A semiconductor laser treatment device and system

Abstract

The present invention relates to a semiconductor laser treatment device and system, which includes a main unit, an adjustment unit, a laser emitting unit, an irradiation unit, a cover unit and a control unit. The advantages of the semiconductor laser treatment device are that the irradiation height and irradiation angle of the irradiation unit can be adjusted by the adjustment unit to meet the use requirements of different patients; the irradiation unit can be covered by the cover unit, which can not only limit the distance between the irradiation unit and the irradiation position of the patient, but also prevent the irradiation unit from scattering light waves outward, thereby improving the irradiation efficiency, protecting the patient's eyesight, and ensuring the safety of irradiation; the cover unit is detachably connected to the adjustment unit, and the cover unit can be replaced according to different use requirements, thereby expanding the scope of application and irradiating different affected parts of the patient.

Description

Technical Field

[0001] The present invention relates to the technical field of medical devices, and in particular to a semiconductor laser treatment device and system. Background Art

[0002] Knee osteoarthritis (KOA) is a degenerative bone and joint disease with articular cartilage degeneration, synovial inflammation and secondary bone hyperplasia as the main pathological changes, and pain, swelling, stiffness and dysfunction as the main clinical manifestations. The incidence of chronic knee osteoarthritis in the elderly is as high as 70% in people over 75 years old. It is known as the "immortal cancer" and seriously affects the quality of life of the elderly.

[0003] The clinical treatment of KOA is mainly to relieve symptoms, and non-drug treatment is the first choice. Clinically, the physical therapy equipment for pain relief includes ultrasound therapy, infrared therapy, photon therapy, etc. according to different mechanisms of action.

[0004] The mechanism of action of ultrasound therapy mainly includes mechanical effect, thermal effect, and physical and chemical effect. It is mostly used to treat pain diseases such as temporomandibular joint pain, facial pain, neck and shoulder pain, and carpal tunnel syndrome. Ultrasound can significantly generate heat in the human body or in other transmitters. Therefore, if the time and dosage are not properly controlled, it is very likely to cause low-temperature burns to the tissue. The dosage of ultrasound therapy is the key to determining the success or failure of treatment. The appropriate dosage of ultrasound therapy should have a therapeutic effect without harming human health, which places high demands on the operator.

[0005] Infrared heat lamps are the most common physical therapy products on the market. They mainly use the thermal effect to accelerate local blood circulation. However, there are huge safety risks during use. For example, the peripheral skin perception of the elderly population is reduced, and the infrared heat accumulation effect is slow. By the time they feel pain, low-temperature burns have often occurred. Therefore, it is not recommended for elderly patients to use infrared heat lamps.

[0006] Photon therapy is an emerging treatment technology that has been widely used in the fields of skin diseases, tissue repair, neurological rehabilitation, gynecological diseases, and other diseases, and has achieved good results. Currently, common non-invasive thermal therapy based on photon technology includes low-intensity laser therapy, high-energy laser therapy, laser acupuncture, etc. Low-intensity laser (LLL) usually refers to monochromatic light with a wavelength of 600-1000nm, which has low output energy, low photothermal effects, etc. It can produce photobiomodulation, relieve pain, eliminate inflammation, and promote wound healing. Due to its low energy, it also avoids the risk of low-temperature burns. Its biostimulation effect and low photothermal effect can regulate the body's immune function, accelerate the metabolism of pain-causing substances, and interfere with pain nerves. Its significant anti-inflammatory and pain-relieving effects have been widely verified. Due to its high energy, high-intensity laser therapy has high requirements for the machine and is suitable for the auxiliary treatment of deeper tissue lesions, such as hips and buttocks; laser acupuncture combines acupuncture with laser, but it is an invasive operation that requires professionals to perform and is not suitable for home environments.

[0007] The existing photon therapy device can emit two different wavelengths of light waves, 450nm and 650nm. It is expensive and requires professionals to adjust different modes for different treatment requirements. It is not suitable for home environments. In addition, the elasticity of the fixing belt of the light shield decreases with the increase of time, and it is easy to fall off. The adjustable gooseneck head snaps easily, affecting the fixation of the lamp head. The touch screen may have poor contact and freeze due to frequent operation.

[0008] There is no effective solution to the problems existing in the prior art, such as complex operation, large size and inconvenient storage, easy burns, easy falling off of the light shield, easy freezing of the touch screen affecting treatment efficiency, and inability to treat knee joints. Summary of the invention

[0009] The purpose of the present invention is to provide a semiconductor laser treatment device and system to address the shortcomings of the prior art, such as complex operation, large size and inconvenient storage, easy burns, easy detachment of the light shield, easy freezing of the touch screen affecting the treatment efficiency, and inability to treat knee joint problems.

[0010] To achieve the above object, the technical solution adopted by the present invention is:

[0011] A first aspect of the present invention is to provide a semiconductor laser treatment device, comprising:

[0012] A main unit, wherein the main unit is arranged on a horizontal plane;

[0013] An adjustment unit, which is disposed on the top of the main unit and is used to adjust the height and angle;

[0014] A laser emitting unit, which is disposed inside the main unit and inside the adjusting unit and is used to emit and transmit light waves;

[0015] an irradiation unit, which is disposed at the end of the adjustment unit and connected to the laser emitting unit, and is used to adjust the irradiation height and irradiation angle under the action of the adjustment unit and receive the light waves emitted by the laser emitting unit to irradiate the patient;

[0016] a cover unit, the cover unit being removably arranged to cover the irradiation unit and used to limit an irradiation distance between the irradiation unit and an affected part of a patient;

[0017] A control unit is arranged on the main unit and connected to the laser emitting unit for controlling the laser emitting unit.

[0018] In some embodiments, the main unit includes:

[0019] A main body element, wherein the main body element is arranged on a horizontal plane, the adjusting unit is arranged on the top of the main body element, the laser emitting unit is arranged inside the main body element, and the control unit is arranged inside and / or on the side of the main body element;

[0020] A connecting element is arranged on the top of the main body element and is used for allowing the laser emitting unit to pass through the main body element and enter the adjusting unit.

[0021] In some of the embodiments, the main unit further comprises:

[0022] A plurality of groove elements, wherein the plurality of groove elements are disposed at the bottom of the main body element and are not communicated with the interior of the main body element;

[0023] A plurality of moving elements are provided in the groove element and are used for moving the main body element.

[0024] In some of the embodiments, the main unit further comprises:

[0025] At least one storage element is disposed inside the main body element and is used to store the cover unit.

[0026] In some embodiments, the adjusting unit includes:

[0027] An adjusting element, wherein the adjusting element is arranged on the top of the main unit;

[0028] A first mounting element is disposed at an end of the adjusting element and is used for mounting the irradiation unit.

[0029] In some of the embodiments, the laser emitting unit comprises:

[0030] A laser emitting element, which is disposed inside the main unit and connected to the control unit, and is used to emit light waves under the action of the control unit;

[0031] A transmission element is disposed inside the adjustment unit, a first end of the transmission element is connected to the laser emitting element, and a second end of the transmission element is connected to the irradiation unit, for transmitting light waves to the irradiation unit.

