Dielectric powder plasma surface treatment apparatus and dielectric powder plasma surface treatment method using same

Abstract

The present invention relates to a plasma treatment apparatus and method for uniformly treating the surface of dielectric powder. The apparatus includes a dielectric substrate, a lower electrode, an upper electrode, and an alternating current power source, and selectively or alternately performs a plasma generation mode and a dielectric powder flow mode by a control means. Accordingly, plasma surface treatment can be performed while inducing vertical mixing of dielectric powder, thereby improving treatment uniformity.

Description

Dielectric powder plasma surface treatment apparatus and method for dielectric powder plasma surface treatment using the same

[0001] The present invention relates to a technology for efficiently plasma surface treating dielectric powders, and in particular to an apparatus and method for effectively plasma treating dielectric powders by utilizing vigorous flow and plasma surface treatment.

[0002] Dielectric powders are utilized in various industrial fields, including semiconductors, electronic materials, coatings, and classification technologies. In particular, controlling the surface properties of dielectric powders is one of the key technologies for enhancing material functionality and ensuring process stability. Plasma treatment is a representative method for surface modification of dielectric powders. Plasma treatment is a technique that uses an electric field to ionize a gas, allowing activated plasma particles to react with the powder surface, thereby enabling the control of hydrophilicity or hydrophobicity, the introduction of chemical functional groups, and changes in surface energy.

[0003] However, in conventional plasma surface treatment methods, since the powder is processed while stationary, the upper portion of the powder directly exposed to the plasma is effectively modified, but the powder located at the bottom does not undergo sufficient reaction, resulting in uneven surface modification. Extending the process time to resolve this issue may lead to a decrease in overall processing efficiency.

[0004] To overcome the limitations of such existing technologies, the present invention proposes a method to more uniformly and efficiently modify the surface of dielectric powder by combining plasma surface treatment technology and dielectric powder flow technology.

[0005] One objective of the present invention is to provide a dielectric powder surface treatment apparatus capable of modifying the surface of a powder more uniformly and efficiently by combining a technology for surface treating a dielectric powder with plasma and a technology for flowing a dielectric powder.

[0006] Another objective of the present invention is to provide a method for surface treatment of a dielectric powder using the dielectric powder surface treatment device described above.

[0007] In one aspect, the present invention provides a dielectric powder plasma surface treatment apparatus comprising: an upright chamber having a dielectric substrate disposed on an inner bottom surface; a lower electrode formed at the bottom of the dielectric substrate; an upper electrode located inside the chamber spaced apart from the bottom surface of the chamber at a certain distance; a power supply means for electrically connecting the lower electrode and the upper electrode to apply an alternating voltage; and a control means for selectively or alternately performing a plasma generation mode for generating plasma in the chamber interior space between the dielectric substrate and the upper electrode and a flow mode for flowing dielectric powder.

[0008] The present invention comprises a lower electrode and an upper electrode, wherein the electrodes are spaced apart from each other to form an alternating electric field that induces an upward flow of dielectric powder between dielectric powders. The lower electrode and the upper electrode are electrically connected to allow the application of an alternating voltage, and by applying the alternating voltage, plasma can be generated or dielectric powder can be moved upward.

[0009] In the plasma discharge device according to the present invention, the power supply means is configured to selectively or alternately form a plasma generation mode for plasma treating the surface of a dielectric powder and a flow mode for flowing the dielectric powder.

[0010] In the above plasma generation mode, in order to generate plasma in the internal space of the chamber, a voltage greater than the breakdown voltage must be applied, taking into account the electrode spacing and the atmospheric conditions inside the chamber. As the electric field becomes stronger, the electrons of the gas molecules gain energy and move, and when a certain critical energy is exceeded, the gas molecules become ionized, generating electrons and positive ions. When this collision ionization occurs repeatedly, it transitions into a plasma state, and a plasma in which the gas is partially ionized can be formed.

