Process for manufacturing thick-edge pot body by heating

Abstract

According to the technology for manufacturing the thick-edge pot body through heating, a spinning wheel is used for machining a wafer base material, the spinning wheel comprises a connecting disc, an annular concave position, a first convex position step and a second convex position step, the annular concave position is located between the connecting disc and the first convex position step, and the second convex position step is connected to the first convex position step; the diameter of the outermost edge of the first convex step is larger than that of the outermost edge of the second convex step; the technology for manufacturing the thick-edge pot body through heating comprises the following steps of spinning preparation, heating treatment, edge thickening, thin-wall spinning, thick edge forming and thick edge shaping. According to the invention, the problem that a pot body with a thick edge cannot be processed from a wafer base material with relatively high strength is solved.

Description

Technical Field

[0001] The invention relates to the technical field of cookware production, in particular to a process for heating and manufacturing a thick-edged cookware body. Background Art

[0002] At present, the production and processing of cookware usually requires a spinning step. Compared with the press stretching process, the spinning processing method saves more raw materials and can realize the forming of the pot body that cannot be formed by ordinary presses.

[0003] Spinning equipment generally uses a spinning wheel to press a disc substrate with a certain thickness onto the pot body and press and shape it. If a thick edge can be processed at the edge of the pot opening, the overall firmness of the pot body after forming can be effectively enhanced, thereby increasing the service life and usage experience of the pot body. However, the spinning process on the market can only thin the disc substrate but not thicken it. Moreover, for disc substrates with higher material strength, the difficulty of spinning to produce a thick edge is further increased. Summary of the invention

[0004] In order to solve the above problems, the present invention proposes a process for manufacturing a pot body with thick edges by heating, which solves the problem that a pot body with thick edges cannot be processed from a wafer substrate with relatively high strength.

[0005] The technical solution adopted by the present invention is: a process for heating and manufacturing a thick-edged pot body, using a spinning wheel to process a wafer substrate, the spinning wheel includes a connecting disk, an annular concave position, a first convex position step and a second convex position step, the annular concave position is located between the connecting disk and the first convex position step, the second convex position step is connected to the first convex position step, and the outermost diameter of the first convex position step is greater than the outermost diameter of the second convex position step; the process for heating and manufacturing a thick-edged pot body includes the following steps:

[0006] Spinning preparation: the wafer substrate is pressed against the mold, and the wafer substrate rotates synchronously with the mold;

[0007] Heat treatment, heating the edge of the wafer substrate so that the strength of the edge of the wafer substrate decreases;

[0008] Edge thickness pressing: adjust the direction of the spinning wheel until the annular concave portion faces the edge of the wafer substrate, the spinning wheel approaches the wafer substrate, the inner surface of the annular concave portion contacts the edge of the wafer substrate, and then continues to move inward, the diameter of the wafer substrate decreases while the thickness of the edge of the wafer substrate increases;

[0009] Thin-wall spinning: the spinning wheel is moved to separate the annular concave portion from the edge of the wafer substrate, the first convex step is pressed toward the wafer substrate and spun along the contour direction of the mold to form a semi-finished product; the portion of the semi-finished product that has been spun by the first convex step forms a thin wall;

[0010] To form a thick edge, the spinning wheel moves along the contour direction of the mold until it stops near the edge of the semi-finished product opening. At this time, the portion of the semi-finished product that has not been spun by the first convex step forms a thick edge.

[0011] Through the above-mentioned technical scheme, after the production process of the present invention, a pot body with a thick edge shape can be stably produced, especially for a wafer substrate made of a relatively high-strength material. By heating the edge heating portion, the strength of the edge portion of the wafer substrate is reduced, which is convenient for the subsequent edge thickening step, thereby effectively reducing the processing difficulty of the edge thickening step.

[0012] Furthermore, the heating treatment step adopts flame heating, workpiece resistance heating, workpiece induction heating, laser beam heating or electron beam heating.

