Automatic arranging method and system for quartz wafers

Abstract

The present invention relates to the field of machine vision, and specifically to an automatic quartz wafer arrangement method and system, which collects a tray image of a quartz wafer tray, and then extracts contour features and quartz wafer data in the tray image, thereby calculating the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor vibration target duration is controlled to separate and flatten the overlapping quartz wafers. Then the tray image is collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. The position and posture features of each quartz wafer at this time are then collected, and finally the position and posture features of the quartz wafer are used to perform gripping and arrangement. The present application can automatically determine the stacking situation of the quartz wafers in the tray, and perform arrangement while keeping the quartz wafers flat. Compared with manual dithering, it is more efficient and has a better arrangement effect.

Description

Technical Field

[0001] The present invention relates to the field of machine vision, and in particular to an automatic quartz wafer arrangement method and system. Background Art

[0002] The production process of a crystal oscillator requires quartz to be cut into wafers. These wafers then undergo a series of processing steps, such as arranging, cleaning, dehydrating, heating, and electrode plating, to finally produce a crystal oscillator. During this process, the quartz wafers, often scattered around, need to be arranged so that they can be neatly stacked on fixed trays for subsequent processing.

[0003] Quartz wafers scattered on a tray are then picked up by a robotic arm and placed on a fixed tray. During this process, the quartz wafers may overlap, creating an unstable structure and potentially causing the robotic arm to fail. In this situation, manual vibration of the tray is typically used to level the stacked quartz wafers. However, manual vibration is ineffective and can cause the wafer sorting process to pause, reducing efficiency. Summary of the Invention

[0004] In view of this, an object of the present invention is to provide a method and system for automatically arranging quartz wafers to solve the problems in the background technology.

[0005] In order to achieve the above object, the present invention adopts the following technical solutions:

[0006] The present invention provides an automatic quartz wafer arrangement method, comprising the steps of:

[0007] S11, acquiring a tray image of a first tray storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement;

[0008] S12, performing feature extraction on the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image;

[0009] S13, calculating the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition whose overlap is greater than a preset overlap threshold, controlling the vibration motor corresponding to the target partition to vibrate for a target duration, and returning to step S12 until the overlap of all partitions is no greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, each vibration motor being used to vibrate one partition;

[0010] S14, when the overlap of all partitions is not greater than a preset overlap threshold, constructing position and posture features of each quartz wafer based on the contour features of the tray image;

[0011] S15, based on the position and posture characteristics of each quartz wafer, controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, wherein the second tray is used to store the quartz wafers after wafer arrangement.

[0012] In one embodiment of the present application, feature extraction is performed on the quartz wafers in the plurality of partitions in the tray image to obtain the contour features and the number of quartz wafers in each partition in the tray image, including:

[0013] converting the pallet image into a grayscale image;

[0014] Performing threshold segmentation on the grayscale image to obtain a binary image;

[0015] Extracting contour features from the binary image, and extracting a convex right-angle feature from the contour features, wherein the convex right-angle feature is composed of two perpendicular straight line contours, and the inner side of the convex right-angle feature is a quartz wafer area;

[0016] All convex right-angle features are traversed and classified based on the reference size of the pre-built quartz wafer outline template to obtain the number of quartz wafers.

[0017] In one embodiment of the present application, all convex right-angle features are classified based on the reference size of the pre-built quartz wafer outline template to obtain the number of quartz wafers, including:

[0018] S21, extracting the vertex of each convex right-angle feature;

[0019] S22, take one of the undivided vertices as the reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template, is the distance threshold;

[0020] S23, aligning the target point and the reference point with a pre-constructed quartz wafer outline template, and dividing the reference point whose corresponding convex right-angle feature overlaps with the pre-constructed quartz wafer outline template into the same quartz wafer outline as the target point;

[0021] S24, return to step S22, until all vertices are divided, and the division results and the number of quartz wafers are obtained.

[0022] In one embodiment of the present application, the overlap of each partition is calculated based on the contour features of each partition and the number of quartz wafers, including:

[0023] Calculate the number of pixels within the outline feature to obtain the total projected area of ​​the quartz wafer in each partition ,in, is the partition number;

[0024] The total projected area of ​​the quartz wafer based on each partition And the number of quartz crystals in each partition Calculate the overlap of each partition , where the overlap of each partition is The mathematical expression is:

[0025]

[0026] Where, The reference area for the pre-built quartz wafer outline template.

