Light emitting diode display unit, packaging method and display screen

Abstract

The invention relates to the technical field of light-emitting diode display screens, and particularly provides a light-emitting diode display unit, a packaging method and a display screen, and the display unit comprises a support and a light-emitting diode chip. The bracket is fixed on the substrate through black plastic, and a bracket bowl cup is formed above the bracket functional area; the first chip is a light-emitting diode chip with the lowest height and is fixedly connected to the corresponding position of the functional area of the bracket; the second chip is a chip except the first chip in the light emitting diode chips, a groove is formed in the upper surface of the support functional area and used for placing the second chip, and the depth of the groove is determined according to the height of the second chip; the bottom of the support bowl cup is filled with black epoxy resin glue, and the upper surface is flush with the top of the light-emitting diode chip; the support bowl is filled with transparent epoxy resin glue, and the upper surface of the transparent epoxy resin glue is flush with the top of the support bowl. The LED display screen is uniform in light emitting and high in contrast ratio, and the LED display screen has good visual consistency.

Description

Technical Field

[0001] The invention relates to the technical field of light emitting diode display screens, and in particular to a light emitting diode display unit, a packaging method and a display screen. Background Art

[0002] Light Emitting Diode (LED), also known as LED lamp beads, is the basic unit of LED related products. As an imaging electronic device, LED display has the characteristics of high brightness, wide viewing angle, long life, etc., and is widely used in various fields.

[0003] The LED bracket is made of plastic injection molding, and the red, green and blue LED chips are set on the bracket functional area. In order to improve the contrast of the LED display, the white plastic used for injection molding is replaced with black plastic; in order to ensure the brightness of the LED display, transparent epoxy resin glue is used to fill the bracket bowl above the bracket functional area. However, since the bracket functional area adopts the silver plating solution, the surface of the bracket functional area appears silvery white. When the LED is lit, the bracket bowl part is translucent and white, which forms a color difference with the black plastic, which is not conducive to the image display of the LED display.

[0004] In addition, in order to ensure the brightness of the LED display, it is necessary to use a normal-mounted LED chip. The height of the normal-mounted green LED chip is the same as that of the normal-mounted blue LED chip, but the normal-mounted red LED chip is higher than the two. Inconsistent heights of LED chips will lead to a low matching degree of light output, reduce the coordination and fidelity of the overall display effect of the LED display, and cause color difference and uneven brightness.

[0005] Currently, no effective solution has been proposed to solve the problem that the functional area of ​​the LED bracket in the related technology is white in light transmission and the height of LED chips of different colors are inconsistent, resulting in poor display effect of the LED display screen. Summary of the invention

[0006] The invention provides a light emitting diode display unit, a packaging method and a display screen, which at least solve the problems in the related art that the functional area of ​​the LED bracket is white and the heights of LED chips of different colors are inconsistent, resulting in poor display effects of the LED display screen.

[0007] The light-emitting diode display unit provided by the present invention includes a bracket and a light-emitting diode chip; the bracket is fixed on a substrate by black plastic, and a bracket cup is formed above the bracket functional area of ​​the bracket;

[0008] The light emitting diode chip comprises a first chip and a second chip; wherein the first chip is the chip with the shortest height among the light emitting diode chips, and the second chip is the chip among the light emitting diode chips except the first chip;

[0009] The first chip is fixedly connected to a corresponding position of the bracket functional area, and a groove is provided on the upper surface of the bracket functional area. The groove is used to place the second chip, and the depth of the groove is determined according to the height of the second chip;

[0010] The bottom of the bracket bowl is filled with black epoxy resin glue, and the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip;

[0011] The interior of the bracket bowl is also filled with transparent epoxy resin glue, and the transparent epoxy resin glue is filled on top of the black epoxy resin glue and the light-emitting diode chip, and the upper surface of the transparent epoxy resin glue is flush with the top of the bracket bowl.

[0012] In the LED display unit provided by the embodiment of the present invention, the second chip is a red LED chip, the first chip is a green LED chip and a blue LED chip, and the green LED chip and the blue LED chip are of equal height;

[0013] The red light emitting diode chip is placed in the groove, and the depth of the groove is determined according to the height difference between the red light emitting diode chip and the green light emitting diode chip.

