Quartz substrate smooth surface ultrasonic quantitative cleaning process

Abstract

The application discloses a quartz substrate smooth surface ultrasonic quantitative cleaning process and relates to the technical field of quartz substrate cleaning. In order to solve the problems of inconvenient quartz substrate cleaning process and poor cleaning effect, the application optimizes the composition of the cleaning solution, improves the cleaning efficiency, and realizes efficient cleaning effect through fine solution proportioning and gradual adding in the medium frequency analysis, and the cleaning scheme combines the advantages of low frequency and medium frequency, preliminary cleaning is first carried out to remove most of the dirt, and then fine cleaning is carried out to thoroughly remove the residues in the small gap. Through strict product detection, unqualified products can be found and processed in time in the production process, so that the unqualified products are prevented from flowing into subsequent processes or the market, production cost and quality loss are reduced, the cleaning scheme is re-established according to the comparison difference value, the maximization of the cleaning effect is ensured, the cleaning accuracy and efficiency can be significantly improved, and substrate damage caused by improper cleaning is reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of quartz substrate cleaning, in particular to a quartz substrate smooth surface ultrasonic quantitative cleaning process. BACKGROUND

[0002] Quartz substrate cleaning refers to a process of using specific methods and techniques to remove contaminants and impurities attached to the surface of the quartz substrate.

[0003] The patent application with publication number CN105127142B discloses a laser thin film element super-smooth surface fused quartz optical substrate ultrasonic cleaning method, which mainly obtains the lowest ultrasonic power and the best ultrasonic time of the 80KHz ultrasonic frequency for effectively removing micron-scale particles through the substrate experiment of spin-coating 1μm~3μm artificial silica small balls before formal ultrasonic cleaning; obtains the best proportion of ammonia water, hydrogen peroxide and pure water when the ultrasonic frequency is 400KHz through the substrate experiment of spin-coating 0.3μm~1μm artificial silica small balls, and obtains the best ultrasonic time by atomic force microscope; after obtaining the optimal ultrasonic cleaning parameters by comprehensively considering the above two aspects, the super-smooth fused quartz optical substrate is subjected to ultrasonic fine cleaning. The above patent application solves the problem of quartz substrate cleaning, but there are still the following problems in actual operation:

[0004] 1. No targeted ultrasonic quantitative cleaning scheme is formulated according to the characteristics of the quartz substrate, resulting in poor quartz substrate cleaning efficiency.

[0005] 2. The equipment involved is not further detected before the quartz substrate is subjected to ultrasonic cleaning, and the cleaning process is not recorded in time during the ultrasonic cleaning, resulting in low quartz substrate cleaning fluency and untraceable cleaning data.

[0006] 3. The quartz substrate after ultrasonic quantitative cleaning is not subjected to final product detection, and the cleaning scheme is not optimized and improved according to the final product detection result, resulting in inflexible cleaning scheme. SUMMARY

[0007] The quartz substrate smooth surface ultrasonic quantitative cleaning process provided by the application can realize efficient cleaning effect, and through strict product detection, unqualified products can be found and processed in time in the production process, thereby avoiding the unqualified products from flowing into subsequent processes or the market, reducing production cost and quality loss, and ensuring the maximization of cleaning effect according to the comparison difference to redetermine the cleaning scheme, so that the accuracy and efficiency of cleaning can be significantly improved, and substrate damage caused by improper cleaning can be reduced, and the problems in the prior art can be solved.

[0008] To achieve the above object, the application provides the following technical scheme.

[0009] A quartz substrate smooth surface ultrasonic quantitative cleaning process comprises the following steps.

[0010] S1: material selection: before the quartz substrate is subjected to ultrasonic quantitative cleaning, the quartz material is selected first, and then the quartz substrate is detected after the selection is completed, and the quartz substrate to be cleaned is obtained after the detection is completed;

[0011] S2: cleaning scheme design: the characteristics of the quartz substrate to be cleaned are analyzed, the ultrasonic quantitative cleaning scheme is formulated according to the confirmed characteristics, and the standard cleaning scheme is obtained after the formulation is completed;

[0012] S3: cleaning equipment detection: the equipment involved in the standard cleaning scheme is confirmed, each equipment is functionally detected, and the quartz substrate is prepared for cleaning after the functional detection is qualified;

[0013] S4: cleaning implementation: the quartz substrate to be cleaned is cleaned according to the standard cleaning scheme, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, and the cleaning process data are obtained after the real-time recording;

[0014] S5: quartz substrate detection: the quartz substrate cleaned by the ultrasonic quantitative cleaning is detected, and the detection result is marked as quartz substrate detection data;

[0015] S6: detection data adjustment and evaluation: the quartz substrate detection data are analyzed, the cleaning adjustment is performed according to the analysis result, the analysis result is evaluated, and finally the cleaning adjustment data and the evaluation data are transmitted to a display terminal for display.

[0016] Preferably, in S1, the quartz material is selected, and the quartz substrate is detected after the selection is completed, comprising:

[0017] The material with SiO2 content higher than 99.5% is selected as the quartz material of the quartz substrate, and after the quartz material is confirmed to be completed, the purchased quartz substrate is detected;

[0018] The detection includes appearance inspection, purity detection, size detection, shape detection, surface roughness detection, optical performance detection and chemical stability detection;

[0019] The appearance inspection is to check the defects on the surface of the quartz substrate, and the defects include cracks, bubbles and stains; the purity detection is to detect the SiO2 content and impurities by using Fourier transform infrared spectroscopy; the size detection and the shape detection are to detect whether the size and the shape of the quartz substrate meet the preset specifications by using a microscope and a projector; the surface roughness detection is to detect the roughness of the surface of the quartz substrate by using an atomic force microscope; the optical performance detection is to detect the light transmittance and the refractive index of the quartz substrate; and the chemical stability detection is to detect the corrosion resistance and the chemical stability of the quartz substrate;

[0020] After the appearance inspection, the purity detection, the size detection, the shape detection, the surface roughness detection, the optical performance detection and the chemical stability detection are all completed and qualified, each quartz substrate is uniquely coded, and the quartz substrate to be cleaned is obtained after the unique coding.

