Packaging device for semiconductor packaging

Abstract

The invention discloses a packaging device for semiconductor packaging in the technical field of semiconductor packaging, and the packaging device comprises a supporting frame, a fixing frame is fixedly connected to the supporting frame, a conveying mechanism is arranged in the supporting frame, a plurality of placing discs are installed on the conveying mechanism, a cooling mechanism is installed on the supporting frame, and an alternating mechanism is installed on the fixing frame. Two connecting frames are fixedly connected to the alternating mechanism, height adjusting mechanisms are installed on the connecting frames, a packaging device is installed at one end of one height adjusting mechanism, a packaging device is installed on the other height adjusting mechanism, a driving mechanism is installed on the fixing frame, and the driving mechanism is in transmission connection with the conveying mechanism, the cooling mechanism and the alternating mechanism. And the working efficiency of the equipment is effectively improved, and meanwhile, the damage of static electricity to the equipment during packaging and packaging is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor packaging, in particular to a packaging device for semiconductor packaging. Background Art

[0002] Semiconductor products are packaged and cooled during the production process, and then packaged to facilitate product transportation. Usually, the time required for packaging, wind cooling, and packaging is similar, all 8-12 seconds. However, the cooling process will affect the hot melt temperature of the packaging head and the packaging process, especially for the packaging head, which can easily cause the packaging glue to solidify at the packaging head outlet. Therefore, packaging, cooling, and packaging are carried out at different locations. At the same time, since semiconductor products are prone to static damage, they are easily damaged during transportation after packaging, which will also reduce the packaging efficiency of the equipment. At the same time, it is necessary to increase the dust-free space in the workshop.

[0003] Based on this, the present invention designs a packaging device for semiconductor packaging to solve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a packaging device for semiconductor packaging to solve the problem that the equipment proposed in the above background technology has many steps to operate during operation and the product is prone to damage.

[0005] To achieve the above object, the present invention provides the following technical solutions: A packaging device for semiconductor packaging, comprising a support frame, a fixed frame fixedly connected to the support frame, a conveying mechanism arranged inside the support frame, a plurality of placing plates mounted on the conveying mechanism, a cooling mechanism mounted on the support frame, an alternating mechanism mounted on the fixed frame, two connecting frames fixedly connected to the alternating mechanism, a height adjustment mechanism mounted on the connecting frame, a packager mounted on one end of one of the height adjustment mechanisms, a packager mounted on the other of the height adjustment mechanisms, a driving mechanism mounted on the fixed frame, and the driving mechanism respectively connected to the conveying mechanism, the cooling mechanism and the alternating mechanism in a transmission manner; The cooling mechanism includes a shell, a threaded rod, a movable plate, a speed regulating box, a first gear, a torsion spring and a heat dissipation fan. The shell is installed on the support frame. Two pairs of threaded rods are rotatably connected to the shell. The two pairs of threaded rods are transmission-connected. A movable plate is threadedly connected between the two threaded rods. The movable plate is located on both sides of the shell. A speed regulating box is installed on the shell. The speed regulating box is transmission-connected to the threaded rods. A first gear is provided on the speed regulating box. A torsion spring is provided between the first gear and the speed regulating box. Two heat dissipation fans are installed on the shell.

[0006] As a further solution of the present invention, the conveying mechanism includes a driving shaft and a conveyor belt, two driving shafts are rotatably connected in the support frame, the two driving shafts are transmission-connected, and a conveyor belt is transmission-connected between the two driving shafts.

[0007] As a further solution of the present invention, the alternating mechanism includes a limit frame, a first rotating column, a second gear, a rack and a first spring, two limit frames are fixedly connected to the fixed frame, the first rotating column is rotatably connected to the fixed frame, the second gear is installed on the first rotating column, two racks are meshed on the second gear, and the connecting frame is fixedly connected to the rack.

