Water-cooled semiconductor temperature control system and method

Abstract

The present application relates to a water-cooled semiconductor temperature control system, which includes: a control end, including a thermoelectric semiconductor, a water pipe component and a water pump, the water pipe component is connected to the thermoelectric semiconductor, and the water pump is arranged on the water pipe component; a working end, including a temperature control product and a flexible energy exchange pipe network, the flexible energy exchange pipe network is in contact with and fits with the temperature control product, the flexible energy exchange pipe network is connected to the water pipe component of the control end, the flexible energy exchange pipe network and the water pipe component constitute a water circulation loop, and a liquid is arranged in the water circulation loop; wherein the flexible energy exchange pipe network includes: an outer water pipe, in an annular structure; an inner water pipe, in a mesh array structure, connected to the inner ring of the annular structure of the outer water pipe, and connected to the outer water pipe; a water inlet, located on the outer water pipe or the inner water pipe, and connected to the water pipe component of the control end; a water outlet, located on the outer water pipe or the inner water pipe, and connected to the water pipe component of the control end. Its advantages are: providing more uniform and comfortable temperature control.

Description

Technical Field

[0001] The present application relates to the field of semiconductor temperature control technology, and in particular to a water-cooled semiconductor temperature control system and method. Background Art

[0002] With the development of thermoelectric system technology, coupled with the rise of smart homes, electronic products and Internet of Things technology, people's acceptance of intelligent devices that combine thermoelectric cooling or thermoelectric heating functions is also increasing. As a result, people have also put forward more functional requirements for these intelligent daily items. With the continuous development of electronic devices and the pursuit of high-quality life, thermoelectric cooling has been increasingly widely used in various fields of production and life with its advantages of small size, light weight, accurate temperature control and rapid cooling. Such as thermoelectric refrigerators, water dispensers, cups, semiconductor children's cooling stickers, which greatly facilitate people's lives.

[0003] In traditional technology, the temperature exchange device in the semiconductor temperature control system usually adopts a serpentine pipe formed by an S-shaped metal sheet. However, this temperature exchange device made of heat-conductive metal has poor contouring ability, the material is relatively hard, and the comfort experience is not good. Summary of the invention

[0004] Based on this, it is necessary to provide a water-cooled semiconductor temperature control system and method that can improve the experience comfort of the working end to be temperature controlled in order to solve the above technical problems.

[0005] A water-cooled semiconductor temperature control system, characterized in that it comprises:

[0006] A control end, comprising a thermoelectric semiconductor, a water pipe component and a water pump, wherein the water pipe component is connected to the thermoelectric semiconductor, and the water pump is arranged on the water pipe component;

[0007] The working end includes a temperature regulating product and a flexible energy exchange pipe network, wherein the flexible energy exchange pipe network contacts and fits the temperature regulating product, the flexible energy exchange pipe network is connected to the water pipe component of the control end, the flexible energy exchange pipe network and the water pipe component form a water circulation loop, and liquid is arranged in the water circulation loop;

[0008] Wherein, the flexible energy exchange network comprises:

[0009] The outer water pipe has a ring-shaped structure;

[0010] The inner water pipe is in a mesh array structure, connected to the inner ring of the annular structure of the outer water pipe and communicated with the outer water pipe;

[0011] A water inlet, located on the outer water pipe or the inner water pipe, and connected to the water pipe component of the control end;

[0012] The water outlet is located on the outer water pipe or the inner water pipe and is connected to the water pipe component of the control end.

[0013] In one embodiment:

[0014] The contour shape of the annular structure of the outer water pipe is consistent with or similar to the outer contour of the temperature control product;

[0015] The curvature of the mesh surface of the mesh array structure of the inner water pipe is consistent with or similar to the curvature of the main body of the temperature regulating product.

[0016] In one embodiment:

[0017] The control end is an independent module;

[0018] The flexible energy exchange pipe network at the working end is connected to the water pipe component at the control end in a detachable connection manner.

