Method, system and equipment for controlling dimensional stability after lamination and medium

Abstract

The embodiment of the invention provides a post-lamination dimensional stability control method, system and device and a medium, and the method comprises the steps: respectively constructing a training sample set and an initial model set for different model set factors, and for each initial model set, constructing a training sample set and an initial model set; performing multi-round iterative training on the initial model group by using the corresponding training sample set to obtain a corresponding target model group; the method comprises the following steps: acquiring a model group factor of a product, determining a target model group corresponding to the product according to the model group factor, inputting to-be-processed expansion and contraction change data corresponding to the product into the target model group corresponding to the product, and performing derivative calculation on the to-be-processed expansion and contraction change data through the target model group, and obtaining a predicted expansion and shrinkage range after the PCB is laminated, and adjusting and controlling the expansion and shrinkage coefficient of the product according to the predicted expansion and shrinkage range after the PCB is laminated. The purposes of automatically adjusting and controlling the expansion coefficient and improving the efficiency of adjusting the expansion coefficient are achieved.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit board manufacturing, and in particular to a method, system, device and medium for controlling dimensional stability after lamination. Background Art

[0002] During the processing of printed circuit boards, multiple factors jointly affect the size shrinkage of products. These factors mainly include differences in product structure, such as the type of materials used, the combination of prepregs, the residual copper rate, and the thickness of the board. In addition, differences in process flows, especially the thermal effects caused by the heating process and the stress changes caused by the mechanical pulling process, further aggravate the complexity and unpredictability of PCB size expansion and contraction.

[0003] As printed circuit board technology continues to evolve towards miniaturization and high-density lamination, the requirements for dimensional accuracy and alignment accuracy of PCB products are becoming increasingly stringent. Therefore, achieving accurate prediction and control of PCB size expansion and contraction is the key to meeting this high-demand challenge. However, in the prior art, in order to achieve accurate prediction and control of printed circuit board size expansion and contraction, the compensation coefficient is usually obtained by failure analysis and repeated tests, but this process is often time-consuming, resource-intensive, and requires professional technicians to operate, resulting in low efficiency and high labor and material costs. Summary of the invention

[0004] The main purpose of the embodiments of the present application is to propose a method, system, device and medium for controlling dimensional stability after lamination, aiming to automatically adjust and control the expansion and shrinkage coefficient and improve the efficiency of adjusting the expansion and shrinkage coefficient.

[0005] To achieve the above-mentioned purpose, a first aspect of an embodiment of the present application provides a method for controlling dimensional stability after lamination, the method comprising:

[0006] A training sample set and an initial model group are constructed for different model group factors, respectively. The training sample set includes the expansion and shrinkage change data corresponding to the model group factors and the actual expansion and shrinkage range corresponding to the expansion and shrinkage change data. The expansion and shrinkage size change range of the PCB after lamination processed by different initial model groups is different.

[0007] For each of the initial model groups, performing multiple rounds of iterative training on the initial model group using the corresponding training sample set to obtain a corresponding target model group;

[0008] Obtaining a model group factor of a product, and determining a target model group corresponding to the product according to the model group factor;

[0009] Inputting the expansion and shrinkage change data to be processed corresponding to the product into the target model group corresponding to the product, so as to derive the expansion and shrinkage change data to be processed through the target model group to obtain the predicted expansion and shrinkage range of the PCB after lamination;

[0010] The expansion and contraction coefficient of the product is adjusted and controlled according to the predicted expansion and contraction range of the PCB after lamination.

[0011] Through the method provided in the first aspect, it is possible to automatically adjust and control the expansion and shrinkage coefficient, thereby improving the efficiency of adjusting the expansion and shrinkage coefficient and avoiding the problem of relying on failure analysis and repeated tests in the prior art to obtain the compensation coefficient, which results in a long time consumption, high resource consumption, low efficiency, and high labor and material costs.

[0012] In a possible implementation manner, the expansion and contraction change data corresponding to the model group factors and the expansion and contraction change data to be processed are measured by an X-ray measurement device.

[0013] In one possible implementation, the model group factors include the stacking composition of the PCB and the process flow factors of the PCB.

[0014] In a possible implementation, the using the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group includes:

[0015] Inputting the expansion and contraction change data corresponding to the model group factors into the initial model group corresponding to the model group factors to obtain a predicted expansion and contraction range;

[0016] Based on the predicted expansion and contraction range and the actual expansion and contraction range, the loss of the initial model group is determined, and model parameters of the initial model group are adjusted based on the loss.

