Cooling device and method of converter valve external cold water system based on semiconductor

Abstract

The invention discloses a semiconductor-based converter valve external cold water system cooling device and method, an external cold water system comprises a water tank for heat exchange of a converter valve, the cooling device comprises a plurality of cooling assemblies, and each cooling assembly comprises a semiconductor chilling plate, a refrigeration base, a fixing mechanism, a temperature detection unit and a control unit; one side of each refrigeration base is attached to a water tank of an external cold water system for heat exchange, the other side of each refrigeration base is attached and fixed to the corresponding semiconductor refrigeration sheet, and the adjacent refrigeration bases are detachably fixed through fixing mechanisms; the temperature detection unit detects converter valve temperature, water tank temperature and environment temperature; the control unit controls the semiconductor chilling plate to adjust the temperature of the converter valve according to the detected converter valve temperature, the water tank temperature and the environment temperature. The system can be rapidly deployed, and rapid refrigeration is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of converter valve cooling, and in particular relates to a semiconductor-based cooling device and method for a converter valve external cooling water system. Background Art

[0002] When the cooling performance of the converter valve cooling water system is reduced due to aging or the external cooling water system fails and it is difficult to recover quickly in a short time, an auxiliary refrigeration device is needed to cool the converter valve cooling system.

[0003] The existing industrial refrigeration equipment mainly adopts compression refrigeration. Compressor refrigeration mainly uses the refrigeration compressor in the vapor compression refrigeration system to increase the refrigerant from low pressure to high pressure, and make the refrigerant circulate continuously, so that the system continuously discharges internal heat to an environment with a higher temperature than the system. Heat is discharged from a low temperature environment to a high temperature environment to reduce the temperature. For example, industrial chillers and household air conditioners. The main working process:

[0004] Compression: The refrigeration method is to compress the refrigerant (coolant) into high-temperature and high-pressure steam through the compressor and discharge it into the condenser

[0005] Condensation: When the pressure remains constant, it is cooled by the cooling medium (water or air), releases heat, the temperature drops, and further condenses into liquid and is discharged from the condenser;

[0006] Throttling: When high-pressure refrigerant liquid passes through the throttle valve, the pressure drops due to obstruction, causing part of the refrigerant liquid to vaporize, absorbing the latent heat of vaporization, and reducing its own temperature accordingly, becoming wet vapor at low temperature and low pressure, and entering the evaporator;

[0007] Evaporation: In the evaporator, the refrigerant absorbs the heat (i.e., cooling capacity) of the cooling medium (air, water or brine, etc.) while keeping the pressure constant and vaporizes to form low-temperature and low-pressure vapor which is then sucked away by the compressor, thus repeating the compression and refrigeration cycle.

[0008] However, when the existing refrigeration technology is directly used in the cold water system outside the converter valve, there are the following defects:

[0009] 1. Not conducive to rapid deployment, compression cooling method, large size, heavy weight. Not easy to move and carry, difficult to deploy quickly when the cooling performance is reduced due to aging of the converter valve cold water system or when the external cold water system fails.

[0010] 2. The refrigeration speed is slow and the structure is complex. Compression refrigeration requires a series of mechanical mechanisms, which results in a significantly lower refrigeration speed than semiconductor refrigeration.

[0011] 3. Loud noise and not environmentally friendly. Compression refrigeration equipment uses a series of mechanical structures, which produces mechanical noise. Refrigerants can easily damage the atmospheric environment and are not environmentally friendly.

[0012] 4. Poor scalability. The current technology can only be used for cooling open systems such as valve external cooling water. For the closed pipelines of water cooling, converter oil circulation, and phase-shifting machine cooling circuit in the converter station, they can only rely on the system's own cooling system for cooling, and cannot be quickly assisted by external means.

[0013] Therefore, how to design an auxiliary cooling device that can be stably applied to the converter valve cooling water system is a technical problem that needs to be solved urgently in this field. Summary of the invention

[0014] In view of the defects in the above-mentioned prior art, the present invention provides a semiconductor-based cooling device and method for a converter valve external cooling water system, which can be quickly deployed and achieve rapid cooling.

[0015] In a first aspect, the present invention provides a semiconductor-based cooling device for a converter valve external cooling water system, the external cooling water system comprising a water tank for exchanging heat with the converter valve, the cooling device comprising a plurality of cooling components, the cooling components comprising a semiconductor cooling sheet, a cooling base, a fixing mechanism, a temperature detection unit and a control unit;

[0016] One side of the refrigeration base is used for heat exchange with the water tank of the external cooling water system, and the other side is fixed with the semiconductor refrigeration sheet. The adjacent refrigeration bases are detachably fixed by a fixing mechanism.

