Laser power compensation method and system for optical waveguide processing based on simulation
By adopting the laser power compensation method based on simulation optical waveguide processing in photon bridging technology, the laser power loss problem caused by interference of the optical fiber cladding and the metal layer on the surface of the chip to the laser beam is solved, and efficient processing and excellent performance of the optical waveguide are achieved.
Patent Information
- Application Number
- CN202411288848.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-14
- Publication Date
- 2025-03-21
- Estimated Expiration
- 2044-09-14
AI Technical Summary
In photon bridging technology, due to interference with the laser beam by the optical fiber cladding and the metal layer on the chip surface, the laser power loss at the focus, which in turn makes the optical waveguide thinner near the vertical end face, reducing the coupling transmission efficiency, and even causing the optical waveguide device to fall off.
The laser power compensation method based on simulation light waveguide processing is adopted, and the light field distribution corresponding to the laser focus is simulated by building a simulation model, and the focal intensity data of different offset distances in the horizontal direction is obtained for normalization, and the light intensity distribution coefficient is obtained, and the product of its reciprocal and the preset change factor is set to the compensation coefficient of the laser power. Finally, the laser processing parameters are generated based on the desired size of the optical waveguide for compensation.
Accurate compensation of processing laser power is achieved, the optical waveguide shape defects caused by laser loss are avoided, and the processing quality and coupling transmission efficiency of the optical waveguide are improved.
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Figure CN118795598B_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of photon chips, and in particular relates to a simulation-based optical waveguide processing laser power compensation method and system. Background Art
[0002] Photon bridging technology uses laser nano three-dimensional direct writing technology to connect the light outlet of the silicon photonic chip with the single-mode optical fiber, thus realizing the coupling and interconnection between different optical chips and between chips and optical fibers. In photon bridging technology, the "wire" that plays a connecting role is no longer metal, but a three-dimensional optical waveguide made by laser direct writing. An optical waveguide is a dielectric device that guides the propagation of light waves, also known as a dielectric optical waveguide. There are two major categories of optical waveguides: one is an integrated optical waveguide, including planar (thin film) dielectric optical waveguides and strip dielectric optical waveguides, which are usually part of optoelectronic integrated devices (or systems), so they are called integrated optical waveguides; the other is a cylindrical optical waveguide, usually called an optical fiber (see optical fiber).
[0003] Photon bridging technology is not only an additional photon integration technology, but also a key technology for realizing three-dimensional photon integration. However, when processing the end face of the lower surface of the photon chip, such as photon bridging between the optical fiber and the optical chip, the interference of the optical fiber cladding and the metal layer on the chip surface on the laser beam leads to the loss of laser power at the focus, which makes the processed optical waveguide thinner near the vertical end face, reduces the coupling transmission efficiency, and may even cause the optical waveguide device to fall off. Summary of the invention
[0004] In view of the above-mentioned deficiencies in the prior art, the present invention provides a simulation-based optical waveguide processing laser power compensation method and system to solve the above-mentioned technical problems.
[0005] In a first aspect, the present invention provides a method for compensating laser power in optical waveguide processing based on simulation, comprising:
[0006] Building a simulation model based on actual architecture parameters, and simulating light field distribution corresponding to the laser focus based on the simulation model;
[0007] Acquiring focal point light intensity data at different lateral offset distances based on the light field distribution, and performing normalization processing on the focal point light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient;
[0008] The product of the inverse of the light intensity distribution coefficient and the preset variation factor is set as the compensation coefficient of the laser power;
[0009] generating laser processing parameters based on desired dimensions of the optical waveguide;
[0010] The laser power in the laser processing parameters is compensated based on the compensation coefficient of the laser power to obtain an optical waveguide processing file.
[0011] In an optional implementation, a simulation model is constructed based on actual architecture parameters, and a light field distribution corresponding to a laser focus is simulated based on the simulation model, including:
[0012] Obtain the material and size of the actual substrate to build a three-dimensional simulation model of the substrate;
[0013] Setting the size and boundary conditions of the simulation area according to the three-dimensional simulation model;
[0014] Adding simulation parameters to the simulation area, wherein the simulation parameters include a photoresist refractive index, a wavelength of a light source, a longitudinal propagation distance, and a numerical aperture;
[0015] Simulating the light field distribution corresponding to the laser focus based on the simulation parameters;
[0016] An analog simulation monitor is added to the simulation area to perform numerical simulation.
[0017] In an optional implementation, simulating the light field distribution corresponding to the laser focus based on the simulation parameters includes:
[0018] Customize a high numerical aperture objective lens to focus the light source. The expression for the field distribution near the focus of the high numerical aperture objective lens focusing system is:
[0019] ;
[0020] Where A is a constant related to focal length and wavelength; i is an imaginary unit, k = 2π / λ is the wave number; α = arcsin(NA / n t ) is the maximum aperture angle of the objective lens, NA is the numerical aperture of the objective lens, and n t is the refractive index of the medium in which the objective lens is immersed; P(θ) is the apodization function; θ=arcsin[rNA / (Rn t )] is the aperture angle, R is the aperture radius; the coordinates r and φ are the polar coordinates of the entrance pupil plane; x, y and z are the Cartesian coordinates of the focal plane; E t It is the transmitted field after the incident light enters the objective lens.
