A vacuum semiconductor chip transfer box

Abstract

This invention relates to a vacuum semiconductor chip transfer box, primarily addressing the risks associated with existing transfer fixtures, such as uncontrollable adhesive adhesion, easy adhesive detachment leading to chip fixation failure; subsequent processes requiring chip cleaning and adhesive removal reduce production efficiency, increase production costs, and pollute the environment; and the adhesive's cleanliness and viscosity decrease after contact with atmospheric dust, rendering the transfer fixture a disposable item and causing resource waste. The box includes a box body, a lid, a sealing device, and spacers. The box body comprises a base plate and side plates; the base plate has multiple connecting vents and mounting holes on its underside, all of which communicate with the mounting holes; multiple support pillars are located on the inner side of the base plate, with air channels between adjacent support pillars, and the connecting vents communicating with the air channels; the spacers abut against the support pillars, are connected to the side plates around their perimeter, and have multiple placement compartments; the spacers also have multiple ventilation holes.

Description

Technical Field

[0001] This invention relates to a chip transfer box, specifically a vacuum semiconductor chip transfer box. Background Technology

[0002] After the chips are manufactured, they need to be loaded into transport fixtures and transported to relevant workshops and downstream manufacturers for further processing. During the transport process, the chips need to be sealed to prevent dust from getting on them and affecting further processing. The chips also need to be fixed to prevent damage caused by bumps during transport.

[0003] Existing transfer fixtures typically use adhesive to fix chips, which has the following drawbacks: First, the adhesive strength is determined by the type of adhesive and is uncontrollable, posing a risk of chip fixation failure due to adhesive detachment. Second, subsequent processes require cleaning and removing the adhesive from the chips, leading to reduced production efficiency, increased production costs, and environmental pollution. Third, the adhesive's cleanliness and adhesion decrease after contact with atmospheric dust, rendering the transfer fixtures disposable and resulting in resource waste. Summary of the Invention

[0004] The purpose of this invention is to address the technical problems of existing transfer tooling, which typically uses adhesive to fix chips. These problems include uncontrollable adhesive force, easy delamination leading to chip fixation failure, subsequent cleaning and adhesive removal of the chips, reduced production efficiency, increased production costs, and environmental pollution, and the reduced cleanliness and viscosity of the adhesive after contact with atmospheric dust, rendering the transfer tooling disposable and causing resource waste. The invention provides a vacuum semiconductor chip transfer box.

[0005] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0006] A vacuum semiconductor chip transfer box, characterized in that it includes a box body, a box cover, a sealing device, and a spacer that is adapted to the internal size of the box body.

[0007] The box body includes a bottom plate and side plates extending from the periphery of the bottom plate in a direction away from the surface of the bottom plate; the box lid closes onto the side plates;

[0008] The base plate is provided with multiple connecting air holes, and the lower side of the base plate is provided with mounting holes. One end of each of the multiple connecting air holes is connected to the mounting hole. The sealing device is installed in the mounting hole and is used to control the opening and closing of the mounting hole and the connecting air holes.

[0009] The inner side of the base plate is provided with multiple support columns, and a first gap is provided between adjacent support columns. The first gap is an air passage for guiding air, and the other end of the multiple connecting air holes is connected to the air passage.

[0010] One side of the septum abuts against the end face of the support column, and the septum is sealed to the inner wall of the side plate on all four sides. The other side of the septum is provided with multiple placement compartments that are adapted to the size of the chip to be transferred, for placing the chip to be transferred or a substitute adapted to the size of the chip. The septum is provided with multiple ventilation holes, and each placement compartment corresponds to at least one ventilation hole. The ventilation holes are used to communicate with the air passage when the septum abuts against the support column.

[0011] Furthermore, multiple support columns are arranged in an array, and the air passage is arranged along the length direction of the base plate or along the width direction of the base plate;

[0012] The air passages arranged along the length of the base plate intersect with the air passages arranged along the width of the base plate.

[0013] Furthermore, the cross-sectional shape of the support column along its radial direction is rectangular.

[0014] Furthermore, multiple placement grids are arranged in an array, with a second gap between adjacent placement grids;

[0015] A reinforcing rib is provided at the second gap position.

