Electronic device

Abstract

The present application relates to the technical field of electronic devices, provides an electronic device, and is used for solving the problem of how to improve the heat dissipation performance of the electronic device. Specifically, a first middle plate of the electronic device has a first surface and a second surface, the first surface has a first recess, and a first sidewall region of the first recess is a stepped surface. A vapor chamber is located in the first recess, a first main body portion has a first side surface region and a second side surface region, a first connection portion is connected to the first side surface region and lap-jointed and fixed to the first sidewall region, and the second side surface region faces a second sidewall region of the first recess. At least part of a first heat source component is located on a second surface side, and the first heat source component is thermally connected to the first main body portion. A connection member is connected to the first main body portion, and at least part of the connection member is located on the outer peripheral side of the first recess and connected to the first middle plate. A first screen portion is bonded to the first surface by means of a first adhesive layer, and the first adhesive layer and the first heat source component are respectively located on two sides of the second side surface region.

Description

electronic devices

[0001] This application claims priority to Chinese Patent Application No. 202510028440.6, filed with the State Intellectual Property Office of China on January 7, 2025, entitled “Electronic Device”, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of electronic equipment technology, and more particularly to an electronic device. Background Technology

[0003] With the continuous development of electronic devices (such as mobile phones and tablets), these devices are becoming increasingly feature-rich, and the heat generated by some internal components is also increasing. Therefore, electronic devices are equipped with vapor chambers (VCs) to dissipate heat and ensure performance. In related technologies, a stepped groove is typically created in the frame of the electronic device, and the vapor chamber is fixed to the sidewall of the stepped groove via a connecting part extending from the edge of a cover plate, thus connecting the vapor chamber to the frame.

[0004] However, while ensuring space around the stepped groove for laying other structural components (such as sealant), the limited size of the stepped groove results in a limited volume of the heat dissipation body of the heat spreader, which in turn cannot guarantee heat dissipation for components with high heat generation. Summary of the Invention

[0005] This application provides an electronic device to address the problem of how to improve the heat dissipation performance of electronic devices.

[0006] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0007] This application provides an electronic device comprising a first intermediate plate, a heat spreader, a first heat source component, a connector, and a first screen portion. The first intermediate plate has a first surface and a second surface arranged along its thickness direction. The first surface has a first groove, and the groove sidewalls include a first sidewall region and a second sidewall region arranged circumferentially. The first sidewall region is a stepped surface. The heat spreader is located within the first groove and includes a first main body and a first connecting portion. The first main body has a sealing cavity; the outer surface of the first main body has a first side region and a second side region. The first connecting portion is connected to the first side region and overlaps and is fixed to the first sidewall region; the second side region faces the second sidewall region. The first heat source component is fixed relative to the first intermediate plate, and at least a portion of the first heat source component is located on the side of the second surface opposite to the first surface. The first heat source component is thermally connected to the first main body. The connector is connected to the first main body, and at least a portion of the connector is located on the outer periphery of the first groove and connected to the first intermediate plate. The orthographic projection of the connector along the thickness direction of the first intermediate plate overlaps with the second sidewall region. The first screen portion is bonded to the first surface by a first adhesive layer, and the first adhesive layer and the first heat source component are located on both sides of the second side area, respectively.

[0008] The electronic device provided in this application embodiment, by placing a heat spreader plate in a first groove, with the second side surface area of ​​the first main body of the heat spreader plate facing the second side wall area of ​​the first groove, and the first heat source component and the first adhesive layer located on both sides of the second side surface area, allows for a larger volume of the first main body portion that is thermally connected to the first heat source component while ensuring the bonding width of the first adhesive layer, which limits the area of ​​the first groove. This improves the heat dissipation effect on the first heat source component and thus enhances the overall heat dissipation performance of the electronic device. By having the first connecting portion of the heat spreader plate overlap and be fixed to the first side wall area of ​​the first groove, with the connector connected to the first main body and at least a portion of the connector located on the outer periphery of the first groove and connected to the first middle plate, the connection reliability between the heat spreader plate and the first middle plate can be improved. This prevents the heat spreader plate portion corresponding to the second side surface area from warping and loosening, squeezing the screen and damaging it when the electronic device is impacted. It also allows for flexible design of the length, width, thickness, and shape of the connector, which helps to provide clearance space for the first adhesive layer, ensuring the connection reliability between the screen and the first middle plate and the dustproof and waterproof performance of the first adhesive layer.

[0009] In some possible implementations, the first main body includes a third surface and a fourth surface arranged along the thickness direction of the first middle plate, the third surface having the same orientation as the first surface. The connector includes a first part and a second part, the first part being connected to the third surface, and the second part being located on the outer periphery of the first groove and connected to the first surface.

[0010] In this way, the connector and the heat spreader can be connected as two separate structural components. The thickness, length, width, and shape of the connector are not limited by the performance requirements, manufacturing process, or connection structure between the heat spreader and the first intermediate plate, simplifying the design of the connector and the assembly between the connector and the first intermediate plate and the heat spreader. Furthermore, the connector is located on the side of the heat spreader and the first intermediate plate opposite to the second surface, allowing for a thicker first intermediate plate portion connected to the second part, ensuring the strength of the first intermediate plate and thus the overall strength of the electronic device. At the same time, the connector does not occupy space on the second surface side of the first intermediate plate, facilitating the placement of other components of the electronic device.

[0011] In some possible implementations, the size of the second part protruding from the second side region is smaller than the size of the first connecting part protruding from the first side region.

[0012] In this way, while improving the connection reliability between the heat spreader and the first middle plate, the second part occupies less space around the first groove, which can reserve enough space for the first adhesive layer, ensuring the connection reliability between the screen and the first middle plate and the dustproof and waterproof performance of the first adhesive layer.

[0013] In some possible implementations, the first middle plate further has a first protrusion located within a first groove and connected to a second sidewall region. The protrusion of the first protrusion from the second sidewall region is smaller than the protrusion of the first connecting portion from the first sidewall region. The second portion is also connected to the first protrusion.

[0014] In this way, while ensuring the bonding width of the first adhesive layer and improving the heat dissipation efficiency of the electronic device, the bonding area between the second part and the first surface can be further increased to ensure the reliability of the connection between the connector and the first middle plate.

[0015] In some possible implementations, the side of the first adhesive layer facing the first groove has a first clearance groove, and at least a portion of the second part is located within the first clearance groove. This ensures sufficient contact area between the second part and the first surface to guarantee reliable connection between the connector and the first middle plate.

[0016] In some possible implementations, the second surface has a second groove; the orthographic projection of the second portion in the first reference plane overlaps with the projection of the second groove in the first reference plane, the first reference plane being a plane perpendicular to the thickness direction of the first intermediate plate. The electronic device also includes a first circuit board and a first device, both the first heat source component and the first device being fixed to the first circuit board, and a portion of the first device being located within the second groove.

[0017] In this way, the space facing one side of the bottom wall of the second groove is relatively large, which can provide more space for the circuit board assembly, thus facilitating the thinning of the entire electronic device. Furthermore, the connector is located on the side of the heat spreader opposite to the second surface, allowing for a larger thickness of the first intermediate plate portion connected to the connector, which helps ensure the strength of the first intermediate plate and consequently the strength of the entire electronic device.

