Floodlight semiconductor lighting wick structure and lamp

Abstract

The present invention relates to a floodlight type semiconductor lighting wick structure and a lamp. The lamp comprises a floodlight type semiconductor lighting wick structure and a lampshade. The floodlight type semiconductor lighting wick structure comprises a heat sink, a light emitting component, a light shading component and a light emitting component. The light emitting component, the light emitting component, the heat sink and the light shading component are integrated into a module with a simple structure. The parts of the module cooperate with each other to achieve miniaturization of the module. The heat of the light emitting component is dissipated through the heat sink. Good heat dissipation can ensure the miniaturization design of the light emitting component. At the same time, the light shading component shields the light emitting component to avoid glare. The light emitted by the light emitting component enters the cavity and is emitted through the light emitting component, which reduces the light emitting surface, increases the light density, and has a good light type, thereby facilitating more reasonable light distribution. At the same time, the adaptability of the module application end is improved, allowing for a wider application. In the production and manufacturing process of the lamp, the modularization degree of the lamp manufacturing is improved, thereby improving the efficiency of the lamp production and assembly.

Description

Technical Field

[0001] The invention relates to the technical field of lighting, and in particular to a floodlight type semiconductor lighting lamp wick structure and a lamp. Background Art

[0002] Lighting equipment has been widely used in various fields, but the current lighting equipment is not highly modularized and has many components. Too many components connected lead to poor heat dissipation performance of the light source, which makes it difficult to distribute light patterns. In addition, due to the large size of the components of lighting equipment, it is difficult for lighting equipment to be miniaturized, which in turn affects the adaptability of lighting equipment. Summary of the invention

[0003] Based on this, it is necessary to provide a floodlight semiconductor lighting wick structure and lamp that can effectively improve the heat dissipation performance and adaptability of lighting equipment in order to address the above problems.

[0004] A floodlight semiconductor lighting wick structure, comprising:

[0005] Heat sink;

[0006] A light emitting component, wherein the light emitting component is disposed on the heat sink;

[0007] A light emitting member, wherein the light emitting member has a cavity, and one end of the light emitting member is an open end connected to the cavity, and the open end is covered on the light emitting component; and

[0008] A shading member is provided with a fixing hole, the shading member is connected to the heat sink, the light emitting member passes through the shading member through the fixing hole, and the light emitting component, the light emitting member, the heat sink and the shading member are integrated into a module.

[0009] The above-mentioned floodlight-type semiconductor lighting wick structure integrates the light-emitting component, the light-emitting part, the heat sink and the shading part into a single module, and has a simple structure. The parts of the module cooperate with each other to realize the miniaturization of the module. The heat of the light-emitting component is effectively dissipated through the heat sink. The good heat dissipation performance can ensure the miniaturization design of the light-emitting component. At the same time, the shading part blocks the light-emitting component to avoid glare. The light emitted by the light-emitting component enters the cavity and is emitted through the light-emitting part, which reduces the light-emitting surface, thereby improving the light utilization rate, the light density, and the light output type, thereby facilitating more reasonable light distribution. The above-mentioned floodlight-type semiconductor lighting wick structure improves the adaptability of the module application end, allowing for a wider application. In the production and manufacturing process of lamps, the modularization of lamp manufacturing is improved, thereby improving the efficiency of lamp production and assembly. The lamp formed by the floodlight-type semiconductor lighting wick structure can make the brightness of a specific lighting area or a specific visual target much higher than other targets and surrounding areas.

[0010] In one embodiment, the light emitting component is welded or eutectic bonded to the heat sink.

[0011] In one embodiment, the light emitting element is columnar; and a diffusion structure is provided on the inner wall of the cavity.

[0012] In one embodiment, a boss is provided on the outer wall of the opening end of the light emitting member, and the light shielding member is pressed against the boss; or

[0013] An external thread is arranged on the outer wall of the opening end of the light emitting member, an internal thread is arranged on the inner wall of the fixing hole, and the light emitting member and the light shielding member are connected by the external thread and the internal thread.

