optical mechanism

Abstract

An optical mechanism is disclosed. The optical mechanism includes a base module, an optical element, and a ball element. The base module has a frame, a substrate, and an image sensor. The substrate is movably disposed in the frame, and the image sensor is disposed on the substrate. The optical element movably connects the base module. Light passes through the optical element and reaches the image sensor, thereby generating a digital image. The ball element is disposed between the substrate and the frame, such that the image sensor and the substrate are movable relative to the frame along a first axis. The first axis is perpendicular to an optical axis of the optical element.

Description

Technical Field

[0001] This invention relates to an optical mechanism. More specifically, this invention relates to an optical mechanism having an image sensor. Background Technology

[0002] With the development of technology, many electronic devices today (such as smartphones or laptops) have camera or video recording capabilities. These devices are becoming increasingly common and are evolving towards more convenient and slimmer designs to provide users with more choices.

[0003] In some electronic devices, a lens drive module is used to move the lens in order to make the lens focal length adjustable. However, lens drive modules often suffer from lens tilting or insufficient driving force due to assembly deviations of internal components. Therefore, solving the aforementioned problems has become an important research topic. Summary of the Invention

[0004] The purpose of this invention is to provide an optical mechanism to solve at least one of the above-mentioned problems.

[0005] In view of the aforementioned problems, one embodiment of the present invention provides an optical mechanism including a base module, an optical element, and a spherical element. The base module has a frame, a substrate, and an image sensor, wherein the substrate is movably disposed within the frame, and the image sensor is disposed on the substrate. The optical element is movably connected to the base module, wherein light passes through the optical element and reaches the image sensor to generate a digital image. The spherical element is disposed between the substrate and the frame, thereby allowing the image sensor and the substrate to move relative to the frame along a first axis, wherein the first axis is perpendicular to an optical axis of the optical element.

[0006] In one embodiment, the aforementioned base module further includes a metal component embedded inside the aforementioned substrate, and the aforementioned spherical element contacts the aforementioned metal component.

[0007] In one embodiment, the aforementioned substrate is made of plastic, and the aforementioned metal part is embedded in the aforementioned substrate by means of an embedded molding process.

[0008] In one embodiment, the aforementioned substrate has a recessed hole, the aforementioned metal part is exposed in the aforementioned recessed hole, and the aforementioned spherical element is accommodated in the aforementioned recessed hole.

[0009] In one embodiment, the width of the aforementioned concave hole is greater than the diameter of the aforementioned spherical element.

[0010] In one embodiment, the aforementioned frame is rectangular and has a protrusion, wherein the aforementioned spherical element is sandwiched between the aforementioned metal part and the aforementioned protrusion.

[0011] In one embodiment, the aforementioned protrusion is located at one corner of the aforementioned frame.

[0012] In one embodiment, the aforementioned protrusion forms a groove, and the aforementioned spherical element is accommodated within the aforementioned groove.

[0013] In one embodiment, the aforementioned base module further includes a coil element disposed on the aforementioned substrate, and the aforementioned optical mechanism further includes a movable module, wherein the aforementioned movable module includes a frame, a carrier and a magnetic element, the aforementioned frame is connected to the aforementioned base module, the aforementioned carrier is movably disposed in the aforementioned frame to support the aforementioned optical element, and the aforementioned magnetic element is disposed on the aforementioned frame, wherein when a current is passed through the aforementioned coil element, the aforementioned substrate and the aforementioned image sensor move relative to the aforementioned frame along the aforementioned first axis.

[0014] In one embodiment, the aforementioned base module further includes a circuit board disposed on a bottom side of the aforementioned substrate, and the aforementioned image sensor is electrically connected to the aforementioned circuit board.

[0015] In one embodiment, the aforementioned base module further includes a magnetic field sensing element that passes through the aforementioned substrate and is electrically connected to the aforementioned circuit board, for sensing the magnetic field strength of the aforementioned magnetic element.

[0016] In one embodiment, the aforementioned base module further includes a coil element disposed on the aforementioned substrate, and the aforementioned optical mechanism further includes a movable module, the aforementioned movable module having a frame and a magnetic element disposed on the aforementioned frame, the aforementioned frame being connected to the aforementioned base module, and the aforementioned optical element being movably disposed within the aforementioned frame, wherein when a current is applied to the aforementioned coil element, the aforementioned substrate and the aforementioned image sensor rotate relative to the aforementioned frame around the aforementioned optical axis.