[0021] Preferably, according to the characteristic analysis of the quartz substrate to be cleaned in S2, the ultrasonic quantitative cleaning scheme is formulated according to the confirmed characteristics, including:

[0022] According to the detection results of the quartz substrate to be cleaned, the detection results are analyzed;

[0023] Before the characteristic analysis, the size of the silica oxide small balls coated on the quartz substrate is confirmed;

[0024] The quartz substrate with the size of the silica oxide small balls coated thereon being 1-3 μm is marked as low-frequency band analysis;

[0025] The quartz substrate with the size of the silica oxide small balls coated thereon being 0.3-1 μm is marked as medium-frequency band analysis;

[0026] The quartz substrates subjected to the low-frequency band analysis and the medium-frequency band analysis include physical property analysis, chemical property analysis and acoustic property analysis;

[0027] The physical property analysis is surface topography and adhesion; the chemical property analysis is contaminant type and cleaning agent selection; and the acoustic property analysis is sound wave propagation and cavitation effect.

[0028] Preferably, according to the characteristic analysis of the quartz substrate to be cleaned in S2, the ultrasonic quantitative cleaning scheme is formulated according to the confirmed characteristics, and further includes:

[0029] The low-frequency band analysis quartz substrate is subjected to ultrasonic quantitative cleaning scheme;

[0030] The ultrasonic quantitative cleaning scheme of the low-frequency band analysis quartz substrate is as follows:

[0031] S2011: Experimental equipment preparation, the experimental equipment includes an 80KHz ultrasonic cleaning tank, a Leica microscope, a clean water system, a power meter and a timer;

[0032] S2012: The quartz substrate is placed in the 80KHz ultrasonic cleaning tank, and the ultrasonic time is preset to 3 minutes, 6 minutes, 9 minutes and 12 minutes, a total of four times;

[0033] S2013: The ultrasonic output power of the 80KHz ultrasonic cleaning tank is set, wherein the initial ultrasonic output power is 100%, and the power is reduced by 10% each time, until the power is reduced to 10%, and each group of power setting is repeated at least 3 times;

[0034] S2014: The cleaning effect of the quartz substrate under different power is confirmed, and the ultrasonic output power that the final cleaning efficiency reaches 95% or more and the quartz substrate surface is not damaged is taken as the best power of the final ultrasonic cleaning scheme;

[0035] S2015: According to the best power, the quartz substrate to be cleaned is subjected to actual ultrasonic quantitative cleaning, and the cleaning data of the actual ultrasonic quantitative cleaning is summarized.

[0036] Preferably, for the characteristic analysis of the quartz substrate in S2 according to the quartz substrate to be cleaned, the ultrasonic quantitative cleaning scheme is developed according to the confirmed characteristics, which further comprises:

[0037] The low-frequency band analysis quartz substrate is subjected to ultrasonic quantitative cleaning scheme;

[0038] The ultrasonic quantitative cleaning scheme of the low-frequency band analysis quartz substrate is as follows:

[0039] S2021: Experimental equipment preparation, the experimental equipment includes a 400 kHz ultrasonic cleaning tank, an ultrasonic cleaning generator, a timer, a solution container, a pipette, a magnetic stirrer and an atomic force microscope;

[0040] S2022: The quartz substrate is placed in the 400 kHz ultrasonic cleaning tank, and the ultrasonic time is 3 minutes, and the ultrasonic power is full power;

[0041] S2023: The solution is prepared, including hydrogen peroxide, ammonia and pure water, wherein the hydrogen peroxide is 30%-35% hydrogen peroxide solution; the ammonia is 25%-28% ammonia solution; the pure water is high-purity deionized water or distilled water;

[0042] S2024: Add pure water to the 400 kHz ultrasonic cleaning tank, then gradually add hydrogen peroxide, and then gradually add ammonia, and record the amount of solution added each time;

[0043] S2025: After adding ammonia each time, run ultrasonic cleaning for 3 minutes, and then use atomic force microscope to evaluate the cleaning efficiency of the quartz substrate cleaned in S2033, and the solution with a final cleaning efficiency of more than 95% is used as the best ratio;

[0044] S2026: According to the best ratio, the quartz substrate to be cleaned is actually ultrasonically cleaned, and the cleaning data of the actual ultrasonic cleaning is summarized.

[0045] Preferably, for S2, the characteristics of the quartz substrate to be cleaned are analyzed, and the ultrasonic cleaning scheme is formulated according to the confirmed characteristics, which further comprises:

[0046] The ultrasonic cleaning scheme of the quartz substrate analyzed in the medium frequency band and the ultrasonic cleaning scheme of the quartz substrate analyzed in the low frequency band are fused to formulate a cleaning scheme;

[0047] The fusion cleaning scheme is as follows:

[0048] S2031: Prepare 80KHz and 400 kHz ultrasonic cleaning tank, Leica microscope, atomic force microscope, clean water system, power meter, timer, solution container, pipette, magnetic stirrer;

[0049] S2032: First, place the quartz substrate in the 80KHz ultrasonic cleaning tank for preliminary cleaning, with a preset ultrasonic time of 3 minutes and a power setting of 100%. After preliminary cleaning, rinse the quartz substrate with pure water;

[0050] S2033: Place the quartz substrate in the 400 kHz ultrasonic cleaning tank for fine cleaning, with a preset ultrasonic time of 3 minutes and a full power setting, and add the solution prepared according to S2023 to the 400 kHz ultrasonic cleaning tank;

[0051] S2034: Use atomic force microscope to evaluate the cleaning efficiency of the quartz substrate cleaned in S2033, when the cleaning efficiency reaches more than 95%, the final ultrasonic cleaning scheme of the quartz substrate is formulated, and the standard cleaning scheme is obtained after the formulation is completed.

[0052] Preferably, the equipment involved in the standard cleaning process in S3 is confirmed, and each equipment is functionally detected, including:

[0053] The equipment involved includes 80KHz ultrasonic cleaning tank, 400 kHz ultrasonic cleaning tank, Leica microscope, atomic force microscope, clean water system, ultrasonic cleaning generator, power meter, timer, solution container, pipette and magnetic stirrer;

[0054] Among them, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank are subjected to frequency detection, power detection, temperature control and integrity detection; the ultrasonic cleaning generator is subjected to stability detection and power adjustment; the timer is subjected to accuracy detection; the solution container and the pipette are subjected to sealing and accuracy detection; the magnetic stirrer is subjected to stirring effect detection; the Leica microscope and the atomic force microscope are subjected to imaging clarity and calibration detection; the clean water system is subjected to water quality detection; the power meter is subjected to reading detection;

[0055] After each equipment is detected and qualified, the cleaning preparation of the quartz substrate is carried out.