[0008] As a further solution of the present invention, the limiting frame is slidably connected in the rack, and a first spring is fixedly connected between the limiting frame and the rack.

[0009] As a further solution of the present invention, the height adjustment mechanism includes a screw rod, a second spring and a handle. The screw rod is threadedly connected to the connecting frame, the second spring is sleeved on the screw rod, and a handle is installed at one end of the screw rod.

[0010] As a further solution of the present invention, the driving mechanism includes a second rotating column, a one-way wheel, a third rotating column, an intermittent gear, a driving motor and a half gear. The second rotating column is rotatably connected to the fixed frame, and the second rotating column is transmission-connected to the conveying mechanism. The second rotating column is equipped with a one-way wheel. The third rotating column is rotatably connected to the fixed frame, and the third rotating column is transmission-connected to the second rotating column. The intermittent gear is installed on the third rotating column, and the intermittent gear is meshingly connected to the cooling mechanism. The driving motor is installed on the fixed frame, and the output end of the driving motor is transmission-connected to the alternating mechanism. The output end of the driving motor is equipped with a half gear, and the half gear is meshingly connected to the one-way wheel.

[0011] As a further solution of the present invention, a material receiving plate is installed at the lower side of the support frame, the material receiving plate is arranged at an angle, and a flexible rubber layer is provided on the surface of the material receiving plate.

[0012] Compared with the prior art, the present invention has the following beneficial effects: The present invention realizes the alternation of encapsulation and packaging through an alternating mechanism. At the same time, during the alternating process, the movable plate is driven to rise and fall, so that the encapsulated semiconductor products can be transported and sealed inside the cooling mechanism 7. On the one hand, when sealing and cooling, the encapsulator is located at the lower side of the air outlet and cannot be cooled by air, so it can be ensured that the outlet of the encapsulator is not easy to solidify; secondly, because when the encapsulator rises, the conveying mechanism 3 is driven to move, that is, cooling and packaging can take over the pre-process at the first time, so the exposure time of the product can be greatly reduced, and the defective rate can be reduced. In addition, by sealing the cooling mechanism, the encapsulation, cooling and packaging can be integrated, the production efficiency is improved, and the dust-free space of the workshop is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for describing the embodiments are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0014] Figure 1 This is a schematic diagram of the rear side viewing angle structure of the present invention; Figure 2 This is a schematic diagram of the structure of the present invention from a front side perspective; Figure 3 This is a schematic diagram of the structure of the present invention from a lower side perspective; Figure 4 It is a schematic diagram of the structure of the partial left side viewing angle of the present invention; Figure 5 It is a schematic diagram of the partial rear side perspective structure of the present invention; Figure 6 It is a schematic diagram of the structure of the partial front side perspective of the present invention.