[0017] The temperature detection unit detects the temperature of the converter valve, the water tank and the ambient temperature;

[0018] The control unit controls the semiconductor refrigeration plate to adjust the temperature of the converter valve according to the detected converter valve temperature, water tank temperature and ambient temperature.

[0019] Furthermore, a plurality of cooling components are annularly connected and fixed outside the water tank, and adjacent cooling components are detachably fixed by a fixing mechanism;

[0020] The fixing mechanism comprises a fixing plug and a fixing groove respectively located on adjacent refrigeration bases. The fixing plug and the fixing groove match in shape and are fixed by a fixing piece passing through both the fixing plug and the fixing groove.

[0021] Furthermore, the external cooling water system also includes a water cooling pipe connected to the water tank, and the water tank exchanges heat with the converter valve through the water cooling pipe;

[0022] The refrigeration base is provided with a plurality of grooves and / or through holes, and accommodates the water cooling pipe after heat exchange through the converter valve.

[0023] Furthermore, a heat dissipation fan is fixed on a side of the semiconductor refrigeration plate away from the refrigeration base.

[0024] Furthermore, a heat dissipation fin is provided on a side of the semiconductor refrigeration plate away from the refrigeration base, and a heat dissipation fan is fixed on the heat dissipation fin.

[0025] Further, according to the detected converter valve temperature, water tank temperature and ambient temperature, controlling the semiconductor refrigeration sheet to adjust the temperature of the converter valve includes:

[0026] Determine the power required by the semiconductor refrigeration chip according to the detected converter valve temperature, water tank temperature and ambient temperature;

[0027] Based on the power required by the semiconductor refrigerator, determine the current required by the semiconductor refrigerator;

[0028] Based on the target temperature range of the converter valve, determine the temperature adjustment range of the semiconductor cooling chip;

[0029] Based on the current required by the semiconductor refrigeration chip and combined with the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range.

[0030] Furthermore, the power required by the semiconductor refrigeration plate is determined according to the detected converter valve temperature, water tank temperature and ambient temperature, including:

[0031] Determine the additional cooling capacity required for the converter valve according to the detected converter valve temperature and the converter valve target temperature and in combination with the physical parameters of the cooling medium in the external cooling water system;

[0032] According to the physical parameters of the refrigeration base, combined with the detected temperature of the converter valve, the water tank temperature and the ambient temperature, the heat load conducted between the environment and the refrigeration base is determined;

[0033] Determine the temperature difference efficiency of the semiconductor refrigeration chip, and combine the additional cooling required by the converter valve and the heat load conducted between the environment and the refrigeration base to obtain the power required by the semiconductor refrigeration chip.

[0034] Furthermore, the power required by the semiconductor refrigeration sheet satisfies the following relationship:

[0035]

[0036] Wherein, I is the current required by the semiconductor refrigeration sheet, c is the specific heat capacity of the cooling medium in the external cooling water system, ρ is the density of the cooling medium, V is the flow rate of the cooling medium, S0 is the effective cooling area of ​​the external cooling water system, T1 is the detected converter valve temperature, T0 is the converter valve target temperature, λ is the thermal conductivity of the refrigeration base, H is the thickness of the refrigeration base, T2 is the water tank temperature, T3 is the ambient temperature, S1 is the total contact area between the semiconductor refrigeration sheet and the refrigeration base, S2 is the total contact area between the refrigeration base and the water tank, and R is the resistance of the semiconductor refrigeration sheet.

[0037] Further, based on the target temperature range of the converter valve, the temperature adjustment range of the semiconductor refrigeration plate is determined, including:

[0038] Obtain the current heat release of the converter valve and the standard ambient temperature of the external cooling water system, and determine the hysteresis temperature of the converter valve in combination with the current ambient temperature;

[0039] The temperature adjustment range of the semiconductor cooling plate is determined by combining the target temperature range of the converter valve and the hysteresis temperature of the converter valve.

[0040] Furthermore, the temperature adjustment range of the semiconductor refrigeration chip is [T 目标下限 -ΔT 滞回 ,T 目标上限 +ΔT 滞回 ], ΔT 滞回 =ΔT 基准 +k1(T3-T 基准 )-k2Q 负载 / λ 有效 ; where ΔT 滞回 is the hysteresis temperature of the converter valve, ΔT 基准 is the initial hysteresis range, T 基准 is the standard ambient temperature of the external cooling water system, k1 is the sensitivity coefficient of the temperature adjustment range to the environmental change, k2 is the sensitivity coefficient of the temperature adjustment range to the heat load change, λ 有效 is the equivalent thermal conductivity of the external cooling water system, T 目标上限 and T 目标下限 They are the upper and lower endpoints of the target temperature range of the converter valve respectively.