[0027] In one embodiment of the present application, the position and posture features of each quartz wafer are constructed based on the contour features of the tray image, including:

[0028] Segmenting the outline of each quartz wafer based on a division result when the overlap of all partitions is not greater than a preset overlap threshold;

[0029] For the outline of the quartz wafer obtained by segmentation and having complete vertices, determine its diagonal line and diagonal vertex;

[0030] For the outline of the quartz wafer obtained by segmentation and having incomplete vertices, the diagonal lines and diagonal vertices thereof are determined by referring to the pre-built quartz wafer outline template;

[0031] The diagonal vertex is used as the position of the quartz wafer, and the diagonal line is used as the posture feature of the quartz wafer.

[0032] In one embodiment of the present application, based on the position and posture characteristics of each quartz wafer, the robot arm is controlled to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, including:

[0033] Determine the position coordinates of each quartz crystal and select the quartz crystal at the current position according to the set order;

[0034] Controlling the robotic arm to move to the horizontal position of the position coordinates of the currently positioned quartz wafer, and then controlling the robotic arm to move downward to a first target height so that the suction cup at the end of the robotic arm is aligned with the currently positioned quartz wafer;

[0035] Controlling the suction cup at the end of the robotic arm to suck up the quartz wafer at the current position, then controlling the robotic arm to move upward to a first target height, and then controlling the robotic arm to move to the target position coordinates of the second tray;

[0036] Rotating the robotic arm to rotate the quartz wafer to a target posture, and then controlling the robotic arm to move downward to a second target height until the quartz wafer is placed in the groove of the second tray;

[0037] Return the robot arm to its original position and select the quartz wafer at the current position according to the set order.

[0038] In one embodiment of the present application, before controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement based on the position and posture characteristics of each quartz wafer, the method further includes:

[0039] constructing a coordinate system of the first pallet and a coordinate system of the second pallet;

[0040] The coordinate system of the first pallet and the coordinate system of the second pallet are aligned based on the robotic arm.

[0041] In one embodiment of the present application, constructing a unified coordinate system based on the coordinate system of the first pallet and the coordinate system of the second pallet includes:

[0042] Using the coordinate system of the first pallet as a reference coordinate system, and controlling the robotic arm to align with the origin of the reference coordinate system;

[0043] Controlling the robotic arm to move horizontally to the origin of the coordinate system of the second pallet, and recording the horizontal axis displacement and the vertical axis displacement;

[0044] The horizontal axis displacement and the vertical axis displacement are compensated to the coordinate system of the second pallet to unify the coordinate system.

[0045] In one embodiment of the present application, it further includes:

[0046] An image of the second pallet is acquired and synchronized to a monitoring display.

[0047] The present application also provides an automatic quartz wafer arrangement system, comprising:

[0048] an acquisition module, configured to acquire a tray image of a first tray storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement;

[0049] a first feature extraction module, configured to extract features of the quartz wafers in the plurality of partitions in the tray image, and obtain contour features and the number of quartz wafers in each partition in the tray image;

[0050] a vibration control module, configured to calculate the degree of overlap of each partition based on the contour features of each partition and the number of quartz wafers; and when a target partition exists whose degree of overlap exceeds a preset overlap threshold, control the vibration motor corresponding to the target partition to vibrate for a target duration, and return to the first feature extraction module until the degree of overlap of all partitions is no greater than the preset overlap threshold; wherein a plurality of vibration motors are preset at the bottom of the first tray, each vibration motor being configured to vibrate a partition;

[0051] a second feature extraction module, configured to construct position and posture features of each quartz wafer based on contour features of the tray image when the overlap of all partitions is no greater than a preset overlap threshold;

[0052] The wafer arrangement control module is used to control the robot arm to grab the quartz wafers one by one from the first tray to the second tray for arrangement based on the position and posture characteristics of each quartz wafer, wherein the second tray is used to store the quartz wafers after arrangement.

[0053] The beneficial effects of the present invention are as follows: the present invention provides an automatic arranging method and system for quartz wafers, which collects a tray image of a quartz wafer tray, and then extracts contour features and quartz wafer data in the tray image, thereby calculating the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor vibration target duration is controlled to separate and flatten the overlapping quartz wafers. Then the tray image is collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. The position and posture features of each quartz wafer at this time are then collected, and finally the position and posture features of the quartz wafer are used to perform grabbing and arranging. The present application can automatically determine the stacking situation of the quartz wafers in the tray, and perform arranging while keeping the quartz wafers flat. Compared with manual dithering, it is more efficient and has a better arranging effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0054] The present invention will be further described below in conjunction with the accompanying drawings and embodiments:

[0055] Figure 1 This is an application scenario diagram shown in an embodiment of the present application;

[0056] Figure 2 This is a schematic diagram of the film arrangement results in this application;

[0057] Figure 3 This is a flow chart of a method for automatically arranging quartz wafers shown in one embodiment of the present application;

[0058] Figure 4 is a schematic diagram of the outline of stacked quartz wafers in one embodiment of the present application;

[0059] Figure 5 This is a structural diagram of an automatic quartz wafer arrangement system shown in one embodiment of the present application. DETAILED DESCRIPTION

[0060] The following describes the embodiments of the present invention through specific examples. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments. The details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that the following embodiments and features in the embodiments can be combined with each other unless they conflict.