[0021] The focused light field distribution is expressed as the Fourier transform of the light field distribution at the rear aperture of the objective lens, and Respectively represent the spatial frequency in the x and y directions, and the expression formula is:
[0022] ;
[0023] The formula for calculating the light field distribution within a specified distance above the top surface of the photonic chip is:
[0024] ;
[0025] The size of the simulation area includes: the distance L1 from the calculated light field distribution to the upper surface of the photonic chip, the distance L2 from the upper surface of the photonic chip to the bottom of the simulation area, the width L3 of the simulation area, and the length L4 of the simulation area.
[0026] In an optional implementation, the focus light intensity data at different lateral offset distances are acquired based on the light field distribution, and the focus light intensity data at different lateral offset distances are normalized to obtain a light intensity distribution coefficient, including:
[0027] Evenly select multiple positioning points on the axis with the same z coordinate and 0 y coordinate;
[0028] Substituting the z coordinate, aperture angle and polar coordinate of the positioning point into the formula for calculating the light field distribution within a specified distance above the upper surface of the photonic chip, the light intensity value of the positioning point is obtained;
[0029] The light intensity values of each positioning point are sorted according to the x-coordinates of each positioning point to obtain the focus light intensity data of different lateral offset distances, and the focus light intensity data of different lateral offset distances are normalized to obtain the light intensity distribution coefficient.
[0030] In an optional implementation, the product of the inverse of the light intensity distribution coefficient and a preset variation factor is set as a compensation coefficient of the laser power, comprising:
[0031] The product of the reciprocal of each element in the light intensity distribution coefficient and the variation factor is set as a compensation coefficient;
[0032] The compensation coefficients are sorted according to the corresponding x-coordinates of the positioning points to obtain a compensation coefficient sequence.
[0033] In an optional embodiment, a corresponding theoretical laser processing parameter is selected based on the expected size of the optical waveguide, and a laser processing parameter is generated based on the position error between the detection light and the direct writing light and the theoretical laser processing parameter, including:
[0034] Preliminarily constructing a correspondence between the optical waveguide dimensions and laser processing parameters based on processing tests, wherein the laser processing parameters include scanning speed and laser power;
[0035] Generate theoretical laser processing parameters based on the expected size of the optical waveguide in the design file and the corresponding relationship;
[0036] extracting the desired position of the optical waveguide from the design file;
[0037] Testing the position error between the detection light and the direct writing light of the laser processing equipment, wherein the position error includes the longitudinal positioning interface deviation and the lateral positioning position deviation;
[0038] The sum of the expected position and the position error is taken as the actual position of the direct writing light.
[0039] In a second aspect, the present invention provides a simulation-based optical waveguide processing laser power compensation system, comprising:
[0040] A modeling and simulation module, used to build a simulation model based on actual architecture parameters, and simulate the light field distribution corresponding to the laser focus based on the simulation model;
[0041] A light field analysis module, used to obtain focus light intensity data at different lateral offset distances based on the light field distribution, and normalize the focus light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient;
[0042] A compensation calculation module, used for setting the product of the inverse of the light intensity distribution coefficient and a preset variation factor as a compensation coefficient of the laser power;
[0043] A parameter generation module for generating laser processing parameters based on the desired dimensions of the optical waveguide;
[0044] The power compensation module is used to compensate the laser power in the laser processing parameters based on the compensation coefficient of the laser power to obtain an optical waveguide processing file.
[0045] In an optional embodiment, the modeling and simulation module includes:
[0046] A model building unit, used to obtain the material and size of the actual substrate to build a three-dimensional simulation model of the substrate;
[0047] An area limiting unit, used for setting the size and boundary conditions of the simulation area according to the three-dimensional simulation model;
[0048] A parameter adding unit, used for adding simulation parameters to the simulation area, wherein the simulation parameters include the refractive index of the photoresist, the wavelength of the light source, the longitudinal propagation distance and the numerical aperture;
[0049] A light field simulation unit, used to simulate the light field distribution corresponding to the laser focus based on the simulation parameters;
[0050] The simulation monitoring unit is used to add an analog simulation monitor to the simulation area to perform numerical simulation.
[0051] In an optional implementation, the light field simulation unit includes:
[0052] Customize the high numerical aperture objective lens to focus the light source. The expression of the field distribution near the focus of the high numerical aperture objective lens focusing system is:
[0053] ;
[0054] Where A is a constant related to focal length and wavelength; i is an imaginary unit, k = 2π / λ is the wave number; α = arcsin(NA / n t ) is the maximum aperture angle of the objective lens, NA is the numerical aperture of the objective lens, and n t is the refractive index of the medium in which the objective lens is immersed; P(θ) is the apodization function; θ=arcsin[rNA / (Rn t )] is the aperture angle, R is the aperture radius; the coordinates r and φ are the polar coordinates of the entrance pupil plane; x, y and z are the Cartesian coordinates of the focal plane; E t It is the transmitted field after the incident light enters the objective lens.