[0019] In one embodiment:

[0020] Wherein, the working end also includes:

[0021] A plurality of temperature detection modules are distributed at different positions on the temperature control product and are used to detect current temperature data at different positions of the temperature control product;

[0022] Wherein, the control end also includes:

[0023] The display terminal is connected to the plurality of temperature detection modules and is used to collect the plurality of current temperature data and form a thermal distribution map based on the plurality of current temperature data.

[0024] In one embodiment, the display terminal includes:

[0025] A data acquisition module, connected to the plurality of temperature detection modules, for acquiring a plurality of current temperature data;

[0026] A position information storage module, used for pre-storing position information of a plurality of temperature detection modules;

[0027] An analysis module, connected to the data acquisition module and the location information storage module, for analyzing and generating a location topology map based on the plurality of current temperature data and the location information corresponding thereto in combination with coordinate rules;

[0028] The thermal distribution map generation module is connected to the analysis module and is used to generate a thermal distribution map according to the current temperature data, the corresponding position information and the position topology map.

[0029] In one embodiment, the control terminal further includes:

[0030] Temperature setting module, used to set target temperature data;

[0031] A current switching circuit, connected to the thermoelectric semiconductor, for switching the direction of the current flowing through the thermoelectric semiconductor;

[0032] a calculation processing module, connected to the temperature setting module, the plurality of temperature detection modules and the current switching circuit, for collecting the plurality of current temperature data, determining the actual cooling or heating demand according to the plurality of current temperature data and the target temperature data, and controlling the current switching circuit to switch to a corresponding state according to the actual cooling or heating demand so that the current flows through the thermoelectric semiconductor in a corresponding current direction;

[0033] A power supply module is connected to the temperature setting module, the current switching circuit, the plurality of temperature detection modules and the calculation processing module for supplying power.

[0034] In one embodiment:

[0035] The calculation and processing module also determines whether the temperature is adjusted too fast or too slow based on the temperature change rate of the multiple current temperature data, and controls the current input to the thermoelectric semiconductor through the current switching circuit to become smaller when the temperature is adjusted too fast, and controls the current input to the thermoelectric semiconductor through the current switching circuit to become larger when the temperature is adjusted too slowly.

[0036] In one embodiment, the computing and processing module includes:

[0037] A collection unit, connected to the plurality of temperature detection modules, for acquiring a plurality of current temperature data;

[0038] a communication unit, connected to the temperature setting module, for acquiring the target temperature data;

[0039] a calculation unit connected to the acquisition unit and the communication unit, for determining an actual cooling or heating demand according to the target temperature data and the current temperature data, and for determining whether the temperature is adjusted too fast or too slow according to a temperature change rate of a plurality of the current temperature data;

[0040] A control unit is connected to the calculation unit and the current switching circuit, and is used to control the current switching circuit to switch to a corresponding state according to the actual cooling or heating demand so that the current flows through the thermoelectric semiconductor in a corresponding current direction, and is used to control the current input to the thermoelectric semiconductor through the current switching circuit to become smaller when the temperature is adjusted too quickly, and control the current input to the thermoelectric semiconductor through the current switching circuit to become larger when the temperature is adjusted too slowly.

[0041] A temperature control method for a water-cooled semiconductor temperature control system, characterized in that it comprises:

[0042] Acquire current temperature data at different positions of a temperature control product detected by a plurality of temperature detection modules, the temperature control product is in contact with and in contact with the flexible energy exchange pipe network, and the plurality of temperature detection modules are distributed at different positions on the temperature control product;

[0043] Get target temperature data;

[0044] Determining whether the temperature is adjusted too fast or too slow according to the temperature change rate of the plurality of current temperature data;

[0045] When the temperature is adjusted too fast, the current input to the thermoelectric semiconductor is controlled to be smaller; when the temperature is adjusted too slow, the current input to the thermoelectric semiconductor is controlled to be larger.