[0056] Preferably, the quartz substrate to be cleaned is cleaned according to the standard cleaning process in S4, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, including:

[0057] The cleaning time of each quartz substrate to be cleaned is recorded when the quartz substrate to be cleaned is cleaned, and the parameters of each stage, the solution ratio, the addition order and the amount during the cleaning process are recorded, the parameters including ultrasonic frequency, power, cleaning time and solution temperature;

[0058] At the same time, through the camera or direct observation, the changes in the cleaning process are recorded, including the generation of bubbles and the change of solution color;

[0059] The cleaning end time of each quartz substrate to be cleaned is recorded after the ultrasonic quantitative cleaning is completed, and a preliminary appearance inspection of each quartz substrate to be cleaned is carried out, which is the residual of the contaminant;

[0060] Finally, the cleaning process data is obtained.

[0061] Preferably, the quartz substrate cleaned by ultrasonic quantitative cleaning is detected in S5, including:

[0062] The quartz substrate to be cleaned cleaned by ultrasonic quantitative cleaning according to the standard cleaning process is subjected to finished product detection;

[0063] The finished product detection includes appearance inspection, roughness detection, purity detection, size detection, shape detection, optical performance detection and chemical stability detection;

[0064] The quartz substrate detection data is obtained after the finished product detection is completed.

[0065] Preferably, the quartz substrate detection data is analyzed in S6, the cleaning adjustment is made according to the analysis result, and the analysis result is evaluated, and finally the cleaning adjustment data and the evaluation data are transmitted to the display terminal for display, including:

[0066] The detection data before the quartz substrate is subjected to ultrasonic quantitative cleaning is compared and analyzed with the quartz substrate detection data;

[0067] The cleaning efficiency is evaluated according to the comparison result, and the cleaning efficiency evaluation is divided into meeting the requirements, basically meeting the requirements and not meeting the requirements;

[0068] According to the cleaning efficiency evaluation result, the attribute corresponding and adjustment are carried out, the attribute that does not meet the requirements is confirmed, and the cleaning scheme is re-established according to the comparison difference, wherein the attribute is the item of detection;

[0069] Finally, the cleaning efficiency evaluation data, the attribute corresponding and adjustment data are transmitted to the display terminal in the form of a chart for display.

[0070] Compared with the prior art, the beneficial effects of the present application are as follows:

[0071] 1. The quartz substrate smooth surface ultrasonic quantitative cleaning process provided by the present application optimizes the composition of the cleaning solution through fine solution proportioning and step-by-step addition in the medium frequency band analysis, improves the cleaning efficiency, and combines the advantages of low frequency band and medium frequency band, first performs preliminary cleaning to remove most of the dirt, and then performs fine cleaning to thoroughly remove the residues in the small gaps, thereby realizing high-efficiency cleaning effect.

[0072] 2. The quartz substrate smooth surface ultrasonic quantitative cleaning process provided by the present application ensures that all equipment is in good working condition through comprehensive equipment function confirmation and detection, reduces downtime caused by equipment failure, improves production efficiency, and ensures high controllability of the cleaning process by recording the cleaning time of each quartz substrate to be cleaned, as well as the key parameters such as ultrasonic frequency, power, cleaning time and solution temperature.

[0073] 3. The quartz substrate smooth surface ultrasonic quantitative cleaning process provided by the present application can timely discover and handle unqualified products in the production process through strict finished product detection, avoid their flow into subsequent processes or market, thereby reducing production cost and quality loss, re-establish the cleaning scheme according to the comparison difference to ensure the maximization of cleaning effect, which can significantly improve the accuracy and efficiency of cleaning, and at the same time reduce the damage to the substrate caused by improper cleaning. BRIEF DESCRIPTION OF DRAWINGS

[0074] Figure 1 A schematic diagram of the quartz substrate smooth surface ultrasonic quantitative cleaning step of the present application is shown in FIG. 1.

[0075] Figure 2 A schematic diagram of the quartz substrate smooth surface ultrasonic quantitative cleaning process of the present application is shown in FIG. 2. DETAILED DESCRIPTION

[0076] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0077] In order to solve the problem in the prior art that no targeted ultrasonic quantitative cleaning scheme is formulated according to the characteristics of the quartz substrate, thereby resulting in poor cleaning efficiency of the quartz substrate, please refer to Figure 1 and Figure 2 The present embodiment provides the following technical solutions:

[0078] A quartz substrate smooth surface ultrasonic quantitative cleaning process, comprising the following steps:

[0079] S1: Material selection: Before the quartz substrate is subjected to ultrasonic quantitative cleaning, the quartz material is selected first, and then the quartz substrate is detected after the selection is completed, and the quartz substrate to be cleaned is obtained after the detection is completed;

[0080] Among them, the quartz substrate that has been strictly screened and detected has more uniform and stable surface properties, which is conducive to the implementation of the ultrasonic cleaning process;

[0081] S2: Cleaning scheme design: the characteristics of the quartz substrate to be cleaned are analyzed, and the ultrasonic quantitative cleaning scheme is formulated according to the confirmed characteristics, and the standard cleaning scheme is obtained after the formulation is completed;

[0082] Among them, through comprehensive characteristic analysis and accurate cleaning strategy, the original physical and chemical properties of the quartz substrate can be ensured during the cleaning process;

[0083] S3: Cleaning equipment detection: the equipment involved in the standard cleaning scheme is confirmed, and each equipment is functionally detected, and the cleaning preparation of the quartz substrate is performed after the functional detection is qualified;

[0084] Among them, through comprehensive equipment function confirmation and detection, it is ensured that all the equipment is in good working condition, and the downtime caused by equipment failure is reduced;

[0085] S4: Cleaning implementation: according to the standard cleaning scheme, the quartz substrate to be cleaned is cleaned, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, and the cleaning process data is obtained after real-time recording;

[0086] Wherein, by recording the changes in the cleaning process through the camera or direct observation, the dynamic of the cleaning process can be monitored in real time, and potential problems can be found and solved in time;

[0087] S5: Quartz substrate detection: the quartz substrate after ultrasonic quantitative cleaning is detected after cleaning, and the detection result is marked as quartz substrate detection data;

[0088] Wherein, through strict finished product detection, unqualified products can be found and handled in time during production;

[0089] S6: Detection data adjustment and evaluation: analyze the quartz substrate detection data, adjust the cleaning according to the analysis result, evaluate the analysis result, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display;

[0090] Wherein, according to the comparison difference, the cleaning scheme is redeveloped to ensure the maximization of cleaning effect, which can significantly improve the accuracy and efficiency of cleaning.