[0015] In the accompanying drawings, the components represented by the reference numerals are as follows: 1. Support frame; 2. Fixed frame; 3. Conveying mechanism; 4. Driving shaft; 5. Conveying belt; 6. Placing plate; 7. Cooling mechanism; 8. Casing; 9. Threaded rod; 10. Moving plate; 11. Speed ​​regulating box; 12. First gear; 13. Torsion spring; 14. Cooling fan; 15. Alternating mechanism; 16. Limiting frame; 17. First rotating column; 18. Second gear; 19. Rack; 20. First spring; 21. Connecting frame; 22. Height adjustment mechanism; 23. Screw rod; 24. Second spring; 25. Handle; 26. Encapsulator; 27. Packaging container; 28. Driving mechanism; 29. ​​Second rotating column; 30. One-way wheel; 31. Third rotating column; 32. Intermittent gear; 33. Driving motor; 34. Half gear; 35. Receiving plate. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-Figure 6 , the present invention provides a technical solution: A packaging device for semiconductor packaging, comprising a support frame 1, a fixed frame 2 is fixedly connected to the support frame 1, a conveying mechanism 3 is arranged inside the support frame 1, a plurality of placing plates 6 are installed on the conveying mechanism 3, a cooling mechanism 7 is installed on the support frame 1, an alternating mechanism 15 is installed on the fixed frame 2, two connecting frames 21 are fixedly connected to the alternating mechanism 15, a height adjustment mechanism 22 is installed on the connecting frame 21, a packaging device 26 is installed at one end of one of the height adjustment mechanisms 22, a packaging device 27 is installed on the other height adjustment mechanism 22, a driving mechanism 28 is installed on the fixed frame 2, and the driving mechanism 28 is respectively connected to the conveying mechanism 3, the cooling mechanism 7 and the alternating mechanism 15; The cooling mechanism 7 includes a shell 8, a threaded rod 9, a movable plate 10, a speed regulating box 11, a first gear 12, a torsion spring 13 and a heat dissipation fan 14. The shell 8 is installed on the support frame 1. Two pairs of threaded rods 9 are rotatably connected to the shell 8. The two pairs of threaded rods 9 are transmission-connected. A movable plate 10 is threadedly connected between the two threaded rods 9. The movable plate 10 is located on both sides of the shell 8. A speed regulating box 11 is installed on the shell 8. The speed regulating box 11 and the threaded rod 9 are transmission-connected. The speed regulating box 11 is provided with a first gear 12. A torsion spring 13 is provided between the first gear 12 and the speed regulating box 11. Two heat dissipation fans 14 are installed on the shell 8. During operation, the material to be packaged is placed in the placement tray 6, and then the height adjustment mechanism 22 is adjusted according to the size and height of the material, so that the height adjustment mechanism 22 is adapted to the packaging and packaging of the material, thereby improving the convenience of use of the equipment and preventing the equipment from being unable to adapt to the size and height of the material. Then, the driving mechanism 28 is controlled to work. When the driving mechanism 28 is working, the driving mechanism 28 controls the alternating mechanism 15 to work. When the encapsulator 26 in the alternating mechanism 15 descends, the one-way wheel 30 does not rotate, and the conveying mechanism 3 does not work at this time. At this time, the encapsulator 26 descends to the placement box to encapsulate the material in the placement box (wind cooling and packaging are carried out simultaneously at two stations, and the encapsulator 26 is located at the lower side of the cooling mechanism 7, which can ensure that the cooling of the cooling mechanism 7 cannot affect the temperature of the encapsulator 26; different from the hot melting principle of the encapsulator 26, the hot melting method of the encapsulator 27 is generally laminating heating, and no preheating is required. At the same time, the encapsulator 27 is also located at the lower side of the exhaust port of the cooling mechanism 7 when working, so the cooling mechanism 7 cannot affect the encapsulator 26. 27 of hot melt packaging), and when the material packaging is completed, the driving mechanism 28 drives the alternating mechanism 15 to work alternately, at this time, one side of the packer 27 is lowered, when one side of the packer 27 is lowered, the one-way wheel 30 rotates, and the conveying mechanism 3 moves at this time. At the same time, when the conveying mechanism 3 moves, the movable plate 10 in the cooling mechanism 7 rises, so that it is convenient to move the packaged placement box to the inner side of the cooling mechanism 7, and there is a difference of one station between the packer 26 and the packer 27, so one of the packaged materials will be located in the cooling device for cooling, and then packaged after cooling, thereby forming an alternating working mode without delaying the packaging and packaging, thereby improving the efficiency of the packaging box packaging, and when the material packaging is completed, the alternating mechanism 15 rises again, and the packer 26 drops again, and this is repeated to complete the packaging, cooling and packaging of the material, so that the three-step operation is performed in sequence, thereby making the equipment more efficient in packaging and packaging, reducing the steps of changing the station of the material, and further improving the practicality and convenience of use of the equipment; Among them: when the conveying mechanism 3 is working, the driving mechanism 28 controls the first gear 12 to work at the same time. When the first gear 12 is working, the speed regulating box 11 works at the same time. At this time, the torsion spring 13 is compressed, and the speed regulating box 11 controls the threaded rod 9 to rotate. When the threaded rod 9 rotates, the movable plate 10 moves up. At the same time, when the conveying mechanism 3 stops working, the intermittent gear 32 and the first gear 12 are disengaged. At this time, the torsion spring 13 is reset, so that the movable plate 10 is lowered again, and then the two sides of the outer shell 8 are sealed. At this time, the material in the outer shell 8 can be fully dissipated through the heat dissipation fan 14, thereby ensuring the sealing during heat dissipation, and avoiding dust from entering and exiting during heat dissipation, further improving the working efficiency of the equipment, ensuring the cooling effect of the equipment, and avoiding overheating during packaging.