[0017] In a possible implementation, adjusting and controlling the expansion and contraction coefficient of the product according to the predicted expansion and contraction range after PCB lamination includes the following steps:

[0018] Determine whether the predicted expansion and shrinkage range of the PCB after lamination exceeds the expansion and shrinkage range of product requirements. If not, output the expansion and shrinkage coefficient of the PCB normally. If exceeded, calculate the corrected expansion and shrinkage coefficient based on the expansion and shrinkage range of product requirements, compensate the corrected expansion and shrinkage coefficient to the drill belt, and output the corrected drill belt expansion and shrinkage coefficient based on the expansion and shrinkage coefficient value allowed to be corrected.

[0019] In a possible implementation, the outputting of the modified drill belt expansion coefficient based on the expansion coefficient value allowed to be modified includes:

[0020] The expansion and shrinkage coefficient allowed to be modified is limited, and it is judged whether the modified expansion and shrinkage coefficient of the drill belt is within the range of the expansion and shrinkage coefficient allowed to be modified. If it exceeds, an error is automatically reported; if it does not exceed, the modified expansion and shrinkage coefficient of the drill belt is output.

[0021] To achieve the above object, a second aspect of an embodiment of the present application provides a system for controlling dimensional stability after lamination, the system comprising:

[0022] X-ray measurement module: used to measure the expansion and contraction change data corresponding to the model group factors and the expansion and contraction change data to be processed;

[0023] Construction module: used to construct training sample sets and initial model groups for different model group factors, respectively. The training sample sets include the expansion and shrinkage change data corresponding to the model group factors and the actual expansion and shrinkage range corresponding to the expansion and shrinkage change data. The expansion and shrinkage size change range of the PCB after lamination processed by different initial model groups is different.

[0024] Model training module: for each of the initial model groups, using the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group;

[0025] Model group factor acquisition module: obtains the model group factor of the product, and determines the target model group corresponding to the product according to the model group factor;

[0026] The expansion and shrinkage change data processing module is used to input the expansion and shrinkage change data to be processed corresponding to the product into the target model group corresponding to the product, so as to derive the expansion and shrinkage change data to be processed through the target model group to obtain the predicted expansion and shrinkage range of the PCB after lamination;

[0027] Expansion and shrinkage coefficient adjustment module: used to determine whether the predicted expansion and shrinkage range of the PCB after lamination exceeds the expansion and shrinkage range of product requirements. If not, the drill belt expansion and shrinkage coefficient of the PCB is output normally; if exceeded, the corrected expansion and shrinkage coefficient is calculated based on the expansion and shrinkage range of product requirements, the corrected expansion and shrinkage coefficient is compensated to the drill belt, and the corrected drill belt expansion and shrinkage coefficient is output based on the expansion and shrinkage coefficient value allowed to be corrected.

[0028] Through the system of the second aspect, the expansion and shrinkage coefficient can be automatically adjusted and controlled, the purpose of improving the efficiency of adjusting the expansion and shrinkage coefficient can be achieved, the labor cost and the scrap cost caused by excessive expansion and shrinkage can be reduced, the quality and ability of the product process can be improved, and the yield rate of the product can be effectively improved. The problem of relying on failure analysis and repeated test methods to obtain the compensation coefficient in the prior art is avoided, which leads to long time consumption, large resource consumption, low efficiency, and high labor and material costs.

[0029] In a possible implementation, the outputting of the modified drill belt expansion coefficient based on the expansion coefficient value allowed to be modified includes:

[0030] The expansion and shrinkage coefficient allowed to be modified is limited, and it is judged whether the modified expansion and shrinkage coefficient of the drill belt is within the range of the expansion and shrinkage coefficient allowed to be modified. If it exceeds, an error is automatically reported; if it does not exceed, the modified expansion and shrinkage coefficient of the drill belt is output.

[0031] In a third aspect, an electronic device is provided, comprising: a memory and a processor, wherein the memory stores a computer program, and when the processor executes the computer program, it implements the method for controlling dimensional stability after lamination as described in any possible implementation of the first aspect and the second aspect.

[0032] In a fourth aspect, a computer-readable storage medium is provided, on which a computer program is stored, and when the computer program is executed by a processor, the method for controlling dimensional stability after lamination as described in any possible implementation of the first aspect and the second aspect is implemented.