[0091] For S1, the quartz material is selected, and after selection, the quartz substrate is detected, including:

[0092] Selecting materials with SiO2 content higher than 99.5% as quartz materials for quartz substrates, and detecting the purchased quartz substrates after confirming the quartz materials;

[0093] The detection includes appearance inspection, purity detection, size detection, shape detection, surface roughness detection, optical performance detection and chemical stability detection;

[0094] Wherein, the appearance inspection is to check the defects on the surface of the quartz substrate, including cracks, bubbles and stains; the purity detection is to detect the SiO2 content and impurities by Fourier transform infrared spectroscopy; the size detection and shape detection are to detect whether the size and shape of the quartz substrate meet the preset specifications by using a microscope and a projector; the surface roughness detection is to detect the roughness of the surface of the quartz substrate using an atomic force microscope; the optical performance detection is to detect the transmittance and refractive index of the quartz substrate; the chemical stability detection is to detect the corrosion resistance and chemical stability of the quartz substrate;

[0095] After the appearance inspection, purity detection, size detection, shape detection, surface roughness detection, optical performance detection and chemical stability detection are all detected and qualified, each quartz substrate is uniquely coded, and the quartz substrate to be cleaned is obtained after unique coding.

[0096] Specifically, by strictly selecting quartz materials with SiO2 content higher than 99.5% as the substrate, the high purity and excellent physical and chemical properties of the quartz substrate are ensured. This provides a solid foundation for subsequent ultrasonic cleaning processes, helping to reduce impurity pollution and chemical reactions that may occur during the cleaning process. The detection process covers multiple aspects such as appearance, purity, size, shape, surface roughness, optical performance, and chemical stability, ensuring that the quartz substrate meets the use requirements in multiple dimensions. This comprehensive detection not only improves the quality of the quartz substrate, but also provides reliable data support for subsequent cleaning processes. High-precision instruments such as Fourier transform infrared spectroscopy, microscopes, projectors, and atomic force microscopes are used for detection, improving the accuracy and reliability of the detection. These technologies can accurately measure various parameters of the quartz substrate, providing scientific basis for the optimization of the cleaning process. Each quartz substrate is uniquely coded for easy tracking and management during subsequent production and quality control processes. This coding method helps improve production efficiency and ensures that each quartz substrate is properly processed and recorded. The quartz substrate that has undergone strict screening and detection has a more uniform and stable surface, which is beneficial to the implementation of the ultrasonic cleaning process. Ultrasonic cleaning can effectively remove dirt and impurities attached to the surface of the quartz substrate using high-frequency vibrations, and high purity and uniform surface properties can help improve cleaning effectiveness and efficiency.

[0097] For the characteristic analysis of the quartz substrate according to the quartz substrate to be cleaned in S2, the ultrasonic quantitative cleaning scheme is formulated according to the confirmed characteristics, including:

[0098] According to the detection results of the quartz substrate in the quartz substrate to be cleaned, the detection results are analyzed;

[0099] Before the characteristic analysis, the size of the silica oxide balls coated on the quartz substrate is confirmed;

[0100] The quartz substrate with silica oxide balls coated on the quartz substrate with a size of 1 μm-3 μm is marked as low-frequency analysis;

[0101] The quartz substrate with silica oxide balls coated on the quartz substrate with a size of 0.3 μm-1 μm is marked as mid-frequency analysis;

[0102] The low-frequency analysis and mid-frequency analysis of the quartz substrate include physical property analysis, chemical property analysis, and acoustic property analysis;

[0103] Among them, the physical property analysis is surface topography and adhesion; the chemical property analysis is contaminant type and cleaning agent selection; and the acoustic property analysis is sound wave propagation and cavitation effect.

[0104] Specifically, by analyzing quartz substrates based on the size of their silica beads, which are categorized into low-frequency and mid-frequency bands, more precise cleaning strategies can be developed for contaminants in different size ranges. This categorization helps better understand how contaminants interact with the substrate surface, thereby optimizing cleaning performance. Physical characterization (surface morphology and adhesion), chemical characterization (contaminant type and cleaning agent selection), and acoustic characterization (acoustic wave propagation and cavitation) provide comprehensive data support for the cleaning process. These analyses help identify the nature of the contaminants, select appropriate cleaning agents, and optimize ultrasonic cleaning parameters to ensure targeted and effective cleaning. Characterizing quartz substrates allows for more effective removal of surface contaminants while minimizing substrate damage. Precise cleaning strategies can avoid surface damage caused by over-cleaning and contaminant residue from under-cleaning. Comprehensive characterization and precise cleaning strategies ensure that quartz substrates maintain their original physical and chemical properties during the cleaning process, thereby improving product reliability and stability.

[0105] Formulate a plan for ultrasonic quantitative cleaning of quartz substrates analyzed in the low frequency band;

[0106] The ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the low frequency band is as follows:

[0107] S2011: Preparation of experimental equipment, including 80KHz ultrasonic cleaning tank, Leica microscope, clean pure water system, power meter and timer;

[0108] S2012: Place the quartz substrate in an 80KHz ultrasonic cleaning tank, and the ultrasonic time is preset to 3 minutes, 6 minutes, 9 minutes and 12 minutes, for a total of four times;

[0109] S2013: setting the ultrasonic output power of the 80 kHz ultrasonic cleaning tank, wherein the initial ultrasonic output power is 100%, and the power is reduced by 10% each time the experiment is performed until the power is reduced to 10%, and each set of power settings is repeated at least 3 times;

[0110] S2014: Confirm the cleaning effect of the quartz substrate at different powers, and take the ultrasonic output power that achieves a final cleaning efficiency of more than 95% and no damage to the quartz substrate surface as the optimal power for the final ultrasonic cleaning solution;

[0111] S2015: performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal power, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

[0112] Specifically, by systematically setting different ultrasonic time and ultrasonic output power, the influence of these two key parameters on the cleaning effect can be comprehensively explored. This systematic experimental design helps to ensure the best cleaning conditions, clearly proposes that the cleaning efficiency needs to reach more than 95%, and requires that the quartz substrate surface be undamaged, which provides a clear quantitative standard for the evaluation of cleaning effect. This quantitative evaluation helps to ensure the consistency and reliability of cleaning quality, by confirming the cleaning effect at different powers and finding the best power that can ensure cleaning efficiency and avoid damage to the quartz substrate surface, which not only improves cleaning efficiency, but also prolongs the service life of the quartz substrate. The cleaning data of the actual ultrasonic cleaning are required to be summarized, which helps to continuously improve and optimize the cleaning process. Through data analysis, potential improvement points can be found to further improve cleaning quality and efficiency, which is not only suitable for low-frequency analysis of quartz substrates, but also can be adjusted as needed for other types of substrates and cleaning requirements, with strong universality and applicability, which can minimize unnecessary resource consumption while ensuring cleaning quality.

