Display module and wearable electronic device comprising same

Abstract

According to one embodiment of the present disclosure, a wearable electronic device comprises: a housing which forms at least a part of the exterior of the wearable electronic device; and a display module disposed in the housing, wherein the display module includes: a window which forms at least a part of the front surface of the wearable electronic device (101); a display panel including a flat part disposed under the window, and a bending part extending to be bent from a part of the edge of the flat part; a sealing member for sealing the edge of the flat part of the display panel, a first part of the sealing member filling a first area surrounded by the inner surface of the bending part, and a second part of the sealing member filling a second area surrounding the outer surface of the bending part; a first structure, which is spaced apart from the bending part, is disposed to at least partially overlap the first area, and is at least partially in contact with the sealing member; and a second structure, which is disposed to occupy a part of the second area and is at least partially in contact with the sealing member.

Description

Display module and wearable electronic device including the same

[0001] One embodiment disclosed in this document relates to a display module and a wearable electronic device including the same.

[0002] Generally, the term "electronic device" refers to a device that performs specific functions according to an installed program, ranging from home appliances to electronic notebooks, portable multimedia players, mobile communication terminals, tablet PCs, video / audio devices, desktop / laptop computers, or in-car navigation systems. These electronic devices can output stored information as sound or video. As the integration density of electronic devices increases and ultra-high-speed, high-capacity wireless communication becomes commonplace, various functions are recently being integrated into a single mobile communication terminal.

[0003] For example, not only communication functions, but also entertainment functions such as games, multimedia functions such as music / video playback, communication and security functions for mobile banking, and functions such as schedule management and electronic wallets are integrated into a single electronic device.

[0004] In addition, various types of wearable electronic devices that can be mounted on the body, such as glasses or watches, are also being proposed.

[0005] While integrating various functions into such electronic devices, thinning, miniaturization, and / or simplification of the appearance may be required to enhance aesthetic appeal and provide convenience to the user.

[0006] The information described above may be provided as related art for the purpose of aiding understanding of the present disclosure. No claim or determination is made as to whether any of the foregoing may be applied as prior art related to the present disclosure.

[0007] According to one embodiment of the present disclosure, a wearable electronic device comprises: a housing forming at least a portion of the exterior of the wearable electronic device; and a display module disposed in the housing, wherein the display module comprises: a window forming at least a portion of the front surface of the wearable electronic device (101); a display panel comprising a flat portion disposed below the window and a bending portion extended to bend from a portion of the edge of the flat portion; and a sealing member configured to seal the edge of the flat portion of the display panel, wherein a first portion of the sealing member is filled in a first area enclosed by the inner surface of the bending portion and a second portion of the sealing member is filled in a second area enclosed by the outer surface of the bending portion; a first structure spaced apart from the bending portion, disposed to overlap at least partially with the first area, and in contact with the sealing member at least partially; and a second structure disposed to occupy a portion of the second area and in contact with the sealing member at least partially.

[0008] According to one embodiment of the present disclosure, a wearable electronic device comprises: a housing forming at least a portion of the exterior of the wearable electronic device; and a display module disposed in the housing, wherein the display module comprises: a window forming at least a portion of the front surface of the wearable electronic device; a display panel comprising a flat portion disposed below the window and a bending portion extended to bend from a portion of the edge of the flat portion; a flexible printed circuit board connected to the bending portion; a display driving integrated circuit disposed on the flexible printed circuit board; a sealing member configured to seal the edge of the flat portion of the display panel, wherein a first portion of the sealing member is filled in a first region surrounded by the inner surface of the bending portion and a second portion of the sealing member is filled in a second region surrounding the outer surface of the bending portion; and a first structure spaced apart from the bending portion, disposed to overlap at least partially with the first region, and in contact at least partially with the sealing member.

[0009] FIG. 1 is a block diagram of an electronic device in a network environment according to various embodiments.

[0010] FIG. 2 is a front perspective view showing a wearable electronic device according to one embodiment of the present disclosure.

[0011] FIG. 3 is a rear perspective view showing a wearable electronic device according to one embodiment of the present disclosure.

[0012] FIG. 4 is an exploded perspective view showing a wearable electronic device according to one embodiment of the present disclosure.

[0013] FIG. 5 is a perspective view showing the rear side of a display module according to one embodiment of the present disclosure.

[0014] FIG. 6 is a cross-sectional view taken along the line AA' of FIG. 5 according to one embodiment of the present disclosure.

[0015] FIG. 7 is a perspective view showing a part of a display module according to one embodiment of the present disclosure.

[0016] FIG. 8 is a cross-sectional view taken along the line BB' of FIG. 7 according to one embodiment of the present disclosure.

[0017] FIG. 9 is a cross-sectional view taken along the line BB' of FIG. 7 according to one embodiment of the present disclosure.

[0018] FIG. 10 is a cross-sectional view taken along the CC' line of FIG. 7 according to one embodiment of the present disclosure.

[0019] FIG. 11a is a cross-sectional view taken along the CC' line of FIG. 7 according to one embodiment of the present disclosure.

[0020] FIG. 11b is a cross-sectional view taken along the CC' line of FIG. 7 according to one embodiment of the present disclosure.

[0021] FIG. 12 is a rear view of a display module according to one embodiment of the present disclosure.

[0022] FIG. 13 is a perspective view showing a display module according to one embodiment of the present disclosure.

[0023] FIG. 14 is a perspective view showing a display module according to one embodiment of the present disclosure.

[0024] FIG. 15 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0025] FIG. 16 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0026] FIG. 17 is a drawing showing a portion of the rear surface of a display module according to one embodiment of the present disclosure.

[0027] Hereinafter, embodiments of the present disclosure are described in detail with reference to the drawings so that those skilled in the art can easily practice them. However, the present disclosure may be embodied in various different forms and is not limited to the embodiments described herein. In relation to the description of the drawings, the same or similar reference numerals may be used for identical or similar components. Furthermore, in the drawings and related descriptions, descriptions of well-known functions and configurations may be omitted for clarity and brevity.

[0028] FIG. 1 is a block diagram of an electronic device (101) in a network environment (100) according to various embodiments.

[0029] Referring to FIG. 1, in a network environment (100), an electronic device (101) may communicate with an electronic device (102) through a first network (198) (e.g., a short-range wireless communication network) or with at least one of an electronic device (104) or a server (108) through a second network (199) (e.g., a long-range wireless communication network). According to one embodiment, the electronic device (101) may communicate with the electronic device (104) through a server (108). According to one embodiment, the electronic device (101) may include a processor (120), memory (130), input module (150), sound output module (155), display module (160), audio module (170), sensor module (176), interface (177), connection terminal (178), haptic module (179), camera module (180), power management module (188), battery (189), communication module (190), subscriber identification module (196), or antenna module (197). In some embodiments, at least one of these components (e.g., connection terminal (178)) may be omitted from the electronic device (101), or one or more other components may be added. In some embodiments, some of these components (e.g., sensor module (176), camera module (180), or antenna module (197)) may be integrated into a single component (e.g., display module (160)).

[0030] The processor (120) can control at least one other component (e.g., hardware or software component) of the electronic device (101) connected to the processor (120) by executing software (e.g., program (140)), for example, and can perform various data processing or operations. According to one embodiment, as at least part of the data processing or operations, the processor (120) can store commands or data received from other components (e.g., sensor module (176) or communication module (190)) in volatile memory (132), process the commands or data stored in volatile memory (132), and store the resulting data in non-volatile memory (134). According to one embodiment, the processor (120) may include a main processor (121) (e.g., central processing unit or application processor) or an auxiliary processor (123) that can operate independently or together with it (e.g., graphics processing unit, neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, if the electronic device (101) includes a main processor (121) and an auxiliary processor (123), the auxiliary processor (123) may be configured to use lower power than the main processor (121) or to be specialized for a designated function. The auxiliary processor (123) may be implemented separately from the main processor (121) or as part thereof.

[0031] The auxiliary processor (123) may control at least some of the functions or states associated with at least one component of the electronic device (101) (e.g., display module (160), sensor module (176), or communication module (190)) on behalf of the main processor (121) while the main processor (121) is in an inactive (e.g., sleep) state, or together with the main processor (121) while the main processor (121) is in an active (e.g., application execution) state. According to one embodiment, the auxiliary processor (123) (e.g., image signal processor or communication processor) may be implemented as part of another functionally related component (e.g., camera module (180) or communication module (190)). According to one embodiment, the auxiliary processor (123) (e.g., neural network processing unit) may include a hardware structure specialized for processing an artificial intelligence model. The artificial intelligence model may be generated through machine learning. Such learning may be performed, for example, on the electronic device (101) itself where the artificial intelligence model is executed, or through a separate server (e.g., server (108)). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but is not limited to the examples described above. The artificial intelligence model may include a plurality of artificial neural network layers.An artificial neural network may be a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), a deep Q-network, or a combination of two or more of the above, but is not limited to the examples described above. In addition to the hardware structure, the artificial intelligence model may include a software structure, either additionally or substantially.

[0032] The memory (130) can store various data used by at least one component of the electronic device (101) (e.g., processor (120) or sensor module (176)). The data may include, for example, input data or output data for software (e.g., program (140)) and related commands. The memory (130) may include volatile memory (132) or non-volatile memory (134).

[0033] The program (140) may be stored as software in memory (130) and may include, for example, an operating system (142), middleware (144), or an application (146).

[0034] The input module (150) can receive commands or data to be used for a component of the electronic device (101) (e.g., processor (120)) from outside the electronic device (101) (e.g., user). The input module (150) may include, for example, a microphone, a mouse, a keyboard, a key (e.g., a button), or a digital pen (e.g., a stylus pen).

[0035] The sound output module (155) can output a sound signal to the outside of the electronic device (101). The sound output module (155) may include, for example, a speaker or a receiver. The speaker may be used for general purposes, such as multimedia playback or recording playback. The receiver may be used to receive incoming calls. According to one embodiment, the receiver may be implemented separately from the speaker or as part thereof.

[0036] The display module (160) can visually provide information to an external (e.g., user) of the electronic device (101). The display module (160) may include, for example, a display, a holographic device, or a projector and a control circuit for controlling said device. According to one embodiment, the display module (160) may include a touch sensor configured to detect a touch, or a pressure sensor configured to measure the intensity of the force generated by said touch.