[0032] In some of the embodiments, the irradiation unit comprises:

[0033] An irradiation element, which is disposed at the end of the adjustment unit and connected to the laser emitting unit, and is used to adjust the irradiation height and irradiation angle under the action of the adjustment unit and receive the light waves emitted by the laser emitting unit to irradiate the patient;

[0034] a second mounting element, the second mounting element being disposed on the irradiating element and connected to an end of the adjusting unit;

[0035] The cover unit comprises:

[0036] a cover element, wherein the cover element covers the irradiation unit and is used to limit the irradiation distance between the irradiation unit and the affected part of the patient;

[0037] A locking element is arranged at the first end of the cover element and is detachably connected to the adjustment unit.

[0038] In some embodiments, the control unit includes:

[0039] A control element, which is disposed on the main unit and connected to the laser emitting unit, and is used to control the laser emitting unit;

[0040] A communication element, the communication element is connected to the control element for information transmission;

[0041] A power supply element is connected to the control element for supplying power.

[0042] In some of the embodiments, it also includes:

[0043] A temperature monitoring unit is arranged at a side of the irradiation unit and connected to the control unit, and is used to monitor the temperature of the affected part of the patient.

[0044] In some of the embodiments, it also includes:

[0045] A display unit is arranged on the main unit and connected to the control unit, and is used to display the working parameters of the semiconductor laser treatment device.

[0046] In some of the embodiments, it also includes:

[0047] A reminder unit is arranged on the main unit and connected to the control unit for reminding.

[0048] In some of the embodiments, it also includes:

[0049] A support unit is arranged on a horizontal plane and is used to assist in adjusting the position of the cover unit to adapt to laser treatment of different parts of the patient.

[0050] In some embodiments, the bracket unit includes:

[0051] A first support element, the first support element is arranged in a horizontal plane and is located on one side of the patient's affected part;

[0052] a second support element, the second support element being disposed in a horizontal plane and located on the other side of the patient's affected part;

[0053] a first supporting element, the first supporting element being movably disposed on an upper portion of the first bracket element and connected to a bottom portion of the cover unit;

[0054] The second supporting element is movably disposed on the upper portion of the second bracket element, and is movably connected to the first supporting element and connected to the bottom of the cover unit.

[0055] A second aspect of the present invention is to provide a conductor laser treatment system, comprising:

[0056] The semiconductor laser treatment device as described in the first aspect;

[0057] A remote control device is communicatively connected with the control unit of the semiconductor laser treatment device and is used to control the semiconductor laser treatment device.

[0058] The present invention adopts the above technical solution, and has the following technical effects compared with the prior art:

[0059] A semiconductor laser treatment device and system of the present invention sets the main unit as a trapezoidal body or a truncated cone body, and sets the adjustment unit as a retractable structure, so that the device is compact and occupies little space, thus solving the problem of inconvenient storage due to its large size; a control unit is used to control the laser emission unit to emit light waves, and the adjustment unit is used to flexibly adjust the height and the irradiation angle of the irradiation unit, thereby meeting the use requirements and effective irradiation of different patients, with simple operation steps and flexible use, which is very friendly to home use and solves the problem of complicated operation; a cover unit is provided to cover the irradiation unit, which can not only limit the distance between the irradiation unit and the irradiation position of the patient, but also prevent the irradiation unit from scattering the light waves outward, thereby improving the irradiation efficiency, protecting the patient's eyesight, ensuring the safety of irradiation, and avoiding the irradiation position of the patient. The hood is firmly fixed and can be cleaned at any time, which solves the problem that the hood is easy to fall off and burns easily; the hood unit is detachably connected to the adjustment unit, and the hood unit can be replaced according to the use requirements of different parts to irradiate different affected parts of the patient, thereby increasing the scope of application; the temperature of the patient's irradiated affected part is monitored in real time by the temperature monitoring unit to ensure that the temperature of the affected part is within a safe range, further solving the problem of easy burns; the bracket unit is erected on the patient's affected part to stabilize the hood unit and irradiate the knee joint, solving the problem that the knee joint cannot be treated; by setting up a remote control device, the semiconductor laser treatment device can be remotely controlled to avoid the situation where treatment cannot be performed when manual control fails, thereby solving the problem that the touch screen is prone to freeze and affects the treatment efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 is a schematic diagram of a semiconductor laser treatment device according to an embodiment of the present invention;

[0061] Figure 2 is a schematic diagram of a main unit according to an embodiment of the present invention (I);

[0062] Figure 3 is a schematic diagram of an adjustment unit according to an embodiment of the present invention;

[0063] Figure 4 is a schematic diagram of a laser emitting unit according to an embodiment of the present invention;

[0064] Figure 5 is a schematic diagram of an irradiation unit according to an embodiment of the present invention;

[0065] Figure 6 is a schematic diagram of a cover unit according to an embodiment of the present invention (I);

[0066] Figure 7 is a schematic diagram of a cover unit according to an embodiment of the present invention (II);

[0067] Figure 8is a schematic diagram of a cover unit according to an embodiment of the present invention (III);

[0068] Fig. 9 is a schematic diagram of a control unit according to an embodiment of the present invention;

[0069] Fig.10 is a schematic diagram of a main unit according to an embodiment of the present invention (II);

[0070] Fig.11 is a schematic diagram of a main unit according to an embodiment of the present invention (III);

[0071] Fig.12 is a schematic diagram of a temperature monitoring unit according to an embodiment of the present invention;

[0072] Fig.13 is a schematic diagram of a display unit according to an embodiment of the present invention;

[0073] Fig.14 is a schematic diagram of a reminder unit according to an embodiment of the present invention;

[0074] Fig.15 is a schematic diagram of a bracket unit according to an embodiment of the present invention;

[0075] Fig.16 is a schematic diagram of a semiconductor laser treatment system according to an embodiment of the present invention.

[0076] The accompanying drawings are denoted as follows:

[0077] 1000. Semiconductor laser treatment device;

[0078] 1010, main unit; 1011, main component; 1012, connecting component; 1013, groove component; 1014, moving component; 1015, storage component;

[0079] 1020, adjusting unit; 1021, adjusting element; 1022, first mounting element; 1023, limiting element;

[0080] 1030, laser emitting unit; 1031, laser emitting element; 1032, transmission element;

[0081] 1040, irradiation unit; 1041, irradiation element; 1042, second installation element;

[0082] 1050, cover unit; 1051, cover element; 1052, locking element;

[0083] 1060, control unit; 1061, control element; 1062, communication element; 1063, power supply element; 1064, control element;

[0084] 1070. Temperature monitoring unit;

[0085] 1080, display unit;

[0086] 1090, reminder unit;

[0087] 1100, bracket unit; 1101, first bracket element; 1102, second bracket element; 1103, first supporting element; 1104, second supporting element;

[0088] 2000. Remote control device. DETAILED DESCRIPTION

[0089] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application is described and illustrated below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application. Based on the embodiments provided in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0090] Obviously, the drawings described below are only some examples or embodiments of the present application. For ordinary technicians in this field, the present application can also be applied to other similar scenarios based on these drawings without creative work. In addition, it can also be understood that although the efforts made in this development process may be complicated and lengthy, for ordinary technicians in this field related to the content disclosed in this application, some changes in design, manufacturing or production based on the technical content disclosed in this application are just conventional technical means, and should not be understood as insufficient content disclosed in this application.