[0041] Further, based on the current required by the semiconductor refrigeration chip and in combination with the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range, including:

[0042] Perform difference processing on the temperature of the converter valve and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate;

[0043] When the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is greater than zero, the required current is input to the semiconductor refrigeration chip, and when the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is less than zero, the minimum operating current is input to the semiconductor refrigeration chip or the semiconductor refrigeration chip stops working;

[0044] Until the difference between the converter valve temperature and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate is not greater than zero or less than zero, and the normal working current is input to the semiconductor refrigeration plate.

[0045] In a second aspect, the present invention further provides a method for cooling a semiconductor-based converter valve external cooling water system, using the semiconductor-based converter valve external cooling water system cooling device, the cooling method comprises:

[0046] The temperature detection unit detects the temperature of the converter valve, the water tank and the ambient temperature in real time;

[0047] When the converter valve temperature exceeds the target temperature range, the control unit controls the semiconductor refrigeration plate to adjust the converter valve temperature according to the converter valve temperature, water tank temperature and ambient temperature until the detected converter valve temperature reaches the target temperature range.

[0048] Furthermore, the power required by the semiconductor refrigeration plate is determined according to the detected converter valve temperature, water tank temperature and ambient temperature, including:

[0049] Determine the additional cooling capacity required for the converter valve according to the detected converter valve temperature and the converter valve target temperature and in combination with the physical parameters of the cooling medium in the external cooling water system;

[0050] According to the physical parameters of the refrigeration base, combined with the detected temperature of the converter valve, the water tank temperature and the ambient temperature, the heat load conducted between the environment and the refrigeration base is determined;

[0051] Determine the temperature difference efficiency of the semiconductor refrigeration chip, and combine the additional cooling required by the converter valve and the heat load conducted between the environment and the refrigeration base to obtain the power required by the semiconductor refrigeration chip.

[0052] Further, based on the target temperature range of the converter valve, the temperature adjustment range of the semiconductor refrigeration plate is determined, including:

[0053] Obtain the current heat release of the converter valve and the standard ambient temperature of the external cooling water system, and determine the hysteresis temperature of the converter valve in combination with the current ambient temperature;

[0054] The temperature adjustment range of the semiconductor cooling plate is determined by combining the target temperature range of the converter valve and the hysteresis temperature of the converter valve.

[0055] Further, based on the current required by the semiconductor refrigeration chip and in combination with the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range, including:

[0056] Perform difference processing on the temperature of the converter valve and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate;

[0057] When the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is greater than zero, the required current is input to the semiconductor refrigeration chip, and when the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is less than zero, the minimum operating current is input to the semiconductor refrigeration chip or the semiconductor refrigeration chip stops working;

[0058] Until the difference between the converter valve temperature and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate is not greater than zero or less than zero, and the normal working current is input to the semiconductor refrigeration plate.

[0059] The present invention provides a semiconductor-based cooling device and method for a converter valve external cooling water system, which has at least the following beneficial effects:

[0060] (1) The semiconductor refrigeration chip is small in size, light in weight, and has a simple refrigeration principle and structure. It can be quickly deployed in the cold water system outside the converter valve. The semiconductor refrigeration mode is adopted, and the Peltier effect is used to control the current to achieve heat transfer, thereby achieving the purpose of rapid refrigeration.

[0061] (2) The detected temperature data can be used to adjust the current of the semiconductor refrigeration plate, and finally achieve rapid temperature adjustment of the converter valve. BRIEF DESCRIPTION OF THE DRAWINGS

[0062] Figure 1 A schematic diagram of the structure of a semiconductor-based cooling device for a converter valve external cooling water system provided by the present invention;

[0063] Figure 2 A three-dimensional schematic diagram of an assembled cooling device provided by an embodiment of the present invention;

[0064] Figure 3 A top view of a cooling device after assembly provided by a certain embodiment of the present invention;

[0065] Figure 4 A flow chart of controlling a semiconductor refrigeration plate to adjust the temperature of a converter valve provided in an embodiment of the present invention;

[0066] Figure 5 A flow chart for determining the power required by a semiconductor refrigeration plate provided in accordance with an embodiment of the present invention;

[0067] Figure 6A flow chart for determining the temperature adjustment range of a semiconductor refrigeration plate provided in an embodiment of the present invention;

[0068] Figure 7 A flow chart of a method for cooling a semiconductor-based converter valve external cooling water system provided by the present invention.

[0069] Explanation of the reference numerals: 1-semiconductor refrigeration plate, 2-refrigeration base, 3-fixing mechanism, 4-water cooling pipe, 5-handle, 6-cooling fan, 7-water tank, 8-circulating water pump. DETAILED DESCRIPTION

[0070] In order to better understand the above technical solution, the above technical solution will be described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0071] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. The singular forms "a", "said" and "the" used in the embodiments of the present invention and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings, and "multiple" generally includes at least two.