[0055] The focused light field distribution is expressed as the Fourier transform of the light field distribution at the rear aperture of the objective lens, and Respectively represent the spatial frequency in the x and y directions, and the expression formula is:
[0056] ;
[0057] The formula for calculating the light field distribution within a specified distance above the top surface of the photonic chip is:
[0058] ;
[0059] The size of the simulation area includes: the distance L1 from the calculated light field distribution to the upper surface of the photonic chip, the distance L2 from the upper surface of the photonic chip to the bottom of the simulation area, the width L3 of the simulation area, and the length L4 of the simulation area.
[0060] In an optional implementation, the light field analysis module includes:
[0061] A positioning selection unit, used to uniformly select multiple positioning points on the axis with the same z coordinate and 0 y coordinate;
[0062] A light intensity acquisition unit is used to substitute the z coordinate, aperture angle and polar coordinate of the positioning point into a formula for calculating the light field distribution within a specified distance above the upper surface of the photon chip to obtain the light intensity value of the positioning point;
[0063] The light intensity processing unit is used to sort the light intensity values of each positioning point according to the x-coordinate of each positioning point, obtain the focus light intensity data of different lateral offset distances, and normalize the focus light intensity data of different lateral offset distances to obtain the light intensity distribution coefficient.
[0064] In a third aspect, a terminal is provided, including:
[0065] processor, memory, wherein:
[0066] The memory is used to store computer programs.
[0067] The processor is used to call and run the computer program from the memory, so that the terminal executes the above-mentioned terminal method.
[0068] According to a fourth aspect, a computer storage medium is provided, wherein the computer-readable storage medium stores instructions, and when the instructions are executed on a computer, the computer executes the methods described in the above aspects.
[0069] The beneficial effect of the present invention is that the simulation-based optical waveguide processing laser power compensation method and system provided by the present invention realizes accurate compensation of the processing laser power, thereby avoiding shape defects of the optical waveguide caused by laser loss.
[0070] In addition, the invention has a reliable design principle, a simple structure and a very broad application prospect. BRIEF DESCRIPTION OF THE DRAWINGS
[0071] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0072] Figure 1 is a schematic flow chart of a method according to an embodiment of the present invention.
[0073] Figure 2 It is a schematic diagram of a simulation area of a method according to an embodiment of the present invention.
[0074] Figure 3 4 is a graph showing the normalized maximum value of the focal point light intensity distribution and the offset distance of the method according to an embodiment of the present invention.
[0075] Figure 4 4 is a curve diagram of power compensation coefficient and offset distance of a method according to an embodiment of the present invention.
[0076] Figure 5 These are electron microscope images of the shape of the optical waveguide without compensating the laser power, where (a) is the overall electron microscope image and (b) is the local electron microscope image of the optical waveguide.
[0077] Figure 6 The following are electron microscope images of the shape of an optical waveguide after compensating the laser power according to an embodiment of the present invention, wherein (a) is an overall electron microscope image, and (b) is a local electron microscope image of the optical waveguide.
[0078] Figure 7 is a schematic block diagram of a system according to an embodiment of the present invention.
[0079] Figure 8 A schematic diagram of the structure of a terminal provided by an embodiment of the present invention.
[0080] Among them, 1. simulation structure; 2. simulation area; 3. calculated light field distribution. DETAILED DESCRIPTION
[0081] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.
[0082] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.
[0083] The simulation-based optical waveguide processing laser power compensation method provided in the embodiment of the present invention is executed by a computer device, and accordingly, the simulation-based optical waveguide processing laser power compensation system runs in the computer device.
[0084] Figure 1 is a schematic flow chart of a method according to an embodiment of the present invention. Figure 1 The execution subject may be a simulation-based optical waveguide processing laser power compensation system. According to different requirements, the order of the steps in the flow chart may be changed, and some may be omitted.
[0085] like Figure 1 As shown, the method includes:
[0086] Step 110, constructing a simulation model based on actual architecture parameters, and simulating light field distribution corresponding to the laser focus based on the simulation model;
[0087] Step 120, acquiring focal point light intensity data at different lateral offset distances based on the light field distribution, and normalizing the focal point light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient;
[0088] Step 130, setting the product of the inverse of the light intensity distribution coefficient and the preset change factor as the compensation coefficient of the laser power;
[0089] Step 140, generating laser processing parameters based on the desired dimensions of the optical waveguide;
[0090] Step 150 , compensating the laser power in the laser processing parameters based on the compensation coefficient of the laser power to obtain an optical waveguide processing file.
[0091] To facilitate understanding of the present invention, the simulation-based optical waveguide processing laser power compensation method provided by the present invention is further described below based on the principle of the simulation-based optical waveguide processing laser power compensation method of the present invention and the process of compensating the optical waveguide processing laser in the embodiment.
[0092] Specifically, the simulation-based optical waveguide processing laser power compensation method includes:
[0093] S1. Building a simulation model based on actual architecture parameters, and simulating the light field distribution corresponding to the laser focus based on the simulation model.