[0014] In one of the embodiments, the light-emitting component includes a ceramic substrate and a plurality of LED lamps, the LED lamps are fixed on the ceramic substrate, the heat sink is a ceramic heat sink, and the ceramic substrate is connected to the ceramic heat sink.

[0015] In one embodiment, the ceramic substrate is arranged flat on the ceramic heat sink; or

[0016] The ceramic substrate is vertically arranged on the ceramic heat sink.

[0017] In one of the embodiments, an expansion cavity is provided on the heat sink, and the expansion cavity is used to accommodate an expanded heat dissipation structure.

[0018] In one of the embodiments, the expansion cavity is opened on the end surface of the heat dissipation element facing the shading element, and the shading element can cover the expansion cavity.

[0019] In one of the embodiments, a threading hole is formed on the end surface of the heat sink away from the light emitting component, and the threading hole penetrates to the end surface of the heat sink facing the shading element.

[0020] A lamp, comprising:

[0021] The floodlight type semiconductor lighting lamp wick structure as described above; and

[0022] A lampshade having a receiving cavity, the lampshade is connected to the light shielding member, and the light emitting member is located in the receiving cavity.

[0023] The above-mentioned lamp integrates the light-emitting component, the light-emitting part, the heat sink and the shading part into a single floodlight-type semiconductor lighting wick structure module, which has a simple structure. The parts of the module cooperate with each other to realize the miniaturization of the module. The heat of the light-emitting component is effectively dissipated through the heat sink. The good heat dissipation performance can ensure the miniaturization design of the light-emitting component. At the same time, the shading part blocks the light-emitting component to avoid glare. The light emitted by the light-emitting component enters the cavity and is emitted through the light-emitting part, which reduces the light-emitting surface, thereby improving the light utilization rate, the light density, and the light output type, thereby facilitating more reasonable light distribution. The above-mentioned floodlight-type semiconductor lighting wick structure improves the adaptability of the module application end, allowing for a wider application. In the production and manufacturing process of the lamp, the modularization degree of the lamp manufacturing is improved, thereby improving the efficiency of the lamp production and assembly. The lamp formed by the floodlight-type semiconductor lighting wick structure can make the brightness of a specific lighting area or a specific visual target much higher than other targets and surrounding areas. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 is a structural schematic diagram of a floodlight-type semiconductor lighting lamp core structure in an embodiment;

[0025] Figure 2 for Figure 1 An exploded schematic diagram of a floodlight-type semiconductor lighting lamp wick structure is shown;

[0026] Figure 3 for Figure 2 A cross-sectional view of a heat sink;

[0027] Figure 4 is an exploded schematic diagram of a floodlight-type semiconductor lighting lamp core structure in another embodiment;

[0028] Figure 5 is a schematic structural diagram of a light shielding member in an embodiment;

[0029] Figure 6 It is a schematic diagram of an exploded view of a connecting member in one embodiment.

[0030] Description of reference numerals:

[0031] 10. Floodlight type semiconductor lighting wick structure, 100. heat sink, 110. second connection hole, 120. extension cavity, 130. heat dissipation fin, 140. threading hole, 150. accommodating cavity, 160. fixing groove, 170. bump, 200. light emitting component, 210. ceramic substrate, 220. LED lamp, 300. shading member, 310. fixing hole, 320. first connection hole, 330. mounting groove, 340. card slot, 400. light emitting member, 410. cavity, 420. opening end, 430. boss, 500. connector, 510. mounting hole, 520. hook, 530. first connection part, 531. first semicircular groove, 532. card platform, 533. first connection rib, 540. second connection part, 541. second semicircular groove, 542. hook body, 543. second connection rib. DETAILED DESCRIPTION

[0032] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited by the specific implementation disclosed below.

[0033] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only embodiment.