[0016] Furthermore, the spacer is provided with reinforcing keels around its perimeter, and the spacer is sealed to the inner wall of the base plate through the reinforcing keels.

[0017] Furthermore, the sealing device includes a sealing nozzle and a sealing plug;

[0018] The sealing nozzle is installed in the mounting hole. An air suction hole is provided at the center of the end face of the sealing nozzle. The sealing nozzle is also provided with multiple air guide holes. The multiple air guide holes are arranged one-to-one with multiple connecting air holes. One end of the air guide hole is connected to the connecting air hole and the other end is connected to the air suction hole.

[0019] Define the side of the sealing device closest to the lid as the upper side and the side furthest from the lid as the lower side;

[0020] The lower side of the sealing plug abuts against the upper side of the sealing nozzle. A boss that matches the air intake hole is provided at the center of the lower side of the sealing plug. The boss is connected to the air intake hole and is used to lift the boss by an external tip to control the opening and closing of the air intake hole.

[0021] Furthermore, the other end of the air guide hole is opened on the upper surface of the sealing nozzle, and the lower side of the sealing plug is used to abut against the upper side of the sealing nozzle to control the opening and closing of the air guide hole and the air intake hole.

[0022] Furthermore, the air intake hole is a threaded hole;

[0023] The sealing device also includes a sealing bolt adapted to the air intake hole; a sealing ring is fitted on the sealing bolt, the sealing ring is connected to the upper side of the nut in the sealing bolt, the upper end of the sealing bolt is connected to the air intake hole, and the upper side of the sealing ring abuts against the lower side of the sealing nozzle.

[0024] Furthermore, there are four connecting vents and four guiding vents, which are respectively located at four different positions around the mounting hole.

[0025] Furthermore, the outer side of the side plate is provided with a snap-fit ​​protrusion, and the box cover is provided with a snap-fit ​​groove that matches the snap-fit ​​protrusion, and the snap-fit ​​protrusion and the snap-fit ​​groove are connected.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] 1. This invention connects the internal and external environments of the housing through a series of ventilation holes, air channels, and connecting air holes, and controls the flow between the housing and the external environment through a sealing device. An external vacuum device can be used to evacuate the contact surfaces between the chip to be transferred and the spacer. The vacuum pressure value can be preset according to different chip specifications to meet the adsorption and fixation needs of chips of different sizes. The vacuum effect can be removed when needed, facilitating chip removal. The chip is adsorbed through physical vacuum adsorption, eliminating the need for cleaning and adhesive removal, thus improving work efficiency and reducing production costs. Furthermore, the spacer can be reused after being cleaned and dust-removed from its contaminated state.

[0028] 2. By placing the vent at the cross intersection of the air passage, the present invention can increase the air intake and exhaust volume of the vent, thereby improving the vacuuming efficiency.

[0029] 3. By setting multiple reinforcing ribs and reinforcing keel on the septum, the present invention can effectively enhance the bending resistance of the septum and prevent deformation within a certain air pressure range, thus avoiding the failure of vacuum adsorption due to septum deformation.

[0030] 4. This invention controls the flow between the inside and outside environment of the box by using a combination of a sealing nozzle and a sealing plug. This not only facilitates the vacuuming between the chip and the spacer by using an external vacuuming device, but also maintains a sufficient sealing effect after the vacuuming operation is completed, thereby maintaining the vacuum effect between the chip and the spacer.

[0031] 5. The sealing bolts provided in this invention can further improve the sealing effect of the sealing device, which helps to maintain the vacuum effect between the chip and the spacer for a long time. Attached Figure Description

[0032] Figure 1 This is a cross-sectional view of an embodiment of a vacuum semiconductor chip transport box according to the present invention;

[0033] Figure 2 This is a schematic diagram of the structure of the box body in an embodiment of the vacuum semiconductor chip transfer box of the present invention;

[0034] Figure 3 This is a schematic diagram of the structure of the lid in an embodiment of a vacuum semiconductor chip transfer box according to the present invention;

[0035] Figure 4 This is a schematic diagram of the structure of the spacer in an embodiment of a vacuum semiconductor chip transport box according to the present invention;

[0036] Figure 5 This is a schematic diagram of the structure of the sealing nozzle in an embodiment of a vacuum semiconductor chip transfer box according to the present invention;

[0037] Figure 6 This is a schematic diagram of the structure of the sealing plug in an embodiment of a vacuum semiconductor chip transport box according to the present invention;

[0038] Figure 7 yes Figure 6 AA section view;

[0039] Figure 8 This is a schematic diagram of the sealing bolt structure in an embodiment of a vacuum semiconductor chip transfer box according to the present invention.

