Multilayer electronic component

Abstract

The present disclosure provides a multilayer electronic component including a body including a dielectric layer, an inner electrode layer, and a floating electrode layer, and an outer electrode, the inner electrode layer includes a first electrode pattern connected to a third surface of the body and a second electrode pattern spaced apart from the first electrode pattern in a third direction and connected to a fourth surface of the body, and the floating electrode layer includes a third electrode pattern spaced apart from the third surface and the fourth surface, a fourth electrode pattern spaced apart from the third electrode pattern and connected to the third surface, and a fifth electrode pattern spaced apart from the third electrode pattern and connected to the fourth surface. The multilayer electronic component may allow an electric field formed between an inner electrode layer and a floating electrode layer in a first direction to be also formed in a second direction and a third direction, which may counteract stress formed in a stress concentration region, thereby improving reliability including breakdown voltage (BDV) characteristics of the multilayer electronic component.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2023-0193518, filed with the Korean Intellectual Property Office on December 27, 2023, the entire disclosure of which is incorporated herein by reference. Technical Field

[0002] The present disclosure relates to a multi-layer electronic component. Background Art

[0003] A multi-layer ceramic capacitor (MLCC), a type of multi-layer electronic component, is a chip capacitor that is mounted on printed circuit boards of various types of electronic products, such as image display devices (including liquid crystal displays (LCDs) and plasma display panels (PDPs)), computers, smartphones and mobile phones, on-vehicle chargers (OBCs) for electric vehicles, and DC-DC converters, etc., and is used to charge or discharge from them.

[0004] When a voltage is applied to a multi-layer ceramic capacitor, stress may occur inside the multi-layer ceramic capacitor due to the electrostriction phenomenon of the dielectric layer, which may lead to a decrease in the reliability of the multi-layer ceramic capacitor, including breakdown voltage (BDV) characteristics.

[0005] Conventionally, attempts have been made to mitigate the electrostriction phenomenon, such as introducing a floating electrode layer structure.

[0006] However, although the internal electrode structure introducing a general floating electrode layer can achieve a certain degree of stress concentration mitigation effect by distributing voltage overall, the stress caused by electrostriction may concentrate at the corners where electrode patterns of different polarities are stacked on top of each other in the stacking direction of the internal electrodes. Therefore, even when a floating electrode layer is introduced, the reliability (including BDV characteristics) may deteriorate, and this phenomenon may be further aggravated when operating the multi-layer ceramic capacitor at high voltages.

[0007] Therefore, in the internal electrode structure introducing a floating electrode layer, structural improvement is needed to mitigate the phenomenon of stress concentration caused by electrostriction at the corners where electrode patterns of different polarities are stacked on top of each other in the stacking direction of the internal electrodes. Summary of the Invention

[0008] One aspect of the present disclosure is to mitigate the phenomenon of stress concentration caused by electrostriction at the corners where electrode patterns of different polarities are stacked on top of each other in the stacking direction of the internal electrodes in the internal electrode structure introducing a floating electrode layer.

[0009] However, the aspects of the present disclosure are not limited to the above, and can be more easily understood during the description of specific embodiments of the present disclosure.

[0010] A multi-layer electronic component according to some example embodiments of the present disclosure may include: a body including a dielectric layer and inner electrode layers and floating electrode layers, the inner electrode layers and the floating electrode layers being alternately arranged in a first direction, and the dielectric layer being interposed between the inner electrode layers and the floating electrode layers, and the body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and at least two outer electrodes respectively provided on the third surface and the fourth surface, and the inner electrode layer may include a first electrode pattern and a second electrode pattern, the first electrode pattern being connected to the third surface, the second electrode pattern being spaced apart from the first electrode pattern in the third direction and connected to the fourth surface, and the floating electrode layer may include a third electrode pattern, a fourth electrode pattern, and a fifth electrode pattern, the third electrode pattern being spaced apart from the third surface and the fourth surface, the fourth electrode pattern being spaced apart from the third electrode pattern and connected to the third surface, and the fifth electrode pattern being spaced apart from the third electrode pattern and connected to the fourth surface.

