Brain-computer interface system and brain-computer interface device

Abstract

The invention relates to a brain-computer interface system and a brain-computer interface device.The brain-computer interface system comprises an implant host and a probe connected to the implant host, the probe is used for being implanted into the intracranial position of the human body to obtain electroencephalogram signals, and the implant host is used for being implanted into the non-intracranial position of the human body and processing the electroencephalogram signals; the implant host comprises a wireless charging module and a wireless communication module, the wireless charging module is used for wirelessly charging the implant host, and the wireless communication module is used for wirelessly transmitting the electroencephalogram signals processed by the implant host. According to the brain-computer interface system, the brain-computer interface system is designed into a split type, the probe used for acquiring the electroencephalogram signals is implanted into the brain of the human body, the implant host used for processing the electroencephalogram signals is implanted into the non-brain of the human body, the implant body with the power supply part can be far away from the brain, and brain tissue damage caused by fever is avoided.

Description

Technical Field

[0001] The present disclosure relates to the field of brain-computer interface technology, and in particular to a brain-computer interface system and a brain-computer interface device. Background Art

[0002] At present, brain-computer interface devices are divided into fully implantable and semi-implantable. Semi-implantable brain-computer interface devices have the risk of infection due to exposed wounds, while fully implantable brain-computer interfaces are usually integrated into one device, which contains high-heat components such as batteries and wireless chips. Therefore, fully implantable brain-computer interfaces also have the risk of heat components damaging brain tissue. Summary of the invention

[0003] In order to solve at least one of the technical problems mentioned above, the present disclosure proposes a brain-computer interface system and a brain-computer interface device.

[0004] According to some embodiments of the present disclosure, a brain-computer interface system is provided, including an implant host and a probe connected to the implant host, the probe is used to be implanted in a human intracranial position to obtain EEG signals, and the implant host is used to be implanted in a non-intracranial position of the human body and process the EEG signals; the implant host includes a wireless charging module and a wireless communication module, the wireless charging module is used to wirelessly charge the implant host, and the wireless communication module is used to wirelessly transmit the EEG signals processed by the implant host.

[0005] Based on the above scheme, by designing the brain-computer interface system as a split type, the probe used to obtain EEG signals is implanted in the human skull, and the implant host used to process EEG signals is implanted outside the human skull. This allows the implant body with the power supply part to be kept away from the brain to avoid heat and damage to brain tissue.

[0006] In some possible implementations, the implant host is provided with a wiring module, the wiring module includes at least two different types of transmission line interfaces, and the probe is coupled to the transmission line interface of a corresponding type.

[0007] Based on the above scheme, by setting up a wiring module including multiple different types of transmission line interfaces, the implant body can be connected to different types of probes, thereby realizing different brain-computer interface functions and improving the compatibility of the implant host.

[0008] According to some other embodiments of the present disclosure, there is provided a brain-computer interface device, including a probe and an implant host, the probe including an electrode, a first signal processing module and a signal transmission line, the electrode is connected to the first signal processing module, the electrode is used to collect EEG signals, the first signal processing module is used to process the EEG signals to obtain a first processed signal, and the signal transmission line is respectively connected to the first signal processing module and the implant host; the implant host includes a second signal processing module and a wiring module, the wiring module is connected to the signal transmission line, the second signal processing module is used to process the first processed signal to obtain a second processed signal, the second signal processing module is integrated with a wireless communication module and a wireless charging module, the wireless communication module is used to wirelessly transmit the second processed signal, and the wireless charging module is used to wirelessly charge the implant host.

[0009] Based on the above scheme, the brain-computer interface device adopts a split design, and the probe and implant host are implanted in different parts of the human body respectively, which can avoid exposed wounds and thus cause infection. The first signal processing module of the probe part can perform preliminary filtering and analog-to-digital conversion on the EEG signals acquired by the electrodes, and then transmit them to the implant host for subsequent signals, which helps to improve the processing accuracy of EEG signals. The implant host adopts wireless power supply and wireless transmission methods to ensure the long-term in-body stability and practicality of the brain-computer interface device.

[0010] In some possible implementations, the wiring module includes at least two different types of transmission line interfaces, and a connection plug is provided on the signal transmission line, and the connection plug is coupled to a corresponding type of transmission line interface.

[0011] Based on the above solution, through the multiple different types of transmission line interfaces set by the wiring module, the implant host can adapt to multiple different electrode interfaces, which can improve the compatibility and comprehensiveness of the implant host.

[0012] In some possible embodiments, the first signal processing module includes a first feedthrough, a first circuit board, a first shell, a flange, and a second shell, the flange and the first shell are assembled to form a chamber space, the first feedthrough is arranged in the chamber space, and the first feedthrough is fixedly connected to the flange, the first circuit board is fixedly installed on one side of the first feedthrough, and the other side of the first feedthrough is respectively installed with the electrode and the signal transmission line, and the second shell is used to wrap and protect the assembly of the flange and the first shell.