[0091] Reference to "embodiments" in this application means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those of ordinary skill in the art that the embodiments described in this application may be combined with other embodiments without conflict.

[0092] Unless otherwise defined, the technical terms or scientific terms involved in this application should be understood by people with ordinary skills in the technical field to which this application belongs. The words "one", "a", "a", "the" and the like involved in this application do not indicate a quantitative limitation, and may represent the singular or plural. The terms "include", "comprise", "have" and any of their variations involved in this application are intended to cover non-exclusive inclusions; for example, a process, method, system, product or device that includes a series of steps or units (units) is not limited to the listed steps or units, but may also include steps or units that are not listed, or may also include other steps or units inherent to these processes, methods, products or devices. The words "connect", "connected", "coupled" and the like involved in this application are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. The "multiple" involved in this application refers to two or more. "And / or" describes the association relationship of associated objects, indicating that there can be three relationships, for example, "A and / or B" can mean: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the objects before and after are in an "or" relationship. The terms "first", "second", "third", etc. involved in this application are only used to distinguish similar objects and do not represent a specific ordering of the objects.

[0093] Example 1

[0094] This embodiment relates to the semiconductor laser treatment device of the present invention.

[0095] An exemplary embodiment of the present invention is as follows Figure 1 As shown, a semiconductor laser treatment device 1000 includes a main unit 1010, an adjustment unit 1020, a laser emitting unit 1030, an irradiation unit 1040, a cover unit 1050 and a control unit 1060. Among them, the main unit 1010 is arranged on a horizontal plane; the adjustment unit 1020 is arranged on the top of the main unit 1010, and is used to adjust the height and angle; the laser emitting unit 1030 is arranged inside the main unit 1010 and the adjustment unit 1020, and is used to emit and transmit light waves; the irradiation unit 1040 is arranged at the end of the adjustment unit 1020 and is connected to the laser emitting unit 1030, and is used to adjust the irradiation height and irradiation angle under the action of the adjustment unit 1020 and receive the light waves emitted by the laser emitting unit 1030 to irradiate the patient; the cover unit 1050 removably covers the irradiation unit 1040, and is used to limit the irradiation distance between the irradiation unit 1040 and the affected part of the patient; the control unit 1060 is arranged in the main unit 1010, and is connected to the laser emitting unit 1030, and is used to control the laser emitting unit 1030.

[0096] like Figure 2As shown, the main unit 1010 includes a main element 1011 and a connecting element 1012. The main element 1011 is arranged on a horizontal plane, an adjusting unit 1020 is arranged on the top of the main element 1011, a laser emitting unit 1030 is arranged inside the main element 1011, and a control unit 1060 is arranged inside and / or on the side of the main element 1011; the connecting element 1012 is arranged on the top of the main element 1011, and is used for the laser emitting unit 1030 to pass through the main element 1011 and enter the adjusting unit 1020.

[0097] In some of the embodiments, the radial dimension of the main body element 1011 increases from the top to the bottom. Generally, the longitudinal section of the main body element 1011 is trapezoidal, truncated cone-shaped, or the like.

[0098] In some of the embodiments, the material of the main body component 1011 includes but is not limited to plastic and metal.

[0099] In some of the embodiments, the main body element 1011 is a hollow base.

[0100] The size of the communication element 1012 matches the size of the main body element 1011. Generally, the radial size (such as the outer diameter) of the communication element 1012 is smaller than the radial size (such as the length and width) of the top of the main body element 1011.

[0101] In some of the embodiments, the connecting element 1012 is a first through hole.

[0102] like Figure 3 As shown, the adjustment unit 1020 includes an adjustment element 1021 and a first mounting element 1022. The adjustment element 1021 is disposed on the top of the main unit 1010; the first mounting element 1022 is disposed at the end of the adjustment element 1021 for mounting the irradiation unit 1040.

[0103] Specifically, the regulating element 1021 is disposed on the top of the main element 1011 and is located on the upper portion of the connecting element 1012 .

[0104] The adjusting element 1021 is a hollow structure and is used to transmit the light waves emitted by the laser emitting unit 1030 .

[0105] The connection between the adjustment element 1021 and the main element 1011 is a detachable connection, wherein the detachable connection includes but is not limited to a screw connection.

[0106] The size of the adjusting element 1021 matches the size of the main element 1011. Generally, the radial size (such as outer diameter, length, width) of the adjusting element 1021 is smaller than the radial size (such as outer diameter, length, width) of the top end of the main element 1011.

[0107] The size of the regulating element 1021 matches the size of the connecting element 1012. Generally, the radial size (such as outer diameter, length, width) of the regulating element 1021 is greater than the radial size (such as outer diameter, length, width) of the connecting element 1012.

[0108] In some of the embodiments, the material of the adjusting element 1021 includes but is not limited to plastic and metal.

[0109] In some of the embodiments, the adjusting element 1021 is a mechanical adjusting arm. In the present invention, the adjusting element 1021 is taken as a three-section mechanical adjusting arm for example. Specifically, the adjusting element 1021 includes a first adjusting arm, a second adjusting arm, a third adjusting arm and a fourth adjusting arm. Among them, the first end of the first adjusting arm is connected to the main element 1011; the first end of the second adjusting arm is movably connected to the second end of the first adjusting arm; the first end of the third adjusting arm is movably connected to the second end of the second adjusting arm; the first end of the fourth adjusting arm is movably connected to the second end of the third adjusting arm, and the second end of the fourth adjusting arm is provided with a first mounting element 1022.

[0110] The movable connection includes a sliding connection and a rotating connection. In addition, the sliding connection can be a sliding connection with a damping function or a sliding connection with a locking function; the rotating connection can be a rotating connection with a damping function or a rotating connection with a locking function. The sliding connection and the rotating connection with a damping function or a locking function are both prior arts and will not be described in detail in the present invention.

[0111] In some embodiments, at least one of the movable connection between the first adjusting arm and the second adjusting arm, the movable connection between the second adjusting arm and the third adjusting arm, and the movable connection between the third adjusting arm and the fourth adjusting arm is a sliding connection, and at least one is a rotating connection. That is, there may be two sliding connections and one rotating connection, or there may be one sliding connection and two rotating connections.

[0112] In some of the embodiments, the movable connection between the first adjusting arm and the second adjusting arm, the movable connection between the second adjusting arm and the third adjusting arm, and the movable connection between the third adjusting arm and the fourth adjusting arm are all rotational connections.

[0113] In the present invention, preferably, the movable connection between the first adjustment arm and the second adjustment arm, the movable connection between the second adjustment arm and the third adjustment arm, and the movable connection between the third adjustment arm and the fourth adjustment arm are all rotational connections. The purpose of setting the movable connections as rotational connections is to not affect the light wave transmission path of the laser emitting unit 1030.

[0114] In some embodiments, the adjusting element 1021 is a multi-axis mechanical arm, wherein the adjusting element 1021 is in communication with the control unit 1060 and is used to adjust the irradiation height and irradiation angle of the irradiation unit 1040 under the control of the control unit 1060 .

[0115] Among them, the multi-axis robotic arm is a conventional technical means in this technical field and will not be described in detail here.