[0037] The audio module (170) can convert sound into an electrical signal or, conversely, convert an electrical signal into sound. According to one embodiment, the audio module (170) can acquire sound through the input module (150) or output sound through the sound output module (155) or an external electronic device (e.g., electronic device (102)) (e.g., speaker or headphones) connected directly or wirelessly to the electronic device (101).

[0038] The sensor module (176) can detect the operating state of the electronic device (101) (e.g., power or temperature) or the external environmental state (e.g., user state) and generate an electrical signal or data value corresponding to the detected state. According to one embodiment, the sensor module (176) may include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0039] The interface (177) may support one or more specified protocols that can be used for the electronic device (101) to be connected directly or wirelessly to an external electronic device (e.g., electronic device (102)). According to one embodiment, the interface (177) may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

[0040] The connection terminal (178) may include a connector through which the electronic device (101) can be physically connected to an external electronic device (e.g., electronic device (102)). According to one embodiment, the connection terminal (178) may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector).

[0041] The haptic module (179) can convert an electrical signal into a mechanical stimulus (e.g., vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module (179) may include, for example, a motor, a piezoelectric element, or an electric stimulation device.

[0042] The camera module (180) can capture still images and video. According to one embodiment, the camera module (180) may include one or more lenses, image sensors, image signal processors, or flashes.

[0043] The power management module (188) can manage the power supplied to the electronic device (101). According to one embodiment, the power management module (188) can be implemented, for example, as at least part of a power management integrated circuit (PMIC).

[0044] The battery (189) can supply power to at least one component of the electronic device (101). According to one embodiment, the battery (189) may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell.

[0045] The communication module (190) can support the establishment of a direct (e.g., wired) communication channel or a wireless communication channel between an electronic device (101) and an external electronic device (e.g., electronic device (102), electronic device (104), or server (108)), and the performance of communication through the established communication channel. The communication module (190) may include one or more communication processors that operate independently of the processor (120) (e.g., application processor) and support direct (e.g., wired) communication or wireless communication. According to one embodiment, the communication module (190) may include a wireless communication module (192) (e.g., cellular communication module, short-range wireless communication module, or GNSS (global navigation satellite system) communication module) or a wired communication module (194) (e.g., LAN (local area network) communication module, or power line communication module). The corresponding communication module among these communication modules can communicate with an external electronic device (104) through a first network (198) (e.g., a short-range communication network such as Bluetooth, WiFi (wireless fidelity) direct, or IrDA (infrared data association)) or a second network (199) (e.g., a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (e.g., a LAN or WAN)). These various types of communication modules may be integrated into a single component (e.g., a single chip) or implemented as multiple separate components (e.g., multiple chips). The wireless communication module (192) can identify or authenticate the electronic device (101) within a communication network such as the first network (198) or the second network (199) using subscriber information (e.g., International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module (196).

[0046] The wireless communication module (192) can support 5G networks and next-generation communication technologies following 4G networks, for example, new radio access technology. NR access technology can support high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and connection of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low-latency communications (URLLC)). The wireless communication module (192) can support a high-frequency band (e.g., mmWave band) to achieve a high data transmission rate, for example. The wireless communication module (192) can support various technologies for securing performance in the high-frequency band, such as beamforming, massive MIMO (multiple-input and multiple-output), full-dimensional MIMO (FD-MIMO), array antenna, analog beam-forming, or large-scale antenna. The wireless communication module (192) can support various requirements specified in the electronic device (101), external electronic device (e.g., electronic device (104)), or network system (e.g., second network (199)). According to one embodiment, the wireless communication module (192) can support a Peak data rate (e.g., 20 Gbps or more) for realizing eMBB, loss coverage (e.g., 164 dB or less) for realizing mMTC, or U-plane latency (e.g., downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) for realizing URLLC.

[0047] An antenna module (197) can transmit a signal or power to or from an external source (e.g., an external electronic device). According to one embodiment, the antenna module (197) may include an antenna comprising a radiator made of a conductor or a conductive pattern formed on a substrate (e.g., a PCB). According to one embodiment, the antenna module (197) may include a plurality of antennas (e.g., an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network, such as a first network (198) or a second network (199), may be selected from the plurality of antennas, for example, by a communication module (190). A signal or power may be transmitted or received between the communication module (190) and an external electronic device through the selected at least one antenna. According to some embodiments, in addition to the radiator, other components (e.g., a radio frequency integrated circuit (RFIC)) may be additionally formed as part of the antenna module (197).

[0048] According to various embodiments, the antenna module (197) may form a mmWave antenna module. According to one embodiment, the mmWave antenna module may include a printed circuit board, an RFIC disposed on or adjacent to a first surface (e.g., bottom surface) of the printed circuit board and capable of supporting a specified high frequency band (e.g., mmWave band), and a plurality of antennas (e.g., array antennas) disposed on or adjacent to a second surface (e.g., top surface or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the specified high frequency band.

[0049] At least some of the above components can be connected to each other via a communication method between peripheral devices (e.g., bus, GPIO (general purpose input and output), SPI (serial peripheral interface), or MIPI (mobile industry processor interface)) and exchange signals (e.g., commands or data) with each other.

[0050] According to one embodiment, commands or data may be transmitted or received between the electronic device (101) and an external electronic device (104) through a server (108) connected to a second network (199). Each of the external electronic devices (102, or 104) may be the same or different type of device as the electronic device (101). According to one embodiment, all or part of the operations performed on the electronic device (101) may be performed on one or more of the external electronic devices (102, 104, or 108). For example, if the electronic device (101) needs to perform a function or service automatically or in response to a request from a user or another device, the electronic device (101) may request one or more external electronic devices to perform at least part of the function or service instead of performing the function or service itself or additionally. One or more external electronic devices that receive the above request may execute at least part of the requested function or service, or additional function or service related to the request, and transmit the result of the execution to the electronic device (101). The electronic device (101) may provide the result as is or additionally processed as at least part of the response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device (101) may provide ultra-low latency services using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device (104) may include an Internet of Things (IoT) device. The server (108) may be an intelligent server using machine learning and / or neural networks. According to one embodiment, the external electronic device (104) or the server (108) may be included within a second network (199).The electronic device (101) can be applied to intelligent services (e.g., smart home, smart city, smart car, or healthcare) based on 5G communication technology and IoT-related technology.

[0051] The electronic device according to the various embodiments disclosed in this document may be of various forms. The electronic device may include, for example, a portable communication device (e.g., a smartphone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a consumer electronics device. The electronic device according to the embodiments of this document is not limited to the devices described above.

[0052] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments. In connection with the description of the drawings, similar reference numerals may be used for similar or related components. The singular form of a noun corresponding to an item may include one or more of said items unless the relevant context clearly indicates otherwise. In this document, phrases such as "A or B," "at least one of A and B," "at least one of A or B," "A, B or C," "at least one of A, B and C," and "at least one of A, B, or C" may each include any one of the items listed together in the corresponding phrase, or all possible combinations thereof. Terms such as "first," "second," or "first" or "second" may be used simply to distinguish said components from other said components and do not limit said components in any other aspect (e.g., importance or order). Where any (e.g., 1st) component is referred to as “coupled” or “connected” to another (e.g., 2nd) component, with or without the terms “functionally” or “communicationly,” it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0053] The term “module” as used in the various embodiments of this document may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as logic, logic block, component, or circuit, for example. A module may be a component formed integrally, or a minimum unit of said component or a part thereof that performs one or more functions. For example, according to one embodiment, a module may be implemented in the form of an application-specific integrated circuit (ASIC).

[0054] Various embodiments of the present document may be implemented as software (e.g., program (140)) comprising one or more instructions stored in a storage medium (e.g., internal memory (136) or external memory (138)) readable by a machine (e.g., electronic device (101)). For example, a processor (e.g., processor (120)) of the machine (e.g., electronic device (101)) may call at least one of the one or more instructions stored in the storage medium and execute it. This enables the machine to be operated to perform at least one function according to the at least one called instruction. The one or more instructions may include code generated by a compiler or code that can be executed by an interpreter. The storage medium readable by the machine may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' simply means that the storage medium is a tangible device and does not contain a signal (e.g., electromagnetic waves), and the term does not distinguish between cases where data is stored semi-permanently and cases where it is stored temporarily.

[0055] According to one embodiment, the method according to the various embodiments disclosed herein may be provided by being included in a computer program product. The computer program product may be traded between a seller and a buyer as a product. The computer program product may be distributed in the form of a device-readable storage medium (e.g., compact disc read-only memory (CD-ROM)), or distributed online (e.g., download or upload) through an application store (e.g., Play Store™) or directly between two user devices (e.g., smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created on a device-readable storage medium, such as the memory of a manufacturer's server, an application store's server, or a relay server.

[0056] According to various embodiments, each component (e.g., module or program) of the components described above may include a singular or multiple entities, and some of the multiple entities may be separated and placed in other components. According to various embodiments, one or more of the components or operations of the aforementioned components may be omitted, or one or more other components or operations may be added. Generally or additionally, multiple components (e.g., module or program) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the multiple components in the same or similar manner as those performed by the corresponding component among the multiple components prior to integration. According to various embodiments, operations performed by the module, program, or other components may be executed sequentially, in parallel, iteratively, or heuristically, or one or more of the operations may be executed in a different order, omitted, or one or more other operations may be added.

[0057] FIG. 2 is a front perspective view showing a wearable electronic device according to one embodiment of the present disclosure.

[0058] FIG. 3 is a rear perspective view showing a wearable electronic device according to one embodiment of the present disclosure.

[0059] The embodiments of FIGS. 2 and 3 may be combined with the embodiment of FIG. 1 or the embodiments of FIGS. 5 to 17. The configurations of the embodiments of FIGS. 2 and 3 may be partially or wholly identical to the configurations of the embodiment of FIG. 1 or the configurations of FIGS. 5 to 17.

[0060] In the following detailed description, among the orthogonal coordinate systems of FIGS. 2, FIGS. 3 and FIGS. 4, the 'X-axis direction' can be understood as the width direction of the electronic device (101) or housing (210), the 'Y-axis direction' can be understood as the length direction of the electronic device (101) or housing (210), and the 'Z-axis direction' can be understood as the thickness direction of the electronic device (101) or housing (210). In one embodiment, the direction in which the front of the electronic device (101) or housing (210) (e.g., the first surface (210A) of FIG. 2) faces can be defined as the '+Z direction', and the direction in which the rear of the electronic device (101) or housing (210) (e.g., the second surface (210B) of FIG. 3) faces can be defined as the '-Z direction'.

