Display module and display device

Abstract

Embodiments of the present application provide a display module and a display device. The display module comprises a flexible circuit board and a display panel. The flexible circuit board and the display panel are connected in a binding mode. The flexible circuit board comprises a substrate layer and a conductive layer arranged in a stacking mode. The conductive layer comprises a first grounding part and a second grounding part arranged in a spaced mode. One end of the flexible circuit board is provided with a connecting structure. The connecting structure comprises at least an electrostatic input end. The electrostatic input end is electrically connected with the second grounding part. The first grounding part is electrically connected with a grounding wire in the display panel. The embodiments of the present application can reduce the amount of electrostatic entering the display panel, and realize electrostatic protection for the display panel.

Description

TECHNICAL FIELD

[0001] The present application belongs to the technical field of display, and particularly relates to a display module and a display device. BACKGROUND

[0002] With the development of display technology, display modules are increasingly widely used in people's production and life. For example, a display module can include a display panel and a flexible printed circuit (FPC) and the like. However, static electricity generated during the production and / or use of the display module is easy to damage electronic devices in the display panel. SUMMARY

[0003] Embodiments of the present application provide a touch display module and a touch display device, which can solve the problem that electronic devices in the display panel have been damaged by static electricity.

[0004] In a first aspect, embodiments of the present application provide a display module, which includes a flexible printed circuit and a display panel. The flexible printed circuit and the display panel are connected in a binding manner. The flexible printed circuit includes a substrate layer and a conductive layer arranged in a stack. The conductive layer includes a first grounding portion and a second grounding portion arranged at intervals. One end of the flexible printed circuit is provided with a connecting structure. The connecting structure includes at least a static electricity input end. The static electricity input end is electrically connected to the second grounding portion. The first grounding portion is electrically connected to a grounding line in the display panel.

[0005] According to the embodiments of the first aspect of the present application, the flexible printed circuit is further provided with a static electricity absorbing element. The static electricity input end is electrically connected to the static electricity absorbing element through the second grounding portion. The static electricity absorbing element is used to absorb static electricity.

[0006] In this way, in addition to the second grounding portion itself consuming static electricity on the grounding end and the second grounding portion, the static electricity on the grounding end and the second grounding portion is further dissipated through the static electricity absorbing element. In this way, by dissipating static electricity through the static electricity absorbing element, the amount of static electricity in the flexible printed circuit can be greatly reduced.

[0007] According to any one of the preceding embodiments of the first aspect of the present application, a first end of the static electricity absorbing element is electrically connected to the second grounding portion. A second end of the static electricity absorbing element is electrically connected to the first grounding portion.

[0008] In this way, a static electricity release loop can be formed to guide residual static electricity in the static electricity absorbing element to the first grounding portion, effectively avoiding the accumulation of static electricity in the static electricity absorbing element.

[0009] According to any one of the preceding embodiments of the first aspect of the present application, the impedance of the second grounding portion is greater than the impedance of the first grounding portion.

[0010] Therefore, the impedance of the second grounding portion can be relatively large, so that the static electricity entering the second grounding portion can be better consumed, and the static electricity of the flexible circuit board can be reduced.

[0011] According to any one of the foregoing embodiments of the first aspect of the present application, the cross-sectional area of the second grounding portion is smaller than the cross-sectional area of the first grounding portion.

[0012] Therefore, since the cross-sectional area of the second grounding portion is smaller than the cross-sectional area of the first grounding portion, the impedance of the second grounding portion can be relatively large, so that the static electricity entering the second grounding portion can be better consumed, and the static electricity of the flexible circuit board can be reduced.

[0013] According to any one of the foregoing embodiments of the first aspect of the present application, along the same straight line, the width of the second grounding portion is smaller than the width of the first grounding portion.

[0014] Therefore, since the width of the second grounding portion is smaller than the width of the first grounding portion along the same straight line, the impedance of the second grounding portion can be relatively large, so that the static electricity entering the second grounding portion can be better consumed, and the static electricity of the flexible circuit board can be reduced.

[0015] According to any one of the foregoing embodiments of the first aspect of the present application, the second grounding portion comprises a conductive trace.

[0016] Therefore, since the second grounding portion adopts a conductive trace and has a relatively thin width, the impedance of the second grounding portion can be increased, so that the static electricity entering the second grounding portion can be better consumed, and the static electricity of the flexible circuit board can be reduced.

[0017] According to any one of the foregoing embodiments of the first aspect of the present application, along the thickness direction of the flexible circuit board, the area of the orthographic projection of the first grounding portion on the substrate layer is larger than the area of the orthographic projection of the second grounding portion on the substrate layer.

[0018] According to any one of the foregoing embodiments of the first aspect of the present application, the static electricity absorbing element comprises an inductor, a first end of the inductor is electrically connected to the second grounding portion, and a second end of the inductor is electrically connected to the first grounding portion; or the static electricity absorbing element comprises a magnetic bead, a first end of the magnetic bead is electrically connected to the second grounding portion, and a second end of the magnetic bead is electrically connected to the first grounding portion.

[0019] Therefore, on one hand, the inductor can generate a counter electromotive force to offset most or all of the static electricity; on the other hand, since the potential of the first grounding portion is relatively low, the inductor can guide the residual static electricity of the second grounding portion to the first grounding portion. On one hand, the magnetic bead can generate a counter electromotive force to offset most or all of the static electricity; on the other hand, since the potential of the first grounding portion is relatively low, the magnetic bead can guide the residual static electricity of the second grounding portion to the first grounding portion.

[0020] According to any one of the foregoing embodiments of the first aspect of the present application, the display module comprises a touch display module, and the display panel comprises a touch display panel.

[0021] According to any one of the foregoing embodiments of the first aspect of the present application, the flexible circuit board further comprises an insulating protective layer, the insulating protective layer is located on a side of the conductive layer away from the substrate layer along the thickness direction of the flexible circuit board, and the insulating protective layer covers the conductive layer; the insulating protective layer is provided with a windowed region, the windowed region exposes a conductive part located on the conductive layer, and the conductive part is insulated from the first grounding part; the conductive part is electrically connected to the second grounding part, or the conductive layer is further provided with a third grounding part, the first grounding part is arranged apart from the third grounding part, and the conductive part is electrically connected to the third grounding part.

[0022] In this way, the static electricity on the conductive part of the windowed region can be consumed through the second grounding part or the third grounding part, thereby reducing the static electricity on the conductive part of the windowed region.

[0023] According to any one of the foregoing embodiments of the first aspect of the present application, the third grounding part is electrically connected to the first end of the electrostatic absorption element, and the second end of the electrostatic absorption element is electrically connected to the first grounding part.

[0024] In this way, the static electricity on the conductive part of the windowed region can be further absorbed or released through the electrostatic absorption element.

[0025] According to any one of the foregoing embodiments of the first aspect of the present application, the material of the conductive part comprises copper.

[0026] According to any one of the foregoing embodiments of the first aspect of the present application, the conductive layer comprises a first conductive layer, the first conductive layer is located on the first side of the substrate layer along the thickness direction of the flexible circuit board, and the connection structure, the first grounding part and the second grounding part are all located on the first conductive layer.

[0027] According to any one of the foregoing embodiments of the first aspect of the present application, the conductive layer comprises a first conductive layer and a second conductive layer, the first conductive layer is located on the first side of the substrate layer along the thickness direction of the flexible circuit board, the second conductive layer is located on the second side of the substrate layer, and the first side of the substrate layer is opposite to the second side of the substrate layer; the first grounding part is located on the first conductive layer and / or the second conductive layer, and the second grounding part is located on the first conductive layer and / or the second conductive layer.