[0013] Through the above technical solution, the method used for heating treatment is highly selective, and the manufacturer can choose the most appropriate heating treatment method according to the different wafer substrates used, so that the edge part of the wafer substrate can effectively, quickly and accurately achieve the effect of reducing the strength through heating treatment.

[0014] Furthermore, the wafer substrate is made of iron, stainless steel, copper or aluminum alloy.

[0015] Through the above technical solution, due to the existence of the heating treatment step, the wafer substrate can be made of a material with higher strength to make the pot body, the wafer substrate material is more selective, and the types of pot bodies produced later are more abundant.

[0016] Furthermore, the method further comprises the following steps: thick edge shaping, after the thick edge is initially formed, the first convex step performs spinning on the surface of the thick edge.

[0017] Through the above technical solution, the shape of the thick edge is made more regular, the surface of the thick edge is made smoother, and the overall appearance of the produced pot body is made more beautiful.

[0018] Furthermore, two inner side surfaces of the annular recess are parallel to each other, and a distance between the two inner side surfaces of the annular recess is 1.1 to 2.5 times the thickness of the wafer substrate when it is not pressed.

[0019] Through the above technical scheme, the distance between the two side surfaces of the annular recess limits the maximum degree of thickening of the edge portion of the wafer substrate, so that the thickness of the edge portion of the thickened wafer substrate in the radial direction is more uniform, which is convenient for subsequent spinning treatment by the spinning wheel; the distance between the two side surfaces of the annular recess can be changed according to the different wafer substrates to be processed, which is convenient for the production of different types of pot bodies.

[0020] Furthermore, the inner surface of the annular recess is a cylindrical surface formed around the rotation axis of the spinning wheel.

[0021] Through the above technical solution, when the inner surface of the annular recess squeezes the edge of the wafer substrate, the extrusion force of the annular recess at various points along the edge of the wafer substrate in the vertical direction is more uniform, thereby avoiding the wafer substrate from deforming and bending upward or downward during the compression process, so that the thickness pressing process can be carried out stably.

[0022] Furthermore, the side surface of the first convex step close to the second convex step is a conical surface, and the diameter of a portion of the conical surface close to the second convex step gradually decreases.

[0023] Through the above technical solution, the conical surface can effectively push the wafer substrate during the spinning process, so that the material of the wafer substrate can be quickly deformed, avoiding excessive extrusion pressure between the spinning wheel and the wafer substrate, which may cause jamming and damage to the wafer substrate, and effectively improving the yield rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0025] Figure 1 This is one of the schematic diagrams of the spinning wheel of the present invention;

[0026] Figure 2 This is the second schematic diagram of the spinning wheel of the present invention;

[0027] Figure 3 It is a schematic diagram of a pot body of the present invention;

[0028] Figure 4 is a process flow chart of the present invention;

[0029] The invention number information is as follows:

[0030] 1. Spinning wheel; 2. Pot body; 11. Connecting plate; 12. Annular concave position; 13. First convex position step; 14. Second convex position step; 21. Pot bottom; 22. Thin wall; 23. Thick edge;

[0031] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0032] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0033] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] In addition, the descriptions of "first", "second", etc. in the present invention are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in the field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

[0035] A process for heating and making a thick-edged pot body, using a spinning wheel 1 to process a wafer substrate, the spinning wheel 1 includes a connecting disk 11, an annular concave position 12, a first convex position step 13 and a second convex position step 14, the annular concave position 12 is located between the connecting disk 11 and the first convex position step 13, the second convex position step 14 is connected to the first convex position step 13, the outermost diameter of the first convex position step 13 is greater than the outermost diameter of the second convex position step 14, reference Figure 1 , 2 The heating process for making the thick edge 23 of the pot body 2 comprises the following steps, reference Figure 4 :

[0036] S1: Spinning preparation, pressing the wafer substrate onto the mold, and the wafer substrate rotates synchronously with the mold;

[0037] S2: heating treatment, heating the edge of the wafer substrate so that the strength of the edge of the wafer substrate decreases;