[0116] The size of the first mounting element 1022 matches the size of the adjusting element 1021. Generally, the radial size (eg, outer diameter, length, width) of the first mounting element 1022 is greater than the radial size (eg, outer diameter, length, width) of the adjusting element 1021.

[0117] In some embodiments, the material of the first installation element 1022 includes but is not limited to plastic and metal.

[0118] In some of the embodiments, the first mounting element 1022 is a first mounting seat.

[0119] Furthermore, the adjusting unit 1020 further includes a limiting element 1023 , wherein the limiting element 1023 is disposed at the second end of the adjusting element 1021 and located at the second end of the first mounting element 1022 , and is used to fix the cover unit 1050 .

[0120] The connection between the limiting element 1023 and the adjusting element 1021 is fixed connection or detachable connection. The fixed connection includes but is not limited to integral molding; the detachable connection includes but is not limited to snap connection.

[0121] The size of the limiting element 1023 matches the size of the adjusting element 1021. Generally, the radial size (such as outer diameter, length, width) of the limiting element 1023 is greater than the radial size (such as outer diameter, length, width) of the second end of the adjusting element 1021.

[0122] In some of the embodiments, the material of the limiting element 1023 includes but is not limited to plastic and metal.

[0123] In some of the embodiments, the limiting element 1023 is a limiting ring.

[0124] like Figure 4As shown, the laser emitting unit 1030 includes a laser emitting element 1031 and a transmission element 1032. The laser emitting element 1031 is disposed inside the main unit 1010 and connected to the control unit 1060, and is used to emit light waves under the action of the control unit 1060; the transmission element 1032 is disposed inside the adjustment unit 1020, the first end of the transmission element 1032 is connected to the laser emitting element 1031, and the second end of the transmission element 1032 is connected to the irradiation unit 1040, and is used to transmit light waves to the irradiation unit 1040.

[0125] Specifically, the laser emitting element 1031 is disposed inside the main element 1011 ; the transmission element 1032 is disposed inside the adjustment element 1021 and passes through the connecting element 1012 and the first mounting element 1022 .

[0126] In this embodiment, the wavelength of the light wave emitted by the laser emitting element 1031 is 600-1000 nm.

[0127] The laser emitting element 1031 and the main element 1011 are connected in a detachable manner, wherein the detachable connection manner includes but is not limited to screw connection.

[0128] The size of the laser emitting element 1031 matches the size of the main element 1011. Generally, the radial size (such as outer diameter, length, width) of the laser emitting element 1031 is smaller than the radial size (such as outer diameter, length, width) of the main element 1011, and the height of the laser emitting element 1031 is smaller than the height of the main element 1011.

[0129] In some of the embodiments, the laser emitting element 1031 is a semiconductor laser emitter.

[0130] The transmission element 1032 and the laser emitting element 1031 are connected in a detachable manner, wherein the detachable connection manner includes but is not limited to a snap-on connection and a plug-in connection.

[0131] The size of the transmission element 1032 matches the size of the communication element 1012. Generally, the radial size (eg, outer diameter) of the transmission element 1032 is smaller than the radial size (eg, inner diameter) of the communication element 1012.

[0132] The size of the transmission element 1032 matches the size of the adjustment element 1021. Generally, the radial size (such as the outer diameter) of the transmission element 1032 is smaller than the radial size (such as the inner diameter) of the adjustment element 1021, and the length of the transmission element 1032 is greater than the length of the adjustment element 1021.

[0133] In some of the embodiments, the transmission element 1032 is an optical fiber.

[0134] like Figure 5 As shown, the irradiation unit 1040 includes an irradiation element 1041 and a second mounting element 1042. The irradiation element 1041 is disposed at the end of the adjustment unit 1020 and connected to the laser emitting unit 1030, and is used to adjust the irradiation height and irradiation angle under the action of the adjustment unit 1020 and receive the light waves emitted by the laser emitting unit 1030 to irradiate the patient; the second mounting element 1042 is disposed on the irradiation element 1041 and connected to the end of the adjustment unit 1020.

[0135] Specifically, the irradiation element 1041 is disposed at the second end of the adjustment element 1021 and connected to the transmission element 1032 for receiving the light wave emitted by the laser emitting element 1031 ; the second installation element 1042 is connected to the first installation element 1022 .

[0136] The connection between the irradiation element 1041 and the transmission element 1032 is a detachable connection, wherein the detachable connection includes but is not limited to a snap connection and a plug connection.

[0137] The size of the illuminating element 1041 matches the size of the adjusting element 1021. Generally, the radial size (eg, outer diameter) of the illuminating element 1041 is greater than the radial size (eg, outer diameter) of the adjusting element 1021.

[0138] In some embodiments, the illumination element 1041 is an illumination lamp.

[0139] The second installation element 1042 is connected to the first installation element 1022 in a detachable manner, wherein the detachable connection manner includes but is not limited to screw connection.

[0140] The size of the second mounting element 1042 matches the size of the first mounting element 1022. Generally, the radial size (eg, outer diameter, length, width) of the second mounting element 1042 is smaller than the radial size (eg, outer diameter, length, width) of the first mounting element 1022.

[0141] The size of the second mounting element 1042 matches the size of the illuminating element 1041. Generally, the radial size (eg, outer diameter, length, width) of the second mounting element 1042 is greater than the radial size (eg, outer diameter, length, width) of the illuminating element 1041.

[0142] In some of the embodiments, the second mounting element 1042 is a second mounting seat.

[0143] like Figure 6As shown, the cover unit 1050 includes a cover element 1051 and a locking element 1052. The cover element 1051 covers the irradiation unit 1040 to limit the irradiation distance between the irradiation unit 1040 and the affected part of the patient; the locking element 1052 is arranged at the first end of the cover element 1051 and is detachably connected to the adjustment unit 1020.

[0144] Specifically, the cover element 1051 covers the irradiation element 1041 to limit the irradiation distance between the irradiation element 1041 and the affected part of the patient; the locking element 1052 is connected to the adjusting element 1021 .

[0145] More specifically, the locking element 1052 is connected to the limiting element 1023 .

[0146] The size of the cover element 1051 matches the size of the illuminating element 1041. Generally, the radial size (such as outer diameter, length, width) of the cover element 1051 is larger than the radial size (such as outer diameter, length, width) of the illuminating element 1041, and the height of the cover element 1051 is larger than the height of the illuminating element 1041.

[0147] The size of the cover element 1051 matches the size of the first mounting element 1022. Generally, the radial size (such as outer diameter, length, width) of the cover element 1051 is greater than the radial size (such as outer diameter, length, width) of the first mounting element 1022.

[0148] In some of these embodiments, the height of the cover element 1051 is greater than 20 cm.

[0149] The size of the cover element 1051 matches the size of the adjustment element 1021. Generally, the radial size (such as outer diameter, length, width) of the cover element 1051 is greater than the radial size (such as outer diameter, length, width) of the adjustment element 1021.

[0150] In some of the embodiments, Figure 7 As shown, the cover element 1051 includes a soft connector, a plurality of hard support members and two adhesive members. The soft connector covers the irradiation element 1041 and is connected to the locking element 1052; the plurality of hard support members are distributed on the soft connector to support the soft connector and limit the irradiation distance between the irradiation element 1041 and the affected part of the patient; the two adhesive members are respectively disposed on the two sides of the soft connector and distributed on two different sides of the soft connector to close the soft connector.