[0034] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those generally understood by those skilled in the art to which the present invention belongs. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The various technical features of the above-described embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-described embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0035] See also Figure 1 and Figure 2The floodlight semiconductor lighting lamp core structure 10 in one embodiment can effectively improve the modularization degree of lamp manufacturing and improve the production and assembly efficiency of lamps. Specifically, the floodlight semiconductor lighting lamp core structure 10 includes a heat sink 100, a light emitting component 200, a light shielding component 300 and a light emitting component 400.

[0036] The light-emitting component 200 is arranged on the heat sink 100, the light-emitting component 400 has a cavity 410, and one end of the light-emitting component 400 is an open end 420 connected to the cavity 410, the open end 420 is covered on the light-emitting component 200, a fixing hole 310 is opened on the shading component 300, the shading component 300 is connected to the heat sink 100, and the light-emitting component 400 passes through the shading component 300 through the fixing hole 310, and the heat sink 100, the light-emitting component 200, the shading component 300 and the light-emitting component 400 are integrated into a module.

[0037] The above-mentioned floodlight-type semiconductor lighting wick structure 10 integrates the heat sink 100, the light-emitting component 200, the shading component 300 and the light-emitting component 400 into a single module, and has a simple structure. The parts of the module cooperate with each other to achieve the miniaturization of the module. The heat of the light-emitting component 200 is effectively dissipated through the heat sink 100. The good heat dissipation performance can ensure the miniaturization design of the light-emitting component 200. At the same time, the shading component 300 blocks the light-emitting component 200 to avoid glare. The light emitted by the light-emitting component 200 enters the cavity 410 and is emitted through the light-emitting component 400, which reduces the light-emitting surface, thereby improving the light utilization rate, improving the light density, and having a good light output type, thereby facilitating more reasonable light distribution. The above-mentioned floodlight-type semiconductor lighting wick structure 10 improves the adaptability of the module application end, allowing for a wider range of applications. In the production and manufacturing process of lamps, the modularization of lamp manufacturing is improved, thereby improving the efficiency of lamp production and assembly. The lamp formed by the floodlight type semiconductor lighting wick structure 10 can make the brightness of a specific lighting area or a specific visual target much higher than other targets and surrounding areas.

[0038] In one embodiment, a boss 430 is provided on the outer wall of the open end 420 of the light emitting member 400, and the light shielding member 300 is pressed against the boss 430. By providing the boss 430 at the open end 420 of the light emitting member 400, the light shielding member 300 can be installed on the heat sink 100 so that the boss 430 is pressed against the heat sink 100, so that the installation of the light emitting member 400 and the heat sink 100 is more stable, and the connection between the light emitting member 400 and the heat sink 100 is more convenient.

[0039] Specifically, the boss 430 is integrally formed on the outer wall of the open end 420 of the light emitting member 400. By integrally forming the boss 430 on the outer wall of the light emitting member 400, the processing technology of the light emitting member 400 is further simplified, and the cost of the light emitting member 400 is reduced.

[0040] Furthermore, the light emitting member 400 may be a plastic member. Of course, the light emitting member 400 may also be a glass member, as long as it can cover the light emitting component 200 so that the light emitting component 200 emits light through the light emitting member 400.

[0041] In another embodiment, an external thread is provided on the outer wall of the open end 420 of the light emitting member 400, and an internal thread is provided on the inner wall of the fixing hole 310, and the light emitting member 400 and the light shielding member 300 are connected by the external thread and the internal thread. The light emitting member 400 is connected to the fixing hole 310 of the light shielding member 300 by threading, and the light shielding member 300 is installed on the heat sink 100, so that the light emitting member 400 can be installed on the heat sink 100, which facilitates the disassembly and assembly of the light emitting member 400 and the light shielding member 300.

[0042] Of course, in other embodiments, the light emitting member 400 may also be directly glued into the fixing hole 310 of the shading member 300 , or directly connected to the heat sink 100 , as long as the light emitting component 200 can be located in the cavity 410 and emit light through the light emitting member 400 .