[0028] According to any one of the foregoing embodiments of the first aspect of the present application, the connection structure and the second grounding part are both located on the first conductive layer or both located on the second conductive layer.

[0029] In this way, since the electrostatic input end and the second grounding part are located on the same film layer, the electrostatic input end and the second grounding part can be electrically connected without a via hole, which is conducive to simplifying the production process and reducing the production cost.

[0030] According to any one of the foregoing embodiments of the first aspect of the present application, the first grounding portion includes a first sub-portion and a second sub-portion, the first sub-portion is located on the first conductive layer and spaced apart from the second grounding portion, and the second sub-portion is located on the second conductive layer.

[0031] According to any one of the foregoing embodiments of the first aspect of the present application, in the thickness direction of the flexible circuit board, the projection of the second sub-portion on the substrate layer at least partially overlaps the projection of the first sub-portion on the substrate layer, and the projection of the second sub-portion on the substrate layer also at least partially overlaps the projection of the second grounding portion on the substrate layer.

[0032] According to any one of the foregoing embodiments of the first aspect of the present application, in the thickness direction of the flexible circuit board, the area of the projection of the second sub-portion on the substrate layer is greater than the sum of the area of the projection of the first sub-portion on the substrate layer and the area of the projection of the second grounding portion on the substrate layer.

[0033] According to any one of the foregoing embodiments of the first aspect of the present application, the second grounding portion is located on the first conductive layer, the second conductive layer is provided with a hollowed-out region, in the thickness direction of the flexible circuit board, the projection of the second grounding portion on the substrate layer at least partially overlaps the projection of the hollowed-out region on the substrate layer; or the second grounding portion is located on the second conductive layer, the first conductive layer is provided with a hollowed-out region, in the thickness direction of the flexible circuit board, the projection of the second grounding portion on the substrate layer at least partially overlaps the projection of the hollowed-out region on the substrate layer.

[0034] In this way, in the area where the second grounding portion is located, the conductive material on the other side of the substrate layer is avoided, which can effectively reduce the jumping of static electricity between the first conductive layer and the second conductive layer, for example, the static electricity of the second grounding portion can be prevented from jumping to the first grounding portion on the other side of the substrate layer.

[0035] According to any one of the foregoing embodiments of the first aspect of the present application, the first end of the flexible circuit board is provided with a connection structure, the second end of the flexible circuit board is provided with a binding area, the binding area includes a plurality of binding pads, and the flexible circuit board is bound and connected with the display panel through the plurality of binding pads; at least one binding pad includes a grounding pad, and the first grounding portion is electrically connected with a grounding wire in the display panel through the grounding pad.

[0036] According to any one of the foregoing embodiments of the first aspect of the present application, the connection structure is electrically connected with a control mainboard of the display device.

[0037] According to any one of the foregoing embodiments of the first aspect of the present application, the connection structure includes a gold finger or a connector.

[0038] According to any one of the foregoing embodiments of the first aspect of the present application, the display module further includes a touch chip, the touch chip is bound and connected with the flexible circuit board, at least one binding pad includes a touch electrode pad, and the touch chip is electrically connected with a touch electrode in the display panel through the touch electrode pad.

[0039] According to any one of the foregoing embodiments of the first aspect of the application, the connecting structure further comprises a plurality of signal connecting terminals arranged at intervals, the conductive layer further comprises a plurality of signal lines, the plurality of signal connecting terminals are electrically connected to the plurality of signal lines one by one, and the signal connecting terminals are electrically connected to the pins of the touch chip through the signal lines.

[0040] According to any one of the foregoing embodiments of the first aspect of the application, the flexible circuit board further comprises an electronic device, and the signal connecting terminals are electrically connected to the pins of the touch chip through the signal lines and the electronic device.

[0041] In a second aspect, the embodiments of the application provide a display device, which comprises the display module provided in the first aspect.

[0042] The display module and the display device provided in the embodiments of the application, the display module comprises a flexible circuit board and a display panel, the flexible circuit board and the display panel are connected in a binding manner, the flexible circuit board comprises a substrate layer and a conductive layer arranged in a stack, and the conductive layer comprises a first grounding portion and a second grounding portion arranged at intervals; one end of the flexible circuit board is provided with a connecting structure, the connecting structure at least comprises an electrostatic input terminal, the electrostatic input terminal is electrically connected to the second grounding portion, and the first grounding portion is electrically connected to a grounding line in the display panel. On the one hand, the conductive layer of the flexible circuit board is respectively provided with the first grounding portion and the second grounding portion, the first grounding portion is electrically connected to the grounding line in the display panel, and the electrostatic input terminal is electrically connected to the second grounding portion, that is, the electrostatic input terminal is not electrically connected to the first grounding portion, so that the electrostatic input by the electrostatic input terminal can be prevented from entering the display panel through the first grounding portion, the amount of electrostatic entering the display panel is reduced, the impact of the electrostatic on electronic devices in the display panel is reduced, and the electrostatic protection of the display panel is realized. On the other hand, since the second grounding portion has a certain impedance, the electrostatic entering the second grounding portion is further consumed by the second grounding portion, so that the amount of electrostatic in the flexible circuit board is reduced, and at least partial dissipation of the electrostatic is realized. BRIEF DESCRIPTION OF DRAWINGS

[0043] In order to more clearly illustrate the technical solutions of the embodiments of the application, the drawings required to be used in the embodiments of the application will be briefly introduced as follows, and other drawings can also be obtained by those of ordinary skill in the art without any creative labor on the basis of these drawings.

[0044] Figure 1 FIG. 1 shows a top view of a display module provided in the embodiments of the application;

[0045] Figure 2 FIG. 2 shows a sectional view of the display module shown in FIG. 1 along the A1-A2 direction; Figure 1

[0046] Figure 3 ​Another top view structural schematic diagram of the display module provided by the embodiment of the present application;

[0047] Figure 4 A partial circuit schematic diagram of the display module provided by the embodiment of the present application;

[0048] Figure 5 Another partial circuit schematic diagram of the display module provided by the embodiment of the present application;

[0049] Figure 6 Another top view structural schematic diagram of the display module provided by the embodiment of the present application;

[0050] Figure 7 A sectional structure schematic diagram of the display module along the B1-B2 direction shown in the figure; Figure 6

[0051] Another top view structural schematic diagram of the display module provided by the embodiment of the present application; Figure 8

[0052] A sectional structure schematic diagram of the display module along the C1-C2 direction shown in the figure; Figure 9 Figure 6 Another sectional structure schematic diagram of the display module along the C1-C2 direction shown in the figure;

[0053] Figure 10 Figure 6 Another sectional structure schematic diagram of the display module along the C1-C2 direction shown in the figure;

[0054] Figure 11 Another sectional structure schematic diagram of the display module along the C1-C2 direction shown in the figure; Figure 6

[0055] Another top view structural schematic diagram of the display module provided by the embodiment of the present application; Figure 12

[0056] A sectional structure schematic diagram of the display module along the D1-D2 direction shown in the figure; Figure 13 Figure 12 A structural schematic diagram of the display device provided by the embodiment of the present application.

[0057] DETAILED DESCRIPTION Figure 14

[0058] ​​​​The features and exemplary embodiments of the various aspects of the present application will be described in detail below with reference to the drawings. To make the purpose, technical solutions and advantages of the present application more clear, the present application will be further described in detail below with reference to the drawings and specific embodiments. It should be understood that the specific embodiments described herein are only intended to explain the present application, but not to limit the present application. The present application can be implemented without some of the specific details by those skilled in the art. The following description of the embodiments is only to provide a better understanding of the present application by showing examples of the present application.