[0046] In one embodiment, it also includes:

[0047] A thermal distribution map is formed based on the plurality of current temperature data.

[0048] The above-mentioned water-cooled semiconductor temperature control system and method have an outer water pipe in an annular structure and an inner water pipe in a mesh array structure and connected to the inner circle of the annular structure of the outer water pipe. Combined with the circulation of the liquid in the water pipe by the control end water pump, energy is transmitted to the working end temperature control product through the thermoelectric semiconductor to play a temperature control role. In addition, the inner water pipe in the mesh array structure has the characteristics of uniform structural distribution, and combined with the flow characteristics and energy diffusion characteristics of the liquid itself, the temperature control of the temperature control product is more uniform and comfortable. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0050] Figure 1 A schematic diagram of the structure of a water-cooled semiconductor temperature control system in one embodiment of the present invention;

[0051] Figure 2 It is a structural block diagram of a computing and processing module in a water-cooled semiconductor temperature control system in one embodiment of the present invention;

[0052] Figure 3 The figure is a flow chart of a temperature control method of a water-cooled semiconductor temperature control system in one embodiment of the present invention. DETAILED DESCRIPTION

[0053] In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. Embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present application more thorough and comprehensive.

[0054] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0055] It can be understood that the terms "first", "second", etc. used in the present application can be used in this article to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish the first element from another element.

[0056] It should be noted that when an element is considered to be "connected" to another element, it can be directly connected to the other element, or connected to the other element through an intermediate element. In addition, the "connection" in the following embodiments should be understood as "electrical connection", "communication connection", etc. if there is transmission of electrical signals or data between the connected objects.

[0057] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" and the like specify the presence of stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. At the same time, the term "and / or" used in this specification includes any and all combinations of the relevant listed items.

[0058] like Figure 1 As shown, the present invention provides a water-cooled semiconductor temperature control system, which includes a control end 200 and a working end 100, wherein:

[0059] The control end 200 includes a thermoelectric semiconductor 232, a water pipe component and a water pump 220. The water pipe component is connected to the thermoelectric semiconductor 232. The water pump 220 in the control end 200 is arranged on the water pipe component. The control end 200 is used to provide temperature control energy to the working end 100. The thermoelectric semiconductor 232 usually includes P-type thermoelectric semiconductor elements and N-type thermoelectric semiconductor elements that are alternately arranged in parallel. Adjacent P-type thermoelectric semiconductor elements and N-type thermoelectric semiconductor elements are sequentially connected through electric arms to form a series structure. Its working principle is that by loading a DC voltage on both ends of the thermoelectric semiconductor 232, heat will flow from one end of the element to the other end. By changing the direction of the current, the direction of the heat flow can be changed, and the heat can be transported to the other end to achieve the effect of heating or cooling. The thermoelectric semiconductor 232 usually includes a cold end and a hot end, and both the cold end and the hot end are provided with metal sheets for conducting energy. The water pump 220 in the control end 200 is used to control the liquid in the water pipe for transportation and circulation.

[0060] The working end 100 includes a temperature regulating product 101 and a flexible energy exchange network. The flexible energy exchange network contacts and fits the temperature regulating product 101. The flexible energy exchange network is connected to the water pipe component of the control end 200. The flexible energy exchange network and the water pipe component form a water circulation loop, and a liquid is arranged in the water circulation loop. As an example, the water pipe component may include a water outlet connecting pipe 211 and a water inlet connecting pipe 212. The water outlet connecting pipe 211 is connected to the water inlet of the flexible energy exchange network, and the water inlet connecting pipe 212 is connected to the water outlet of the flexible energy exchange network. The water outlet connecting pipe 211 and the water inlet connecting pipe 212 are in a connected state in the control end 200 to form a water circulation loop, and are in contact with the metal sheet of the hot end 231 or the cold end 233 of the thermoelectric semiconductor 232. In this embodiment, the metal sheet of the hot end 231 of the thermoelectric semiconductor 232 is in contact with the water outlet connecting pipe 211.

