support member. Meanwhile, as another method to improve the characteristics of the temperature sensor assembly of the present invention, the thermal time constant value of the temperature sensor assembly when the material of the ring lug is improved from brass to aluminum is shown in Table 2.
[0202]
[0203] As can be seen from Table 2, referring to the results in Table 1, it can be seen that the thermal time constant is significantly improved by changing the support member from brass to aluminum. In addition, it can be confirmed that forming a groove when the ring lug is made of aluminum material has a significant effect on improving the thermal time constant value of the temperature sensor assembly.
[0204] Table 3 shows experimental results comparing the characteristics of an embodiment of the present invention and a temperature sensor assembly of the prior art to summarize the present invention.
[0205] Here, the conventional product is a bulk-type temperature sensor assembly in which epoxy molding is formed on the temperature measuring portion of the thermistor element, and the present invention represents a third embodiment of the present invention.
[0206] [Correction pursuant to Rule 91 10.02.2026]
[0207]
[0208] As shown in Table 3, the present invention tracks the temperature of the object being measured with great precision, whereas the prior art shows a difference of more than 10 degrees, which immediately confirms the superior effect of the present invention.
[0209] As such, it has been confirmed that the present invention provides a temperature sensor assembly that accurately measures temperature in a short time in a rapidly changing environment.
[0210]
[0211] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without altering its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive, and the scope of the present invention is defined by the claims set forth below. Furthermore, all modifications or variations derived from the meaning and scope of the claims and their equivalents should be interpreted as being included within the scope of the present invention.
[0212] An embodiment of the present invention can be used industrially by providing a temperature sensor assembly for use in components requiring accurate temperature measurement in a short time by significantly improving the responsiveness of the temperature sensor element.
[0213] In addition, the present invention provides a temperature sensor assembly that can be industrially utilized by additionally applying a support member that supports the temperature sensor, thereby improving the mechanical properties and stability of the temperature sensor assembly.
[0214] In addition, the present invention can be used industrially by providing a temperature sensor assembly with improved ease of installation through the addition of an external component connecting member that facilitates connection with a measurement target.
Claims
1. Thermistor sensor element; A pair of leads connected to the thermistor sensor element; A lead frame connected to the above pair of leads; Wire connected to the lead frame above; and An insulating film that applies the thermistor sensor element, the lead, the lead frame, and a portion of the wire in a film form; A temperature sensor assembly characterized by including a film-type thermistor temperature sensor.
2. Thermistor sensor element; A pair of leads connected to the thermistor sensor element; A lead frame connected to the above pair of leads; Wire connected to the lead frame above; and An insulating film that applies the thermistor sensor element, the lead, the lead frame, and a portion of the wire in a film form; It includes a film-type thermistor temperature sensor composed of, A support member supporting the above-mentioned film-type thermistor temperature sensor; A temperature sensor assembly characterized by also including 3. Thermistor sensor element; A pair of leads connected to the thermistor sensor element; A lead frame connected to the above pair of leads; Wire connected to the lead frame above; and An insulating film that applies the thermistor sensor element, the lead, the lead frame, and a portion of the wire in a film form; It includes a film-type thermistor temperature sensor composed of, A support member supporting the above film-type temperature sensor; comprising Also, external component connecting member; A temperature sensor assembly characterized by further including 4. In any one of claims 1, 2, and 3, A temperature sensor assembly characterized in that the thermistor sensor element is an NTC (Negative Temperature Coefficient) element.
5. In any one of claims 1, 2, and 3, The above film-type thermistor temperature sensor is a temperature sensor assembly characterized in that a protective member is not applied to a portion corresponding to the temperature measurement area of the thermistor sensor element.
6. In any one of claims 1, 2, and 3, A temperature sensor assembly characterized by the above-described film-type thermistor temperature sensor being formed by bending it into a "U" shape.
7. In either of claims 2 or 3, A temperature sensor assembly characterized in that the above film-type thermistor temperature sensor is formed in a shape that wraps around the support member.
8. In either of claims 2 or 3, A temperature sensor assembly characterized in that the above-mentioned support member is formed of insulating, flame-retardant, or a mixture thereof.
9. In either of claims 2 or 3, A temperature sensor assembly characterized by having a groove formed in the above-mentioned support member.
10. In Claim 9, A temperature sensor assembly characterized in that the above-mentioned groove is either a "V" shape or a "C" shape.
11. In Claim 10, A temperature sensor assembly characterized in that the above-mentioned groove is formed at a position where a thermistor sensor element reads the temperature.
12. In Claim 3, A temperature sensor assembly characterized in that the above-mentioned external component connecting member further includes a ring lug.
13. A temperature sensor assembly according to claim 12, characterized in that the ring lug is made of either brass or aluminum.