[0011] In the above flow mode, all or most of the dielectric powders may flow upward to the upper electrode and undergo vigorous flow. After the flow process is complete, the dielectric powders undergo vertical mixing, allowing the dielectric powders located in the lower layer on the dielectric substrate to move to the upper layer, thereby facilitating smoother plasma processing.

[0012] The above plasma generation mode and the above flow mode may be executed selectively or alternately. Execution selectively means executing only one of the two modes independently, and execution alternately means repeatedly performing the two modes alternately in a specific order. The present invention has technical significance in that dielectric powder can be uniformly modified by appropriately executing the plasma generation mode and the flow mode.

[0013] In one embodiment, the dielectric powder plasma surface treatment device may further include a plasma source gas supply unit that supplies a plasma source gas into the chamber. Here, the plasma source gas is a gas supplied into the chamber to generate plasma, which is ionized through an electric field to form plasma. If the plasma source gas corresponds to a gas with a low discharge initiation voltage (100 to 500 V when the discharge gap is 1 mm), it may fall within the scope of the present invention. When a gas with a low discharge initiation voltage is used as the plasma source gas, sufficient electron-ion collisions can be induced while reducing power consumption, thereby providing suitable conditions for plasma formation.

[0014] In one embodiment, the plasma source gas may comprise one or more substances selected from the group comprising helium (He), neon (Ne), and argon (Ar). These inert gases are chemically stable and have low reactivity, so they can induce strong ion collisions to generate plasma without causing unwanted chemical reactions, making them suitable as source gases for plasma generation.

[0015] In addition, maintaining a low-pressure state inside the chamber may be suitable for plasma generation. Here, "low-pressure state" means a near-vacuum state (about 0.1 to 500 Torr), and when a high voltage is applied in such a low-pressure state, electrons and ions collide in regions where remaining gas molecules exist, causing an ionization process that may be advantageous for forming plasma.

[0016] In one embodiment, a fluid supply unit for supplying a fluid containing polar molecules into the interior of the chamber may be further included. A fluid refers to a fluid that provides a medium through which dielectric powder can flow, and can perform the role of improving the surface reactivity of the dielectric powder. Polar molecules are molecules having partial positive and negative electrical charges, and when an external flow voltage is applied, they serve to impart a net charge to the surface of the dielectric powder for powder flow within an electric field. Additionally, surface modification can occur by ionizing these molecules or forming active radicals within the plasma to impart new chemical functional groups to the surface of the dielectric powder. Through this, the hydrophilicity or hydrophobicity of the dielectric powder can be controlled.

[0017] In one embodiment, the control means may include an AC voltage control means capable of adjusting the strength and frequency of the AC voltage applied to the lower electrode and the upper electrode. Increasing the strength of the AC voltage increases the electric field strength between the electrodes, thereby increasing the plasma density and the fluidity of the powder; conversely, lowering the strength of the AC voltage decreases the electric field strength between the electrodes, thereby decreasing the plasma density and the fluidity of the powder. Additionally, lowering the frequency of the AC voltage increases the period of change in the upward-downward direction of the dielectric powder, thereby increasing the flow range of the dielectric powder; conversely, at a long frequency, the flow range of the dielectric powder may decrease.

[0018] In one embodiment, the control means may include an electrode spacing adjustment means capable of adjusting the spaced-apart distance between the lower electrode and the upper electrode. Since the strength of the electric field formed in the space between the electrodes becomes stronger as the distance between the electrodes narrows, the fluidity of the dielectric powder can be controlled by adjusting the distance between the electrodes. Through this, flow conditions can be optimized, and plasma treatment characteristics can be adjusted to suit various process conditions.

[0019] In another aspect, the present invention provides a method for plasma surface treatment of dielectric powder through a dielectric powder plasma treatment apparatus, comprising: placing dielectric powder on a dielectric substrate; applying an alternating voltage having a strength and frequency sufficient to enable a plasma generation mode in which plasma is generated in the internal space of a chamber between the dielectric substrate and the upper electrode; and applying an alternating voltage having a strength and frequency sufficient to enable a flow mode in which the dielectric powders placed on the dielectric substrate flow upward and the dielectric powders are mixed vertically.