[0011] A multi-layer electronic component according to another exemplary embodiment of the present disclosure may include: a body including a dielectric layer, an inner electrode layer, and a floating electrode layer, the inner electrode layer and the floating electrode layer being alternately arranged in a first direction, and the dielectric layer being interposed between the inner electrode layer and the floating electrode, and the body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in a third direction; and at least two outer electrodes respectively disposed on the third surface and the fourth surface, and the inner electrode layer may include a first electrode pattern and a second electrode pattern, the first electrode pattern being connected to the third surface, the second electrode pattern being spaced apart from the first electrode pattern in the third direction and connected to the fourth surface, the floating electrode layer may include a third electrode pattern spaced apart from the third surface and the fourth surface, the first electrode pattern may include a first connection portion and a first main portion, the first connection portion being in contact with the outer electrode on the third surface among the outer electrodes, the first main portion extending from the first connection portion in the second direction but having a length longer than that of the first connection portion in the second direction and a width narrower than that of the first connection portion in the third direction, and the second electrode pattern may include a second connection portion and a second main portion, the second connection portion being in contact with the outer electrode on the fourth surface among the outer electrodes, the second main portion extending from the second connection portion in the second direction but having a length longer than that of the second connection portion in the second direction and a width narrower than that of the second connection portion in the third direction.

[0012] One of the various effects of the present disclosure is that in a multi-layer electronic component including an inner electrode layer and a floating electrode layer, the reliability (including BDV characteristics) of the multi-layer electronic component is improved by controlling the shapes of the electrode patterns included in the inner electrode layer and the floating electrode layer and reducing the stress concentrated on the corners where the electrode patterns of different polarities are stacked on top of each other in the stacking direction of the inner electrodes.

[0013] The advantages and effects of the present disclosure are not limited to the foregoing, and can be more easily understood during the process of describing specific exemplary embodiments of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Through the following specific embodiments in conjunction with the drawings, the above and other aspects, features, and advantages of the present disclosure will be more clearly understood. In the drawings: Figure 1 is a perspective view schematically showing a multi-layer electronic component according to an exemplary embodiment of the present disclosure and another exemplary embodiment of the present disclosure; Figure 2 is a cross-sectional view taken along line I-I' of Figure 1 ; Figure 3 is a cross-sectional view taken along line II-II' of Figure 1 ; Figure 4 is a cross-sectional view taken along line III-III' of Figure 1 ; Figure 5A shows a region where electrostrictive stress concentration occurs in an electrode pattern in a multilayer electronic component according to a comparative example; Figure 5B shows a region where electrostrictive stress concentration occurs in an electrode pattern in a multilayer electronic component according to an inventive example; Figure 6A schematically shows a plan view of an inner electrode layer according to an exemplary embodiment; Figure 6B schematically shows a plan view of a floating electrode layer according to an exemplary embodiment; and Figure 7 schematically shows an exploded perspective view of a main body according to an embodiment. DETAILED DESCRIPTION

[0015] Hereinafter, exemplary embodiments of the present disclosure will be described with reference to specific exemplary embodiments and the drawings. However, the exemplary embodiments of the present disclosure may be illustrated in many different forms and should not be construed as being limited to the specific embodiments set forth herein. The exemplary embodiments disclosed herein are provided to better explain the present disclosure to those skilled in the art. Therefore, in the drawings, for clarity, the shapes and sizes of elements may be exaggerated, and the same or similar reference numerals will always be used to denote the same or similar elements.

[0016] In addition, in order to clearly show the present disclosure in the drawings, content unrelated to the description is omitted, and since the dimensions (e.g., thickness) of each component shown in the drawings are arbitrarily shown for ease of description, the present disclosure is not limited thereto. In addition, components having the same function within the same inventive concept are described using the same reference numerals. Throughout the specification, unless otherwise specified, when a part "includes" or "comprises" a certain component, this indicates that other components are not excluded and other components may be further included.

