High temperature logging polar plate based on vacuum insulation technology

Abstract

The present application relates to the technical field of geophysical well logging, in particular to a high-temperature well logging polar plate based on vacuum heat insulation technology. The high-temperature well logging polar plate based on vacuum heat insulation technology comprises a base shell, a base vacuum layer and a base inner container, the base inner container is welded in the base shell, the base vacuum layer is formed between the base shell and the base inner container, and the base is composed of the base shell, the base inner container and the base vacuum layer. The high-temperature well logging polar plate based on vacuum heat insulation technology can block the heat transfer between the wellbore and the inside of the polar plate, prevent or slow down the temperature rise in the inside of the polar plate, improve the temperature resistance of the well logging polar plate, and the inside of the heat absorber is a phase change constant temperature material, i.e. a material with high specific heat capacity, which has very small temperature rise after absorbing heat, so that the temperature in the inside of the polar plate remains relatively constant, the temperature rise in the inside of the polar plate is within the designed index, and the safety during use is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of geophysical well logging, in particular to a high-temperature well logging plate based on vacuum insulation technology. Background Art

[0002] In geophysical exploration, some plates require embedded sensors and circuit modules to achieve an ideal signal-to-noise ratio. In recent years, with the trend toward miniaturization and integration of instruments, many products have integrated more circuitry directly into the plates, enabling signal reception, conditioning, acquisition, and other functions within the plates, ultimately outputting digital signals.

[0003] Currently, logging pads lack any technology or measures to prevent external heat from entering the probe. A common approach in the industry is to improve the temperature performance of logging pads by selecting components and sensors with superior heat resistance. This approach can partially meet the requirement for short-term operation (30 minutes of continuous operation) in a 175°C environment. However, since the sensors and electronic circuit modules within the logging pads operate at their extreme temperatures, their lifespan is significantly shortened. The actual cumulative operating life at 175°C ranges from a few hours to more than ten hours. Therefore, in high-temperature wellbore environments, the instrument lifespan is significantly shortened, costs increase, and the success rate of installation is extremely low. Summary of the Invention

[0004] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a high-temperature logging plate based on vacuum insulation technology.

[0005] The present invention aims to solve the problem that some existing logging pads do not have any technology and measures to block external heat from entering the probe, which greatly shortens the instrument life, increases costs and has an extremely low construction success rate under high-temperature wellbore environment conditions.

[0006] The technical solution is as follows:

[0007] A high-temperature logging plate based on vacuum insulation technology includes a base shell, a base vacuum layer and a base liner. The base shell is welded to the inside of the base shell, and a base vacuum layer is formed between the base shell and the base liner. The base consists of the base shell, the base liner and the base vacuum layer.

[0008] On the basis of the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, an upper cover shell is arranged above the base shell, and an upper cover liner is welded to the surface of the upper cover shell. An upper cover vacuum layer is formed between the upper cover shell and the upper cover liner. The upper cover is composed of the upper cover shell, the upper cover liner and the upper cover vacuum layer, and an upper cover sealing ring is arranged on the periphery of the upper cover shell.

[0010] The beneficial effect of adopting the above further solution is that the upper cover shell is also used to withstand the fluid pressure in the wellbore, and the base shell is also used to withstand the fluid pressure in the wellbore.

[0011] Furthermore, a transmission channel for providing electrical signals to the plate sensor or circuit module is provided at the front end of the base housing, and a wire is connected to the right side of the sensor or circuit module.

[0012] The beneficial effect of adopting the above further solution is that the electrical connection between the electrode plate and the outside can be established by using a wire.

[0013] Furthermore, a pressure-bearing plug is provided on the right side of the base shell, and a pressure-bearing plug sealing ring is provided on the periphery of the pressure-bearing plug.

[0014] The beneficial effect of adopting the above further solution is that the base, upper cover and pressure-bearing plug are assembled together, and their joints are sealed by the upper cover sealing ring and the pressure-bearing plug sealing ring to form a sealed plate cavity.

[0015] Furthermore, a wire channel for placing wires is opened inside the base shell, the wire channel is filled with a heat insulator, and the wires pass through the wire channel and are connected between the sensor or circuit module and the pins on the pressure plug.