[0043] In one embodiment, the light emitting member 400 is a columnar structure, and a diffusion structure is provided on the inner wall of the cavity 410. The light emitting member 400 can transform the point light source or surface light source of the light emitting component 200 into a three-dimensional light source that emits light in a columnar shape, so as to achieve a 360° all-around light emitting effect, effectively solving the problem of the light emitting angle limitation of the light source of the light emitting component 200. The diffusion structure is also beneficial to the light type of the light emitting component 200 through the light emitting member 400, and thus is beneficial to the light distribution. Specifically, the diffusion structure can be a layered structure coated on the inner wall of the cavity 410, or it can be other structures that can achieve a diffusion effect.

[0044] In one embodiment, the shading member 300 is provided with a first connection hole 320, and the heat sink 100 is provided with a second connection hole 110, and the second connection hole 110 is correspondingly connected to the first connection hole 320. The shading member 300 is fixed to the heat sink 100 by connecting screws penetrating the first connection hole 320 and the second connection hole 110. The above connection method facilitates the detachment of the shading member 300 relative to the heat sink 100.

[0045] Of course, in other embodiments, the shading member 300 may also be directly glued to the heat sink 100 , or fixed to the heat sink 100 by other means, as long as the light output member 400 can be installed on the heat sink 100 through the shading member 300 .

[0046] In this embodiment, the shading member 300 is a plastic member. Since the light emitting member 400 is installed on the heat sink 100 through the shading member 300, the shading member 300 is made of plastic, which prevents the shading member 300 from being too hard and damaging the light emitting member 400 or the light emitting component 200 during installation.

[0047] Of course, in other embodiments, the shading member 300 may also be a metal member, as long as the light output member 400 can be installed on the heat sink 100 through the shading member 300 .

[0048] Please also read Figure 3 Optionally, an expansion cavity 120 is provided on the heat sink 100, and the expansion cavity 120 is used to accommodate an extended heat dissipation structure. Since the light-emitting component 200 is the main heating element, the heat of the light-emitting component 200 can be dissipated through the heat sink 100. Due to the limitation of existing materials or cost considerations, the heat dissipation performance of the heat sink 100 will be subject to certain limitations. By providing the expansion cavity 120, it is convenient to accommodate a heat dissipation structure with better heat dissipation performance, thereby further improving the heat dissipation performance of the heat sink 100.

[0049] Specifically, the extended cavity 120 is provided on the surface of the heat sink 100 facing the shading member 300, and the shading member 300 can cover the extended cavity 120. Since the shading member 300 can cover the extended cavity 120, when the extended heat dissipation structure is disposed in the extended cavity 120, the extended cavity 120 is covered by the shading member 300, so that the extended heat dissipation structure is effectively fixed in the extended cavity 120, avoiding the need to add other shading members 300 to fix the extended heat dissipation structure.

[0050] Furthermore, the heat sink 100 has a plurality of expansion cavities 120, and the plurality of expansion cavities 120 are arranged at intervals, thereby being able to simultaneously accommodate a plurality of expanded heat sink 100 structures.

[0051] Of course, in other embodiments, the heat sink 100 may not have the expansion cavity 120 , and the heat sink 100 itself is used to dissipate heat for the light emitting component 200 .

[0052] In one embodiment, a plurality of heat dissipation fins 130 are formed on the outer wall of the heat dissipation element 100. The heat dissipation fins 130 can further increase the heat dissipation performance of the heat dissipation element 100, thereby further conducting away the heat of the light emitting component 200. Specifically, the heat dissipation fins 130 can be arranged at intervals along the circumferential direction of the heat dissipation element 100, and of course, can also be arranged at intervals along the axial direction of the heat dissipation element 100.

[0053] In one embodiment, a threading hole 140 is provided on the end surface of the heat sink 100 away from the light emitting component 200, and the threading hole 140 penetrates to the end surface of the heat sink 100 facing the light shielding member 300. The threading hole 140 can facilitate the connection between the light emitting component 200 and the power supply. Specifically, there are two threading holes 140, which are respectively provided on opposite sides of the light emitting component 200, further facilitating the wires of the light emitting component 200 to pass through the threading holes 140 to connect to the power supply. Of course, in other embodiments, the threading hole 140 can also be one or more, as long as it is convenient for the wires of the light emitting component 200 to pass through the threading holes 140.