[0072] It should also be noted that the term "includes", "comprising" or any other variation thereof is intended to cover non-exclusive inclusion, so that a commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the commodity or device including the elements.

[0073] like Figures 1 to 3 As shown, in the first aspect, the present invention provides a cooling device for a semiconductor-based converter valve external cooling water system, the external cooling water system includes a water tank 7 for heat exchange with the converter valve, a circulating water pump 8 for driving a cooling medium to circulate and exchange heat is arranged in the water tank 7, the cooling device includes a plurality of cooling components, the cooling components include a semiconductor refrigeration sheet 1, a refrigeration base 2, a fixing mechanism 3, a temperature detection unit and a control unit;

[0074] One side of the refrigeration base 2 is used for heat exchange with the water tank 7 of the external cooling water system, and the other side is fixed with the semiconductor refrigeration sheet 1. The adjacent refrigeration bases 2 are detachably fixed by the fixing mechanism 3.

[0075] The temperature detection unit detects the temperature of the converter valve, the temperature of the water tank 7 and the ambient temperature; the temperature detection unit may be a temperature sensor, which may be arranged at the converter valve, in the water tank 7 and in the surrounding environment to achieve detection;

[0076] The control unit controls the semiconductor refrigeration plate 1 to adjust the temperature of the converter valve according to the detected converter valve temperature, the water tank 7 temperature and the ambient temperature.

[0077] The cooling device of the present invention is used to assist the external cooling water system of the converter valve in cooling the converter valve, which solves the problem that the cooling performance is reduced due to the aging of the external cooling water system of the converter valve or the external cooling water system fails, and it is difficult to recover quickly in a short time. When the cooling device is fixed to the external cooling water system, multiple cooling components can be connected in a ring and fixed. In the actual application scenario, multiple cooling components are connected in a ring and fixed outside the water tank 7, and adjacent cooling components are detachably fixed by a fixing mechanism 3; the fixing mechanism 3 includes a fixed plug and a fixed groove respectively located on adjacent refrigeration bases 2, and the fixed plug and the fixed groove match in shape, and are fixed by a fixing member that passes through the fixed plug and the fixed groove at the same time.

[0078] The external cold water system of the converter valve may also include a water cooling pipe 4 connected to the water tank 7, and the water tank 7 exchanges heat with the converter valve through the water cooling pipe 4; the refrigeration base 2 is provided with a plurality of grooves and / or through holes, and accommodates the water cooling pipe 4 after heat exchange with the converter valve. The side of the refrigeration base 2 that fits the water tank 7 is an arc-shaped surface, which can increase the total contact area between the refrigeration base 2 and the water tank 7, and the heat exchange effect (i.e., refrigeration effect) of the semiconductor refrigeration plate 1 on the cooling medium can be further improved by the grooves and / or through holes provided. At least one semiconductor refrigeration plate 1 can be provided on a single refrigeration base 2, and multiple semiconductor refrigeration plates 1 and multiple refrigeration bases 2 of the same specifications can be used, so as to quickly realize the calculation and adjustment of the current of the semiconductor refrigeration plate 1. In addition, when the cooling device is fixed at different positions of the external cold water system, the appropriate shape of the refrigeration base 2 can be selected according to the fixed position shape to achieve better fitting and fixing. For example, when fixed on the water tank 7, one side of the refrigeration base 2 is an arc-shaped surface, which can better match the outer side of the water tank 7.

[0079] A heat dissipation fan 6 is fixed on the side of the semiconductor cooling plate 1 away from the cooling base 2. A heat dissipation fin is provided on the side of the semiconductor cooling plate 1 away from the cooling base 2, and the heat dissipation fan 6 is fixed on the heat dissipation fin. Through the cooperation of the heat dissipation fin and the heat dissipation fan 6, the heat dissipation of the hot end of the semiconductor cooling plate 1 can be achieved. A handle 5 is also provided on the cooling base 2 to facilitate the transfer and installation of the cooling component.

[0080] like Figure 4As shown, when the cooling device of the present invention assists the external cooling water system in cooling the converter valve, it can control the semiconductor refrigeration sheet to adjust the temperature of the converter valve according to the detected converter valve temperature, water tank temperature and ambient temperature, and specifically includes:

[0081] Determine the power required by the semiconductor refrigeration chip according to the detected converter valve temperature, water tank temperature and ambient temperature;

[0082] Based on the power required by the semiconductor refrigerator, determine the current required by the semiconductor refrigerator;

[0083] Based on the target temperature range of the converter valve, determine the temperature adjustment range of the semiconductor cooling chip;

[0084] Based on the current required by the semiconductor refrigeration chip and combined with the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range.