[0033] It can be seen from the technical solutions provided by one or more embodiments of the present specification that the method for controlling dimensional stability after lamination provided by the embodiment of the present application constructs training sample sets and initial model groups for different model group factors respectively, and for each initial model group, performs multiple rounds of iterative training on the initial model group using the corresponding training sample set to obtain the corresponding target model group; obtains the model group factor of the product, and determines the target model group corresponding to the product according to the model group factor, inputs the expansion and shrinkage change data to be processed corresponding to the product into the target model group corresponding to the product, and derives the expansion and shrinkage change data to be processed through the target model group to obtain the predicted expansion and shrinkage range after PCB lamination, and adjusts and controls the expansion and shrinkage coefficient of the product according to the predicted expansion and shrinkage range after PCB lamination. The purpose of automatically adjusting and controlling the expansion and shrinkage coefficient and improving the efficiency of adjusting the expansion and shrinkage coefficient is achieved, and the problem of relying on failure analysis and repeated test methods to obtain compensation coefficients in the prior art, which leads to long time consumption, large resource consumption, low efficiency, and high labor and material costs, is avoided. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate one or more embodiments of this specification or the technical solutions in the prior art, the drawings required for use in the description of one or more embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0035] Figure 1A schematic flow chart of a method for controlling dimensional stability after lamination provided in an embodiment of the present application;

[0036] Figure 2 A logical diagram for calculating and adjusting the input product information for the target model group;

[0037] Figure 3 Schematic diagram of establishing the initial model group for big data-based derivatives and model group factors;

[0038] Figure 4 A logical schematic diagram for adjusting and controlling the expansion and contraction coefficient of a product according to the predicted expansion and contraction range after PCB lamination;

[0039] Figure 5 This is a structural block diagram of an electronic device according to an embodiment of the present application. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions in this specification, the technical solutions in one or more embodiments of this specification will be clearly and completely described below in conjunction with the drawings in one or more embodiments of this specification. Obviously, the one or more embodiments described are only part of the embodiments of this specification, not all of the embodiments. Based on one or more embodiments in this specification, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of this document.

[0041] It should be noted that, although the functional modules are divided in the device schematic diagram and the logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than the module division in the device or the order in the flowchart. The terms "first", "second", etc. in the specification, claims and the above drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence.

[0042] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein are only for the purpose of describing the embodiments of this application and are not intended to limit this application.

[0043] It should be noted that in each specific implementation of the present application, when it comes to the need to perform relevant processing based on data related to user identity or characteristics such as user information, user behavior data, user historical data, and user location information, the user's permission or consent will be obtained first, and the collection, use, and processing of these data will comply with the relevant laws, regulations, and standards of the relevant countries and regions. In addition, when the embodiment of the present application needs to obtain the user's sensitive personal information, the user's separate permission or consent will be obtained through a pop-up window or by jumping to a confirmation page. After clearly obtaining the user's separate permission or consent, the necessary user-related data for the normal operation of the embodiment of the present application will be obtained.

[0044] In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other. The embodiments of the present invention are further described below in conjunction with the accompanying drawings.

[0045] Figure 1 is an optional flow chart of the method for controlling dimensional stability after lamination provided in an embodiment of the present application, Figure 1 The method may include but is not limited to steps S100 to S500.

[0046] First, as Figure 1 As shown, a method for controlling dimensional stability after lamination is provided, the method comprising:

[0047] S100, constructing training sample sets and initial model groups for different model group factors respectively, wherein the training sample sets include expansion and shrinkage change data corresponding to the model group factors and actual expansion and shrinkage ranges corresponding to the expansion and shrinkage change data. Different initial model groups process different expansion and shrinkage size change ranges after PCB lamination.

[0048] It should be noted that by constructing a diverse set of training samples, the model can better adapt to different data distributions and scenarios, learn more features and patterns, thereby reducing the risk of fitting, enhancing the generalization ability of the model, and improving the accuracy of expansion and shrinkage range prediction and classification. The expansion and shrinkage size change range of different PCBs after lamination varies due to factors such as their material properties, manufacturing process, design structure, and temperature changes. Therefore, different initial model groups are set to process PCBs with different expansion and shrinkage size change ranges after lamination, that is, the product stacking composition and processing flow within the same initial model group are similar.

[0049] S200: For each initial model group, use the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group.

[0050] It should be noted that each round of iterative training gives the model an opportunity to further learn the features and patterns in the training data set. As the number of iterations increases, the model gradually adjusts its internal parameters to better fit the training data. However, in practical applications, too many iterations may cause the model to overfit, so that it cannot generalize well to new data. Therefore, it is necessary to select the number of iterations according to actual needs and use methods such as validation sets or cross-validation to monitor the performance of the model to ensure that the model has good generalization ability.

[0051] S300, obtaining the model group factors of the product, and determining the target model group corresponding to the product according to the model group factors.

[0052] S400, inputting the to-be-processed expansion and shrinkage change data corresponding to the product into the target model group corresponding to the product, so as to derive the to-be-processed expansion and shrinkage change data through the target model group to obtain the predicted expansion and shrinkage range of the PCB after lamination.

[0053] S500, adjust and control the expansion and contraction coefficient of the product according to the predicted expansion and contraction range after PCB lamination.