[0016] The beneficial effect of adopting this further solution is that it can establish an electrical connection between the plate and the outside world. Because the thermal insulation has an extremely low thermal conductivity, it can block heat convection between the pressure plug and the plate cavity, significantly reducing heat conduction. In this way, the plate cavity, except for the wire channel, is completely surrounded by the upper cover vacuum layer and the base vacuum layer. The wire channel is also filled with thermal insulation. In this way, the entire plate is like a thermos, and heat from the plate outside the plate cannot enter the plate cavity through the upper cover shell, base shell, and pressure plug through heat conduction and convection.

[0017] Furthermore, a heat absorber is provided inside the inner container of the base, the heat absorber is made of a phase-change constant temperature material, and a circuit module is connected to the front end of the heat absorber.

[0018] The beneficial effect of adopting this further solution is that it can utilize materials with high specific heat capacity. After absorbing heat, the temperature rise is very small, keeping the internal temperature of the plate relatively constant. The main purpose of the heat absorber is to absorb heat generated by the sensor or circuit module during operation within the plate, as well as heat that enters the plate cavity from outside the plate. The amount of phase-change constant temperature material in the heat absorber determines its ability to limit internal temperature rise, and the specific implementation of this patent requires detailed calculations to determine.

[0019] Furthermore, a plate cavity is formed between the base inner shell and the sensor or circuit module.

[0020] The beneficial effect of adopting the above-mentioned further scheme is that the heat convection and heat conduction paths of the external heat of the plate entering the inner cavity of the plate are blocked by the vacuum layer, and the thermal radiation force is weakened by using materials and processes with lower and higher emissivity. However, some heat will still enter the inner cavity of the plate by heat conduction through the metal at the joint of the plate base and the upper cover, and some heat will enter the interior by heat radiation through the vacuum layer. Heat from the insulation of the wire channel enters the inner cavity of the plate by heat conduction and heat radiation. In addition, the sensor or circuit module will also generate heat itself. Therefore, in order to limit the temperature rise inside the inner cavity of the plate to a certain target within a certain period of time, a heat absorber is designed.

[0021] Furthermore, it also includes a plug and a plate body, the plug includes a plug vacuum layer, and a plug sealing ring is provided on the periphery of the plug for sealing the plate body.

[0022] The beneficial effect of adopting the above further scheme is that the above vacuum layers are evacuated using vacuum technology to form a vacuum, and the inner two sides of the vacuum layer are made of low-emissivity and high-reflectivity materials respectively to prevent external heat from entering the inner cavity of the plate in the form of thermal radiation.

[0023] Furthermore, an electrode array is provided on the surface of the electrode plate body, an electrode array sealing ring is provided on the surface of the electrode array, and the electrode plate body includes a electrode plate body vacuum layer.

[0024] The beneficial effect of adopting the above further solution is that a wiring hole is provided at one end of the electrode body, and the wire passes through the hole to establish an electrical connection between the pressure-bearing plug and the electrode array.

[0025] Furthermore, it also includes a pressure-bearing socket, which is equipped with an electrical connection socket. The pressure-bearing socket is connected to the heat insulator, the heat insulator is connected to the heat absorber, the surface of the heat absorber is connected to the long source distance detector and the circuit, and the long source distance detector and the circuit are connected to the pressure plug sealing ring; a vacuum insulation bottle is provided on the outside of the pressure socket, the heat insulator, the long source distance detector and the circuit and the pressure plug sealing ring, and the outside of the vacuum insulation bottle is connected to the probe housing.

[0026] The beneficial effect of adopting the above further solution is that the insulation is made of a material with a low thermal conductivity coefficient; the vacuum flask is independent of the outer shell, its inner and outer walls are relatively thin, it occupies less space, and does not need to withstand the pressure of the external wellbore fluid.

[0027] The beneficial effects of the present invention are:

[0028] 1) When in use, the device can block the heat transfer between the wellbore and the inside of the plate, prevent or slow down the temperature rise inside the plate, improve the temperature resistance of the logging plate, and enhance the use effect of the device.