[0061] It should be noted that the illustrations provided in the following embodiments are only schematic illustrations of the basic concept of the present invention. Therefore, the drawings only show the layers related to the present invention and are not drawn according to the number, shape and size of the layers in actual implementation. In actual implementation, the type, quantity and proportion of each layer can be changed arbitrarily, and the layer layout type may also be more complicated.

[0062] In the following description, numerous details are set forth to provide a more thorough explanation of the embodiments of the present invention; however, it is apparent to one skilled in the art that the embodiments of the present invention may be practiced without these specific details.

[0063] Figure 1 This is an application scenario diagram shown in an embodiment of the present application, such as Figure 1 As shown in the figure, the crystal oscillator production process needs to go through the wafer arrangement process, which is to arrange the cut quartz wafers from a disordered state to an ordered state. Figure 2 This is a schematic diagram of the film arrangement results in this application, such as Figure 2 As shown, the quartz wafers after arranging are neatly stacked on a tray or fixed fixture to facilitate subsequent cleaning, dehydration, heating, electrode plating and other processes.

[0064] like Figure 1 As shown, in this application, a robotic arm 11 is used to complete the wafer arrangement work. A CCD industrial camera 12 is installed on the robotic arm 11, and the CCD industrial camera 12 takes pictures of the wafers in the first tray 14. The CCD industrial camera 12 sends the captured images to the background host. After performing feature extraction and overlap calculation, the background host controls the surface-mounted vibration motor 16 at the bottom of the first tray 14 to vibrate and break up the stacked wafers in the first tray 14. Under the action of gravity, the wafers are spread flat in the first tray 14. After the vibration is completed, the suction cup 13 at the bottom of the robotic arm 11 is used to grab the wafers in the first tray 14 and place them in the second tray 15 for wafer arrangement. The specific control process is described below.

[0065] Figure 3 This is a flow chart of an automatic quartz wafer arrangement method shown in one embodiment of the present application. Figure 3 As shown, the automatic arrangement method of quartz wafers of this embodiment may include the following steps:

[0066] S11, acquiring a tray image of a first tray storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement;

[0067] First, a CCD industrial camera is used to capture the quartz wafers in the first tray. It is worth noting that since the quartz wafers themselves are translucent crystals, they reflect light significantly under direct sunlight. To avoid the impact of reflective light spots on subsequent image processing, this application uses heat dissipation light as much as possible for illumination before image acquisition.

[0068] S12, performing feature extraction on the quartz wafers in the plurality of partitions in the tray image to obtain contour features and the number of quartz wafers in each partition in the tray image;

[0069] The captured images are sent to the background host where feature extraction is performed.

[0070] Since this application uses a chip-type vibration motor to vibrate and break up the stacked quartz wafers in a tray, the tray is large, and a low-power chip-type vibration motor cannot cover the entire tray. A high-power chip-type vibration motor would have a large vibration amplitude, which could easily cause minor damage to the quartz wafers. Therefore, this application adopts a solution of partitioning and multiple low-power vibration motors.

[0071] The purpose of feature extraction is to perform contour segmentation to obtain quartz wafer data and the internal area of ​​the contour, and then calculate the overlap. Therefore, this application mainly extracts contour features and then performs a quantity extraction algorithm on the contour features. The specific algorithm process is as follows:

[0072] S121, the tray image Convert to grayscale image ;

[0073] S122, the grayscale image Perform threshold segmentation to obtain a binary image ;Threshold segmentation can effectively filter out background information and retain only the quartz wafer to facilitate subsequent contour extraction.

[0074] S123, extracting contour features from the binary image, and extracting a convex right-angle feature from the contour features, wherein the convex right-angle feature is composed of two perpendicular straight line contours, and the inner side of the convex right-angle feature is a quartz wafer area;

[0075] This application uses a contour detection algorithm to extract contour features, such as the Canny operator. Figure 4 FIG. 1 is a schematic diagram of the outline of the stacked quartz wafers in one embodiment of the present application, as shown in FIG. Figure 4 As shown, since the quartz wafers in this application are rectangular, if the quartz wafers are overlapped, it is difficult to segment the outline of the overlapping quartz wafers in the binary image. The solution of this application is to first extract the convex right-angle feature and use the convex right-angle feature as the recognition feature of the rectangular outline.