[0017] In one embodiment, when the aforementioned coil element is subjected to the aforementioned current, the aforementioned substrate and the aforementioned image sensor move relative to the aforementioned frame along the aforementioned first axis and a second axis, wherein the aforementioned second axis is perpendicular to the aforementioned first axis and the aforementioned optical axis.

[0018] In one embodiment, the aforementioned optical mechanism further includes a movable module, which has a frame, a carrier, a coil, and a magnetic element. The frame is connected to the base module, the carrier is movably disposed inside the frame to support the optical element, the coil is disposed on the carrier, and the magnetic element is disposed on the frame. When a current flows through the coil, the coil and the magnetic element generate an electromagnetic driving force to drive the carrier and the optical element to move relative to the frame.

[0019] In one embodiment, the aforementioned movable module further includes a first spring that connects the aforementioned carrier and the aforementioned frame.

[0020] In one embodiment, the aforementioned movable module further includes a second reed connecting the aforementioned frame and the aforementioned frame.

[0021] In one embodiment, the aforementioned optical mechanism further includes an upper cover, a movable module, and a shape memory alloy element. The movable module is connected to the aforementioned base module and has a frame. The aforementioned optical element is movably disposed within the aforementioned frame. The aforementioned shape memory alloy element is connected to the aforementioned frame and the aforementioned upper cover. When an electric current is applied to the aforementioned shape memory alloy element, the aforementioned movable module rotates relative to the aforementioned upper cover around the aforementioned optical axis.

[0022] In one embodiment, when the aforementioned shape memory alloy element is supplied with the aforementioned current, the aforementioned movable module moves relative to the aforementioned top cover along the aforementioned first axis and a second axis, wherein the aforementioned second axis is perpendicular to the aforementioned first axis and the aforementioned optical axis.

[0023] In one embodiment, the aforementioned optical mechanism further includes a top cover, a movable module, a coil element, a ball bearing, and a guide member. The movable module has a frame and a magnetic element disposed on the frame. The optical element is movably disposed within the frame. The coil element is disposed on an inner surface of the top cover. The guide member is fixed to the frame. The ball bearing is sandwiched between the top cover and the guide member. When a current is applied to the coil element, the movable module moves relative to the top cover.

[0024] In one embodiment, the aforementioned guiding member forms a guide groove, and the aforementioned ball is accommodated within the aforementioned guide groove.

[0025] The beneficial effect of this invention is that the movable module is movably disposed between the upper cover and the base module, and the aforementioned optical element (e.g., an optical lens) is disposed inside the movable module and can move relative to the upper cover along the Y-axis or Z-axis direction, thereby achieving functions such as autofocus and optical image stabilization. Attached Figure Description

[0026] Figure 1 This is an exploded view showing the optical mechanism assembly before assembly according to an embodiment of the present invention.

[0027] Figure 2 express Figure 1 A three-dimensional diagram of the optical components assembled in the image.

[0028] Figure 3 express Figure 1 A 3D view of the movable module in the image.

[0029] Figure 4 express Figure 1 A three-dimensional view of the top cover.

[0030] Figure 5 express Figure 1 A three-dimensional view of the guiding components in the diagram.

[0031] Figure 6 This is a cross-sectional view of the optical mechanism after the optical elements have been removed.

[0032] Figure 7 express Figure 1 Exploded view of the base module.

[0033] Figure 8 express Figure 1 Another exploded view of the base module.

[0034] Figure 9 express Figure 7 and Figure 8 The base module is shown in a 3D view after assembly.

[0035] Figure 10 express Figure 7 and Figure 8 A 3D view of the framework in the image.

[0036] Figure 11 express Figure 7 and Figure 8 Another perspective of the frame in the diagram.

[0037] Figure 12 This is a schematic diagram showing a spherical element sandwiched between a protrusion in a frame and a metal component inside a substrate.

[0038] Figure 13 A cross-sectional view showing a spherical element sandwiched between a protrusion in a frame and a metal piece within a substrate.