[0029] 2) The inner part of the heat-absorbing body is a phase-change constant-temperature material, i.e. a material with high specific heat capacity, which has very small temperature rise after absorbing heat, so that the temperature inside the plate remains relatively constant, and the temperature rise inside the plate is within the designed index, ensuring the safety during use. BRIEF DESCRIPTION OF DRAWINGS

[0030] Figure 1 is a schematic diagram of the high-temperature logging plate assembly of the present application;

[0031] Figure 2 is a schematic diagram of the plate assembly of the present application;

[0032] Figure 3 is a schematic diagram of the structure at A in the present application Figure 2

[0033] Figure 4 is a schematic diagram of the structure at B in the present application Figure 2

[0034] Figure 5 is a schematic diagram of the high-temperature electrical imaging plate of the present application;

[0035] Figure 6 is a schematic diagram of the connection structure of the plate main body and the motor array of the present application;

[0036] Figure 7 is a sectional view of the high-temperature density plate of the present application.

[0037] In the figure:

[0038] 1, base shell, 2, upper cover shell, 3, pressure plug, 4, upper cover sealing ring, 5, pressure plug sealing ring, 6, upper cover vacuum layer, 7, base vacuum layer, 8, sensor or circuit module, 9, wire, 10, base inner container, 11, upper cover inner container, 12, heat insulation body, 13, wire channel, 14, heat-absorbing body, 15, plate inner cavity, 16, plug, 17, plug sealing ring, 18, plate main body, 19, electrode array sealing ring, 20, electrode array, 21, plug vacuum layer, 22, plate main body vacuum layer, 23, circuit module, 24, heat insulation body, 25, vacuum thermos bottle, 26, long source distance detector and circuit, 27, probe shell. DETAILED DESCRIPTION

[0039] The principles and characteristics of the present application are described below in conjunction with the drawings, and the examples are only used to explain the present application and are not used to limit the scope of the present application.

[0040] ​​In geophysical exploration, some plates require embedded sensors and circuit modules to achieve an ideal signal-to-noise ratio. In recent years, with the trend toward miniaturization and integration of instruments, many products have integrated more circuitry directly into the plates, enabling signal reception, conditioning, acquisition, and other functions within the plates, ultimately outputting digital signals.

[0041] As geological exploration and development progresses to deeper layers, the underground formation temperature is getting higher and higher. The underground temperature of oil development wells in some areas of Xinjiang exceeds 200°C. In recent years, the underground temperature of hot dry rock wells has even exceeded 250°C, posing a more severe challenge to the temperature resistance of geological exploration logging instruments.

[0042] Currently, logging pads lack any technology or measures to prevent external heat from entering the probe. A common approach in the industry is to improve the temperature performance of logging pads by selecting components and sensors with superior heat resistance. This approach can partially meet the requirement for short-term operation (30 minutes of continuous operation) in a 175°C environment. However, since the sensors and electronic circuit modules within the logging pads operate at their extreme temperatures, their lifespan is significantly shortened. The actual cumulative operating life at 175°C ranges from a few hours to more than ten hours. Therefore, in high-temperature wellbore environments, the instrument lifespan is significantly shortened, costs increase, and the success rate of installation is extremely low.

[0043] When the instrument is logging downhole, the temperature of the wellbore fluid rises rapidly. When the internal temperature of the plate rises rapidly, it exceeds the temperature rise that electronic components can withstand, causing direct physical damage to the components, open pins, and broken copper foil on the circuit board. When the internal temperature of the plate exceeds the maximum rated operating temperature of the circuit components, the circuit components will not operate normally or even suffer thermal breakdown. If the internal temperature of the plate does not reach the maximum rated temperature of the circuit components, but the circuit operates in a high temperature environment for a long time, the life of the components will decrease exponentially with the operating temperature, significantly reducing the life of the plate and its temperature resistance.

[0044] Currently, electrical imaging logging pads have a preamplifier and its signal processing circuit embedded directly within them. Density logging pads also have gamma-ray detectors and signal processing circuits embedded within them. The gamma-ray detectors, in particular, are significantly affected by temperature. Currently, no designs, products, or patents have been found that utilize thermal insulation technology to improve the temperature resistance of logging pads. This invention proposes a high-temperature logging pad based on vacuum insulation technology to address this issue.

[0045] The present invention provides the following preferred embodiments

[0046] Example 1

[0047] like Figure 1 As shown, a high-temperature logging plate based on vacuum insulation technology includes a base shell 1, a base vacuum layer 7 and a base liner 10. The base liner 10 is welded to the inside of the base shell 1, and a base vacuum layer 7 is formed between the base shell 1 and the base liner 10. The base is composed of the base shell 1, the base liner 10 and the base vacuum layer 7.