[0076] S124, traversing all the convex right-angle features, and classifying all the convex right-angle features based on the reference size of the pre-built quartz wafer outline template to obtain the number of quartz wafers.

[0077] After obtaining the convex right-angle features, all the convex right-angle features are verified using the reference dimensions of the pre-built quartz wafer outline template. The convex right-angle features are judged to see if they meet the rectangular distribution of a specific size. If so, they are segmented into the same rectangular outline. If not, they are judged to belong to different rectangular outlines. The specific process includes:

[0078] S1241, extracting the vertex of each convex right-angle feature;

[0079] In this application, each convex right-angle feature is constructed by two perpendicular straight lines, which is also one of the criteria for determining a convex right-angle feature. The intersection of the two perpendicular straight lines is the vertex of the convex right-angle feature.

[0080] S1242, take one of the undivided vertices as the reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template;

[0081] First, in order to save calculation process, it is also necessary to lock the target point at the distance reference point The distance is not too much from the diagonal point, which is about to be the distance from the reference point Distance exceeds Then for the vertices in the range, if they satisfy , then the distance between the vertex and the reference point is exactly the length of the long side of the rectangular outline template. Similarly, the target point Distance from the reference point satisfy When , it means that the distance between the vertex and the reference point is exactly the length of the short side of the rectangular outline template, and the target point Distance from the reference point satisfy When , it means that the distance between the vertex and the reference point is exactly the diagonal length of the rectangular outline template. is the distance threshold;

[0082] The above filtering process selects vertices that meet the length requirements as target points for further contour matching.

[0083] S1243, aligning the target point and the reference point with a pre-constructed quartz wafer outline template, and dividing the reference point whose corresponding convex right-angle feature overlaps with the pre-constructed quartz wafer outline template into the same quartz wafer outline as the target point;

[0084] Since the selection is based solely on distance, it is possible to find vertices that do not belong to the same rectangular contour but whose distances just meet the above conditions. Therefore, the quartz wafer contour template is used for selection.

[0085] For example, based on the distribution characteristics of the target point and the reference point, the target point and the reference point are aligned with a pre-built quartz wafer outline template. If the corresponding convex right-angle feature coincides with it, it can be determined that the target point and the reference point are vertices of the same rectangular outline.

[0086] S1244, return to step S1242, until all vertices are divided, and the division results and the number of quartz wafers are obtained.

[0087] The present application segments all contour features by looping the above process, thereby obtaining the segmentation results and the number of quartz wafers. The above process can be quickly processed by the analysis host.

[0088] The number of quartz wafers can also be determined when the quartz wafers are placed on the first tray, for example, to fix the number of each quartz wafer. However, in actual production, this is often not possible, as the number of quartz wafers in a batch cannot be an exact multiple of the fixed number in a tray. Therefore, the image counting method used in this application can verify the number and segment the outline. This not only eliminates the limitation of the number of wafers in the tray but also provides a basis for the position and posture characteristics of individual lenses in the subsequent film arrangement process.

[0089] S13, calculating the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition whose overlap is greater than a preset overlap threshold, controlling the vibration motor corresponding to the target partition to vibrate for a target duration, and returning to step S12 until the overlap of all partitions is no greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, each vibration motor being used to vibrate one partition;

[0090] After obtaining the number of quartz crystals, the overlap can be calculated using the number and the coverage area of ​​the contour features. The overlap calculation process for each partition is as follows:

[0091] S131, calculate the number of pixels in the outline feature to obtain the total projected area of ​​the quartz wafer in each partition ,in, is the partition number;

[0092] This application uses the number of pixels within the statistical outline feature as the total projected area of ​​the quartz wafer for each partition. Since the binarization process was previously performed, the total projected area of ​​the quartz wafer for each partition can also be calculated by counting the number of black or white pixels. It is worth noting that since each partition is manually delineated, it is possible that a quartz wafer may belong to both partition A and partition B, but this does not affect the subsequent overlap calculation.

[0093] S132, based on the total projected area of ​​the quartz wafer for each partition And the number of quartz crystals in each partition Calculate the overlap of each partition , where the overlap of each partition is The mathematical expression is:

[0094]

[0095] Where, The reference area for the pre-built quartz wafer outline template.

[0096] in, is the theoretical area when all quartz wafers in the partition are tiled. is the actual projection area, and the difference is the loss area of ​​the overlapping part. The larger the loss area, the corresponding overlap degree The bigger.