[0113] Developing an ultrasonic quantitative cleaning scheme for mid-frequency analysis quartz substrates;

[0114] The ultrasonic quantitative cleaning scheme for mid-frequency analysis quartz substrates is as follows:

[0115] S2021: Test equipment preparation, experimental equipment includes 400 kHz ultrasonic cleaning tank, ultrasonic cleaning generator, timer, solution container, pipette, magnetic stirrer and atomic force microscope;

[0116] S2022: Place the quartz substrate into the 400 kHz ultrasonic cleaning tank, the ultrasonic time is 3 minutes, and the ultrasonic power is full power;

[0117] S2023: Prepare the solution, which includes hydrogen peroxide, ammonia and pure water, wherein the hydrogen peroxide is 30%-35% hydrogen peroxide solution; the ammonia is 25%-28% ammonia solution; the pure water is high-purity deionized water or distilled water;

[0118] S2024: Add pure water to the 400 kHz ultrasonic cleaning tank, then gradually add hydrogen peroxide, and then gradually add ammonia, and record the amount of solution added each time;

[0119] S2025: After adding ammonia each time, run ultrasonic cleaning for 3 minutes, and then use the atomic force microscope to evaluate the cleaning efficiency, and the solution ratio that achieves a final cleaning effect of more than 95% is taken as the best ratio;

[0120] S2026: According to the best matching, the quartz substrate to be cleaned is actually ultrasonic quantitative cleaning, and the cleaning data of the actual ultrasonic quantitative cleaning is data summarized.

[0121] Specifically, a 400 kHz ultrasonic cleaning tank is used. The cavitation effect of ultrasonic waves of this frequency in the cleaning solution is strong, which can effectively separate the dirt from the surface of the quartz substrate and improve the cleaning efficiency. The cleaning time is set to 3 minutes to ensure the efficiency of the cleaning process, while avoiding the damage to the substrate caused by long-time ultrasonic cleaning. A magnetic stirrer is used to ensure uniform mixing of the cleaning solution, which improves the consistency of the cleaning effect. A pipette and a timer are used to accurately control the ratio of the cleaning solution and the cleaning time, making the cleaning process more controllable. By gradually adding hydrogen peroxide and ammonia, and recording the amount of each addition, the best solution ratio can be systematically explored. After adding ammonia each time, ultrasonic cleaning and cleaning efficiency evaluation are performed to ensure that the final solution ratio found is the best one, which can maximize the cleaning effect. Atomic force microscopy is used to evaluate the cleaning efficiency, which is a high-precision measurement method that can accurately reflect the surface changes before and after cleaning, thereby ensuring the accuracy of the cleaning quality. Each step has clear operation guidelines and recording requirements, making the cleaning process highly reproducible.

[0122] The ultrasonic quantitative cleaning scheme of the quartz substrate analyzed in the medium frequency band and the ultrasonic quantitative cleaning scheme of the quartz substrate analyzed in the low frequency band are fused to develop a cleaning scheme;

[0123] The fusion cleaning scheme is as follows:

[0124] S2031: Prepare 80KHz and 400 kHz ultrasonic cleaning tanks, Leica microscope, atomic force microscope, clean water system, power meter, timer, solution container, pipette, magnetic stirrer;

[0125] S2032: First, place the quartz substrate in the 80KHz ultrasonic cleaning tank for preliminary cleaning. The ultrasonic time is preset to 3 minutes, and the power is set to 100%. After preliminary cleaning, rinse the quartz substrate with pure water.

[0126] S2033: Place the quartz substrate in the 400 kHz ultrasonic cleaning tank for fine cleaning. The ultrasonic time is preset to 3 minutes, the power is set to full power, and the solution prepared according to S2023 is added to the 400 kHz ultrasonic cleaning tank.

[0127] S2034: Use the atomic force microscope to evaluate the cleaning efficiency of the quartz substrate cleaned in S2033. When the cleaning efficiency reaches 95% or more, the final ultrasonic quantitative cleaning scheme of the quartz substrate is developed. The standard cleaning scheme is obtained after the development is completed.

[0128] Specifically, the ultrasonic cleaning tank combined with 80KHz and 400kHz two different frequencies realizes the organic combination of preliminary cleaning and fine cleaning. The 80KHz ultrasonic cleaning can effectively remove most of the dirt and impurities on the surface of the quartz substrate, while the 400kHz ultrasonic cleaning can more deeply clean the small gaps and hard-to-reach areas, improving the overall cleaning efficiency. Through atomic force microscope evaluation, the cleanliness of the cleaned quartz substrate surface can be accurately measured to ensure that the cleaning efficiency reaches more than 95%. This high-precision evaluation method can ensure the consistency and reliability of the cleaning quality, meet the requirements of high-precision processes, and the ultrasonic time, power and other parameters in the cleaning scheme can be preset and adjusted, so that the cleaning process has high controllability. At the same time, using power meter and timer and other tools can accurately monitor and control the parameter changes in the cleaning process to ensure the stability and consistency of the cleaning effect, which can be adjusted and optimized according to different quartz substrate materials, pollution levels and cleaning requirements. For example, by changing the cleaning solution ratio, cleaning time and power and other parameters to adapt to different cleaning needs, in low frequency analysis, by changing the ultrasonic time and power for multiple experiments to find the best cleaning power, this method ensures the stability and reliability of the cleaning effect, in the middle frequency analysis, through the fine solution ratio and the way of gradually adding, the composition of the cleaning solution is optimized, the cleaning efficiency is improved, and the cleaning scheme combines the advantages of low frequency and middle frequency, first preliminary cleaning to remove most of the dirt, and then fine cleaning to deeply remove the residues in the small gaps, so as to realize high-efficiency cleaning effect.