[0013] Based on the above scheme, the first signal processing module includes a three-layer structure, namely the innermost circuit structure, the middle layer assembly fixing structure and the outermost protective shell structure. This can improve the practicality of the first signal processing module and reduce the risk of damage to the first signal processing module, thereby ensuring the safety of the probe when implanted in the human skull.

[0014] In some possible implementations, the first feedthrough is made of an insulating and water-proof material, the flange and the first shell are both made of a titanium-containing material, and the second shell is made by a silicone injection molding process.

[0015] Based on the above scheme, the first feedthrough made of insulating waterproof material can protect the chip on the circuit board and prevent the chip from failing due to contact with human tissue fluid, while the first shell and the second shell are made of titanium-containing material and silicone injection molding process respectively, which can take into account both waterproof and dustproof effects and implant safety.

[0016] In some possible embodiments, the first circuit board is fixedly mounted on the first feedthrough by soldering, the electrode is fixedly mounted on the first feedthrough by gold ball ultrasonic welding, the signal transmission line is fixedly mounted on the first feedthrough by laser spot welding, the first feedthrough is fixedly mounted on the flange by gold brazing, and the flange and the first shell are assembled and sealed by laser seam welding.

[0017] Based on the above scheme, different welding and fixing methods are adopted to ensure the stable operation of the circuit components and improve the stability and safety of the probe.

[0018] In some possible embodiments, the electrode includes at least one of the following: a cortical electrode, an intracortical electrode, or a deep brain electrode.

[0019] Based on the above scheme, the probe can realize different functions according to different electrodes, which helps to make the brain-computer interface device more comprehensive.

[0020] In some possible implementations, a fixing hole is circumferentially provided on the flange, and the fixing hole is used to fix the probe on a skull implanted in a human body.

[0021] Based on the above scheme, fixing holes are set around the flange so that the first signal processing module can be fixedly installed on the skull implanted in the human body, ensuring the stability of the probe part in the body, avoiding damage to brain tissue caused by the movement of the probe, and also helping to improve the aesthetics. After the probe is implanted in the human skull, there will be no obvious bulge on the appearance of the brain.

[0022] In some possible embodiments, the second signal processing module includes a second feedthrough, a second circuit board, a third shell and a fourth shell, the second circuit board is fixedly installed inside the third shell, the second feedthrough is installed on the second circuit board, and the second feedthrough is connected to the wiring module; the wireless communication module is installed on the second circuit board, the wireless charging module includes a wireless charging coil and a wireless power supply receiver, the wireless power supply receiver is installed on the second circuit board, and the wireless charging coil is installed on the outer side of the third shell; the fourth shell is sleeved on the third shell.

[0023] Based on the above solution, the second signal processing module also adopts a three-layer structure, namely the innermost second circuit board, the middle layer third shell and the outermost fourth shell. The layered structure can separate the signal processing components and the wireless charging module to ensure the accuracy of signal processing and reduce interference.

[0024] In some possible implementations, the fourth shell includes a titanium shell, a window is opened on one side of the titanium shell, the window is embedded with ceramic or glass, and the window is aligned with the wireless charging coil.

[0025] Based on the above solution, a window is opened in the fourth shell to install ceramic or glass to avoid the influence of titanium metal on the wireless charging module, thereby ensuring the stable operation of wireless power supply and improving the in-body stability and safety of the implant host.

[0026] In some possible implementations, the second signal processing module further includes a third circuit board, and the third circuit board is respectively connected to the second feedthrough and the second circuit board.

[0027] Based on the above solution, by additionally providing a third circuit board, the difficulty of circuit integration can be reduced and interference between signals can be reduced.

[0028] In some possible implementations, the second circuit board includes a single-chip microcomputer, a host power supply and a signal processing circuit, the host power supply is connected to the wireless power receiver, the host power supply is used to power the single-chip microcomputer and the signal processing circuit, the signal processing circuit is communicatively connected to the third circuit board, and the signal processing circuit includes a field programmable gate array, a flash memory and a dynamic cache.

[0029] Based on the above scheme, by setting up a signal processing circuit, the accuracy of EEG signal processing can be improved, thereby ensuring the stable operation of the implant host.

[0030] It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the disclosure.