[0059] It should be noted that, in this paper, the relationship terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements not only includes those elements, but also includes other elements not explicitly listed or inherent to such process, method, article or equipment. Without more limitations, the elements defined by the statement "include" do not exclude the presence of other identical elements in the process, method, article or equipment including the elements.

[0060] It should be understood that the term "and / or" used herein is only to describe the association relationship of the associated objects, which means that there can be three relationships, for example, A and / or B can represent the three cases of A alone, A and B together, and B alone. In addition, the character " / " in this paper generally represents that the front and rear associated objects have an "or" relationship.

[0061] In the embodiments of the present application, the term "electrically connected" can mean that two components are directly electrically connected, or that two components are electrically connected via one or more other components.

[0062] Various modifications and changes can be made to the present application without departing from the spirit or scope of the present application, which will be apparent to those skilled in the art. Therefore, the present application is intended to cover the modifications and variations of the present application falling within the scope of the corresponding claims (claimed technical solutions) and their equivalents. It should be noted that the embodiments provided by the embodiments of the present application can be combined with each other without contradiction.

[0063] Before describing the technical solutions provided by the embodiments of the present application, in order to facilitate the understanding of the embodiments of the present application, the present application first specifically describes the problems existing in the related art:

[0064] With the development of display technology, display modules are applied more and more widely in people's production and life. The display module is an important module device of a display device such as a mobile phone, a smart watch and a computer. The inventors of the present application have found that, after static electricity in the air strikes the shell of the display device and / or the flexible circuit board in the display module, the static electricity enters the display panel through the flexible circuit board, and the entering static electricity is likely to damage the electronic devices in the display panel.

[0065] In view of the above research findings of the inventors, the embodiments of the present application provide a display module and a display device, which can solve the problem that the electronic devices in the display panel are damaged by static electricity in the related art.

[0066] The technical concept of the embodiments of the present application is that, on the one hand, the conductive layer of the flexible circuit board is respectively provided with a first grounding part and a second grounding part, the first grounding part is electrically connected with a grounding wire in the display panel, and the static electricity input end is electrically connected with the second grounding part, that is, the static electricity input end is no longer electrically connected with the first grounding part, which can prevent the static electricity input by the static electricity input end from entering the display panel through the first grounding part, reduce the amount of static electricity entering the display panel, reduce the impact of static electricity on the electronic devices in the display panel, and achieve static electricity protection for the display panel; on the other hand, since the second grounding part has a certain impedance, the static electricity entering the second grounding part is further consumed by the second grounding part, so that the amount of static electricity in the flexible circuit board can be reduced, and at least partial dissipation of static electricity can be achieved.

[0067] First, the touch display module provided by the embodiments of the present application will be introduced.

[0068] Figure 1 A top view structural schematic diagram of the display module provided by the embodiments of the present application. Figure 2 A cross-sectional structural schematic diagram of the display module along the A1-A2 direction shown in Figure 1 The display module 10 can include a flexible circuit board (Flexible Printed Circuit, FPC) 110 and a display panel 120, as shown in Figure 1 and Figure 2 The display panel 120 can be provided with sub-pixels to realize a display picture. In some examples, the display module 10 can include a touch display module, and the display panel 120 can include a touch display panel, which can be provided with sub-pixels to realize a display picture and can be provided with a touch component to realize a touch function.

[0069] The flexible circuit board 110 can be bonded with the display panel 120. The flexible circuit board 110 can include a base material layer 01 and a conductive layer 02 which are stacked. The material of the base material layer 01 includes, but is not limited to, a flexible insulating material such as polyimide (PI) or polyester film. The thickness of the base material layer 01 can be flexibly designed according to actual needs. The conductive layer 02 can include a first grounding part GND1 and a second grounding part GND2 which are arranged at intervals. That is, the first grounding part GND1 and the second grounding part GND2 can be insulated. In actual application, the first grounding part GND1 can also be referred to as a system GND, which serves as the main reference ground terminal of the flexible circuit board 110.

[0070] The shape of the first grounding part GND1 and the shape of the second grounding part GND2 can be flexibly adjusted according to actual conditions, which are not limited in the embodiments of the present application. The shape of the first grounding part GND1 and the shape of the second grounding part GND2 can be regular or irregular. For example, in some examples, the first grounding part GND1 can be regular or irregular plate or line, and the second grounding part GND2 can also be regular or irregular plate or line.

[0071] One end of the flexible circuit board 110 is provided with a connection structure LX. In some examples, the connection structure LX includes, but is not limited to, a gold finger or a connector. When the connection mode of the gold finger and the connector is adopted, the gold finger can be inserted into the clamping slot of the connector to realize electrical connection. For example, when the connection structure LX is a gold finger, the gold finger of the flexible circuit board 110 can be inserted into the clamping slot of the connector of another circuit board to realize electrical connection between the flexible circuit board 110 and another circuit board. For another example, when the connection structure LX is a connector, the gold finger of another circuit board can be inserted into the clamping slot of the connector of the flexible circuit board 110 to realize electrical connection between the flexible circuit board 110 and another circuit board.

[0072] The connection structure LX can at least include an electrostatic input end 201, which can be electrically connected with the second grounding part GND2. For example, the electrostatic input end 201 can include a ground end GND of the flexible circuit board, which can be electrically connected with the ground end GND of the whole machine shell, the ground end GND of other circuit boards and / or the ground end GND of other connectors. Therefore, the electrostatic input end 201 can input electrostatic from the whole machine shell, other circuit boards and / or other connectors. Therefore, the second grounding part GND2 can also be referred to as an electrostatic input part.

[0073] The first grounding part GND1 can be electrically connected with a ground line D1 in the display panel 120. For example, in some examples, the first grounding part GND1 can be electrically connected with the ground line D1 in the display panel 120 through the bonding pad at the other end of the flexible circuit board 110.

[0074] The display module of the embodiment of the present application includes a flexible circuit board and a display panel, the flexible circuit board and the display panel are connected in a binding manner, the flexible circuit board includes a substrate layer and a conductive layer arranged in a stack, the conductive layer includes a first grounding part and a second grounding part arranged at intervals; one end of the flexible circuit board is provided with a connecting structure, the connecting structure at least includes an electrostatic input end, the electrostatic input end is electrically connected with the second grounding part, and the first grounding part is electrically connected with a grounding wire in the display panel. On the one hand, the conductive layer of the flexible circuit board is respectively provided with the first grounding part and the second grounding part, the first grounding part is electrically connected with the grounding wire in the display panel, and the electrostatic input end is electrically connected with the second grounding part, that is, the electrostatic input end is no longer electrically connected with the first grounding part, so that the electrostatic input by the electrostatic input end can be prevented from entering the display panel through the first grounding part, the amount of electrostatic entering the display panel is reduced, the impact of the electrostatic on electronic devices in the display panel is reduced, and the electrostatic protection of the display panel is realized. For example, when the display panel is a touch display panel, the electronic devices can include touch electrodes, by reducing the amount of electrostatic entering the touch display panel, the impact of the electrostatic on the touch electrodes in the touch display panel is reduced, and the problem that the display module is prone to touch failure can be improved. On the other hand, since the second grounding part has a certain impedance, the electrostatic entering the second grounding part is further consumed by the second grounding part, so that the amount of electrostatic in the flexible circuit board can be reduced, and at least partial dissipation of the electrostatic is realized.

[0075] Taking the display panel as a touch display panel as an example, in the related art, when the electrostatic enters the touch electrodes of the touch display panel through the flexible circuit board, since the shapes (or areas) of the touch electrodes can have certain differences, the resistances of the touch electrodes with different shapes (or different areas) are different, and the discharge speeds are also different. In this way, a relatively large voltage difference can be formed between the adjacent touch electrodes with different shapes (or different areas), and since the connections (such as cross bridges) between the adjacent touch electrodes are relatively thin, when the current flows, the connections (such as cross bridges) between the adjacent touch electrodes are prone to high temperature, the connections (such as cross bridges) between the adjacent touch electrodes are damaged, and the display module is prone to touch failure.