[0017] In the drawings, the first direction may be defined as the thickness (T) direction, the second direction may be defined as the length (L) direction, and the third direction may be defined as the width (W) direction.

[0018] Figure 1is a perspective view schematically showing a multilayer electronic component according to an exemplary embodiment of the present disclosure and another exemplary embodiment of the present disclosure.

[0019] Figure 2 is a cross-sectional view taken along Figure 1 line I-I'.

[0020] Figure 3 is a cross-sectional view taken along Figure 1 line II-II'.

[0021] Figure 4 is a cross-sectional view taken along Figure 1 line III-III'.

[0022] Figure 5A shows a region where electrostrictive stress concentration occurs in an electrode pattern in a multilayer electronic component according to a comparative example, and Figure 5B shows a region where electrostrictive stress concentration occurs in an electrode pattern in a multilayer electronic component according to an inventive example.

[0023] Figure 6A schematically shows a plan view of an inner electrode layer according to some exemplary embodiments, and Figure 6B schematically shows a plan view of a floating electrode layer according to an exemplary embodiment.

[0024] Figure 7 schematically shows an exploded perspective view of a main body according to some embodiments of the present disclosure.

[0025] Hereinafter, a multilayer electronic component according to an exemplary embodiment of the present disclosure and another exemplary embodiment of the present disclosure will be described in detail with reference to Figures 1 to 7 In addition, a multilayer ceramic capacitor (MLCC) is described as an example of the multilayer electronic component, but the present disclosure is not limited thereto, and the multilayer electronic component of the present disclosure can also be applied to various other multilayer electronic components using ceramic materials, such as inductors, piezoelectric elements, varistors, or thermistors.

[0026] Before describing the multilayer electronic component according to an exemplary embodiment of the present disclosure and the multilayer electronic component according to another exemplary embodiment of the present disclosure, components commonly included in the multilayer electronic component according to an exemplary embodiment of the present disclosure and the multilayer electronic component according to another exemplary embodiment of the present disclosure will be described.

[0027] According to some exemplary embodiments of the present disclosure, a multi-layer electronic component 100 may include: a body 110 including a dielectric layer 111, an inner electrode layer 121, and a floating electrode layer 122, the inner electrode layer 121 and the floating electrode layer 122 being alternately arranged in a first direction, and the dielectric layer being interposed between the inner electrode layer 121 and the floating electrode layer 122, and the body 110 having a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface and the second surface and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface to the fourth surface and opposite to each other in a third direction; outer electrodes 130 and 140 respectively disposed on the third surface and the fourth surface.

[0028] The body 110 may include a dielectric layer 111, an inner electrode layer 121, and a floating electrode layer 122, the inner electrode layer 121 and the floating electrode layer 122 being alternately arranged in the first direction and the dielectric layer 111 being interposed between the inner electrode layer 121 and the floating electrode layer 122.

[0029] There is no particular limitation on the specific shape of the body 110, but as Figure 1 shown, the body 110 may have a hexahedral shape or a shape similar to a hexahedral shape. Due to the shrinkage of the ceramic powder particles included in the body 110 during the sintering process, the body 110 may not have a completely straight hexahedral shape, but may generally have a hexahedral shape.

[0030] The body 110 may have a first surface 1 and a second surface 2 opposite to each other in the first direction, a third surface 3 and a fourth surface 4 connected to the first surface 1 and the second surface 2 and opposite to each other in a second direction, and a fifth surface 5 and a sixth surface 6 connected to the first surface to the fourth surface and opposite to each other in a third direction.

[0031] In the present disclosure, the first direction may represent the direction in which the inner electrode layer 121 and the floating electrode layer 122 are alternately arranged and the dielectric layer 111 is interposed between the inner electrode layer 121 and the floating electrode layer 122, that is, the stacking direction of the inner electrode layer 121, the floating electrode layer 122, and the dielectric layer 111. Additionally, the second direction may refer to the direction perpendicular to the first direction, and the third direction may represent the direction perpendicular to both the first direction and the second direction.