[0061] As an example, the liquid may be water or oil, which are relatively cheap, or other liquids with heat-conducting function.

[0062] As an example, the flexible energy exchange network includes an outer water pipe 102 and an inner water pipe 103, wherein. The outer water pipe 102 is an annular structure, and the inner water pipe 103 is a mesh array structure. The mesh array structure of the inner water pipe 103 is connected to the inner circle of the annular structure of the outer water pipe 102 and is connected to the outer water pipe 102. As an example, the end of the mesh array structure of the inner water pipe 103 is connected to the corresponding position of the inner circle of the annular structure of the outer water pipe 102; the water inlet is located on the outer water pipe 102 or the inner water pipe 103, and is connected to the water pipe component of the control end 200; the water outlet is located on the outer water pipe 102 or the inner water pipe 103, and is connected to the water pipe component of the control end 200. In this embodiment, the water inlet and the water outlet are both arranged on the outer water pipe 102, and can be located on the same side of the outer water pipe 102, so that the overall structure of the flexible energy exchange network is compact. In other embodiments, the water inlet and the water outlet can be located on opposite sides of the outer water pipe 102, respectively, so that the liquid flows in and out as far as possible along the shortest path, which helps to improve the efficiency of liquid circulation.

[0063] The working end temperature control product of the water-cooled semiconductor temperature control system of the present invention has an outer water pipe in an annular structure and an inner water pipe in a mesh array structure and connected to the inner circle of the annular structure of the outer water pipe. Combined with the circulation of the liquid in the water pipe by the control end water pump, energy is conducted to the working end temperature control product through the thermoelectric semiconductor to play a temperature control role. In addition, the inner water pipe in the mesh array structure has the characteristics of uniform structural distribution (transverse and longitudinal distribution), and combined with the flow characteristics and energy diffusion characteristics of the liquid itself, the temperature control product is more uniform and comfortable in temperature regulation. Furthermore, due to its own flexibility and ductility, the water pipe has stronger comfort than traditional conductive metal materials, and can also be adaptively made into the shape of any temperature control product. For example, the temperature control product can be a mattress, head patch, clothes, chair and other items that need to be temperature controlled. Therefore, the present invention can expand the application scope and application scenarios of the thermoelectric semiconductor temperature control system.

[0064] In one embodiment, the contour shape of the annular structure of the outer water pipe 102 is consistent with or similar to the outer contour of the temperature control product 101; the curvature of the mesh surface of the mesh array structure of the inner water pipe 103 is consistent with or similar to the curvature of the main body of the temperature control product 101.

[0065] In one embodiment, the end of the mesh array structure of the inner water pipe 103 is connected to the corresponding position of the inner ring of the annular structure of the outer water pipe 102. When the inner water pipe 103 is completely hollow and the outer water pipe 102 is completely hollow, the liquid in the water pipe structure of the flexible energy exchange device formed in this way can flow in all directions, and the energy is diffused more evenly during heating or cooling.

[0066] It should be noted that the actual size of the flexible energy exchange network and the specific product structural characteristics can be selectively set inside the temperature control product 101 or on the surface of the temperature control product 101. For example, for large temperature control products 101 that are unlikely to move, such as the flexible energy exchange network on a mattress, the flexible energy exchange network can be set inside the product to save space; and for small temperature control products 101, such as the flexible energy exchange network on a chair, the flexible energy exchange network can be set on the surface of the product for easy disassembly and only installed when in use.