[0038] S3: Edge thickness pressing, adjusting the direction of the spinning wheel 1 until the annular concave position 12 faces the edge of the wafer substrate, the spinning wheel 1 approaches the wafer substrate, the inner surface of the annular concave position 12 contacts the edge of the wafer substrate, and then continues to move inward, the diameter of the wafer substrate decreases while the thickness of the edge of the wafer substrate increases;

[0039] S4: Thin-wall spinning, moving the spinning wheel 1 to separate the annular concave portion 12 from the edge of the wafer substrate, the first convex step 13 is pressed toward the wafer substrate and spun along the contour direction of the mold to form a semi-finished product; the portion of the semi-finished product that has been spun by the first convex step 13 forms a thin wall 22;

[0040] S5: forming a thick edge. The spinning wheel 1 moves along the contour direction of the mold until it stops near the edge of the semi-finished product opening. At this time, the portion of the semi-finished product that has not been spun by the first convex step 13 forms a thick edge 23.

[0041] S6: Thick edge shaping: after the thick edge 23 is initially formed, the first convex step 13 performs spinning on the surface of the thick edge 23 .

[0042] After the production process of the present invention, a pot body 2 with a thick edge 23 can be stably produced, especially for a wafer substrate made of a relatively high-strength material. By heating the edge heating portion, the strength of the edge portion of the wafer substrate is reduced, which is convenient for the subsequent edge thickening step, thereby effectively reducing the processing difficulty of the edge thickening step.

[0043] The step of shaping the thick edge 23 can make the shape of the thick edge 23 more regular, and the surface of the thick edge 23 smoother, so that the overall appearance of the finished pot body 2 is more beautiful.

[0044] The mold is rotatably installed on a workbench, and a power device for driving the mold to rotate is provided on the workbench. The power device is generally a motor. The specific structure of the workbench and the power device is the prior art in this field and is not the focus of the description in this article, so it will not be repeated in this article.

[0045] In actual use of the spinning wheel 1, the spinning wheel 1 needs to be used in conjunction with a carrying platform and an adjusting mechanism. The spinning wheel 1 is rotatably connected to the carrying platform, and the position of the carrying platform is changed by the adjusting mechanism, so that the carrying platform has at least two moving pairs staggered in two directions and one rotating pair for adjusting the spinning wheel 1. Since the specific implementation methods of the carrying platform and the adjusting mechanism are diverse and are not the focus of the present invention, they will not be elaborated in this article.

[0046] After the above steps, the pot body 2 is finally produced. The pot body 2 includes a pot bottom 21, a thin wall 22 and a thick edge 23. Figure 3 .

[0047] The heating treatment step adopts flame heating, workpiece resistance heating, workpiece induction heating, laser beam heating or electron beam heating.

[0048] The method used for heat treatment is highly selective, and the manufacturer can select the most appropriate heat treatment method according to the different wafer substrates used, so that the edge part of the wafer substrate can effectively, quickly and accurately achieve the effect of reducing the strength through heat treatment.

[0049] Laser beam heating is preferably used to make local heating more efficient and accurate.

[0050] The material of the wafer substrate is iron, stainless steel, copper or aluminum alloy.

[0051] Due to the existence of the heating treatment step, the wafer substrate can be made of a material with higher strength to make the pot body 2. The wafer substrate material has a stronger selectivity, and the types of pot bodies 2 produced later are more abundant.

[0052] The two inner side surfaces of the annular recess 12 are parallel to each other, and the distance between the two inner side surfaces of the annular recess 12 is 1.1 to 2.5 times the thickness of the wafer substrate when it is not pressed.

[0053] Preferably, the distance between the two inner side surfaces of the annular recess 12 is 1.5 times the thickness of the wafer substrate when it is not pressed.

[0054] The distance between the two sides of the annular recess 12 limits the maximum extent of the thickening of the edge of the wafer substrate, so that the thickness of the edge of the wafer substrate thickened in the radial direction is more uniform, which is convenient for the subsequent spinning process of the spinning wheel 1; the distance between the two sides of the annular recess 12 can be changed according to the different wafer substrates to be processed, which is convenient for the production of different types of pot bodies 2. The inner surface of the annular recess 12 is a cylindrical surface formed around the rotation axis of the spinning wheel 1.

