Dust sensor housing
Patent Information
- Application Number
- PCT/EP2026/054606
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2025-06-04
- Filing Date
- 2026-02-19
- Publication Date
- 2026-08-27
Smart Images

Figure EP2026054606_27082026_PF_FP_ABST
Abstract
Description
DUST SENSOR HOUSINGTechnical field
[0001] The invention lies in the field of dust sensors and in particular it relates to a dust sensor housing for measuring dust under harsh conditions, namely extreme temperatures, high humidity and moisture, and / or dust and particulate exposure.Background of the invention
[0002] Dust sensors play a critical role in environmental monitoring, especially in industrial and urban environments where particulate matter, PM, poses significant health and environmental risks.
[0003] Dust sensors operating in harsh conditions, such as industrial environments, face significant challenges that can compromise their accuracy and longevity. Extreme temperatures, whether excessively high or low, can alter sensor performance by affecting electronic stability and material integrity. Additionally, exposure to moisture, condensation, or prolonged humidity may lead to corrosion or short circuits, reducing sensor reliability. High levels of airborne dust and debris pose another critical issue, as particulate buildup can clog sensor inlets, obstruct optical components, and degrade measurement accuracy over time.
[0004] The sensor housings are typically constructed from hard and rigid materials such as metal and rigid plastics. Most designs incorporate basic Ingress Protection, IP, standards, such as IP65 or IP67, offering resistance to water and dust to ensure operational reliability.
[0005] Existing sensor technologies, such as the integrated particulate matter sensor described in document [2], offer compact, durable designs but are limited in their ability to withstand harsh industrial conditions, compromising sensor accuracy and reliability over time.
[0006] The publication [3] explores the use of metallic structures in the design of housings for industrial sensors, emphasizing their potential in improving durability and functionality. While the use of metallic structures offers robustness, it can significantly increase the weight and cost of the housing, potentially limiting its applicability in lightweight or cost-sensitive designs.Furthermore, the focus on metallic materials may overlook opportunities to incorporate sustainable or advanced composite materials.
[0007] Traditional housings often feature simple, standardized designs, making them easy to manufacture. However, many of these designs lack flexibility, as they are not easily tailored for diverse applications or specific environmental challenges. Additionally, maintenance can be cumbersome, often requiring specialized tools for disassembly and reassembly, which increases downtime and effort. Efficient dust sensors, such as the SPS30 Sensor, are capable of detecting various sizes of particulate matter (e.g., PM1, PM2.5, PM4, and PM 10). However, in known solutions, the optical sensor at the core of the functionality is prone to degradation over time due to the accumulation of dust on its sensitive electronic components. This creates a significant dilemma: while measuring dust levels is a dust sensor’s primary function, the very presence of dust poses a threat to the longevity and reliability of the sensor components. This inherent vulnerability compromises the device's performance, particularly in harsh environments where dust exposure is constant and unavoidable.
[0008] One major limitation of traditional dust sensor housings is their insufficient protection of sensitive components. Many enclosures fail to effectively shield electronics and sensors from direct exposure to dust and environmental contaminants. As a result, these particles can accumulate within the housing, leading to degraded performance and a shortened operational lifespan. Over time, the intrusion of dust and other pollutants can cause malfunctions, requiring frequent maintenance or even premature replacement of the sensor.
[0009] Another drawback lies in the vulnerability of combined designs. Many dust sensor housings integrate all components within a single enclosure, offering minimal isolation between critical parts. This design increases the risk of environmental damage, as contaminants that infiltrate one section of the housing can easily affect the entire system. Such vulnerability makes the sensor more susceptible to failures caused by moisture, dust accumulation, and temperature fluctuations, compromising its reliability in harsh environments.
[0010] Maintenance challenges also arise due to the design of conventional housings. Many require specialized tools for disassembly and reassembly, making it difficult for technicians to access internal components quickly. This cumbersome maintenance process results in extended downtime, particularly in industrial settings where efficiency and operational continuity are crucial. The need for frequent servicing further exacerbates the issue, increasing overall maintenance costs and resource consumption.