[0076] And by reducing the amount of electrostatic entering the touch display panel, the embodiment of the present application can reduce the voltage difference between the adjacent touch electrodes with different shapes (or different areas), and further reduce the current flowing through the connections (such as cross bridges) between the adjacent touch electrodes, so as to effectively prevent the connections (such as cross bridges) between the adjacent touch electrodes from being damaged, and improve the problem that the display module is prone to touch failure.

[0077] According to some embodiments of the present application, optionally, the impedance of the second grounding part GND2 can be greater than the impedance of the first grounding part GND1.

[0078] In this way, the impedance of the second grounding part GND2 can be relatively large, which can better dissipate the static electricity entering the second grounding part GND2 and reduce the amount of static electricity on the flexible circuit board.

[0079] According to some embodiments of this application, optionally, the cross-sectional area of ​​the second grounding portion GND2 may be smaller than the cross-sectional area of ​​the first grounding portion GND1. For example, in some examples, the maximum cross-sectional area of ​​the second grounding portion GND2 may be smaller than the minimum cross-sectional area of ​​the first grounding portion GND1.

[0080] Thus, since the cross-sectional area of ​​the second grounding part is smaller than that of the first grounding part, the impedance of the second grounding part can be relatively large, thereby better dissipating the static electricity entering the second grounding part and reducing the amount of static electricity on the flexible circuit board.

[0081] In some specific embodiments, optionally, the thickness of the second grounding portion GND2 can be the same as the thickness of the first grounding portion GND1 along the thickness direction of the flexible circuit board. For example, in some examples, the second grounding portion GND2 and the first grounding portion GND1 can be located in the same film layer, that is, the second grounding portion GND2 and the first grounding portion GND1 can be prepared by the same process, which is beneficial to the simplification of the manufacturing process.

[0082] Accordingly, when the thickness of the second grounding part GND2 is the same as or similar to the thickness of the first grounding part GND1, the cross-sectional area of ​​the second grounding part GND2 being smaller than the cross-sectional area of ​​the first grounding part GND1 can specifically mean that, along the same straight line, the width of the second grounding part GND2 can be smaller than the width of the first grounding part GND1. For example... Figure 1 As shown, for example, along the same straight line ZL1, the width w2 of the second grounding portion GND2 can be smaller than the width w1 of the first grounding portion GND1. For example, along the same straight line ZL2, the width w4 of the second grounding portion GND2 can be smaller than the width w3 of the first grounding portion GND1. In some examples, the straight lines (such as ZL1 and ZL2) include, but are not limited to, any straight line extending along the row direction of the flexible circuit board or display panel. In some specific examples, the maximum width of the second grounding portion GND2 can be smaller than the minimum width of the first grounding portion GND1.

[0083] Thus, since the width of the second grounding part GND2 along the same straight line is relatively small, the impedance of the second grounding part GND2 can be relatively large, thereby better dissipating the static electricity entering the second grounding part GND2 and reducing the amount of static electricity on the flexible circuit board.

[0084] In some embodiments, the second grounding portion GND2 can optionally include, but is not limited to, a conductive trace, such as a metal trace. Of course, the shape of the second grounding portion GND2 can be adjusted as needed, for example, in other embodiments, the second grounding portion GND2 can also be in the shape of a regular or irregular block or plate. The width of the second grounding portion GND2 can be adjusted as needed, and the embodiments of the present application do not limit this. For example, in some embodiments, the width of the second grounding portion GND2 can optionally be in the range of 0.05 mm to 0.3 mm, including but not limited to this range. For example, in some examples, the width of the second grounding portion GND2 can be 0.3 mm. For example, in some examples, the width of the second grounding portion GND2 can be 0.2 mm. For example, in some examples, the width of the second grounding portion GND2 can be 0.1 mm. For example, in some examples, the width of the second grounding portion GND2 can be 0.05 mm, and the like.

[0085] Thus, since the width of the second grounding portion GND2 is thin, i.e., the width w2 of the second grounding portion GND2 is small, the impedance of the second grounding portion GND2 can be increased, thereby better dissipating the static electricity entering the second grounding portion GND2 and reducing the amount of static electricity in the flexible circuit board.

[0086] Figure 3 Another top view structural schematic diagram of the display module provided by the embodiments of the present application is provided. As shown in Figure 3 According to some embodiments of the present application, the flexible circuit board 110 can also be provided with an electrostatic absorption element 301, and the electrostatic input end 201 can be electrically connected to the electrostatic absorption element 301 through the second grounding portion GND2. The electrostatic absorption element 301 can be used to dissipate static electricity.

[0087] Thus, in addition to the second grounding portion GND2 itself dissipating static electricity on the electrostatic input end 201 and the second grounding portion GND2, the electrostatic absorption element 301 further dissipates static electricity on the electrostatic input end 201 and the second grounding portion GND2. In this way, by dissipating static electricity through the electrostatic absorption element 301, the amount of static electricity in the flexible circuit board can be greatly reduced, and the dissipation of static electricity can be greatly achieved.

[0088] By further dissipating static electricity on the electrostatic input end 201 and the second grounding portion GND2 through the electrostatic absorption element 301, the static electricity on the electrostatic input end 201 and the second grounding portion GND2 can be further prevented from entering the display panel 120, and the amount of static electricity entering the display panel can be reduced.

[0089] For example, when the display module is a touch display module and the display panel is a touch display panel, the electrostatic absorption element 301 can be used to reduce the amount of electricity entering the touch electrode (Touch Panel sensor) area of the touch display panel. Specifically, by further dissipating the static electricity on the electrostatic input end 201 and the second ground GND2 through the electrostatic absorption element 301, the amount of electricity entering the touch electrode area of the touch display panel can be further reduced, the voltage difference between adjacent touch electrodes of different shapes (or different areas) can be reduced, and in turn the current flowing through the connection (such as a cross-bridge) between adjacent touch electrodes can be reduced, effectively preventing the connection (such as a cross-bridge) between adjacent touch electrodes from being damaged, and improving the problem of easy touch failure of the display module.

[0090] Continuing to refer to Figure 3 , according to some embodiments of the present application, optionally, the first end of the electrostatic absorption element 301 can be electrically connected to the second ground GND2, and the second end of the electrostatic absorption element 301 can be electrically connected to the first ground GND1.

[0091] In this way, a static discharge loop can be formed to guide the residual static electricity in the electrostatic absorption element 301 to the first ground GND1, effectively avoiding the accumulation of static electricity in the electrostatic absorption element 301.

[0092] In combination with Figure 2 and Figure 3 , according to some embodiments of the present application, optionally, along the thickness direction Z of the flexible circuit board, the area of the orthographic projection of the first ground GND1 on the substrate layer 01 can be greater than the area of the orthographic projection of the second ground GND2 on the substrate layer 01.

[0093] As mentioned earlier, the first ground GND1 can also be referred to as a system GND, and a larger area on the flexible circuit board 110 can be provided with the first ground GND1. The second ground GND2 is mainly used for static discharge of the electrostatic input end 201, and therefore the area occupied by the second ground GND2 on the flexible circuit board 110 can be relatively small.

[0094] Figure 4 A partial circuit schematic diagram of the display module provided by the embodiments of the present application is shown in Figure 4 , according to some embodiments of the present application, optionally, the electrostatic absorption element 301 includes but is not limited to an inductor L, the first end of the inductor L can be electrically connected to the second ground GND2, and the second end of the inductor L can be electrically connected to the first ground GND1. The inductor L can generate a counter electromotive force, which is conducive to offsetting static electricity.