[0129] In order to solve the problem that in the prior art, the equipment involved before the quartz substrate is subjected to ultrasonic cleaning is not further detected, and the cleaning process is not recorded in time when the quartz substrate is subjected to ultrasonic cleaning, so that the quartz substrate cleaning fluency is not high and the cleaning data cannot be traced, please refer to Figure 1 and Figure 2 The embodiment provides the following technical scheme:

[0130] In S3, the equipment involved in the standard cleaning scheme is confirmed, and each equipment is subjected to function detection, including:

[0131] The equipment includes an 80KHz ultrasonic cleaning tank, a 400kHz ultrasonic cleaning tank, a Leica microscope, an atomic force microscope, a clean water system, an ultrasonic cleaning generator, a power meter, a timer, a solution container, a pipette and a magnetic stirrer.

[0132] Among them, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank perform frequency detection, power detection, temperature control and integrity detection; the ultrasonic cleaning generator performs stability detection and power adjustment; the timer performs accuracy detection; the solution container and the pipette perform sealing and accuracy detection; the magnetic stirrer performs stirring effect detection; the Leica microscope and the atomic force microscope perform imaging clarity and calibration detection; the clean water system performs water quality detection; the power meter performs reading detection;

[0133] After each device is detected and qualified, the quartz substrate is prepared for cleaning.

[0134] Specifically, the 80KHz ultrasonic cleaning tank and the 400 kHz ultrasonic cleaning tank are detected by frequency to ensure that the working frequency of the cleaning tank is accurate, and suitable frequency is selected for different dirt and cleaning objects to achieve the best cleaning effect. The power detection ensures the cleaning intensity to meet different cleaning needs, the stability detection and power adjustment of the ultrasonic cleaning generator ensure that the generator can continuously and stably output ultrasonic wave energy to provide a stable ultrasonic wave source for the cleaning tank, the temperature control detection of the ultrasonic cleaning tank ensures that the temperature is constant during the cleaning process, improves the cleaning efficiency and effect, the timer accuracy detection can ensure accurate control of the cleaning time, avoid over-cleaning or insufficient cleaning, improve the cleaning precision, the sealing and accuracy detection of the solution container and the pipette can ensure the accurate amount of cleaning agent, prevent leakage, improve the cleaning effect and safety, the stirring effect detection of the magnetic stirrer can ensure uniform mixing of the cleaning agent, improve the cleaning effect, through comprehensive equipment function confirmation and detection, ensure that all equipment are in good working condition, reduce downtime caused by equipment failure, improve production efficiency, after the equipment detection is qualified, the cleaning preparation is carried out, ensure the smooth progress of the cleaning process, improve the cleaning efficiency and quality.

[0135] The quartz substrate to be cleaned is cleaned according to the standard cleaning scheme in S4, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, including:

[0136] The cleaning time of each quartz substrate to be cleaned is recorded when the quartz substrate to be cleaned is cleaned, and the parameters of each stage, the solution ratio, the addition order and the amount during the cleaning process are recorded, the parameters including ultrasonic frequency, power, cleaning time and solution temperature;

[0137] At the same time, through the camera or direct observation, the changes in the cleaning process are recorded, including the generation of bubbles and the change of solution color;

[0138] After the ultrasonic quantitative cleaning is completed, the cleaning end time of each quartz substrate to be cleaned is recorded, and a preliminary appearance inspection is performed on each quartz substrate to be cleaned, and the appearance inspection is for contaminant residue;

[0139] Finally, the cleaning process data is obtained.

[0140] Specifically, by recording the cleaning time of each quartz substrate to be cleaned, as well as the key parameters such as ultrasonic frequency, power, cleaning time and solution temperature, the high controllability of the cleaning process can be ensured. This precise control helps to achieve consistency and stability of the cleaning effect, recording the solution ratio, addition order and amount at each stage of the cleaning process can ensure that the composition and concentration of the cleaning solution are always in the best state, thereby improving the cleaning effect, by camera or direct observation to record the changes in the cleaning process such as bubble generation and solution color change, the dynamic of the cleaning process can be monitored in real time, potential problems can be found and solved in time, after the completion of ultrasonic quantitative cleaning, preliminary appearance inspection is performed on each quartz substrate to be cleaned, which can timely find the pollution residue and provide important basis for subsequent processing, the data recording during the entire cleaning process, including time, parameters, solution ratio, etc., provides rich basic data for subsequent data analysis and process optimization, ultrasonic cleaning can complete the cleaning task in a relatively short time, saving energy and time.

[0141] In order to solve the problem that in the prior art, the quartz substrate after ultrasonic quantitative cleaning is not subjected to final product detection, and the cleaning scheme is not optimized and improved according to the final product detection result, resulting in that the cleaning scheme is not flexible enough, please refer to Figure 1 and Figure 2 The embodiment provides the following technical solutions:

[0142] The detection of the quartz substrate after ultrasonic quantitative cleaning in S5 includes:

[0143] The quartz substrate to be cleaned after ultrasonic quantitative cleaning according to the standard cleaning scheme is subjected to product detection;

[0144] The product detection includes appearance inspection, roughness detection, purity detection, size detection, shape detection, optical performance detection and chemical stability detection;

[0145] The quartz substrate detection data is obtained after the product detection is completed.

[0146] Specifically, by measuring the roughness of the quartz substrate surface, it can be determined whether the ultrasonic cleaning has caused excessive wear or scratches on the substrate surface, thereby ensuring that the cleaning process does not damage the substrate surface, and the ultrasonic cleaning can efficiently remove impurities on the quartz substrate surface, and the purity test can verify whether the cleaned substrate meets the required purity requirements, which is crucial for ensuring the quality and performance of the product, and through chemical stability testing, it can be evaluated whether the cleaned quartz substrate still has good chemical stability, which is important for maintaining the performance of the quartz substrate during subsequent processing and use, the detection scheme covers appearance, roughness, purity, size, shape, optical performance, and chemical stability, which can comprehensively evaluate the quality of the cleaned quartz substrate. At the same time, these detection items can usually be automated or quickly completed, thereby improving production efficiency, through strict finished product testing, unqualified products can be found and processed in time during the production process, avoiding their flow into subsequent processes or the market, thereby reducing production costs and quality losses.