[0018] In some possible implementations, the second part includes a fifth surface facing away from the second surface; the first adhesive layer includes a sixth surface facing away from the second surface. The fifth and sixth surfaces are flush; or, the fifth surface is located on the side facing away from the sixth surface.

[0019] In this way, the second part of the connector will not protrude from the sixth surface of the first adhesive layer and squeeze the screen, thus preventing the screen from being easily damaged or malfunctioning.

[0020] In some possible implementations, the electronic device further includes a heat sink, a portion of which covers the third surface, and a portion of which is located on the outer periphery of the first groove and covers the first surface. The surface of the heat sink facing the third surface has a second clearance groove, a first portion of which is located within the second clearance groove, and a second portion of which is located on the outer periphery of the heat sink.

[0021] In this way, the heat sink can be thermally connected to the first main body of the heat spreader, facilitating the transfer of heat from the heat spreader to the cool area of ​​the first intermediate plate for heat dissipation, thereby further improving the heat dissipation effect of the electronic device. In addition, the second clearance groove reduces the superimposed thickness of the heat sink and the connector, which helps to reduce the overall thickness of the electronic device and achieve a thinner design.

[0022] In some possible implementations, the connector is located on the outer periphery of the first main body and is connected to the second surface.

[0023] In this configuration, the connector and the first connecting portion are located on opposite sides of the first middle plate. The first connecting portion mates with the first sidewall area, restricting the movement of the heat spreader relative to the first middle plate along the side facing the second surface. The connector mates with the second surface, further restricting the movement of the heat spreader relative to the first middle plate along the side facing the first surface. This improves the reliability of the connector in attaching the heat spreader to the first middle plate. Furthermore, the connector does not need to avoid the first adhesive layer, resulting in fewer restrictions and lower design and assembly complexity. Similarly, this allows for a larger bonding width of the first adhesive layer, ensuring its dustproof and waterproof performance.

[0024] In some possible implementations, the second surface has a third groove that extends through the second sidewall region; the connector is located within the third groove. The first surface has a second protrusion located on the side of the first adhesive layer facing the first groove, and the orthographic projection of the third groove onto the first reference plane lies within the orthographic projection of the second protrusion onto the first reference plane; the first reference plane is a plane perpendicular to the thickness direction of the first middle plate.

[0025] In this way, while ensuring the space for the components on the second surface side of the first middle plate, the thickness of the first middle plate can be guaranteed to ensure its strength, thereby ensuring the overall strength of the electronic device.

[0026] In some possible implementations, the first main body includes a first cover plate and a second cover plate, with a sealing cavity formed between the first cover plate and the second cover plate. The surface of the first cover plate facing away from the sealing cavity has the same orientation as the first surface. The first connecting portion is integrally formed with the first cover plate.

[0027] In some possible implementations, the first main body includes a first cover plate and a second cover plate, with a sealing cavity formed between the first and second cover plates. The surface of the first cover plate facing away from the sealing cavity has the same orientation as the first surface. The connector and the second cover plate are integrally formed.

[0028] In some possible implementations, the first main body includes a first cover plate and a second cover plate, with a sealing cavity formed between the first cover plate and the second cover plate. The surface of the first cover plate facing away from the sealing cavity has the same orientation as the first surface. The first connecting part is integrally formed with the first cover plate; the connecting member is integrally formed with the second cover plate.

[0029] This results in a simple structure for the heat spreader and connectors, high overall strength, and high manufacturing efficiency.

[0030] In some possible implementations, the electronic device also includes a heat sink, a portion of which covers the first body portion and is located on the outer periphery of the first groove and covers the first surface.

[0031] In this way, the heat sink can be thermally connected to the first main body of the heat spreader, which facilitates the transfer of heat from the heat spreader to the cool area of ​​the first intermediate plate for heat dissipation, thereby further improving the heat dissipation effect of the electronic device.

[0032] In some possible implementations, the connector is located between the two ends of the second sidewall region along the circumference of the first groove.

[0033] In this way, while ensuring the reliability of the connection between the heat spreader and the first middle plate, the area of ​​the connector covering the first surface is small, which can provide as much bonding area as possible for the first adhesive layer, ensuring the bonding reliability between the screen and the first middle plate and the dustproof and waterproof performance of the first adhesive layer, and also contributing to the lightweighting of electronic devices.

[0034] In some possible implementations, the electronic device also includes a battery. The battery is fixed to the second surface, and the battery and the first heat source component are located on the same side of the first body and spaced apart from each other; at least a portion of the battery is thermally connected to the first body.

[0035] In this way, when the electronic device is in operation (such as gaming, shooting, or playing audio / video), the first heat source component generates more heat and is a relatively hot zone. At this time, the battery, due to its low internal resistance and low current, is a relatively cool zone. The liquid working fluid in the sealed cavity can quickly transfer the heat generated by the first heat source component to the parts that are thermally connected to the battery to dissipate heat from the first heat source component. When the electronic device is charging, the battery is a relatively hot zone, and the areas including the first heat source component are relatively cool zones. The heat spreader can dissipate heat from the battery.

[0036] In some possible implementations, the electronic device further includes a second adhesive layer. The second adhesive layer is bonded between the first surface and the first screen portion, and both ends of the second adhesive layer are respectively connected to both ends of the first adhesive layer to form a sealing ring; the heat spreader, the first heat source component, and the connector are all located inside the sealing ring.

[0037] In this way, the first and second adhesive layers not only fix the first screen portion to the first middle plate, but also prevent dust and moisture from the outside of the electronic device from entering the electronic device through the gap between the first screen portion and the first middle plate and damaging the components of the electronic device. Attached Figure Description

[0038] Figure 1 is a perspective view of an electronic device provided in some embodiments of this application in an unfolded state;

[0039] Figure 2 is a partial exploded view of the electronic device shown in Figure 1;

[0040] Figure 3 is a schematic diagram of the electronic device shown in Figure 1 when it is in a folded state;

[0041] Figure 4 is a schematic diagram of a partial structure of the electronic device shown in Figure 1;

[0042] Figure 5 is an exploded structural diagram of a portion of the electronic device shown in Figure 4.

[0043] Figure 6 is a schematic diagram of the heat spreader of the electronic device shown in Figure 5;

[0044] Figure 7 is a cross-sectional view of the heat spreader shown in Figure 6 at line AA;

[0045] Figure 8 is a cross-sectional view of the electronic device shown in Figure 4 at line BB;

[0046] Figure 9 is a cross-sectional view of the electronic device shown in Figure 4 at the CC line;

[0047] Figure 10 is a schematic diagram of another part of the structure of the electronic device shown in Figure 1;

[0048] Figure 11 is a schematic diagram of the heat spreader provided in some other embodiments of this application;

[0049] Figure 12 shows a partial structure of the electronic device shown in Figure 10 and a cross-sectional view of the heat spreader plate shown in Figure 11 after assembly.

[0050] Figure 13 is another structural schematic diagram of a part of the electronic device shown in Figure 1;

[0051] Figure 14 is an exploded structural diagram of a portion of the electronic device shown in Figure 13;

[0052] Figure 15 is a cross-sectional view of the electronic device shown in Figure 13 at the DD line;

[0053] Figure 16 is another cross-sectional view of a portion of the electronic device shown in Figure 1;

[0054] Figure 17 is a schematic diagram of the heat spreader of the electronic device shown in Figure 16.