[0014] In the light-emitting diode display unit provided by the embodiment of the invention, the red light-emitting diode chip, the green light-emitting diode chip, and the blue light-emitting diode chip are arranged in a straight line on the functional area of ​​the bracket.

[0015] In the light-emitting diode display unit provided by the embodiment of the present invention, the black epoxy resin glue is a mixture of epoxy resin glue and black agent, and the content of the black agent is 0.3% to 0.4% of the content of the epoxy resin glue.

[0016] The light emitting diode packaging method provided by the embodiment of the present invention comprises the following steps:

[0017] The bracket is injection molded by black plastic to fix the bracket on the substrate and form a bracket cup above the bracket functional area of ​​the bracket;

[0018] The first chip among the light-emitting diode chips is fixedly connected to the corresponding position of the bracket functional area, and the second chip among the light-emitting diode chips is placed in the groove, wherein the first chip is the chip with the lowest height among the light-emitting diode chips, and the second chip is the chip among the light-emitting diode chips except the first chip, and the groove is opened on the upper surface of the bracket functional area, and the depth of the groove is determined according to the height of the second chip;

[0019] Fill the bottom of the bracket bowl with black epoxy resin glue until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip;

[0020] Fill the interior of the support bowl with transparent epoxy resin glue until the upper surface of the transparent epoxy resin glue is flush with the top of the support bowl.

[0021] The light emitting diode packaging method provided by the embodiment of the present invention, after the upper surface of the transparent epoxy resin glue is flush with the top of the bracket bowl, further comprises:

[0022] The transparent epoxy resin glue is baked in multiple stages according to the set temperatures from low to high.

[0023] The light emitting diode packaging method provided by the present invention is to bake the transparent epoxy resin glue in multiple stages according to the set temperatures from low to high, including:

[0024] Baking the transparent epoxy resin glue at a first baking temperature of 90 degrees Celsius to 100 degrees Celsius for 1 hour;

[0025] The transparent epoxy resin glue is baked at a second baking temperature of 150 degrees Celsius for 3 hours.

[0026] The light emitting diode packaging method provided by the present invention is to fill the bottom of the bracket bowl with black epoxy resin glue until the upper surface of the black epoxy resin glue is flush with the top of the light emitting diode chip, comprising:

[0027] Evenly dispense black epoxy resin glue on the bottom of the bracket bowl until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip;

[0028] The black epoxy resin glue is baked at a first baking temperature of 90 degrees Celsius to 100 degrees Celsius for 1 hour.

[0029] The light emitting diode display screen provided by the embodiment of the invention includes one or more light emitting diode display units.

[0030] The light-emitting diode display screen provided by the embodiment of the invention also includes a main controller, a scanning board, a display control unit and a light-emitting diode display screen body, and the light-emitting diode display screen body is provided with the light-emitting diode display unit;

[0031] The main controller is connected to the scanning board, and the main controller transmits a control signal to the scanning board;

[0032] The scanning board is connected to the display control unit, and the scanning board buffers the control signal and transmits it to the display control unit;

[0033] The display control unit is connected to the light emitting diode display screen and is used to control the light emitting diode display unit to display.

[0034] The invention provides a light-emitting diode display unit, a packaging method and a display screen, which solve the problems in the related art that the functional area of ​​the LED bracket is light-transmissive and white, and the heights of LED chips of different colors are inconsistent, resulting in poor display effects of the LED display screen. While having a high contrast ratio, it can ensure uniform light emission, so that the LED display screen has better visual consistency. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the prior art descriptions. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other embodiments can be obtained based on these drawings without creative work.

[0036] Figure 1 It is a side view schematic diagram of a light emitting diode display unit in an embodiment of the invention.

[0037] Figure 2 It is a top view schematic diagram of a light emitting diode display unit in an embodiment of the invention.

[0038] Figure 3 It is a step flow chart of a light emitting diode packaging method in an embodiment of the present invention.

[0039] Figure 4 The present invention is a light-transmitting schematic diagram of a light-emitting diode display screen in an embodiment of the invention.

[0040] Figure 5 It is a schematic diagram of the structure of an electronic device in an embodiment of the invention.