[0040] In the picture:

[0041] 1-Box body, 2-Box lid;

[0042] 3-Sealing device, 31-Sealing nozzle, 311-Suction hole, 312-Guide hole, 32-Sealing plug, 33-Sealing bolt;

[0043] 4-Spacing pad, 41-Placement compartment, 42-Ventilation hole, 43-Reinforcing rib, 44-Reinforcing keel;

[0044] 5-Connecting air hole, 6-Mounting hole, 7-Support column, 8-Air passage, 9-Boss, 10-Snap-fit ​​groove, 11-Snap-fit ​​protrusion. Detailed Implementation

[0045] To make the objectives, advantages, and features of the present invention clearer, the following detailed description of a vacuum semiconductor chip transfer box proposed by the present invention, in conjunction with the accompanying drawings and specific embodiments, will further illustrate these points. The advantages and features of the present invention will become clearer according to the following specific embodiments. It should be noted that the accompanying drawings are all in a very simplified form and use non-precise proportions, and are only used to conveniently and clearly assist in illustrating the objectives of the embodiments of the present invention; furthermore, the structures shown in the drawings are often part of the actual structures.

[0046] like Figures 1-8 As shown, the present invention provides a vacuum semiconductor chip transfer box, comprising a box body 1, a box cover 2, a sealing device 3, and a spacer 4 adapted to the internal size of the box body 1; wherein the box body 1, the box cover 2, the sealing device 3 and the spacer 4 are made of dust-free materials such as silicone, plastic, ceramic or metal, and the contact surface with the chip to be transferred is sufficiently smooth to maintain vacuum suction for a long time.

[0047] like Figure 2 and Figure 3 As shown, the box body 1 includes a rectangular base plate and side plates extending from the periphery of the base plate away from the surface of the base plate; the outer side of the side plate is provided with a snap-fit ​​protrusion 11, and the box cover 2 is provided with a snap-fit ​​groove 10 that matches the snap-fit ​​protrusion 11. When the box cover 2 is closed on the side plate, the snap-fit ​​protrusion 11 and the snap-fit ​​groove 10 are connected to form a snap-fit ​​structure, thereby preventing the box cover 2 from being opened unexpectedly during transportation, causing chip contamination inside the box body 1.

[0048] The base plate is provided with multiple connecting air holes 5, and an installation hole 6 is opened at the center of the lower side of the base plate. One end of each of the multiple connecting air holes 5 is connected to the installation hole 6. Multiple support columns 7 are provided on the inner side of the base plate. The cross-sectional shape of the support column 7 along its radial direction is rectangular, and the cross-sectional size is equal to that of the placement grid 41. The multiple support columns 7 are arranged in an array, and a first gap is provided between adjacent support columns 7. The first gap is an air passage 8 for guiding air. Multiple air passages 8 are formed between the side walls of the support columns 7 along the length direction of the base plate and multiple air passages 8 along the width direction of the base plate. The air passages 8 along the length direction of the base plate and the air passages 8 along the width direction of the base plate intersect each other.

[0049] One side of the spacer 4 abuts against the end face of the support column 7, such as... Figure 4As shown, the other side of the spacer 4 is provided with a plurality of placement slots 41 adapted to the size of the chip, for placing the chip or a substitute adapted to the size of the chip; the spacer 4 is provided with a plurality of vent holes 42, and each placement slot 41 corresponds to at least one vent hole 42, the vent holes 42 being used to communicate with the air passage 8 when the spacer 4 abuts against the support post 7; in this embodiment, each placement slot 41 corresponds to one vent hole 42 for illustration. In other embodiments of the present invention, depending on the size of the chip, for example, placing wafers or other larger-sized chips... For large semiconductor objects, the size of the placement grid 41 can be designed to be larger. In order to achieve a better adsorption effect, multiple ventilation holes 42 can be set within a placement grid 41. In order to prevent the spacer 4 from deforming during vacuuming and thus reducing the adsorption effect, a reinforcing rib 44 is set around the spacer 4. The spacer 4 is glued to the inner wall of the base plate through the reinforcing rib 44. Multiple placement grids 41 are arranged in an array, and a second gap is set between adjacent placement grids 41. A reinforcing rib 43 is set at the position of the second gap.