[0031] Further features and aspects of the present disclosure will become apparent from the following detailed description of exemplary embodiments with reference to the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the technical solutions and advantages in the embodiments of this specification or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0033] Figure 1 The system block diagram of the brain-computer interface system according to the embodiment of the present disclosure is shown. Figure 1 ;

[0034] Figure 2 The system block diagram of the brain-computer interface system according to the embodiment of the present disclosure is shown. Figure 2 ;

[0035] Figure 3 A schematic diagram showing the structure of a probe of a brain-computer interface device according to an embodiment of the present disclosure is shown;

[0036] Figure 4 An exploded diagram of the structure of a first signal processing module according to an embodiment of the present disclosure is shown;

[0037] Figure 5 A schematic diagram showing the installation structure of a first signal processing module according to an embodiment of the present disclosure is shown;

[0038] Figure 6 A schematic diagram showing the structure of an implant host of a brain-computer interface device according to an embodiment of the present disclosure;

[0039] Figure 7 An exploded view of the structure of an implant host according to an embodiment of the present disclosure is shown;

[0040] Figure 8 A diagram showing an installation structure of a second circuit board and a third circuit board according to an embodiment of the present disclosure;

[0041] Fig. 9 A diagram showing an installation structure of a second circuit board and a third housing according to an embodiment of the present disclosure;

[0042] Fig.10 A diagram showing the installation structure of the third housing and the fourth housing according to an embodiment of the present disclosure;

[0043] Fig.11 A circuit structure diagram of a second signal processing module according to an embodiment of the present disclosure is shown.

[0044] In the figure,

[0045] 100, probe; 110, electrode; 120, first signal processing module; 121, first feedthrough; 122, first circuit board; 123, first shell; 124, flange; 125, second shell; 130, signal transmission line; 200, implant host; 210, second signal processing module; 211, second feedthrough; 212, second circuit board; 213, third shell; 214, fourth shell; 215, third circuit board; 220, wiring module; 230, wireless communication module; 240, wireless charging module. DETAILED DESCRIPTION

[0046] The following will be combined with the drawings in the embodiments of this specification to clearly and completely describe the technical solutions in the embodiments of this specification. Obviously, the described embodiments are only part of the embodiments of this specification, not all of the embodiments. Based on the embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any variations thereof are intended to cover non-exclusive inclusions, for example, a process, method, system, product, or server that includes a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products, or devices.

[0048] Various exemplary embodiments, features and aspects of the present disclosure will be described in detail below with reference to the accompanying drawings. The same reference numerals in the accompanying drawings represent elements with the same or similar functions. Although various aspects of the embodiments are shown in the accompanying drawings, the drawings are not necessarily drawn to scale unless otherwise specified.

[0049] The word “exemplary” is used exclusively herein to mean “serving as an example, example, or illustration.” Any embodiment described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other embodiments.

[0050] The term "and / or" herein is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the term "at least one" herein represents any combination of at least two of any one or more of a plurality of. For example, including at least one of A, B, and C can represent including any one or more elements selected from the set consisting of A, B, and C.

[0051] In addition, in order to better illustrate the present disclosure, numerous specific details are given in the following specific embodiments. It should be understood by those skilled in the art that the present disclosure can also be implemented without certain specific details. In some examples, methods, means, components and circuits well known to those skilled in the art are not described in detail in order to highlight the subject matter of the present disclosure.

[0052] Unless otherwise specified, the direction "front" in this article refers to the direction in which the range hood faces the user, and the direction "rear" refers to the direction in which the range hood faces away from the user. Other directions are determined based on the above-mentioned front and rear directions.

[0053] Brain-computer interface technology is a revolutionary human-computer interaction technology. Its mechanism of action is to bypass peripheral nerves and muscles and directly establish a new communication and control channel between the brain and external devices. It achieves information transmission and control by capturing brain signals and converting them into electrical signals.

[0054] At present, brain-computer interface devices are divided into fully implantable and semi-implantable. Semi-implantable brain-computer interface devices include an implant and a non-implant, which are connected by a communication line. Therefore, a wound needs to be left on the surface of the user's body to pass the communication line. The exposed wound is prone to infection, affecting the safety of use. Fully implantable brain-computer interface devices are usually integrated into a single device, which integrates multiple functional modules such as signal acquisition, signal processing, power supply, and signal transmission. The power supply module is a high-heat component module, which makes the fully implantable brain-computer interface device have the risk of heating components damaging brain tissue.

[0055] In order to solve the above technical problems, the embodiments of the present disclosure provide a brain-computer interface system, which is a fully implantable brain-computer interface, which can avoid leaving exposed wounds and thus reduce the risk of infection caused by wounds. In addition, the brain-computer interface system adopts a split design, which keeps components with high heat generation away from the brain to avoid damage to brain tissue due to heat generated by the brain-computer interface system.

[0056] Figure 1A brain-computer interface system according to an embodiment of the present disclosure is shown, the system includes an implant host and a probe connected to the implant host, wherein the probe is used to be implanted in a human intracranial position to obtain EEG signals, while the implant host is used to be implanted in a non-intracranial position of the human body and process EEG signals, and the connecting line between the implant host and the probe is also implanted in the human body.

[0057] In order to avoid leaving wounds on the body surface of the implanted object, the implant host includes a wireless charging module and a wireless communication module. The wireless charging module and the battery of the implant host together constitute the power supply part of the brain-computer interface system. The wireless charging module is used to wirelessly charge the implant host. The wireless communication module is used to wirelessly transmit the EEG signals processed by the above-mentioned implant host. Based on the wireless communication module, the implant host processes and analyzes the EEG signals obtained by the probe and generates data signals corresponding to the EEG signals. The data signals are sent to external devices through the wireless communication module to facilitate the realization of further human-computer interaction functions such as device control and information transmission.