[0039] Figure 14 This is a schematic diagram showing the combination of a substrate, a circuit board, a spherical element, a magnetic field sensing element, and an image sensor.

[0040] Figure 15This is an exploded view showing the substrate before it is bonded to a metal component.

[0041] Figure 16 express Figure 15 A cross-sectional view of the substrate and metal components after they are joined together.

[0042] Figure 17 This diagram illustrates the relative positions of the flat coil within the coil element and the magnetic elements on the frame after assembly.

[0043] Figure 18 A cross-sectional view showing the optical mechanism of another embodiment of the present invention.

[0044] Figure 19 A cross-sectional view showing the optical mechanism of another embodiment of the present invention.

[0045] Figure 20 A cross-sectional view showing the optical mechanism of another embodiment of the present invention.

[0046] The attached figures are labeled as follows:

[0047] 100: Optical mechanism

[0048] 10: Movable module

[0049] 11: Frame

[0050] 12: Bearing components

[0051] 20: Base Module

[0052] B: Bottom shell

[0053] B1: Ball bearing

[0054] B2: Spherical element

[0055] C1: Coil element

[0056] C2: Coil element

[0057] C21: Flat coil

[0058] C22: Flat coil

[0059] C23: Flat coil

[0060] F: Frame

[0061] F1: Protrusion

[0062] F2: Bump

[0063] FC: Circuit element

[0064] G: Guiding Components

[0065] H: Top cover

[0066] H1: Metal sheet

[0067] HS: Magnetic field sensing element

[0068] L: Optical components

[0069] M1: Magnetic element

[0070] M2: Magnetic element

[0071] m1: Magnetic element

[0072] m2: Magnetic element

[0073] MB: Metal parts

[0074] N: Limiting component

[0075] O: Optical axis

[0076] P: Substrate

[0077] R1: Depressed structure

[0078] R2: Groove

[0079] S: Image sensor

[0080] SC: Circuit Board

[0081] SP: First reed

[0082] LP: Second reed

[0083] V1: Guide Channel

[0084] V2: Concave hole

[0085] W: Coil Detailed Implementation

[0086] The optical mechanism of an embodiment of the present invention is described below. However, it will be readily apparent that the embodiments of the present invention provide many suitable inventive concepts that can be implemented in a wide range of specific contexts. The specific embodiments disclosed are merely illustrative of the use of the invention in a particular manner and are not intended to limit the scope of the invention.

[0087] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this disclosure pertains. It is understood that these terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with the relevant art and the background or context of this disclosure, and should not be interpreted in an idealized or overly formal manner, unless specifically defined herein.

[0088] The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of a preferred embodiment with reference to the accompanying drawings. The directional terms mentioned in the following embodiments, such as up, down, left, right, front, or back, are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used in the embodiments are for illustrative purposes and not for limiting the present invention.

[0089] Please refer to the following first: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 ,in Figure 1 This is an exploded view of the optical mechanism 100 before assembly according to an embodiment of the present invention. Figure 2 express Figure 1 A three-dimensional diagram of the assembled optical mechanism 100. Figure 3 express Figure 1 A three-dimensional view of the movable module 10 in the middle. Figure 4 express Figure 1 A three-dimensional view of the upper cover H in the middle. Figure 5 express Figure 1 A three-dimensional diagram of the guiding component G in the diagram. Figure 6 This is a cross-sectional view of the optical mechanism 100 after the optical element L has been removed.

[0090] like Figure 1 , Figure 2 and Figure 6 As shown, the optical mechanism 100 of one embodiment of the present invention is, for example, a camera lens, which mainly includes a top cover H, an optical element L, a coil element C1 (e.g., a flat coil), multiple balls B1, a guide member G, a movable module 10, and a base module 20. In this embodiment, the aforementioned movable module 10 is movably disposed between the top cover H and the base module 20, and the aforementioned optical element L (e.g., an optical lens) is disposed inside the movable module 10, and it can move relative to the top cover H along the Y-axis or Z-axis direction, thereby achieving functions such as auto-focusing (AF) and optical image stabilization (OIS).