[0020] A plasma generation mode can be formed by placing dielectric powder on a dielectric substrate and then applying an alternating voltage to generate plasma in the internal space of a chamber between the dielectric substrate and the upper electrode. At this time, the upper layer of the dielectric powder on the dielectric substrate is directly exposed to the space where plasma is generated, so surface treatment is performed relatively easily. However, the surface treatment of the dielectric powder located in the lower layer may not be uniform because contact with the plasma is limited.

[0021] To solve this, a flow mode can be formed by applying an alternating voltage sufficient to allow the dielectric particles to flow upward and be mixed vertically. In this process, the dielectric particles in the lower layer move upward and have the opportunity to be exposed to the plasma, and as a result, all dielectric particles on the dielectric substrate can be processed uniformly.

[0022] In one embodiment, the flow mode may be characterized by being performed while plasma generation is stopped. Although the flow mode may be performed in a space where plasma is generated, this is undesirable as the plasma may hinder the flow of the fluid powder. On the other hand, when the flow mode is performed while plasma generation is stopped, the dielectric powder can move more freely, allowing the flow mode to be performed smoothly. Accordingly, it is preferable to separate the plasma generation step from the fluidization process of the fluid powder; through this process, the vertical mixing of the dielectric powder is performed more effectively, and the uniformity of the overall surface treatment can be improved.

[0023] In one embodiment, the plasma generation mode and the flow mode may be performed repeatedly. While the upper layer of the dielectric powder on the dielectric substrate directly exposed to the space where the plasma discharge occurs may undergo sufficient plasma surface treatment, the dielectric powder on the lower layer may not undergo sufficient surface treatment. Subsequently, through the flow mode, the dielectric powder on the dielectric substrate is mixed vertically, causing the dielectric powder in the lower layer to move to the upper layer, thereby rearranging the powder and giving the new surface an opportunity to be exposed to the plasma. This process can be repeated two or more times for an appropriate number of times, and as the process is repeated, the dielectric powder that has not undergone surface treatment is exposed to the plasma, allowing all particles of the dielectric powder to be treated evenly.

[0024] In one embodiment, the process may further include supplying a plasma source gas into the interior of the chamber before the plasma generation mode is performed. Preferably, the plasma source gas is a gas in a low-pressure state or a gas with a low discharge initiation voltage. This creates an environment within the chamber where plasma can be generated smoothly.

[0025] In one embodiment, the process may further include supplying a fluid containing polar molecules into the interior of the chamber before the flow mode is formed. This allows strong electrical properties to be imparted to the surface of the dielectric powder, thereby creating an environment in which the dielectric powder can flow smoothly.

[0026] The dielectric powder plasma surface treatment apparatus and method according to the present invention are designed to selectively or alternately control the plasma mode and the flow mode, thereby enabling more uniform and efficient surface modification of the dielectric powder.

[0027] Figure 1 is a schematic diagram showing the plasma surface treatment of a dielectric powder using a plasma generation mode and a flow mode.

[0028] Figure 2 is a diagram showing the technical principle that allows a dielectric powder to flow according to the characteristics of the dielectric powder.

[0029] Figure 3 is a diagram showing the difference in the flow range of dielectric powder according to the frequency of the applied AC voltage.

[0030] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings. As the present invention is susceptible to various modifications and may take various forms, specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to the specific disclosed forms, and it should be understood that the invention includes all modifications, equivalents, and substitutions that fall within the spirit and scope of the invention. Similar reference numerals have been used for similar components in the description of each drawing.

[0031] The terms used in this application are used merely to describe specific embodiments and are not intended to limit the invention. The singular expression includes the plural expression unless the context clearly indicates otherwise. In this application, terms such as "comprising" or "having" are intended to indicate the presence of the features, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, steps, actions, components, parts, or combinations thereof.