[0054] In one embodiment, a receiving cavity 150 is provided on the surface of the heat sink 100 away from the light emitting component 200, and the receiving cavity 150 is used to accommodate components such as a power supply, etc. The threading hole 140 is connected to the receiving cavity 150, so that the light emitting component 200 can be connected to components such as a power supply.

[0055] In one embodiment, a fixing groove 160 is provided on the heat sink 100, and the light emitting component 200 is embedded in the fixing groove 160. By providing the fixing groove 160, it is convenient for the light emitting component 200 to be embedded in the heat sink 100, and then it is convenient for the light emitting component 200 to be connected to the heat sink 100. Specifically, the fixing groove 160 is provided on the side of the heat sink 100 facing the light shielding member 300. When the light shielding member 300 is installed on the heat sink 100, the fixing groove 160 can correspond to the fixing hole 310, and then the light emitting component 200 can be effectively located in the light emitting member 400.

[0056] In one embodiment, the light emitting component 200 is welded or eutectic on the heat sink 100. Specifically, the light emitting component 200 is welded or eutectic in the fixing groove 160. By welding or eutecticating the light emitting component 200 to the heat sink 100, the thermal resistance between the light emitting component 200 and the heat sink 100 can be reduced, ensuring that the heat of the light emitting component 200 is smoothly conducted to the heat sink 100.

[0057] In one embodiment, the light emitting component 200 is soldered to the heat sink 100. Of course, in other embodiments, the light emitting component 200 can also be disposed on the heat sink 100 in other ways, as long as the heat of the light emitting component 200 can be effectively transferred to the heat sink 100.

[0058] Specifically, the light emitting assembly 200 includes a ceramic substrate 210 and a plurality of LED lamps 220, wherein the plurality of LED lamps 220 are fixed to the ceramic substrate 210, the heat sink 100 is a ceramic heat sink, and the ceramic substrate 210 is connected to the ceramic heat sink. The connection between the ceramic substrate 210 and the ceramic heat sink can further improve the heat dissipation effect of the LED lamps 220.

[0059] Furthermore, the LED lamp 220 is directly formed on the ceramic substrate 210 through a circuit process to meet the needs of manufacturing a light-emitting component 200 with a smaller light-emitting surface or a point light source. This can effectively increase the light intensity, improve the light utilization rate, and reduce the difficulty of light distribution. At the same time, the ceramic substrate 210 has a good heat dissipation effect, and can effectively transfer the heat of the LED lamp 220 to the heat sink 100.

[0060] In the traditional process, the SMT (Surface Mount Technology) process forms the light-emitting component, and then the light-emitting component is connected to the heat sink by bonding or mechanical fastening. The probability of failure of the heat dissipation connection is high, so the light source power of a single light-emitting point is limited, which in turn leads to an increase in the number of single light-emitting point light sources, large external dimensions, increased processing costs, or low luminous intensity and low light utilization. The floodlight-type semiconductor lighting wick structure 10 can effectively reduce thermal resistance by welding or eutecticizing the light-emitting component 200 to the heat sink 100, and at the same time, the LED lamp 220 is directly formed on the ceramic substrate 210 through a circuit process, further reducing the size of the light-emitting component 200, and thus effectively reducing the overall size of the floodlight-type semiconductor lighting wick structure 10 to meet the application of lamps in more scenarios.

[0061] In this embodiment, the light emitting component 200 is further located in the fixing hole 310 of the shading member 300. The fixing hole 310 can provide a certain shading effect on the light emitting component 200, reduce the adverse factors of glare, and prevent the human eye from directly looking at the light emitting component 200, thereby protecting the eyes.