[0041] The above drawings include the following reference numerals:

[0042] 101—support functional area; 1011—groove; 102—support bowl; 103—support heat dissipation part; 104—support pin;

[0043] 201—first chip; 202—second chip; 2011—green LED chip; 2012—blue LED chip; 2021—red LED chip;

[0044] 30—black plastic; 40—black epoxy glue; 50—transparent epoxy glue. DETAILED DESCRIPTION

[0045] The embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although certain embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be construed as being limited to the embodiments described herein, which are instead provided to provide a more thorough and complete understanding of the present invention. It should be understood that the drawings and embodiments of the present invention are only for exemplary purposes and are not intended to limit the scope of protection of the present invention.

[0046] In the related art, in order to improve the contrast of the LED display screen, the white plastic used for injection molding is replaced with black plastic; in order to ensure the brightness of the LED display screen, transparent epoxy resin glue is used to fill the bracket bowl above the bracket functional area. However, since the bracket functional area adopts the silver plating solution, the surface of the bracket functional area appears silvery white, and the bracket bowl part is translucent and white when the LED is displayed, which forms a color difference with the black plastic, which is not conducive to the image display of the LED display screen. In addition, in order to ensure the brightness of the LED display screen, it is necessary to use a normal LED chip. The normal green LED chip is the same height as the normal blue LED chip, but the normal red LED chip is higher than the two. The inconsistent height of the LED chip will result in a low matching degree of the light output shape, reduce the coordination and fidelity of the overall display effect of the LED display screen, and cause color difference and uneven brightness.

[0047] To this end, embodiments of the present invention provide a light emitting diode display unit, a packaging method and a display screen.

[0048] Please refer to Figure 1 The side view schematic diagram of a light emitting diode display unit shown in the figure, the light emitting diode display unit provided by the embodiment of the invention comprises a bracket and a light emitting diode chip;

[0049] The bracket is fixed on the substrate by black plastic 30, and a bracket cup 102 is formed above the bracket functional area 101 of the bracket;

[0050] The light emitting diode chip includes a first chip 201 and a second chip 202; wherein the first chip 201 is the chip with the shortest height among the light emitting diode chips, and the second chip 202 is the chip other than the first chip among the light emitting diode chips;

[0051] The first chip 201 is fixedly connected to the corresponding position of the support functional area 101. The upper surface of the support functional area 101 is provided with a groove 1011. The groove 1011 is used to place the second chip 202. The depth of the groove 1011 is determined according to the height of the second chip 202.

[0052] The bottom of the support bowl 102 is filled with black epoxy resin glue 40, and the upper surface of the black epoxy resin glue 40 is flush with the top of the light-emitting diode chip 20;

[0053] The interior of the support bowl 102 is also filled with transparent epoxy resin glue 50 , which is filled on top of the black epoxy resin glue 40 and the light-emitting diode chip, and the upper surface of the transparent epoxy resin glue 50 is flush with the top of the support bowl 102 .

[0054] The above-mentioned light-emitting diode display unit provided by the embodiment created by the present invention has a groove on the bracket functional area to accommodate a second chip with a higher height, so that the height of the light-emitting diode chip on the bracket functional area is consistent, ensuring a high degree of matching of the light output light shape, thereby improving the coordination and fidelity of the overall display effect of the light-emitting diode display screen; black epoxy resin glue is filled at the bottom of the bracket bowl to isolate the upper surface of the bracket functional area from the transparent epoxy resin glue inside the bracket bowl, and the side of the light-emitting diode chip is wrapped to avoid color differences caused by the white light of the bracket bowl and the black plastic when the light-emitting diode is displayed, thereby ensuring brightness and contrast while making the light-emitting diode display screen have better visual consistency in the overall display effect.

[0055] Next, the above-mentioned light emitting diode display unit is described in detail:

[0056] Optionally, the black plastic is polyphenylene ether ketone or polyphthalamide (PPA), which has excellent thermal stability and chemical resistance.

[0057] Optionally, the substrate is a printed circuit board (PCB) or a plastic board, and the specific substrate to be selected depends on the design requirements when the LED display unit is applied.

[0058] It can be understood that the shape of the groove 1011 is determined according to the shape of the second chip 202 , and the gap between the groove 1011 and the second chip 202 is filled with conductive silver paste.