[0097] In calculating the overlap If the overlap exceeds n%, the vibration motor of the corresponding partition will be started and will stop automatically after the vibration time T. At this time, repeat the above steps and increase the overlap of all partitions to When it is controlled within n%, the subsequent film scheduling work can be started.

[0098] In actual production, if the number of wafers in the first tray is reasonable, the flattening of most quartz wafers can be guaranteed after 1-2 vibration cycles.

[0099] S14, when the overlap of all partitions is not greater than a preset overlap threshold, constructing position and posture features of each quartz wafer based on the contour features of the tray image;

[0100] After ensuring that most of the quartz wafers are flat, the structure of the quartz wafers is relatively stable and the upper surface is horizontal. When the suction cup is used to pick up the wafers, it can be ensured that the wafers are in the same posture as when they were flat. After selection and adjustment, the wafers can be placed in the second tray in the target posture.

[0101] In this application, the process of constructing the position and posture features of each quartz wafer based on the contour features of the tray image includes:

[0102] S141 , segmenting the outline of each quartz wafer based on a segmentation result when the overlap of all partitions is not greater than a preset overlap threshold;

[0103] The segmentation process has been described in the previous article, that is, segmentation is performed using convex right-angle features.

[0104] S142, for the segmented quartz wafer contour with complete vertices, determine its diagonal line and diagonal vertex;

[0105] S143, for the segmented quartz wafer contour with incomplete vertices, determine its diagonal lines and diagonal vertices with reference to a pre-built quartz wafer contour template;

[0106] After vibration, the outline of most quartz crystals is separated, allowing us to extract two diagonal lines. The intersection of these two diagonals is the center of the crystal, which serves as the position. If there is still occlusion, and if the angle between the diagonal and the side is fixed, a virtual diagonal can be constructed using the side and vertex, thereby obtaining position and posture features.

[0107] S144: Using the diagonal vertex as the position of the quartz wafer and using the diagonal as the posture feature of the quartz wafer.

[0108] S15, based on the position and posture characteristics of each quartz wafer, controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, wherein the second tray is used to store the quartz wafers after wafer arrangement.

[0109] The specific control process is as follows:

[0110] S151, determining the position coordinates of each quartz wafer and selecting the quartz wafer at the current position according to the set order;

[0111] The coordinates of the first tray, the second tray, and the suction cup are unified in advance, so that the current position coordinates of each quartz wafer and the target position coordinates of each quartz wafer can be determined in the same coordinate system. The specific unification process includes:

[0112] (1) Construct the coordinate system of the first pallet and the coordinate system of the second pallet ';

[0113] (2) Using the coordinate system of the first pallet As a reference coordinate system, the robot arm is controlled to align with the origin of the reference coordinate system The first pallet has a crosshair mark for alignment, and the robotic arm has a CCD industrial camera. Therefore, we only need to align the crosshair mark with a specific position in the CCD industrial camera image. At this point, the position of the suction cup in the robotic arm is also set to (0, 0).

[0114] (3) Control the robot arm to move horizontally to the origin of the coordinate system of the second pallet, and record the horizontal axis displacement and the vertical axis displacement; since the suction cup in the robot arm has been positioned at this time, the horizontal axis displacement of the origin of the coordinate system of the second pallet can be directly recorded. and longitudinal axis displacement The principle of aligning the suction cup with the origin of the coordinate system of the second tray is the same as that in the previous article, so it will not be repeated here.

[0115] (4) Compensating the horizontal axis displacement and the vertical axis displacement to the coordinate system of the second pallet to unify the coordinate system.

[0116] Among them, the coordinate system of the second pallet is expressed as , .

[0117] S152, controlling the robotic arm to move to a horizontal position corresponding to the position coordinates of the currently positioned quartz wafer, and then controlling the robotic arm to move downward to a first target height so that the suction cup at the end of the robotic arm is aligned with the currently positioned quartz wafer;

[0118] After alignment, the suction cup descends to a certain height, reaching the entire top of the quartz wafer. The height of the tray is fixed, so there's no need to use a z-axis coordinate.

[0119] S153, controlling the suction cup at the end of the robotic arm to suck up the quartz wafer at the current position, then controlling the robotic arm to move upward to a first target height, and then controlling the robotic arm to move to the target position coordinates of the second tray;

[0120] S154, rotating the robotic arm to rotate the quartz wafer to a target posture, and then controlling the robotic arm to move downward to a second target height until the quartz wafer is placed in the groove of the second tray;

[0121] In this application, the second tray is provided with a groove to fix the quartz wafer. When installing, it can be pressed by the edge of the suction cup.

[0122] S155, returning the robotic arm to its original position and returning to select the quartz wafer at the current position according to the set order.