[0058] The embodiments of the present disclosure do not limit the specific implantation position of the implant host. The implant host can be implanted in the limbs, trunk or other locations far away from the brain of the human body. The implant host is connected to the probe through a signal transmission line. The implant host obtains EEG signals through the probe. Since the potential of the EEG signal is very low, directly transmitting the EEG signal to the implant host through the signal transmission line may cause the attenuation or distortion of the EEG signal, thereby causing the implant host to be unable to correctly analyze and identify the acquired EEG signal. Therefore, a front-end signal processing component can be set on the probe. The front-end signal processing component is used to amplify, filter and perform analog-to-digital conversion on the EEG signal immediately after the probe obtains the EEG signal. The continuous EEG signal is converted into a digital signal by the front-end signal processing component and then transmitted to the implant host through the signal transmission line. Compared with the solution of directly transmitting the EEG signal to the implant host, the solution of using the front-end signal processing can solve the problem of signal loss during signal transmission, which helps to improve the accuracy of the implant host in identifying and processing the EEG signal.

[0059] In some embodiments of the present disclosure, please refer to Figure 2The implant host is provided with a wiring module, which includes at least two different types of transmission line interfaces. The type of the transmission line interface corresponds to the type of the probe. The probe can be coupled with the corresponding type of transmission line interface to achieve connection to the implant host. It can be understood that different types of probes are implanted in different positions in the skull, and the acquired EEG signals are also different. Correspondingly, different types of probes have different front-end processing methods for the EEG signals they acquire. In other words, the signal forms output by different types of probes may be different, which leads to different signal transmission protocols used by the signal transmission lines of different probes, and the types of the above-mentioned transmission line interfaces correspond to signal transmission lines with different protocols.

[0060] Based on the wiring module set on the implant host, by replacing the probe connected to the implant host, the brain-computer interface system can analyze and process different EEG signals, thereby connecting different external devices to achieve different brain-computer interface functions.

[0061] It is worth noting that the number of probes is not limited to one, that is, the implant host can be connected to only one probe, or the implant host can be connected to multiple probes. Moreover, when the implant host is connected to multiple probes, the types of the multiple probes are not limited to be consistent. For example, in some possible implementations, an implant host is connected to two probes, the two probes are of different types, the two probes use different signal connection lines, and the two signal connection lines are respectively connected to different transmission line interfaces in the above-mentioned interface module. Based on this configuration, the brain-computer interface system can process a variety of EEG signals, thereby realizing complex signal transmission and device control functions.

[0062] The above-mentioned embodiments have introduced a brain-computer interface system of a fully implantable split design. The system is fully implanted in the human body, and the high heat generating part is integrated on the implant host to avoid damage to brain tissue and improve the in vivo stability and safety of the system. By providing a wiring module on the implant host, the compatibility of the implant host can be improved. When the function of the adjustment system needs to be switched, only the probe connected to the implant host needs to be replaced. It should be understood that the above-mentioned embodiments do not limit the specific structural configuration of the probe and the implant host, and the probe and the implant host can be designed and adjusted according to actual implantation requirements.

[0063] Please refer to Figure 3-Figure 11 Based on the brain-computer interface system of the above embodiment, the present disclosure also provides a brain-computer interface device, which includes a probe 100 and an implant host 200. Figure 3As shown, the probe 100 includes an electrode 110, a first signal processing module 120 and a signal transmission line 130. The electrode 110 is connected to the first signal processing module 120. The electrode 110 is used to collect EEG signals. The first signal processing module 120 is used to process the EEG signals to obtain first processed signals. The signal transmission line 130 is respectively connected to the first signal processing module 120 and the implant host 200. It can be understood that the first signal processing module 120 is the front-end signal processing component in the above embodiment. The EEG signals collected by the electrode 110 are continuous analog signals, while the first processed signals are digital signals. The signal transmission protocol of the signal transmission line 130 is adapted to the first processed signals.

[0064] like Figure 6 As shown, the implant host 200 includes a second signal processing module 210 and a wiring module 220, the wiring module 220 is connected to the signal transmission line 130, the second signal processing module 210 is used to process the first processing signal to obtain a second processing signal, and the second signal processing module 210 is integrated with a wireless communication module 230 and a wireless charging module 240, the wireless communication module 230 is used to wirelessly transmit the second processing signal, and the wireless charging module 240 is used to wirelessly charge the implant host 200. The second processing signal is obtained after analyzing and processing the first processing signal. The present disclosure does not limit the type of the second processing signal. The second processing signal can be a restored EEG signal, or a command signal determined based on the EEG signal, etc.