[0048] In this embodiment, Figure 1-2 As shown, in order to further improve the sealing effect of the base and the upper cover, an upper cover shell 2 is provided above the base shell 1, and an upper cover liner 11 is welded to the surface of the upper cover shell 2. A upper cover vacuum layer 6 is formed between the upper cover shell 2 and the upper cover liner 11. The upper cover is composed of the upper cover shell 2, the upper cover liner 11 and the upper cover vacuum layer 6. An upper cover sealing ring 4 is provided on the periphery of the upper cover shell 2. The upper cover shell 2 is also used to withstand the fluid pressure in the wellbore, and the base shell 1 is also used to withstand the fluid pressure in the wellbore; the front end of the base shell 1 is provided with a transmission channel for providing electrical signals to the plate sensor or circuit module 8, and a wire 9 is connected to the right side of the sensor or circuit module 8. The wire 9 can be used to establish an electrical connection between the plate and the outside, and a pressure plug 3 is provided on the right side of the base shell 1. A pressure plug 3 is provided, and a pressure plug sealing ring 5 is provided on the periphery of the pressure plug 3. The base, the upper cover and the pressure plug 3 are assembled together, and their joints are sealed by the upper cover sealing ring 4 and the pressure plug sealing ring 5 to form a sealed plate cavity 15.

[0049] Example 3

[0050] like Figure 1 As shown, a high-temperature logging plate based on vacuum insulation technology includes a base shell 1, a base vacuum layer 7 and a base liner 10. The base liner 10 is welded to the inside of the base shell 1, and a base vacuum layer 7 is formed between the base shell 1 and the base liner 10. The base is composed of the base shell 1, the base liner 10 and the base vacuum layer 7.

[0051] The difference between this embodiment and the above embodiment is that:

[0052] In this embodiment, Figure 1-4As shown, in order to further enhance the effect of reducing heat conduction, a wire channel 13 for placing the wire 9 is provided inside the base shell 1, and the wire channel 13 is filled with a heat insulator 12. The wire 9 passes through the wire channel 13 and is connected between the sensor or circuit module 8 and the pins on the pressure plug 3, thereby establishing an electrical connection between the plate and the outside. Since the thermal conductivity coefficient of the heat insulator 12 is extremely low, the heat insulator 12 can block the heat convection between the pressure plug 3 and the inner cavity 15 of the plate, thereby greatly reducing heat conduction. In this way, the entire plate cavity 15 except for the wire channel 13 is surrounded by the upper cover vacuum layer 6 and the base vacuum layer 7, and the wire channel 13 is also filled with the heat insulator 12, so that the entire plate is a thermos, and the external heat of the plate cannot enter the plate cavity 15 in the form of heat conduction and heat convection through the upper cover shell 2, the base shell 1, and the pressure plug 3. Low-emissivity materials and processes are used on the inner walls of the base shell 1 and the upper cover shell 2, that is, the surfaces of the base shell 1 and the upper cover shell 2 facing the base vacuum layer 7 and the upper cover vacuum layer 6 respectively, to reduce the emissivity of thermal radiation; and high-reflectivity, low-transmittance materials are used on the outer walls of the base liner 10 and the upper cover liner 11, that is, the side facing the vacuum layer, to increase the reflectivity of thermal radiation and reduce the thermal transmittance; the above-mentioned means are used to prevent the base shell from 1 and the base liner 10 and the upper cover shell 2 and the upper cover liner 11; although the heat convection and heat conduction paths of the external heat of the plate entering the plate cavity 15 are blocked by the vacuum layer, and the materials and processes with low emissivity and high emissivity are used to weaken the heat radiation force, some heat will still enter the plate cavity 15 by heat conduction through the metal at the junction of the plate base and the upper cover, and some heat will enter the interior by heat radiation through the vacuum layer, and heat will enter the plate cavity 15 by heat conduction and heat radiation through the insulation 12 of the wire channel 13. In addition, the sensor or circuit module 8 will also generate heat by itself. Therefore, in order to limit the temperature rise inside the plate cavity 15 to a certain target within a certain period of time, a heat absorber 14 is designed.