[0061] Referring to FIGS. 2 and 3, a wearable electronic device (101) (e.g., the electronic device (101) of FIG. 1) may include a housing (210) or a wearable member (250, 260). The housing (210) may include a first surface (or front) (210A), a second surface (or rear) (210B) opposite to the first surface (210A), or a side (210C). The side (210C) may surround the space between the first surface (210A) and the second surface (210B).

[0062] According to one embodiment, the housing (210) may form at least a part of the exterior of the wearable electronic device (101). According to an embodiment, the wearable member (250, 260) may be defined as a part of the housing (210).

[0063] According to one embodiment, the wearable member (250, 260) may be connected to at least a portion of the housing (210) and configured to detachably attach the electronic device (101) to a part of the user's body (e.g., wrist, ankle, etc.). For example, the wearable member (250, 260) may wrap around the user's wrist when the wearable electronic device (101) is worn by the user, but is not limited thereto. According to one embodiment, the wearable member (250, 260) may be referred to as a strap. For example, the wearable electronic device (101) may be in the form of a wristwatch. In one embodiment, the housing (210) may refer to a structure forming a portion of the first surface (210A) of FIG. 2, the second surface (210B) of FIG. 3, and the side (210C). According to one embodiment, the first surface (210A) may be formed by a front plate (201) in which at least a portion is substantially transparent (e.g., a glass plate or a polymer plate comprising various coating layers). The second surface (210B) may be formed by a rear plate (207) that is substantially opaque. According to one embodiment, when the wearable electronic device (101) is worn by a user, the second surface (210B) and / or the rear plate (207) may come into contact with a part of the user's body (e.g., a wrist).

[0064] In one embodiment, when the wearable electronic device (101) includes a sensor module (211) disposed on a second surface (210B), the back plate (207) may include at least a partially transparent area. The back plate (207) may be formed, for example, by coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the materials. The side (210C) may be formed by a side bezel structure (or "side member") (206) comprising a metal and / or polymer, which is combined with the front plate (201) and the back plate (207). In one embodiment, the back plate (207) and the side bezel structure (206) may be formed integrally and may include the same material (e.g., a metallic material such as aluminum). The wearable member (250, 260) may be formed in various materials and shapes. For example, the wearable member (250, 260) may be formed such that an integral and a plurality of unit links are movable with each other by means of a woven fabric, leather, rubber, urethane, metal, ceramic, or a combination of at least two of the above materials.

[0065] According to one embodiment, the wearable electronic device (101) may include at least one of a display module (e.g., the display module (160) of FIG. 1, the display module (302) of FIG. 4, or the display module (400) of FIG. 5), an audio module (205, 208) (e.g., the audio module (170) of FIG. 1), a sensor module (211) (e.g., the sensor module (176) of FIG. 1), a key input device (202, 203, 204) (e.g., the input module (150) of FIG. 1), or a connector hole (209) (e.g., the connection terminal (178) of FIG. 1). In one embodiment, the wearable electronic device (101) may omit at least one of the components (e.g., the key input device (202, 203, 204), the connector hole (209), or the sensor module (211)) or additionally include other components.

[0066] According to one embodiment, a display panel of a display module (e.g., the display panel (320) of FIG. 4) may be visually exposed through a significant portion of, for example, a front plate (201) (e.g., the front plate (303) of FIG. 4). The shape of the display panel may be a shape corresponding to the shape of the front plate (201) and may be various shapes such as circular, elliptical, or polygonal. The display panel may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of a touch, and / or a fingerprint sensor.

[0067] The audio module (205, 208) may include a microphone hole (205) and a speaker hole (208). A microphone for acquiring external sound may be placed inside the microphone hole (205), and in one embodiment, a plurality of microphones may be placed to detect the direction of sound. The speaker hole (208) may be used as an external speaker and a receiver for calls. In one embodiment, a speaker may be included without a speaker hole (e.g., a piezo speaker).

[0068] The sensor module (211) can generate an electrical signal or data value corresponding to an internal operating state of the wearable electronic device (101) or an external environmental state. The sensor module (211) may include, for example, a biosensor module (211) (e.g., a heart rate monitoring (HRM) sensor) disposed on the second surface (210B) of the housing (210). The wearable electronic device (101) may further include at least one of the sensor modules not illustrated, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor.

[0069] The key input devices (202, 203, 204) may include a wheel key (202) disposed on a first surface (210A) of the housing (210) and rotatable in at least one direction, and / or a side key button (203, 204) disposed on a side (210C) of the housing (210). The wheel key (202) may be in a shape corresponding to the shape of the front plate (201). In one embodiment, the electronic device (101) may not include some or all of the aforementioned key input devices (202, 203, 204), and the key input devices (202, 203, 204) that are not included may be implemented in other forms, such as soft keys on a display. The connector hole (209) may accommodate a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device, and may include another connector hole (not shown) for accommodating a connector for transmitting and receiving audio signals with an external electronic device. The electronic device (101) may further include a connector cover (not shown) that, for example, covers at least a portion of the connector hole (209) and blocks the entry of external foreign matter into the connector hole.

[0070] The wearable member (250, 260) may be detachably attached to at least a portion of the housing (210) using a locking member (251, 261). The locking member (251, 261) may include a fastening component, such as a pogo pin, for example, and may be replaced by a protrusion(s) or recess(es) formed in the wearable member (250, 260) according to the embodiment. For example, the wearable member (250, 260) may be coupled by engaging with a groove or protrusion formed in the housing (210). The wearable member (250, 260) may include one or more of a fixing member (252), a fixing member fastening hole (253), a band guide member (254), and a band fixing ring (255).

[0071] The fixing member (252) may be configured to fix the housing (210) and the wearing member (250, 260) to a part of the user's body (e.g., wrist, ankle, etc.). The fixing member fastening hole (253) may fix the housing (210) and the wearing member (250, 260) to a part of the user's body in correspondence with the fixing member (252). The band guide member (254) may be configured to limit the range of movement of the fixing member (252) when the fixing member (252) is fastened to the fixing member fastening hole (253), thereby allowing the wearing member (250, 260) to be fastened in close contact with a part of the user's body. The band fixing ring (255) may limit the range of movement of the wearing member (250, 260) when the fixing member (252) and the fixing member fastening hole (253) are fastened.

[0072] FIG. 4 is an exploded perspective view showing a wearable electronic device according to one embodiment of the present disclosure.

[0073] The embodiment of FIG. 4 may be combined with the embodiments of FIG. 1 to 3, or the embodiments of FIG. 5 to 17. The configurations of the embodiment of FIG. 4 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 3, or the configurations of FIG. 5 to 17.

[0074] Referring to FIG. 4, a wearable electronic device (101) (e.g., the wearable electronic device (101) of FIG. 2 and FIG. 3) may include a housing (301) (e.g., the housing (210) of FIG. 2 and FIG. 3) that forms at least a part of the exterior of the wearable electronic device (101).

[0075] According to one embodiment, the housing (301) may include a side bezel structure (310) (e.g., the side bezel structure (206) of FIG. 2 and FIG. 3), a wheel key (330) (e.g., the wheel key (202) of FIG. 2 and FIG. 3), a support member (360) (e.g., a bracket), and a rear plate (392) (e.g., the rear plate (207) of FIG. 3). According to an embodiment, a front plate (303) (e.g., the front plate (201) of FIG. 2) may be defined and / or interpreted as part of the housing (301).

[0076] According to one embodiment, the wearable electronic device (101) may include one or more components disposed at and / or disposed inside the housing (301). The one or more components may be supported by the housing (301). For example, the wearable electronic device (101) may include a display module (302) (e.g., the display module (160) of FIG. 1, or the display module (400) of FIG. 5), a first antenna (350), a second antenna (e.g., an antenna included in a circuit board (355)), a battery (370), a printed circuit board (380), a sealing member (390), and a wearable member (395, 397) (e.g., the wearable member (250, 260) of FIG. 2 or FIG. 3). At least one of the components of the electronic device (101) may be identical or similar to at least one of the components of the electronic device (101) of FIG. 2 or FIG. 3, and redundant descriptions are omitted below.

[0077] According to one embodiment, the display module (302) may include a display panel (320) and a front plate (303) coupled to the outer surface of the display panel (320) (e.g., the surface facing the +Z direction in FIG. 4).

[0078] According to one embodiment, the display panel (320) may include one or more pixels. The display panel (320) may visually provide information (e.g., a visual image) to an outside of the wearable electronic device (101) (e.g., a user). The display panel (320) may be electrically connected to a display driver integrated circuit (DDI). An outer surface of the display panel (320) (e.g., a surface facing the +Z direction in FIG. 4) may be covered by a front plate (303).

[0079] According to one embodiment, the front plate (303) may be attached to the outer surface of the display panel (320) to cover the outer surface of the display panel (320). The front plate (303) may be formed of a transparent or translucent material so that information provided from the display panel (320) can be seen from the outside. For example, the front plate (303) may include glass, but is not limited thereto. The front plate (303) may include tempered glass, aluminosilicate glass, or a non-metallic material (e.g., polymer), but is not limited thereto, and may include various materials in which at least a portion may be formed as a transparent material.

[0080] According to one embodiment, the front plate (303) may be configured to protect the outer surface of the display panel (320). The front plate (303) may be referred to as a window or a cover window.

[0081] According to one embodiment, the front plate (303) may form at least a portion of the front surface of the wearable electronic device (101) (e.g., the surface facing the +Z direction in FIG. 4).

[0082] According to one embodiment, the support member (360) may be disposed inside the wearable electronic device (101) and connected to the side bezel structure (310), or may be formed integrally with the side bezel structure (310). The support member (360) may be formed from, for example, a metal material and / or a non-metal (e.g., a polymer) material. The support member (360) may have a display panel (320) attached to one side and a printed circuit board (380) attached to the other side. A processor, memory, and / or interface may be mounted on the printed circuit board (380).

[0083] A processor (e.g., the processor (120) of FIG. 1) may include, for example, one or more of a central processing unit, an application processor, a GPU (graphic processing unit), an application processor sensor processor, or a communication processor.