[0065] In the disclosed embodiment, the wiring module 220 is used to connect the signal transmission line 130. Based on the introduction of the brain-computer interface system in the above embodiment, it can be known that different types of probes 100 have different signal transmission lines 130, which is reflected in the difference in transmission protocols. Based on the transmission protocol, the number of signal lines actually included in the signal transmission line 130 is also different (such as 4 pins, 8 pins, 16 pins, 32 pins or other numbers), so the interfaces corresponding to different signal transmission lines 130 are also different. In order to improve the application compatibility of the implant host 200, the wiring module 220 includes at least two different types of transmission line interfaces, and the signal transmission line 130 is provided with a connection plug, which is coupled to the corresponding type of transmission line interface.

[0066] Based on the above configuration, the implant host 200 and the probe 100 can be independently designed and produced. After determining the actual functional requirements of the brain-computer interface device, the corresponding probe 100 is coupled to the transmission line interface on the implant host 200 through a connecting plug. After debugging, the configuration of the brain-computer interface device can be completed.

[0067] Furthermore, since the first processed signal transmitted by the signal transmission line 130 is a digital signal, that is, the first signal processing module 120 involves analog-to-digital conversion (AD conversion), the above-mentioned transmission line interface can be further configured as a serial peripheral interface, namely, an SPI (Serial Peripheral interface) interface. SPI is a high-speed, full-duplex, synchronous communication bus, which is mainly used in EEPROM, FLASH, real-time clock, AD converter, and between digital signal processors and digital signal decoders. The brain-computer interface device of the present invention needs to process the EEG signal quickly after acquiring it. Therefore, the use of the SPI interface can ensure the real-time transmission of the signal, and the SPI interface has a small number of pins, that is, the signal transmission line 130 includes a small number of signal lines, which helps to reduce the volume of the signal transmission line 130, thereby reducing the discomfort of the implanted object.

[0068] In the disclosed embodiment, the type of the signal transmission line 130 depends on the type of the first processed signal transmitted, and the first processed signal is obtained by converting the EEG signal. The EEG signal is an electrical signal collected from brain tissue. When the collection location is different, the expression form of the EEG signal is different. Correspondingly, the electrode 110, as a component for directly collecting EEG signals, can be further divided into cortical electrodes 110, intracortical electrodes 110, deep brain electrodes 110, etc. Different electrodes 110 have different implantation locations in the skull, and the collected EEG signals are also different. Among them, the cortical electrode 110 is used to collect the field potential on the surface of the cerebral cortex, the intracortical electrode 110 is used to collect single neuron SPI KE signals or field potentials in the cortex, and the deep brain electrode 110 is used to collect field potentials or SPI KE signals in the deep brain area.

[0069] It should be understood that the present disclosure does not limit the specific selection of the electrode 110, that is, the electrode 110 can be any one of the cortical electrode 110, the intracortical electrode 110, and the deep brain electrode 110. The present disclosure does not limit the number of the electrode 110. When there are multiple electrodes 110, the electrode 110 can be multiple of the cortical electrode 110, the intracortical electrode 110, and the deep brain electrode 110; multiple electrodes 110 can be connected to the same first signal processing module 120 to form a probe 100 including multiple electrodes 110 to improve the degree of integration and facilitate implantation; or, multiple first signal processing modules 120 are set, and the multiple first signal processing modules 120 correspond one-to-one to the multiple electrodes 110 to form multiple probes 100, and the probes 100 are independent of each other to avoid signal interference, thereby improving the accuracy of EEG signal processing.

[0070] In order to improve the safety of the probe 100 when implanted in the human body, in the embodiment of the present disclosure, the first signal processing module 120 adopts a three-layer structural design, which includes a circuit structure, a fixed structure and a protective structure. The circuit structure is fixedly installed inside the fixed structure, that is, the circuit structure is the innermost layer, and the fixed structure is used to be fixedly installed on the skull. The fixed structure serves as the middle layer, and the protective structure wraps the fixed structure. The protective structure is the outermost layer, which can avoid malfunction of the internal circuit structure. Based on the three-layer structural design, the risk of damage to the first signal processing module 120 can be reduced, thereby ensuring the safety of the probe 100 when implanted in the human skull.

[0071] For details, please refer to Figure 4 and Figure 5 The first signal processing module 120 includes a first feedthrough 121, a first circuit board 122, a first shell 123, a flange 124 and a second shell 125, wherein the flange 124 and the first shell 123 are assembled to form a chamber space, the first feedthrough 121 is arranged in the above-mentioned chamber space, and the first feedthrough 121 is fixedly connected to the flange 124, the first circuit board 122 is fixedly installed on one side of the first feedthrough 121, and the other side of the first feedthrough 121 is respectively installed with an electrode 110 and a signal transmission line 130, and the electrode 110 and the signal transmission line 130 extend outside the above-mentioned chamber space. The function of the first feedthrough 121 is to serve as a passage to connect the lines inside and outside the first signal processing module 120, that is, the first feedthrough 121 can be understood as a connection structure or a connection device, which is used to connect the electrode 110 and the signal transmission line 130 to the first circuit board 122.