[0055] Reference numerals: 100 - Electronic device; 10 - Screen; 11 - First screen portion; 12 - Second screen portion; 13 - Third screen portion; 20 - Support device; 21 - First housing; 211 - First middle frame; 2111 - First side frame; 21111 - First side frame segment; 21112 - Second side frame segment; 21113 - Third side frame segment; 2112 - First middle plate; 2112a - First surface; 2112b - Second surface; 2112c - First groove; 2112c1 - First through hole; 2112c2 - Second through hole; 2112c3 - First side wall area; 2112c4 - Second side wall area; 2112d - First protrusion; 2112e - Second groove; 2112f - Third groove; 2112g - Second protrusion; 212 - First back cover; 22 - Second housing; 221 - Second middle frame; 2211 - Second side frame; 2212 - Second middle plate; 222 - Second back cover; 23 - Rotating shaft mechanism; 30-First adhesive layer; 31-First adhesive layer; 31a-First clearance groove; 31b-Sixth surface; 32-Second adhesive layer; 321-First sub-adhesive layer; 322-Second sub-adhesive layer; 323-Third sub-adhesive layer; 40-Second adhesive layer; 50-Circuit board assembly; 51-First circuit board; 52-First heat source component; 53-First device; 531-First electronic component; 532-Shielding cover; 532a-Third through hole; 533-Metal sheet; 60-Heat spreader; 61-First main body; 61a-Sealed cavity; 61b-First side area; 61c-Second side area; 61d-Third surface; 61f-Fourth surface; 611-First cover plate; 612-Second cover plate; 613-Capillary structure; 62-First connecting part; 70-Heat sink; 70a-Second clearance groove; 80-Battery; 90 - Connector; 91 - First part; 92 - Second part; 92a - Fifth surface. Detailed Implementation

[0056] In the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation" and "connection" should be interpreted broadly. For example, "connection" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0057] In the embodiments of this application, it should be understood that the directional terms mentioned, such as "up", "down", "left", "right", "inner", "outer", etc., are only for reference to the direction of the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0058] In the embodiments of this application, the terms "first," "second," "third," "fourth," "fifth," and "sixth" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined with "first," "second," "third," "fourth," "fifth," and "sixth" may explicitly or implicitly include one or more of that feature.

[0059] In embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0060] In the embodiments of this application, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0061] In the embodiments of this application, it should be noted that the descriptions of "vertical" and "parallel" respectively indicate approximately vertical and approximately parallel within a certain error range. The error range can be a range with a deviation angle of less than or equal to 5°, 8°, 10° or 15° relative to absolute verticality and absolute parallelism, respectively, and is not specifically limited here.

[0062] This application provides an electronic device, including but not limited to mobile phones, tablet personal computers, personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, and wireless terminals in smart homes, etc.

[0063] This application uses handheld devices as examples of electronic devices, such as mobile phones, which may be foldable screen phones.

[0064] Please refer to Figures 1 and 2. Figure 1 is a perspective view of the electronic device 100 in its unfolded state according to some embodiments of this application, and Figure 2 is a partially exploded structural diagram of the electronic device 100 shown in Figure 1. The electronic device 100 is approximately rectangular in shape when unfolded. For ease of description of the embodiments below, an XYZ coordinate system is established for the electronic device 100 in its unfolded state, defining the length direction of the electronic device 100 as the X-axis, the width direction as the Y-axis, and the thickness direction as the Z-axis. It is understood that the coordinate system setting of the electronic device 100 can be flexibly set according to actual needs and is not specifically limited here. In other embodiments, the shape of the electronic device 100 may also be a square plate, a circular plate, an elliptical plate, etc.

[0065] The electronic device 100 includes a screen 10 and a support device 20.

[0066] Screen 10 is the screen of electronic device 100, used to display images, videos, and other information. Screen 10 can be an organic light-emitting diode (OLED) screen, a micro organic light-emitting diode (MOLED) screen, a quantum dot light-emitting diode (QLED) screen, a liquid crystal display (LCD), etc.

[0067] Screen 10 has a display area for displaying image information, and the display area of ​​screen 10 is exposed to facilitate the presentation of images, videos, and other information to the user. Screen 10 includes a first screen portion 11, a second screen portion 12, and a third screen portion 13 connected in sequence. In the embodiments shown in Figures 1 and 2, screen 10 is in an unfolded state, with the first screen portion 11, the second screen portion 12, and the third screen portion 13 arranged sequentially along the X-axis, so that the electronic device 100 folds laterally. In some other embodiments, when screen 10 is in the unfolded state, the first screen portion 11, the second screen portion 12, and the third screen portion 13 may also be arranged sequentially along the Y-axis, so that the electronic device 100 folds vertically. When screen 10 is in the unfolded state, a large-screen display can be achieved to provide users with richer information and a better user experience.

[0068] At least the second screen portion 12 of screen 10 is a flexible screen structure. Thus, the second screen portion 12 can bend and deform under external force, causing screen 10 to fold from the unfolded state shown in Figure 1 to the folded state. The first screen portion 11 and the third screen portion 13 of screen 10 can be flexible screen structures, rigid screen structures, or a combination of both; no specific limitations are made here.

[0069] Please refer to Figure 3, which is a structural schematic diagram of the electronic device 100 shown in Figure 1 in a folded state. The screen 10 in this electronic device 100 is also in a folded state. Specifically, when the screen 10 is in a folded state, the first screen portion 11 and the third screen portion 13 of the screen 10 are approximately parallel and opposite to each other. It should be noted that the angle between the first screen portion 11 and the third screen portion 13 is within 30°, and the first screen portion 11 and the third screen portion 13 can be considered approximately parallel. The first screen portion 11 and the third screen portion 13 being opposite to each other means that the display surface of the first screen portion 11 faces the display surface of the third screen portion 13.

[0070] Please refer to Figure 3. The support device 20 is used to support the screen 10. When the electronic device 100 is in a folded state, the support device 20 protects the screen 10 from view, making the screen 10 invisible to the user. This means the electronic device 100 is an inward-folding electronic device, preventing the screen 10 from being scratched by hard objects. In some other embodiments, when the electronic device 100 is in a folded state, the screen 10 can also be located outside the support device 20, making the screen 10 visible to the user. This means the electronic device 100 is an outward-folding electronic device, allowing for the display of video and images even when folded.

[0071] The support device 20 includes a first housing 21, a second housing 22, and a pivot mechanism 23. The first housing 21 supports the first screen portion 11, and the second housing 22 supports the third screen portion 13. The pivot mechanism 23 connects the first housing 21 and the second housing 22 and supports the second screen portion 12, that is, the second screen portion 12 of the screen 10 is supported on the pivot mechanism 23. The pivot mechanism 23 is used to realize the rotation between the second housing 22 and the first housing 21 to support the screen 10 to fold between an unfolded state and a folded state.