[0059] Optional, see Figure 2 In the schematic top view of a light emitting diode display unit shown, the second chip 202 is a red LED chip 2021, the first chip 201 is a green LED chip 2011 and a blue LED chip 2012, and the green LED chip 2011 and the blue LED chip 2012 are of equal height.

[0060] The red LED chip 2021 is placed in the groove 1011 . The depth of the groove 1011 is determined according to the height difference between the red LED chip 2021 and the green LED chip 2011 . The shape of the groove 1011 is determined according to the shape of the red LED chip 2021 .

[0061] Exemplarily, the positive electrode of the red LED chip 2021 is located at the bottom of the chip, and the positive electrode is connected to the positive electrode pad of the above-mentioned bracket through the above-mentioned conductive silver glue; the negative electrode of the red LED chip 2021 is located on the surface of the chip, and the negative electrode is connected to the negative electrode pad of the above-mentioned bracket through a bonding wire.

[0062] The positive and negative electrodes of the green LED chip 2011 and the blue LED chip 2012 are both located on the chip surface, wherein the positive electrode of the green LED chip 2011 and the positive electrode of the blue LED chip 2012 are both connected to the positive electrode pad of the above-mentioned bracket through bonding wires, and the negative electrode of the green LED chip 2011 and the negative electrode of the blue LED chip 2012 are both connected to the negative electrode pad of the above-mentioned bracket through bonding wires.

[0063] Optionally, the bonding wire is a gold wire, a copper wire or a palladium-plated copper wire, or other metal wires with good electrical conductivity.

[0064] Preferably, the pad area of ​​the bracket includes not only the positive pad and the negative pad, but also an electrode separation area, and the electrode separation area is used to isolate the positive pad and the negative pad to improve the safety of the circuit.

[0065] Specifically, an LED display unit using a red LED chip 2021, a green LED chip 2011 and a blue LED chip 2012 is an integrated pixel point when displaying light. By adjusting the brightness of the LED chips 2021, 2011, and 2012, multiple colors can be mixed to produce.

[0066] It is foreseeable that a plurality of red LED chips 2021, a plurality of green LED chips 2011 and a plurality of blue LED chips 2012 may be provided on the same LED display unit, so as to obtain a richer color display effect.

[0067] Optionally, the bracket further includes a bracket heat dissipation portion 103, and the bracket heat dissipation portion 103 can be connected to an external heat dissipation path to conduct away the heat generated by the LED chip, thereby improving the reliability and service life of the LED chip.

[0068] Exemplarily, the bracket heat dissipation portion 103 is a pin-fin heat sink or a plate-fin heat sink, which is composed of a metal plate and a plurality of protruding pins or fins, and promotes heat dissipation by increasing the surface area.

[0069] Optionally, the bracket further includes a bracket pin 104 .

[0070] According to the design requirements and application scenarios of the LED display unit, the shape of the bracket pin 104 can be changed to make it have a clamping support function. On this basis, welding can be performed to strengthen the connection between the LED display unit and the substrate, thereby improving the structural stability of the LED display unit.

[0071] When the bracket pin 104 is connected to the pad area of ​​the above-mentioned bracket through a bonding wire, or when the bracket pin 104 is directly connected to the electrode of the LED chip through a bonding wire, the bracket pin 104 also has the function of providing an electrical connection so that the current of the external circuit can smoothly enter the electrode of the LED chip.

[0072] Preferably, the red light emitting diode chip 2021 , the green light emitting diode chip 2011 , and the blue light emitting diode chip 2012 are arranged in a straight line on the support functional area 101 .

[0073] The linear arrangement helps the red, green and blue lights to mix directly in space, forming a uniform white light or full-color display, improving the luminous efficiency and enhancing the display effect. At the same time, the linear arrangement can simplify the packaging and assembly process and improve production efficiency. In addition, the linear arrangement makes it easier to individually control the current and light intensity of each LED chip, and the display color and brightness can be adjusted more accurately.

[0074] Optionally, the black epoxy resin glue 40 is a mixture of epoxy resin glue and black agent, and the content of the black agent is 0.3% to 0.4% of the content of the epoxy resin glue.

[0075] Epoxy resin glue has strong adhesion, low volume shrinkage and good compatibility, and its corrosion resistance and dielectric properties are also good.