[0072] Based on the above configuration, the first circuit board 122 and the first feedthrough 121 constitute the above circuit structure, the assembly of the flange 124 and the first shell 123 serves as the above fixed structure, and the second shell 125 serves as the above protective structure, and the second shell 125 is used to wrap and protect the assembly of the flange 124 and the first shell 123.

[0073] In the disclosed embodiment, an EEG signal processing chip is provided on the first circuit board 122. The EEG signal processing chip is used to amplify, filter, and perform analog-to-digital conversion on the EEG signal. In order to protect the EEG signal chip and prevent failure due to contact with tissue fluid after implantation in the body, the first feedthrough 121 is made of insulating and waterproof material. In some possible implementations, the first feedthrough 121 may adopt a high-density ceramic feedthrough or a glass feedthrough. Based on the above selection, the effects of sealing insulation, waterproofing, and dustproofing can be achieved, thereby protecting the first circuit board 122.

[0074] For details, please refer to Figure 5The first circuit board 122 is installed on one side of the first feedthrough 121 close to the flange 124. The first feedthrough 121 and the flange 124 work together to achieve sealing protection for the first circuit board 122. The first circuit board 122 is fixedly installed on the first feedthrough 121 by soldering. Since the first feedthrough 121 is made of ceramic or glass, the first feedthrough 121 needs to be fixedly installed on the flange 124 by gold brazing. The other side of the first feedthrough 121 is connected to the electrode 110 and the signal transmission line 130 respectively. Figure 5 It can be seen that the electrode 110 includes an electrode 110 wire and an electrode 110 body. The electrode 110 body is used to directly contact the brain tissue to obtain EEG signals. The electrode 110 wire sends the EEG signals obtained by the electrode 110 body to the EEG signal processing chip on the first circuit board 122. The end of the electrode 110 wire away from the electrode 110 body is fixedly mounted on the first feedthrough 121 by gold ball ultrasonic welding; and the two ends of the signal transmission line 130 are respectively connected to the first feedthrough 121 and the wiring module 220. The end of the signal transmission line 130 connected to the wiring module 220 is provided with a connection plug, and the other end of the signal transmission line 130 is fixedly mounted on the first feedthrough 121 by laser spot welding. After completing the above welding, the flange 124 and the first shell 123 are finally assembled and sealed by laser seam welding.

[0075] Based on the above installation configuration, further, the flange 124 and the first shell 123 are both made of titanium-containing materials, that is, the flange 124 and the first shell 123 are both titanium alloy materials, so that the first probe 100 will not produce a rejection reaction after being implanted in the body, thereby ensuring the safety of the implantation. In the disclosed embodiment, the purpose of setting the second shell 125 is to wrap and protect the flange 124 and the first shell 123 after the assembly and sealing. Therefore, the second shell 125 is formed by wrapping the whole after the other components of the first signal module are welded as a whole through a silicone injection molding process. The second shell 125 formed based on the silicone injection molding process can further enhance the overall sealing and insulation effect, thereby enhancing the in-body stability of the first signal processing module 120.

[0076] In this embodiment, please refer to Figure 4 and Figure 5, the flange 124 is provided with fixing holes circumferentially, and the fixing holes are used to fix the probe 100 and then implant it into the human skull. When the probe 100 is implanted into the human skull, the electrode 110 is placed at the corresponding brain tissue position according to the selection category of the electrode 110, and the first signal processing module 120 is fixedly installed on the skull. The first signal processing module 120 can be fixed by passing bone screws or other fixing parts through the fixing holes circumferentially provided on the flange 124. The above fixing scheme can enhance the in-body stability of the probe 100. The first signal processing module 120 is fixed on the skull to avoid signal processing errors caused by movement. In addition, it also helps to improve the aesthetics. After the probe 100 is implanted, it will not show obvious protrusions in appearance.

[0077] In the embodiment of the present disclosure, the second signal processing module 210 also adopts a multi-layer structure design to enhance the in-body stability of the implant host 200. Figure 7 The second signal processing module 210 includes a second feedthrough 211, a second circuit board 212, a third housing 213 and a fourth housing 214. The second circuit board 212 is fixedly mounted inside the third housing 213. The second feedthrough 211 is mounted on the second circuit board 212. The second feedthrough 211 is connected to the wiring module 220. The wireless communication module 230 is mounted on the second circuit board 212. Similar to the first feedthrough 121, the second feedthrough 211 serves as a connector to connect the second circuit board 212 and the wiring module 220 to prevent human tissue fluid from entering the second circuit board 212 and causing damage to the device.

[0078] Based on the above structure, after the first processed signal is transmitted to the second circuit board 212 through the wiring module 220 and the second feedthrough 211, the second circuit board 212 further processes the first processed signal to obtain a second processed signal, and then the wireless communication module 230 wirelessly transmits the second processed signal to an external device to complete the transmission of the EEG signal.