[0085] Among them, Figure 5 As shown, according to the detected converter valve temperature, water tank temperature and ambient temperature, the power required by the semiconductor refrigeration plate is determined, which may include:

[0086] According to the detected converter valve temperature and converter valve target temperature, combined with the physical parameters of the cooling medium in the external cooling water system, the additional cooling capacity required by the converter valve is determined to meet the following relationship:

[0087] Q 额外 =cρVS0(T1-T0)

[0088] In the formula, Q 额外 is the additional cooling capacity required by the converter valve, c is the specific heat capacity of the cooling medium in the external cooling water system, ρ is the density of the cooling medium, V is the flow rate of the cooling medium, S0 is the effective cooling area of ​​the external cooling water system, T1 is the detected converter valve temperature, T0 is the converter valve target temperature, the converter valve target temperature is within the target temperature range of the converter valve, and can be the center point value of the target temperature range or the end point value of the target temperature range, which can be determined according to actual conditions;

[0089] According to the physical parameters of the refrigeration base, combined with the detected temperature of the converter valve, the water tank temperature and the ambient temperature, the heat load conducted between the environment and the refrigeration base is determined to meet the following relationship:

[0090]

[0091] In the formula, Q 环境is the heat load conducted between the environment and the refrigeration base, S1 is the total contact area between the semiconductor refrigeration sheet and the refrigeration base, S2 is the total contact area between the refrigeration base and the water tank, T2 is the water tank temperature, λ is the thermal conductivity of the refrigeration base, H is the thickness of the refrigeration base, which refers to the thickness of the refrigeration base between the water tank and the semiconductor refrigeration sheet, which can be the average thickness, and T3 is the ambient temperature, which is the temperature of the environment where the semiconductor refrigeration sheet is located;

[0092] Determine the temperature difference efficiency of the semiconductor refrigeration chip, and combine the additional cooling required by the converter valve and the heat load conducted between the environment and the refrigeration base to obtain the power required by the semiconductor refrigeration chip.

[0093] The temperature difference efficiency of semiconductor refrigeration chips can be determined by:

[0094] Based on the total contact area between the semiconductor cooling sheet and the cooling base and the total contact area between the cooling base and the water tank, the detected converter valve temperature and water tank temperature are weightedly calculated to obtain the cooling base temperature, which satisfies the following relationship:

[0095]

[0096] Where, T 底座 is the temperature of the cooling base, T1 is the detected temperature of the converter valve, T2 is the water tank temperature, S1 is the total contact area between the semiconductor cooling sheet and the cooling base, and S2 is the total contact area between the cooling base and the water tank;

[0097] According to the water tank temperature and the difference between the refrigeration base temperature and the water tank temperature, the temperature difference efficiency of the semiconductor refrigeration sheet is determined to meet the following relationship:

[0098]

[0099] Where COP is the temperature difference efficiency of the semiconductor refrigeration sheet.

[0100] The power required by the semiconductor refrigeration chip satisfies the following relationship:

[0101]

[0102] Where P 制冷 is the power required by the semiconductor refrigeration sheet, c is the specific heat capacity of the cooling medium in the external cooling water system, ρ is the density of the cooling medium, V is the flow rate of the cooling medium, T1 is the detected temperature of the converter valve, T0 is the target temperature of the converter valve, the target temperature is within the target temperature range of the converter valve, λ is the thermal conductivity of the refrigeration base, H is the thickness of the refrigeration base, T2 is the water tank temperature, T3 is the ambient temperature, S1 is the total contact area between the semiconductor refrigeration sheet and the refrigeration base, and S2 is the total contact area between the refrigeration base and the water tank.

[0103] After determining the power required by the semiconductor refrigeration chip, the current required by the semiconductor refrigeration chip can be determined based on the power required by the semiconductor refrigeration chip, specifically including:

[0104] Based on the Peltier effect, determine the expression between the current required by the semiconductor refrigerator and the power required by the semiconductor refrigerator;

[0105] The expression between the current required by the semiconductor refrigerator and the power required by the semiconductor refrigerator is analyzed, and the current required by the semiconductor refrigerator is given in combination with the power required by the semiconductor refrigerator and the resistance of the semiconductor refrigerator, satisfying the following relationship:

[0106]

[0107] In the formula, I is the current required by the semiconductor refrigeration film, and R is the resistance of the semiconductor refrigeration film.

[0108] Among them, the expression between the current required by the semiconductor refrigeration piece and the power required by the semiconductor refrigeration piece satisfies the following relationship:

[0109]

[0110] Where α is the Seebeck coefficient.