[0076] The black agent is printer toner or activated carbon, or may be other black dye or black paint that is compatible with epoxy resin glue.

[0077] The mixing ratio of 0.3% to 0.4% can ensure that the mixed black epoxy resin glue 40 can solve the problem of white light transmission of the bracket bowl 102 while not covering the display light of the LED chip.

[0078] Considering that the interior of the support bowl 102 needs to be filled with transparent epoxy resin glue 50, the black epoxy resin glue 40 can be directly obtained by mixing the necessary transparent epoxy resin glue 50 with a black agent and then degassing. Degassing refers to removing bubbles in the material to improve purity and performance.

[0079] The embodiment of the present invention also provides a light emitting diode packaging method, which can be used for packaging the light emitting diode display unit provided in the above embodiment.

[0080] Please refer to Figure 3 The light emitting diode packaging method provided by the embodiment of the present invention comprises:

[0081] Step S101, performing injection molding on the bracket by using black plastic, fixing the bracket on the substrate, and forming a bracket cup above the bracket functional area of ​​the bracket;

[0082] Step S102, fixing and connecting the first chip among the light-emitting diode chips to the corresponding position of the bracket functional area, and placing the second chip among the light-emitting diode chips in the groove, wherein the first chip is the chip with the lowest height among the light-emitting diode chips, and the second chip is the chip other than the first chip among the light-emitting diode chips, and the groove is opened on the upper surface of the bracket functional area, and the depth of the groove is determined according to the height of the second chip;

[0083] Step S103, filling the bottom of the bracket bowl with black epoxy resin glue until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip;

[0084] Step S104, filling the interior of the bracket bowl with transparent epoxy resin glue until the upper surface of the transparent epoxy resin glue is flush with the top of the bracket bowl.

[0085] The above-mentioned light-emitting diode packaging method provided by the embodiment of the invention can ensure that the height of the light-emitting diode chip on the functional area of ​​the bracket is consistent, thereby improving the matching degree of the light output light shape and improving the coordination and fidelity of the overall display effect of the light-emitting diode display screen; while ensuring the brightness and contrast, the light-emitting diode display screen can have better visual consistency in the overall display effect.

[0086] Preferably, step S103, filling the bottom of the bracket bowl with black epoxy resin glue until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip, comprises:

[0087] Step S103A, evenly dispense black epoxy resin glue on the bottom of the bracket bowl until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip.

[0088] Specifically, the fluidity and viscosity characteristics of epoxy resin glue enable it to automatically form a relatively uniform filling effect without the need for additional scraping or smoothing of the upper surface; using a dispensing machine for dispensing can accurately control the flow and pressure of the epoxy resin glue, so that the epoxy resin glue can be evenly distributed in the target position.

[0089] Taking into account that the epoxy resin glue expands during the baking process and contracts after cooling after baking, the flow rate and pressure of the epoxy resin glue controlled by the dispensing machine need to be pre-adjusted.

[0090] Step S103B, baking the black epoxy resin glue at a first baking temperature of 90 degrees Celsius to 100 degrees Celsius for 1 hour to remove moisture and volatile substances in the black epoxy resin glue.

[0091] Preferably, in step S104, after the upper surface of the transparent epoxy resin glue is flush with the top of the bracket bowl, the method further includes: baking the transparent epoxy resin glue in multiple stages according to set temperatures from low to high.

[0092] Low-temperature baking can remove moisture from LED chips and packaging materials, reduce the impact of humidity on product performance, and help improve product quality and stability.

[0093] High temperature baking can accelerate the curing process and thermally age the LED to improve bonding strength.

[0094] Performing low-temperature baking first and then high-temperature baking can prevent the phosphor added to the transparent epoxy resin glue from precipitating, thereby improving the color temperature and light effect of the LED.

[0095] Preferably, the transparent epoxy resin glue is baked in multiple stages according to the set temperatures from low to high, including:

[0096] Bake the transparent epoxy resin glue at a first baking temperature of 90 degrees Celsius to 100 degrees Celsius for 1 hour;

[0097] The transparent epoxy resin glue is baked at a second baking temperature of 150 degrees Celsius for 3 hours.

[0098] Gradual curing can reduce thermal stress caused by rapid temperature changes and avoid damage to packaging materials caused by premature high temperature.