[0079] In the disclosed embodiment, please refer to Fig. 9 The wireless charging module 240 includes a wireless charging coil and a wireless power receiver. The wireless power receiver is mounted on the second circuit board 212, and the wireless charging coil is mounted on the outer side of the third shell 213. The third shell 213 separates the wireless charging coil from the second circuit board 212 inside to prevent the wireless charging coil from causing signal interference to the components on the second circuit board 212. Fig.10The fourth housing 214 is sleeved on the third housing 213 to protect the wireless charging coil and the third housing 213. Based on the above configuration, the second signal processing module 210 also forms a three-layer structure, which is the innermost circuit structure of the second circuit board 212, the middle layer structure of the third housing 213 and the outermost structure of the fourth housing 214. The three-layer structure can ensure the normal operation of the second circuit board 212 and the in-body stability of the implant host 200.

[0080] In some possible embodiments, please refer to Figure 7 A shielding plate is provided on the outer side of the third shell 213, and the wireless charging coil is installed on the side of the shielding plate away from the third shell 213. The shielding plate is used to prevent signal interference between the wireless charging coil and the circuit board, thereby ensuring the accuracy of the second signal processing module 210 in processing the EEG signal.

[0081] For further information, please refer to Fig.10 The fourth shell 214 in the embodiment of the present disclosure includes a titanium shell, and a window is provided on one side of the titanium shell. The window is embedded with a cover plate made of ceramic or glass, and the window is aligned with the wireless charging coil. The purpose of opening a window and setting a cover plate is to prevent the all-metal shell from affecting the charging efficiency of the wireless charging coil, and it can also help reduce the heat generated by the second signal processing module 210. In the present disclosure, the ceramic or glass cover plate needs to be sealed with the fourth shell 214 to prevent tissue fluid from infiltrating into the fourth shell 214 or the third shell 213 after implantation in the human body, causing damage to the second circuit board 212. Therefore, the ceramic or glass cover plate is fixedly mounted on the fourth shell 214 by gold brazing.

[0082] For further information, please refer to Figure 6 and Figure 7 In some specific embodiments, the ceramic or glass cover plate adopts a circular design, and correspondingly, the third shell 213 and the fourth shell 214 are also configured as a quasi-circular structure. The circular cover plate can directly correspond to the wireless charging coil, which helps to reduce the overall volume of the implant host 200, facilitates its implantation in the human body, and reduces the discomfort of the implanted object.

[0083] Optionally, in some specific embodiments, the second signal processing module 210 based on the above three-layer structure can also be wrapped and protected as a whole through a silicone injection molding process to further improve the sealing and waterproof performance, thereby enhancing the in-body stability of the implant host 200.

[0084] Please refer to Figure 7 and Figure 8In the embodiment of the present disclosure, the second signal processing module 210 further includes a third circuit board 215, which is disposed on one side of the second circuit board 212. The third circuit board 215 is connected with the second feedthrough 211, and the side of the second feedthrough 211 that is not connected to the third circuit board 215 is connected to the wiring module 220. The third circuit board 215 is provided with a plurality of solder joints, which can connect each lead on the feedthrough 211 to the corresponding lead on the second circuit board 212. The present disclosure additionally arranges the third circuit board 215 to be installed and connected with the second feedthrough 211, which helps to simplify the structure of the second circuit board 212 and the structure of the implant host 200, and improves the sealing of the implant host 200, so as to prevent the infiltration of human tissue fluid into and damage to the second circuit board 212.

[0085] Furthermore, Fig.11 FIG. 2 shows a schematic diagram of the circuit structure of the second signal processing module 210 according to an embodiment of the present disclosure. Fig.11 In the disclosed embodiment, the second circuit board 212 includes a single-chip microcomputer, a host power supply and a signal processing circuit. The host power supply is connected to a wireless charging receiver. The current generated by the wireless charging coil is transmitted to the host power supply through the wireless charging receiver. The host power supply is used to power the single-chip microcomputer and the signal processing circuit, wherein the signal processing circuit is communicatively connected to the third circuit board 215, and the signal processing circuit includes a field programmable gate array (FPGA), a flash memory (FLASH) and a dynamic cache. The third circuit board 215 includes a differential connector and a probe 100 power supply. The probe 100 power supply is used to power the probe 100 connected to the implant host 200. Specifically, the probe 100 power supply obtains an electrical signal from the host power supply and converts it into an electrical signal form that can be used by the probe 100. The differential interface is used to perform differential processing on the connector input signal and the host output signal respectively. By differentially processing the signal, the EEG signal under the digital signal can be accurately identified, and the differential signal is highly immune to external electromagnetic interference, which can reduce the risk of external signal interference. Based on the differential interface, the working stability of the brain-computer interface device can be further improved.

