Electroplating grinding rod for mobile phone lens processing

Abstract

The invention discloses an electroplating grinding rod for mobile phone lens machining. The electroplating grinding rod comprises a fixing handle, a connecting part, a first electroplating base body and a second electroplating base body. The fixing handle is installed at the top end of the connecting part, the first electroplating base body is installed at the bottom end of the connecting part, and the second electroplating base body is located at the bottom end of the first electroplating base body. Through the synergistic effect of the cobalt sulfate, the nickel chloride hexahydrate, the nickel sulfate heptahydrate, the lauryl sodium sulfate, the boric acid, the saccharin, the 1, 4-butanediol and the water, the electroplating hardness of the electroplating grinding rod is effectively enhanced, and therefore the service life of the electroplating grinding rod is further prolonged.

Description

Technical Field

[0001] The invention relates to the technical field of electroplating grinding rods, and in particular to an electroplating grinding rod used for processing mobile phone lenses. Background Art

[0002] Electroplated grinding rods are generally used in deep processing industries such as optical glass, sapphire glass, touch screen glass, precision ceramics, auto parts, medical equipment, cemented carbide, semiconductors, etc. Their main functions are drilling, edge grinding or trimming. Traditional electroplated grinding rods are mostly single-abrasive grinding rods or double-abrasive grinding rods. For multiple different processing procedures, at least two types of grinding rods are generally required to complete them. The functional concentration is low, which also affects the operating efficiency.

[0003] Therefore, how to provide an electroplated grinding rod for processing mobile phone lenses to solve the problems existing in the prior art is of great significance to its application. Summary of the invention

[0004] In view of this, the purpose of this application is to provide an electroplated grinding rod for processing mobile phone lenses to solve the problem.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] An electroplated grinding rod for processing mobile phone lenses, comprising a fixed handle, a connecting portion, a first electroplated substrate and a second electroplated substrate;

[0007] The fixing handle is installed at the top end of the connecting part, the first electroplating substrate is installed at the bottom end of the connecting part, and the second electroplating substrate is located at the bottom end of the first electroplating substrate;

[0008] The surface of the first electroplating substrate is electroplated with a first electroplating layer; the surface of the second electroplating substrate is electroplated with a second electroplating layer.

[0009] Preferably, the diameter of the second electroplating substrate is 4-5 mm, and the diameter of the first electroplating substrate is 7-9 mm.

[0010] Preferably, the surface of the first electroplated substrate is provided with a plurality of ring-mounted grooves 1, and the surface of the second electroplated substrate is provided with a ring-mounted groove 2, wherein the depth of the ring-mounted groove 1 is 0.4-0.6mm and the width is 0.5-0.7mm; the depth of the ring-mounted groove 1 is 0.2-0.3mm and the width is 0.3-0.5mm.

[0011] Preferably, the first electroplating substrate and the second electroplating substrate are electroplated using the same electroplating system, and the electroplating system includes cobalt sulfate, nickel chloride hexahydrate, nickel sulfate heptahydrate, sodium dodecyl sulfate, boric acid, saccharin, 1,4-butanediol and water.

[0012] Preferably, in 1L of water in the electroplating system, there are 30-55g of nickel chloride hexahydrate, 15-20g of cobalt sulfate, 220-400g of nickel sulfate heptahydrate, 0.2-0.5g of sodium dodecyl sulfate, 20-60g of boric acid, 0.5-1.1g of saccharin, and 0.3-0.7g of 1,4-butanediol.

[0013] Preferably, 0.36 g of CBN abrasive with a particle size of 15 um is added to the electroplating system of the first electroplating substrate, and 5 g of CBN abrasive with a particle size of 50 um and 4 g of silicon carbide are added to the electroplating system of the second electroplating substrate.

[0014] Compared with the prior art, the present invention has the following beneficial effects:

[0015] 1. Different electroplated abrasives are disposed on the first electroplated substrate and the second electroplated substrate in the present invention, so that the functional concentration is increased and the operation efficiency is improved.