[0072] Please refer back to Figure 2. The first housing 21 may include a first middle frame 211 and a first back cover 212. The first middle frame 211 may include a first border 2111 and a first middle plate 2112, with the first border 2111 surrounding the outer peripheral edge of the first middle plate 2112. Based on this, the first screen portion 11 of the screen 10 can be bonded and fixed to the first middle plate 2112. Specifically, the first middle plate 2112 includes a first surface 2112a and a second surface 2112b (not shown in Figure 2) arranged along the thickness direction (Z-axis direction). The first screen portion 11 is bonded to the first surface 2112a through a first adhesive layer 30, that is, the first screen portion 11 is located on the side of the first surface 2112a that is opposite to the second surface 2112b.

[0073] The first back cover 212 is located on the side of the first middle plate 2112 opposite to the first screen portion 11. The first back cover 212 is fixed to the first frame 2111 and can be replaced with a display screen (such as an LCD display screen). In some examples, the first back cover 212 can be fixed to the first frame 2111 by means of adhesive, snap-fit, etc. In other examples, the first back cover 212 can also be integrally formed with the first frame 2111, that is, the first back cover 212 and the first frame 2111 are a single structural component. The first back cover 212, the first frame 2111, and the first middle plate 2112 enclose a first receiving cavity. Based on this, the first housing 21 can be connected to the rotating shaft mechanism 23 through the first middle frame 211.

[0074] Referring to Figure 2, the second housing 22 may include a second middle frame 221 and a second back cover 222. The second middle frame 221 may include a second side frame 2211 and a second middle plate 2212. The second side frame 2211 surrounds the outer peripheral edge of the second middle plate 2212. Based on this, the third screen portion 13 of the screen 10 can be bonded and fixed to the second middle plate 2212 by the second adhesive layer 40, that is, the third screen portion 13 is stacked with the second middle plate 2212 and located on one side of the second middle plate 2212. The pivot mechanism 23 can be connected between the first middle frame 211 and the second middle frame 221.

[0075] The second back cover 222 is located on the side of the second middle plate 2212 opposite to the third screen portion 13. The second back cover 222 is fixed to the second frame 2211 and can be replaced with a display screen (such as an LCD display). In some examples, the second back cover 222 can be fixed to the second frame 2211 by adhesive, snap-fit, or other means. In other examples, the second back cover 222 can also be integrally formed with the second frame 2211, that is, the second back cover 222 and the second frame 2211 are a single structural component. The second back cover 222, the second frame 2211, and the second middle plate 2212 enclose a second receiving cavity. This second receiving cavity and the aforementioned first receiving cavity are used to accommodate electronic components such as the main circuit board, the sub-circuit board, the speaker module, the camera module, and the battery. Based on this, the second housing 22 can be connected to the pivot mechanism 23 via the second middle frame 221.

[0076] Please refer to Figure 2. The first border 2111 includes a first border segment 21111, a second border segment 21112, and a third border segment 21113. The extension directions of the first border segment 21111 and the third border segment 21113 are both parallel to the X-axis direction, and the extension direction of the second border segment 21112 is parallel to the Y-axis direction. The first border segment 21111, the second border segment 21112, and the third border segment 21113 are connected sequentially. In some other embodiments, the first border segment 21111 may also be parallel to the Y-axis direction, and the second border segment 21112 and the third border segment 21113 may be parallel to the X-axis direction. This application does not limit this.

[0077] The first adhesive layer 30 includes a first adhesive layer 31 and a second adhesive layer 32, both of which are bonded between the first surface 2112a and the first screen portion 11. The first adhesive layer 31 has a sixth surface 31b, which faces away from the second surface 2112b. The first adhesive layer 31 extends parallel to the Y-axis and is bonded to the edge portion of the first surface 2112a near the pivot mechanism 23. The second adhesive layer 32 extends in the same direction as the first frame 2111 and is bonded to the edge portion of the first surface 2112a near the first frame 2111. Specifically, the second adhesive layer 32 includes a first sub-adhesive layer 321, a second sub-adhesive layer 322, and a third sub-adhesive layer 323. The first sub-adhesive layer 321 extends in the same direction as the first frame segment 21111 and is bonded to the edge portion of the first surface 2112a near the first frame segment 21111; the second sub-adhesive layer 322 extends in the same direction as the second frame segment 21112 and is bonded to the edge portion of the first surface 2112a near the second frame segment 21112; the third sub-adhesive layer 323 extends in the same direction as the third frame segment 21113 and is bonded to the edge region of the first surface 2112a near the third frame segment 21113.

[0078] Based on this, the first sub-adhesive layer 321, the second sub-adhesive layer 322, and the third sub-adhesive layer 323 are connected sequentially. The end of the first sub-adhesive layer 321 away from the second sub-adhesive layer 322 is connected to one end of the first adhesive layer 31, and the end of the third sub-adhesive layer 323 away from the second sub-adhesive layer 322 is connected to the other end of the first adhesive layer 31. That is, both ends of the second adhesive layer 32 are respectively connected to both ends of the first adhesive layer 31 to form a continuous annular sealing ring. In this way, the first adhesive layer 30, while fixing the first screen portion 11 to the first middle plate 2112, can also prevent dust and moisture from the outside of the electronic device 100 from entering the interior of the electronic device 100 through the gap between the first screen portion 11 and the first middle plate 2112 and damaging the components of the electronic device 100.

[0079] Please refer to Figures 4 and 5. Figure 4 is a schematic diagram of a partial structure of the electronic device 100 shown in Figure 1, and Figure 5 is an exploded structural view of a partial structure of the electronic device 100 shown in Figure 4. The first surface 2112a of the first intermediate plate 2112 has a first groove 2112c, the bottom wall of which faces away from the second surface 2112b. The sidewall of the first groove 2112c is a stepped surface. The first intermediate plate 2112 also has a first through hole 2112c1 and a second through hole 2112c2 spaced apart. One end of the first through hole 2112c1 and the second through hole 2112c2 opens on the bottom wall of the first groove 2112c, and the other end opens on the second surface 2112b. In some other embodiments, the first through hole 2112c1 and the second through hole 2112c2 may also be connected.

[0080] The electronic device 100 also includes a circuit board assembly 50, a heat spreader 60, a heat sink 70, and a battery 80 located inside the aforementioned annular sealing ring. The circuit board assembly 50 includes a first circuit board 51, a first heat source component 52, and a first device 53. The first circuit board 51 can be the main circuit board of the electronic device 100, and it is fixed to the first intermediate plate 2112 and located on the side of the second surface 2112b facing away from the first surface 2112a. Specifically, the first circuit board 51 can be fixed to the first intermediate plate 2112 by means of adhesive bonding, snap-fitting, threaded connection, etc. The first circuit board 51 is used to house the electronic components inside the electronic device 100 and to realize the electrical connection between the electronic components.

[0081] The first heat source component 52 is fixed to the surface of the first circuit board 51 facing the first surface 2112a and is electrically connected to the first circuit board 51. That is, the first heat source component 52 is fixed relative to the first intermediate plate 2112, and at least a portion of the first heat source component 52 is located on the side of the second surface 2112b facing away from the first surface 2112a. The first heat source component 52 includes, but is not limited to, a system on chip (SOC), a graphics processing unit (GPU), and universal flash storage (UFS).