[0094] S101, obtaining the material and size of an actual substrate to construct a three-dimensional simulation model of the substrate.
[0095] In combination with the substrate used in the experiment, set parameters such as the material and proportional size of the simulation structure 1.
[0096] S102: Setting the size and boundary conditions of the simulation area according to the three-dimensional simulation model.
[0097] like Figure 2 As shown, the size of the simulation area 2 includes: the distance L1 from the calculated light field distribution 3 to the upper surface of the photonic chip, the distance L2 from the upper surface of the photonic chip to the bottom of the simulation area, the width L3 of the simulation area, and the length L4 of the simulation area.
[0098] In this embodiment, the sizes of the simulation area 2 may be: L1 = 8 μm, L2 = 10 μm, L3 = L4 = 20 μm.
[0099] S103, adding simulation parameters to the simulation area, wherein the simulation parameters include a photoresist refractive index, a wavelength of a light source, a longitudinal propagation distance, and a numerical aperture.
[0100] The refractive index of the simulation area is set in combination with the refractive index of the photoresist used in the experiment; the wavelength of the simulated light source, the propagation distance in the longitudinal direction, the numerical aperture and other parameters are set according to the light source and objective lens actually used in the experiment.
[0101] In this embodiment, the numerical aperture NA is fixedly set to 1.3. The background refractive index of the simulation area is 1.49, and the wavelength of the custom light source is 515 nm. The simulation structure is composed of a gold layer and silicon, and is contained in the simulation area.
[0102] S104, simulating the light field distribution corresponding to the laser focus based on the simulation parameters.
[0103] Customize a high numerical aperture objective lens to focus the light source. The expression for the field distribution near the focus of the high numerical aperture objective lens focusing system is:
[0104] ;
[0105] Where A is a constant related to focal length and wavelength; i is an imaginary unit, k = 2π / λ is the wave number; α = arcsin(NA / n t ) is the maximum aperture angle of the objective lens, NA is the numerical aperture of the objective lens, and n t is the refractive index of the medium in which the objective lens is immersed; P(θ) is the apodization function; θ=arcsin[rNA / (Rn t )] is the aperture angle, R is the aperture radius; the coordinates r and φ are the polar coordinates of the entrance pupil plane; x, y and z are the Cartesian coordinates of the focal plane; E t It is the transmitted field after the incident light enters the objective lens.
[0106] The focused light field distribution is expressed as the Fourier transform of the light field distribution at the rear aperture of the objective lens, and Respectively represent the spatial frequency in the x and y directions, and the expression formula is:
[0107] ;
[0108] The formula for calculating the light field distribution within a specified distance above the top surface of the photonic chip is:
[0109] .
[0110] S105, adding an analog simulation monitor to the simulation area to perform numerical simulation.
[0111] A simulation monitor is a tool used in software simulation to monitor specific parameters or results during a simulation in real time. It allows users to view and analyze the progress and results of a simulation in real time during the simulation run, so as to adjust the simulation settings in time or observe dynamic changes in the simulation. Specifically, users can define monitors in the simulation settings to track and record various physical quantities or field quantities, such as light field intensity, energy distribution, transmission, etc. Monitors can be set at specific spatial points or areas, or tracked along the time axis, so as to analyze in detail the dynamic changes and key information of light field focusing during the simulation.
[0112] S2. Acquire focal light intensity data at different lateral offset distances based on the light field distribution, and perform normalization processing on the focal light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient.
[0113] A plurality of positioning points are uniformly selected on an axis with the same z coordinate and a y coordinate of 0; the z coordinate, aperture angle and polar coordinate of the positioning point are substituted into a formula for calculating the light field distribution within a specified distance above the upper surface of the photonic chip to obtain the light intensity value of the positioning point; the light intensity value of each positioning point is sorted according to the x coordinate of each positioning point to obtain the focal light intensity data of different lateral offset distances, and the focal light intensity data of different lateral offset distances are normalized to obtain the light intensity distribution coefficient.
[0114] To achieve this goal, we first select multiple positioning points evenly on the axis with the same z coordinate and 0 y coordinate. These positioning points are selected to ensure that we can comprehensively and evenly analyze the changes in the light field distribution at different lateral offset distances. Next, the z coordinate, aperture angle, and polar coordinates of each positioning point are substituted into the formula for calculating the light field distribution within a specified distance above the upper surface of the photonic chip. Through this formula, we can calculate the light intensity value at each positioning point, which reflects the strength of the light field at that point. In order to more intuitively analyze the changes in the light field distribution, we sort the light intensity values of each positioning point according to their x coordinates. In this way, we obtain the focal light intensity data at different lateral offset distances, which shows how the light field intensity changes with the change of the lateral offset distance.
[0115] In order to further process these data, we normalize the focal light intensity data at different lateral offset distances. The purpose of normalization is to convert the light intensity data into a relative value, namely the light intensity distribution coefficient. This coefficient eliminates the influence of the dimension and order of magnitude of the original light intensity data, making it easier for us to compare and analyze.