[0084] The memory (e.g., the memory (130) of FIG. 1) may include, for example, volatile memory or non-volatile memory.

[0085] The interface (e.g., the interface (177) of FIG. 1) may include, for example, an HDMI (high definition multimedia interface), a USB (universal serial bus) interface, an SD card interface, and / or an audio interface. The interface may, for example, electrically or physically connect the electronic device (101) to an external electronic device and may include a USB connector, an SD card / MMC connector, or an audio connector.

[0086] According to one embodiment, the battery (370) (e.g., the battery (189) of FIG. 1) is a device for supplying power to at least one component of the electronic device (101) and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery (370) may be disposed substantially coplanar with, for example, a printed circuit board (380). The battery (370) may be disposed integrally within the electronic device (101) or may be disposed detachably from the electronic device (101).

[0087] According to one embodiment, a first antenna (350) (e.g., antenna module (197) of FIG. 1) may be positioned between a display panel (320) and a support member (360). The first antenna (350) may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The first antenna (350) may, for example, communicate near field with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a near field communication signal or payment data. In one embodiment, the antenna structure may be formed by a part of the side bezel structure (310) and / or a combination thereof of the support member (360).

[0088] According to one embodiment, a circuit board (355) may be positioned between a printed circuit board (380) and a back plate (392). The circuit board (355) may include an antenna (e.g., the antenna module (197) of FIG. 1), for example, a near field communication (NFC) antenna, a wireless charging antenna, and / or a magnetic secure transmission (MST) antenna. The circuit board (355) may, for example, communicate near field with an external device, wirelessly transmit and receive power required for charging, and transmit a magnetic-based signal including a near field communication signal or payment data. In one embodiment, an antenna structure may be formed by a part of the side bezel structure (310) and / or a combination thereof of the back plate (392). In one embodiment, when an electronic device (101) (e.g., the electronic device (101) of FIG. 2 and FIG. 3) includes a sensor module (e.g., the sensor module (211) of FIG. 3), a sensor circuit or a sensor element (e.g., a photoelectric conversion element or an electrode pad) separate from the circuit board (355) may be placed on the circuit board (355). For example, an electronic component provided as a sensor module may be placed between a printed circuit board (380) and a back plate (392). The circuit board (255) may include at least one of a printed circuit board (PCB), a flexible printed circuit board (FPCB), or a rigid-flexible PCB (RF-PCB).

[0089] According to one embodiment, the sealing member (390) may be located between the side bezel structure (310) and the front plate (301). The sealing member (390) may be configured to block or reduce moisture and foreign matter entering from the outside into the space enclosed by the side bezel structure (310) and the front plate (301).

[0090] FIG. 5 is a perspective view showing the rear side of a display module according to one embodiment of the present disclosure.

[0091] FIG. 6 is a cross-sectional view taken along the line AA' of FIG. 5 according to one embodiment of the present disclosure.

[0092] The embodiments of FIGS. 5 and 6 may be combined with the embodiments of FIGS. 1 to 4, or the embodiments of FIGS. 7 to 17. The configurations of the embodiments of FIGS. 5 and 6 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 4, or the configurations of FIGS. 7 to 17.

[0093] Referring to FIGS. 5 and 6, a display module (400) (e.g., display module (302) of FIG. 4) may include a window (410) (e.g., front plate (303) of FIG. 4), a display panel (420) (e.g., display panel (320) of FIG. 4), a sealing member (430), a flexible printed circuit board (460) (flexible printed circuit board; FPCB), a cover film (470), and a display driver integrated circuit (e.g., 480 of FIG. 6).

[0094] According to one embodiment, the display module (400) has a center or center axis (CX) of the display module (400) and may have a circular shape based on the center or center axis (Cx), but is not limited thereto and may have various shapes.

[0095] According to one embodiment, the display module (400) may be referred to as a display assembly. The display module (400) may be supported by a housing (e.g., housing (301) of FIG. 4) of a wearable electronic device (e.g., wearable electronic device (101) of FIG. 4). The display module (400) may be disposed at, disposed in, or disposed on the housing.

[0096] According to one embodiment, the window (410) may be attached to the outer surface of the display panel (420) (e.g., the surface facing the +Z direction in FIG. 5 and FIG. 6). The window (410) may cover the outer surface of the display panel (420). The window (410) may be configured to protect the display panel (420).

[0097] According to one embodiment, at least a portion of the front surface of the window (410) may form at least a portion of the front surface (e.g., the front surface (210A) of FIG. 2) or the outer surface of the wearable electronic device. For example, the front surface of the window (410) (e.g., the side facing the +Z direction in FIG. 5 and 6) may face the outside of the wearable electronic device, and the rear surface of the window (410) (e.g., the side facing the -Z direction in FIG. 5 and 6) may face the inside of the wearable electronic device.

[0098] According to one embodiment, the display panel (420) may be combined with the window (410). According to one embodiment, the display panel (420) may be combined with the rear surface of the window (410) (e.g., the surface facing the -Z direction in FIG. 5 and FIG. 6).

[0099] According to one embodiment, the display panel (420) may include a touch sensor configured to detect a user's touch, or a pressure sensor configured to measure the intensity of the force generated by the user's touch.

[0100] According to one embodiment, the display panel (420) may include a planar portion (421) and a bending portion (e.g., the bending portion (423) of FIG. 6).

[0101] According to one embodiment, the flat portion (421) may be attached to the rear of the window (410). For example, the flat portion (421) may be disposed under the window (410). The flat portion (421) may form at least a portion of a display area configured to provide a visual image to a user.

[0102] According to one embodiment, the bending portion (423) may be extended to be bent from at least a portion of the edge of the planar portion (421). The bending portion (423) may include a curved portion extended to be bent toward the rear of the display module (400) (e.g., the -Z direction in FIG. 5 and 6) and another planar portion extending from the curved portion and parallel to the planar portion (421). The other planar portion may be referred to as a parallel portion.

[0103] According to one embodiment, at least a portion of the bending portion (423) (e.g., a parallel portion) may be coupled and / or connected to a flexible printed circuit board (460). For example, at least a portion of the bending portion (423) may be electrically connected to a flexible printed circuit board (460).

[0104] According to one embodiment, the flexible printed circuit board (460) may overlap with the flat portion (421) of the display panel (420) in the thickness direction (e.g., Z-axis direction) of the display module (400).

[0105] According to one embodiment, the flexible printed circuit board (460) can be physically and / or electrically connected to the main circuit board of a wearable electronic device (e.g., the printed circuit board (380) of FIG. 4).

[0106] According to one embodiment, the display driving integrated circuit (480) may be disposed on a flexible printed circuit board (460). For example, the display driving integrated circuit (480) may be disposed on and / or mounted on one side or the back side (e.g., the side facing the -Z direction in FIG. 5 and 6) of the flexible printed circuit board (460).

[0107] According to one embodiment, the display driving integrated circuit (480) may be electrically connected to the display panel (420) through the flexible printed circuit board (460). The display driving integrated circuit (480) may be configured to control image output through the display panel (420). The display driving integrated circuit (480) may be provided in the form of a chip disposed on one side of the flexible printed circuit board (460), but is not limited thereto, and may also be provided in the form of a circuitry embedded in the flexible printed circuit board (460).

[0108] According to one embodiment, the flexible printed circuit board (460) may be referred to as a substrate. The substrate may provide an electrical path for connecting the display panel (420) and the display driving integrated circuit (480). For example, the substrate may include electrical wiring to provide said electrical path. As an example, the substrate may include a panel that allows the display driving integrated circuit (480) to be connected to the display panel (420) in a COP (chip on panel) manner. As an example, the substrate may include plastic that allows the display driving integrated circuit (480) to be connected to the display panel (420) in a COP (chip on plastic) manner. As an example, the substrate may include glass that allows the display driving integrated circuit (480) to be connected to the display panel (420) in a COG (chip on glass) manner. As an example, the substrate may include a film that allows the display driving integrated circuit (480) to be connected to the display panel (420) in a COF (chip on film) manner. The type of substrate is not limited to that described above and may include various means capable of electrically connecting the display panel (420) and the display driving integrated circuit (480). Hereinafter, for convenience of explanation, the case where the substrate is a flexible printed circuit board (460) will be described as an example.

[0109] According to one embodiment, the cover film (470) can cover the flexible printed circuit board (460). For example, the cover film (470) may be superimposed on the rear surface of the flexible printed circuit board (460) (e.g., the surface facing the -Z direction in FIG. 5 and FIG. 6) and bonded and / or laminated to the rear surface.

[0110] According to one embodiment, the cover film (470) can cover the display driving integrated circuit (480). For example, the cover film (470) can wrap the display driving integrated circuit (480).

[0111] According to one embodiment, the cover film (470) may include, but is not limited to, a metal thin film. The cover film (470) may be electrically connected to the ground of the flexible printed circuit board (460).

[0112] According to one embodiment, the cover film (470) may be configured to block or reduce electromagnetic noise acting between the electrical / electronic components of the wearable electronic device and the display driving integrated circuit (480). The cover film (470) may be defined and / or interpreted as a shielding structure, a shielding film, or a shield-can.

[0113] According to one embodiment, the display module (400) may include a sealing member (430). The sealing member (430) may extend along the edge of the window (410) and the edge of the display panel (420). The sealing member (430) may cover the edge of the flat portion (421) of the display panel (420) and may be configured to seal the edge of the flat portion (421) of the display panel (420).

[0114] According to one embodiment, the sealing member (430) may be a ring shape extending along the outer line of the display module (400) overall, but is not limited thereto.

[0115] According to one embodiment, the sealing member (430) can limit and / or reduce the inflow of foreign substances and / or moisture from the outside of the wearable electronic device to electrical / electronic components located in the internal area of ​​the sealing member (430).

[0116] According to one embodiment, the sealing member (430) may include epoxy, but is not limited thereto. For example, the sealing member (430) may include resin. The sealing member (430) may be defined and / or referred to as a molding member or a bonding member.

[0117] According to one embodiment, the sealing member (430) may include a first protruding portion (438) and a second protruding portion (439) protruding from the inner edge of the sealing member (430). The second protruding portion (439) may be positioned opposite to the first protruding portion (438) with respect to the center axis (Cx).