[0095] In this way, on the one hand, the inductor L can generate a counter electromotive force to offset most or all of the static electricity; on the other hand, since the potential of the first ground part GND1 is relatively low, the inductor L can lead the residual static electricity of the second ground part GND2 to the first ground part GND1.

[0096] The size of the inductor L can be flexibly adjusted according to actual conditions, and embodiments of the present application do not limit this. For example, in some embodiments, the inductor L has a value range including but not limited to 1uH-10H. For example, in some examples, the inductor L can be a 1uH, 10uH, 20uH, 50uH, 100uH, 500uH, 1H, 2H, 5H or 10H inductor, etc.

[0097] When the inductor L with the above value range is used, on the one hand, a stronger counter electromotive force can be generated to offset most or even all of the static electricity, and on the other hand, the size of the inductor L can be avoided to be too large, the space occupied by the inductor L can be reduced, and the production cost can be reduced.

[0098] Figure 5 Another partial circuit schematic diagram of the display module provided by the embodiments of the present application is provided. As shown in Figure 5 According to some other embodiments of the present application, the static electricity absorbing element 301 can include but is not limited to a magnetic bead M, a first end of the magnetic bead M can be electrically connected with the second ground part GND2, and a second end of the magnetic bead M can be electrically connected with the first ground part GND1. The magnetic bead can be used to suppress high-frequency noise and spike interference on the signal line and the power line, and also has the ability to absorb static electricity pulses. The magnetic bead has a relatively high resistivity and magnetic permeability, and can be equivalent to a series connection of a resistor and an inductor, and the resistance value and the inductance value of the magnetic bead can change with frequency.

[0099] In this way, on the one hand, the magnetic bead M can generate a counter electromotive force to offset most or all of the static electricity; on the other hand, since the potential of the first ground part GND1 is relatively low, the magnetic bead M can lead the residual static electricity of the second ground part GND2 to the first ground part GND1.

[0100] The size of the magnetic bead M can be flexibly adjusted according to actual conditions, and embodiments of the present application do not limit this. For example, in some embodiments, the magnetic bead M has a value range including but not limited to 10Ω / 100MHZ-300Ω / 100MHZ. For example, in some examples, the magnetic bead M can be a 10Ω / 100MHZ, 20Ω / 100MHZ, 50Ω / 100MHZ, 80Ω / 100MHZ, 100Ω / 100MHZ, 150Ω / 100MHZ, 180Ω / 100MHZ, 200Ω / 100MHZ, 250Ω / 100MHZ or 300Ω / 100MHZ magnetic bead, etc.

[0101] When a magnetic bead M with the above-mentioned value range is selected, on the one hand, a strong reverse electromotive force can be generated to cancel most or even all of the static electricity; on the other hand, the magnetic bead M can be kept from being too large, reducing the space occupied by the magnetic bead M and lowering the production cost.

[0102] Figure 6 This is another top view structural diagram of the display module provided in the embodiments of this application. Figure 7 For along Figure 6 The diagram shows a cross-sectional structure of the display module along the B1-B2 direction. (Combined with...) Figure 6 and Figure 7 As shown, according to some embodiments of this application, the flexible circuit board 110 may optionally include an insulating protective layer 03. Along the thickness direction Z of the flexible circuit board, the insulating protective layer 03 may be located on the side of the conductive layer 02 away from the substrate layer 01, and the insulating protective layer 03 may cover the conductive layer 02.

[0103] The insulating protective layer 03 may have a window area K, which exposes a conductive portion 701 located on the conductive layer 02. The conductive portion 701 is insulated from the first grounding portion GND1. The shape and size of the conductive portion 701 can be flexibly adjusted according to actual conditions, and this embodiment does not limit this. For example, in some examples, the conductive portion 701 may be in the form of a regular or irregular plate.

[0104] In some examples, the conductive part 701 can be made of copper, so the windowed area K can also be called the copper leakage area.

[0105] In some examples, the conductive portion 701 of the window area K can be electrically connected to other circuit boards or connectors, so the conductive portion 701 of the window area K will also receive static electricity.

[0106] like Figure 6 As shown, in some embodiments, the conductive portion 701 of the window area K can be electrically connected to the second ground portion GND2.

[0107] In this way, the static electricity of the conductive part 701 in the window area K can be consumed through the second grounding part GND2, thereby reducing the static electricity of the conductive part 701 in the window area K.

[0108] See also Figure 6 In some embodiments, the conductive part 701 of the window area K can be electrically connected to the first end of the electrostatic absorption element 301 through the second grounding part GND2, and the second end of the electrostatic absorption element 301 is electrically connected to the first grounding part GND1.

[0109] Thus, the static electricity on the conductive part 701 of the window area K can be further absorbed or released by the static absorption element 301.

[0110] Figure 8 Another top view of the display module is provided in the embodiments of the present application. As shown in Figure 8 The difference between the embodiment shown in Figure 6 In other embodiments, the conductive layer 02 can also be provided with a third grounding portion GND3. The shape of the third grounding portion GND3 can be flexibly adjusted according to actual conditions. For example, in some examples, the third grounding portion GND3 can include a conductive trace. The third grounding portion GND3 is spaced apart from the first grounding portion GND1, i.e., the third grounding portion GND3 is not electrically connected to the first grounding portion GND1. In addition, the third grounding portion GND3 can also be spaced apart from the second grounding portion GND2, i.e., the third grounding portion GND3 is not electrically connected to the second grounding portion GND2.

[0111] The conductive portion 701 can be electrically connected to the third grounding portion GND3.

[0112] In this way, the static electricity of the conductive portion 701 of the windowed area K can be consumed by the third grounding portion GND3, reducing the static electricity of the conductive portion 701 of the windowed area K.

[0113] It should be noted that in other embodiments of the present application, a fourth grounding portion, a fifth grounding portion to an Nth grounding portion (not shown in the figure) can also be provided as needed, and N is an integer greater than 5. The fourth grounding portion, the fifth grounding portion to the Nth grounding portion have similar functions to the second grounding portion GND2 and the third grounding portion GND3, and can be used to dissipate static electricity.

[0114] For example, when there is a static electricity input device (such as a bare rigid reinforcing structure) similar to the conductive portion 701 of the windowed area K in the flexible circuit board, the conductive layer 02 can also be provided with a fourth grounding portion. The fourth grounding portion is electrically connected to the rigid reinforcing structure, and the fourth grounding portion is used to dissipate the static electricity of the rigid reinforcing structure.

[0115] Continuing to refer to Figure 8 In some embodiments, the third grounding portion GND3 can be electrically connected to the first end of the static electricity absorbing element 301, and the second end of the static electricity absorbing element 301 is electrically connected to the first grounding portion GND1.

[0116] In this way, the static electricity on the conductive portion 701 of the windowed area K can be further absorbed or released by the static electricity absorbing element 301.

[0117] Similarly, the fourth grounding portion, the fifth grounding portion to the Nth grounding portion can also be electrically connected to the static electricity absorbing element 301, and the static electricity can be further dissipated by the static electricity absorbing element 301.

[0118] According to some embodiments of this application, the conductive layer 02 may optionally include, but is not limited to, copper. For example, in some embodiments, the conductive layer 02 may be formed by covering one or both sides of the substrate layer 01 with copper foil. Then, by patterning the copper foil, circuit structures such as a first ground portion GND1 and a second ground portion GND2 are formed.