[0011] Sensor clogging and accuracy degradation are significant concerns in dust sensor enclosures. Many housings lack effective dust protection mechanisms, allowing large particulate matter to infiltrate and accumulate around the sensor. This buildup reduces measurement accuracy over time and necessitates frequent recalibration to maintain reliable performance. Additionally, dust infiltration into electronic components can cause long-term damage, further increasing the need for maintenance and reducing the sensor’s effectiveness in high-dust environments.
[0012] Another limitation is the lack of customization in standardized housing designs. Many enclosures are built with a one-size-fits-all approach, making them difficult to adapt for specific environmental conditions or unique industrial applications. This lack of flexibility limits the sensor’s usability in specialized fields where tailored solutions are required to ensure optimal performance and longevity.
[0013] Finally, the materials used in traditional dust sensor housings often contribute to environmental concerns. Many enclosures are constructed from non-biodegradable plastics or metals that do not align with modern sustainability goals. Additionally, traditional manufacturing methods may generate excessive waste and have a high carbon footprint. As industries increasingly prioritize eco-friendly solutions, the continued reliance on unsustainable materials presents a significant drawback that hampers long-term environmental responsibility.Technical problem to be solved
[0014] It is an objective to present a dust sensor housing and sensor, which overcome at least some of the disadvantages of the prior art.Summary of the invention
[0015] In accordance with a first aspect of the invention, a dust sensor housing is provided, comprising: a first chamber configured to house at least one dust sensor; a protuberance, configured as a wind shield, extending from the first chamber; a second chamber, wherein the second chamber is air- and dust-tight and is configured to house an electronic circuit; at least one inlet comprising a removable mesh, to prevent larger particles from entering the first chamber, configured to allow air and dust particles to enter the first chamber; and at least one outlet configured to allow air and dust particles to exit the first chamber.
[0016] The dust sensor may preferably comprise sealing means, such as but not limited to sealing joints, a sealing film, for providing the air- and / or dust-tightness of the second chamber.
[0017] In an advantageous embodiment, to prevent any mechanical impact on a dust sensor, the dust sensor housing further comprises a third chamber.
[0018] The second chamber may be configured to enclose the first chamber, i.e. , at least partially enclosed or surrounded by the second chamber, thus thermally isolating the first chamber.
[0019] To minimize the influence of wind or particle direction on the measurements of the dust sensors, the dust sensor housing may comprise a plurality of inlets arranged symmetrically around the first chamber, thus reducing directional bias in particle measurements.
[0020] In an embodiment, the at least one inlet and the at least one outlet are placed at a common surface, thus reducing the dimensionality of the dust sensor housing.
[0021] To provide more reliable environmental measurements, the dust sensor housing may further comprise a protuberance extending from the first chamber, preferably the protuberance is configured as a wind shield, thus ensuring accurate readings under extreme environmental conditions.
[0022] The removable mesh may be made of an anti-static material to prevent particle buildup and ensure consistent airflow into the first chamber. In a more preferred way, the removable mesh is configured to cover both the least one inlet and the at least one outlet.
[0023] In an advantageous way, the second chamber and / or the third chamber may be made of a material resistant to environmental wear and corrosion, preferably a high-performance thermoplastic such as PEEK (Polyether Ether Ketone), PEI (Polyetherimide), or LILTEM, for applications where an operating temperature is below 250°C, and High-Temperature Silicone Coatings, for an operating temperature exceeding 250°C, thus providing an additional layer of defence to enhance thermal insulation and protection.
[0024] In a second aspect of the invention a dust sensor system is provided, comprising: a dust sensor housing as previously described; at least one dust sensor, e.g., Sensirion SPS30; at least one environmental sensor assembled in a protuberance extending from the first chamber configured to provide reliable environmental measurements, and an electronic circuit (preferablyprovided on a printed circuit board, PCB) housed in the dust sensor housing; wherein the electronic processor is configured to process sensing data from the dust sensor.