[0018] The present invention realizes the alternation of encapsulation and packaging through the alternating mechanism 15. At the same time, during the alternating process, the movable plate 10 is driven to rise and fall, so that the encapsulated semiconductor products can be transported and sealed inside the cooling mechanism 7. On the one hand, when sealing and cooling, the encapsulator 26 is located at the lower side of the air outlet and cannot be cooled by air, so it can be ensured that the outlet of the encapsulator 26 is not easy to solidify; secondly, because when the encapsulator 26 rises, the conveying mechanism 3 is driven to move, that is, cooling and packaging can take over the pre-process at the first time (the pre-process of cooling is encapsulation, and the pre-process of packaging is cooling), so it can greatly reduce the exposure time of the product and reduce the defective rate. In addition, by sealing the cooling mechanism 7, it is possible to realize the integrated operation of encapsulation, cooling and packaging, improve production efficiency, and reduce the dust-free space in the workshop.

[0019] As a further solution of the present invention, the conveying mechanism 3 includes a driving shaft 4 and a conveyor belt 5. Two driving shafts 4 are rotatably connected in the support frame 1. The two driving shafts 4 are transmission-connected, and the conveyor belt 5 is transmission-connected between the two driving shafts 4. During operation, when the driving mechanism 28 controls the driving shaft 4 to rotate, the driving shaft 4 controls the conveyor belt 5 to transport, thereby moving the placement plate 6, thereby ensuring the sequential packaging, cooling and packaging of the equipment, thereby making the equipment more convenient and efficient during operation.

[0020] As a further solution of the present invention, the alternating mechanism 15 includes a limit frame 16, a first rotating column 17, a second gear 18, a rack 19 and a first spring 20, two limit frames 16 are fixedly connected to the fixed frame 2, the first rotating column 17 is rotatably connected to the fixed frame 2, the second gear 18 is installed on the first rotating column 17, two racks 19 are meshed on the second gear 18, and the connecting frame 21 is fixedly connected to the rack 19; During operation, when the driving mechanism 28 controls the first rotating column 17 to rotate, the first rotating column 17 controls the second gear 18 to rotate. At this time, the second gear 18 controls the movement of the two racks 19. When one of the racks 19 moves up, the other rack 19 moves down. At the same time, the equipment realizes the steps of first encapsulating and then packaging, thereby making the equipment more efficient at work, reducing the steps of material transfer, making the equipment more convenient at work, and reducing the damage caused by static electricity.

[0021] As a further solution of the present invention, the limit frame 16 is slidably connected in the rack 19, and a first spring 20 is fixedly connected between the limit frame 16 and the rack 19; During operation, the rack 19 moves on the limit frame 16. At this time, the length of the first spring 20 is elongated and telescopic, thereby ensuring the stability of the device during movement and preventing the rack 19 from shifting during movement, thereby further improving the practicability and safety of the device.