[0050] like Figure 1 As shown, the sealing device 3 is installed in the mounting hole 6 to control the opening and closing of the connecting air hole 5 and the mounting hole 6; the side of the sealing device 3 closer to the cover 2 is defined as the upper side, and the side farther from the cover 2 is defined as the lower side; the sealing device 3 includes a sealing nozzle 31, a sealing plug 32, and a sealing bolt 33; the sealing nozzle 31 is installed in the mounting hole 6, as shown... Figure 5 As shown, a suction hole 311 is provided at the center of the end face of the sealing nozzle 31 along the vertical direction. Multiple air guide holes 312 are also provided on the sealing nozzle 31, each corresponding to a multiple connecting air hole 5. One end of each air guide hole 312 communicates with a connecting air hole 5, and the other end of each air guide hole 312 is located on the upper surface of the sealing nozzle 31 and communicates with the suction hole 311. The lower side of the sealing plug 32 is used to abut against the upper side of the sealing nozzle 31 to control the passage between the air guide hole 312 and the suction hole 311. Figure 6 and Figure 7 As shown, a boss 9, adapted to the suction hole 311, is provided at the lower center of the sealing plug 32. The boss 9 is connected inside the suction hole 311 and is used to control the opening and closing of the suction hole 311 by lifting the boss 9 with an external center. Specifically, the boss 9 has a frustum structure, and the diameter of the boss 9 gradually decreases from top to bottom. The maximum diameter of the boss 9 is adapted to the inner wall of the suction hole 311, which not only meets the sealing requirements but also facilitates the fit between the boss 9 and the suction hole 311. To achieve a durable seal, the suction hole 311 is a threaded hole, and the sealing bolt 33 is adapted to the suction hole 311. Figure 8 As shown, a sealing ring is fitted on the sealing bolt 33. The sealing ring is connected to the upper side of the nut in the sealing bolt 33 by glue. The upper end of the sealing bolt 33 is connected to the air intake hole 311, and the upper side of the sealing ring abuts against the lower side of the sealing nozzle 31.

[0051] In a preferred embodiment of the present invention, the number of connecting air holes 5 and air guide holes 312 is set to four. The four connecting air holes 5 and the four air guide holes 312 are respectively arranged in four different positions around the mounting hole 6, which can not only achieve faster air extraction efficiency, but also reduce the machining difficulty.

[0052] In use, place the chip to be transported or a chip substitute in the placement compartment 41, ensuring that each compartment 41 contains a chip or chip substitute; close the lid 2, remove the sealing bolt 33, and use the external tip to lift the protrusion 9, so that the suction port 311, the air guide port 312, the connecting air port 5, the air channel 8, and the vent 42 are connected in sequence. Place the vacuum pipe of the external vacuum device into the suction port 311, and extract the air between the chip and the spacer 4 according to the preset vacuum pressure. After reaching the preset vacuum pressure, remove the external tip, so that the sealing plug 32 abuts against the upper side of the sealing nozzle 31 under the action of gravity and vacuum pressure, and the protrusion 9 is placed inside the suction port 311, so that a vacuum is maintained between the chip and the spacer 4, achieving the adsorption and fixation effect; finally, remove the external vacuum device and connect the sealing bolt 33 into the suction port 311.

