A wet polishing apparatus and polishing control system
By using a movable block control component in the wet grinding and polishing device, the adsorption, feeding, and backwashing of materials can be carried out independently, which solves the problems of complex pipelines and high control difficulty of existing equipment, simplifies the operation steps and reduces costs.
CN119973877BActive Publication Date: 2026-06-26SHEN ZHEN YONG LIN TECH CO LTD
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Patent Information
- Application Number
- CN202510353136.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-24
- Publication Date
- 2026-06-26
- Estimated Expiration
- 2045-03-24
AI Technical Summary
Technical Problem
Existing wet grinding and polishing equipment has a complex pipeline structure, requiring multiple control valves to be linked, which increases equipment cost and operational difficulty.
Method used
The movable block in the control component moves within the control chamber, enabling independent connection of the first channel with the negative pressure port, cleaning port, and normal pressure port. By controlling the negative pressure source and the cleaning component, the pipeline structure is simplified, allowing for independent operation of material adsorption, feeding, and backwashing.
Benefits of technology
The piping structure of the polishing device has been simplified, reducing control difficulty, operation steps, and equipment costs.
✦ Generated by Eureka AI based on patent content.
Abstract
The application provides a wet grinding and polishing device and a polishing control system, and belongs to the technical field of polishing devices. The polishing device comprises a polishing table, a polishing piece and a control assembly. The polishing piece has a working surface and a first channel, and the first channel is in communication with the control assembly. The control assembly comprises a control chamber and a movable block. The control chamber has a negative pressure port, an atmospheric pressure port, a cleaning port and a connecting port in communication with the first channel. The movable block is movably installed in the control chamber and has a second channel. One end of the second channel is in communication with the connecting port, and the other end is a butt joint end. In the case that the butt joint end is in communication with the atmospheric pressure port, the movable block can respond to the negative pressure port to realize the communication between the butt joint end and the negative pressure port, or the movable block can respond to the cleaning port to realize the communication between the butt joint end and the cleaning port. The application realizes the switching of the polishing device state under the driving of the negative pressure source and the cleaning assembly by setting the movement of the movable block, and simplifies the pipeline structure of the polishing device.
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