[0022] As a further solution of the present invention, the height adjustment mechanism 22 includes a screw rod 23, a second spring 24 and a handle 25. The screw rod 23 is threadedly connected to the connecting frame 21, the second spring 24 is sleeved on the screw rod 23, and the handle 25 is installed at one end of the screw rod 23; During operation, when it is necessary to change the encapsulator 26 or the wrapper 27, the handle 25 is used to drive the screw rod 23 to rotate. At this time, the screw rod 23 moves on the connecting frame 21, so that the encapsulator 26 or the wrapper 27 rises or falls, and then the position of the encapsulator 26 or the wrapper 27 is changed. At the same time, the length of the second spring 24 changes, which ensures the stability of the equipment during adjustment and prevents the screw rod 23 from shaking during the adjustment process.

[0023] As a further solution of the present invention, the driving mechanism 28 includes a second rotating column 29, a one-way wheel 30, a third rotating column 31, an intermittent gear 32, a driving motor 33 and a half gear 34. The second rotating column 29 is rotatably connected to the fixed frame 2, and the second rotating column 29 is transmission-connected to the conveying mechanism 3. The second rotating column 29 is equipped with a one-way wheel 30. The third rotating column 31 is rotatably connected to the fixed frame 2. The third rotating column 31 is transmission-connected to the second rotating column 29. The intermittent gear 32 is installed on the third rotating column 31. The intermittent gear 32 is meshed with the cooling mechanism 7. The driving motor 33 is installed on the fixed frame 2. The output end of the driving motor 33 is transmission-connected to the alternating mechanism 15. The output end of the driving motor 33 is equipped with a half gear 34, and the half gear 34 is meshed with the one-way wheel 30. During operation, when the driving motor 33 rotates in one direction, if the encapsulator 26 in the alternating mechanism 15 descends, the half gear 34 does not drive the one-way wheel 30 to rotate. At this time, the alternating mechanism 15 controls the encapsulator 26 to move to a suitable position, thereby completing the encapsulation of the material. When the encapsulator 27 in the alternating mechanism 15 descends, the half gear 34 drives the one-way wheel 30 to rotate, and then the conveying mechanism 3 moves. During the movement of the conveying mechanism 3, the intermittent gear 32 simultaneously controls the first gear 12 to rotate. At this time, the moving plate 10 moves up to keep the cooling mechanism 7 open. When the half gear 34 and the one-way wheel 30 are disengaged, the conveying mechanism 3 stops working. At this time, the encapsulator 27 continues to descend, and then moves to the placement plate 6 for packaging. At the same time, the unpackaged material is moved again. The first gear 12 is disengaged from the first gear 12, and the torsion spring 13 causes the speed regulating box 11 to work in reverse, thereby causing the movable plate 10 to move downward, thereby ensuring the sealing of the cooling mechanism 7 and the cooling efficiency thereof. When the material is packaged, the driving motor 33 rotates in the opposite direction, at which time the one-way wheel 30 does not rotate, and the encapsulator 26 descends again, and the work is repeated, so that the equipment forms a three-step operation, thereby further improving the encapsulation and packaging efficiency of the equipment, and making the equipment more convenient and efficient during operation.

[0024] As a further solution of the present invention, a material receiving plate 35 is installed on the lower side of the support frame 1, the material receiving plate 35 is inclined, and a flexible rubber layer is provided on the surface of the material receiving plate 35; During operation, when the conveying mechanism 3 moves to one side of the support frame 1, the support frame 1 forms a cycle, and the materials in the placement tray 6 fall onto the receiving plate 35, so that the packaged materials are collected uniformly, thereby improving the working efficiency of the equipment.

[0025] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A packaging device for semiconductor packaging, comprising a support frame (1), characterized in that: The support frame (1) is fixedly connected to a fixed frame (2), a conveying mechanism (3) is provided inside the support frame (1), a plurality of placement plates (6) are installed on the conveying mechanism (3), a cooling mechanism (7) is installed on the support frame (1), an alternating mechanism (15) is installed on the fixed frame (2), two connecting frames (21) are fixedly connected to the alternating mechanism (15), a height adjustment mechanism (22) is installed on the connecting frame (21), one end of one of the height adjustment mechanisms (22) is installed with a packaging container (26), and the other height adjustment mechanism (22) is installed with a packaging container (27), and a driving mechanism (28) is installed on the fixed frame (2), and the driving mechanism (28) is respectively connected to the conveying mechanism (3), the cooling mechanism (7) and the alternating mechanism (15) in a transmission manner.