Claims

1. A vacuum semiconductor chip transfer cassette, characterized by: The utility model relates to a chip transport box, including box body (1), box cover (2), sealing device (3) and the spacer (4) with the inside size of box body (1) are adapted, The box body (1) includes a bottom plate and side plates extending from the periphery of the bottom plate in a direction away from the surface of the bottom plate; the box cover (2) covers the side plates; A plurality of connecting air holes (5) are arranged on the bottom plate, and a mounting hole (6) is arranged on the lower side of the bottom plate; one end of each of the plurality of connecting air holes (5) is in communication with the mounting hole (6); the sealing device (3) is mounted in the mounting hole (6) and is used for controlling the opening and closing of the mounting hole (6) and the connecting air holes (5); A plurality of support columns (7) are arranged on the inner side of the bottom plate, and a first gap is arranged between adjacent support columns (7), the first gap being an air passage (8) for guiding air; the other end of each of the plurality of connecting air holes (5) is in communication with the air passage (8); One side of the spacer (4) abuts against the end face of the support column (7), the spacer (4) is sealingly connected to the inner wall of the side plate around the spacer (4), and the other side of the spacer (4) is provided with a plurality of placement compartments (41) adapted to the size of the chip to be transported and used for placing the chip to be transported or a substitute having a size adapted to the chip; a plurality of air holes (42) are arranged on the spacer (4), each placement compartment (41) corresponds to at least one air hole (42), and the air hole (42) is used for communication with the air passage (8) when the spacer (4) abuts against the support column (7); The sealing device (3) includes a sealing suction nozzle (31) and a sealing plug (32); The sealing suction nozzle (31) is mounted in the mounting hole (6), an air suction hole (311) is arranged at the center of the end face of the sealing suction nozzle (31), a plurality of air guide holes (312) are arranged on the sealing suction nozzle (31), and one end of each of the plurality of air guide holes (312) is in communication with the connecting air hole (5) and the other end is in communication with the air suction hole (311); The side of the sealing device (3) close to the box cover (2) is defined as the upper side, and the side of the sealing device (3) away from the box cover (2) is defined as the lower side; The lower side of the sealing plug (32) abuts against the upper side of the sealing suction nozzle (31), a boss (9) adapted to the air suction hole (311) is arranged at the center of the lower side of the sealing plug (32), the boss (9) is connected to the air suction hole (311), and the boss (9) is used for controlling the opening and closing of the air suction hole (311) by an external center.

2. The vacuum semiconductor chip transfer box according to claim 1, characterized in that: The plurality of support columns (7) are arranged in an array, the air passage (8) is arranged along the length direction of the bottom plate, or the air passage (8) is arranged along the width direction of the bottom plate; The air passage (8) arranged along the length direction of the bottom plate and the air passage (8) arranged along the width direction of the bottom plate are cross-shaped.

3. The vacuum semiconductor chip transfer box according to claim 2, characterized in that: The cross-sectional shape of the support column (7) along the radial direction thereof is rectangular.

4. The vacuum semiconductor chip transfer box according to claim 3, characterized in that: The plurality of placement compartments (41) are arranged in an array, and a second gap is arranged between adjacent placement compartments (41); A reinforcing rib (43) is arranged at the second gap.

5. The vacuum semiconductor chip transfer box according to claim 4, characterized in that: The spacer (4) is sealingly connected to the inner wall of the bottom plate through the reinforcing keel (44).

6. The vacuum semiconductor chip transfer box according to any one of claims 1 to 5, characterized in that: The other end of the air guide hole (312) is opened on the upper surface of the sealing nozzle (31), and the lower side of the sealing plug (32) is used to abut on the upper side of the sealing nozzle (31) to control the opening and closing of the air guide hole (312) and the air inlet hole (311).

7. The vacuum semiconductor chip transfer box according to claim 6, characterized in that: The air inlet hole (311) is a threaded hole; The sealing device (3) further comprises a sealing bolt (33) matched with the air inlet hole (311); a sealing ring is sleeved on the sealing bolt (33), the sealing ring is connected to the upper side of the nut in the sealing bolt (33), the upper end of the sealing bolt (33) is connected to the air inlet hole (311), and the upper side of the sealing ring abuts on the lower side of the sealing nozzle (31).

8. The vacuum semiconductor chip transfer box according to claim 7, characterized in that: The number of the connecting air holes (5) and the air guide holes (312) is four, and the four connecting air holes (5) and the four air guide holes (312) are arranged at four different positions around the mounting hole (6).

9. The vacuum semiconductor chip transfer box according to claim 8, characterized in that: The outer side of the side plate is provided with a clamping protrusion (11), the box cover (2) is provided with a clamping groove (10) matched with the clamping protrusion (11), and the clamping protrusion (11) is connected with the clamping groove (10).

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