[0118] According to one embodiment, when an assembly formed by assembling a cover window (410), a display panel (420), a flexible printed circuit board (460), a display driving integrated circuit (480), and a cover film (470) is coupled to a jig, a sealing member (430) may be formed by epoxy injected or filled into the edge of the assembly. For example, the jig may form a path through which the injected epoxy can flow between the jig and the assembly, and the shape of the sealing member (430) may be formed as the epoxy flows along the path provided by the jig. According to one embodiment, after the epoxy is formed into the shape of the sealing member (430), a curing process (e.g., a thermal curing process or a photocuring process) may be performed to form the sealing member (430). According to one embodiment, when the manufacture of the sealing member (430) is completed, the jig may be removed to complete the display module (400). According to one embodiment, in the manufacturing process of the sealing member (430), the portion into which epoxy is injected through an epoxy injection part (e.g., a dispenser) may form a first protruding portion (438). The first protruding portion (438) may include an injection port (438a) corresponding to the shape of the epoxy injection part. In the manufacturing process of the sealing member (430), a suction part (e.g., a vacuum pump) that provides negative pressure to allow the epoxy to flow may form a second protruding portion (439). The second protruding portion (439) may include an outlet (439a) corresponding to the shape of the suction part. For example, in the manufacturing process of the sealing member (430), the epoxy injected through the epoxy injection part may flow along a path provided from a jig by the negative pressure generated in the suction part.

[0119] According to one embodiment, in the manufacturing process of the sealing member (430), the epoxy may flow along the circumferential direction of the display module (400), and in this case, the epoxy may also fill the inner region of the bending portion (423) (e.g., the first region (A1) of FIG. 6).

[0120] According to one embodiment, the sealing member (430) may extend along the circumferential direction of the display module (400). A specific section (430A) of the sealing member (430) may correspond to a bending portion (423) of the display panel (420).

[0121] Hereinafter, the relationship between the sealing member (430) and the bending portion (423) of the display panel (420) in a specific section (430A) of the sealing member (430) is explained.

[0122] According to one embodiment, the sealing member (430) may include a first portion (431) filled in a first region (A1) defined by the inner surface of the bending portion (423). For example, the first region (A1) may be defined as an area enclosed by the inner surface or inner curve of the bending portion (423). According to one embodiment, the first portion (431) of the sealing member (430) may be disposed in or filled in the first region (A1).

[0123] According to one embodiment, the sealing member (430) may include a second portion (433) filled in a second region (A2) defined by the outer surface of the bending portion (423). For example, the second region (A2) may be defined as a region surrounding the outer surface or outer curve of the bending portion (423). According to one embodiment, the second portion (433) of the sealing member (430) may be placed in or filled in the second region (A2).

[0124] According to one embodiment, the first region (A1) may be defined and / or referred to as the first space, and the second region (A2) may be defined and / or referred to as the second space.

[0125] According to one embodiment, when epoxy flows during the manufacturing process of the sealing member (430), the epoxy branches out so that a portion of the epoxy can fill the first region (A1) and the remainder of the epoxy can fill the second region (A2). Accordingly, the first portion (431) and the second portion (433) can be formed.

[0126] According to one embodiment, when viewing a cross-section of the display module (400) in the periphery direction (e.g., as in FIG. 6), the size of the cross-sectional area of ​​the first region (A1) may be smaller than the size of the cross-sectional area of ​​the second region (A2). The first region (A1) may be in the form of a tunnel wrapped by a bending portion (423), but is not limited thereto.

[0127] In the manufacturing process of the sealing member (430), when the epoxy flows along the edge of the display panel (420), the flow rate of the epoxy in the first region (A1) may be slower than the flow rate of the epoxy in the second region (A2) because the cross-sectional area of ​​the first region (A1) is smaller than the cross-sectional area of ​​the second region (A2). In this case, the epoxy that has passed through the second region (A2) may flow back into the first region (A1), and an air gap or air trap may be formed as the epoxy is introduced from both sides inside the bending portion (423). Such an air gap or air trap may degrade the waterproof performance of the display module (400) or the wearable electronic device, or cause a crack in a part of the display module (400).

[0128] According to one embodiment of the present disclosure, in the manufacturing process of a sealing member (400), a first structure (e.g., the first structure (440) of FIG. 7) capable of limiting and / or reducing the backflow of epoxy passing through the second region (A2) into the first region (A1) and a second structure (e.g., the second structure (450) of FIG. 7) configured to control the flow rate of the epoxy in the second region (A2) may be provided.

[0129] FIG. 7 is a perspective view showing a part of a display module according to one embodiment of the present disclosure.

[0130] The embodiment of FIG. 7 may be combined with the embodiments of FIG. 1 to 6 or the embodiments of FIG. 8 to 17. The configurations of the embodiment of FIG. 7 may be partially or wholly identical to the configurations of the embodiments of FIG. 1 to 6 or the configurations of FIG. 8 to 17.

[0131] FIG. 7 is illustrated with the sealing member (e.g., the sealing member (430) of FIG. 5 and 6) omitted for convenience of explanation.

[0132] Referring to FIG. 7, a display module (400) (e.g., the display module (400) of FIG. 5 and 6) may include a window (410), a display panel (420), a sealing member (e.g., the sealing member (430) of FIG. 5 and 6), a first structure (440), a second structure (450), and a cushion layer (491).

[0133] According to one embodiment, the cushion layer (491) may be disposed at least partially between the flat portion (421) of the display panel (420) and the window (410). The cushion layer (491) may be configured to limit and / or reduce the transmission of excessive impact to the display panel (420) by mitigating external impact applied to the window (410). The cushion layer (491) may include, but is not limited to, an elastic material such as silicone, rubber, or sponge.

[0134] According to one embodiment, the first structure (440) may be disposed adjacent to the bending portion (423) of the display panel (420). The second structure (440) may be disposed adjacent to the bending portion (423) of the display panel (420).

[0135] According to one embodiment, the second structure (450) may be spaced apart from the first structure (440).

[0136] According to one embodiment, the first structure (440) may be spaced apart from the bending portion (423). The first structure (440) may be positioned on one side of the bending portion (423) to overlap at least partially with the first area defined by the bending portion (423) (e.g., the first area (A1) in FIG. 6). For example, the first structure (440) may overlap at least partially with the first area (A1) in the periphery direction (F1) of the display module (400). The first structure (440) may be positioned to overlap about 50% to about 100% of the cross-section of the first area (A1) in the periphery direction (F1) of the display module (400), but is not limited thereto.

[0137] According to one embodiment, the second structure (450) may be located in a second region (e.g., the second region (A2) of FIG. 6) that surrounds the bending portion (423). For example, the second structure (450) may be disposed to occupy a portion of the second region.

[0138] According to one embodiment, the second structure (450) may be spaced apart from the outer curved surface of the bending portion (423), but is not limited thereto.

[0139] According to one embodiment, when looking at the rear of the display module (400) (e.g., looking from the -Z direction to the +Z direction of FIG. 7), the second structure (450) may be positioned between the edge of the window (410) and the outer curved surface of the bending portion (423).

[0140] According to one embodiment, the bending portion (423) may define a first region (e.g., the first region (A1) of FIG. 6) which is the internal space of the bent shape of the bending portion (423).

[0141] According to one embodiment, one end of the first region (A1) may be defined as an inlet (423a) of the bending portion (423), and the other end of the first region (A1) may be defined as an outlet (423b) of the bending portion (423).

[0142] In the manufacturing process of the sealing member, the epoxy can flow along the circumferential direction (F1) of the display module (400). In the process of the epoxy flowing, the epoxy can be branched into a first region and a second region at one side of the bending portion (423) where the inlet (423a) of the bending portion (423) is formed. The epoxy branched into the first region can be introduced into the first region through the inlet (423a) and discharged through the outlet (423b). As the cross-sectional area of ​​the first region is smaller than the cross-sectional area of ​​the second region, the flow rate of the epoxy in the first region (e.g., epoxy flowing along the F2 path) may be lower than the flow rate of the epoxy in the second region (e.g., epoxy flowing along the F3 path). Accordingly, the time at which the epoxy flowing in the second region reaches the outlet (423b) may be earlier than the time at which the epoxy flowing in the first region reaches the outlet (423b). In this case, the epoxy flowing in the second region may flow back into the first region through the outlet (423b). At this time, as the epoxy introduced through the inlet (423a) and the epoxy flowing back through the outlet (423b) flow toward each other, an air gap or air trap may form between them. In this case, there is a risk that cracks may occur in the electrical / electronic components placed in the bending portion (423).

[0143] According to one embodiment, the first structure (440) can at least partially cover the outlet (423b) so that the epoxy passing through the second region does not flow back into the outlet (423b). For example, the epoxy passing through the second region (e.g., epoxy flowing through the F3 path) may be blocked by the first structure (440) and not flow back into the outlet (423b).

[0144] According to one embodiment, the first structure (440) may be referred to as a backflow prevention member.

[0145] According to one embodiment, the second structure (450) may occupy a portion of the second region. The second structure (450) may be configured to reduce the flow rate of epoxy passing through the second region (e.g., epoxy flowing through the F3 path). As the second structure (450) occupies a portion of the second region, the speed of the epoxy passing through the second region may be reduced.

[0146] According to one embodiment, as the flow rate of epoxy in the second region is reduced by the second structure (450), the time at which the epoxy passing through the second region reaches the outlet (423b) may be the same as or later than the time at which the epoxy passing through the first region reaches the outlet (423b).

[0147] According to one embodiment, the second structure (450) may be referred to as a flow rate control member.

[0148] According to one embodiment, when a sealing member is formed, the first region, which is the inner side of the bending portion (423), may not have an air gap or air trap formed therein, or the formation of an air gap or air trap may be minimized, as the flow rate of the epoxy in the second region is reduced by the second structure (450) and the backflow of the epoxy is prevented and / or limited by the first structure (450).

[0149] FIG. 8 is a cross-sectional view taken along the line BB' of FIG. 7 according to one embodiment of the present disclosure.

[0150] FIG. 9 is a cross-sectional view taken along the line BB' of FIG. 7 according to one embodiment of the present disclosure.

[0151] FIG. 10 is a cross-sectional view taken along the CC' line of FIG. 7 according to one embodiment of the present disclosure.

[0152] FIG. 11a is a cross-sectional view taken along the line CC' of FIG. 7 according to one embodiment of the present disclosure.

[0153] FIG. 11b is a cross-sectional view taken along the CC' line of FIG. 7 according to one embodiment of the present disclosure.