[0025] In a preferred embodiment, the dust sensor further comprises at least two cooling radiators, at least two fans, and a semiconductor cooler, e.g., of the Peltier type such as TEC1-12706.
[0026] The at least two cooling radiators may be placed inside a third chamber, and the at least two fans are placed inside the second chamber, this arrangement improves thermal dissipation by allowing for gradual cooling to achieve the desired ambient temperature. The dust that exits the sensor will not re-enter because there is a fan inside the measurement unit. This fan creates higher pressure, causing the dust to move away from the sensor and preventing it from reentering.
[0027] To improve the dust measurement, the dust sensor system may comprise comprising at least one environmental sensor placed in proximity with the at least one inlet of the dust sensor housing; wherein the electronic processor is further configured to process sensing data from the at least one environmental sensor.
[0028] To further reduce directional bias in particle measurements, the dust sensor system comprises a plurality of dust sensors arranged symmetrically around the first chamber.
[0029] The at least one environmental sensor may be one of the following: temperature sensor, humidity sensor, pressure sensor, wind speed and / or direction sensor, Volatile Organic Compound (VOC) sensor, or a combination of these.
[0030] The electronic circuit within the second chamber include a wireless communication module configured to transmit processed sensor data to an external device.
[0031] By using the proposed invention, it becomes possible to protect dust sensors in harsh industrial environments. In an embodiment, it features a dual chamber structure with an inner chamber for a dust sensor and an outer chamber for placing an electronic board. This separation ensures that sensitive electronic components are shielded from direct exposure to dust and environmental contaminants, enhancing durability and extending operational life.
[0032] To maintain accuracy and reliability, the dust sensor housing may incorporate a robust filtering mechanism, which functions as a passive self-cleaning system, that minimizes the entry of large particulate matter, preventing sensor clogging.
[0033] Unlike traditional systems, this solution provides enhanced durability, simplified maintenance, and improved reliability / sustainability, setting it apart from conventional sensor housings.Brief description of the drawings
[0034] Several embodiments of the present invention are illustrated by way of figures, which do not limit the scope of the invention, wherein:figures 1A-1E show, in different perspectives, an embodiment of the dust sensor housing;figures 2A-2D show, in different perspectives, an embodiment of the first chamber of the dust sensor housing;figures 3A-3C show, in different perspectives, an embodiment of the first chamber lid of the dust sensor housing;figures 4A-4D show, in different perspectives, an embodiment of the second chamber of the dust sensor housing;figures 5A-5B show, in different perspectives, an embodiment of the second chamber lid of the dust sensor housing.Detailed description of the invention
[0035] This section describes aspects of the invention in further detail based on preferred embodiments and on the figures. The figures do not limit the scope of the invention. Throughout the description, like numerals will be used to describe like concepts in different embodiments. Details that are described in the context of a particular embodiment are applicable to other embodiments, unless otherwise stated.
[0036] The description puts focus on those aspects that are relevant for understanding the invention. It will be clear to the skilled person that dust sensor also comprises other commonly known aspects, such as a sensing element, a light source, a photodetector, and a signal processing unit, even if those aspects are not explicitly mentioned.
[0037] The sensing element generally operates based on optical scattering, where a light source, such as a laser diode or infrared LID, emits a beam that interacts with airborne particulate matter. The scattered light is then detected by the photodetector, which converts the received signal into an electrical output proportional to the concentration and size of the dust particles. The signal processing unit, which may include an electronic processor and memory, processes the raw data by applying noise reduction, calibration, and compensation algorithms to enhance measurement accuracy. Some dust sensors may also incorporate additional features such as temperature and humidity sensors for environmental compensation, a fan or air pump for controlled sampling, and a communication interface for data transmission to external systems.