[0119] Copper foil is an anionic electrolytic material that can be deposited as a thin, continuous layer on the surface of substrate layer 01. As a conductor in flexible circuit boards, copper foil easily adheres to the surface of substrate layer 01. After the copper foil circuitry is printed on substrate layer 01, an insulating protective layer 03 can be added to the surface of the copper foil, thereby forming a flexible circuit board.

[0120] According to some embodiments of this application, the flexible circuit board 110 may optionally include, but is not limited to, a single-layer board (or single-sided board). A single-layer board or single-sided board is a flexible circuit board with only a single layer of conductor.

[0121] Figure 9 For along Figure 6 The diagram shows a cross-sectional view of the display module along the C1-C2 direction. (Combined with...) Figure 6 and Figure 9 As shown, according to some embodiments of this application, optionally, the conductive layer 02 may include a first conductive layer 021. Along the thickness direction Z of the flexible circuit board, the first conductive layer 021 may be located on a first side of the substrate layer 01. The first side of the substrate layer 01 can be any side of the substrate layer 01 along the thickness direction Z of the flexible circuit board, i.e., the front or back side of the substrate layer 01; this embodiment of the application does not limit this. Along the thickness direction Z of the flexible circuit board, the insulating protective layer 03 may be located on the side of the first conductive layer 021 away from the substrate layer 01, and the insulating protective layer 03 may cover the first conductive layer 021.

[0122] The connection structure LX, the first grounding part GND1, and the second grounding part GND2 can all be located on the first conductive layer 021. That is, the electrostatic input terminal 201 and the second grounding part GND2 can both be located on the first conductive layer 021.

[0123] Thus, since the electrostatic input terminal 201 and the second grounding part GND2 are located on the same film layer, electrical connection can be achieved between the electrostatic input terminal 201 and the second grounding part GND2 without the need for vias, which helps to simplify the production process and reduce production costs.

[0124] According to some embodiments of this application, the flexible circuit board 110 may optionally include, but is not limited to, a double-layer board (or double-sided board). A double-layer board or double-sided board is a flexible circuit board with two layers of conductors.

[0125] Figure 10 For alongFigure 6 Another cross-sectional structure diagram of the display module in the C1-C2 direction is shown. In combination with Figure 6 and Figure 10 As shown, according to some embodiments of the present application, optionally, the conductive layer 02 can include a first conductive layer 021 and a second conductive layer 022. Along the thickness direction Z of the flexible circuit board, the first conductive layer 021 is located on the first side of the substrate layer 01, and the second conductive layer 022 is located on the second side of the substrate layer 01, which is opposite to the first side of the substrate layer 01. That is, along the thickness direction Z of the flexible circuit board, one of the first side of the substrate layer 01 and the second side of the substrate layer 01 is the front surface of the substrate layer 01, and the other is the back surface of the substrate layer 01.

[0126] The first grounding portion GND1 can be located on the first conductive layer 021 and / or the second conductive layer 022. Figure 10 For example, the first grounding portion GND1 is located on the first conductive layer 021 and the second conductive layer 022, but in other embodiments, the first grounding portion GND1 can be located only on the first conductive layer 021 or only on the second conductive layer 022, which is not limited in the embodiments of the present application.

[0127] The second grounding portion GND2 can also be located on the first conductive layer 021 and / or the second conductive layer 022. Figure 10 For example, the second grounding portion GND2 is located on the first conductive layer 021. However, in other embodiments, the second grounding portion GND2 can also be located on the second conductive layer 022, or part of the second grounding portion GND2 is located on the first conductive layer 021 and part of the second grounding portion GND2 is located on the second conductive layer 022, which is not limited in the embodiments of the present application.

[0128] In combination with Figure 6 and Figure 10 As shown, according to some embodiments of the present application, optionally, the connection structure LX and the second grounding portion GND2 can be located on the first conductive layer 021 or on the second conductive layer 022. Figure 10 For example, the connection structure LX and the second grounding portion GND2 are located on the first conductive layer 021, but in other embodiments, the connection structure LX and the second grounding portion GND2 can also be located on the second conductive layer 022. That is, the electrostatic input end 201 and the second grounding portion GND2 can be located on the same film layer.

[0129] Therefore, since the electrostatic input end 201 and the second grounding portion GND2 are located on the same film layer, the electrostatic input end 201 and the second grounding portion GND2 can be electrically connected without a via hole, which is beneficial to simplify the production process and reduce the production cost.

[0130] In combination with Figure 6and Figure 10 As shown, according to some embodiments of this application, optionally, the first ground portion GND1 includes a first sub-part z1 and a second sub-part z2. The first sub-part z1 and the second ground portion GND2 may be located on the first conductive layer 021, and the first sub-part z1 and the second ground portion GND2 may be spaced apart, that is, the first sub-part z1 and the second ground portion GND2 may be insulated from each other. For example, along a direction parallel to the surface of the flexible circuit board, the first sub-part z1 and the second ground portion GND2 may be isolated by the insulating material of the insulating protective layer 03. The second sub-part z2 may be located on the second conductive layer 022.

[0131] Thus, the first grounding part GND1 is located in the first conductive layer 021 and the second conductive layer 022 respectively. That is, the first grounding part GND1 can be located not only in the first conductive layer 021, but also in the second conductive layer 022. This can increase the area of ​​the first grounding part GND1 and minimize the impedance of the first grounding part GND1, so that the first grounding part GND1 can achieve a function similar to earth (such as zero potential). That is, the first grounding part GND1 is the system GND.

[0132] Combination Figure 6 and Figure 10 As shown, according to some embodiments of this application, along the thickness direction Z of the flexible circuit board, the orthographic projection of the second sub-part z2 on the substrate layer 01 can at least partially overlap with the orthographic projection of the first sub-part z1 on the substrate layer 01, and the orthographic projection of the second sub-part z2 on the substrate layer 01 can also at least partially overlap with the orthographic projection of the second grounding part GND2 on the substrate layer 01. That is, the second sub-part z2 can cover a large area of ​​the substrate layer 01. For example, in some examples, the orthographic projection of the second sub-part z2 on the substrate layer 01 can cover the orthographic projection of the first sub-part z1 on the substrate layer 01 and the orthographic projection of the second grounding part GND2 on the substrate layer 01. That is, along the thickness direction Z of the flexible circuit board, the area of ​​the orthographic projection of the second sub-part z2 on the substrate layer 01 can be greater than the sum of the area of ​​the orthographic projection of the first sub-part z1 on the substrate layer 01 and the area of ​​the orthographic projection of the second grounding part GND2 on the substrate layer 01. Of course, the shape and size of the second sub-part z2 can be flexibly adjusted according to the actual situation, and the embodiments of this application do not limit this.

[0133] Figure 11 For along Figure 6 This is a schematic diagram of another cross-sectional structure of the display module along the C1-C2 direction. (Combined with...) Figure 6 and Figure 11As shown, according to some embodiments of the present application, optionally, the second ground part GND2 can be located at the first conductive layer 021. The second conductive layer 022 can be provided with a hollowed-out area Q. No conductive material can be provided within the hollowed-out area Q. Along the thickness direction Z of the flexible circuit board, the orthogonal projection of the second ground part GND2 on the substrate layer 01 can at least partially overlap with the orthogonal projection of the hollowed-out area Q on the substrate layer 01. For example, the orthogonal projection of the hollowed-out area Q on the substrate layer 01 can completely cover the orthogonal projection of the second ground part GND2 on the substrate layer 01.

[0134] In this way, in the area where the second ground part GND2 is located, the conductive material on the other side of the substrate layer 01 is avoided, which can effectively reduce the static electricity jumping between the first conductive layer 021 and the second conductive layer 022, for example, the static electricity of the second ground part GND2 can be prevented from jumping to the first ground part GND1 on the other side of the substrate layer 01, thereby effectively preventing the static electricity from entering the display panel through the first ground part GND1.