[0091] Please continue reading. Figure 1 , Figure 2 and Figure 6The aforementioned base module 20 mainly includes a bottom shell B, a frame F, a substrate P, a coil element C2, and an image sensor S. The frame F is fixed between the top cover H and the bottom shell B, the substrate P is movably disposed within the frame F, and the aforementioned image sensor S and coil element C2 are fixed on the substrate P, with the coil element C2 surrounding the image sensor S. It should be understood that external light can enter the optical mechanism 100 along the optical axis O of the optical element L, and the light will reach the image sensor S after passing through the optical element L, thereby generating a digital image.

[0092] Specifically, at least one spherical element B2 ( Figure 6 The image sensor S is sandwiched between the aforementioned substrate P and frame F, allowing the substrate P to slide relative to the frame F. In this way, the image sensor S can move along the X-axis (first axis) and / or Y-axis (second axis) relative to the frame F and the base shell B together with the substrate P to achieve the function of optical image stabilization (OIS).

[0093] In addition, from Figure 3 , Figure 6 and Figure 17 As can be seen from the above, the aforementioned movable module 10 mainly includes a frame 11, a support member 12, at least one first spring SP, and multiple magnetic elements M1, M2, m1, m2 ( Figure 17 The aforementioned magnetic elements M1, M2, m1, m2 (e.g., magnets) are fixed to the three sides of the frame 11, while the aforementioned support member 12 is movably disposed inside the frame 11 and connected to the frame 11 via a first spring SP. Additionally, the aforementioned frame 11 is connected via a second spring LP. Figure 6 It is connected to the frame F, so that the entire movable module 10 can move relative to the frame F and the top cover H.

[0094] It should be understood that the aforementioned optical element L is fixed inside the carrier 12, and at least one coil (not shown) is provided on the outer surface of the carrier 12. When a current is applied to the aforementioned coil, the coil and magnetic elements M1 and M2 can generate an electromagnetic driving force, thereby driving the optical element L and the carrier 12 to move relative to the frame 11 along the Z-axis direction (optical axis O direction), thereby achieving the function of auto-focusing (AF).

[0095] On the other hand, from Figure 1 , Figure 4 , Figure 5 and Figure 6As can be seen, the coil element C1 is attached to the inner surface of the upper cover H, and the guide member G is fixed to the frame 11 of the movable module 10. In addition, four balls B1 are sandwiched between the recessed structure R1 on the inner surface of the upper cover H and the guide groove V1 of the guide member G. Specifically, the aforementioned guide groove V1 extends in the Y-axis direction, and when a current is applied to the coil element C1, the coil element C1 and the magnetic elements M1 and m1 can generate an electromagnetic driving force, thereby driving the entire movable module 10 to move relative to the upper cover H in the Y-axis direction to achieve the function of optical image stabilization (OIS).

[0096] For example, the aforementioned cover H may contain a metal material (such as...) Figure 1 and Figure 6 (As shown in the metal sheet H1), in this way a magnetic attraction can be generated between the upper cover H and the magnetic elements M1 and m1, thereby stably clamping the ball B1 between the upper cover H and the guide member G.

[0097] In this embodiment, the aforementioned guide groove V1 and ball B1 are located near the four corners of the movable module 10. However, they can also be located on the four sides or other positions of the movable module 10. On the other hand, the guide member G may not have the aforementioned guide groove V1. In this way, the electromagnetic driving force generated between the coil element C1 and the magnetic elements M1 and m1 can drive the entire movable module 10 to move relative to the upper cover H along the X-axis (first axis) and / or the Y-axis (second axis), and is not limited to what is disclosed in this embodiment.

[0098] Please refer to the following as well. Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 , Figure 11 , Figure 12 and Figure 13 ,in Figure 7 express Figure 1 Exploded view of base module 20 in the middle. Figure 8 express Figure 1 Another exploded view of the base module 20 in the middle. Figure 9 express Figure 7 and Figure 8 The base module 20 is shown in the 3D view after assembly. Figure 10 express Figure 7 and Figure 8 A 3D view of frame F in the diagram. Figure 11 express Figure 7 and Figure 8 Another perspective stereoscopic view of frame F in the image. Figure 12 This is a schematic diagram showing a spherical element B2 sandwiched between a protrusion F1 of a frame F and a metal piece MB inside a substrate P. Figure 13This is a cross-sectional view showing the spherical element B2 sandwiched between a protrusion F1 of the frame F and a metal piece MB inside the substrate P.