[0123] In addition, the present application also sets up a camera to capture the image of the second tray in real time, and synchronizes the image of the second tray to the monitoring display. In this way, the film scheduling situation can be monitored in real time, and any abnormalities in the film scheduling can be discovered in time.

[0124] The present invention provides an automatic arranging method for quartz wafers, which collects a tray image of a quartz wafer tray, extracts contour features and quartz wafer data in the tray image, and calculates the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor vibration target duration is controlled to separate and flatten the overlapping quartz wafers. The tray image is then collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. The position and posture features of each quartz wafer at this time are then collected, and finally the position and posture features of the quartz wafer are used to perform gripping and arranging. The present application can automatically determine the stacking situation of the quartz wafers in the tray and perform arranging while keeping the quartz wafers flat. Compared with manual dithering, it is more efficient and has a better arranging effect.

[0125] like Figure 5 As shown, the present application also provides an automatic quartz wafer arrangement system, comprising:

[0126] an acquisition module, configured to acquire a tray image of a first tray storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement;

[0127] a first feature extraction module, configured to extract features of the quartz wafers in the plurality of partitions in the tray image, and obtain contour features and the number of quartz wafers in each partition in the tray image;

[0128] a vibration control module, configured to calculate the degree of overlap of each partition based on the contour features of each partition and the number of quartz wafers; and when a target partition exists whose degree of overlap exceeds a preset overlap threshold, control the vibration motor corresponding to the target partition to vibrate for a target duration, and return to the first feature extraction module until the degree of overlap of all partitions is no greater than the preset overlap threshold; wherein a plurality of vibration motors are preset at the bottom of the first tray, each vibration motor being configured to vibrate a partition;

[0129] a second feature extraction module, configured to construct position and posture features of each quartz wafer based on contour features of the tray image when the overlap of all partitions is no greater than a preset overlap threshold;

[0130] The wafer arrangement control module is used to control the robot arm to grab the quartz wafers one by one from the first tray to the second tray for arrangement based on the position and posture characteristics of each quartz wafer, wherein the second tray is used to store the quartz wafers after arrangement.

[0131] The present invention provides an automatic arranging system for quartz wafers, which collects a tray image of a quartz wafer tray, extracts contour features and quartz wafer data from the tray image, and calculates the overlap of quartz wafers in multiple partitions. If the overlap of any partition is high, the corresponding vibration motor is controlled to vibrate the target duration, thereby separating and flattening the overlapping quartz wafers. The tray image is then collected again and the partition overlap is calculated. The above process is repeated until the overlap of the quartz wafers in all partitions is no greater than a preset threshold. The position and posture features of each quartz wafer at this time are then collected, and finally the position and posture features of the quartz wafer are used to perform gripping and arranging. The present application can automatically determine the stacking situation of the quartz wafers in the tray, and perform arranging while keeping the quartz wafers flat. Compared with manual dithering, it is more efficient and has a better arranging effect.

[0132] This embodiment also provides an electronic terminal, including: a processor and a memory;

[0133] The memory is used to store computer programs, and the processor is used to execute the computer programs stored in the memory, so that the terminal executes any one of the methods in this embodiment.

[0134] Regarding the computer-readable storage medium in this embodiment, those skilled in the art will appreciate that all or part of the steps in the aforementioned method embodiments can be implemented using hardware associated with the computer program. The aforementioned computer program can be stored in a computer-readable storage medium. When executed, the program performs the steps in the aforementioned method embodiments. The aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0135] The electronic terminal provided in this embodiment includes a processor, a memory, a transceiver and a communication interface. The memory and the communication interface are connected to the processor and the transceiver and complete communication with each other. The memory is used to store computer programs, the communication interface is used for communication, and the processor and the transceiver are used to run computer programs so that the electronic terminal executes the various steps of the above method.

[0136] In this embodiment, the memory may include a random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage.

[0137] The above-mentioned processor can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gate or transistor logic devices, and discrete hardware components.

[0138] In the above embodiments, although the present invention has been described in conjunction with specific embodiments of the present invention, many replacements, modifications and variations of these embodiments will be apparent to those skilled in the art based on the foregoing description. The embodiments of the present invention are intended to cover all such replacements, modifications and variations that fall within the broad scope of the appended claims.

[0139] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the present invention. Anyone skilled in the art may modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, all equivalent modifications or alterations made by one of ordinary skill in the art without departing from the spirit and technical principles disclosed herein are intended to be covered by the claims of the present invention.