[0135] With Figure 11 Different from the embodiments shown, according to some other embodiments of the present application, optionally, the second ground part GND2 and the film layer where the hollowed-out area Q is located can be interchanged. That is, the second ground part GND2 can be located at the second conductive layer 022, and the first conductive layer 021 is provided with the hollowed-out area Q. Along the thickness direction of the flexible circuit board, the orthogonal projection of the second ground part GND2 on the substrate layer 01 can at least partially overlap with the orthogonal projection of the hollowed-out area Q on the substrate layer 01. The specific case is similar to the embodiments shown, and will not be described here. Figure 11

[0136] In this way, in the area where the second ground part GND2 is located, the conductive material on the other side of the substrate layer 01 is avoided, which can effectively reduce the static electricity jumping between the first conductive layer 021 and the second conductive layer 022, for example, the static electricity of the second ground part GND2 can be prevented from jumping to the first ground part GND1 on the other side of the substrate layer 01, thereby effectively preventing the static electricity from entering the display panel through the first ground part GND1.

[0137] As Figure 6 As shown, according to some embodiments of the present application, optionally, the first end of the flexible circuit board 110 can be provided with a connection structure LX, and the second end of the flexible circuit board 110 can be provided with a binding area 60. The binding area 60 can include a plurality of binding pads P, and the flexible circuit board 110 can be connected and bound to the display panel 120 through the plurality of binding pads P. For example, in some examples, the display panel 120 is also provided with a plurality of binding pads (not shown in the figure), and the plurality of binding pads P on the flexible circuit board 110 can be electrically connected one by one with the plurality of binding pads on the display panel 120 through conductive glue.

[0138] ​At least one of the bonding pads P in the bonding area 60 includes a ground pad Pd. The first ground portion GND1 can be electrically connected to the ground line D1 in the display panel 120 through the ground pad Pd. For example, the first ground portion GND1 can extend to the ground pad Pd and be electrically connected to the ground pad Pd. The ground pad Pd can be electrically connected to the ground line D1 in the display panel 120 through a bonding pad on the display panel 120.

[0139] According to some embodiments of the present application, the connection structure LX includes but is not limited to a gold finger or a connector. The connection structure LX can be electrically connected to a control mainboard (not shown in the figure) of the display device. Taking a mobile phone as an example, the control mainboard can be a mobile phone mainboard (or main control circuit board). The control mainboard can be provided with a central processing unit (CPU) and / or a graphics processing unit (GPU) and the like. The connection structure LX can be used to receive signals sent by the control mainboard.

[0140] Figure 12 Another top view structural schematic diagram of the display module provided by the embodiments of the present application is provided. As shown in the figure, Figure 12 According to some embodiments of the present application, the display module 10 can also include a touch chip 130. The touch chip 130 includes but is not limited to a touch panel driver integrated circuit (TPIC) or a touch and display driver integration (TDDI) chip.

[0141] The display panel 120 can be provided with a touch electrode TP, Figure 12 For example, a mutual capacitance or self-capacitance integrated touch display panel is taken as an example, the touch electrode TP can include a touch driving electrode TX and a touch sensing electrode RX. Of course, in other embodiments, the display panel 120 can also be a self-capacitance touch display panel, which is not limited in the embodiments of the present application.

[0142] The touch chip 130 can be bonded to the flexible circuit board 110, that is, a chip on film (COF) design is adopted. At least one of the bonding pads P can include a touch electrode pad Px, and the touch chip 130 can be electrically connected to the touch electrode TP in the display panel 120 through the touch electrode pad Px. The touch chip 130 can provide a touch driving signal for the touch electrode TP and / or receive a touch sensing signal.

[0143] Of course, in other embodiments, the touch chip 130 can also be directly connected with the display panel 120 in a COP (Chip On Panel) or COG (Chip On Glass) design, and the embodiments of the present application do not limit this.

[0144] Figure 13 For Figure 12 Figure 1 shows a cross-sectional structure of the display module along the D1-D2 direction. In combination with Figure 12 and Figure 13 According to some embodiments of the present application, as shown in FIGS. 1 and 2, the connection structure LX can further include a plurality of signal connection terminals 202 arranged at intervals. The conductive layer 02 can further include a plurality of signal lines L1, and the plurality of signal connection terminals 202 can be electrically connected to the plurality of signal lines L1 one by one. It should be noted that the signals transmitted by the plurality of signal lines L1 can be the same or different, and the embodiments of the present application do not limit this. The signal connection terminal 202 can be electrically connected to the pin of the touch chip 130 through the signal line L1.

[0145] In combination with Figure 12 and Figure 13 According to some embodiments of the present application, as shown in FIGS. 1 and 2, the connection structure LX can include at least two electrostatic input terminals 201, Figure 12 Taking two electrostatic input terminals 201 as an example, the at least two electrostatic input terminals 201 can be electrically connected to the same second ground part GND2, and the second ground part GND2 can be electrically connected to only one electrostatic absorption element 301, thereby reducing the number of electrostatic absorption elements 301. Of course, in other embodiments, the at least two electrostatic input terminals 201 can also be electrically connected to at least two second ground parts GND2, such as one electrostatic input terminal 201 connected to one second ground part GND2. The at least two second ground parts GND2 can be electrically connected to the same electrostatic absorption element 301, or can be electrically connected to at least two electrostatic absorption elements 301 respectively, and the embodiments of the present application do not limit this.

[0146] In combination with Figure 12 and Figure 13As shown, according to some embodiments of this application, optionally, when at least two electrostatic input terminals 201 are electrically connected to the same second grounding portion GND2, a jumper wire Kx can be used to electrically connect the at least two electrostatic input terminals 201 to the same second grounding portion GND2. The jumper wire Kx can be located on a different conductive layer than the signal line L1, thereby avoiding a short circuit between the second grounding portion GND2 and the signal line L1. For example, in some implementations, the second grounding portion GND2 and the signal line L1 can be located on the first conductive layer 021, and the jumper wire Kx can be located on the second conductive layer 022, with the jumper wire Kx electrically connected to the second grounding portion GND2 through a via. Alternatively, the second grounding portion GND2 and the signal line L1 can be located on the second conductive layer 022, and the jumper wire Kx can be located on the first conductive layer 021, with the jumper wire Kx electrically connected to the second grounding portion GND2 through a via.

[0147] like Figure 12 As shown, according to some embodiments of this application, the flexible circuit board may optionally include electronic components 203, including but not limited to resistors and / or capacitors. Resistors and / or capacitors can perform filtering, voltage division, and / or current limiting functions. The signal connection terminal 202 can be electrically connected to the pins of the touch chip 130 via signal line L1 and electronic components 203, thereby achieving overvoltage protection and / or overcurrent protection for the touch chip 130.

[0148] Based on the display module provided in the above embodiments, this application also provides a display device, including the display module provided in this application. In some embodiments, the display module may include a touch display module, and the display device may include a touch display device. Please refer to... Figure 14 , Figure 14 This is a schematic diagram of a display device provided in an embodiment of this application. Figure 14 The provided display device 1000 includes the display module 10 provided in any of the above embodiments of this application. Figure 14 The embodiments use a mobile phone as an example to describe the display device 1000. It is understood that the display device provided in the embodiments of this application can be other display devices with display functions, such as wearable products, computers, televisions, and vehicle-mounted display devices. This application does not impose specific limitations on these. The display device provided in the embodiments of this application has the beneficial effects of the display module 10 provided in the embodiments of this application. For details, please refer to the specific descriptions of the display module 10 in the above embodiments. These descriptions will not be repeated here.