[0099] like Figure 6 , Figure 7 , Figure 8 , Figure 9 , Figure 10 and Figure 11 As shown, the base module 20 of this embodiment includes a coil element C2, a circuit element FC, a frame F, a limiting member N, a substrate P, a circuit board SC, multiple spherical elements B2, an image sensor S, and a bottom shell B. The aforementioned frame F is fixed on the bottom shell B, the aforementioned substrate P is movably disposed within the frame F, and the aforementioned image sensor S, circuit element FC, and coil element C2 are fixed on the substrate P. The coil element C2 and circuit element FC surround the image sensor S, and external light can enter the optical mechanism 100 along the optical axis O and reach the image sensor S after passing through the optical element L, thereby generating a digital image.

[0100] For example, the aforementioned circuit element FC can be a flexible printed circuit (FPC) element, and the aforementioned coil element C2 can be electrically connected to an external circuit through the circuit element FC. Furthermore, from... Figure 7 , Figure 8 and Figure 9 As can be seen from the above, the aforementioned coil element C2 includes multiple flat coils C21, C22, and C23, and their positions correspond to the magnetic elements M2 and m2 on the frame 11. Figure 17 ).

[0101] When an external circuit applies current to the planar coils C21, C22, and C23 in the coil element C2, the coil element C2 and the magnetic elements M2 and m2 on the frame 11 can generate an electromagnetic driving force, thereby driving the substrate P and the image sensor S to move together relative to the frame F along the X-axis (first axis) and / or the Y-axis (second axis), or causing the substrate P and the image sensor S to rotate together relative to the frame F around the optical axis O, so as to achieve the function of optical image stabilization (OIS).

[0102] Specifically, the aforementioned frame F is rectangular, and at each of the four corners of the frame F, there are protrusions F1 extending inward, wherein a groove R2 is formed on the bottom side of each protrusion F1. Figure 8 , Figure 11 and Figure 13 Furthermore, a recessed hole V2 is formed on the aforementioned substrate P, wherein the aforementioned spherical element B2 is accommodated between the groove R2 of the protrusion F1 and the recessed hole V2 of the substrate P.

[0103] Since the width of the aforementioned recess V2 is greater than the diameter of the spherical element B2, the spherical element B2 can slide within the recess V2; in this way, the substrate P can be displaced relative to the frame F along the X-axis and / or Y-axis, and the aforementioned image sensor S can also move relative to the frame F and the bottom shell B along the X-axis (first axis) and / or Y-axis (second axis) through the substrate P and the spherical element B2, thereby achieving the function of optical image stabilization (OIS).

[0104] On the other hand, from Figure 7 and Figure 17 As can be seen, several magnetic field sensing elements HS are embedded on the substrate P, which can be used to sense the magnetic field strength of magnetic elements M2 and m2, thereby determining the positional change of the image sensor S relative to the movable module 10. In one embodiment, the aforementioned image sensor S and magnetic field sensing elements HS can pass through the substrate P and be electrically connected to the circuit board SC located on the bottom side of the substrate P. In this way, the image sensor S can be electrically connected to an external circuit through the circuit board SC.

[0105] In addition, from Figure 8 , Figure 9 , Figure 10 , Figure 11 and Figure 13 As can be seen, a limiting member N is provided on the bottom side of the frame F, wherein the limiting member N is, for example, made of metal and has a C-shaped structure. During assembly, the protrusion F2 located on the bottom side of the frame F can pass through the limiting member N. Figure 13 The limiting member N is fixed to the bottom side of the frame F, thereby restricting the substrate P between the protrusion F1 of the frame F and the limiting member N.

[0106] In this embodiment, when viewed along the optical axis O, the substrate P, the limiting member N, and the protrusion F1 of the frame F at least partially overlap, thereby preventing the substrate P from falling off the bottom side of the frame F.

[0107] Please refer to the following as well. Figure 12 , Figure 13 , Figure 14 , Figure 15 and Figure 16 ,in Figure 14 This diagram illustrates the assembly of substrate P, circuit board SC, spherical element B2, magnetic field sensing element HS, and image sensor S. Figure 15 This is an exploded view of substrate P before it is bonded to a metal component MB. Figure 16 express Figure 15 A cross-sectional view of the substrate P after it is joined with the metal component MB.