Claims

1. A method for automatically arranging quartz wafers, characterized in that: Including steps: S11, acquiring a tray image of a first tray storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; S12, extracting features of the quartz wafers in multiple partitions in the tray image to obtain the contour features and the number of quartz wafers in each partition of the tray image; extracting features of the quartz wafers in multiple partitions in the tray image to obtain the contour features and the number of quartz wafers in each partition of the tray image, including: converting the tray image into a grayscale image; performing threshold segmentation on the grayscale image to obtain a binary image; extracting contour features in the binary image, and extracting convex right-angle features in the contour features, wherein the convex right-angle features are composed of two vertical straight line contours, and the inner side of the convex right-angle features is the quartz wafer area; traversing all convex right-angle features, and classifying all convex right-angle features based on the reference size of the pre-constructed quartz wafer contour template to obtain the number of quartz wafers; classifying all convex right-angle features based on the reference size of the pre-constructed quartz wafer contour template to obtain the number of quartz wafers, including: S21, extracting the vertex of each convex right-angle feature; S22, taking one of the unclassified vertices as a reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template, is the distance threshold; S23, aligning the target point and the reference point with the pre-built quartz wafer outline template, and dividing the reference point whose corresponding convex right-angle feature coincides with the pre-built quartz wafer outline template into the same quartz wafer outline as the target point; S24, returning to step S22, until all vertices are divided, and obtaining the division result and the number of quartz wafers; S13, calculating the overlap of each partition based on the contour features of each partition and the number of quartz wafers, and when there is a target partition whose overlap is greater than a preset overlap threshold, controlling the vibration motor corresponding to the target partition to vibrate for a target duration, and returning to step S12 until the overlap of all partitions is no greater than the preset overlap threshold, wherein a plurality of vibration motors are preset at the bottom of the first tray, each vibration motor being used to vibrate one partition; S14, constructing the position and posture features of each quartz wafer based on the contour features of the tray image when the overlap of all partitions is not greater than a preset overlap threshold; constructing the position and posture features of each quartz wafer based on the contour features of the tray image, including: segmenting the contour of each quartz wafer based on the segmentation result when the overlap of all partitions is not greater than the preset overlap threshold; for the contour of the quartz wafer obtained by segmentation and having complete vertices, determining its diagonal and diagonal vertex; for the contour of the quartz wafer obtained by segmentation and having incomplete vertices, determining its diagonal and diagonal vertex with reference to a pre-constructed quartz wafer contour template; using the diagonal vertex as the position of the quartz wafer, and using the diagonal as the posture feature of the quartz wafer; S15, based on the position and posture characteristics of each quartz wafer, controlling the robotic arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, wherein the second tray is used to store the quartz wafers after wafer arrangement; based on the position and posture characteristics of each quartz wafer, controlling the robotic arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement, including: determining the position coordinates of each quartz wafer, and selecting the quartz wafer in the current position according to a set order; Control the robotic arm to move to the horizontal position of the position coordinates of the quartz wafer in the current position, then control the robotic arm to move downward to the first target height so that the suction cup at the end of the robotic arm is opposite to the quartz wafer in the current position; control the suction cup at the end of the robotic arm to suck up the quartz wafer in the current position, then control the robotic arm to move upward to the first target height, and then control the robotic arm to move to the target position coordinates of the second tray; rotate the robotic arm to rotate the quartz wafer to the target posture, and then control the robotic arm to move downward to the second target height until the quartz wafer is placed in the groove of the second tray; return the robotic arm to its position, and return to selecting the quartz wafer in the current position according to the set order.

2. The automatic quartz wafer arrangement method according to claim 1, characterized in that: The overlap of each partition is calculated based on the contour characteristics of each partition and the number of quartz crystals, including: Calculate the number of pixels within the outline feature to obtain the total projected area of ​​the quartz wafer in each partition ,in, is the partition number; The total projected area of ​​the quartz wafer based on each partition And the number of quartz crystals in each partition Calculate the overlap of each partition , where the overlap of each partition is The mathematical expression is: Where, The reference area for the pre-built quartz wafer outline template.

3. The automatic quartz wafer arrangement method according to claim 1, characterized in that: Before controlling the robot arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement based on the position and posture characteristics of each quartz wafer, the method further includes: constructing a coordinate system of the first pallet and a coordinate system of the second pallet; The coordinate system of the first pallet and the coordinate system of the second pallet are aligned based on the robotic arm.

4. The automatic quartz wafer arrangement method according to claim 3, characterized in that: Constructing a unified coordinate system based on the coordinate system of the first pallet and the coordinate system of the second pallet, including: Using the coordinate system of the first pallet as a reference coordinate system, and controlling the robotic arm to align with the origin of the reference coordinate system; Controlling the robotic arm to move horizontally to the origin of the coordinate system of the second pallet, and recording the horizontal axis displacement and the vertical axis displacement; The horizontal axis displacement and the vertical axis displacement are compensated to the coordinate system of the second pallet to unify the coordinate system.