[0111] In the analysis of the expression between the current required by the semiconductor refrigerator and the power required by the semiconductor refrigerator, αI ((T1S1+T2S2) / (S1+S2)-T2) is the Peltier effect-related power caused by the semiconductor refrigerator current I. In the actual adjustment strategy, in order to simplify the calculation process of the current I, the influence of the αI term on the total power can be ignored. The reason is that the design of the semiconductor refrigerator is the result of optimization, and αI ((T1S1+T2S2) / (S1+S2)-T2) is relatively small relative to the power required by the semiconductor refrigerator and can be ignored. In the real-time adjustment process, the current is calculated directly based on the power required by the semiconductor refrigerator to meet the demand. Although the αI term is ignored, the calculation and control efficiency of the semiconductor refrigerator current I is significantly improved. Of course, if it is necessary to consider the αI term, the expression between the current required by the semiconductor refrigerator and the power required by the semiconductor refrigerator can also be solved by an iterative method to obtain the semiconductor refrigerator current I.

[0112] like Figure 6 As shown, based on the target temperature range of the converter valve, the temperature adjustment range of the semiconductor refrigeration chip is determined, including:

[0113] Obtain the current heat release of the converter valve and the standard ambient temperature of the external cooling water system, and determine the hysteresis temperature of the converter valve in combination with the current ambient temperature; wherein the standard ambient temperature is the ambient temperature specified by the external cooling water system or under the standard working state;

[0114] The temperature adjustment range of the semiconductor cooling plate is determined by combining the target temperature range of the converter valve and the hysteresis temperature of the converter valve.

[0115] The current heat release of the converter valve can be calculated based on the difference between the input power and the output power of the converter valve, or it can be determined by detecting the temperature of the converter valve before and after cooling by the cooling medium, and combining the specific heat capacity, density, flow rate and cross-sectional area of ​​the cooling pipe of the cooling medium, specifically: Q 负载 =cρVA(T 出 -T 入 ), Q 负载 is the current heat release of the converter valve, A is the cross-sectional area of ​​the water cooling pipe, T 出 is the temperature of the converter valve after the cooling medium cools it, T 入 It is the temperature before the cooling medium cools the converter valve.

[0116] The hysteresis temperature of the converter valve can satisfy the following relationship:

[0117] ΔT 滞回 =ΔT 基准 +k1(T3-T 基准 )-k2Q 负载 / λ 有效

[0118] In the formula, ΔT 滞回 is the hysteresis temperature of the converter valve, ΔT 基准 is the initial hysteresis range, which can be obtained by presetting or empirical value, T 基准 is the standard ambient temperature of the external cooling water system, k1 is the sensitivity coefficient of the temperature adjustment range to the environmental change, k2 is the sensitivity coefficient of the temperature adjustment range to the heat load change, both k1 and k2 can be obtained through experiments, and k2 can also be obtained through heat balance calculation, λ 有效 is the equivalent thermal conductivity of the external cooling water system, λ 有效 =λS0 / L, L is the length of the heat transfer path.

[0119] After determining the hysteresis temperature of the converter valve, the temperature adjustment range of the semiconductor cooling plate can be determined as [T 目标下限 -ΔT 滞回 ,T 目标上限 +ΔT 滞回 ], T 目标上限 and T 目标下限 They are the upper and lower endpoints of the target temperature range of the converter valve respectively.

[0120] Based on the current required by the semiconductor refrigeration chip and the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range, including:

[0121] Perform difference processing on the temperature of the converter valve and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate;

[0122] When the difference between the upper and lower endpoints of the temperature adjustment range of the converter valve temperature and the semiconductor refrigeration chip is greater than zero, the required current is input to the semiconductor refrigeration chip, and when the difference between the upper and lower endpoints of the temperature adjustment range of the converter valve temperature and the semiconductor refrigeration chip is less than zero, the minimum operating current is input to the semiconductor refrigeration chip or the semiconductor refrigeration chip stops working; wherein the minimum operating current is the current when the semiconductor refrigeration chip maintains the minimum power, specifically: I 低运行 =(P min / R) 0.5 , P min is the minimum power of the semiconductor refrigeration chip, I 低运行 The current required to maintain the minimum power for the semiconductor refrigeration chip;

[0123] Until the difference between the converter valve temperature and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate is no more than zero or less than zero, and the normal working current is input to the semiconductor refrigeration plate; wherein, the normal working current is the current of the semiconductor refrigeration plate to maintain the converter valve temperature in a normal state, which is a certain value when the converter valve and the external cooling water system are determined.