[0053] Example 4

[0054] like Figure 1 As shown, a high-temperature logging plate based on vacuum insulation technology includes a base shell 1, a base vacuum layer 7 and a base liner 10. The base liner 10 is welded to the inside of the base shell 1, and a base vacuum layer 7 is formed between the base shell 1 and the base liner 10. The base is composed of the base shell 1, the base liner 10 and the base vacuum layer 7.

[0055] The difference between this embodiment and the above embodiment is that:

[0056] In this embodiment, Figure 1-4As shown, in order to further improve the temperature stabilization effect, a heat absorber 14 is provided inside the base inner tank 10. The heat absorber 14 is made of a phase change constant temperature material, and the front end of the heat absorber 14 is connected to the circuit module 23; a plate cavity 15 is formed between the base inner tank 10 and the sensor or circuit module 8. A material with a high specific heat capacity can be used. After absorbing heat, the temperature rise is very small, so that the internal temperature of the plate remains relatively constant. The main purpose of the heat absorber 14 is to absorb the heat generated by the sensor or circuit module 8 in the plate during operation and the heat that enters from the outside of the plate and is transmitted to the plate cavity 15. The amount of phase-change constant temperature material in the heat absorber 14 determines its ability to limit the internal temperature rise. The specific implementation process of this patent needs to be determined through detailed calculations. The vacuum layer blocks the heat convection and heat conduction paths of the external heat of the plate entering the plate cavity 15. The use of materials and processes with low emissivity and high emissivity weakens the thermal radiation force. However, some heat will still enter the plate cavity 15 by heat conduction through the metal at the junction of the plate base and the upper cover, and some heat will enter the interior by heat radiation through the vacuum layer. Heat enters the plate cavity 15 by heat conduction and heat radiation through the insulation 12 of the wire channel 13. In addition, the sensor or circuit module 8 will also generate heat itself. Therefore, in order to limit the temperature rise inside the plate cavity 15 to a certain target within a certain period of time, the heat absorber 14 is designed.

[0057] In this embodiment, Figure 2-7 As shown, in order to further improve the convenience of use, the surface of the electrode body 18 is provided with an electrode array 20, and the surface of the electrode array 20 is provided with an electrode array sealing ring 19. The electrode body 18 includes a electrode body vacuum layer 22, and also includes a pressure-bearing socket. The pressure-bearing socket is equipped with an electrical connection socket, the pressure-bearing socket is connected to the heat insulator 24, the heat insulator 24 is connected to the heat absorber 14, the surface of the heat absorber 14 is connected with a long source distance detector and a circuit 26, and the long source distance detector and the circuit 26 are connected to the pressure plug sealing ring 5; a vacuum insulation bottle 25 is provided on the outside of the pressure socket, the heat insulator 24, the long source distance detector and the circuit 26 and the pressure plug sealing ring 5, and the outside of the vacuum insulation bottle 25 is connected to the probe housing 27, the heat insulator 24 is made of a low thermal conductivity material; the vacuum insulation bottle 25 is independent of the housing, and its inner and outer walls are relatively thin, occupying less space, and does not need to withstand the pressure of the external wellbore fluid.

[0058] The specific working process of the present invention is as follows:

[0059] According to the Stefan-Boltzmann law, we first calculate the thermal radiation force of the ideal black body of the high-temperature plate to the plate cavity:

[0060]

[0061] In formula (1), Eb is the thermal radiation force of a black body at a certain temperature, unit: W / m 2 ;

[0062] σ b is the radiation constant of the black body, σ b =5.67×10 -8 (W / m 2 ·K 4 );

[0063] T is the thermodynamic temperature of the black body, in K;

[0064] c b It is called the blackbody radiation coefficient, c b =5.67(W / m 2 ·K 4 )

[0065] According to the emissivity of the material used for the plate, the thermal radiation force of the plate can be calculated by formula (2):

[0066] E=εE b -----(2)

[0067] In formula (2), E is the actual plate thermal radiation force, unit: W / m 2 ;

[0068] ε is the emissivity of the inner wall of the base 1 and the upper cover 2;

[0069] Through formula (3), the thermal radiation power can be obtained.