[0032] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the present invention pertains. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0033]

[0034] The present invention is a technology based on prior registered patent No. 10-2725876 (hereinafter referred to as the "Prior Invention") devised by the inventor. The Prior Invention is a technology capable of rapidly and precisely sorting powders based on characteristics such as particle size, density, and dielectric constant using an alternating electric field. It overcomes the limitations of existing physical sorting methods and has demonstrated potential for application in various industries. In particular, the approach of controlling the fluidity of powders by adjusting voltage magnitude and frequency has been evaluated as a significant innovation compared to existing technologies.

[0035] During the course of researching prior art, the inventors recognized that a fluid mode utilizing an alternating electric field could be used not only for sorting powders but also for the function of creating a fluid state for vertical mixing of dielectric powders. Accordingly, they conceived that if combined with the existing plasma treatment method for surface modification of dielectric powders, performing plasma treatment in a fluid state would enable more uniform modification than the existing method. In the existing plasma treatment method, since the reaction takes place while the powder is stationary, the surface in direct contact with the plasma undergoes smooth modification, but the powder located inside does not undergo sufficient reaction, resulting in a problem of reduced uniformity of modification. To solve this, the present invention is designed to introduce a fluid mode utilizing an alternating electric field to perform plasma treatment while continuously mixing the powder, thereby ensuring that all particles are modified under the same conditions.

[0036] FIG. 1 is a schematic diagram showing plasma surface treatment of dielectric powder using a plasma generation mode and a flow mode. The plasma generation mode on the left side of FIG. 1 shows that plasma (200) is formed when dielectric powder (210) is placed on a dielectric substrate (100), and the upper layer is first plasma surface treated. The flow mode in the center of FIG. 1 shows that the dielectric powder is flowed upward by an electric field, and flow (220) is performed. The plasma generation mode on the right side of FIG. 1 shows that the dielectric powder (230), which is mixed vertically by the flow mode, is exposed to plasma (200) again in a uniformly mixed state to perform overall surface treatment.

[0037] A dielectric powder plasma surface treatment device according to the present invention has a dielectric substrate (110) disposed inside a chamber and a lower electrode (120) disposed at the bottom of the dielectric substrate. An upper electrode is disposed at the top spaced apart from the lower electrode, and a dielectric powder is disposed on the dielectric substrate. The upper electrode and the lower electrode are electrically connected so as to apply an alternating voltage.

[0038] The core of the present invention is to include a control means capable of selectively or alternately adjusting a plasma generation mode and a flow mode within a chamber to enable uniform plasma surface treatment of dielectric powders. Here, selective adjustment means operating the plasma generation mode and the flow mode so that only one of them is executed independently. On the other hand, alternating adjustment means performing the two modes alternately in a specific order to maximize the process effect. That is, by performing plasma treatment for a certain period of time, activating the flow to mix the unmodified powder, and repeating the plasma treatment, all powders are made uniformly modified.

[0039] The above control means may be an AC voltage control means or an electrode spacing adjustment means, and both means may be applied simultaneously as needed.

[0040] The above AC voltage control means can adjust the strength and frequency of the AC voltage applied to the lower electrode and the upper electrode. Increasing the strength of the AC voltage increases the electric field strength between the electrodes, thereby increasing the plasma density and the fluidity of the powder. Conversely, lowering the strength of the AC voltage decreases the electric field strength between the electrodes, thereby decreasing the plasma density and the fluidity of the powder. Additionally, lowering the frequency of the AC voltage increases the period of change in the upward-downward direction of the dielectric powder, thereby increasing the flow range of the dielectric powder. Conversely, at a long frequency, the flow range of the dielectric powder may decrease.

[0041] The electrode spacing adjustment means can adjust the spaced-apart distance between the lower electrode and the upper electrode. Since the strength of the electric field formed in the space between the electrodes becomes stronger as the distance between the electrodes narrows, the fluidity of the dielectric powder can be controlled by adjusting the distance between the electrodes. Through this, flow conditions can be optimized, and plasma treatment characteristics can be adjusted to suit various process conditions.