[0149] It should be understood that the specific circuit structures and cross-sectional structures of the display modules provided in the accompanying drawings of the embodiments of this application are merely examples and are not intended to limit this application. Furthermore, the above embodiments provided in this application can be combined with each other unless there is contradiction.

[0150] It is to be understood that all the embodiments described herein are susceptible to broad interpretation. The same or similar parts or features of various embodiments can be interchanged so that one part or feature can be used in place of another part or feature. It will be apparent to those skilled in the art that numerous modifications and variations can be made without departing from the scope or spirit of the application. It is not intended that the application be limited by the above description but only by the following claims.

[0151] It will be apparent to those skilled in the art that numerous modifications and variations can be made without departing from the scope or spirit of the application. It is not intended that the application be limited by the above description but only by the following claims. It is to be understood that all the embodiments described herein are susceptible to broad interpretation. The same or similar parts or features of various embodiments can be interchanged so that one part or feature can be used in place of another part or feature. It will be apparent to those skilled in the art that numerous modifications and variations can be made without departing from the scope or spirit of the application. It is not intended that the application be limited by the above description but only by the following claims.

Claims

1. A display module, characterized in that, The display module includes a flexible circuit board and a display panel. The flexible circuit board is bonded to the display panel. The flexible circuit board includes a substrate layer and a conductive layer stacked together. The conductive layer includes a first grounding portion and a second grounding portion spaced apart. One end of the flexible circuit board is provided with a connection structure, the connection structure including at least an electrostatic input terminal, the electrostatic input terminal being electrically connected to the second grounding part, and the first grounding part being electrically connected to the grounding wire in the display panel; The flexible circuit board is also provided with an electrostatic absorption element. The electrostatic input terminal is electrically connected to the electrostatic absorption element through the second grounding part. The electrostatic absorption element is used to absorb static electricity. The first end of the electrostatic absorption element is electrically connected to the second grounding part, and the second end of the electrostatic absorption element is electrically connected to the first grounding part. The impedance of the second grounding part is greater than the impedance of the first grounding part.

2. The display module according to claim 1, characterized in that, The cross-sectional area of ​​the second grounding part is smaller than that of the first grounding part.

3. The display module according to claim 1, characterized in that, Along the same straight line, the width of the second grounding part is smaller than the width of the first grounding part.

4. The display module according to claim 1, characterized in that, The second grounding portion includes conductive traces.

5. The display module according to claim 1, characterized in that, Along the thickness direction of the flexible circuit board, the area of ​​the first grounding portion projected onto the substrate layer is larger than the area of ​​the second grounding portion projected onto the substrate layer.

6. The display module according to claim 1, characterized in that, The electrostatic absorption element includes an inductor, with a first end of the inductor electrically connected to the second grounding portion and a second end of the inductor electrically connected to the first grounding portion; Alternatively, the electrostatic absorption element may include a magnetic bead, with a first end of the magnetic bead electrically connected to the second grounding portion and a second end of the magnetic bead electrically connected to the first grounding portion.

7. The display module according to claim 1, characterized in that, The display module includes a touch display module, and the display panel includes a touch display panel.

8. The display module according to claim 1, characterized in that, The flexible circuit board further includes an insulating protective layer. Along the thickness direction of the flexible circuit board, the insulating protective layer is located on the side of the conductive layer away from the substrate layer, and the insulating protective layer covers the conductive layer. The insulating protective layer is provided with a window area, the window area exposing a conductive part located in the conductive layer, the conductive part being insulated from the first grounding part; The conductive part is electrically connected to the second grounding part, or the conductive layer is further provided with a third grounding part, the first grounding part and the third grounding part are spaced apart, and the conductive part is electrically connected to the third grounding part.

9. The display module according to claim 8, characterized in that, The third grounding part is electrically connected to the first end of the electrostatic absorption element, and the second end of the electrostatic absorption element is electrically connected to the first grounding part.

10. The display module according to claim 8, characterized in that, The material of the conductive part includes copper.

11. The display module according to claim 1, characterized in that, The conductive layer includes a first conductive layer. Along the thickness direction of the flexible circuit board, the first conductive layer is located on the first side of the substrate layer. The connection structure, the first grounding portion, and the second grounding portion are all located on the first conductive layer.

12. The display module according to claim 1, characterized in that, The conductive layer includes a first conductive layer and a second conductive layer. Along the thickness direction of the flexible circuit board, the first conductive layer is located on a first side of the substrate layer, and the second conductive layer is located on a second side of the substrate layer. The first side of the substrate layer and the second side of the substrate layer are opposite to each other. The first grounding portion is located on the first conductive layer and / or the second conductive layer, and the second grounding portion is located on the first conductive layer and / or the second conductive layer.

13. The display module according to claim 12, characterized in that, The connection structure and the second grounding portion are both located in the first conductive layer or both are located in the second conductive layer.

14. The display module according to claim 12, characterized in that, The first grounding portion includes a first sub-portion and a second sub-portion, the first sub-portion and the second grounding portion are located in the first conductive layer, the first sub-portion and the second grounding portion are spaced apart, and the second sub-portion is located in the second conductive layer.

15. The display module according to claim 14, characterized in that, Along the thickness direction of the flexible circuit board, the orthographic projection of the second sub-part on the substrate layer at least partially overlaps with the orthographic projection of the first sub-part on the substrate layer, and the orthographic projection of the second sub-part on the substrate layer also at least partially overlaps with the orthographic projection of the second grounding part on the substrate layer.

16. The display module according to claim 14, characterized in that, Along the thickness direction of the flexible circuit board, the area of ​​the orthographic projection of the second sub-part onto the substrate layer is greater than the sum of the area of ​​the orthographic projection of the first sub-part onto the substrate layer and the area of ​​the orthographic projection of the second grounding part onto the substrate layer.

17. The display module according to claim 12, characterized in that, The second grounding portion is located on the first conductive layer. The second conductive layer is provided with a hollow area. Along the thickness direction of the flexible circuit board, the orthographic projection of the second grounding portion on the substrate layer and the orthographic projection of the hollow area on the substrate layer at least partially overlap. Alternatively, the second grounding portion is located in the second conductive layer, and the first conductive layer is provided with a cutout area. Along the thickness direction of the flexible circuit board, the orthographic projection of the second grounding portion on the substrate layer and the orthographic projection of the cutout area on the substrate layer at least partially overlap.

18. The display module according to claim 1, characterized in that, The first end of the flexible circuit board is provided with the connection structure, and the second end of the flexible circuit board is provided with a bonding area, the bonding area including multiple bonding pads, and the flexible circuit board is bonded to the display panel through the multiple bonding pads; At least one of the bonding pads includes a grounding pad, and the first grounding portion is electrically connected to the grounding wire in the display panel via the grounding pad.

19. The display module according to claim 1, characterized in that, The connection structure is electrically connected to the control motherboard of the display device.

20. The display module according to claim 1, characterized in that, The connection structure includes gold fingers or connectors.

21. The display module according to claim 18, characterized in that, The display module further includes a touch chip, which is bonded to the flexible circuit board. At least one of the bonding pads includes a touch electrode pad, and the touch chip is electrically connected to the touch electrode in the display panel through the touch electrode pad.

22. The display module according to claim 21, characterized in that, The connection structure further includes a plurality of signal connection terminals spaced apart, and the conductive layer further includes a plurality of signal lines. The plurality of signal connection terminals are electrically connected to the plurality of signal lines in a one-to-one correspondence, and the signal connection terminals are electrically connected to the pins of the touch chip through the signal lines.

23. The display module according to claim 22, characterized in that, The flexible circuit board is also provided with electronic components, and the signal connection terminal is electrically connected to the pins of the touch chip through the signal line and the electronic components.

24. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 23.

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