[0067] In one embodiment, the control end 200 can be designed as an independent module, so that the control end 200 can be easily disassembled from the working end 100 to meet the product upgrade needs of the control end 200. As an example, the flexible energy exchange network of the working end 100 is connected to the water pipe components (211, 212) of the control end 200 by a detachable connection method, for example, the ends of the water outlet connecting pipe 211 and the water inlet connecting pipe 212 are respectively connected to the water inlet and the water outlet of the flexible energy exchange network by a pair of connectors, so that when separated, the water pipe part will not be damaged, and the connector can be implemented by including but not limited to an internal threaded sleeve and a matching external threaded sleeve.

[0068] In one embodiment, a heat sink 240 is provided on the metal sheet at the hot end 231 or the metal sheet at the cold end 233 of the thermoelectric semiconductor 232. Specifically, the heat sink 240 should be provided on the end that does not actually play a cooling or heating role. For example, when the water pipe component (211, 212) is in contact with the metal sheet at the hot end 231, the heat sink 240 is provided on the metal sheet at the cold end 233. When the water pipe component (211, 212) is in contact with the metal sheet at the cold end 233, the heat sink 240 is provided on the metal sheet at the hot end 231, so that the energy that cannot be conducted away at this end can be diffused to avoid excessive energy accumulation and damage to the thermoelectric semiconductor 232. In another embodiment, a heat sink fan 250 can also be provided at the position corresponding to the heat sink 240 to further help energy diffusion.

[0069] In one of the embodiments, the working end also includes multiple temperature detection modules 400, which are distributed at different positions on the temperature control product 101 and are used to detect current temperature data at different positions of the temperature control product 101. The multiple temperature detection modules 400 can be powered independently or can be powered by a power supply module 260 described later. The temperature detection module 400 can be implemented using a temperature sensor or a thermocouple; the control end 200 also includes a display terminal 300, which is connected to the multiple temperature detection modules 400 (not shown in the connection relationship diagram) and is used to collect multiple current temperature data and form a thermal distribution map based on the multiple current temperature data. As an example, the display terminal 300 includes a data acquisition module, a position information storage module, an analysis module and a thermal distribution map generation module. The data acquisition module is connected to multiple temperature detection modules 400 for collecting multiple current temperature data. The position information storage module is used to pre-store the position information of multiple temperature detection modules 400. The analysis module is connected to the data acquisition module and the position information storage module, and is used to generate a position topology map based on multiple current temperature data and corresponding position information combined with coordinate rules. The thermal distribution map generation module is connected to the analysis module, and is used to generate a thermal distribution map based on the current temperature data, the corresponding position information and the position topology map. The display module is used to display the thermal distribution map to the user to help the user understand the heat distribution.

[0070] In one embodiment, the control end 200 further includes a temperature setting module 290, a current switching circuit 270, a calculation processing module 280 and a power supply module 260; the temperature setting module 290 is used to set target temperature data, that is, the temperature that the user needs to reach for the temperature control product 101; the current switching circuit 270 is connected to the thermoelectric semiconductor 232, and is used to switch the direction of the current flowing through the thermoelectric semiconductor 232; the calculation processing module 280 is connected to the temperature setting module 290, multiple temperature detection modules 400 and the current switching circuit 270, and is used to collect multiple current temperature data, and The actual cooling or heating demand is determined based on multiple current temperature data and target temperature data, and the current switching circuit 270 is controlled to switch to the corresponding state based on the actual cooling or heating demand so that the current flows through the thermoelectric semiconductor 232 in the corresponding current direction, thereby realizing automatic cooling and heating regulation of the water-cooled semiconductor temperature control system, eliminating the trouble of manually selecting the connection with the cold end or the hot end to achieve cooling and heating regulation in traditional technology; the power supply module 260 is connected to the temperature setting module 290, the current switching circuit 270, multiple temperature detection modules 400 and the calculation and processing module 280 for power supply.

[0071] In one of the embodiments, the calculation and processing module 280 also determines whether the temperature is adjusted too fast or too slow based on the temperature change rate of multiple current temperature data, and controls the current input to the thermoelectric semiconductor 232 through the current switching circuit 270 to become smaller when the temperature is adjusted too fast, and controls the current input to the thermoelectric semiconductor 232 through the current switching circuit 270 to become larger when the temperature is adjusted too slowly.