[0042] By adjusting the AC voltage and electrode spacing suitable for the plasma generation mode and flow mode through these control means, each mode can be performed under optimal conditions. This enhances the uniformity of the plasma treatment and allows for effective control of the fluidity of the dielectric powder, thereby improving overall treatment efficiency.

[0043] Hereinafter, a method for plasma surface treatment of dielectric powder using a dielectric powder plasma surface treatment apparatus according to the present invention will be described.

[0044] First, dielectric powder is placed on a dielectric substrate of a dielectric powder plasma surface treatment device according to the present invention, and an alternating voltage with conditions capable of generating plasma is applied to the internal space of a chamber between the dielectric substrate and the upper electrode to form a plasma generation mode. Then, an alternating voltage having a strength and frequency sufficient to cause most of the dielectric powder placed on the dielectric substrate to flow upward and enable upper and lower mixing of the dielectric powder is applied to form a flow mode.

[0045] The core of the dielectric powder plasma surface treatment method according to the present invention is to uniformly plasma surface treat most of the dielectric powder disposed on a dielectric substrate by repeatedly performing a flow mode and a plasma generation mode. Through this, the dielectric powder is continuously rearranged so that it receives the influence of the plasma evenly, and the surface of individual particles can be treated under optimal conditions.

[0046] In the above plasma generation mode, in order to generate plasma in the internal space of the chamber, a voltage greater than the breakdown voltage must be applied, taking into account the electrode spacing and the atmospheric conditions inside the chamber. As the electric field becomes stronger, the electrons of the gas molecules gain energy and move, and when a certain critical energy is exceeded, the gas molecules become ionized, generating electrons and positive ions. When this collision ionization occurs repeatedly, it transitions into a plasma state, and a plasma in which the gas is partially ionized can be formed.

[0047] A plasma source gas can be supplied into the chamber of the above-described dielectric powder plasma surface treatment device. Here, the plasma source gas is a gas supplied into the chamber to generate plasma, which is ionized through an electric field to form plasma. It is preferable that the plasma source gas be a gas with a low discharge initiation voltage (100 to 500 V when the discharge gap is 1 mm). When a gas with a low discharge initiation voltage is used as the plasma source gas, sufficient electron-ion collisions can be induced while reducing power consumption, thereby providing suitable conditions for plasma formation.

[0048] For example, the plasma source gas may include one or more substances selected from the group comprising helium (He), neon (Ne), and argon (Ar). These inert gases are chemically stable and have low reactivity, so they can induce strong ion collisions to generate plasma without causing unwanted chemical reactions, making them suitable as source gases for plasma generation.

[0049] In addition, maintaining a low-pressure state inside the chamber may be suitable for plasma generation. Here, "low-pressure state" means a near-vacuum state (about 0.1 to 500 Torr), and when a high voltage is applied in such a low-pressure state, electrons and ions collide in regions where remaining gas molecules exist, causing an ionization process that may be advantageous for forming plasma.

[0050] In the above flow mode, all or most of the dielectric powders may flow upward to the upper electrode and undergo vigorous flow. After the flow process is complete, the dielectric powders undergo vertical mixing, allowing the dielectric powders located in the lower layer on the dielectric substrate to move to the upper layer, thereby facilitating smoother plasma processing.

[0051] A fluid containing polar molecules can be supplied into the chamber of the above-described dielectric powder plasma surface treatment device. A fluid refers to a fluid that provides a medium through which dielectric powder can flow, and it can play a role in enhancing the surface reactivity of the dielectric powder. Polar molecules are molecules that have partial positive and negative electrical charges, and when an external flow voltage is applied, they serve to impart a net charge to the surface of the dielectric powder for powder flow within the electric field. Furthermore, surface modification can occur as these molecules ionize or form active radicals within the plasma, thereby imparting new chemical functional groups to the surface of the dielectric powder. Through this, the hydrophilicity or hydrophobicity of the dielectric powder can be controlled.