[0016] 2. The electroplating system of the present invention effectively enhances the electroplating hardness of the electroplated grinding rod through the synergistic effect of cobalt sulfate, nickel chloride hexahydrate, nickel sulfate heptahydrate, sodium dodecyl sulfate, boric acid, saccharin, 1,4-butanediol and water, thereby further improving the service life of the electroplated grinding rod.

[0017] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application so that it can be implemented in accordance with the contents of the specification, and to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings as follows.

[0018] Based on the detailed description of the specific embodiments of the present application in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other objects, advantages and features of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required for use in the embodiments or the prior art descriptions are briefly introduced below. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. In all drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual scale.

[0020] Figure 1 It is a structural schematic diagram of the present invention.

[0021] In the figure: 1. fixing handle; 2. connecting part; 3. first electroplating substrate; 4. second electroplating substrate. DETAILED DESCRIPTION

[0022] To make the purpose, technical scheme and advantages of the embodiment of the present application clearer, the technical scheme in the embodiment of the present application will be clearly and completely described below in conjunction with the accompanying drawings in the embodiment of the present application. Obviously, the described embodiment is a part of the embodiment of the present application, rather than all of the embodiments. In the following description, specific details such as specific configuration and components are provided only to help fully understand the embodiments of the present application. Therefore, it should be clear to those skilled in the art that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, for clarity and brevity, the description of known functions and structures is omitted in the embodiment.

[0023] In addition, the present application may repeat reference numerals and / or letters in different examples. This repetition is for the purpose of simplicity and clarity, and does not in itself indicate the relationship between the various embodiments and / or settings discussed.

[0024] The term "and / or" in this article is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, B exists alone, and A and B exist at the same time. The term " / and" in this article describes another type of association object relationship, indicating that there can be two relationships. For example, A / and B can mean: A exists alone, and A and B exist alone. In addition, the character " / " in this article generally indicates that the previous and next associated objects are in an "or" relationship.

[0025] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusions.

[0026] See also Figure 1 , the present invention provides a technical solution of an electroplated grinding rod for processing mobile phone lenses: comprising a fixed handle 1, a connecting portion 2, a first electroplated substrate 3 and a second electroplated substrate 4;

[0027] The fixing handle 1 is installed at the top end of the connecting part 2, the first electroplating base 3 is installed at the bottom end of the connecting part 2, and the second electroplating base 4 is located at the bottom end of the first electroplating base 3;

[0028] The surface of the first electroplating substrate 3 is electroplated with a first electroplating layer; the surface of the second electroplating substrate 4 is electroplated with a second electroplating layer.

[0029] The diameter of the second electroplating substrate 4 is 4-5 mm, and the diameter of the first electroplating substrate 3 is 7-9 mm.

[0030] The surface of the first electroplated substrate 3 is provided with a plurality of ring-shaped grooves 1, and the surface of the second electroplated substrate 4 is provided with ring-shaped grooves 2. The depth of the ring-shaped grooves 1 is 0.4-0.6mm, and the width is 0.5-0.7mm; the depth of the ring-shaped grooves 2 is 0.2-0.3mm, and the width is 0.3-0.5mm.

[0031] The first electroplating substrate 3 and the second electroplating substrate 4 are electroplated using the same electroplating system, which includes cobalt sulfate, nickel chloride hexahydrate, nickel sulfate heptahydrate, sodium dodecyl sulfate, boric acid, saccharin, 1,4-butanediol and water.

[0032] In 1L water of the electroplating system, 30-55g of nickel chloride hexahydrate, 15-20g of cobalt sulfate, 220-400g of nickel sulfate heptahydrate, 0.2-0.5g of sodium dodecyl sulfate, 20-60g of boric acid, 0.5-1.1g of saccharin and 0.3-0.7g of 1,4-butanediol.

[0033] 0.36 g of CBN abrasive with a particle size of 15 um was added to the electroplating system of the first electroplated substrate 3 , and 5 g of CBN abrasive with a particle size of 50 um and 4 g of silicon carbide were added to the electroplating system of the second electroplated substrate 4 .