[0099] The embodiment of the present invention also provides a light emitting diode display screen, which includes one or more of the above-mentioned light emitting diode display units.

[0100] Optionally, the above-mentioned LED display screen also includes a main controller, a scanning board, a display control unit and an LED display screen body, and the LED display screen body is provided with an LED display unit.

[0101] The main controller is connected to the scanning board, and the main controller transmits the control signal to the scanning board.

[0102] The main controller is at least one of the following: a programmable logic controller (PLC), an ARM controller or a FPGA controller.

[0103] The scanning board is connected to the display control unit, and the scanning board buffers the control signal and transmits it to the display control unit.

[0104] The scanning board has a single-layer or multi-layer structure. When the scanning board has a multi-layer structure, the scanning board can transmit the control signal in segments, which helps to independently control different areas of the LED display screen and achieve more complex display effects.

[0105] The display control unit is connected to the light emitting diode display screen and is used to control the light emitting diode display unit to display.

[0106] The display control unit is composed of latches and has a grayscale control function.

[0107] Specifically, the light emitting diode display screen can realize automatic control, and the light emission is more accurate and stable.

[0108] The light-emitting diode display screen provided by the embodiment of the present invention includes all the technical effects of the light-emitting diode display unit described above. Since the technical effects of the light-emitting diode display unit have been described in detail above, they will not be repeated here.

[0109] For example, please refer to Figure 4 As shown, the embodiment of the invention also provides a light transmission schematic diagram of the above solution to verify its technical effect. The specific test data are as follows:

[0110] The first chip is a green LED chip and a blue LED chip, with a length, width and height of 0.20mm*0.25mm*0.11mm respectively; the second chip is a red LED chip, with a length, width and height of 0.18mm*0.18mm*0.16mm; the groove is a square groove, with a length, width and height of 0.20mm*0.20mm*0.05mm; the dispensing amount of black epoxy resin glue is 0.12μl, the glue height is 0.11mm, and it is baked at the first baking temperature for 1 hour after dispensing; the dispensing amount of transparent epoxy resin glue is 0.58μl, the glue height is 0.34mm, and it is baked at the first baking temperature for 1 hour after dispensing, and then baked at the second baking temperature for 3 hours.

[0111] Specifically, Figure 4 The left half is a light transmission diagram of the bracket functional area without a groove and the bottom of the bracket bowl without filling black epoxy resin glue. It can be seen that there is an obvious light transmission whitening problem; Figure 4 The right half is a light transmission schematic diagram of the above solution provided by the invention, the problem of white light transmission of the bracket bowl and cup has been significantly improved, and the LED display screen has better visual consistency.

[0112] The embodiments of the present invention also provide a non-transitory machine-readable medium storing a computer program, wherein the computer program, when executed by a processor of a computer, is used to cause the computer to execute the method of the embodiments of the present invention.

[0113] The embodiments of the present invention further provide a computer program product, including a computer program, wherein the computer program, when executed by a processor of a computer, is used to cause the computer to execute the method of the embodiments of the present invention.

[0114] The embodiment of the invention also provides an electronic device, comprising: at least one processor; and a memory connected to the at least one processor in communication. The memory stores a computer program that can be executed by the at least one processor, and the computer program is used to enable the electronic device to perform the method of the embodiment of the invention when executed by the at least one processor.

[0115] refer to Figure 5 , a block diagram of an electronic device that can be used as a server or client of an embodiment of the invention will now be described, which is an example of a hardware device that can be applied to various aspects of the invention. Electronic devices are intended to represent various forms of digital electronic computer devices, such as laptop computers, desktop computers, workbenches, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The components shown herein, their connections and relationships, and their functions are merely examples and are not intended to limit the implementation of the invention described and / or claimed herein.

[0116] like Figure 5 As shown, the electronic device includes a computing unit 501, which can perform various appropriate actions and processes according to a computer program stored in a read-only memory (ROM) 502 or a computer program loaded from a storage unit 508 to a random access memory (RAM) 503. In the RAM 503, various programs and data required for the operation of the electronic device can also be stored. The computing unit 501, the ROM 502, and the RAM 503 are connected to each other via a bus 504. An input / output (I / O) interface 505 is also connected to the bus 504.