[0052] Referring to the left side of Fig. 1, in the plasma generation mode, the dielectric powder in the upper layer among the dielectric powders placed on the dielectric electrode can undergo plasma surface treatment, but the remaining dielectric powders are not effectively treated with plasma surface treatment. To achieve uniform plasma surface treatment, as shown in the center of Fig. 1, the system is made into a flow mode to crush the agglomerated dielectric powders and to allow for upper and lower mixing so that dielectric powders that were not subjected to primary plasma treatment can also undergo plasma surface treatment. As shown in the center of Fig. 1, in the flow mode, the electrode spacing can be set narrower than in the plasma generation mode to ensure smooth flow of the dielectric powders.

[0053] The above flow mode can be performed with plasma generation stopped. When the flow mode is performed with plasma generation stopped, the dielectric powder can move more freely, allowing for smooth flow. Therefore, it is desirable to separate the plasma generation step from the dielectric powder flow process, which enables more effective vertical mixing of the powder and improves the uniformity of the overall surface treatment.

[0054] The intensity and frequency of the alternating voltage applied to the upper and lower electrodes are also important factors affecting the plasma generation mode and flow mode. A detailed explanation of this is provided through Figures 2 and 3.

[0055] Figure 2 illustrates the process by which a dielectric powder placed on a dielectric electrode becomes fluid upon the application of an alternating current voltage. As an alternating current voltage is applied, the powder particles on the dielectric electrode are given polarity and become charged. When the fluid containing polar vapor is present, one or more conductive polar films are formed on the surface of the dielectric powder, causing the powder to have a net charge. The powder particles with a net charge are affected by an electric field and gain an upward force due to the interaction of the electric field within the fluid space. If this upward force is greater than the gravity of the powder particles and the attractive force between the dielectric and the dielectric, the powder particles enter a fluid state in which they move upward.

[0056] The fluidity of powder is influenced by several factors. First, inversely proportional to the weight and size of the powder particles, lighter particles exhibit fluidity more easily. Second, fluidity increases as the voltage increases, proportional to the magnitude of the applied AC voltage. Third, the surface area and shape of the powder particles affect fluidity; particles that are close to spherical have lower fluidity, while non-spherical particles (shapes with a large surface area) have higher fluidity. Fourth, in proportion to the degree of adsorption of polar vapor molecules onto the surface of the powder particles, particles with a high affinity for polar vapors exhibit higher fluidity. Finally, fluidity increases as the fluid contains more polar vapors, inversely proportional to the concentration of polar vapor molecules within the fluid.

[0057] In conclusion, Figure 2 visually explains the principle that dielectric particles have fluidity depending on the interaction between an electric field and a flowing fluid.

[0058] Figure 3 illustrates the process in which the flow range of powder particles on a dielectric electrode changes according to the frequency of the alternating current voltage. When a half-cycle of the alternating current voltage is applied at the high-voltage electrode, the powder particles begin to flow upward. At this time, the upward flow continues as long as the polarity of the voltage is maintained, but when the polarity of the voltage is reversed, the powder particles switch to a downward flow. Therefore, the frequency of the alternating current voltage is closely related to the flow range.

[0059] When the frequency of the AC voltage is high, the voltage polarity changes rapidly, shortening the rise duration of powder particles and consequently reducing the flow range. Conversely, when the frequency of the AC voltage is low, the cycle of voltage polarity change lengthens, extending the rise duration of powder particles and expanding the flow range. By utilizing these characteristics, it becomes possible to control the flow range according to the physical properties (size, density, permittivity, etc.) of the powder based on the difference in flow range.

[0060] In conclusion, Figure 3 illustrates the core principle of a process that can control the flow range of powder through frequency adjustment of the alternating voltage.