[0072] As an example, Figure 2 As shown, the calculation and processing module 280 includes: an acquisition unit 283, connected to multiple temperature detection modules, for obtaining multiple current temperature data; a communication unit 282, connected to the temperature setting module 290, for obtaining target temperature data; a calculation unit 284, connected to the acquisition unit 283 and the communication unit 282, for determining the actual cooling or heating demand according to the target temperature data and the current temperature data, and for determining whether the temperature is adjusted too fast or too slow according to the temperature change rate of the multiple current temperature data; a control unit 281, connected to the calculation unit 284 and the current switching circuit 270, for controlling the current switching circuit 270 to switch to a corresponding state according to the actual cooling or heating demand so that the current flows through the thermoelectric semiconductor 232 in a corresponding current direction, and for controlling the current input to the two ends of the thermoelectric semiconductor 232 through the current switching circuit 270 to become smaller when the temperature is adjusted too fast, and controlling the current input to the thermoelectric semiconductor 232 through the current switching circuit 270 to become larger when the temperature is adjusted too slowly; the current switching circuit 270 can be implemented by a full-bridge circuit. The calculation processing module 280 may be implemented by a microprocessor chip, or may also be implemented by an FPGA. In this example, the calculation control module 3 is implemented by a DSP processor.

[0073] As an example, the method of determining the actual cooling or heating demand based on the target temperature data and the current temperature data may include: when the target temperature data is greater than the current temperature data, it is judged as a heating demand, and when the target temperature data is less than the current temperature data, it is judged as a cooling demand. Correspondingly, the control unit 281 controls the current switching circuit 270 to switch to a corresponding state so that the current flows through the thermoelectric semiconductor 232 in a corresponding current direction. Specifically, the full-bridge circuit usually includes 4 electronic switches, and uses the principle of high-level conduction and low-level off. By switching a pair of electronic switches on a diagonal line with a pair of electronic switches on another diagonal line, the current direction is switched to achieve the switching purpose of heating and cooling.

[0074] As an example, a method for determining whether the temperature is adjusted too fast or too slow based on the temperature change rate of multiple current temperature data may include that the temperature change rate is the temperature change amount within a preset time, and the preset time can be set according to actual conditions, that is, within the preset time after the heating or cooling is turned on, the current temperature is detected by multiple temperature detection modules 400, and the temperature change rate is obtained by comparing the change amount of the average value of multiple currently detected temperature data at the beginning and end of the preset time with the preset time. For example, the preset time is half a minute, and the average value of multiple currently detected temperature data at the beginning of the preset time is 15 degrees Celsius, and the average value of multiple currently detected temperature data at the end of the preset time is 17 degrees Celsius, then the temperature change rate is 4 degrees Celsius / minute, and the temperature change rate baseline value is set to compare with the temperature change rate to determine whether the temperature is adjusted too fast or too slow. For example, if the temperature If the temperature change rate is greater than the temperature change rate reference value, then it is determined that the temperature adjustment is too fast; if the temperature change rate is less than the temperature change rate reference value, then it is determined that the temperature adjustment is too slow; the calculation control module 280 also includes a PWM module 285, the PWM module 285 is connected to the control unit 281, and the PWM module 285 is used to generate a PWM signal; the PWM module 285 is connected to the full-bridge circuit through a PWM drive amplifier circuit; the control unit 281 adjusts the input current size and current direction of the thermoelectric semiconductor 232 by adjusting the duty cycle of the PWM signal generated by the PWM module 285, which is used to control whether it is heating or cooling, and to adjust the operating power of the thermoelectric semiconductor 232, so as to speed up or slow down the heating and cooling speed of the thermoelectric semiconductor 232, so as to make the temperature change rate close to the temperature change rate reference value, so that the temperature adjustment method is more flexible and comfortable, and the user's experience comfort is further improved.