[0151] In some of the embodiments, the soft connector is made of light-shielding material, including but not limited to black fabric and light-shielding PU.

[0152] The connection methods of the several hard supporting parts and the soft connecting parts are fixed connection and detachable connection. The fixed connection method includes but is not limited to machine sewing; the detachable connection method includes but is not limited to plugging, bonding, etc.

[0153] The size of the hard support member matches the size of the soft connector. Generally, the width of the hard support member is smaller than the width of the fixing pocket of the soft connector, and the height of the hard support member is not greater than the height of the soft connector.

[0154] In some of the embodiments, the number of the hard support members is at least 3.

[0155] In some of the embodiments, the height of the hard support member is not less than 20 cm.

[0156] In some of the embodiments, the material of the hard support member includes but is not limited to an opaque thin PVC board.

[0157] The bonding member and the soft connection member are connected by fixed connection, wherein the fixed connection method includes but is not limited to machine sewing.

[0158] The size of the adhesive component matches the size of the soft connector. Generally, the width of the adhesive component is smaller than the width of the soft connector, and the height of the adhesive component is not greater than the height of the soft connector.

[0159] In some of the embodiments, the adhesive member is Velcro.

[0160] Furthermore, the cover element 1051 further includes a plurality of fixing members, wherein the plurality of fixing members are distributed inside the soft connecting member and are detachably connected to the plurality of hard supporting members respectively.

[0161] The detachable connection methods between the fixing member and the hard supporting member include but are not limited to bonding, plugging, etc.

[0162] The size of the fixing member matches the size of the soft connecting member. Generally, the length of the fixing member is smaller than the length of the soft connecting member, and the width of the fixing member is smaller than the width of the soft connecting member.

[0163] The size of the fixing member matches the size of the hard support member. Generally, the length of the fixing member is not less than the length of the hard support member, and the width of the fixing member is not less than the width of the hard support member.

[0164] The number of fixing members matches the number of rigid support members. Generally, the number of fixing members is equal to the number of rigid support members.

[0165] In some of the embodiments, the fixing member includes but is not limited to a fixing adhesive surface, a fixing bag, etc.

[0166] Furthermore, if Figure 8As shown, the cover element 1051 also includes a plurality of limiting members and a plurality of fitting members; the plurality of limiting members are arranged at the bottom of the soft connecting member, and are used to fix the bottom of the soft connecting member on the affected part of the patient; the plurality of fitting members are arranged at the bottom of the corresponding limiting members, and are respectively connected to the plurality of limiting members, and are used to connect the plurality of limiting members and the affected part of the patient.

[0167] The connection method between the limiter and the soft connector is fixed connection or detachable connection. The fixed connection method includes but is not limited to machine sewing; the detachable connection method includes but is not limited to snap connection.

[0168] The size of the stopper matches the size of the rigid support member. Generally, the width of the stopper is smaller than the width of the rigid support member.

[0169] In some of the embodiments, the number of the limiting members is at least two.

[0170] In some of the embodiments, the limiting member is a limiting plate.

[0171] The connection mode between the fitting member and the limiting member is a detachable connection, wherein the detachable connection mode includes but is not limited to fitting.

[0172] The size of the fitting piece matches the size of the stopper. Generally, the radial size (such as outer diameter, length, width) of the fitting piece is smaller than the radial size (such as length, width) of the stopper.

[0173] The number of the fitting parts matches the number of the limiting parts. Generally, the number of the fitting parts is equal to the number of the limiting parts or is an integral multiple of the number of the limiting parts.

[0174] In some of the embodiments, the adhesive component includes but is not limited to medical tape.

[0175] The locking element 1052 and the cover element 1051 are connected in a detachable manner, wherein the detachable connection manner includes but is not limited to sleeve connection, snap connection, and zipper connection.

[0176] The locking element 1052 and the limiting element 1023 are connected in a detachable manner, wherein the detachable connection manner includes but is not limited to a sleeve connection and a snap connection.

[0177] The size of the locking element 1052 matches the size of the cover element 1051. Generally, the radial size (such as outer diameter, length, width) of the locking element 1052 is smaller than the width of the soft connector, and the maximum length of the locking element 1052 is not less than the length of the soft connector.

[0178] The size of the locking element 1052 matches the size of the limiting element 1023. Generally, when unlocked, the length of the locking element 1052 is greater than the circumference of the limiting element 1023, and when locked, the length of the locking element 1052 is less than the circumference of the limiting element 1023.

[0179] In some of the embodiments, the locking element 1052 can be made of a hard material or a soft material.

[0180] In some of the embodiments, the locking element 1052 includes, but is not limited to, a fixing strap and a fixing ring.

[0181] like Fig. 9 As shown, the control unit 1060 includes a control element 1061, a communication element 1062 and a power element 1063. The control element 1061 is disposed in the main unit 1010 and connected to the laser emitting unit 1030 for controlling the laser emitting unit 1030; the communication element 1062 is connected to the control element 1061 for information transmission; and the power element 1063 is connected to the control element 1061 for power supply.

[0182] Specifically, the control element 1061 is connected to the laser emitting element 1031 and is used to control the laser emitting element 1031 to emit laser.

[0183] In some embodiments, the control element 1061 is connected to the adjustment element 1021. The adjustment element 1021 is a multi-axis robot arm.

[0184] In some of the embodiments, the control element 1061 includes but is not limited to a single chip microcomputer, a chip, and a processor.

[0185] In some of the embodiments, the communication element 1062 includes but is not limited to a Bluetooth module, a WiFi module, a 4G module, and a 5G module.

[0186] The power supply element 1063 is of detachable design or non-detachable design. In the case where the power supply element 1063 is of detachable design, the power supply element 1063 can be replaced.

[0187] In some of the embodiments, the power supply element 1063 includes but is not limited to a lithium battery.

[0188] Furthermore, the control unit 1060 further includes a manipulation element 1064. The manipulation element 1064 is disposed on the main body element 1011 and connected to the control element 1061 for manually setting treatment parameters.

[0189] In some of the embodiments, the control element 1064 includes but is not limited to an on / off key, a time adjustment key, and a temperature adjustment key.

[0190] In some of the embodiments, the control element 1064 is a button.

[0191] The method of use of the present invention is as follows:

[0192] (I) Installation of cover unit 1050

[0193] Place the main body element 1011 at a suitable position next to the patient, select a cover element 1051 of a suitable size according to the location of the patient's affected part, then close the side of the cover element 1051, cover the cover element 1051 on the outside of the irradiation element 1041, and use the locking element 1052 to fix the cover element 1051 on the limiting element 1023.

[0194] (II) Adjusting the height of the irradiation element 1041

[0195] By manually or automatically adjusting the height and direction of the adjustment element 1021, the cover element 1051 is aligned with the patient's affected part, and the distance between the irradiation element 1041 and the patient's affected part is within 20 cm, and the fitting at the bottom end of the cover element 1051 is fixed to the patient's leg, and the relative position of the cover element 1051 and the patient's affected part is further fixed.