[0116] The light intensity distribution coefficient is fitted into a curve, such as Figure 3 As shown in the figure, the normalized maximum value of the focal light intensity distribution is plotted against the offset distance in the lateral x direction between the focal point of the photon bridge system and the vertical plane of the photon chip. As the offset distance in the x direction gradually decreases, the closer the focal point is to the vertical end face of the photon chip, the more severe the shielding of the laser beam is. When the offset distance in the x direction is greater than 3.8 μm, the focal light field intensity basically tends to be stable, close to the state when there is no light blocking.
[0117] S3. The product of the inverse of the light intensity distribution coefficient and the preset variation factor is set as the compensation coefficient of the laser power.
[0118] The product of the reciprocal of each element in the light intensity distribution coefficient and the variation factor is set as the compensation coefficient; the compensation coefficients are sorted according to the corresponding x-coordinates of the positioning points to obtain a compensation coefficient sequence, wherein the value of the variation factor is obtained by multiple experiments.
[0119] according to Figure 3 The light intensity distribution data in the image was used to reversely deduce the laser power compensation data and plot the Figure 4 The power compensation coefficient curve is shown.
[0120] S4. Generate laser processing parameters based on the desired dimensions of the optical waveguide.
[0121] In one implementation, the expected size of the optical waveguide may be directly obtained from the design file, and appropriate laser processing parameters may be determined based on a preset correspondence between the optical waveguide size and the laser processing parameters.
[0122] In order to improve the position accuracy of the optical waveguide, in another embodiment of the present invention, the position error between the detection light and the direct writing light of the laser processing equipment is taken into account, as follows:
[0123] S401, constructing a correspondence between the optical waveguide size and the laser processing parameters based on processing tests in advance, wherein the laser processing parameters include scanning speed and laser power; and generating theoretical laser processing parameters based on the expected size of the optical waveguide in the design file and the correspondence.
[0124] Specifically, they include:
[0125] The appropriate layer height is set according to the objective lens magnification used in actual processing, and the optical waveguide array is made at different speeds and powers;
[0126] Measure the length and width of the optical waveguide array, and draw curves of length and width changing with laser power and scanning speed;
[0127] According to the drawn curve graph, find the parameters such as scanning speed and laser power corresponding to the designed length and width.
[0128] S402, extracting the expected position of the optical waveguide from the design file; testing the position error between the detection light and the direct writing light of the laser processing equipment, wherein the position error includes a longitudinal positioning interface deviation and a lateral positioning position deviation; and taking the sum of the expected position and the position error as the actual position of the direct writing light.
[0129] S5. Compensate the laser power in the laser processing parameters based on the compensation coefficient of the laser power to obtain an optical waveguide processing file.
[0130] The product of the laser power at different offset positions in the laser processing parameters and the compensation coefficient at the corresponding offset position is used as the actual laser power at the corresponding offset position, and the actual laser power is updated in the optical waveguide processing file.
[0131] According to the determined processing files, they are imported into the software system, and the processing equipment is used to process the optical waveguides between the photonic chips.
[0132] Figure 5 This is an electron microscope image of an optical waveguide prepared on the vertical end face of a photonic chip without power compensation. Figure 5 (b) The optical waveguide is Figure 5 (a) The pushed-down state. The closer the optical waveguide is to the vertical end face, the thinner it is. This is because the upper surface of the chip blocks the laser beam, resulting in damage to the laser power. During processing, a high-performance laser direct writing device (model MJ-works-fiber) from Magic Nano Technology Co., Ltd. was used. The processing parameters were a processing speed of 1.8mm / s and a laser power of 4.81mW. The objective lens was Olympus (magnification 100 times, NA 1.3), and the refractive index of the photoresist was 1.49.
[0133] Figure 6 This is the optical waveguide processing file after applying the power compensation data processing, and the electron microscope image of the optical waveguide after power compensation prepared on the vertical end face of the photonic chip. It can be seen that the optical waveguide after power compensation makes up for the missing part of the optical waveguide shape before power compensation. Figure 6 (b) The optical waveguide is Figure 6 (a) The pushed-down state. As can be seen from the figure, the optical waveguide defect has been eliminated.
[0134] In some embodiments, the simulation-based optical waveguide processing laser power compensation system may include multiple functional modules composed of computer program segments. The computer program of each program segment in the simulation-based optical waveguide processing laser power compensation system may be stored in a memory of a computer device and executed by at least one processor to perform (see Figure 1 Description) Functionality for simulation-based laser power compensation in optical waveguide processing.
[0135] In this embodiment, the optical waveguide processing laser power compensation system based on simulation can be divided into multiple functional modules according to the functions it performs, such as Figure 7 As shown. The functional modules of the system 700 may include: a modeling simulation module 710, a light field analysis module 720, a compensation calculation module 730, a parameter generation module 740 and a power compensation module 750. The module referred to in the present invention refers to a series of computer program segments that can be executed by at least one processor and can complete fixed functions, which are stored in a memory. In this embodiment, the functions of each module will be described in detail in subsequent embodiments.