[0054] It should be noted that if Figure 2 As shown, based on the expansion and shrinkage change data corresponding to the model group factors and the actual expansion and shrinkage range corresponding to the expansion and shrinkage change data, the initial model group is trained for multiple rounds of iterations to improve the model capability to obtain the corresponding target model group. The target model group that meets the model capability automatically obtains the model group factors of the product to determine the target model group corresponding to the product. Then the target model group derives the expansion and shrinkage change data to be processed corresponding to the input product to obtain the predicted expansion and shrinkage range after PCB lamination, and judges whether it meets the product specifications. If it meets, the expansion and shrinkage coefficient is output. If it does not meet, the expansion and shrinkage coefficient of the product is adjusted and controlled according to the expansion and shrinkage range and specifications of the product requirements, and the expansion and shrinkage coefficient that meets the product specifications after adjustment is output. If the adjusted expansion and shrinkage coefficient still does not meet the product rules, the model capability is improved, and the above steps are repeated. The whole process is fully automated without any manual intervention, which significantly reduces the time and cost of manual operation, thereby greatly improving production efficiency, avoiding delays and errors caused by human factors, improving product quality, and reducing cost waste caused by errors.

[0055] Through the method provided in the first aspect, it is possible to automatically adjust and control the expansion and shrinkage coefficient, thereby improving the efficiency of adjusting the expansion and shrinkage coefficient and avoiding the problem of relying on failure analysis and repeated tests in the prior art to obtain the compensation coefficient, which results in a long time consumption, high resource consumption, low efficiency, and high labor and material costs.

[0056] In a possible implementation manner, the expansion and contraction change data corresponding to the model group factors and the expansion and contraction change data to be processed are measured by an X-ray measurement device.

[0057] Among them, X-rays can penetrate PCB materials and generate images of their internal structures, thereby achieving high-resolution imaging of expansion and contraction changes. This imaging technology allows manufacturers to clearly observe subtle changes inside the PCB, including interlayer offsets, welding defects, etc. Through X-ray images, the position changes of various key points on the PCB can be accurately measured, and then the changes in expansion and contraction can be calculated. X-ray measurement is a non-destructive testing technology. It does not cause any damage to the PCB or components, so it can be tested multiple times without disassembling the product, preserving the integrity of the PCB, so that these products can continue to be used in subsequent production processes, reducing production costs and waste. In addition, X-ray detection is fast and can complete high-resolution image capture in a short time. This greatly improves the detection efficiency, and the X-ray measurement equipment is highly automated, which further improves the detection efficiency and reduces errors caused by human factors.

[0058] In one possible implementation, the model group factors include the stacking composition of the PCB and the process flow factors of the PCB.

[0059] It should be noted that if Figure 3 As shown, the model group factors affect the dimensional expansion and contraction changes of the product after lamination, wherein the model group factors include the stacking composition of the PCB and the process flow factors of the PCB. The stacking composition of the PCB includes the residual copper rate, core board thickness, PP thickness, copper thickness, material type, stiffness, etc. The process flow factors of the PCB include reflow soldering, resin plugging, POFV, lead-spray tin, lead-free spray tin, plasma, baking plate, etc. In addition, it can be understood that the embodiments of the present application do not limit the types and quantities of the model group factors.

[0060] In a possible implementation, the using the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group includes:

[0061] The expansion and contraction change data corresponding to the model group factors are input into the initial model group corresponding to the model group factors to obtain a predicted expansion and contraction range; based on the predicted expansion and contraction range and the actual expansion and contraction range, the loss of the initial model group is determined, and the model parameters of the initial model group are adjusted based on the loss.

[0062] Among them, it should be noted that based on the predicted expansion and contraction range and the actual expansion and contraction range, determining the loss of the initial model group to adjust the model parameters can make the model better fit the training data and enhance the generalization ability of the model. Adjusting the model parameters in combination with the actual expansion and contraction range will help the model better cope with various complex situations in practical applications. And it should be noted that each round of iterative training gives the model the opportunity to further learn the characteristics and rules in the training data set. As the number of iterations increases, the model gradually adjusts its internal parameters to better fit the training data. However, in practical applications, too many iterations may cause the model to overfit, so that it cannot be generalized well to new data. Therefore, it is necessary to select the number of iterations according to actual needs, and use methods such as validation sets or cross-validation to monitor the performance of the model to ensure that the model has good generalization ability.