[0070] P1=E·S·ρ----(3)

[0071] In formula (3), S is the actual heat radiation area of ​​the plate, unit: m 2 ;

[0072] P1 is the thermal radiation power, unit: W;

[0073] ρ is the reflectivity of the outer surface of the upper cover inner liner and the base inner liner.

[0074] Emissivity and reflectivity are not only related to the material, but also to the surface condition of the material. Therefore, if the plate cavity includes radiation surfaces of different materials and processes, their thermal radiation power should be calculated separately, and finally the radiation power components are accumulated to the total thermal radiation power P through formula (4). r .

[0075] P r =P1+P2+...+P N ----(4)

[0076] 2.2 Calculation of heat conduction power

[0077]

[0078] In formula (5), P t1 is the heat conduction power, unit: W;

[0079] λ is the thermal conductivity of the material;

[0080] a is the cross-sectional area of ​​the heat conducting material;

[0081] T DIFF is the temperature difference between the two ends of the heat conduction path;

[0082] L is the length of the heat conduction path.

[0083] Similarly, if there are multiple conduction paths, they should be calculated separately and then accumulated. The total heat conduction power is:

[0084] P t =P t1 +P t2 +...+P tN -----(6)

[0085] Then, the sum of the heat transfer power between the outside and inside of the plate plus the heat generation power of the circuit module inside the plate is:

[0086] P=P r +P t +P e P=P r +P t +P e -----(7)

[0087] In formula (7), P e is the heating power of the circuit module, unit: W;

[0088] P is the total thermal power.

[0089] 2.3 Calculate the weight of the heat absorber

[0090] According to the technical indicators of the high-temperature plate design, the total heat transferred from the outside of the plate to the inside of the plate during its operation is calculated:

[0091] Q=P·t diff ----(8)

[0092] In formula (8), Q is heat, unit is J (joule);

[0093] t diff is the working time, unit: second;

[0094] P is the total heat transfer power, unit: W;

[0095] The total amount of heat that the heat absorber can absorb within the allowable temperature range must be greater than the total amount of heat Q that is input, so:

[0096] c·m·ΔT≥Q-----(9)

[0097] In formula (9), Q is the total heat transferred to the inside of the plate during the working time, unit J (joule);

[0098] ΔT is the phase change temperature difference of the heat absorber, which is the difference between the target temperature of the heat absorber and the temperature before operation;

[0099] c is the specific heat capacity of the heat absorber material, unit: J / kg;

[0100] m is the mass of the heat absorber;

[0101] After formula (9) is sorted out, the mass of the heat absorber can be obtained:

[0102]

[0103] Through the above calculation, we can get m. If this patent is at temperature T, working t diff If the internal temperature rise does not exceed ΔT within a certain time, the mass of the heat absorber must be greater than m. Through vacuum insulation technology, the logging plate can operate in a 200°C downhole fluid environment for more than 10 hours without exceeding 150°C internal temperature, and the sensor-circuit module embedded in the plate can function normally.

[0104] To further illustrate the working principle of the present invention

[0105] like Figure 5The figure shows a schematic diagram of the structure of a high-temperature electro-imaging plate, in which the plate body 18 and the plug 16 are assembled together to form the plate cavity 15, and the plate body 18 and the plug 16 are sealed by the plug sealing ring 17. A wiring hole is provided at one end of the plate body 18, through which the wire 9 establishes an electrical connection with the pressure-bearing plug 3 and the electrode array 20. The wiring hole is filled with a heat insulator 12 to block heat convection between the plate cavity 15 and the plate cavity 15, thereby weakening heat conduction. The plate body vacuum layer 22 on the plate body 18 and the plug vacuum layer 21 on the plug block heat from entering the plate cavity 15 by heat conduction and heat convection; at the same time, the inner surfaces of the plate body vacuum layer 22 and the plug vacuum layer 21 are made of low-emissivity and high-reflectivity materials and processes, respectively, to reduce the heat from the outside of the plate from entering the plate cavity 15 by heat radiation through the vacuum layer. A heat absorber 14 and a circuit module 23 are installed in the inner cavity 15 of the electrode plate. The heat absorber 14 is equipped with a phase-change constant temperature material with a high specific heat capacity. It absorbs the heat generated during the operation of the circuit module 23 itself and the heat that enters the interior of the electrode plate through the vacuum layer and the thermal insulator 12, thereby slowing down the temperature rise in the inner cavity 15 of the electrode plate and ensuring that the electro-imaging high-temperature electrode plate can operate in an environment above 200°C for 10 hours, and the temperature rise inside is within the design indicators.