[0075] like Figure 3 As shown, the present invention also provides a temperature control method for a water-cooled semiconductor temperature control system, which comprises:

[0076] S1: obtaining current temperature data at different positions of a temperature control product detected by multiple temperature detection modules, the temperature control product is in contact with and fitted to the flexible energy exchange pipe network, and the multiple temperature detection modules are distributed at different positions on the temperature control product;

[0077] S2: Obtain target temperature data;

[0078] S3: determining whether the temperature is adjusted too fast or too slow according to the temperature change rate of the multiple current temperature data;

[0079] S4: When the temperature is adjusted too fast, the current input to the thermoelectric semiconductor is controlled to be smaller, and when the temperature is adjusted too slow, the current input to the thermoelectric semiconductor is controlled to be larger.

[0080] In one embodiment, the temperature control method of the water-cooled semiconductor temperature control system further includes:

[0081] S5: forming a thermal distribution map based on the multiple current temperature data.

[0082] It should be understood that although Figure 3 The steps in the flowchart are shown in sequence as indicated by the arrows, but these steps are not necessarily executed in the order indicated by the arrows. Unless otherwise specified in this document, there is no strict order restriction for the execution of these steps, and these steps can be executed in other orders. Moreover, Figure 3 At least part of the steps may include multiple steps or multiple stages. These steps or stages are not necessarily performed at the same time, but can be performed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed in turn or alternately with other steps or at least part of the steps or stages in other steps.

[0083] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0084] In the description of this specification, the description with reference to the terms "some embodiments", "other embodiments", "ideal embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic descriptions of the above terms do not necessarily refer to the same embodiment or example.

[0085] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A water-cooled semiconductor temperature control system, characterized in that: include: A control end, comprising a thermoelectric semiconductor, a water pipe component and a water pump, wherein the water pipe component is connected to the thermoelectric semiconductor, and the water pump is arranged on the water pipe component; The working end includes a temperature regulating product and a flexible energy exchange pipe network, wherein the flexible energy exchange pipe network contacts and fits the temperature regulating product, the flexible energy exchange pipe network is connected to the water pipe component of the control end, the flexible energy exchange pipe network and the water pipe component form a water circulation loop, and liquid is arranged in the water circulation loop; Wherein, the flexible energy exchange network comprises: The outer water pipe has a ring-shaped structure; The inner water pipe is in a mesh array structure, connected to the inner ring of the annular structure of the outer water pipe and communicated with the outer water pipe; A water inlet, located on the outer water pipe or the inner water pipe, and connected to the water pipe component of the control end; A water outlet, located on the outer water pipe or the inner water pipe, and connected to the water pipe component of the control end; Wherein, the working end also includes: A plurality of temperature detection modules are distributed at different positions on the temperature control product and are used to detect current temperature data at different positions of the temperature control product; Wherein, the control end also includes: The display terminal is connected to the plurality of temperature detection modules and is used to collect the plurality of current temperature data and form a thermal distribution map based on the plurality of current temperature data.

2. The water-cooled semiconductor temperature control system according to claim 1, characterized in that: The contour shape of the annular structure of the outer water pipe is consistent with or similar to the outer contour of the temperature control product; The curvature of the mesh surface of the mesh array structure of the inner water pipe is consistent with or similar to the curvature of the main body of the temperature regulating product.

3. The water-cooled semiconductor temperature control system according to claim 1, characterized in that: The control end is an independent module; The flexible energy exchange pipe network at the working end is connected to the water pipe component at the control end in a detachable connection manner.

4. The water-cooled semiconductor temperature control system according to claim 1, characterized in that: The thermoelectric semiconductor comprises P-type thermoelectric semiconductor elements and N-type thermoelectric semiconductor elements which are alternately arranged in parallel, and adjacent P-type thermoelectric semiconductor elements and N-type thermoelectric semiconductor elements are sequentially connected through electric arms to form a series structure.