[0082] The first device 53 is fixed to the first circuit board 51. The first device 53 includes a first electronic component 531, a shielding cover 532, and a metal sheet (not shown in the figure). The first electronic component 531 is located around the first heat source component 52 and includes, but is not limited to, capacitors, resistors, and inductors. The shielding cover 532 covers the first heat source component 52 and the first electronic component 531 and is fixed to the surface of the first circuit board 51 facing the first surface 2112a to prevent the first heat source component 52 and the first electronic component 531 from causing electromagnetic interference with the electronic components outside the shielding cover 532. The shielding cover 532 has a third through hole 532a, which is opposite to the first through hole 2112c1 along the thickness direction of the first middle plate 2112. A portion of the surface of the first heat source component 52 is exposed through the third through hole 532a, that is, at least a portion of the first heat source component 52 is opposite to the first through hole 2112c1. The metal sheet is located on the side of the shielding cover 532 facing the first surface 2112a and covers the third through hole 532a. The metal sheet and the shielding cover 532 form a complete shielding structure. The thickness of the metal sheet can be less than the thickness of the shielding cover 532 to reduce the thermal resistance of the metal sheet. In some other embodiments, the first device 53 may not include the metal sheet. In still other embodiments, the first device 53 may not include the shielding cover 532 and the metal sheet.

[0083] Please refer to Figures 6 and 7. Figure 6 is a structural schematic diagram of the heat spreader 60 of the electronic device 100 shown in Figure 5, and Figure 7 is a cross-sectional structural diagram of the heat spreader 60 shown in Figure 6 at line AA. The heat spreader 60 includes a first main body 61 and a first connecting part 62. The first main body 61 has a sealing cavity 61a. The first main body 61 includes a third surface 61d and a fourth surface 61f arranged along the thickness direction of the first middle plate 2112. Specifically, the first main body 61 includes a first cover plate 611, a second cover plate 612, and a capillary structure 613. A sealing cavity 61a is formed between the first cover plate 611 and the second cover plate 612, and the sealing cavity 61a is filled with a liquid working fluid (not shown in the figure). The capillary structure 613 is disposed within the sealing cavity 61a and disposed on the second cover plate 612. The surface of the first cover plate 611 facing away from the sealing cavity 61a forms the third surface 61d, and the third surface 61d has the same orientation as the first surface 2112a. In this way, a portion of the first main body 61 can form an evaporation section, and another portion can form a condensation section. When the evaporation section is heated, the liquid working fluid vaporizes and diffuses into the condensation section. When the gaseous working fluid comes into contact with the inner wall of the sealed cavity 61a at a lower temperature in the condensation section, it quickly condenses into a liquid working fluid and releases heat. The liquid working fluid returns to the evaporation section through the capillary force of the capillary structure 613. That is, by quickly transferring the heat from a small heat source to a large heat dissipation surface, the purpose of efficient heat dissipation is achieved.

[0084] The first connecting portion 62 is connected to the outer side of the first main body 61 and extends away from the sealing cavity 61a. The first connecting portion 62 is arranged around the first main body 61. Specifically, the first connecting portion 62 can be connected to the outer side of the first cover plate 611 and is integrally formed with the first cover plate 611. In this way, the heat spreader 60 has a simple structure, high overall strength, and high manufacturing efficiency.

[0085] Based on this, please refer to Figures 8 and 9. Figure 8 is a cross-sectional view of the electronic device 100 shown in Figure 4 at the BB line, and Figure 9 is a cross-sectional view of the electronic device 100 shown in Figure 4 at the CC line. The heat spreader 60 is located within the first groove 2112c, and the first connecting portion 62 of the heat spreader 60 is overlapped and fixed to the sidewall of the first groove 2112c. Specifically, the first connecting portion 62 and the transverse platform of the sidewall of the first groove 2112c can be bonded together using adhesive or hot melt adhesive. The longitudinal platform of the first groove 2112c is used to restrict the movement of the heat spreader 60 relative to the first middle plate 2112.

[0086] The horizontal platform is perpendicular to the thickness direction of the first middle plate 2112, and the vertical platform is parallel to the thickness direction (Z-axis direction) of the first middle plate 2112.

[0087] Based on this, the first heat source component 52 is thermally connected to the first main body 61. Specifically, the portion of the first heat source component 52 exposed in the third through hole 532a of the shielding cover 532 is thermally connected to the second cover plate 612 of the first main body 61 through a metal sheet 533 and thermally conductive adhesive. This allows the heat generated by the first heat source component 52 during operation to be conducted to the first main body 61 of the heat spreader 60. If the circuit board assembly 50 does not include the metal sheet 533, the first heat source component 52 can be directly thermally connected to the first main body 61 through the thermally conductive adhesive. Furthermore, the battery 80 is fixed to the second surface 2112b, meaning the battery 80 and the first heat source component 52 are located on the same side of the heat spreader 60. The battery 80 and the first heat source component 52 are spaced apart along the Y-axis. A portion of the battery 80 is positioned opposite the second through hole 2112c2, meaning a portion of the battery 80 is exposed in the second through hole 2112c2 and thermally connected to the first main body 61. Specifically, the battery 80 can be thermally connected to the first main body 61 through thermally conductive adhesive.

[0088] In this way, when the electronic device 100 is in operation (such as in gaming, shooting, or playing audio / video), the first heat source component 52 generates more heat and is a relatively hot area, while the thermally conductive portion between the first main body 61 and the first heat source component 52 is an evaporation zone. At this time, the battery 80, due to its low internal resistance and low current, is a relatively cool area, while the thermally conductive portion between the first main body 61 and the battery 80 is a condensation zone, which has a relatively large area. The liquid working fluid within the sealed cavity 61a can quickly transfer the heat generated by the first heat source component 52 to the condensation zone to dissipate heat from the first heat source component 52. When the electronic device 100 is charging, the battery 80 is a relatively hot area, the thermally conductive portion between the first main body 61 and the battery 80 is an evaporation zone, the area of ​​the first heat source component 52 is a relatively cool area, and the thermally conductive portion between the first main body 61 and the first heat source component 52 is a condensation zone. The heat spreader 60 can dissipate heat from the battery 80.

[0089] Based on the above, a heat sink 70 is disposed on the side of the heat spreader 60 opposite to the second surface 2112b. A portion of the heat sink 70 covers the third surface 61d of the first main body 61 and is thermally connected to the first main body 61. Another portion of the heat sink 70 is located on the periphery of the first groove 2112c and covers the first surface 2112a, and is thermally connected to the first intermediate plate 2112. Specifically, the heat sink 70 can be a graphite sheet. In this way, the heat sink 70 can be thermally connected to the third surface 61d of the heat spreader 60, facilitating the conduction of heat from the heat spreader 60 to the cool area of ​​the first intermediate plate 2112 for heat dissipation, thereby further improving the heat dissipation effect of the electronic device 100.

[0090] However, as the electronic device 100 becomes increasingly functional and contains more and more components, the internal space becomes increasingly limited. Simultaneously, the heat generated by the first heat source component 52 increases significantly when the electronic device 100 is in operation. Therefore, while maintaining the bonding width of the first adhesive layer 31, the area occupied by the first groove 2112c within the first surface 2112a of the first intermediate plate 2112 cannot be further increased to increase the volume of the first main body 61 near the first heat source component 52 and improve the heat dissipation performance of the heat spreader 60 on the first heat source component 52. Consequently, the overall heat dissipation performance of the electronic device 100 is relatively low.