[0063] like Figure 4 As shown, in a possible implementation method, adjusting and controlling the expansion and contraction coefficient of the product according to the predicted expansion and contraction range after PCB lamination includes the following steps:

[0064] Determine whether the predicted expansion and shrinkage range of the PCB after lamination exceeds the expansion and shrinkage range of product requirements. If not, output the expansion and shrinkage coefficient of the PCB normally. If exceeded, calculate the corrected expansion and shrinkage coefficient based on the expansion and shrinkage range of product requirements, compensate the corrected expansion and shrinkage coefficient to the drill belt, and output the corrected drill belt expansion and shrinkage coefficient based on the expansion and shrinkage coefficient value allowed to be corrected.

[0065] It should be noted that in order to improve the production efficiency and quality of products, it is necessary to accurately control the expansion and contraction of the sheet material, that is, to adjust and control the expansion and contraction coefficient of the product. The traditional expansion and contraction compensation method based on manual experience has the problems of update lag, lack of pertinence and accuracy, and it is difficult to meet the high-precision requirements of current PCB manufacturing. Therefore, the operation process of adjusting and controlling the expansion and contraction coefficient of the product according to the predicted expansion and contraction range after PCB lamination provided in the embodiment of the present application is fully automated without relying on manual assistance, and it is judged whether the predicted expansion and contraction range after PCB lamination exceeds the expansion and contraction range of the product requirements, thereby judging whether to output the expansion and contraction coefficient of the PCB normally or to correct the expansion and contraction coefficient of the PCB before output, which can better meet the manufacturing needs of PCBs of different batches and specifications.

[0066] like Figure 4 As shown, in one possible implementation method, the output of the corrected drill belt expansion and shrinkage coefficient based on the expansion and shrinkage coefficient value allowed to be corrected includes: limiting the expansion and shrinkage coefficient allowed to be corrected, judging whether the corrected drill belt expansion and shrinkage coefficient is within the range of the expansion and shrinkage coefficient allowed to be corrected, and automatically reporting an error if it exceeds the range; if it does not exceed the range, outputting the corrected drill belt expansion and shrinkage coefficient.

[0067] Among them, it should be noted that due to the limitations of drill tape compensation and the complexity and variability of the PCB process flow, the corrected expansion and shrinkage coefficient cannot be fully compensated in the drill tape. Therefore, it is necessary to limit different allowable expansion and shrinkage coefficients to be corrected according to actual conditions to determine whether the corrected drill tape expansion and shrinkage coefficient is within the set range of the allowable expansion and shrinkage coefficient to be corrected. If it exceeds the range, an error is automatically reported; if it does not exceed the range, the corrected drill tape expansion and shrinkage coefficient is output.

[0068] To achieve the above object, a second aspect of an embodiment of the present application provides a system for controlling dimensional stability after lamination, the system comprising:

[0069] X-ray measurement module: used to measure the expansion and contraction change data corresponding to the model group factors and the expansion and contraction change data to be processed.

[0070] It should be noted that X-rays can penetrate PCB materials and generate images of their internal structures, thereby achieving high-resolution imaging of expansion and contraction changes. This imaging technology allows manufacturers to clearly observe subtle changes inside the PCB, including interlayer offsets, soldering defects, etc. Through X-ray images, the position changes of various key points on the PCB can be accurately measured, and then the changes in expansion and contraction can be calculated. X-ray measurement is a non-destructive testing technology. It does not cause any damage to the PCB or components, so it can be tested multiple times without disassembling the product, preserving the integrity of the PCB, so that these products can continue to be used in subsequent production processes, reducing production costs and waste. In addition, X-ray detection is fast and can complete high-resolution image capture in a short time. This greatly improves the detection efficiency, and the X-ray measurement equipment is highly automated, which further improves the detection efficiency and reduces errors caused by human factors.

[0071] Construction module: used to construct training sample sets and initial model groups for different model group factors respectively. The training sample sets include the expansion and shrinkage change data corresponding to the model group factors and the actual expansion and shrinkage range corresponding to the expansion and shrinkage change data. Different initial model groups process different expansion and shrinkage size change ranges of PCBs after lamination.

[0072] Model training module: used for performing multiple rounds of iterative training on each of the initial model groups using the corresponding training sample set to obtain the corresponding target model group.

[0073] Among them, using the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group includes: based on the expansion and contraction change data corresponding to the model group factor, the initial model group predicts the predicted expansion and contraction range; based on the predicted expansion and contraction range and the actual expansion and contraction range, the model loss is determined, and the model parameters of the initial model group are adjusted based on the model loss. Based on the predicted expansion and contraction range and the actual expansion and contraction range, the model loss is determined to adjust the model parameters, which can make the model better fit the training data and enhance the generalization ability of the model. Combining the actual expansion and contraction range to adjust the model parameters helps the model to better cope with various complex situations in practical applications. It should be noted that each round of iterative training gives the model an opportunity to further learn the features and rules in the training data set. As the number of iterations increases, the model gradually adjusts its internal parameters to better fit the training data. However, in practical applications, too many iterations may cause the model to overfit, so that it cannot be well generalized to new data. Therefore, it is necessary to select the number of iterations according to actual needs, and use methods such as validation sets or cross-validation to monitor the performance of the model to ensure that the model has good generalization ability.