[0038] In accordance with a preferred embodiment of the invention, a dust sensor housing comprises a first chamber for housing at least one dust sensor, and a second chamber for housing an electronic circuit, which is operatively connected to the sensor by appropriate connection means. The second chamber is preferably air- and / or dust-tight in order to protect the components of the electronic circuit housed therein from environmental conditions, in particular from particulate matter that is being sensed by the dust sensor itself. The second chamber is generally closed opened towards the sensed environment, except in some embodiments, for the sake of cooling the electronic components. The required sealing is achieved by sealing means, such as flexible joints, interlocking fittings or sealing films, without limiting the invention to these examples.
[0039] The housing comprises at least one inlet comprising a mesh for filtering larger particles, which allows air and dust to enter the first chamber, for sensing by the dust sensor. The housing further comprises at least one outlet configured to allow said air and dust particles to exit the first housing. Save for the inlet and outlet, the first chamber is not opened towards the sensed environment. The required sealing is achieved by sealing means, such as flexible joints, interlocking fittings or sealing films, without limiting the invention to these examples.
[0040] The first and second chambers are separated so that the air and dust particles that are being sensed by the sensor housed in the first chamber are largely or entirely prohibited to enter the second chamber, which houses the electronic circuit. This allows to protect the electronic components. The arrangement of both chambers may be any arrangement that allows to achieve this effect: assuring electronic and operational connection between the components house in the first and second chambers (sensor and electronics board), and preventing air andparticles that contact the sensor from contacting the electronics board. The second chamber may be a pouch or box, providing electronic connection to the sensor. Alternatively, the second chamber may be generally box-shaped of a rigid material, providing further mechanical protection to the electronics board housed therein. The second chamber may be adjacent to the first chamber, fixed to the first chamber, physically distant from the first chamber, or enclosed within the first chamber. The further embodiments disclosed hereafter provide advantageous aspects in addition to those that have been described.
[0041] Figures 1A-1E show, in different perspectives, another preferred embodiment of the dust sensor housing in accordance with an embodiment of the invention, wherein 1 represents a first chamber, 2 represents a lid of the first chamber, 3 represents a second chamber, 4 represents a lid of the second chamber, and 5 represents a filter of particles.
[0042] In Fig. 1E, it can be seen in detail C that the walls of the second chamber are interlocked by mechanical fittings.
[0043] Figures 2A-2D show, in different perspectives, an embodiment of the first chamber, which is configured to house a dust sensor, thus providing dedicated protection.
[0044] Figures 3A-3C show, in different perspectives, an embodiment of the first chamber lid, which seals the first chamber, ensuring a secure and protective environment for the dust sensor.
[0045] Figures 4A-AD show, in different perspectives, an embodiment of the second chamber, which encases the electronic components, isolating them from dust and environmental hazards.
[0046] Figures 5A-5B show, in different perspectives, an embodiment of the second chamber Box lid, which seals the second chamber, safeguarding the electronic components from external contaminants.
[0047] Communication between the two chambers may be secured through a sealed interface, for example the lid of the first chamber (2), preserving the dust sensor housing's integrity.
[0048] Additionally, the housing is assembled without screws or nuts, enabling tool-free access for maintenance. This design simplifies component replacement or cleaning, significantly reducing downtime and maintenance effort.
[0049] Manufactured using sustainable materials via a 3D-printing process, the housing aligns with environmental standards and offers flexibility for customization to suit diverse industrial applications.
[0050] In an additional embodiment, the second chamber further comprises a power supply unit, preferably the power supply unit being rechargeable.
[0051] The present solution has been developed and tested in the laboratory. A prototype was built to demonstrate the key features, including the dynamic housing system, dust sensor protection, and tool-free maintenance. The prototype was created using 3D printing with sustainable materials. In laboratory tests, the prototype was exposed to dust, and the filter successfully blocked large particles, preventing the sensor from clogging.
[0052] The sensor housing was also tested for durability under conditions such as temperature fluctuations, humidity, and vibration, and it effectively protected the electronics. The tool-free access feature was tested multiple times, showing that it was easy to open and close, which helped reduce maintenance time. The tests confirmed that the prototype reduced sensor clogging, extended the system's lifespan, and provided effective protection against dust and moisture. It is now ready for further field testing and improvements based on real-world use.