[0136] A modeling and simulation module, used to build a simulation model based on actual architecture parameters, and simulate the light field distribution corresponding to the laser focus based on the simulation model;
[0137] A light field analysis module, used to obtain focus light intensity data at different lateral offset distances based on the light field distribution, and normalize the focus light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient;
[0138] A compensation calculation module, used for setting the product of the inverse of the light intensity distribution coefficient and a preset variation factor as a compensation coefficient of the laser power;
[0139] A parameter generation module for generating laser processing parameters based on the desired dimensions of the optical waveguide;
[0140] The power compensation module is used to compensate the laser power in the laser processing parameters based on the compensation coefficient of the laser power to obtain an optical waveguide processing file.
[0141] Optionally, as an embodiment of the present invention, the modeling and simulation module includes:
[0142] A model building unit, used to obtain the material and size of the actual substrate to build a three-dimensional simulation model of the substrate;
[0143] An area limiting unit, used for setting the size and boundary conditions of the simulation area according to the three-dimensional simulation model;
[0144] A parameter adding unit, used for adding simulation parameters to the simulation area, wherein the simulation parameters include the refractive index of the photoresist, the wavelength of the light source, the longitudinal propagation distance and the numerical aperture;
[0145] A light field simulation unit, used to simulate the light field distribution corresponding to the laser focus based on the simulation parameters;
[0146] The simulation monitoring unit is used to add an analog simulation monitor to the simulation area to perform numerical simulation.
[0147] Optionally, as an embodiment of the present invention, the light field simulation unit includes:
[0148] Customize a high numerical aperture objective lens to focus the light source. The expression for the field distribution near the focus of the high numerical aperture objective lens focusing system is:
[0149] ;
[0150] Where A is a constant related to focal length and wavelength; i is an imaginary unit, k = 2π / λ is the wave number; α = arcsin(NA / n t) is the maximum aperture angle of the objective lens, NA is the numerical aperture of the objective lens, and n t is the refractive index of the medium in which the objective lens is immersed; P(θ) is the apodization function; θ=arcsin[rNA / (Rn t )] is the aperture angle, R is the aperture radius; the coordinates r and φ are the polar coordinates of the entrance pupil plane; x, y and z are the Cartesian coordinates of the focal plane; E t It is the transmitted field after the incident light enters the objective lens.
[0151] The focused light field distribution is expressed as the Fourier transform of the light field distribution at the rear aperture of the objective lens, and Respectively represent the spatial frequency in the x and y directions, and the expression formula is:
[0152] ;
[0153] The formula for calculating the light field distribution within a specified distance above the top surface of the photonic chip is:
[0154] ;
[0155] The size of the simulation area includes: the distance L1 from the calculated light field distribution to the upper surface of the photonic chip, the distance L2 from the upper surface of the photonic chip to the bottom of the simulation area, the width L3 of the simulation area, and the length L4 of the simulation area.
[0156] Optionally, as an embodiment of the present invention, the light field analysis module includes:
[0157] A positioning selection unit, used to uniformly select multiple positioning points on the axis with the same z coordinate and 0 y coordinate;
[0158] A light intensity acquisition unit is used to substitute the z coordinate, aperture angle and polar coordinate of the positioning point into a formula for calculating the light field distribution within a specified distance above the upper surface of the photon chip to obtain the light intensity value of the positioning point;
[0159] The light intensity processing unit is used to sort the light intensity values of each positioning point according to the x-coordinate of each positioning point, obtain the focus light intensity data of different lateral offset distances, and normalize the focus light intensity data of different lateral offset distances to obtain the light intensity distribution coefficient.
[0160] Figure 8 The present invention is a schematic diagram of the structure of a terminal 800 provided in an embodiment of the present invention. The terminal 800 can be used to execute the simulation-based optical waveguide processing laser power compensation method provided in an embodiment of the present invention.
[0161] The terminal 800 may include: a processor 810, a memory 820 and a communication unit 830. These components communicate via one or more buses. Those skilled in the art will appreciate that the server structure shown in the figure does not limit the present invention, and it may be a bus structure or a star structure, and may include more or fewer components than shown in the figure, or combine certain components, or arrange the components differently.
[0162] The memory 820 can be used to store the execution instructions of the processor 810, and the memory 820 can be implemented by any type of volatile or non-volatile storage terminal or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk. When the execution instructions in the memory 820 are executed by the processor 810, the terminal 800 can perform some or all of the steps in the following method embodiments.
[0163] The processor 810 is the control center of the storage terminal, and uses various interfaces and lines to connect various parts of the entire electronic terminal. It runs or executes software programs and / or modules stored in the memory 820, and calls data stored in the memory to perform various functions of the electronic terminal and / or process data. The processor can be composed of an integrated circuit (IC), for example, it can be composed of a single packaged IC, or it can be composed of multiple packaged ICs with the same or different functions. For example, the processor 810 can include only a central processing unit (CPU). In the embodiment of the present invention, the CPU can be a single computing core or multiple computing cores.
[0164] The communication unit 830 is used to establish a communication channel so that the storage terminal can communicate with other terminals, receive user data sent by other terminals or send user data to other terminals.
[0165] The present invention also provides a computer storage medium, wherein the computer storage medium may store a program, and when the program is executed, the program may include some or all of the steps in each embodiment provided by the present invention. The storage medium may be a magnetic disk, an optical disk, a read-only memory (ROM) or a random access memory (RAM).