[0074] Model group factor acquisition module: obtains the model group factors of a product, and determines the target model group corresponding to the product according to the model group factors.

[0075] Expansion and shrinkage change data processing module: used to input the expansion and shrinkage change data to be processed corresponding to the product into the target model group corresponding to the product, so as to derive the expansion and shrinkage change data to be processed through the target model group to obtain the predicted expansion and shrinkage range after PCB lamination.

[0076] Expansion and shrinkage coefficient adjustment module: used to determine whether the predicted expansion and shrinkage range of the PCB after lamination exceeds the expansion and shrinkage range of product requirements. If not, the drill belt expansion and shrinkage coefficient of the PCB is output normally; if exceeded, the corrected expansion and shrinkage coefficient is calculated based on the expansion and shrinkage range of product requirements, the corrected expansion and shrinkage coefficient is compensated to the drill belt, and the corrected drill belt expansion and shrinkage coefficient is output based on the expansion and shrinkage coefficient value allowed to be corrected.

[0077] It should be noted that the model group factor acquisition module automatically obtains the model group factor of the product to determine the target model group corresponding to the product, and then the target model group in the expansion and shrinkage change data processing module derives the expansion and shrinkage change data to be processed corresponding to the input product to obtain the predicted expansion and shrinkage range after PCB lamination. The expansion and shrinkage coefficient adjustment module determines whether it will exceed the expansion and shrinkage range of product requirements, and then adjusts and controls the expansion and shrinkage coefficient of the product according to the expansion and shrinkage range of product requirements. The entire system is fully automated without any manual intervention, which significantly reduces the time and cost of manual operation, thereby greatly improving production efficiency, avoiding delays and errors caused by human factors, improving product quality, and reducing cost waste caused by errors.

[0078] Through the system of the second aspect, the expansion and shrinkage coefficient can be automatically adjusted and controlled, the purpose of improving the efficiency of adjusting the expansion and shrinkage coefficient can be achieved, the labor cost and the scrap cost caused by excessive expansion and shrinkage can be reduced, the quality and ability of the product process can be improved, and the yield rate of the product can be effectively improved. The problem of relying on failure analysis and repeated test methods to obtain the compensation coefficient in the prior art is avoided, which leads to long time consumption, large resource consumption, low efficiency, and high labor and material costs.

[0079] In one possible implementation, the output of the corrected drill belt expansion and shrinkage coefficient based on the expansion and shrinkage coefficient value allowed to be corrected includes: limiting the expansion and shrinkage coefficient allowed to be corrected, judging whether the corrected drill belt expansion and shrinkage coefficient is within the range of the expansion and shrinkage coefficient allowed to be corrected, and automatically reporting an error if it exceeds the range; if it does not exceed the range, outputting the corrected drill belt expansion and shrinkage coefficient.

[0080] Among them, due to the limitations of drill tape compensation and the complexity and variability of the PCB process flow, the corrected expansion and shrinkage coefficient cannot be fully compensated in the drill tape. Therefore, it is necessary to limit different allowable expansion and shrinkage coefficients to be corrected according to actual conditions to determine whether the corrected drill tape expansion and shrinkage coefficient is within the set allowable expansion and shrinkage coefficient range. If it exceeds, an error is automatically reported; if it does not exceed, the corrected drill tape expansion and shrinkage coefficient is output.

[0081] The present application also provides an electronic device, such as Figure 5 As shown, the electronic device 1400 includes:

[0082] one or more processors 1410;

[0083] The memory 1420 stores one or more programs. When the one or more programs are executed by the one or more processors 1410, the one or more processors 1410 implement the method for controlling dimensional stability after lamination provided in any embodiment of the present application.

[0084] The memory 1420, as a non-transient network system, can be used to store non-transient software programs and non-transient computer executable programs. In addition, the memory 1420 may include a high-speed random access memory, and may also include a non-transient memory, such as at least one disk storage device, a flash memory device, or other non-transient solid-state storage device. In some embodiments, the memory 1420 may optionally include a memory 1420 remotely arranged relative to the processor 1410, and these remote memories 1420 may be connected to the processor 1410 via a network. Examples of the above-mentioned network include, but are not limited to, the Internet, an intranet, a local area network, a mobile communication network, and combinations thereof.