[0062] Specifically, the ceramic substrate 210 of the light emitting component 200 is disposed flat on the heat sink 100. Furthermore, the ceramic substrate 210 of the light emitting component 200 is disposed flat in the fixing groove 160, so that the light shielding member 300 can effectively shield the LED lamp 220 to avoid the generation of glare, and effectively enhance the efficiency of heat transfer from the ceramic substrate 210 to the heat sink 100.

[0063] Furthermore, the size of the fixing groove 160 matches the size of the surface of the ceramic substrate 210 , so that the ceramic substrate can be effectively disposed in the fixing groove 160 .

[0064] See also Figure 4 In another embodiment of the light-concentrating semiconductor lighting lamp core structure 10, the light-emitting component 200 includes a ceramic substrate 210 and a plurality of LED lamps 220, and the plurality of LED lamps 220 are disposed on the ceramic substrate 210. The ceramic substrate 210 is disposed on the heat sink 100, so that the light-emitting component 200 is located in the cavity 410 of the light-emitting component 400, and a 360° full-circle light-emitting effect is formed.

[0065] Of course, in other embodiments, the light emitting component 200 may also be disposed on the heat sink 100 in other postures, as long as the light emitting component 200 is located inside the light emitting component 400 .

[0066] Furthermore, the size of the fixing groove 160 matches the size of the cross section of the ceramic substrate 210 , so that the ceramic substrate 210 can be inserted into the fixing groove 160 .

[0067] In one embodiment, a protrusion 170 is formed on the surface of the heat sink 100 facing the light emitting component 200, and the fixing groove 160 is formed on the protrusion 170. The protrusion 170 can effectively increase the depth of the fixing groove 160, thereby making the ceramic substrate 210 more stably arranged in the fixing groove 160, and effectively increase the contact area between the ceramic substrate 210 and the heat sink 100, thereby improving the heat dissipation efficiency.

[0068] In another embodiment of the heat sink 100 , the protrusion may also be formed on the surface of the heat sink 100 facing away from the light emitting assembly 200 . The fixing groove 160 is formed on the surface of the heat sink 100 and further formed on the protrusion to increase the depth of the fixing groove 160 .

[0069] Of course, in other embodiments, the light emitting component 200 may also be disposed on the heat sink 100 in other postures, as long as the light emitting component 200 is located inside the light emitting component 400 .

[0070] The floodlight semiconductor lighting lamp core structure 10 can be applied to a lamp. In one embodiment, the lamp comprises the floodlight semiconductor lighting lamp core structure 10 and a lampshade. The lampshade has a receiving cavity, the lampshade is connected to the light shielding member 300, and the light emitting member 400 is located in the receiving cavity. The lampshade is arranged outside the light emitting member 400 to form a lamp, wherein the lampshade can be arranged according to different usage scenarios.

[0071] The above-mentioned floodlight semiconductor lighting lamp wick structure 10 effectively optimizes the original lamp installation components into two parts, namely the floodlight semiconductor lighting lamp wick structure 10 and the lampshade, so that the structure of the lamp is simple and clear, and the modularity of the lamp is effectively improved, so that the lamp is easy to achieve large-scale production and manufacturing. At the same time, the production and assembly efficiency and yield rate of the lamp are improved. At the same time, the floodlight semiconductor lighting lamp wick structure 10 has good heat dissipation performance, strong adaptability, and small size, which makes the floodlight semiconductor lighting lamp wick structure 10 more adaptable, thereby effectively increasing the design space of the lamp.

[0072] In one embodiment, a mounting groove 330 is provided on the surface of the shading member 300 facing the light emitting assembly 200, and the lampshade can be fixed in the mounting groove 330 to form a lamp. Specifically, the lampshade can be directly bonded in the mounting groove 330. Alternatively, the inner wall of the mounting groove 330 is provided with an internal thread, and the outer wall of the lampshade is provided with an external thread, and the lampshade is fixed to the shading member 300 through the thread.

[0073] Please also read Figure 5 and Figure 6 In another embodiment, the lamp further comprises a connecting member 500, and a mounting groove 330 is further provided on the shading member 300, and the lampshade is installed in the mounting groove 330 through the connecting member 500. The connection member 500 is provided to further facilitate fixing the lampshade on the shading member 300.