[0166] Therefore, the present invention realizes accurate compensation of the processing laser power, thereby avoiding the shape defects of the optical waveguide caused by laser loss. The technical effects that can be achieved by this embodiment can be found in the description above and will not be repeated here.
[0167] Those skilled in the art can clearly understand that the technology in the embodiments of the present invention can be implemented by means of software plus a necessary general hardware platform. Based on this understanding, the technical solution in the embodiments of the present invention, in essence or in other words, the part that contributes to the prior art, can be embodied in the form of a software product, which is stored in a storage medium such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, and other media that can store program codes, including several instructions for enabling a computer terminal (which can be a personal computer, a server, or a second terminal, a network terminal, etc.) to execute all or part of the steps of the methods described in each embodiment of the present invention.
[0168] In this specification, the same or similar parts between the various embodiments can be referred to each other. In particular, for the terminal embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the description in the method embodiment.
[0169] In the several embodiments provided by the present invention, it should be understood that the disclosed systems and methods can be implemented in other ways. For example, the system embodiments described above are only schematic. For example, the division of the modules is only a logical function division. There may be other division methods in actual implementation, such as multiple modules or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be through some interfaces, indirect coupling or communication connection of systems or modules, which can be electrical, mechanical or other forms.
[0170] The modules described as separate components may or may not be physically separated, and the components shown as modules may or may not be physical modules, that is, they may be located in one place or distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
[0171] In addition, each functional module in each embodiment of the present invention may be integrated into one processing module, or each module may exist physically separately, or two or more modules may be integrated into one module.
[0172] Although the present invention has been described in detail with reference to the accompanying drawings and in combination with the preferred embodiments, the present invention is not limited thereto. Without departing from the spirit and essence of the present invention, a person of ordinary skill in the art may make various equivalent modifications or substitutions to the embodiments of the present invention, and these modifications or substitutions shall be within the scope of the present invention. Any person of ordinary skill in the art may easily think of changes or substitutions within the technical scope disclosed by the present invention, and these shall be within the scope of protection of the present invention.
Claims
1. A method for compensating laser power in optical waveguide processing based on simulation, characterized in that: include: Building a simulation model based on actual architecture parameters, and simulating light field distribution corresponding to the laser focus based on the simulation model; Acquiring focal point light intensity data at different lateral offset distances based on the light field distribution, and performing normalization processing on the focal point light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient; The product of the inverse of the light intensity distribution coefficient and the preset variation factor is set as the compensation coefficient of the laser power; generating laser processing parameters based on desired dimensions of the optical waveguide; Compensating the laser power in the laser processing parameters based on the laser power compensation coefficient to obtain an optical waveguide processing file; A simulation model is constructed based on actual architecture parameters, and a light field distribution corresponding to the laser focus is simulated based on the simulation model, including: Obtain the material and size of the actual substrate to build a three-dimensional simulation model of the substrate; Setting the size and boundary conditions of the simulation area according to the three-dimensional simulation model; Adding simulation parameters to the simulation area, wherein the simulation parameters include a photoresist refractive index, a wavelength of a light source, a longitudinal propagation distance, and a numerical aperture; Simulating the light field distribution corresponding to the laser focus based on the simulation parameters; adding an analog simulation monitor to the simulation area to perform numerical simulation; Simulating the light field distribution corresponding to the laser focus based on the simulation parameters includes: Customize a high numerical aperture objective lens to focus the light source. The expression for the field distribution near the focus of the high numerical aperture objective lens focusing system is: ; Where A is a constant related to focal length and wavelength; i is an imaginary unit, k = 2π / λ is the wave number; α = arcsin(NA / n t ) is the maximum aperture angle of the objective lens, NA is the numerical aperture of the objective lens, and n t is the refractive index of the medium in which the objective lens is immersed; P(θ) is the apodization function; θ=arcsin[rNA / (Rn t )] is the aperture angle, R is the aperture radius; the coordinates r and φ are the polar coordinates of the entrance pupil plane; x, y and z are the Cartesian coordinates of the focal plane; E t It is the transmitted field after the incident light enters the objective lens; The focused light field distribution is expressed as the Fourier transform of the light field distribution at the rear aperture of the objective lens, and Respectively represent the spatial frequency in the x and y directions, and the expression formula is: ; The formula for calculating the light field distribution within a specified distance above the top surface of the photonic chip is: ; The size of the simulation area includes: the distance L1 from the calculated light field distribution to the upper surface of the photonic chip, the distance L2 from the upper surface of the photonic chip to the bottom of the simulation area, the width L3 of the simulation area, and the length L4 of the simulation area; Based on the light field distribution, the focus light intensity data at different lateral offset distances are acquired, and the focus light intensity data at different lateral offset distances are normalized to obtain the light intensity distribution coefficient, including: Evenly select multiple positioning points on the axis with the same z coordinate and 0 y coordinate; Substituting the z coordinate, aperture angle and polar coordinate of the positioning point into the formula for calculating the light field distribution within a specified distance above the upper surface of the photonic chip, the light intensity value of the positioning point is obtained; The light intensity values of each positioning point are sorted according to the x-coordinates of each positioning point to obtain the focus light intensity data of different lateral offset distances, and the focus light intensity data of different lateral offset distances are normalized to obtain the light intensity distribution coefficient; The product of the inverse of the light intensity distribution coefficient and the preset variation factor is set as the compensation coefficient of the laser power, comprising: The product of the reciprocal of the light intensity distribution coefficient and the variation factor is set as the compensation coefficient; The compensation coefficients are sorted according to the corresponding x-coordinates of the positioning points to obtain a compensation coefficient sequence.