[0108] from Figure 12 , Figure 13 , Figure 14 , Figure 15and Figure 16 As can be seen from this, a metal part MB ( Figure 15 The spherical element B can be integrated into the plastic substrate P through insert molding, with the metal part MB exposed at the recess V2 of the substrate P. It should be understood that the aforementioned spherical element B will contact the metal part MB after assembly and can slide on the surface of the metal part MB.

[0109] It should be understood that by embedding the aforementioned metal component MB inside the substrate P, not only can the overall structural strength of the substrate P be significantly improved, but damage to the plastic substrate P caused by contact friction between the spherical element B2 and the substrate P can also be avoided. In addition, since a magnetic attraction can be generated between the metal component MB and the magnetic elements M2 and m2, the spherical element B2 can be stably clamped between the protrusion F1 of the frame F and the metal component MB, thereby significantly improving the reliability and service life of the optical mechanism 100.

[0110] Please refer to the following: Figure 17 ,in Figure 17 This diagram illustrates the relative positions of the flat coils C21, C22, and C23 within coil element C2 and the magnetic elements M1, M2, m1, and m2 on frame 11 after assembly.

[0111] like Figure 17 As shown, when the planar coils C21, C22, and C23 in the coil element C2 are supplied with an appropriate current, the coil element C2 and the magnetic elements M2 and m2 on the frame 11 will generate an electromagnetic driving force, thereby driving the substrate P and the image sensor S to move together relative to the frame F, thus achieving the function of optical image stabilization (OIS).

[0112] Please see again Figure 18 ,in Figure 18 A cross-sectional view showing an optical mechanism 100 according to another embodiment of the present invention. (See diagram below.) Figure 18 As shown, the first spring SP connects the frame 11 and the carrier 12, while the second spring LP connects the frame 11 and the frame F. The ball bearing B1 is sandwiched between the frame 11 and the top cover H, and the spherical element B2 is sandwiched between the base plate P and the frame F.

[0113] When an external circuit applies current to the coil W on the carrier 12, the coil W and the magnetic elements M1 and M2 can generate an electromagnetic driving force, thereby driving the optical element L and the carrier 12 to move relative to the frame 11 along the Z-axis direction (optical axis O direction), thus achieving the function of autofocus (AF).

[0114] Furthermore, when an external circuit applies current to the coil element C1, the coil element C1 and the magnetic elements M1 and m1 can generate electromagnetic driving force, thereby driving the entire movable module 10 to move relative to the upper cover H along the X-axis (first axis) and / or the Y-axis (second axis), or enabling the movable module 10 to rotate around the optical axis O, thereby achieving the function of optical image stabilization (OIS). A magnetic field sensing element HS is provided on the inner side of the upper cover to sense the magnetic field strength of the magnetic elements M1 and M2, so as to know the position change of the frame 11 relative to the upper cover H.

[0115] On the other hand, when an external circuit applies current to the coil element C2, the coil element C2 and the magnetic elements M2 and m2 on the frame 11 can generate an electromagnetic driving force, thereby driving the substrate P and the image sensor S to move together relative to the frame F along the X-axis (first axis) and / or the Y-axis (second axis), or causing the substrate P and the image sensor S to rotate together relative to the frame F around the optical axis O, so as to achieve the function of optical image stabilization (OIS).

[0116] Please refer to the following: Figure 19 ,in Figure 19 A cross-sectional view showing an optical mechanism 100 according to another embodiment of the present invention. Figure 19 and Figure 18 The main difference in the embodiments is that at least one shape memory alloy (SMA) element SA connects the frame 11 and the top cover H, and in Figure 19 The aforementioned coil element C1 may not be required.

[0117] It should be understood that when a current is applied to the shape memory alloy element SA, the entire movable module 10 can be driven to move relative to the upper cover H along the X-axis (first axis) and / or the Y-axis (second axis), or the entire movable module 10 can be driven to rotate around the optical axis O to achieve the function of optical image stabilization (OIS).

[0118] Please see again Figure 20 ,in Figure 20 A cross-sectional view showing an optical mechanism 100 according to another embodiment of the present invention. Figure 20 and Figure 19 The main difference in the embodiment is that the frame 11 is fixed to the inner surface of the upper cover H, and in Figure 20 The aforementioned second reed LP may not be required.