[0124] The present invention can at least achieve the following technical effects:

[0125] 1. Rapid cooling, using semiconductor cooling mode, using the Peltier effect, the semiconductor cooling plate uses this effect to control the size and direction of the current to achieve heat transfer, thereby achieving the purpose of rapid cooling, making the surface of the cooling plate instantly reach minus 15 degrees Celsius.

[0126] 2. Rapid deployment, using the small size and light weight of semiconductor refrigeration chips. The refrigeration principle is simple, and a fast cooling device for the cold water system outside the converter valve is designed, which is light in weight, simple in structure, and can be quickly deployed.

[0127] 3. Diversity of cooling methods. For open equipment, such as the cold water system outside the converter valve, it can directly act on the cooling liquid and circulate the cooling liquid to achieve a cooling effect; for closed equipment, such as the cold water inside the converter valve, the converter oil circulation, the phase-shifting cooling circuit, etc., it can be deployed in the cooling pipeline, and the cooling water circulation pipeline can be transferred to the cooling liquid in the pipeline.

[0128] 4. When the cooling performance of the converter valve cooling water system is reduced due to aging or the external cooling water system fails and it is difficult to recover quickly in a short time, the device can be used to quickly deploy and cool the converter valve cooling system to ensure the stability of DC power transmission.

[0129] like Figure 7 As shown, the present invention also provides a method for cooling a semiconductor-based converter valve external cooling water system, using the semiconductor-based converter valve external cooling water system cooling device, the cooling method includes:

[0130] The temperature detection unit detects the temperature of the converter valve, the water tank and the ambient temperature in real time;

[0131] When the converter valve temperature exceeds the target temperature range, the control unit controls the semiconductor refrigeration plate to adjust the converter valve temperature according to the converter valve temperature, water tank temperature and ambient temperature until the detected converter valve temperature reaches the target temperature range.

[0132] Furthermore, the power required by the semiconductor refrigeration plate is determined according to the detected converter valve temperature, water tank temperature and ambient temperature, including:

[0133] Determine the additional cooling capacity required for the converter valve according to the detected converter valve temperature and the converter valve target temperature and in combination with the physical parameters of the cooling medium in the external cooling water system;

[0134] According to the physical parameters of the refrigeration base, combined with the detected temperature of the converter valve, the water tank temperature and the ambient temperature, the heat load conducted between the environment and the refrigeration base is determined;

[0135] Determine the temperature difference efficiency of the semiconductor refrigeration chip, and combine the additional cooling required by the converter valve and the heat load conducted between the environment and the refrigeration base to obtain the power required by the semiconductor refrigeration chip.

[0136] Further, based on the target temperature range of the converter valve, the temperature adjustment range of the semiconductor refrigeration plate is determined, including:

[0137] Obtain the current heat release of the converter valve and the standard ambient temperature of the external cooling water system, and determine the hysteresis temperature of the converter valve in combination with the current ambient temperature;

[0138] The temperature adjustment range of the semiconductor cooling plate is determined by combining the target temperature range of the converter valve and the hysteresis temperature of the converter valve.

[0139] Further, based on the current required by the semiconductor refrigeration chip and in combination with the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range, including:

[0140] Perform difference processing on the temperature of the converter valve and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate;

[0141] When the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is greater than zero, the required current is input to the semiconductor refrigeration chip, and when the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is less than zero, the minimum operating current is input to the semiconductor refrigeration chip or the semiconductor refrigeration chip stops working;

[0142] Until the difference between the converter valve temperature and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate is not greater than zero or less than zero, and the normal working current is input to the semiconductor refrigeration plate.

[0143] Although preferred embodiments of the present invention have been described, additional changes and modifications may be made to these embodiments by those skilled in the art once the basic inventive concepts are known. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention. Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A semiconductor-based cooling device for a cooling water system outside a converter valve, characterized in that: The external cooling water system includes a water tank for exchanging heat with the converter valve, the cooling device includes a plurality of cooling components, and the cooling components include a semiconductor cooling sheet, a cooling base, a fixing mechanism, a temperature detection unit and a control unit; One side of the refrigeration base is used for heat exchange with the water tank of the external cooling water system, and the other side is fixed with the semiconductor refrigeration sheet. The adjacent refrigeration bases are detachably fixed by a fixing mechanism. The temperature detection unit detects the temperature of the converter valve, the water tank and the ambient temperature; The control unit controls the semiconductor refrigeration plate to adjust the temperature of the converter valve according to the detected converter valve temperature, water tank temperature and ambient temperature.

2. The cooling device according to claim 1, characterized in that: A plurality of cooling components are annularly connected and fixed outside the water tank, and adjacent cooling components are detachably fixed by a fixing mechanism; The fixing mechanism comprises a fixing plug and a fixing groove respectively located on adjacent refrigeration bases. The fixing plug and the fixing groove match in shape and are fixed by a fixing piece passing through both the fixing plug and the fixing groove.