2. The method according to claim 1, characterized in that Generate laser processing parameters based on the desired dimensions of the optical waveguide, including: Preliminarily constructing a correspondence between the optical waveguide dimensions and laser processing parameters based on processing tests, wherein the laser processing parameters include scanning speed and laser power; Generate theoretical laser processing parameters based on the expected size of the optical waveguide in the design file and the corresponding relationship; extracting the desired position of the optical waveguide from the design file; Testing the position error between the detection light and the direct writing light of the laser processing equipment, wherein the position error includes the longitudinal positioning interface deviation and the lateral positioning position deviation; The sum of the expected position and the position error is taken as the actual position of the direct writing light.
3. A simulation-based optical waveguide processing laser power compensation system, characterized in that: include: A modeling and simulation module, used to build a simulation model based on actual architecture parameters, and simulate the light field distribution corresponding to the laser focus based on the simulation model; A light field analysis module, used to obtain focus light intensity data at different lateral offset distances based on the light field distribution, and normalize the focus light intensity data at different lateral offset distances to obtain a light intensity distribution coefficient; A compensation calculation module, used for setting the product of the inverse of the light intensity distribution coefficient and a preset variation factor as a compensation coefficient of the laser power; A parameter generation module for generating laser processing parameters based on the desired dimensions of the optical waveguide; A power compensation module, used to compensate the laser power in the laser processing parameters based on the compensation coefficient of the laser power to obtain an optical waveguide processing file; The modeling and simulation module includes: A model building unit, used to obtain the material and size of the actual substrate to build a three-dimensional simulation model of the substrate; An area limiting unit, used for setting the size and boundary conditions of the simulation area according to the three-dimensional simulation model; A parameter adding unit, used for adding simulation parameters to the simulation area, wherein the simulation parameters include the refractive index of the photoresist, the wavelength of the light source, the longitudinal propagation distance and the numerical aperture; A light field simulation unit, used to simulate the light field distribution corresponding to the laser focus based on the simulation parameters; A simulation monitoring unit, used to add a simulation monitor to the simulation area to perform numerical simulation; The light field simulation unit comprises: Customize a high numerical aperture objective lens to focus the light source. The expression for the field distribution near the focus of the high numerical aperture objective lens focusing system is: ; Where A is a constant related to focal length and wavelength; i is an imaginary unit, k = 2π / λ is the wave number; α = arcsin(NA / n t ) is the maximum aperture angle of the objective lens, NA is the numerical aperture of the objective lens, and n t is the refractive index of the medium in which the objective lens is immersed; P(θ) is the apodization function; θ=arcsin[rNA / (Rn t )] is the aperture angle, R is the aperture radius; the coordinates r and φ are the polar coordinates of the entrance pupil plane; x, y and z are the Cartesian coordinates of the focal plane; E t It is the transmitted field after the incident light enters the objective lens; The focused light field distribution is expressed as the Fourier transform of the light field distribution at the rear aperture of the objective lens, and Respectively represent the spatial frequency in the x and y directions, and the expression formula is: ; The formula for calculating the light field distribution within a specified distance above the top surface of the photonic chip is: ; The size of the simulation area includes: the distance L1 from the calculated light field distribution to the upper surface of the photonic chip, the distance L2 from the upper surface of the photonic chip to the bottom of the simulation area, the width L3 of the simulation area, and the length L4 of the simulation area; The light field analysis module comprises: A positioning selection unit, used to uniformly select multiple positioning points on the axis with the same z coordinate and 0 y coordinate; A light intensity acquisition unit is used to substitute the z coordinate, aperture angle and polar coordinate of the positioning point into a formula for calculating the light field distribution within a specified distance above the upper surface of the photon chip to obtain the light intensity value of the positioning point; A light intensity processing unit is used to sort the light intensity values of each positioning point according to the x-coordinate of each positioning point to obtain the focus light intensity data of different lateral offset distances, and to perform normalization processing on the focus light intensity data of different lateral offset distances to obtain the light intensity distribution coefficient; The product of the inverse of the light intensity distribution coefficient and the preset variation factor is set as the compensation coefficient of the laser power, comprising: The product of the reciprocal of the light intensity distribution coefficient and the variation factor is set as the compensation coefficient; The compensation coefficients are sorted according to the corresponding x-coordinates of the positioning points to obtain a compensation coefficient sequence.
Citation Information
Patent Citations
High-uniformity laser guide plate processing method and device
CN106166649A