[0091] To address this issue, please refer to Figures 10-12. Figure 10 is a schematic diagram of another structural configuration of a portion of the electronic device 100 shown in Figure 1. Figure 11 is a schematic diagram of the structure of a heat spreader 60 provided in other embodiments of this application. Figure 12 is a cross-sectional view of a portion of the electronic device 100 shown in Figure 10 assembled with the heat spreader 60 shown in Figure 11. The embodiments shown in Figures 10-12 differ from those shown in Figures 5-8 in that the groove sidewall of the first groove 2112c includes a first sidewall region 2112c3 and a second sidewall region 2112c4 arranged circumferentially. The first sidewall region 2112c3 is a stepped surface. The second sidewall region 2112c4 is a plane that is parallel to the thickness direction (Z-axis direction) of the first middle plate 2112 and extends along the Y-axis direction. The first heat source component 52 is located on the side facing the second sidewall region 2112c4, and the first adhesive layer 31 is located on the side facing away from the second sidewall region 2112c4. That is, the first adhesive layer 31 and the first heat source component 52 are located on both sides of the second sidewall region 61c.

[0092] Based on this, along the extending direction of the second sidewall region 2112c4, the length of the second sidewall region 2112c4 is greater than or equal to the length of the first heat source component 52, that is, the orthographic projection of the first heat source component 52 in the plane containing the second sidewall region 2112c4 is aligned with the second sidewall region 2112c4 along the thickness direction of the first middle plate 2112. In other examples, the length of the second sidewall region 2112c4 may also be less than the length of the first heat source component 52, that is, a portion of the orthographic projection of the first heat source component 52 in the plane containing the second sidewall region 2112c4 is aligned with the second sidewall region 2112c4 along the thickness direction of the first middle plate 2112.

[0093] The first connecting portion 62 of the heat spreader 60 is not arranged around the first main body 61. Specifically, the outer surface of the first main body 61 includes a first side region 61b and a second side region 61c arranged circumferentially along the first main body 61. The first connecting portion 62 is connected to the first side region 61b and extends away from the first side region 61b in a direction perpendicular to the Z-axis. The first connecting portion 62 overlaps and is fixed to the first side wall region 2112c3 of the first groove 2112c. The second side region 61c faces the second side wall region 2112c4 of the first groove 2112c. In this way, with a fixed area of ​​the first groove 2112c, the width of the first main body 61 in the direction perpendicular to the second side wall region 2112c4 can be increased, thereby increasing the volume of the first main body 61 at the thermal connection point with the first heat source component 52, increasing the heat exchange area and liquid working fluid volume of the first main body 61, and thus improving the heat dissipation efficiency of the first heat source component 52.

[0094] However, in this case, the edge portion corresponding to the second side region 61c of the first main body 61 is not fixedly connected to the first middle plate 2112. When the electronic device 100 is impacted, the edge portion corresponding to the second side region 61c is prone to move relative to the first middle plate 2112 along the thickness direction of the first middle plate 2112, thereby impacting the screen 10 and causing the screen 10 to be damaged and fail.

[0095] To address the aforementioned issues, please refer to Figures 13-15. Figure 13 is a schematic diagram of another partial structure of the electronic device 100 shown in Figure 1; Figure 14 is an exploded structural view of a partial structure of the electronic device 100 shown in Figure 13; and Figure 15 is a cross-sectional structural view of the electronic device 100 shown in Figure 13 at the DD line. In the embodiments shown in Figures 13-15, the structure of the heat spreader 60 is the same as that shown in Figure 11. The embodiments shown in Figures 13 and 14 differ from those shown in Figures 10 and 11 in that the electronic device 100 further includes a connector 90. The connector 90 is plate-shaped. The connector 90 includes a first portion 91 and a second portion 92. The second portion 92 includes a fifth surface 92a, which faces away from the second surface 2112b. The first portion 91 is connected to the third surface 61d, and the second portion 92 is located on the periphery of the first groove 2112c and connected to the first surface 2112a. The second portion 92 is located on the side of the first adhesive layer 31 facing the first heat source component 52. That is, the connector 90 is connected to the first main body 61, a part of the connector 90 is located on the outer periphery of the first groove 2112c, and is connected to the first surface 2112a of the first middle plate 2112.

[0096] The connector 90 can be a metal structural component; specifically, the material of the connector 90 can be copper, copper alloy, aluminum, aluminum alloy, stainless steel, titanium, titanium alloy, etc. In some examples, the first part 91 is welded to the third surface 61d of the first main body 61, and the second part 92 is bonded to the first surface 2112a. In other examples, the first part 91 can also be bonded to the third surface 61d, and the second part 92 can also be welded to the first surface 2112a. Furthermore, the orthographic projection of the second part 92 along the thickness direction of the first middle plate 2112 onto the first middle plate 2112 overlaps with the second sidewall region 2112c4.

[0097] In this way, while increasing the volume of the first main body 61 to increase the heat dissipation efficiency of the first heat source component 52 and thus improve the overall heat dissipation efficiency of the electronic device 100, it also improves the reliability of the connection between the heat spreader 60 and the first intermediate plate 2112, thereby improving the overall reliability of the electronic device 100. Furthermore, the connector 90 and the heat spreader 60 can be connected as two structural components. The thickness, length, width, and shape of the connector 90 are not limited by the performance requirements, processing technology, or connection structure between the heat spreader 60 and the first intermediate plate 2112. This simplifies the design difficulty of the connector 90 and the assembly difficulty between it and the first intermediate plate 2112 and the heat spreader 60. It also facilitates providing sufficient clearance for the first adhesive layer 31, ensuring both the heat dissipation efficiency of the electronic device 100 and the dustproof and waterproof performance of the first adhesive layer 31. Finally, the connector 90 is located on the side of the heat spreader 60 and the first intermediate plate 2112 opposite to the second surface 2112b, which makes the first intermediate plate 2112 part connected to the second part 92 thicker, so as to ensure the strength of the first intermediate plate 2112, and thus ensure the overall strength of the electronic device 100.

[0098] Please refer to Figures 13 and 15. The size of the second part 92 of the connector 90 protruding from the second side region 61c is smaller than the size of the first connecting part 62 protruding from the first side region 61b. That is, the distance from any point on the second part 92 to the second side region 61c is smaller than the distance from each point on the edge of the first connecting part 62 away from the first main body 61 to the first side region 61b.

[0099] In this way, while improving the connection reliability between the heat dissipation plate 60 and the first middle plate 2112, the second part 92 occupies less space around the first groove 2112c, which can ensure that enough bonding area is reserved for the first adhesive layer 31, thus ensuring the connection reliability between the screen 10 and the first middle plate 2112 and the dustproof and waterproof performance of the first adhesive layer 31.

[0100] Referring to Figures 13 and 14, the side of the first adhesive layer 31 facing the first groove 2112c has a first clearance groove 31a, and a portion of the second portion 92 is located within the first clearance groove 31a. In some examples, the depth of the first clearance groove 31a is less than or equal to 1 / 3 of the width of the first adhesive layer 31. For example, the depth of the first clearance groove 31a can be 1 / 3, 1 / 4, 1 / 5, 1 / 6, etc., of the width of the first adhesive layer 31. In other embodiments, the first adhesive layer 31 may not have the first clearance groove 31a, and the side of the second portion 92 facing the first adhesive layer 31 may contact the side of the first adhesive layer 31 facing the first groove 2112c.