[0053] It should be understood that the detailed description of specific preferred embodiments is given by way of illustration only, since various changes and modifications within the scope of the invention will be apparent to the person skilled in the art. The scope of protection is defined by the following set of claims.
[0054] References[1] South Coast AQMD. Sensirion Nubo Air Sensor Details [online]. Retrieved from: https: / / www.aqmd.gov / aq-spec / sensordetail / sensirion-nubo-air .[2] US20210199555A1 (AMS AG) 2021-07-01.[3] Al-Baradoni, M. (2022). Sensor-Integrated Structures in Mechanical Engineering: Challenges and Opportunities for Mechanical Joining Processes.[4] Farnell. Datasheet for Product No. 3622890 [online]. Retrieved from:https: / / www.farnell.com / datasheets / 3622890.pdf.
Claims
Claims1. A dust sensor housing, comprising:a first chamber (1) configured to house at least one dust sensor;a protuberance, configured as a wind shield, extending from the first chamber (1); a second chamber (3), wherein the second chamber (3) is air- and dust-tight and is configured to house an electronic circuit;at least one inlet comprising a removable mesh (5) configured to allow air and dust particles to enter the first chamber (1); andat least one outlet configured to allow air and dust particles to exit the first chamber (1).
2. The dust sensor housing according to the previous claim further comprising a third chamber.
3. The dust sensor housing according to any of the previous claims, wherein the second chamber (3) is configured to enclose the first chamber, i.e. , at least partially enclosed or surrounded by the second chamber (3).
4. The dust sensor housing according to any of the previous claims, comprising a plurality of inlets arranged symmetrically around the first chamber (1).
5. The dust sensor housing according to any of the previous claims wherein the at least one inlet and the at least one outlet are placed at a common surface.
6. The dust sensor housing according to any of the previous claims, wherein the removable mesh (5) is made of an anti-static material.
7. The dust sensor housing according to any of the previous claims wherein the removable mesh (5) is configured to cover both the least one inlet and the at least one outlet.
8. The dust sensor housing according to any of the previous claims, wherein the second chamber (3) and / or the third chamber is made of a material resistant to environmentalwear and corrosion, preferably a high-performance thermoplastic such as PEEK (Polyether Ether Ketone), PEI (Polyetherimide), or LILTEM, for an operating temperature is below 250°C, and High-Temperature Silicone Coatings, for an operating temperature exceeding 250°C.
9. A dust sensor system comprising:a dust sensor housing of any of the previous claims 1-8;at least one dust sensor and an electronic circuit (PCB) housed in the dust sensor housing;at least one environmental sensor is assembled in a protuberance extending from the first chamber (1);wherein the electronic processor is configured to process sensing data from the dust sensor.
10. The dust sensor system according to the previous claim further comprising at least two cooling radiators, at least two fans, and a semiconductor cooler.
11. The dust sensor system according to any of the claims 9-10 wherein the at least two cooling radiators are placed inside the third chamber, and the at least two fans are placed inside the second chamber (3).
12. The dust sensor system according to any of the previous claims 9-11 further comprising at least one environmental sensor placed in proximity with the at least one inlet of the dust sensor housing; wherein the electronic processor is further configured to process sensing data from the at least one environmental sensor.
13. The dust sensor system according to any of claims 9-12, comprises a plurality of dust sensors arranged symmetrically around the first chamber (1).
14. The dust sensor system according to any of the claims 9-13, wherein the at least one environmental sensor is one of the following: temperature sensor, humidity sensor,pressure sensor, wind speed and / or direction sensor, Volatile Organic Compound (VOC) sensor, or a combination of these.
15. The dust sensor system according to any of the claims 9-14, wherein the electronic circuit within the second chamber (3) include a wireless communication module configured to transmit processed sensor data to an external device.