[0061] The present invention enables effective uniform surface modification of dielectric powders by providing a system capable of selectively or alternately controlling a plasma generation mode and a flow mode. To overcome the non-uniformity of processing that occurred in conventional plasma treatment methods, a flow mode utilizing an alternating electric field is introduced to allow the powder to be continuously mixed and come into contact with the plasma. This improves process efficiency, enables uniform surface modification, and provides the effect of reducing processing time. Therefore, the present invention is expected to be utilized as a core technology for high-quality surface treatment of dielectric powders in semiconductors, electronic materials, coatings, and various other industrial fields.

[0062] Although the present invention has been described above with reference to preferred embodiments, those skilled in the art will understand that various modifications and changes can be made to the invention without departing from the spirit and scope of the invention as set forth in the following claims.

[0063] [Explanation of the symbol]

[0064] 100 Dielectric Powder Plasma Surface Treatment Device

[0065] 110 Dielectric Substrate

[0066] 120 lower electrode

[0067] 130 upper electrode

[0068] 200 Plasma

[0069] 210 Dielectric powder layer disposed on a dielectric substrate immediately prior to the flow mode

[0070] 211 Region of the dielectric powder layer where plasma surface treatment is performed

[0071] 220 Flowing Dielectric Powder

[0072] Dielectric powder with upper and lower mixing achieved by 230 flow mode

Claims

1. An upright chamber having a dielectric substrate disposed on its inner bottom surface; A lower electrode formed at the bottom of the above dielectric substrate; An upper electrode located inside the chamber spaced apart from the bottom surface of the chamber at a certain distance; and Power supply means for electrically connecting the lower electrode and the upper electrode to apply an alternating current voltage; and A control means comprising a plasma generation mode for generating plasma in the internal chamber space between the dielectric substrate and the upper electrode and a flow mode for flowing dielectric powder, wherein the plasma generation mode and the flow mode for flowing dielectric powder are selectively or alternately performed. Dielectric powder plasma surface treatment device.

2. In Paragraph 1, The above dielectric powder plasma surface treatment device further includes a plasma source gas supply unit that supplies plasma source gas into the chamber. Dielectric powder plasma surface treatment device.

3. In Paragraph 2, The above plasma source gas comprises one or more materials selected from the group including helium (He), neon (Ne), and argon (Ar). Dielectric powder plasma surface treatment device.

4. In Paragraph 1, A fluid supply unit further comprising a fluid supply unit for supplying a fluid containing polar molecules into the interior of the chamber. Dielectric powder plasma surface treatment device.

5. In Paragraph 1, The above control means includes an AC voltage control means capable of adjusting the intensity and frequency of the AC voltage applied to the lower electrode and the upper electrode. Dielectric powder plasma surface treatment device.

6. In Paragraph 1, The above control means includes an electrode spacing adjustment means capable of adjusting the spaced-apart distance between the lower electrode and the upper electrode. Dielectric powder plasma surface treatment device.

7. A method for plasma surface treating a dielectric powder using a dielectric powder plasma treatment apparatus according to any one of claims 1 to 6, wherein A dielectric powder is placed on the above dielectric substrate; It includes applying an alternating voltage having a strength and frequency sufficient to enable a plasma generation mode that generates plasma in the internal chamber space between the dielectric substrate and the upper electrode; A method comprising applying an alternating voltage having a strength and frequency sufficient to enable a flow mode in which dielectric powders disposed on the dielectric substrate flow upward and the dielectric powders are mixed vertically. Dielectric powder plasma surface treatment method.

8. In Paragraph 7, The above flow mode is characterized by being performed in a state where plasma generation is interrupted. Dielectric powder plasma surface treatment method.

9. In Paragraph 7, Repeating the above plasma generation mode and the above flow mode, Dielectric powder plasma surface treatment method.

10. In Paragraph 7, A process further comprising supplying a plasma source gas into the interior of the chamber before the above plasma generation mode is performed. Dielectric powder plasma surface treatment method.

11. In Paragraph 7, A process further comprising supplying a fluid containing polar molecules into the interior of the chamber before the above flow mode is performed. Dielectric powder plasma surface treatment method.

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