Handling Using Diffraction/Refraction/Reflection TRIZ Cases
- EUV Reticle Absorber Deposition for Lower Mask 3D Effects
Selective electroless metal deposition forms thinner EUV reticle absorbers with smooth sidewalls, reducing shadowing and mirror damage.
- Stress Patterned Thin Substrates for Wafer Warpage Correction
Micro-lithographic stress patterning reshapes thin substrates to correct wafer warpage, astigmatism, and trefoil distortion.
- Synchrotron Monochromator Positioning With Reaction-Mass Feedback
A reaction-mass and spring-mounted feedback stage improves crystal parallelism and nanometric stability in synchrotron beamline flyscans.