[0074] Specifically, one end of the lampshade is a fixed end, a mounting plate is formed on the outer wall of the fixed end, a mounting hole 510 is formed on the connector 500, the fixed end is passed through the mounting hole 510, and the connector 500 can press the mounting plate into the mounting groove 330. Through the mounting plate of the lampshade, the connector 500 can effectively fix the lampshade on the shade 300, making the connection between the lampshade and the shade 300 more convenient.

[0075] Furthermore, the size of the mounting hole 510 matches the size of the fixing end, so that the lampshade can be more stably arranged in the mounting hole 510 to prevent the lampshade from moving relative to the shading member 300 .

[0076] Optionally, a slot 340 is provided on the inner wall of the mounting groove 330, and a hook 520 is provided on the side of the connector 500 facing the shade member 300, and the hook 520 can be locked in the slot 340. When the hook 520 of the connector 500 is locked in the slot 340, the mounting plate of the lampshade is pressed into the mounting groove 330 at the same time, further facilitating the installation of the lampshade and the shade member 300.

[0077] Optionally, the connecting member 500 includes a first connecting portion 530 and a second connecting portion 540, and the first connecting portion 530 and the second connecting portion 540 are semicircular structures. A first semicircular groove 531 is provided on the first connecting portion 530, and a second semicircular groove 541 is provided on the second connecting portion 540. The first connecting portion 530 and the second connecting portion 540 are arranged opposite to each other, so that the first semicircular groove 531 and the second semicircular groove 541 together form a mounting hole 510. The first connecting portion 530 and the second connecting portion 540 can facilitate the fixing end of the lampshade to be inserted into the mounting hole 510.

[0078] Specifically, a clamping platform 532 is formed on the first connection part 530, and a hook body 542 is formed on the second connection part 540. The hook body 542 can be correspondingly hooked on the clamping platform 532, so that the first connection part 530 and the second connection part 540 can be relatively connected. Further, clamping platforms 532 are formed on both opposite ends of the first connection part 530, and hook bodies 542 corresponding to the clamping platforms 532 are formed on both opposite ends of the second connection part 540. The hook bodies 542 are correspondingly hooked on the clamping platform 532, so that the first connection part 530 and the second connection part 540 can be more stably connected.

[0079] In one embodiment, a first connecting rib 533 is formed on the surface of the first connecting portion 530 facing the shade member 300. The first connecting rib 533 can not only strengthen the structural strength of the first connecting portion 530, but also effectively press the mounting plate of the lampshade into the mounting groove 330.

[0080] In one embodiment, a second connecting rib 543 is formed on the surface of the second connecting portion 540 facing the shade member 300. The second connecting rib 543 can not only strengthen the structural strength of the second connecting portion 540, but also effectively press the mounting plate of the lampshade into the mounting groove 330.

[0081] The first connection portion 530 and the second connection portion 540 are both formed with hooks 520 on their surfaces facing the shading member 300 , and the hooks 520 correspond to the slots 340 on the shading member 300 , so that the first connection portion 530 and the second connection portion 540 can be effectively connected to the shading member 300 .

[0082] In one embodiment, there are multiple hooks 520, and the multiple hooks 520 are arranged at intervals. The number of slots 340 corresponds to the number of hooks 520. Each hook 520 can be correspondingly inserted into a slot 340, thereby effectively improving the stability of the installation of the connecting member 500 on the shading member 300.

[0083] In this embodiment, three hooks 520 are formed on the first connection portion 530 and three hooks 520 are formed on the second connection portion 540, so that both the first connection portion 530 and the second connection portion 540 can be stably arranged in the mounting groove 330. Of course, in other embodiments, the number of hooks 520 on the first connection portion 530 can also be two, four, or other numbers, as long as the first connection portion 530 can be stably arranged on the shading member 300. The number of hooks 520 on the second connection portion 540 can also be two, four, or other numbers, as long as the second connection portion 540 can be stably arranged on the shading member 300.