[0154] FIG. 12 is a rear view of a display module according to one embodiment of the present disclosure.

[0155] The embodiments of FIGS. 8 to 12 may be combined with the embodiments of FIGS. 1 to 7, or the embodiments of FIGS. 13 to 17. The configurations of the embodiments of FIGS. 8 to 12 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 7, or the configurations of FIGS. 13 to 17.

[0156] FIGS. 8, FIGS. 10, and / or FIG. 12 are cross-sectional views(s) of a display module showing a state before a sealing member is formed.

[0157] FIGS. 9, FIGS. 11a, and FIGS. 11b are cross-sectional views(s) of a display module showing the state after a sealing member is formed.

[0158] Referring to FIGS. 8 and 9, a display module (400) (e.g., the display module (400) of FIGS. 5 to 7) may include a window (410), a display panel (420), and a first structure (440).

[0159] According to one embodiment, the first structure (440) may be placed on and / or combined with the window (410) and the display panel (420) so as to be in contact with the flat portion (421) of the window (410) and the display panel (420).

[0160] According to one embodiment, the first structure (440) may be spaced apart from the bending portion (423) of the display panel (420).

[0161] According to one embodiment, the first structure (440) may have a hemisphere shape, but is not limited thereto and may have various shapes.

[0162] According to one embodiment, the first structure (440) may overlap with the first region (A1) defined by the bending portion (423). For example, the first structure (440) may be positioned parallel to the first region (A1).

[0163] According to one embodiment, the first structure (440) may be spaced apart from the edge of the bending portion (423). For example, the first structure (440) may be spaced apart by a specified distance (d2) from a part (e.g., the center) of the inclined portion (424) formed by the edge of the bending portion (423) (e.g., an edge formed to be inclined with respect to the flat portion (421)).

[0164] According to one embodiment, the specified distance (d2) may be about 0.3 to about 2.2 times the width (d1) of the first structure (440) (e.g., the diameter of the first structure (440) if the first structure (440) is hemispherical), but is not limited thereto. For example, the specified distance (d2) may be about 0.5 to about 2.0 times the width (d1) of the first structure (440), but is not limited thereto.

[0165] According to one embodiment, the specified distance (d2) may be about 0.3 to about 2.2 times the maximum width of the first area (A1) (e.g., width (d5) in FIG. 10), but is not limited thereto. For example, the specified distance (d2) may be about 0.5 to about 2.0 times the maximum width of the first area (A1) (e.g., width (d5) in FIG. 10), but is not limited thereto. The maximum width of the first region (A1) (e.g., width (d5) in FIG. 10) may be defined as the distance between the inflection point of the inner curved surface of the bending portion (423) and the center (e.g., center (427a) in FIG. 10) of the internal part of the display module (400) (e.g., internal part (427) in FIG. 10) when looking at the cross-section of the first region (A1) (e.g., when looking as in FIG. 10), but is not limited thereto. The inflection point of the inner curved surface of the bending portion (423) may be the point located furthest from the center of the internal part of the display module (400), but is not limited thereto.

[0166] According to one embodiment, in the manufacturing process of the sealing member (430), the epoxy may flow along path F2 shown in FIG. 8 from the first region (A1). As the first structure (440) is spaced apart from the bending portion (423), the epoxy passing through the first region (A1) may flow continuously without being blocked by the first structure (440). According to one embodiment, the first structure (440) may be spaced apart from the bending portion (423) and may overlap the first region (A1) and the perimeter direction of the display module (400) (e.g., the direction of F1 in FIG. 7 or the direction of path F2 in FIG. 8).

[0167] According to one embodiment, in the manufacturing process of the sealing member (430), the epoxy may flow along path F3 shown in FIG. 8 in the second region. As the first structure (440) is adjacent to the bending portion (423), the epoxy passing through the second region (A2) may not flow back in the direction of FB shown by being blocked by the first structure (440). Accordingly, the epoxy passing through the second region (A2) may not flow back into the first region (A1).

[0168] According to one embodiment, in the manufacturing process of the sealing member (430), when the epoxy is cured, a sealing member (430) may be formed including a first portion (431) filled in a first region (A1) and a second portion (433) filled in a second region (A2) as shown in FIG. 9.

[0169] According to one embodiment, the first structure (440) may be wrapped at least partially in the sealing member (430). The first structure (440) may be in contact with the sealing member (430) at least partially.

[0170] According to one embodiment, the first structure (440) may be formed of epoxy. The first structure (440) may include, but is not limited to, an epoxy of the same material as the epoxy of the sealing member (430) or an epoxy of a softer material than the epoxy of the sealing member (430) in order to limit damage to surrounding parts caused by shrinkage and / or expansion during the manufacturing process of the sealing member (430).

[0171] Referring to FIG. 10, FIG. 11a and FIG. 11b, the display module (400) may include an internal component (427).

[0172] According to one embodiment, the internal component (427) may be located at least partially between the bending portion (423) and the flat portion (421). The internal component (427) may include at least one of a flexible printed circuit board, a spacer, or a heat dissipation sheet.

[0173] According to one embodiment, the second structure (450) may be located adjacent to the bending portion (423). The second structure (450) may be placed on and / or combined with the back surface of the window (410).

[0174] According to one embodiment, the second structure (450) may be positioned inwardly spaced from the edge (411) or side of the window (410).

[0175] According to one embodiment, the width (d3) of the second structure (450) may be about 0.2 to about 0.9 times the distance (d4) from the edge (411) of the window (410) to the inflection point of the bending portion (423), but is not limited thereto. The width (d3) of the second structure (450) may be about 0.3 to about 0.8 times the distance (d4) from the edge (411) of the window (410) to the inflection point of the bending portion (423), but is not limited thereto.

[0176] According to one embodiment, in the manufacturing process of the sealing member (430), when the epoxy is cured, a sealing member (430) may be formed including a first portion (431) filled in a first region (A1) and a second portion (433) filled in a second region (A2) as shown in FIG. 11.

[0177] According to one embodiment, the second structure (450) may be wrapped at least partially in the sealing member (430). The second structure (450) may be in contact with the sealing member (430) at least partially.

[0178] According to one embodiment, the second structure (450) may be in the shape of a dome, but is not limited thereto and may have various shapes.

[0179] According to one embodiment, the second structure (450) may be formed of epoxy. The second structure (450) may include, but is not limited to, an epoxy of the same material as the epoxy of the sealing member (430) or an epoxy of a softer material than the epoxy of the sealing member (430) in order to limit damage to surrounding parts caused by shrinkage and / or expansion during the manufacturing process of the sealing member (430).

[0180] According to one embodiment, the thickness (d7) of the second structure (450) may be about 0.05 to about 0.95 times the maximum thickness (d6) of the second part (433) or sealing member (430), but is not limited thereto. According to one embodiment, the thickness (d7) of the second structure (450) may be about 0.1 to about 0.9 times the maximum thickness (d6) of the second part (433) or sealing member (430), but is not limited thereto.

[0181] According to one embodiment, the bending portion (423) may be convex toward the edge of the window (410), but is not limited thereto. For example, the bending portion (423) may be convex at least partially toward the downward direction of the window (410) (e.g., the -Z direction in FIG. 10 and FIG. 11).

[0182] Referring to FIG. 11b, the display module (400) may further include a third structure (455). The third structure (455) may be disposed on the cover film (470) of the display module (400) (e.g., the cover film (470) of FIG. 5). The third structure (455) may be configured to control the flow rate of the epoxy on the outside of the bending portion (423) during the manufacturing process of the sealing member (430). The third structure (455) may be formed of epoxy. The third structure (455) may include, but is not limited to, an epoxy of the same material as the epoxy of the sealing member (430) or an epoxy of a softer material than the epoxy of the sealing member (430) in order to limit damage to surrounding parts caused by shrinkage and / or expansion during the manufacturing process of the sealing member (430). According to one embodiment, the third structure (455) can at least partially contact the sealing member (430).

[0183] Referring to FIG. 12, the width (d1) of the first structure (440) (e.g., the diameter if the first structure (440) is hemispherical) may be about 0.8 to about 2.2 times the maximum width (e.g., width (d5) of FIG. 10) of the first region (e.g., the first region (A1) of FIG. 10), but is not limited thereto. The width (d1) of the first structure (440) (e.g., the diameter if the first structure (440) is hemispherical) may be about 1.0 to about 2.0 times the maximum width (e.g., width (d5) of FIG. 10) of the first region (e.g., the first region (A1) of FIG. 10), but is not limited thereto.

[0184] According to one embodiment, the second structure (450) may be formed to be elongated. According to one embodiment, the length (d9) of the second structure (450) may be about 0.1 to about 1.6 times the length (d8) of the bending portion (423), but is not limited thereto. According to one embodiment, the length (d9) of the second structure (450) may be about 0.2 to about 1.5 times the length (d8) of the bending portion (423), but is not limited thereto.

[0185] According to one embodiment, the first structure (440) and the second structure (450) may be defined and / or referred to as the first molding member (440) and the second molding member (450), respectively.

[0186] FIG. 13 is a perspective view showing a display module according to one embodiment of the present disclosure.

[0187] FIG. 14 is a perspective view showing a display module according to one embodiment of the present disclosure.

[0188] The embodiments of FIGS. 13 and 14 may be combined with the embodiments of FIGS. 1 to 12, or the embodiments of FIGS. 15 to 17. The configurations of the embodiments of FIGS. 13 and 14 may be partially or wholly identical to the configurations of the embodiments of FIGS. 1 to 12, or the configurations of FIGS. 15 to 17.

[0189] Referring to FIGS. 13 and 14, a display module (400) (e.g., the display module (400) of FIG. 7) may include a display panel (420) comprising a flat portion (421) and a bending portion (423), a sealing member (e.g., the sealing member (430) of FIGS. 5 and 6), a first structure (440), a second structure (550, 650) (e.g., the second structure (450) of FIG. 7), and a cushion layer (491).

[0190] According to one embodiment, the second structure (550, 650) may include a plurality of parts spaced apart from each other.

[0191] Referring to FIG. 13, the second structure (550) may include a first occupying member (551) and a second occupying member (552) that are spaced apart from each other along the periphery direction of the display module (400) and occupy a second area.