5. The water-cooled semiconductor temperature control system according to claim 4, characterized in that: The display terminal comprises: A data acquisition module, connected to the plurality of temperature detection modules, for acquiring a plurality of current temperature data; A position information storage module, used for pre-storing position information of a plurality of temperature detection modules; An analysis module, connected to the data acquisition module and the location information storage module, for analyzing and generating a location topology map based on the plurality of current temperature data and the location information corresponding thereto in combination with coordinate rules; The thermal distribution map generation module is connected to the analysis module and is used to generate a thermal distribution map according to the current temperature data, the corresponding position information and the position topology map.

6. The water-cooled semiconductor temperature control system according to claim 1, characterized in that: The control end also includes: Temperature setting module, used to set target temperature data; A current switching circuit, connected to the thermoelectric semiconductor, for switching the direction of the current flowing through the thermoelectric semiconductor; a calculation processing module, connected to the temperature setting module, the plurality of temperature detection modules and the current switching circuit, for collecting the plurality of current temperature data, determining the actual cooling or heating demand according to the plurality of current temperature data and the target temperature data, and controlling the current switching circuit to switch to a corresponding state according to the actual cooling or heating demand so that the current flows through the thermoelectric semiconductor in a corresponding current direction; A power supply module is connected to the temperature setting module, the current switching circuit, the plurality of temperature detection modules and the calculation processing module for supplying power.

7. The water-cooled semiconductor temperature control system according to claim 6, characterized in that: The calculation and processing module also determines whether the temperature is adjusted too fast or too slow based on the temperature change rate of the multiple current temperature data, and controls the current input to the thermoelectric semiconductor through the current switching circuit to become smaller when the temperature is adjusted too fast, and controls the current input to the thermoelectric semiconductor through the current switching circuit to become larger when the temperature is adjusted too slowly.

8. The water-cooled semiconductor temperature control system according to claim 7, characterized in that: The calculation processing module includes: A collection unit, connected to the plurality of temperature detection modules, for acquiring a plurality of current temperature data; a communication unit, connected to the temperature setting module, for acquiring the target temperature data; a calculation unit connected to the acquisition unit and the communication unit, for determining an actual cooling or heating demand according to the target temperature data and the current temperature data, and for determining whether the temperature is adjusted too fast or too slow according to a temperature change rate of a plurality of the current temperature data; A control unit is connected to the calculation unit and the current switching circuit, and is used to control the current switching circuit to switch to a corresponding state according to the actual cooling or heating demand so that the current flows through the thermoelectric semiconductor in a corresponding current direction, and is used to control the current input to the thermoelectric semiconductor through the current switching circuit to become smaller when the temperature is adjusted too quickly, and control the current input to the thermoelectric semiconductor through the current switching circuit to become larger when the temperature is adjusted too slowly.

9. A temperature control method for a water-cooled semiconductor temperature control system, characterized in that: Based on the water-cooled semiconductor temperature control system according to any one of claims 1 to 8, the temperature control method of the water-cooled semiconductor temperature control system includes: Acquire current temperature data at different positions of a temperature control product detected by a plurality of temperature detection modules, the temperature control product is in contact with and in contact with the flexible energy exchange pipe network, and the plurality of temperature detection modules are distributed at different positions on the temperature control product; Get target temperature data; Determining whether the temperature is adjusted too fast or too slow according to the temperature change rate of the plurality of current temperature data; When the temperature is adjusted too fast, the current input to the thermoelectric semiconductor is controlled to be smaller; when the temperature is adjusted too slow, the current input to the thermoelectric semiconductor is controlled to be larger.

10. The temperature control method of the water-cooled semiconductor temperature control system according to claim 9, characterized in that: Also includes: A thermal distribution map is formed based on the plurality of current temperature data.

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