[0196] (III) Treatment

[0197] The laser emitting element 1031 is turned on by the control element 1061, and a light wave with a wavelength of 600-1000nm is emitted, which is transmitted to the irradiation element 1041 through the transmission element 1032, and then the patient's affected part is irradiated. The cover element 1051 blocks the light wave; after the preset treatment time is reached, the laser emitting element 1031 automatically stops emitting the light wave.

[0198] (IV) End of treatment

[0199] Release the connection between the cover element 1051 and the patient's leg, then adjust the length and direction of the adjustment element 1021, move the irradiation element 1041 away from the patient's affected part, and manually or automatically adjust the length of the adjustment element 1021 to the minimum length, move the main element 1011 to a suitable position; if the cover element 1051 is dirty, the cover element 1051 can be cleaned.

[0200] The technical effects of the present invention are as follows:

[0201] The main unit is set as a trapezoidal body or a truncated cone body, and the adjustment unit is set as a retractable structure, so that the device is small and occupies little space, solving the problem of large volume and inconvenient storage; the control unit is used to control the laser emitting unit to emit light waves, and the height and irradiation angle of the irradiation unit are flexibly adjusted through the adjustment unit, so as to meet the use requirements and effective irradiation of different patients. The operation steps are simple, the use is flexible, and it is very friendly to home use, solving the problem of complicated operation; the cover unit is set to cover the irradiation unit, which can not only limit the distance between the irradiation unit and the irradiation position of the patient, but also prevent the irradiation unit from scattering light waves outward, improve the irradiation efficiency, protect the patient's eyesight, ensure the safety of irradiation, and avoid the patient's irradiation position from being burned. It is firmly fixed and can be cleaned at any time, solving the problem of the light shield being easy to fall off and easy to be burned; the cover unit and the adjustment unit are detachably connected, and the cover unit can be replaced according to different use requirements, thereby improving the scope of application and irradiating different affected parts of the patient.

[0202] Example 2

[0203] This embodiment is a variation of Embodiment 1.

[0204] like Fig.10 As shown, the main unit 1010 further includes a plurality of groove elements 1013 and a plurality of moving elements 1014. The plurality of groove elements 1013 are arranged at the bottom of the main element 1011 and are not connected to the interior of the main element 1011; the plurality of moving elements 1014 are arranged in the groove element 1013 and are used to move the main element 1011.

[0205] The size of the groove element 1013 matches the size of the main body element 1011. Generally, the radial size (such as outer diameter, length, width) of the groove element 1013 is less than half of the cross-sectional size (such as outer diameter, length, width) of the bottom of the main body element 1011, and the depth of the groove element 1013 is less than the height of the main body element 1011.

[0206] In some of the embodiments, the number of the groove elements 1013 is at least four, and the four groove elements 1013 are symmetrically arranged at the bottom of the main body element 1011 .

[0207] In some of the embodiments, the groove element 1013 is a groove.

[0208] The connection between the moving element 1014 and the main element 1011 is a detachable connection, wherein the detachable connection includes but is not limited to a screw connection.

[0209] The size of the moving element 1014 matches the size of the groove element 1013. Generally, the radial size (such as outer diameter, length, width) of the moving element 1014 is smaller than the radial size (such as outer diameter, length, width) of the groove element 1013; the height of the moving element 1014 is greater than the depth of the groove element 1013.

[0210] The number of moving elements 1014 matches the number of groove elements 1013. Generally, the number of moving elements 1014 is equal to the number of groove elements 1013.

[0211] In some of the embodiments, the moving element 1014 is a universal wheel.

[0212] The technical effects of this embodiment are as follows:

[0213] By setting a number of moving elements, the position of the main unit can be easily moved and the direction of the main unit can be changed, which makes it more convenient to use and greatly facilitates home treatment for elderly people with limited mobility.

[0214] Example 3

[0215] This embodiment is a variation of Embodiments 1 and 2.

[0216] like Fig.11 As shown, the main body unit 1010 further includes at least one storage element 1015. The storage element 1015 is disposed inside the main body element 1011 and is used to store the cover unit 1050.

[0217] The storage element 1015 is connected to the main element 1011 by sliding connection.

[0218] The size of the storage element 1015 matches the size of the main element 1011. Generally, the radial size (such as length and width) of the storage element 1015 is smaller than the radial size (such as length and width) of the main element 1011;

[0219] The size of the storage element 1015 matches the size of the cover element 1051. Generally, the radial size (such as length, width) of the storage element 1015 is greater than the radial size (such as length, width) of the cover element 1051.

[0220] In some of the embodiments, the number of the storage element 1015 is at least one.

[0221] In some of the embodiments, the storage element 1015 is a storage box, including but not limited to a drawer.

[0222] The technical effects of this embodiment are as follows:

[0223] By providing the storage element, the cover unit can be stored in time to prevent the cover unit from being lost and to protect the cover unit and reduce the speed at which it becomes dirty.

[0224] Example 4

[0225] This embodiment is a variation of Embodiments 1 to 3.

[0226] like Fig.12 As shown, the semiconductor laser treatment device 1000 further includes a temperature monitoring unit 1070. The temperature monitoring unit 1070 is disposed on the side of the irradiation unit 1040 and connected to the control unit 1060 to monitor the temperature of the affected part of the patient.

[0227] Specifically, the temperature monitoring unit 1070 is disposed on the second mounting element 1042 , located on the side of the irradiation element 1041 , and connected to the control element 1061 , for real-time monitoring of the temperature of the skin of the patient's affected area.

[0228] The temperature monitoring unit 1070 is connected to the second mounting element 1042 in a detachable manner, wherein the detachable connection manner includes but is not limited to a screw connection.

[0229] The size of the temperature monitoring unit 1070 matches the size of the second mounting element 1042. Generally, the radial size (eg, outer diameter, length, width) of the temperature monitoring unit 1070 is smaller than the radial size (eg, outer diameter, length, width) of the second mounting element 1042.

[0230] In some of the embodiments, the temperature monitoring unit 1070 includes but is not limited to a temperature sensor.

[0231] The method of using this embodiment is as follows:

[0232] The temperature monitoring unit 1070 monitors the temperature of the patient's affected part in real time and transmits the temperature information to the control element 1061. When the temperature of the patient's affected part exceeds a preset safe temperature range, the control element 1061 controls the laser emitting unit 1030 to stop emitting light waves.

[0233] The technical effects of this embodiment are as follows:

[0234] The temperature of the patient's affected area is monitored in real time through the temperature monitoring unit to ensure that the temperature of the affected area is within a safe range, thereby preventing the patient's affected area from being burned due to the high irradiation temperature and solving the problem of easy burns.

[0235] Example 5

[0236] This embodiment is a variation of Embodiments 1 to 4.

[0237] like Fig.13 As shown, the semiconductor laser treatment device 1000 further includes a display unit 1080. The display unit 1080 is disposed in the main unit 1010 and connected to the control unit 1060, and is used to display the working parameters of the semiconductor laser treatment device 1000.

[0238] Specifically, the display unit 1080 is disposed on a side of the main body element 1011 and is connected to the control element 1061 .

[0239] The working parameters of the semiconductor laser treatment device 1000 include but are not limited to emission wavelength, irradiation time, temperature information of the patient's affected area, etc.

[0240] The size of the display unit 1080 matches the size of the main body element 1011. Generally, the radial size (such as length, width) of the display unit 1080 is smaller than the radial size (such as outer diameter, length, width) of the side of the main body element 1011.