[0084] In one embodiment, the lamp further includes a lamp holder, which is disposed at an end of the heat sink 100 facing away from the lampshade. The light-emitting component 200 can be electrically connected to the lamp holder through the heat sink 100. The light-emitting component 200 can be powered by the lamp holder. Of course, in other embodiments, the lamp holder can be omitted, and the light-emitting component 200 can be directly connected to a power source.

[0085] The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims.

Claims

1. A lamp, characterized in that: include: A floodlight semiconductor lighting wick structure, comprising: A heat sink, wherein an expansion cavity is formed on the heat sink, and the expansion cavity is used to accommodate an expanded heat dissipation structure; A light emitting component, wherein the light emitting component is disposed on the heat sink; A light emitting member, wherein the light emitting member has a cavity, and one end of the light emitting member is an open end connected to the cavity, the open end is covered on the light emitting component, and the light emitting member is columnar; a diffusion structure is provided on the inner wall of the cavity; A shading member, wherein a fixing hole is formed on the shading member, the shading member is connected to the heat sink, the light emitting member passes through the shading member through the fixing hole, and the light emitting component, the light emitting member, the heat sink and the shading member are integrated into a module; The lamp further comprises a lampshade and a connecting piece, wherein the lampshade has a receiving cavity, the light emitting piece is located in the receiving cavity, the light shielding piece is further provided with a mounting groove, and the lampshade is mounted in the mounting groove through the connecting piece; One end of the lampshade is a fixed end, a mounting plate is formed on the outer wall of the fixed end, a mounting hole is formed on the connecting member, the fixed end is passed through the mounting hole, the connecting member presses the mounting plate into the mounting groove, and the connecting member fixes the lampshade on the shading member through the mounting plate of the lampshade; A card slot is provided on the inner wall of the mounting groove, and a card hook is provided on the side of the connecting member facing the shading member, and the card hook can be clamped in the card slot to press the mounting plate of the lampshade into the mounting groove; the connecting member includes a first connecting part and a second connecting part, the first connecting part and the second connecting part are semicircular structures, a first semicircular groove is provided on the first connecting part, and a second semicircular groove is provided on the second connecting part, the first connecting part and the second connecting part are arranged opposite to each other so that the first semicircular groove and the second semicircular groove together form a mounting hole; a clamping platform is formed on the first connecting part, and a hook body is formed on the second connecting part, and the hook body can be correspondingly hooked on the clamping platform so that the first connecting part and the second connecting part are relatively connected.

2. The lamp according to claim 1, characterized in that: The light emitting component is welded or eutecticized on the heat sink.

3. The lamp according to claim 1 or 2, characterized in that: A boss is provided on the outer wall of the opening end of the light emitting member, and the light shielding member is pressed against the boss.

4. The lamp according to claim 1 or 2, characterized in that: An external thread is arranged on the outer wall of the opening end of the light emitting member, an internal thread is arranged on the inner wall of the fixing hole, and the light emitting member and the light shielding member are connected by the external thread and the internal thread.

5. The lamp according to claim 1 or 2, characterized in that: The light-emitting component comprises a ceramic substrate and a plurality of LED lamps, wherein the LED lamps are fixed on the ceramic substrate, the heat sink is a ceramic heat sink, and the ceramic substrate is connected to the ceramic heat sink.

6. The lamp according to claim 5, characterized in that: The ceramic substrate is arranged flat on the ceramic heat sink.

7. The lamp according to claim 5, characterized in that: The ceramic substrate is vertically arranged on the ceramic heat sink.

8. The lamp according to claim 1, characterized in that: The expansion cavity is opened on the end surface of the heat sink facing the light shielding member, and the light shielding member can cover the expansion cavity.

9. The lamp according to claim 1 or 2, characterized in that: A threading hole is formed on the end surface of the heat sink away from the light emitting component, and the threading hole penetrates to the end surface of the heat sink facing the light shielding component.

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