[0085] The memory 1420 may be implemented in the form of a read-only memory (ROM), a static storage device, a dynamic storage device, or a random access memory (RAM). The memory 1420 may store an operating system and other application programs. When the technical solutions provided in the embodiments of this specification are implemented by software or firmware, the relevant program codes are stored in the memory 1420, and the processor 1410 calls and executes the methods of the embodiments of this application.

[0086] The processor 1410 can be implemented by a general-purpose CPU (Central Processing Unit), a microprocessor, an application-specific integrated circuit (ASIC), or one or more integrated circuits, and is used to execute relevant programs to implement the technical solutions provided in the embodiments of the present application.

[0087] In some embodiments, the electronic device further comprises:

[0088] Input / output interface, used to realize information input and output;

[0089] Communication interface, used to realize communication interaction between this device and other devices, which can be realized through wired mode (such as USB, network cable, etc.) or wireless mode (such as mobile network, WIFI, Bluetooth, etc.);

[0090] A bus that transmits information between various components of the device (e.g., processor 1410, memory 1420, input / output interface, and communication interface);

[0091] The processor 1410 , the memory 1420 , the input / output interface and the communication interface can be connected to each other in communication within the device via a bus.

[0092] An embodiment of the present application further provides a computer-readable storage medium storing computer-executable instructions for executing the method for controlling dimensional stability after lamination provided in any embodiment of the present application.

[0093] An embodiment of the present application also provides a computer program product, including a computer program or computer instructions, which are stored in a computer-readable storage medium. A processor of a computer device reads the computer program or computer instructions from the computer-readable storage medium, and the processor executes the computer program or computer instructions, so that the computer device executes the method for controlling post-lamination dimensional stability provided in any embodiment of the present application.

[0094] The system architecture and application scenarios described in the embodiments of the present application are intended to more clearly illustrate the technical solutions of the embodiments of the present application, and do not constitute a limitation on the technical solutions provided in the embodiments of the present application. Those skilled in the art will appreciate that with the evolution of the system architecture and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present application are equally applicable to similar technical problems.

[0095] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable ROM (PROM), electrically programmable ROM (EPROM), electrically erasable programmable ROM (EEPROM) or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, RAM is available in many forms, such as static RAM (SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), double data rate SDRAM (DDRSDRAM), enhanced SDRAM (ESDRAM), synchronous link DRAM (SLDRAM), RAMbus direct RAM (RDRAM), direct RAMbus dynamic RAM (DRDRAM), and RAMbus dynamic RAM (RDRAM), etc.

[0096] It will be appreciated by those skilled in the art that all or some of the steps and systems in the disclosed method above may be implemented as software, firmware, hardware and appropriate combinations thereof. Some physical components or all physical components may be implemented as software executed by a processor, such as a central processing unit, a digital signal processor or a microprocessor, or may be implemented as hardware, or may be implemented as an integrated circuit, such as an application specific integrated circuit. Such software may be distributed on a computer-readable medium, which may include a computer storage medium (or a non-transitory medium) and a communication medium (or a temporary medium). As known to those skilled in the art, the term computer storage medium includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules or other data). Computer storage media include, but are not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disks (DVD) or other optical disk storage, magnetic cassettes, magnetic tapes, disk storage or other magnetic storage devices, or any other medium that may be used to store desired information and may be accessed by a computer. Furthermore, it is well known to those skilled in the art that communication media typically embodies computer readable instructions, data structures, program modules, or other data in a modulated data signal such as a carrier wave or other transport mechanism, and may include any information delivery media.

[0097] The above describes some embodiments of the present application with reference to the accompanying drawings, but does not limit the scope of the present invention. Any modification, equivalent substitution and improvement made by those skilled in the art without departing from the scope and essence of the present invention shall be within the scope of the present application.

[0098] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0099] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0100] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0101] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0102] The above is a description of a specific embodiment of the specification. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the drawings do not necessarily require the specific order or continuous order shown to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0103] The preferred embodiments of the present invention are described above with reference to the accompanying drawings, but the scope of the rights of the present invention is not limited thereto. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present invention should be within the scope of the rights of the present invention.

Claims

1. A method for controlling dimensional stability after lamination, characterized in that: The method comprises: A training sample set and an initial model group are constructed for different model group factors, respectively. The training sample set includes the expansion and shrinkage change data corresponding to the model group factors and the actual expansion and shrinkage range corresponding to the expansion and shrinkage change data. The expansion and shrinkage size change range of the PCB after lamination processed by different initial model groups is different. For each of the initial model groups, performing multiple rounds of iterative training on the initial model group using the corresponding training sample set to obtain a corresponding target model group; Obtaining a model group factor of a product, and determining a target model group corresponding to the product according to the model group factor; Inputting the expansion and shrinkage change data to be processed corresponding to the product into the target model group corresponding to the product, so as to derive the expansion and shrinkage change data to be processed through the target model group to obtain the predicted expansion and shrinkage range of the PCB after lamination; The expansion and contraction coefficient of the product is adjusted and controlled according to the predicted expansion and contraction range of the PCB after lamination.