[0101] This ensures the connection area between the second part 92 and the first surface 2112a, guaranteeing the connection reliability between the connector 90 and the first middle plate 2112. It also ensures the width between the side of the first adhesive layer 31 facing away from the second part 92 and the bottom wall of the first clearance groove 31a, ensuring the dustproof and waterproof performance of the first adhesive layer 31. Furthermore, it allows for a larger width of the first adhesive layer 31 on both sides of the second part 92 along the arrangement direction of the first part 91 and the second part 92, further improving the bonding reliability between the screen 10 and the first middle plate 2112, as well as the dustproof and waterproof performance of the first adhesive layer 31.

[0102] Based on this, the first middle plate 2112 also has a first protrusion 2112d, which is located within the first groove 2112c and connected to the second sidewall region 2112c4. A portion of the surface of the first protrusion 2112d forms a part of the first surface 2112a, and the height of the first protrusion 2112d protruding from the second sidewall region 2112c4 is less than the height of the first connecting portion 62 protruding from the first side surface region 61b. Based on this, a portion of the second part 92 is connected to the surface of the first protrusion 2112d. In this way, while ensuring the bonding width of the first adhesive layer 31 and improving the heat dissipation efficiency of the electronic device 100, the bonding area between the second part 92 and the first surface 2112a can be further increased to ensure the reliability of the connection between the connector 90 and the first middle plate 2112.

[0103] Based on the above, along the circumference of the first groove 2112c, the connector 90 is located between the two ends of the second sidewall region 2112c4. In this way, while ensuring the reliability of the connection between the connector 90 and the first middle plate 2112, the area of ​​the connector 90 covering the first surface 2112a is small, which can provide as much bonding area as possible for the first adhesive layer 31, ensuring the bonding reliability between the screen 10 and the first middle plate 2112 and the dustproof and waterproof performance of the first adhesive layer 31, and also contributing to the lightweighting of the electronic device 100.

[0104] Based on the above, please continue referring to Figure 15. The second surface 2112b of the first intermediate plate 2112 has a second groove 2112e, and the bottom wall of the second groove 2112e faces the same direction as the second surface 2112b. A portion of the shield 532 of the circuit board assembly 50 is located within the second groove 2112e, that is, a portion of the first device 53 is located within the second groove 2112e. In some other embodiments, a portion of the first electronic component 531 may also be located within the second groove 2112e. Based on this, the orthographic projection of the second portion 92 of the connector 90 in the first reference plane overlaps with the orthographic projection of the second groove 2112e in the first reference plane, which is a plane perpendicular to the thickness direction of the first intermediate plate 2112. In the embodiment shown in Figure 15, the second groove 2112e penetrates the sidewall of the first groove 2112c. In some other embodiments, the second groove 2112e may not penetrate the sidewall of the first groove 2112c.

[0105] In this way, the distance between the bottom wall of the second groove 2112e and the first back cover 212 along the thickness direction (Z-axis direction) of the first middle plate 2112 is relatively large. Without increasing the overall distance between the first middle plate 2112 and the first back cover 212, it can provide a larger layout space for the circuit board assembly 50, which is beneficial to the thinning of the electronic device 100. On this basis, the connector 90 is located on the side of the heat spreader 60 opposite to the second surface 2112b, which can make the distance between the area on the first surface 2112a covered by the second part 92 and the bottom wall of the second groove 2112e relatively large, thereby ensuring the thickness of the first middle plate 2112 at this point, and thus ensuring the strength of the first middle plate 2112 to ensure the strength of the electronic device 100.

[0106] Based on this, the area on the first surface 2112a covered by the second portion 92 of the connector 90 is located on the side of the first main body 61 opposite to the second surface 2112b. The fifth surface 92a of the second portion 92 is flush with the sixth surface 31b of the first adhesive layer 31, or the fifth surface 92a is located on the side opposite to the sixth surface 31b. In the embodiment shown in FIG. 15, the area of ​​the first surface 2112a covered by the first adhesive layer 31 and the area covered by the second portion 92 are located in the same plane. In other embodiments, the area of ​​the first surface 2112a covered by the first adhesive layer 31 may also be located in a different plane from the area covered by the second portion 92.

[0107] In this way, the thickness of the first middle plate 2112 connected to the connector 90 is relatively large, which can ensure the strength of the first middle plate 2112, thereby ensuring the overall strength of the electronic device 100. At the same time, the second part 92 of the connector 90 will not protrude from the first adhesive layer 31 and squeeze the screen 10, thus preventing the screen 10 from being easily damaged or malfunctioning.

[0108] Based on the above, please continue referring to Figure 15. The surface of the heat sink 70 facing the first main body 61 has a second clearance groove 70a. The first part 91 of the connector 90 is located within the second clearance groove 70a, and the second part 92 is located on the outer periphery of the heat sink 70. In the embodiment shown in Figure 15, the second part 92 of the connector 90 is bent relative to the first part 91 toward the side facing the first surface 2112a. The second clearance groove 70a does not penetrate the surface of the heat sink 70 opposite to the second surface 2112b. The first part 91 of the connector 90 is located between the first main body 61 and the bottom wall of the second clearance groove 70a. The part of the surface of the heat sink 70 opposite to the second clearance groove 70a is flush with the fifth surface 92a of the second part 92. In some other embodiments, the surface of the connector 90 opposite to the second surface 2112b may also be planar, and the second clearance groove 70a may also penetrate the surface of the heat sink 70 opposite to the second surface 2112b. In this way, the combined thickness of the heat sink 70 and the connector 90 is small, which helps to reduce the overall thickness of the electronic device 100 and achieve the thinning of the electronic device 100.

[0109] Please refer to Figures 16 and 17. Figure 16 is another cross-sectional view of a portion of the electronic device 100 shown in Figure 1, and Figure 17 is a schematic diagram of the heat spreader 60 of the electronic device 100 shown in Figure 16. The embodiments shown in Figures 16 and 17 differ from those shown in Figures 13-15 in that the connector 90 is connected to the second side surface region 61c of the first main body 61. The entire connector 90 is located on the outer periphery of the first groove 2112c. The connector 90 is located on the side facing the second surface 2112b and is connected to the second surface 2112b. That is, the connector 90 cooperates with the first connecting portion 62 to snap the heat spreader 60 onto the first middle plate 2112. In some examples, the connector 90 is in contact with the second surface 2112b. In other examples, the connector 90 can be fixedly connected to the second surface 2112b by adhesive bonding.

[0110] In this way, the connector 90 and the first connecting portion 62 are located on both sides of the first middle plate 2112. The first connecting portion 62 cooperates with the first sidewall region 2112c3, which can restrict the movement of the heat spreader 60 relative to the first middle plate 2112 along the side facing the second surface 2112b. The connector 90 cooperates with the second surface 2112b, which can restrict the movement of the heat spreader 60 relative to the first middle plate 2112 along the side facing the first surface 2112a. This helps to improve the reliability of the connector 90 in connecting the heat spreader 60 to the first middle plate 2112. In addition, the connector 90 does not need to avoid the first adhesive layer 31. The connector 90 is subject to fewer restrictions, and the design and assembly difficulty of the connector 90 is lower. Similarly, the first adhesive layer 31 does not need to have a first clearance groove 31a to avoid the connector 90, so the bonding width of the first adhesive layer 31 can be larger to ensure the dustproof and waterproof performance of the first adhesive layer 31.