[0117] Multiple components in the electronic device are connected to the I / O interface 505, including: an input unit 506, an output unit 507, a storage unit 508, and a communication unit 509. The input unit 506 can be any type of device that can input information to the electronic device, and the input unit 506 can receive input digital or character information, and generate key signal input related to user settings and / or function control of the electronic device. The output unit 507 can be any type of device that can present information, and can include but is not limited to a display, a speaker, a video / audio output terminal, a vibrator, and / or a printer. The storage unit 508 can include but is not limited to a disk, an optical disk. The communication unit 509 allows the electronic device to exchange information / data with other devices through a computer network such as the Internet and / or various telecommunication networks, and can include but is not limited to a modem, a network card, an infrared communication device, and / or a wireless communication transceiver, such as a Bluetooth device, a WiFi device, a WiMax device, a cellular communication device, and / or the like.

[0118] The computing unit 501 may be a variety of general and / or special processing components with processing and computing capabilities. Some examples of the computing unit 501 include, but are not limited to, a CPU, a graphics processing unit (GPU), various special artificial intelligence (AI) computing units, various computing units running machine learning model algorithms, digital signal processors (DSPs), and any appropriate processors, controllers, microcontrollers, etc. The computing unit 501 performs the various methods and processes described above. For example, in some embodiments, the method embodiments created by the present invention may be implemented as a computer program, which is tangibly contained in a machine-readable medium, such as a storage unit 508. In some embodiments, part or all of the computer program may be loaded and / or installed on an electronic device via a ROM 502 and / or a communication unit 509. In some embodiments, the computing unit 501 may be configured to perform the above-described method in any other appropriate manner (e.g., by means of firmware).

[0119] The computer program for implementing the method of the present invention can be written in any combination of one or more programming languages. These computer programs can be provided to a processor or controller of a general-purpose computer, a special-purpose computer, or other programmable data processing device, so that the computer program, when executed by the processor or controller, enables the functions / operations specified in the flow chart and / or block diagram to be implemented. The computer program can be executed entirely on the machine, partially on the machine, partially on the machine as a stand-alone software package and partially on a remote machine, or entirely on a remote machine or server.

[0120] In the context of the present invention, a machine-readable medium may be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, device, or apparatus. A machine-readable medium may be a machine-readable signal medium or a machine-readable storage medium. A machine-readable signal medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, or infrared systems, devices, or equipment, or any suitable combination of the foregoing. More specific examples of machine-readable storage media may include electrical connections based on one or more lines, portable computer disks, hard disks, random access memories (RAM), read-only memories (ROM), erasable programmable read-only memories (EPROM or flash memory), optical fibers, portable compact disk read-only memories (CD-ROMs), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0121] It should be noted that the term "including" and its variations used in the embodiments of the present invention are open inclusions, that is, "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one other embodiment"; the term "some embodiments" means "at least some embodiments". The modifications of "one" and "multiple" mentioned in the embodiments of the present invention are illustrative and not restrictive. Those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more".

[0122] The user information (including but not limited to user device information, user personal information, etc.) and data (including but not limited to data used for analysis, stored data, displayed data, etc.) involved in the embodiments of the present invention are all information and data authorized by the user or fully authorized by all parties, and the collection, use and processing of relevant data must comply with the relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation entrances for users to choose to authorize or refuse.

[0123] The various steps described in the method implementation methods provided by the embodiments of the present invention can be performed in different orders and / or in parallel. In addition, the method implementation methods may include additional steps and / or omit the steps shown. The scope of protection of the present invention is not limited in this respect.

[0124] The term "embodiment" in this specification refers to specific features, structures or characteristics described in conjunction with the embodiment that can be included in at least one embodiment of the invention. The appearance of this phrase in various locations in the specification does not necessarily mean the same embodiment, nor does it mean that it is mutually exclusive with other embodiments and is independent or optional. The various embodiments in this specification are described in a related manner, and the same and similar parts between the various embodiments refer to each other. In particular, for the method embodiment, since it is basically similar to the device and equipment embodiment, the description is relatively simple, and the relevant parts refer to the partial description of the device and equipment embodiment.

[0125] The above-described embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of protection. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the scope of protection of the present invention. Therefore, the scope of protection of the present invention shall be subject to the attached claims.