[0241] In some of the embodiments, the display unit 1080 includes but is not limited to a liquid crystal display.

[0242] The technical effects of this embodiment are as follows:

[0243] By setting up the display unit, patients or medical staff can grasp the treatment status of the affected part in real time, and can observe the parameter settings of the control unit through the display unit. It is more convenient and intuitive to use, avoids parameter setting errors, and ensures the effectiveness of treatment.

[0244] Example 6

[0245] This embodiment is a variation of Embodiments 1 to 5.

[0246] like Fig.14 As shown, the semiconductor laser treatment device 1000 further includes a reminder unit 1090. The reminder unit 1090 is disposed in the main unit 1010 and connected to the control unit 1060 for reminder.

[0247] Specifically, the reminder unit 1090 is disposed on the side of the main element 1011 and connected to the control element 1061, and is used to remind when an abnormality occurs in the device or the temperature of the patient's affected part is higher than a preset range.

[0248] The reminder unit 1090 is connected to the main body element 1011 in a detachable connection, wherein the detachable connection includes but is not limited to a screw connection.

[0249] The size of the reminder unit 1090 matches the size of the main body element 1011. Generally, the radial size (such as outer diameter, length, width) of the reminder unit 1090 is smaller than the radial size (such as outer diameter, length, width) of the main body element 1011.

[0250] In some of the embodiments, the reminder unit 1090 includes but is not limited to sound reminders and light reminders.

[0251] In some of the embodiments, the reminder unit 1090 is a sound player or a warning light.

[0252] The technical effects of this embodiment are as follows:

[0253] By setting up a reminder unit, when the equipment malfunctions or the temperature of the patient's affected area is too high, medical staff or patients can be reminded in time, and they can check in time to avoid affecting the treatment effect.

[0254] Example 7

[0255] This embodiment is a variation of Embodiments 1 to 6.

[0256] like Fig.15 As shown, the semiconductor laser treatment device 1000 further includes a support unit 1100. The support unit 1100 is disposed on a horizontal plane and is used to assist in adjusting the position of the cover unit 1050 to adapt to laser treatment of different parts of the patient.

[0257] like Fig.15 As shown, the support unit 1100 includes a first support element 1101, a second support element 1102, a first support element 1103 and a second support element 1104. The first support element 1101 is arranged on a horizontal plane and is located on one side of the patient's affected part; the second support element 1102 is arranged on a horizontal plane and is located on the other side of the patient's affected part; the first support element 1103 is movably arranged on the upper part of the first support element 1101 and is connected to the bottom of the cover unit 1050; the second support element 1104 is movably arranged on the upper part of the second support element 1102, and is movably connected to the first support element 1103 and is connected to the bottom of the cover unit 1050.

[0258] Specifically, the first supporting element 1103 and the second supporting element 1104 are respectively connected to the bottom of the cover element 1051 .

[0259] More specifically, the first supporting element 1103 and the second supporting element 1104 are detachably connected to the limiting members respectively.

[0260] In some of the embodiments, the first bracket element 1101 is L-shaped.

[0261] In some embodiments, the material of the first bracket element 1101 includes but is not limited to stainless steel.

[0262] In some of the embodiments, the first bracket element 1101 is a first bracket.

[0263] In some of the embodiments, the first support element 1101 is a telescopic structure, and the height of the first support element 1101 can be adjusted in the vertical direction.

[0264] The size of the second support element 1102 matches the size of the first support element 1101. Generally, the radial size (such as length and width) of the second support element 1102 is equal to the radial size (such as length and width) of the first support element 1101, and the height of the second support element 1102 is equal to the height of the first support element 1101.

[0265] In some embodiments, the second bracket element 1102 is L-shaped.

[0266] In some embodiments, the material of the second bracket element 1102 includes but is not limited to stainless steel.

[0267] In some of the embodiments, the second bracket element 1102 is a second bracket.

[0268] In some of the embodiments, the second support element 1102 is a retractable structure, and the height of the second support element 1102 can be adjusted in the vertical direction.

[0269] The first support element 1103 and the cover element 1051 are connected in a detachable manner, wherein the detachable connection manner includes but is not limited to pasting and clamping.

[0270] The first support element 1103 and the first bracket element 1101 are connected in a fixed connection or a detachable connection. The fixed connection includes but is not limited to integral molding and welding; the detachable connection includes but is not limited to screw connection.

[0271] The size of the first support element 1103 matches the size of the cover element 1051. Generally, the maximum radial size (such as length and width) of the first support element 1103 is greater than the radial size (such as length and width) of the cover element 1051, and the minimum radial size (such as length and width) of the first support element 1103 is smaller than the radial size (such as length and width) of the cover element 1051.

[0272] The size of the first support element 1103 matches the size of the first bracket element 1101. Generally, the width of the first support element 1103 is not less than the width of the first bracket element 1101.

[0273] In some of the embodiments, the first supporting element 1103 is U-shaped.

[0274] In some embodiments, the material of the first supporting element 1103 includes but is not limited to stainless steel.

[0275] In some of the embodiments, the first supporting element 1103 is a first supporting plate.

[0276] In some embodiments, at least one of the first supporting element 1103 and the second supporting element 1104 is a hollow structure.

[0277] The second supporting element 1104 is connected to the first supporting element 1103 in a sliding connection, wherein the sliding connection includes but is not limited to a damping sliding connection.

[0278] The second support element 1104 and the cover element 1051 are connected in a detachable manner, wherein the detachable connection manner includes but is not limited to pasting and clamping.

[0279] The second support element 1104 and the second bracket element 1102 are connected in a fixed connection or a detachable connection. The fixed connection includes but is not limited to integral molding and welding; the detachable connection includes but is not limited to screw connection.

[0280] The size of the second support element 1104 matches the size of the cover element 1051. Generally, the maximum radial size (such as length and width) of the second support element 1104 is greater than the radial size (such as length and width) of the cover element 1051, and the minimum radial size (such as length and width) of the second support element 1104 is smaller than the radial size (such as length and width) of the cover element 1051.

[0281] The size of the second support element 1104 matches the size of the second bracket element 1102. Generally, the width of the second support element 1104 is not less than the width of the second bracket element 1102.

[0282] In some of the embodiments, the second supporting element 1104 is U-shaped.

[0283] In some embodiments, the material of the second supporting element 1104 includes but is not limited to stainless steel.

[0284] In some embodiments, the second supporting element 1104 is a second supporting plate.

[0285] The method of using this embodiment is as follows:

[0286] When in use, first adjust the height of the first support element 1101 and the second support element 1102 to be close to the patient's affected part, then place the first support element 1101 and the second support element 1102 on the patient's affected part, then pull the first support element 1103 and the second support element 1104 to slide relative to each other, adjust the distance between the first support element 1103 and the second support element 1104 to a suitable width, and then fix the cover element 1051 to the first support element 1103 and the second support element 1104, and then start irradiating the patient's affected part. The other steps are the same as in Example 1.

[0287] The technical effects of this embodiment are as follows:

[0288] By setting up the bracket unit, the cover unit can be placed more stably on the patient's affected part, avoiding the cover unit from being unstable due to the unevenness of the affected part during the irradiation process, causing shaking or shifting that affects the irradiation effect, and can effectively irradiate the patient's knee joint, solving the problem of being unable to treat the knee joint.