[0034] When used specifically, the first electroplating substrate 3 and the second electroplating substrate 4 are firstly processed by a machine tool, and the ring-mounting groove 1 and the ring-mounting groove 2 are opened on the surface of the substrate, and then the electroplating system is configured. In 1L of water, 30-55g of nickel chloride hexahydrate, 15-20g of cobalt sulfate, 220-400g of nickel sulfate heptahydrate, 0.2-0.5g of sodium dodecyl sulfate, 20-60g of boric acid, 0.5-1.1g of saccharin, and 0.3-0.7g of 1,4-butanediol are added. The second electroplating substrate 4 is immersed in the electroplating system, and 5g of CBN abrasive with a particle size of 50um, 4g of silicon carbide, and 23-65 ℃, 0.5-4A / dm2 electroplating for 3 hours, shielding is performed after the electroplating is completed, the first electroplating substrate 3 is electroplated, 0.36g of CBN abrasive with a particle size of 15um is added to the electroplating system, and the first electroplating substrate 3 is electroplated at a temperature of 23-65℃ and 0.5-4A / dm2 for 4 hours. After the completion, the shielding is removed to complete the preparation. The synergistic effect of cobalt sulfate and nickel chloride hexahydrate, nickel sulfate heptahydrate, sodium dodecyl sulfate, boric acid, saccharin, 1,4-butanediol and water effectively enhances the electroplating hardness of the electroplated grinding rod, thereby further improving the service life of the electroplated grinding rod.

[0035] The above description is only the preferred embodiment of the present invention, which does not limit the protection scope of the present invention. For those skilled in the art, the present invention can be modified and varied in various ways. Within the spirit and principle of the present invention, any change, modification, replacement, integration and parameter change of these embodiments by conventional substitution or capable of achieving the same function without departing from the principle and spirit of the present invention shall fall within the protection scope of the present invention.

Claims

1. An electroplated grinding rod for processing mobile phone lenses, characterized in that: It comprises a fixing handle (1), a connecting portion (2), a first electroplating base (3) and a second electroplating base (4); The fixing handle (1) is mounted on the top end of the connecting portion (2), the first electroplating base (3) is mounted on the bottom end of the connecting portion (2), and the second electroplating base (4) is located at the bottom end of the first electroplating base (3); The surface of the first electroplating substrate (3) is electroplated with a first electroplating layer; the surface of the second electroplating substrate (4) is electroplated with a second electroplating layer.

2. The electroplated grinding rod for processing mobile phone lenses according to claim 1, characterized in that: The diameter of the second electroplating substrate (4) is 4-5 mm, and the diameter of the first electroplating substrate (3) is 7-9 mm.

3. The electroplated grinding rod for processing mobile phone lenses as claimed in claim 2, characterized in that: The surface of the first electroplated substrate (3) is provided with a plurality of first ring-shaped grooves, and the surface of the second electroplated substrate (4) is provided with second ring-shaped grooves. The depth of the first ring-shaped grooves is 0.4-0.6 mm, and the width is 0.5-0.7 mm; the depth of the first ring-shaped grooves is 0.2-0.3 mm, and the width is 0.3-0.5 mm.

4. The electroplated grinding rod for processing mobile phone lenses as claimed in claim 3, characterized in that: The first electroplating substrate (3) and the second electroplating substrate (4) are electroplated using the same electroplating system, wherein the electroplating system comprises cobalt sulfate, nickel chloride hexahydrate, nickel sulfate heptahydrate, sodium dodecyl sulfate, boric acid, saccharin, 1,4-butanediol and water.

5. The electroplated grinding rod for processing mobile phone lenses as claimed in claim 4, characterized in that: In the electroplating system, in 1L of water, there are 30-55g of nickel chloride hexahydrate, 15-20g of cobalt sulfate, 220-400g of nickel sulfate heptahydrate, 0.2-0.5g of sodium dodecyl sulfate, 20-60g of boric acid, 0.5-1.1g of saccharin, and 0.3-0.7g of 1,4-butanediol.

6. The electroplated grinding rod for processing mobile phone lenses as claimed in claim 5, characterized in that: 0.36 g of CBN abrasive with a particle size of 15 um was added to the electroplating system of the first electroplated substrate (3), and 5 g of CBN abrasive with a particle size of 50 um and 4 g of silicon carbide were added to the electroplating system of the second electroplated substrate (4).

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