2. A packaging device for semiconductor packaging according to claim 1, characterized in that: The conveying mechanism (3) comprises a driving shaft (4) and a conveyor belt (5); two driving shafts (4) are rotatably connected inside the support frame (1); the two driving shafts (4) are transmission-connected; and a conveyor belt (5) is transmission-connected between the two driving shafts (4).

3. A packaging device for semiconductor packaging according to claim 1, characterized in that: The cooling mechanism (7) comprises a housing (8), a threaded rod (9), a movable plate (10), a speed regulating box (11), a first gear (12), a torsion spring (13) and a heat dissipation fan (14). The housing (8) is mounted on the support frame (1). Two pairs of threaded rods (9) are rotatably connected to the housing (8). The two pairs of threaded rods (9) are in driving connection. A movable plate (10) is threadedly connected between the two threaded rods (9). The movable plate (10) is located on both sides of the housing (8). The housing (8) is mounted on the speed regulating box (11). The speed regulating box (11) and the threaded rods (9) are in driving connection. The speed regulating box (11) is provided with a first gear (12). A torsion spring (13) is provided between the first gear (12) and the speed regulating box (11). Two heat dissipation fans (14) are mounted on the housing (8).

4. A packaging device for semiconductor packaging according to claim 1, characterized in that: The alternating mechanism (15) comprises a limit frame (16), a first rotating column (17), a second gear (18), a rack (19) and a first spring (20); the two limit frames (16) are fixedly connected to the fixed frame (2); the first rotating column (17) is rotatably connected to the fixed frame (2); the second gear (18) is mounted on the first rotating column (17); the second gear (18) is meshed with two racks (19); and the connecting frame (21) is fixedly connected to the rack (19).

5. A packaging device for semiconductor packaging according to claim 4, characterized in that: The limiting frame (16) is slidably connected in the rack (19), and a first spring (20) is fixedly connected between the limiting frame (16) and the rack (19).

6. A packaging device for semiconductor packaging according to claim 1, characterized in that: The height adjustment mechanism (22) comprises a screw rod (23), a second spring (24) and a handle (25); the screw rod (23) is threadedly connected to the connecting frame (21); the second spring (24) is sleeved on the screw rod (23); and the handle (25) is mounted on one end of the screw rod (23).

7. A packaging device for semiconductor packaging according to claim 1, characterized in that: The driving mechanism (28) comprises a second rotating column (29), a one-way wheel (30), a third rotating column (31), an intermittent gear (32), a driving motor (33) and a half gear (34); the second rotating column (29) is rotatably connected to the fixed frame (2); the second rotating column (29) is transmission-connected to the conveying mechanism (3); the one-way wheel (30) is mounted on the second rotating column (29); the third rotating column (31) is rotatably connected to the fixed frame (2); the third rotating column (31) is transmission-connected to the second rotating column (29); the intermittent gear (32) is mounted on the third rotating column (31); the intermittent gear (32) is meshingly connected to the cooling mechanism (7); the driving motor (33) is mounted on the fixed frame (2); the output end of the driving motor (33) is transmission-connected to the alternating mechanism (15); the output end of the driving motor (33) is mounted with a half gear (34); the half gear (34) is meshingly connected to the one-way wheel (30).

8. The packaging device for semiconductor packaging according to claim 1, characterized in that: A material receiving plate (35) is installed on the lower side of the support frame (1); the material receiving plate (35) is arranged in an inclined manner; and a flexible rubber layer is provided on the surface of the material receiving plate (35).

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