[0119] It should be understood that when an external circuit applies current to... Figure 20 When the coil W is in the middle, the coil W and the magnetic elements M1 and M2 can generate an electromagnetic driving force, thereby driving the optical element L and the carrier 12 to move relative to the frame 11 along the Z-axis direction (optical axis O direction), thereby achieving the function of autofocus (AF).

[0120] On the other hand, when an external circuit applies current to the coil element C2, the coil element C2 and the magnetic elements M2 and m2 on the frame 11 can generate an electromagnetic driving force, thereby driving the substrate P and the image sensor S to move together relative to the frame F along the X-axis (first axis) and / or the Y-axis (second axis), or causing the substrate P and the image sensor S to rotate together relative to the frame F around the optical axis O, so as to achieve the function of optical image stabilization (OIS).

[0121] While the embodiments and advantages of the present invention have been disclosed above, it should be understood that those skilled in the art can make modifications, substitutions, and refinements without departing from the spirit and scope of the invention. Furthermore, the scope of protection of the present invention is not limited to the processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps described in the specific embodiments of the specification. Any processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps currently or in the future that can be developed from the disclosure of this invention can be used according to the present invention, as long as they can perform substantially the same function or obtain substantially the same results in the embodiments described herein. Therefore, the scope of protection of the present invention includes the aforementioned processes, machines, manufacturing methods, material compositions, apparatuses, methods, and steps. In addition, each claim constitutes an individual embodiment, and the scope of protection of the present invention also includes combinations of the various claims and embodiments.

[0122] Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Those skilled in the art can make some modifications and refinements without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the appended claims.

Claims

1. An optical mechanism, comprising: A base module has a frame, a coil element, a substrate and an image sensor, wherein the coil element is disposed on the substrate, the substrate is movably disposed within the frame, and the image sensor is disposed on the substrate. An optical element is movably connected to the base module, through which a light ray passes and reaches the image sensor to generate a digital image; A movable module includes a frame, a carrier, and a magnetic element. The frame is connected to the base module. The carrier is movably disposed within the frame to support the optical element. The magnetic element is disposed on the frame, and a coil element is located between the magnetic element and the substrate. A spherical element is disposed between the substrate and the frame, thereby enabling the image sensor and the substrate to move relative to the frame along a first axis, wherein the first axis is perpendicular to an optical axis of the optical element; The base module also has a metal component embedded inside the substrate. A magnetic attraction is generated between the metal component and the magnetic element, and the spherical element contacts the metal component. The frame is rectangular and has a protrusion, wherein the spherical element is sandwiched between the metal part and the protrusion.

2. The optical mechanism of claim 1, wherein the substrate is made of plastic and the metal part is embedded in the substrate by means of an embedded molding.

3. The optical mechanism of claim 2, wherein the substrate has a recessed hole, the metal part is exposed in the recessed hole, and the spherical element is accommodated in the recessed hole.

4. The optical mechanism of claim 3, wherein the width of the recess is greater than the diameter of the spherical element.

5. The optical mechanism of claim 1, wherein the protrusion is located at a corner of the frame.

6. The optical mechanism of claim 5, wherein the protrusion forms a groove, and the spherical element is received within the groove.

7. The optical mechanism of claim 1, wherein when a current is passed through the coil element, the substrate and the image sensor move relative to the frame along the first axis.

8. The optical mechanism of claim 7, wherein the base module further comprises a circuit board disposed on a bottom side of the substrate, and the image sensor is electrically connected to the circuit board.

9. The optical mechanism of claim 8, wherein the base module further comprises a magnetic field sensing element passing through the substrate and electrically connected to the circuit board for sensing the magnetic field strength of the magnetic element.

10. The optical mechanism of claim 1, wherein the optical element is movably disposed within the frame, wherein when a current is applied to the coil element, the substrate and the image sensor rotate relative to the frame about the optical axis.

11. The optical mechanism of claim 10, wherein when the current is applied to the coil element, the substrate and the image sensor move relative to the frame along the first axis and a second axis, wherein the second axis is perpendicular to the first axis and the optical axis.

Images