[0111] In some examples, the connector 90 and the second cover plate 612 of the heat spreader 60 are integrally formed. This results in a simple structure for both the heat spreader 60 and the connector 90, higher overall strength, and higher manufacturing efficiency. In other examples, the connector 90 can also be connected to the second side region 61c of the first main body 61 by welding or bonding.

[0112] Based on the above, the second surface 2112b has a third groove 2112f, which penetrates the second sidewall region 2112c4, and the connector 90 is located within the third groove 2112f. Specifically, the opening of the third groove 2112f is located on the bottom wall of the second groove 2112e. Based on this, the first surface 2112a has a second protrusion 2112g, which is located on the side of the first adhesive layer 31 facing the first groove 2112c and on the side opposite to the sixth surface of the first adhesive layer 31. The orthographic projection of the third groove 2112f in the first reference plane is located within the orthographic projection of the second protrusion 2112g in the first reference plane. In this way, while ensuring the layout space of the circuit board assembly 50, the thickness of the first intermediate plate 2112 can be ensured to guarantee the strength of the first intermediate plate 2112, thereby ensuring the overall strength of the electronic device 100.

[0113] The above embodiments describe in detail the structure of the first middle frame 211 of the electronic device 100 and the connection structure between it and the heat spreader 60. The structure of the second middle frame 221 of the electronic device 100 and the connection structure between it and another heat spreader (not shown in the figure) can be referred to the structure of the first middle frame 211, and will not be repeated here.

[0114] In some other embodiments, the electronic device 100 may also be a non-foldable handheld device, such as a mobile phone. In this case, the support device 20 of the electronic device 100 does not include the second housing 22 and the pivot mechanism 23. The first frame 2111 also includes a fourth frame segment (not shown in the figure), which is opposite to and spaced apart from the first frame segment 21111. The first frame segment 21111, the second frame segment 21112, the third frame segment 21113, and the fourth frame segment are connected end to end to form the first frame 2111. The first adhesive layer 31 extends in the same direction as the fourth frame segment and is bonded to the edge area of ​​the first surface 2112a near the fourth frame segment. The entire screen and the first back cover 212 are located on both sides of the first middle plate 2112 and fixed to the first middle frame 211.

[0115] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0116] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An electronic device, characterized in that, include: A first middle plate has a first surface and a second surface arranged along the thickness direction. The first surface has a first groove. The groove sidewalls of the first groove include a first sidewall region and a second sidewall region arranged circumferentially. The first sidewall region is a stepped surface. A heat spreader is located within the first groove. The heat spreader includes a first main body and a first connecting part. The first main body has a sealing cavity. The outer side of the first main body has a first side area and a second side area. The first connecting part is connected to the first side area and overlapped and fixed to the first side wall area. The second side area faces the second side wall area. A first heat source component is fixed relative to the first middle plate, at least a portion of the first heat source component is located on the side of the second surface opposite to the first surface, and the first heat source component is thermally connected to the first main body. A connector is connected to the first main body portion, at least a portion of which is located on the outer periphery of the first groove and connected to the first middle plate; the orthographic projection of the connector on the first middle plate along the thickness direction overlaps with the second sidewall region. The first screen portion is bonded to the first surface by a first adhesive layer, and the first adhesive layer and the first heat source component are respectively located on both sides of the second side region.

2. The electronic device according to claim 1, characterized in that, The first main body includes a third surface and a fourth surface arranged along the thickness direction of the first middle plate, wherein the third surface has the same orientation as the first surface; The connector includes a first part and a second part. The first part is connected to the third surface, and the second part is located on the outer periphery of the first groove and is connected to the first surface.

3. The electronic device according to claim 2, characterized in that, The second portion protruding from the second side region is smaller than the first connecting portion protruding from the first side region.

4. The electronic device according to claim 2 or 3, characterized in that, The first middle plate also has a first protrusion, which is located in the first groove and connected to the second side wall region. The size of the first protrusion protruding from the second side wall region is smaller than the size of the first connecting portion protruding from the first side region. The second part is also connected to the surface of the first protrusion.

5. The electronic device according to any one of claims 2-4, characterized in that, The first adhesive layer has a first clearance groove on the side facing the first groove, and at least a portion of the second part is located within the first clearance groove.

6. The electronic device according to any one of claims 2-5, characterized in that, The second surface has a second groove; the orthographic projection of the second portion in the first reference surface overlaps with the orthographic projection of the second groove in the first reference surface, and the first reference surface is a plane perpendicular to the thickness direction of the first middle plate; The electronic device further includes a first circuit board and a first device, both of which are fixed to the first circuit board, and a portion of the first device is located in the second groove.

7. The electronic device according to claim 6, characterized in that, The second portion includes a fifth surface that is opposite to the second surface; the first adhesive layer includes a sixth surface that is opposite to the second surface. The fifth surface is flush with the sixth surface; or, The fifth surface is located on the side opposite to the sixth surface.

8. The electronic device according to any one of claims 2-7, characterized in that, The electronic device further includes a heat sink, a portion of which covers the third surface, and a portion of which is located on the outer periphery of the first groove and covers the first surface; The surface of the heat sink facing the third surface has a second clearance groove, the first part of which is located in the second clearance groove and the second part is located on the outer periphery of the heat sink.

9. The electronic device according to claim 1, characterized in that, The connector is located on the outer periphery of the first main body and is connected to the second surface.

10. The electronic device according to claim 9, characterized in that, The second surface has a third groove that penetrates the second sidewall region; the connector is located within the third groove. The first surface has a second protrusion located on the side of the first adhesive layer facing the first groove. The orthographic projection of the third groove in the first reference surface is located within the orthographic projection of the second protrusion in the first reference surface. The first reference surface is a plane perpendicular to the thickness direction of the first middle plate.

11. The electronic device according to claim 9 or 10, characterized in that, The first main body includes a first cover plate and a second cover plate, and the sealing cavity is formed between the first cover plate and the second cover plate. The surface of the first cover plate facing away from the sealing cavity has the same orientation as the first surface. The first connecting part and the first cover plate are integrally formed; and / or, The connector and the second cover plate are integrally formed.

12. The electronic device according to any one of claims 9-11, characterized in that, The electronic device further includes a heat sink, a portion of which covers the first main body and is located on the outer periphery of the first groove and covers the first surface.

13. The electronic device according to any one of claims 1-12, characterized in that, Along the circumference of the first groove, the connector is located between the two ends of the second sidewall region.

14. The electronic device according to any one of claims 1-13, characterized in that, The electronic device also includes: The battery is fixed to the second surface, and the battery and the first heat source component are located on the same side of the first main body and are spaced apart from each other; at least a portion of the battery is thermally connected to the first main body.

15. The electronic device according to any one of claims 1-14, characterized in that, The electronic device also includes: The second adhesive layer is bonded between the first surface and the first screen portion, and the two ends of the second adhesive layer are respectively connected to the two ends of the first adhesive layer to form a sealing ring; the heat spreader, the first heat source component, and the connector are all located inside the sealing ring.

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