[0055] When the inner surface of the annular recess 12 presses the edge of the wafer substrate, the pressing force of the annular recess 12 at each location along the edge of the wafer substrate in the vertical direction is more uniform, thereby preventing the wafer substrate from deforming and bending upward or downward during the pressing process, and allowing the thickness pressing process to be carried out stably.

[0056] The side surface of the first convex step 13 close to the second convex step 14 is a conical surface, and the diameter of the portion of the conical surface close to the second convex step 14 gradually decreases.

[0057] During the spinning process, the conical surface can effectively push the wafer substrate, causing the material of the wafer substrate to deform quickly, avoiding excessive squeezing force between the spinning wheel 1 and the wafer substrate, resulting in jamming and damage to the wafer substrate, and effectively improving the yield rate.

[0058] The above description is only a preferred embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A process for manufacturing a thick-edged pot body by heating, wherein a circular substrate is processed by a spinning wheel (1), characterized in that: The spinning wheel (1) comprises a connecting disk (11), an annular recess (12), a first convex step (13) and a second convex step (14), wherein the annular recess (12) is located between the connecting disk (11) and the first convex step (13), the second convex step (14) is connected to the first convex step (13), and the outermost diameter of the first convex step (13) is greater than the outermost diameter of the second convex step (14); the process for heating a pot body (2) with a thick edge (23) comprises the following steps: Spinning preparation: the wafer substrate is pressed against the mold, and the wafer substrate rotates synchronously with the mold; Heat treatment, heating the edge of the wafer substrate so that the strength of the edge of the wafer substrate decreases; The edge is pressed to thicken the wafer substrate. The direction of the spinning wheel (1) is adjusted until the annular recess (12) faces the edge of the wafer substrate. The spinning wheel (1) approaches the wafer substrate, and the inner surface of the annular recess (12) contacts the edge of the wafer substrate, and then continues to move inward. The diameter of the wafer substrate is reduced, and the thickness of the edge of the wafer substrate is increased. Thin-wall spinning, moving the spinning wheel (1) to separate the annular concave portion (12) from the edge portion of the wafer substrate, pressing the first convex step (13) toward the wafer substrate and spinning along the contour direction of the mold to form a semi-finished product; the portion of the semi-finished product that has been spun by the first convex step (13) forms a thin wall (22); To form a thick edge, the spinning wheel (1) moves along the contour direction of the mold until it stops near the edge of the semi-finished product opening. At this time, the portion of the semi-finished product that has not been spun by the first convex step (13) forms a thick edge (23).

2. The process for heating a thick-edged pot body according to claim 1, characterized in that: The heating treatment step adopts flame heating, workpiece resistance heating, workpiece induction heating, laser beam heating or electron beam heating.

3. The process for making a thick-edged pot body by heating according to claim 2, characterized in that: The material of the wafer substrate is iron, stainless steel, copper or aluminum alloy.

4. A process for heating and manufacturing a thick-edged pot body according to claim 1, 2 or 3, characterized in that: The following steps are also included: Thick edge shaping: after the thick edge (23) is initially formed, the first convex step (13) performs spinning on the surface of the thick edge (23).

5. The process for making a thick-edged pot body by heating according to claim 4, characterized in that: The two inner side surfaces of the annular recess (12) are parallel to each other, and the distance between the two inner side surfaces of the annular recess (12) is 1.1 to 2.5 times the thickness of the wafer substrate when it is not pressed.

6. The process for heating and manufacturing a thick-edged pot body according to claim 1, 2, 3 or 5, characterized in that: The inner surface of the annular recess (12) is a cylindrical surface formed around the rotation axis of the spinning wheel (1).

7. The process for making a thick-edged pot body by heating according to claim 6, characterized in that: The side surface of the first convex step (13) close to the second convex step (14) is a conical surface, and the diameter of the portion of the conical surface close to the second convex step (14) gradually decreases.

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