[0147] For the analysis of the quartz substrate detection data in S6, the cleaning adjustment is made according to the analysis result, and the analysis result is evaluated, and finally the cleaning adjustment data and evaluation data are transmitted to the display terminal for display, including:

[0148] Comparative analysis of the detection data before the quartz substrate is subjected to ultrasonic quantitative cleaning and the quartz substrate detection data;

[0149] According to the comparison result, the cleaning efficiency is evaluated, and the cleaning efficiency evaluation is divided into meeting the requirements, basically meeting the requirements and not meeting the requirements;

[0150] According to the cleaning efficiency evaluation result, the attribute corresponding and adjustment are carried out, the attribute that does not meet the requirements is confirmed, and the cleaning scheme is re-established according to the comparison difference, wherein the attribute is the detection item;

[0151] Finally, the cleaning efficiency evaluation data, attribute corresponding and adjustment data are transmitted to the display terminal in the form of a chart for display.

[0152] Specifically, by comparing the detection data before ultrasonic quantitative cleaning with the original detection data of the quartz substrate, the area and degree of cleaning required can be accurately identified, thereby avoiding unnecessary cleaning steps and waste of resources. The cleaning efficiency evaluation is divided into three levels: meeting the requirements, basically meeting the requirements and not meeting the requirements. This clear classification helps to quickly identify the cleaning effect and ensure efficient execution of the cleaning process. According to the cleaning efficiency evaluation results, the cleaning scheme can be adjusted accordingly. For properties that do not meet the cleaning requirements, the specific problems can be further identified, and the cleaning scheme can be redeveloped based on the comparison difference to ensure maximum cleaning effect. This dynamic adjustment of the cleaning scheme can significantly improve the accuracy and efficiency of cleaning, while reducing substrate damage caused by improper cleaning. Finally, the cleaning efficiency evaluation data, attribute correspondence and adjusted data are transmitted to the display terminal in the form of a chart for display. This data visualization makes the cleaning process more intuitive and transparent.

[0153] It should be noted that the relational terms herein, such as first and second, are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any such actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0154] Although embodiments of the present application have been shown and described, it will be understood by those having ordinary skill in the art that various changes, modifications, alternatives and variations can be made thereto without departing from the principles and spirit of the application.

Claims

1. A quartz substrate smooth surface ultrasonic quantitative cleaning process, characterized in that: The steps include: S1: Material selection: Before the quartz substrate is subjected to ultrasonic quantitative cleaning, the quartz material is first selected. After the selection is completed, the quartz substrate is tested. After the test is completed, the quartz substrate to be cleaned is obtained; S2: Cleaning plan design: Analyze the characteristics of the quartz substrate to be cleaned, formulate an ultrasonic quantitative cleaning plan based on the confirmed characteristics, and obtain a standard cleaning plan after the formulation is completed; S3: Cleaning equipment testing: Confirm the equipment involved in the standard cleaning plan, perform functional testing on each device, and prepare for cleaning the quartz substrate after the functional tests are qualified; S4: Cleaning implementation: Cleaning the quartz substrate to be cleaned according to a standard cleaning solution, and recording the cleaning process of the quartz substrate to be cleaned in real time, thereby obtaining cleaning process data; S5: Quartz substrate inspection: The quartz substrate that has been cleaned by ultrasonic quantitative cleaning is inspected after cleaning, and the inspection results are marked as quartz substrate inspection data; S6: Detection data adjustment and evaluation: Analyze the quartz substrate detection data, perform cleaning adjustments based on the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display; In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, including: Performing feature analysis on the detection results of the quartz substrates to be cleaned; Before feature analysis, the size of the silicon oxide spheres coated on the quartz substrate was confirmed; The quartz substrate coated with silicon oxide beads with a size of 1 μm-3 μm is marked as low-frequency analysis; The quartz substrate coated with silicon oxide beads with a size of 0.3 μm-1 μm is marked as the mid-frequency band analysis; The low-frequency and mid-frequency analysis of quartz substrates includes physical, chemical and acoustic properties analysis; Among them, physical property analysis includes surface morphology and adhesion; chemical property analysis includes pollutant type and cleaning agent selection; and acoustic property analysis includes sound wave propagation and cavitation effect.

2. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 1, characterized in that: After selecting the quartz material in S1, the quartz substrate will be tested, including: Select materials with SiO2 content higher than 99.5% as quartz materials for quartz substrates. After the quartz materials are confirmed, test the purchased quartz substrates. Testing includes appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical performance inspection and chemical stability inspection; Among them, appearance inspection is to check for defects on the surface of quartz substrates, including cracks, bubbles and stains; purity inspection is to detect SiO2 content and impurities using Fourier transform infrared spectroscopy; size inspection and shape inspection are to use microscopes and projectors to detect whether the size and shape of quartz substrates meet the preset specifications; surface roughness inspection is to use atomic force microscopes to detect the roughness of the surface of quartz substrates; optical performance inspection is to test the transmittance and refractive index of quartz substrates; chemical stability inspection is to test the corrosion resistance and chemical stability of quartz substrates; After the appearance inspection, purity inspection, size inspection, shape inspection, surface roughness inspection, optical performance inspection and chemical stability inspection are completed and qualified, each quartz substrate will be uniquely coded and labeled, and the quartz substrate to be cleaned will be obtained after the unique coding and labeling.

3. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 2, characterized in that: In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, which also includes: Formulate a plan for ultrasonic quantitative cleaning of quartz substrates analyzed in the low frequency band; The ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the low frequency band is as follows: S2011: Preparation of experimental equipment, including 80KHz ultrasonic cleaning tank, Leica microscope, clean pure water system, power meter and timer; S2012: Place the quartz substrate in an 80KHz ultrasonic cleaning tank, and the ultrasonic time is preset to 3 minutes, 6 minutes, 9 minutes and 12 minutes, for a total of four times; S2013: setting the ultrasonic output power of the 80 kHz ultrasonic cleaning tank, wherein the initial ultrasonic output power is 100%, and the power is reduced by 10% each time the experiment is performed until the power is reduced to 10%, and each set of power settings is repeated at least 3 times; S2014: Confirm the cleaning effect of the quartz substrate at different powers, and take the ultrasonic output power that achieves a final cleaning efficiency of more than 95% and no damage to the quartz substrate surface as the optimal power for the final ultrasonic cleaning solution; S2015: performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal power, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

4. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 3, characterized in that: In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, which also includes: Formulate a quantitative ultrasonic cleaning plan for the quartz substrate analyzed in the medium frequency band; The ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the medium frequency band is as follows: S2021: Experimental equipment preparation, including a 400 kHz ultrasonic cleaning tank, an ultrasonic cleaning generator, a timer, a solution container, a pipette, a magnetic stirrer, and an atomic force microscope; S2022: Place the quartz substrate in a 400 kHz ultrasonic cleaning tank, ultrasonic time for 3 minutes, and ultrasonic power at full power; S2023: preparing a solution comprising hydrogen peroxide, ammonia water, and pure water, wherein the hydrogen peroxide is a 30%-35% hydrogen peroxide solution; the ammonia water is a 25%-28% ammonia water solution; and the pure water is high-purity deionized water or distilled water; S2024: Add pure water to the 400 kHz ultrasonic cleaning tank. After the pure water is added, gradually add hydrogen peroxide, and then gradually add ammonia water, and record the amount of solution added each time; S2025: After each addition of ammonia water, ultrasonic cleaning is performed for 3 minutes. After the ultrasonic cleaning is completed, the cleaning efficiency is evaluated using an atomic force microscope. The solution ratio that achieves a final cleaning effect of more than 95% is regarded as the optimal ratio; S2026: Performing actual ultrasonic quantitative cleaning on the quartz substrate to be cleaned according to the optimal ratio, and summarizing the cleaning data of the actual ultrasonic quantitative cleaning.

5. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 4, characterized in that: In S2, the characteristics of the quartz substrate to be cleaned are analyzed, and an ultrasonic quantitative cleaning plan is formulated based on the confirmed characteristics, which also includes: The ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the mid-frequency band and the ultrasonic quantitative cleaning scheme for quartz substrates analyzed in the low-frequency band are integrated to formulate a cleaning scheme; The fusion cleaning scheme is as follows: S2031: Prepare 80 kHz and 400 kHz ultrasonic cleaning tanks, Leica microscope, atomic force microscope, clean pure water system, power meter, timer, solution container, pipette, and magnetic stirrer; S2032: First, place the quartz substrate in an 80KHz ultrasonic cleaning tank for preliminary cleaning. The ultrasonic time is preset to 3 minutes and the power is set to 100%. After the preliminary cleaning, rinse the quartz substrate with pure water. S2033: placing the quartz substrate in a 400 kHz ultrasonic cleaning tank for fine cleaning, with the ultrasonic time preset to 3 minutes and the power set to full power, and adding the solution prepared according to step S2023 into the 400 kHz ultrasonic cleaning tank; S2034: Use an atomic force microscope to evaluate the cleaning efficiency of the quartz substrate that has been ultrasonically cleaned in S2033. When the cleaning efficiency reaches more than 95%, a final ultrasonic quantitative cleaning plan for the quartz substrate is formulated, and a standard cleaning plan is obtained after the formulation is completed.

6. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 5, characterized in that: Confirm the equipment involved in the standard cleaning plan in S3 and perform functional testing on each equipment, including: The equipment involved includes an 80 kHz ultrasonic cleaning tank, a 400 kHz ultrasonic cleaning tank, a Leica microscope, an atomic force microscope, a clean pure water system, an ultrasonic cleaning generator, a power meter, a timer, solution containers, pipettes, and a magnetic stirrer; Among them, the 80KHz ultrasonic cleaning tank and the 400kHz ultrasonic cleaning tank are tested for frequency, power, temperature control and integrity; the ultrasonic cleaning generator is tested for stability and power adjustment; the timer is tested for accuracy; the solution container and pipette are tested for sealing and accuracy; the magnetic stirrer is tested for stirring effect; the Leica microscope and atomic force microscope are tested for imaging clarity and calibration; the clean pure water system is tested for water quality; and the power meter is tested for reading. After each device has been inspected and qualified, the quartz substrate is prepared for cleaning.

7. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 6, characterized in that: In S4, the quartz substrate to be cleaned is cleaned according to the standard cleaning solution, and the cleaning process of the quartz substrate to be cleaned is recorded in real time, including: When cleaning the quartz substrate to be cleaned, the cleaning time of each quartz substrate to be cleaned is recorded, and the parameters of each stage of the cleaning process as well as the solution ratio, addition order and amount are recorded. The parameters include ultrasonic frequency, power, cleaning time and solution temperature; At the same time, changes in the cleaning process are recorded through a camera or direct observation, including bubble generation and solution color change; After the ultrasonic quantitative cleaning is completed, the cleaning end time of each quartz substrate to be cleaned is recorded, and a preliminary appearance inspection is performed on each quartz substrate to be cleaned to check for residual contaminants; Finally, the cleaning process data is obtained.

8. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 7, characterized in that: The quartz substrate that has been ultrasonically cleaned in S5 is inspected after cleaning, including: Conduct finished product inspection on the quartz substrate to be cleaned after ultrasonic quantitative cleaning according to the standard cleaning scheme; Finished product testing includes appearance inspection, roughness inspection, purity inspection, size inspection, shape inspection, optical performance inspection and chemical stability inspection; After the finished product inspection is completed, the quartz substrate inspection data is obtained.

9. The ultrasonic quantitative cleaning process for a smooth surface of a quartz substrate according to claim 8, characterized in that: Analyze the quartz substrate inspection data in S6, make cleaning adjustments based on the analysis results, evaluate the analysis results, and finally transmit the cleaning adjustment data and evaluation data to the display terminal for display, including: Compare and analyze the test data of the quartz substrate before ultrasonic quantitative cleaning with the test data of the quartz substrate; The cleaning efficiency is evaluated based on the comparison results. The cleaning efficiency evaluation is divided into meeting the requirements, basically meeting the requirements, and not meeting the requirements. Attributes are mapped and adjusted based on the cleaning efficiency evaluation results, unsatisfied attributes are confirmed, and the cleaning plan is re-formulated based on the comparison differences, where attributes are the items tested; Finally, the cleaning efficiency evaluation data, attribute correspondence and adjustment data are transmitted to the display terminal in the form of charts for display.

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