[0192] Referring to FIG. 14, the second structure (650) may include a first occupying member (651), a second occupying member (652), and a third occupying member (653) that are spaced apart from each other along the periphery direction of the display module (400) and occupy a second area.

[0193] Referring to FIGS. 7, 13, and 14, the case in which the number of elements of the second structure (450, 550, 650) is 1, 2, and 3 is described as an example, but the number of elements of the second structure is not limited thereto and can have various numbers.

[0194] FIG. 15 is a perspective view looking toward the front of an electronic device according to one embodiment of the present disclosure.

[0195] FIG. 16 is a perspective view looking toward the rear of an electronic device according to one embodiment of the present disclosure.

[0196] The embodiments of FIGS. 15 and 16 may be combined with the embodiments of FIGS. 1 to 14 or the embodiment of FIG. 17. The configurations of the embodiments of FIGS. 15 and 16 may be partially or entirely identical to the configurations of the embodiments of FIGS. 1 to 14 or the configurations of the embodiment of FIG. 17.

[0197] The components of the electronic device (1001) of FIGS. 15 and 16 may be some or all identical to the components of the electronic device (1001) of FIG. 1.

[0198] Referring to FIGS. 15 and 16, an electronic device (1001) according to one embodiment (e.g., the electronic device (101) of FIG. 1) may include a housing (1010) comprising a first surface (or front) (1010A), a second surface (or rear) (1010B), and a side (1010C) surrounding the space between the first surface (1010A) and the second surface (1010B). In one embodiment (not shown), the housing (1010) may refer to a structure forming some of the first surface (1010A), the second surface (1010B), and the side (1010C) of FIGS. 15 and 16.

[0199] According to one embodiment, the first surface (1010A) may be formed by a front plate (1011a) in which at least a portion is substantially transparent (e.g., a glass plate containing various coating layers, or a polymer plate). The second surface (1010B) may be formed by a rear plate (1011b) that is substantially opaque. The rear plate (1011b) may be formed by, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. The side (1010C) may be formed by a side structure (or "side bezel structure") (1018) comprising metal and / or polymer, which is combined with the front plate (1011a) and the rear plate (1011b). In one embodiment, the rear plate (1011b) and the side structure (1018) may be formed integrally and may comprise the same material (e.g., a metallic material such as aluminum).

[0200] According to one embodiment, the front plate (1011a) may include region(s) that are curved and seamlessly extended toward the rear plate (1011b) at least a portion of the edge. For example, the front plate (1011a) (or rear plate (1011b)) may include only one of the regions that are curved and extended toward the rear plate (1011b) (or front plate (1011a)) at one edge of the first surface (1010A). According to one embodiment, the front plate (1011a) or the rear plate (1011b) may be substantially flat in shape, in which case it may not include the curved and extended region. If the front plate (1011a) or the rear plate (1011b) includes the curved and extended region, the thickness of the electronic device (1001) in the portion including the curved and extended region may be smaller than the thickness of the other portion.

[0201] According to one embodiment, the electronic device (1001) may include at least one of a display module (1015) (e.g., the display module (160) of FIG. 1, or the display module (400) of FIG. 7), an audio module (e.g., a microphone hole (1003), an external speaker hole (1007), a receiver hole for calls (1014)), a sensor module (e.g., a first sensor module (1016), a second sensor module (not shown), a third sensor module (1019)), a camera module (e.g., a first camera device (1005), a second camera device (1012), a flash (1013)), a key input device (1017), a light-emitting element (1006), and a connector hole (e.g., a first connector hole (1009a), a second connector hole (1009b)). In one embodiment, the electronic device (1001) may omit at least one of the components (e.g., a key input device (1017), or a light-emitting element (1006)) or additionally include other components.

[0202] According to one embodiment, a display module (1015) (e.g., the display module (160) of FIG. 1, or the display module (400) of FIG. 7) may output a screen or be visually exposed through a significant portion of a first surface (1010A) (e.g., the front plate (1011a)). In one embodiment, at least a portion of the display module (1015) may be visually exposed through the front plate (1011a) forming the first surface (1010A) or through a portion of the side (1010C). In one embodiment, the corners of the display module (1015) may be formed to be generally identical to the adjacent outer shape of the front plate (1011a). In one embodiment (not shown), in order to expand the area where the display module (1015) is visually exposed, the gap between the outer edge of the display module (1015) and the outer edge of the front plate (1011a) may be formed to be generally identical.

[0203] According to one embodiment, a recess or opening is formed in a part of the screen display area of ​​the display module (1015), and at least one of an audio module (e.g., a call receiver hole (1014)), a sensor module (e.g., a first sensor module (1016)), a camera module (e.g., a first camera device (1005)), and a light-emitting element (1006) may be included that are aligned with the recess or the opening. In one embodiment (not shown), at least one of an audio module (e.g., a call receiver hole (1014)), a sensor module (e.g., a first sensor module (1016)), a camera module (e.g., a first camera device (1005)), a fingerprint sensor (not shown), and a light-emitting element (1006) may be included on the back surface of the screen display area of ​​the display module (1015). In one embodiment (not shown), the display module (1015) may be combined with or placed adjacent to a touch detection circuit, a pressure sensor capable of measuring the intensity (pressure) of the touch, and / or a digitizer capable of detecting a magnetic field type stylus pen.

[0204] According to one embodiment, the audio module (1003, 1007, 1014) may include a microphone hole (1003) and a speaker hole (e.g., an external speaker hole (1007), a call receiver hole (1014)). A microphone for acquiring external sound may be placed inside the microphone hole (1003), and in one embodiment, a plurality of microphones may be placed to detect the direction of sound. The speaker hole may include an external speaker hole (1007) and a call receiver hole (1014). In one embodiment, the speaker hole (e.g., an external speaker hole (1007), a call receiver hole (1014)) and the microphone hole (1003) may be implemented as a single hole, or a speaker may be included without a speaker hole (e.g., an external speaker hole (1007), a call receiver hole (1014)) (e.g., a piezo speaker).

[0205] According to one embodiment, the sensor module may generate an electrical signal or data value corresponding to an internal operating state of the electronic device (1001) or an external environmental state. The sensor module may include, for example, a first sensor module (1016) (e.g., proximity sensor) and / or a second sensor module (not shown) (e.g., fingerprint sensor) disposed on a first surface (1010A) of the housing (1010), and / or a third sensor module (1019) disposed on a second surface (1010B) of the housing (1010). The second sensor module (not shown) (e.g., fingerprint sensor) may be disposed on the second surface (1010B) or side (1010C) as well as on the first surface (1010A) (e.g., display module (1015)) of the housing (1010). The electronic device (1001) may further include at least one of, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biosensor, a temperature sensor, a humidity sensor, or an illuminance sensor (1004).

[0206] According to one embodiment, the camera module may include a first camera device (1005) disposed on a first surface (1010A) of the electronic device (1001), a second camera device (1012) disposed on a second surface (1010B), and / or a flash (1013). The camera devices (e.g., the first camera device (1005), the second camera device (1012)) may include one or more lenses, an image sensor, and / or an image signal processor. The flash (1013) may include, for example, a light-emitting diode or a xenon lamp. In one embodiment, one or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one surface of the electronic device (1001). In one embodiment, the flash (1013) may emit infrared light, and the infrared light emitted by the flash (1013) and reflected by the subject may be received through the third sensor module (1019). The electronic device (1001) or the processor of the electronic device (1001) (e.g., the processor (1020) of FIG. 1) may detect depth information of the subject based on the time when the infrared light is received by the third sensor module (1019).

[0207] According to one embodiment, a key input device (1017) may be disposed on a side (1010C) of a housing (1010). In one embodiment, the electronic device (1001) may not include some or all of the aforementioned key input devices (1017), and the key input devices (1017) that are not included may be implemented in other forms, such as soft keys, on a display module (1015). In one embodiment, the key input device may include a sensor module disposed on a second side (1010B) of the housing (1010).

[0208] According to one embodiment, the light-emitting element (1006) may be disposed, for example, on a first surface (1010A) of a housing (1010). The light-emitting element (1006) may, for example, provide state information of an electronic device (1001) in the form of light. In one embodiment, the light-emitting element (1006) may, for example, provide a light source that is coupled with the operation of a camera module (e.g., a first camera device (1005)). The light-emitting element (1006) may include, for example, an LED, an IR LED, and a xenon lamp.

[0209] According to one embodiment, the connector hole (e.g., first connector hole (1009a), second connector hole (1009b)) may include a first connector hole (1009a) capable of receiving a connector (e.g., a USB connector) for transmitting and receiving power and / or data with an external electronic device (e.g., the electronic device (10002) of FIG. 1), and a second connector hole (e.g., an earphone jack) (1009b) capable of receiving a connector for transmitting and receiving audio signals with an external electronic device.

[0210] FIG. 17 is a drawing showing a portion of the rear surface of a display module according to one embodiment of the present disclosure.

[0211] The embodiment of FIG. 17 can be combined with the embodiments of FIG. 1 to 16. The configurations of the embodiment of FIG. 17 may be partially or entirely identical to the configurations of the embodiments of FIG. 1 to 16.

[0212] Referring to FIG. 17, a display module (1100) (e.g., the display module (1015) of FIG. 15, or the display module (400) of FIG. 7) may include a display panel (1120) (e.g., the display panel (420) of FIG. 7), a sealing member (1130) (e.g., the sealing member (430) of FIG. 6), a first structure (1140) (e.g., the first structure (440) of FIG. 7), and a cover film (1170) (e.g., the cover film (470) of FIG. 6).

[0213] According to one embodiment, the display panel (1120) may include a flat portion (1121) (e.g., the flat portion (421) of FIG. 7) and a bending portion (1123) (e.g., the bending portion (423) of FIG. 7) extended from the flat portion (1121) to be bent. A cover film (1170) may be attached to the bending portion (1123) to cover the bending portion (1123).

[0214] According to one embodiment, the sealing member (1130) can wrap at least a portion of the edge of the display panel (1120).

[0215] According to one embodiment, the first structure (1140) may be positioned on one side of the first region (A1) so as to overlap with the first region (A1) defined by the bending portion (1123). The first structure (1140) may be spaced apart from the bending portion (1123).