[0086] The above-mentioned multiple embodiments have described in detail a brain-computer interface device of the present disclosure. In the absence of conflicts, the solutions of different embodiments can be freely combined to form new solutions, and the present disclosure will not repeat them. In addition, it is worth noting that some functional modules of the present disclosure are not specifically limited, and should be interpreted broadly when understanding functional modules. For example, the embodiments of the present disclosure do not limit the specific selection of wireless communication module 230. Wireless communication module 230 can be such as Fig.11 The Bluetooth module shown, the wireless communication module 230 may also be a WiFi module or other modules with wireless communication function.

[0087] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A brain-computer interface system, characterized in that: It includes an implant host and a probe connected to the implant host, the probe is used to be implanted in a human intracranial position to obtain brain electrical signals, and the implant host is used to be implanted in a non-intracranial position of a human body and process the brain electrical signals; The implant host includes a wireless charging module and a wireless communication module. The wireless charging module is used to wirelessly charge the implant host, and the wireless communication module is used to wirelessly transmit the EEG signal processed by the implant host.

2. The brain-computer interface system according to claim 1, characterized in that: The implant host is provided with a wiring module, which includes at least two different types of transmission line interfaces, and the probe is coupled to the corresponding type of the transmission line interface.

3. A brain-computer interface device, characterized in that: It includes a probe and an implant host, the probe includes an electrode, a first signal processing module and a signal transmission line, the electrode is connected to the first signal processing module, the electrode is used to collect EEG signals, the first signal processing module is used to process the EEG signals to obtain a first processed signal, and the signal transmission line is respectively connected to the first signal processing module and the implant host; The implant host includes a second signal processing module and a wiring module, the wiring module is connected to the signal transmission line, the second signal processing module is used to process the first processing signal to obtain a second processing signal, the second signal processing module is integrated with a wireless communication module and a wireless charging module, the wireless communication module is used to wirelessly transmit the second processing signal, and the wireless charging module is used to wirelessly charge the implant host.

4. The brain-computer interface device according to claim 3, characterized in that: The wiring module includes at least two different types of transmission line interfaces. A connection plug is provided on the signal transmission line, and the connection plug is coupled to the transmission line interface of the corresponding type.

5. The brain-computer interface device according to claim 3 or 4, characterized in that: The first signal processing module includes a first feedthrough, a first circuit board, a first shell, a flange and a second shell. The flange and the first shell are assembled to form a chamber space. The first feedthrough is arranged in the chamber space, and the first feedthrough is fixedly connected to the flange. The first circuit board is fixedly installed on one side of the first feedthrough, and the other side of the first feedthrough is respectively installed with the electrode and the signal transmission line. The second shell is used to wrap and protect the assembly of the flange and the first shell.

6. The brain-computer interface device according to claim 5, characterized in that: The first feedthrough is made of an insulating and water-proof material, the flange and the first shell are both made of a titanium-containing material, and the second shell is made by a silicone injection molding process.

7. The brain-computer interface device according to claim 6, characterized in that: The first circuit board is fixedly mounted on the first feedthrough by soldering, the electrode is fixedly mounted on the first feedthrough by gold ball ultrasonic welding, the signal transmission line is fixedly mounted on the first feedthrough by laser spot welding, the first feedthrough is fixedly mounted on the flange by gold brazing, and the flange and the first shell are assembled and sealed by laser seam welding.

8. The brain-computer interface device according to claim 4, characterized in that: The electrodes include at least one of the following: cortical electrodes, intracortical electrodes, and deep brain area electrodes.

9. The brain-computer interface device according to claim 5, characterized in that: The flange is circumferentially provided with fixing holes, and the fixing holes are used to fix the probe on the skull implanted in the human body.

10. The brain-computer interface device according to claim 3 or 4, characterized in that: The second signal processing module includes a second feedthrough, a second circuit board, a third housing and a fourth housing, The second circuit board is fixedly mounted inside the third housing, the second feedthrough is mounted on the second circuit board, and the second feedthrough is connected to the wiring module; The wireless communication module is mounted on the second circuit board, the wireless charging module includes a wireless charging coil and a wireless power supply receiver, the wireless power supply receiver is mounted on the second circuit board, and the wireless charging coil is mounted on the outer side of the third housing; The fourth shell is sleeved on the third shell.

11. The brain-computer interface device according to claim 10, characterized in that: The fourth shell includes a titanium shell, a window is opened on one side of the titanium shell, ceramic or glass is embedded in the window, and the window is aligned with the wireless charging coil.

12. The brain-computer interface device according to claim 10, characterized in that: The second signal processing module further includes a third circuit board, and the third circuit board is connected to the second feedthrough and the second circuit board respectively.

13. The brain-computer interface device according to claim 12, characterized in that: The second circuit board includes a single-chip microcomputer, a host power supply and a signal processing circuit. The host power supply is connected to the wireless power supply receiver. The host power supply is used to power the single-chip microcomputer and the signal processing circuit. The signal processing circuit is communicatively connected to the third circuit board, and the signal processing circuit includes a field programmable gate array, a flash memory and a dynamic cache.

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