[0106] The specific mass of the phase change constant temperature material in the heat absorber 14 needs to be calculated according to the algorithm described in this patent.

[0107] like Figure 6-7 As shown, it is a density measurement plate, in which a pressure socket, an insulator 24, a heat absorber 14, a long source distance detector and circuit 26, and a short source distance detector and circuit 5 are assembled together and placed in a vacuum thermos 25, which is then placed as a whole in a probe housing 27 to form a high-temperature density plate. The probe housing 27 provides mechanical protection for the plate, withstands the wellbore fluid pressure, and is sealed with the pressure socket by a sealing ring. The vacuum thermos 25 can block the external heat of the plate from penetrating the vacuum layer and entering the interior of the thermos by heat conduction and heat convection. By adopting special processes and materials, the external heat is weakened and enters the interior of the thermos in the form of heat radiation. The insulator 24 is used to prevent external heat from entering the inner cavity of the vacuum thermos 25 by heat convection. The heat entering through the pressure socket can only enter by heat radiation and heat conduction. The thermal conductivity coefficient of the insulator 24 is extremely low, so it can limit the transfer of heat. Heat absorber 14, filled with a phase-change constant-temperature material with a high specific heat capacity, absorbs heat entering the thermos flask and generated by the short-range detector and circuit 5, and the long-range detector and circuit 26, with minimal temperature rise. These measures ensure that the density plate operates within design specifications for 10 hours in an environment above 200°C.

[0108] The above is the working process of the entire device, and the contents not described in detail in this specification belong to the existing technology known to professional and technical personnel in this field.

[0109] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A high-temperature logging pad based on vacuum insulation technology, comprising a base shell (1), a base vacuum layer (7) and a base liner (10), wherein the base liner (10) is welded inside the base shell (1), and a base vacuum layer (7) is formed between the base shell (1) and the base liner (10). The base is composed of the base shell (1), the base liner (10) and the base vacuum layer (7). An upper cover shell (2) is provided above the base shell (1), an upper cover liner (11) is welded to the surface of the upper cover shell (2), an upper cover vacuum layer (6) is formed between the upper cover shell (2) and the upper cover liner (11), and the upper cover is composed of the upper cover shell (2), the upper cover liner (11) and the upper cover vacuum layer (6). The front end of the base shell (1) is provided with a transmission channel for providing an electrical signal to the plate sensor or circuit module (8), the right side of the base shell (1) is provided with a pressure-bearing plug (3), and a plate cavity (15) is formed between the base liner (10) and the sensor or circuit module (8). A heat absorber (14) is provided inside the base liner (10), and the mass m of the heat absorber (14) satisfies m≥Q / (c·ΔT), wherein Q is the total heat transferred to the inside of the plate during the working time, c is the specific heat capacity of the heat absorber (14), and ΔT is the difference between the target temperature of the heat absorber (14) and the temperature before working.

2. The high-temperature logging plate based on vacuum insulation technology according to claim 1, characterized in that: A wire channel (13) for placing a wire (9) is provided inside the base shell (1), the wire channel (13) is filled with a heat insulator (12), and the wire (9) passes through the wire channel (13) and is connected to a pin on a sensor or circuit module (8) and a pressure plug (3).

3. A high-temperature logging plate based on vacuum insulation technology, characterized by: The invention comprises a plug (16) and a plate body (18), wherein the plug (16) comprises a plug vacuum layer (21), a plug sealing ring (17) for sealing the plate body (18) is arranged on the periphery of the plug (16), and the plate body (18) comprises a plate body vacuum layer (22), the plug (16) and the plate body (18) are assembled together to form a plate cavity (15), a heat absorber (14) and a circuit module (23) are installed in the plate cavity (15), an electrode array (20) is arranged on the surface of the plate body (18), and the mass m of the heat absorber (14) satisfies m≥Q / (c·ΔT), wherein Q is the total heat transferred to the inside of the plate during the working time, c is the specific heat capacity of the heat absorber (14), and ΔT is the difference between the target temperature of the heat absorber (14) and the temperature before working.

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