[0216] The first or second structure of the present disclosure, described with reference to FIGS. 1 to 17, may be applied to a watch-type wearable electronic device as shown in FIGS. 2 to 4 or to a bar-shaped electronic device as shown in FIGS. 15 and 16, but is not limited thereto and may be applied to various types of electronic devices. For example, the first or second structure of the present disclosure may be applied to various types of electronic devices in which a display panel includes a bending portion and a sealing member filled in the bending portion.

[0217] An electronic device or a wearable electronic device may include a portion in which at least a part of a display panel is bent. The electronic device or the wearable electronic device may include a sealing member to restrict the ingress of external foreign substances or moisture into electrical / electronic components located on the inside of the display panel. In the process of forming the sealing member, it may be difficult to uniformly fill the inner and outer sides of the bending portion due to the shape of the bending portion.

[0218] According to one embodiment of the present disclosure, a wearable electronic device can be provided in which a sealing member can be uniformly formed on the inner and outer sides of a bending portion of a display panel by preventing backflow of epoxy or controlling the flow rate of epoxy during the manufacturing process of the sealing member.

[0219] However, the problems to be solved in this disclosure are not limited to those mentioned above, and may be expanded in various ways without departing from the spirit and scope of this disclosure.

[0220] According to one embodiment of the present disclosure, a display module and a wearable electronic device including the same may be provided, wherein the formation of an air gap or air trap inside a bending portion of a display panel may be limited and / or reduced.

[0221] The effects obtainable from the present disclosure are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art to which the present disclosure belongs from the description below.

[0222] According to one embodiment of the present disclosure, a wearable electronic device (101) may include a housing (301) that forms at least a part of the exterior of the wearable electronic device (101).

[0223] According to one embodiment, the wearable electronic device (101) may include a display module (400) disposed in the housing (301).

[0224] According to one embodiment, the display module (400) may include a window (410) that forms at least a portion of the front surface of the wearable electronic device (101).

[0225] According to one embodiment, the display module (400) may include a display panel (420) comprising a flat portion (421) positioned below the window (410) and a bending portion (423) extended to be bent from a portion of the edge of the flat portion (421).

[0226] According to one embodiment, the display panel (420) may include a sealing member (430) configured to seal the edge of the flat portion (421) of the display panel (420).

[0227] According to one embodiment, the first portion (431) of the sealing member (430) can be filled in the first region (A1) surrounded by the inner surface of the bending portion (423).

[0228] According to one embodiment, the second portion (433) of the sealing member may be filled in the second area (A2) surrounding the outer surface of the bending portion (423).

[0229] According to one embodiment, the display module (400) may include a first structure (440) that is spaced apart from the bending portion (423), is positioned to overlap at least partially with the first region (A1), and is in contact at least partially with the sealing member (430).

[0230] According to one embodiment, the display module (400) may include a second structure (450) that is positioned to occupy a portion of the second area (A2) and at least partially contacts the sealing member (430).

[0231] According to one embodiment, the first structure (440) may be arranged to overlap with the first region (A1) in the periphery direction of the display module (400).

[0232] According to one embodiment, the first structure (440) may have a softer material than the sealing member (430).

[0233] According to one embodiment, the width (d1) of the first structure (440) may be 0.5 to 2.0 times the maximum width (d5) of the first region (A1).

[0234] According to one embodiment, the first structure (440) may be spaced apart from the bending portion (423) by a specified distance (d2).

[0235] According to one embodiment, the specified distance (d2) may be 0.5 to 2.0 times the width (d1) of the first structure (440).

[0236] According to one embodiment, the first structure (440) may be spaced apart from the bending portion (423) by a specified distance (d2).

[0237] According to one embodiment, the specified distance (d2) may be 0.5 to 2.0 times the maximum width (d5) of the first area (A1).

[0238] According to one embodiment, the second structure (450) may be located between the edge of the window (410) and the bending portion (423).

[0239] According to one embodiment, the second structure (450) may have a softer material than the sealing member (430).

[0240] According to one embodiment, the thickness (d7) of the second structure (450) may be 0.1 to 0.9 times the maximum thickness (d6) of the sealing member (430).

[0241] According to one embodiment, the second structure (450) may be formed in an elongated shape.

[0242] According to one embodiment, the length (d9) of the second structure (450) may be 0.2 to 1.5 times the length (d8) of the bending portion (423).

[0243] According to one embodiment, the first structure (440) can come into contact with the planar portion (421).

[0244] According to one embodiment, the second structure (450) may be spaced apart from the bending portion (423).

[0245] According to one embodiment, the display module (400) may include a cover film (470) arranged to cover the bending portion (423).

[0246] According to one embodiment, the display module (400) may include a third structure (455) disposed on the cover film (470) and in contact with at least partially the sealing member (430).

[0247] According to one embodiment, the third structure (455) may have a softer material than the sealing member (430).

[0248] According to one embodiment, the second structure (550) may include a first occupying member (551) and a second occupying member (552) that are spaced apart from each other and occupy the second region (A2).

[0249] According to one embodiment of the present disclosure, a wearable electronic device (101) may include a housing (301) that forms at least a part of the exterior of the wearable electronic device (101).

[0250] According to one embodiment, the wearable electronic device (101) may include a display module (400) disposed in the housing (301).

[0251] According to one embodiment, the display module (400) may include a window (410) that forms at least a portion of the front surface of the wearable electronic device (101).

[0252] According to one embodiment, the display module (400) may include a display panel (420) comprising a flat portion (421) positioned below the window (410) and a bending portion (423) extended to be bent from a portion of the edge of the flat portion (421).

[0253] According to one embodiment, the display module (400) may include a flexible printed circuit board (460) connected to the bending portion (423).

[0254] According to one embodiment, the display module (400) may include a display driving integrated circuit (480) disposed on the flexible printed circuit board (460).

[0255] According to one embodiment, the display module (400) may include a sealing member (430) configured to seal the edge of the flat portion (421) of the display panel (420).

[0256] According to one embodiment, the first portion (431) of the sealing member (430) can be filled in the first region (A1) surrounded by the inner surface of the bending portion (423).

[0257] According to one embodiment, the second portion (433) of the sealing member may be filled in the second area (A2) surrounding the outer surface of the bending portion (423).

[0258] According to one embodiment, the display module (400) may include a first structure (440) that is spaced apart from the bending portion (423), is positioned to overlap at least partially with the first region (A1), and is in contact at least partially with the sealing member (430).

[0259] According to one embodiment, the display module (400) may include a cover film (470) that is coupled to the flexible printed circuit board (460) and covers the display driving integrated circuit (480).

[0260] According to one embodiment, the sealing member (430) may include epoxy.

[0261] According to one embodiment, the first structure (440) may include an epoxy material that is softer than the sealing member (430).

[0262] According to one embodiment, the display module (400) may further include a second structure (450) that is positioned to occupy a portion of the second area (A2) and at least partially contacts the sealing member (430).

[0263] Although specific embodiments have been described in the detailed description of this document, it will be obvious to those skilled in the art that various modifications are possible within the scope of this document.

Claims

1. In a wearable electronic device (101), A housing (301) forming at least a part of the exterior of the above-mentioned wearable electronic device (101); and It includes a display module (400) disposed in the above housing (301), and The above display module (400) is, A window (410) forming at least a portion of the front surface of the wearable electronic device (101); A display panel (420) comprising a flat portion (421) positioned below the window (410) and a bending portion (423) extended to be bent from a portion of the edge of the flat portion (421); A sealing member (430) configured to seal the edge of the flat portion (421) of the display panel (420), wherein a first portion (431) of the sealing member (430) is filled in a first area (A1) surrounded by the inner surface of the bending portion (423), and a second portion (433) of the sealing member is filled in a second area (A2) surrounding the outer surface of the bending portion (423); A first structure (440) spaced apart from the bending portion (423), positioned to overlap at least partially with the first region (A1), and at least partially in contact with the sealing member (430); and A wearable electronic device (101) comprising a second structure (450) positioned to occupy a portion of the second region (A2) and in contact with at least partially the sealing member (430).

2. In Paragraph 1, The first structure (440) is a wearable electronic device (101) arranged to overlap with the first region (A1) in the circumferential direction of the display module (400).

3. In Paragraph 1 or 2, The first structure (440) is a wearable electronic device (101) having a softer material than the sealing member (430).

4. In any one of paragraphs 1 to 3, The width (d1) of the first structure (440) is 0.5 to 2.0 times the maximum width (d5) of the first region (A1), in a wearable electronic device (101).

5. In any one of paragraphs 1 through 4, The first structure (440) is spaced apart from the bending portion (423) by a specified distance (d2), and The above-mentioned specified distance (d2) is 0.5 to 2.0 times the width (d1) of the first structure (440) of the wearable electronic device (101).

6. In any one of paragraphs 1 through 5, The first structure (440) is spaced apart from the bending portion (423) by a specified distance (d2), and The above-mentioned specified distance (d2) is 0.5 to 2.0 times the maximum width (d5) of the first area (A1), in a wearable electronic device (101).

7. In any one of paragraphs 1 through 6, The second structure (450) is a wearable electronic device (101) located between the edge of the window (410) and the bending portion (423).

8. In any one of paragraphs 1 through 7, The second structure (450) is a wearable electronic device (101) having a softer material than the sealing member (430).

9. In any one of paragraphs 1 through 8, The thickness (d7) of the second structure (450) is 0.1 to 0.9 times the maximum thickness (d6) of the sealing member (430) of the wearable electronic device (101).

10. In any one of paragraphs 1 through 9, The above second structure (450) is formed in an elongated shape, and The length (d9) of the second structure (450) is 0.2 to 1.5 times the length (d8) of the bending portion (423) of the wearable electronic device (101).

11. In any one of paragraphs 1 through 10, The first structure (440) is a wearable electronic device (101) that contacts the planar portion (421).

12. In any one of paragraphs 1 through 11, The second structure (450) above is a wearable electronic device (101) spaced apart from the bending portion (423).

13. In any one of paragraphs 1 through 12, The above display module (400) is, A cover film (470) positioned to cover the bending portion (423); and A wearable electronic device (101) further comprising a third structure (455) disposed on the cover film (470) and in contact at least partially with the sealing member (430).

14. In any one of paragraphs 1 through 13, The above third structure (455) is a wearable electronic device (101) having a softer material than the sealing member (430).

15. In any one of paragraphs 1 through 14, The above second structure (550) is a wearable electronic device (101) comprising a first occupying member (551) and a second occupying member (552) that are spaced apart from each other and occupy the second region (A2).

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