5. The automatic quartz wafer arrangement method according to claim 1, characterized in that: Also includes: An image of the second pallet is acquired and synchronized to a monitoring display.

6. An automatic quartz wafer arrangement system, applied to the automatic quartz wafer arrangement method according to claim 1, characterized in that: include: an acquisition module, configured to acquire a tray image of a first tray storing quartz wafers, wherein the first tray is used to store quartz wafers before wafer arrangement; The first feature extraction module is used to extract features of the quartz wafers in multiple partitions in the tray image to obtain the contour features and the number of quartz wafers in each partition in the tray image; extract features of the quartz wafers in multiple partitions in the tray image to obtain the contour features and the number of quartz wafers in each partition in the tray image, including: converting the tray image into a grayscale image; performing threshold segmentation on the grayscale image to obtain a binary image; extracting contour features in the binary image, and extracting convex right-angle features in the contour features, wherein the convex right-angle features are composed of two vertical straight line contours, and the inner side of the convex right-angle features is the quartz wafer area; traversing all convex right-angle features and classifying all convex right-angle features based on the reference size of the pre-constructed quartz wafer contour template to obtain the number of quartz wafers; classifying all convex right-angle features based on the reference size of the pre-constructed quartz wafer contour template to obtain the number of quartz wafers, including: S21, extracting the vertex of each convex right-angle feature; S22, taking one of the unclassified vertices as a reference point ; When there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the long side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the short side of the rectangle; when there is a target point Distance from the reference point satisfy When the target point With reference point are the two endpoints on the diagonal of the rectangle, where is the reference length of the long side of the quartz wafer outline template, is the reference length of the short side of the quartz wafer outline template, is the diagonal reference length of the quartz wafer outline template, is the distance threshold; S23, aligning the target point and the reference point with the pre-built quartz wafer outline template, and dividing the reference point whose corresponding convex right-angle feature coincides with the pre-built quartz wafer outline template into the same quartz wafer outline as the target point; S24, returning to step S22, until all vertices are divided, and obtaining the division result and the number of quartz wafers; a vibration control module, configured to calculate the degree of overlap of each partition based on the contour features of each partition and the number of quartz wafers; and when a target partition exists whose degree of overlap exceeds a preset overlap threshold, control the vibration motor corresponding to the target partition to vibrate for a target duration, and return to the first feature extraction module until the degree of overlap of all partitions is no greater than the preset overlap threshold; wherein a plurality of vibration motors are preset at the bottom of the first tray, each vibration motor being configured to vibrate a partition; A second feature extraction module is configured to construct, based on the contour features of the tray image, a position and posture feature of each quartz wafer when the overlap of all partitions is no greater than a preset overlap threshold; constructing the position and posture feature of each quartz wafer based on the contour features of the tray image, comprising: segmenting the contour of each quartz wafer based on the segmentation result when the overlap of all partitions is no greater than the preset overlap threshold; determining, for the contour of the quartz wafer obtained by segmentation and having complete vertices, its diagonal and diagonal vertices; for the contour of the quartz wafer obtained by segmentation and having incomplete vertices, determining, with reference to a pre-constructed quartz wafer contour template, its diagonal and diagonal vertices; using the diagonal vertices as the position of the quartz wafer, and using the diagonal as the posture feature of the quartz wafer; a wafer arrangement control module, configured to control the robotic arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement based on the position and posture characteristics of each quartz wafer, wherein the second tray is used to store the quartz wafers after wafer arrangement; controlling the robotic arm to grab the quartz wafers one by one from the first tray to the second tray for wafer arrangement based on the position and posture characteristics of each quartz wafer, including: determining the position coordinates of each quartz wafer, and selecting the quartz wafer in the current position according to a set order; Control the robotic arm to move to the horizontal position of the position coordinates of the quartz wafer in the current position, then control the robotic arm to move downward to the first target height so that the suction cup at the end of the robotic arm is opposite to the quartz wafer in the current position; control the suction cup at the end of the robotic arm to suck up the quartz wafer in the current position, then control the robotic arm to move upward to the first target height, and then control the robotic arm to move to the target position coordinates of the second tray; rotate the robotic arm to rotate the quartz wafer to the target posture, and then control the robotic arm to move downward to the second target height until the quartz wafer is placed in the groove of the second tray; return the robotic arm to its position, and return to selecting the quartz wafer in the current position according to the set order.

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