2. The method according to claim 1, characterized in that The expansion and contraction change data corresponding to the model group factors and the expansion and contraction change data to be processed are measured by an X-ray measuring device.

3. The method according to claim 1, characterized in that The model group factors include the stacking composition of the PCB and the process flow factors of the PCB.

4. The method according to claim 1, characterized in that: The performing multiple rounds of iterative training on the initial model group using the corresponding training sample set to obtain the corresponding target model group comprises: Inputting the expansion and contraction change data corresponding to the model group factors into the initial model group corresponding to the model group factors to obtain a predicted expansion and contraction range; Based on the predicted expansion and contraction range and the actual expansion and contraction range, the loss of the initial model group is determined, and model parameters of the initial model group are adjusted based on the loss.

5. The method according to claim 1, characterized in that The step of adjusting and controlling the expansion and contraction coefficient of the product according to the predicted expansion and contraction range of the PCB after lamination comprises the following steps: Determine whether the predicted expansion and shrinkage range of the PCB after lamination exceeds the expansion and shrinkage range of product requirements. If not, output the expansion and shrinkage coefficient of the PCB normally. If exceeded, calculate the corrected expansion and shrinkage coefficient based on the expansion and shrinkage range of product requirements, compensate the corrected expansion and shrinkage coefficient to the drill belt, and output the corrected drill belt expansion and shrinkage coefficient based on the expansion and shrinkage coefficient value allowed to be corrected.

6. The method according to claim 5, characterized in that The method of outputting a modified drill belt expansion coefficient based on the expansion coefficient value allowed to be modified includes: Define the expansion and shrinkage coefficient that can be modified, and judge whether the modified expansion and shrinkage coefficient of the drill belt is within the range of the expansion and shrinkage coefficient that can be modified. If it exceeds, an error is automatically reported; if it does not exceed, output the modified expansion and shrinkage coefficient of the drill belt.

7. A system for controlling dimensional stability after lamination, characterized in that: The system comprises: X-ray measurement module: used to measure the expansion and contraction change data corresponding to the model group factors and the expansion and contraction change data to be processed; Construction module: used to construct training sample sets and initial model groups for different model group factors, respectively. The training sample sets include the expansion and shrinkage change data corresponding to the model group factors and the actual expansion and shrinkage range corresponding to the expansion and shrinkage change data. The expansion and shrinkage size change range of the PCB after lamination processed by different initial model groups is different. Model training module: for each of the initial model groups, using the corresponding training sample set to perform multiple rounds of iterative training on the initial model group to obtain the corresponding target model group; Model group factor acquisition module: obtains the model group factor of the product, and determines the target model group corresponding to the product according to the model group factor; The expansion and shrinkage change data processing module is used to input the expansion and shrinkage change data to be processed corresponding to the product into the target model group corresponding to the product, so as to derive the expansion and shrinkage change data to be processed through the target model group to obtain the predicted expansion and shrinkage range of the PCB after lamination; Expansion and shrinkage coefficient adjustment module: used to determine whether the predicted expansion and shrinkage range of the PCB after lamination exceeds the expansion and shrinkage range of product requirements. If not, the drill belt expansion and shrinkage coefficient of the PCB is output normally; if exceeded, the corrected expansion and shrinkage coefficient is calculated based on the expansion and shrinkage range of product requirements, the corrected expansion and shrinkage coefficient is compensated to the drill belt, and the corrected drill belt expansion and shrinkage coefficient is output based on the expansion and shrinkage coefficient value allowed to be corrected.

8. The system according to claim 7, characterized in that The method of outputting a modified drill belt expansion coefficient based on the expansion coefficient value allowed to be modified includes: The expansion and shrinkage coefficient allowed to be modified is limited, and it is judged whether the modified expansion and shrinkage coefficient of the drill belt is within the range of the expansion and shrinkage coefficient allowed to be modified. If it exceeds, an error is automatically reported; if it does not exceed, the modified expansion and shrinkage coefficient of the drill belt is output.

9. An electronic device, characterized in that: The electronic device comprises a memory and a processor, wherein the memory stores a computer program, and the processor implements the method for controlling dimensional stability after lamination according to any one of claims 1 to 6 when executing the computer program.

10. A computer-readable storage medium storing a computer program, characterized in that: When the computer program is executed by a processor, the method for controlling dimensional stability after lamination according to any one of claims 1 to 6 is implemented.

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