Sensor module

WO238925SActive Publication Date: 2025-05-23NIHON DEMPA KOGYO CO LTD
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Patent Information

Application Number
WO238925
Authority / Receiving Office
WO · WO
Patent Type
Designs
Current Assignee / Owner
Priority Date
2023-11-22
Filing Date
2024-05-17
Publication Date
2025-05-23
Estimated Expiration
2049-05-17

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Abstract

This article is a sensor module; this sensor module has a sensor body with a circular flange formed thereon and a cylindrical portion; the amount of deposit that enters the cylindrical part through the opening of the cylindrical part and adheres to the sensor element inside is detected; this sensor module is used, for example, by being attached to a film forming chamber of a semiconductor manufacturing apparatus; the periphery of the opening is formed into a concave shape; a part of the sensor body is provided with a connection section for outputting a signal; the left side view is omitted because it is the mirror view of the right-side view; Fig. 1.8 is a cross-sectional view taken along the A-A’ line shown in Fig. 1.3.
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