[0289] Example 8

[0290] This embodiment relates to the semiconductor laser treatment system of the present invention.

[0291] like Fig.16 As shown, the semiconductor laser treatment system comprises the semiconductor laser treatment device 1000 and the remote control device 2000 described in any one of Embodiments 1 to 7. The remote control device 2000 is connected to the control unit 1060 of the semiconductor laser treatment device 1000 for controlling the semiconductor laser treatment device 1000.

[0292] Specifically, the remote control device 2000 is connected to the control element 1061 for communication, and the semiconductor laser treatment device 1000 can be controlled by the remote control device 2000 .

[0293] In some of the embodiments, the remote control device 2000 includes but is not limited to a remote controller, a smart tablet, and a mobile phone.

[0294] The technical effects of this embodiment are as follows:

[0295] By setting up a remote control device, when the control unit cannot be manually operated or it is inconvenient to operate the control unit, the patient can control the semiconductor laser treatment device through the remote control device, such as parameter setting, height and direction adjustment, which further increases the convenience of use for medical staff and patients. At the same time, it avoids the situation where the manually operated control unit fails or freezes, and the treatment cannot be carried out, solving the problem of touch screen jamming affecting treatment efficiency.

[0296] The above description is only a preferred embodiment of the present invention, and does not limit the implementation mode and protection scope of the present invention. For those skilled in the art, it should be aware that all solutions obtained by equivalent substitutions and obvious changes made using the description and illustrations of the present invention should be included in the protection scope of the present invention.

Claims

1. A semiconductor laser treatment device, characterized in that: include: A main unit, wherein the main unit is arranged on a horizontal plane; An adjustment unit, which is disposed on the top of the main unit and is used to adjust the height and angle; A laser emitting unit, which is disposed inside the main unit and inside the adjusting unit and is used to emit and transmit light waves; An irradiation unit, which is disposed at the end of the adjustment unit and connected to the laser emitting unit, and is used to adjust the irradiation height and irradiation angle under the action of the adjustment unit and receive the light waves emitted by the laser emitting unit to irradiate the patient; a cover unit, the cover unit being removably arranged to cover the irradiation unit and used to limit an irradiation distance between the irradiation unit and an affected part of a patient; A control unit, which is disposed on the main unit and connected to the laser emitting unit, and is used to control the laser emitting unit; A support unit, the support unit is arranged on a horizontal plane and is used to assist in adjusting the position of the cover unit to adapt to laser treatment of different parts of the patient; Wherein, the adjustment unit comprises: a limiting element, the limiting element being arranged at the second end of the adjusting unit and being used for fixing the cover unit; Wherein, the cover unit comprises: a cover element, wherein the cover element covers the irradiation unit and is used to limit the irradiation distance between the irradiation unit and the affected part of the patient; a locking element, the locking element being disposed at the first end of the cover element and being detachably connected to the adjustment unit; Wherein, the cover element comprises: A soft connecting piece, which covers the irradiation unit and is connected to the locking element; A plurality of hard supporting members, wherein the plurality of hard supporting members are distributed on the soft connecting member, and are used to support the soft connecting member and limit the irradiation distance between the irradiation unit and the affected part of the patient; Two adhesive members, the two adhesive members are respectively arranged on two sides of the soft connector and distributed on two different sides of the soft connector, and are used to close the soft connector; A plurality of fixing members, wherein the fixing members are distributed inside the soft connecting member and are detachably connected to the plurality of hard supporting members respectively; A plurality of stoppers, which are arranged at the bottom of the soft connector and are used to fix the bottom of the soft connector to the affected part of the patient; A plurality of fitting parts, which are arranged at the bottom of the corresponding limiting parts and are respectively connected to the limiting parts, and are used to connect the limiting parts to the affected part of the patient; Wherein, the bracket unit comprises: A first support element, the first support element is arranged in a horizontal plane and is located on one side of the patient's affected part; a second support element, the second support element being disposed in a horizontal plane and located on the other side of the patient's affected part; a first supporting element, the first supporting element being movably disposed on an upper portion of the first bracket element and connected to a bottom portion of the cover unit; The second supporting element is movably disposed on the upper portion of the second bracket element, and is movably connected to the first supporting element and connected to the bottom of the cover unit.

2. The semiconductor laser treatment device according to claim 1, characterized in that: The main unit comprises: A main body element, wherein the main body element is arranged on a horizontal plane, the adjusting unit is arranged on the top of the main body element, the laser emitting unit is arranged inside the main body element, and the control unit is arranged inside and / or on the side of the main body element; A connecting element is arranged on the top of the main body element and is used for allowing the laser emitting unit to pass through the main body element and enter the adjusting unit.

3. The semiconductor laser treatment device according to claim 2, characterized in that: The main unit also includes: A plurality of groove elements, wherein the plurality of groove elements are disposed at the bottom of the main body element and are not communicated with the interior of the main body element; a plurality of moving elements, wherein the plurality of moving elements are disposed in the groove element and are used to move the main body element; and / or At least one storage element is disposed inside the main body element and is used to store the cover unit.

4. The semiconductor laser treatment device according to claim 1, characterized in that: The adjustment unit comprises: An adjusting element, wherein the adjusting element is arranged on the top of the main unit; A first mounting element is disposed at an end of the adjusting element and is used for mounting the irradiation unit.

5. The semiconductor laser treatment device according to claim 1, characterized in that: The laser emitting unit comprises: A laser emitting element, which is disposed inside the main unit and connected to the control unit, and is used to emit light waves under the action of the control unit; A transmission element is disposed inside the adjustment unit, a first end of the transmission element is connected to the laser emitting element, and a second end of the transmission element is connected to the irradiation unit, for transmitting light waves to the irradiation unit.

6. The semiconductor laser treatment device according to claim 1, characterized in that: The irradiation unit comprises: An irradiation element, which is disposed at the end of the adjustment unit and connected to the laser emitting unit, and is used to adjust the irradiation height and irradiation angle under the action of the adjustment unit and receive the light waves emitted by the laser emitting unit to irradiate the patient; A second mounting element is disposed on the illuminating element and connected to an end of the adjusting unit.

7. The semiconductor laser treatment device according to claim 1, characterized in that: The control unit comprises: A control element, which is disposed on the main unit and connected to the laser emitting unit, and is used to control the laser emitting unit; A communication element, the communication element is connected to the control element for information transmission; A power supply element is connected to the control element for supplying power.

8. The semiconductor laser treatment device according to any one of claims 1 to 7, characterized in that: Also includes: A temperature monitoring unit, which is disposed on a side of the irradiation unit and connected to the control unit, and is used to monitor the temperature of the affected part of the patient; and / or A display unit, which is disposed on the main unit and connected to the control unit and is used to display the working parameters of the semiconductor laser treatment device; and / or A reminder unit is arranged on the main unit and connected to the control unit for reminding.

9. A semiconductor laser treatment system, characterized in that: include: The semiconductor laser treatment device according to any one of claims 1 to 8; A remote control device is communicatively connected with the control unit of the semiconductor laser treatment device and is used to control the semiconductor laser treatment device.

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