3. The cooling device according to claim 1, characterized in that: The external cooling water system also includes a water cooling pipe connected to the water tank, and the water tank exchanges heat with the converter valve through the water cooling pipe; The refrigeration base is provided with a plurality of grooves and / or through holes, and accommodates the water cooling pipe after heat exchange through the converter valve.

4. The cooling device according to claim 1, characterized in that: A heat dissipation fan is fixed on a side of the semiconductor refrigeration plate away from the refrigeration base.

5. The cooling device according to claim 4, characterized in that: A heat dissipation fin is arranged on a side of the semiconductor refrigeration plate away from the refrigeration base, and a heat dissipation fan is fixed on the heat dissipation fin.

6. The cooling device according to claim 1, characterized in that: According to the detected converter valve temperature, water tank temperature and ambient temperature, the semiconductor refrigeration chip is controlled to adjust the temperature of the converter valve, including: Determine the power required by the semiconductor refrigeration chip according to the detected converter valve temperature, water tank temperature and ambient temperature; Based on the power required by the semiconductor refrigerator, determine the current required by the semiconductor refrigerator; Based on the target temperature range of the converter valve, determine the temperature adjustment range of the semiconductor cooling chip; Based on the current required by the semiconductor refrigeration chip and combined with the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range.

7. The cooling device according to claim 6, characterized in that: According to the detected converter valve temperature, water tank temperature and ambient temperature, determine the power required by the semiconductor refrigeration chip, including: Determine the additional cooling capacity required for the converter valve according to the detected converter valve temperature and the converter valve target temperature and in combination with the physical parameters of the cooling medium in the external cooling water system; According to the physical parameters of the refrigeration base, combined with the detected temperature of the converter valve, the water tank temperature and the ambient temperature, the heat load conducted between the environment and the refrigeration base is determined; Determine the temperature difference efficiency of the semiconductor refrigeration chip, and combine the additional cooling required by the converter valve and the heat load conducted between the environment and the refrigeration base to obtain the power required by the semiconductor refrigeration chip, satisfying the following relationship: Where P 制冷 is the power required by the semiconductor refrigeration sheet, c is the specific heat capacity of the cooling medium in the external cooling water system, ρ is the density of the cooling medium, V is the flow rate of the cooling medium, S0 is the effective cooling area of ​​the external cooling water system, T1 is the detected converter valve temperature, T0 is the converter valve target temperature, the target temperature is within the converter valve target temperature range, λ is the thermal conductivity of the refrigeration base, H is the thickness of the refrigeration base, T2 is the water tank temperature, T3 is the ambient temperature, S1 is the total contact area between the semiconductor refrigeration sheet and the refrigeration base, and S2 is the total contact area between the refrigeration base and the water tank.

8. The cooling device according to claim 6, characterized in that: Based on the target temperature range of the converter valve, determine the temperature adjustment range of the semiconductor refrigeration chip, including: Obtain the current heat release of the converter valve and the standard ambient temperature of the external cooling water system, and determine the hysteresis temperature of the converter valve in combination with the current ambient temperature; The temperature adjustment range of the semiconductor cooling plate is determined by combining the target temperature range of the converter valve and the hysteresis temperature of the converter valve.

9. The cooling device according to claim 8, characterized in that: Based on the current required by the semiconductor refrigeration chip and the temperature adjustment range of the semiconductor refrigeration chip, the temperature of the converter valve is adjusted to reach the target temperature range, including: Perform difference processing on the temperature of the converter valve and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate; When the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is greater than zero, the required current is input to the semiconductor refrigeration chip, and when the difference between the upper and lower endpoints of the temperature adjustment interval of the converter valve temperature and the semiconductor refrigeration chip is less than zero, the minimum operating current is input to the semiconductor refrigeration chip or the semiconductor refrigeration chip stops working; Until the difference between the converter valve temperature and the upper and lower end points of the temperature adjustment range of the semiconductor refrigeration plate is not greater than zero or less than zero, and the normal working current is input to the semiconductor refrigeration plate.

10. A method for cooling a cooling water system outside a converter valve based on semiconductors, characterized in that: Using the semiconductor-based cooling device for the converter valve external cooling water system as claimed in any one of claims 1 to 9, the cooling method includes: The temperature detection unit detects the temperature of the converter valve, the water tank and the ambient temperature in real time; When the converter valve temperature exceeds the target temperature range, the control unit controls the semiconductor refrigeration plate to adjust the converter valve temperature according to the converter valve temperature, water tank temperature and ambient temperature until the detected converter valve temperature reaches the target temperature range.

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