Claims

1. A light emitting diode display unit, characterized in that: It includes a bracket and a light-emitting diode chip; the bracket is fixed on the substrate by black plastic, and a bracket cup is formed above the bracket functional area of ​​the bracket; The light emitting diode chip comprises a first chip and a second chip; wherein the first chip is the chip with the shortest height among the light emitting diode chips, and the second chip is the chip among the light emitting diode chips except the first chip; The first chip is fixedly connected to a corresponding position of the bracket functional area, and a groove is provided on the upper surface of the bracket functional area. The groove is used to place the second chip, and the depth of the groove is determined according to the height of the second chip; The bottom of the bracket bowl is filled with black epoxy resin glue, and the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip; The interior of the support bowl is also filled with transparent epoxy resin glue, and the transparent epoxy resin glue is filled on top of the black epoxy resin glue and the light-emitting diode chip, and the upper surface of the transparent epoxy resin glue is flush with the top of the support bowl.

2. The light emitting diode display unit according to claim 1, characterized in that: The second chip is a red light emitting diode chip, the first chip is a green light emitting diode chip and a blue light emitting diode chip, and the height of the green light emitting diode chip and the height of the blue light emitting diode chip are equal; The red light emitting diode chip is placed in the groove, and the depth of the groove is determined according to the height difference between the red light emitting diode chip and the green light emitting diode chip.

3. The light emitting diode display unit according to claim 2, characterized in that: The red light emitting diode chip, the green light emitting diode chip, and the blue light emitting diode chip are arranged in a straight line on the support functional area.

4. The light emitting diode display unit according to claim 1, characterized in that: The black epoxy resin glue is a mixture of epoxy resin glue and black agent, and the content of the black agent is 0.3% to 0.4% of the content of the epoxy resin glue.

5. A light emitting diode packaging method, characterized in that: The following steps are involved: The bracket is injection molded by black plastic to fix the bracket on the substrate and form a bracket cup above the bracket functional area of ​​the bracket; The first chip among the light-emitting diode chips is fixedly connected to the corresponding position of the bracket functional area, and the second chip among the light-emitting diode chips is placed in the groove, wherein the first chip is the chip with the lowest height among the light-emitting diode chips, and the second chip is the chip among the light-emitting diode chips except the first chip, and the groove is opened on the upper surface of the bracket functional area, and the depth of the groove is determined according to the height of the second chip; Fill the bottom of the bracket bowl with black epoxy resin glue until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip; Fill the interior of the support bowl with transparent epoxy resin glue until the upper surface of the transparent epoxy resin glue is flush with the top of the support bowl.

6. The light emitting diode packaging method according to claim 5, characterized in that: After the upper surface of the transparent epoxy resin glue is flush with the top of the bracket bowl, the method further comprises: The transparent epoxy resin glue is baked in multiple stages according to the set temperatures from low to high.

7. The light emitting diode packaging method according to claim 6, characterized in that: The transparent epoxy resin glue is baked in multiple stages according to the set temperatures from low to high, including: Baking the transparent epoxy resin glue at a first baking temperature of 90 degrees Celsius to 100 degrees Celsius for 1 hour; The transparent epoxy resin glue is baked at a second baking temperature of 150 degrees Celsius for 3 hours.

8. The light emitting diode packaging method according to claim 5, characterized in that: Filling the bottom of the support bowl with black epoxy resin glue until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip, including: Evenly dispense black epoxy resin glue on the bottom of the bracket bowl until the upper surface of the black epoxy resin glue is flush with the top of the light-emitting diode chip; The black epoxy resin glue is baked at a first baking temperature of 90 degrees Celsius to 100 degrees Celsius for 1 hour.

9. A light emitting diode display screen, characterized in that: The device comprises one or more light emitting diode display units according to any one of claims 1 to 4.

10. The light emitting diode display screen according to claim 9, characterized in that: It also includes a main controller, a scanning board, a display control unit and a light emitting diode display screen, on which the light emitting diode display screen is provided with the light emitting diode display unit; The main controller is connected to the scanning board, and the main controller transmits a control signal to the scanning board; The scanning board is connected to the display control unit, and the scanning board buffers the control signal and transmits it to the display control unit; The display control unit is connected to the light emitting diode display screen and is used to control the light emitting diode display unit to display.

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