[0032] On the other hand, since the edge regions of the dielectric layer 111 without electrode patterns are stacked in the first direction, step differences may occur due to the thickness of the inner electrode layer. Correspondingly, the corners connecting the first surface 1 to the third to sixth surfaces and / or the corners connecting the second surface 2 to the third to sixth surfaces may have a shape that is centrally contracted in the first direction based on the first surface or the second surface facing the main body 110. Optionally, due to the shrinkage behavior during the sintering process of the main body, the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a shape that is centrally contracted in the first direction based on the first surface or the second surface facing the main body 110. Optionally, in order to prevent peeling defects, the corners connecting each surface of the main body 110 can be rounded by performing a separate process, such that the corners connecting the first surface 1 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 and / or the corners connecting the second surface 2 to the third surface 3, the fourth surface 4, the fifth surface 5, and the sixth surface 6 may have a rounded shape.

[0033] The dielectric layers 111 forming the main body 110 can be formed in multiple layers. In the state where the multiple dielectric layers 111 are sintered, adjacent dielectric layers 111 can be integrated, making it difficult to identify the boundary between adjacent dielectric layers 111 without using a scanning electron microscope (SEM). The number of stacked dielectric layers 111 is not particularly limited and can be determined considering the size of the multi-layer electronic component. For example, 400 or more dielectric layers can be stacked to form the main body.

[0034] The dielectric layer 111 can be formed by the following method: producing a ceramic slurry containing ceramic powder particles, an organic solvent, and a binder, coating the ceramic slurry on a carrier film and drying it to prepare a ceramic green sheet, and then sintering the ceramic green sheet. The ceramic powder particles are not particularly limited as long as sufficient electrostatic capacitance can be obtained therefrom. For example, barium titanate (BaTiO3)-based powder particles can be used as the ceramic powder particles. For a more specific example, the barium titanate (BaTiO3)-based powder particles may include one or more selected from the group consisting of BaTiO3, (Ba 1-x Ca x )TiO3 (0 < x < 1), Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), and Ba(Ti 1-y Zr y )O3 (0 < y < 1).

[0035] On the other hand, when using barium titanate (BaTiO3)-based powder particles as the raw material for forming the dielectric layer 111, the sintered dielectric layer 111 may include Ba and Ti.

[0036] The average thickness of the dielectric layer 111 is not particularly limited.

[0037] To achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the dielectric layer 111 may be 0.35 µm or less, and to improve the reliability of the multilayer electronic component 100 at high temperature and high voltage, the average thickness of the dielectric layer 111 may be 20 µm or more.

[0038] The average thickness of the dielectric layer 111 can be measured by an image obtained by scanning the cross-sections in the second direction and the first direction (L-T cross-section) of the main body 110 with a scanning electron microscope (SEM).

[0039] For example, the average thickness of the dielectric layer 111 can be obtained as follows: For each of a total of five dielectric layers in the dielectric layer extracted from an image obtained by scanning the cross-sections in the length direction and the thickness direction (L-T cross-section) cut from the center in the width direction of the main body 110 with a scanning electron microscope (SEM) (including the dielectric layer at the center in the thickness direction of the main body and two dielectric layers above and two dielectric layers below based on this dielectric layer), five points are equally spaced based on the point where the center line in the length direction of the main body intersects the center line in the thickness direction of the main body (i.e., the reference point determined based on this intersection point and two points to the left and two points to the right centered on the reference point), and then the thickness of each point is measured and averaged.

[0040] When a voltage is applied to the multilayer electronic component 100, due to the electrostrictive phenomenon in the dielectric layer, deformations such as contraction and expansion of the multilayer electronic component 100 may occur. When a high voltage is applied to the multilayer electronic component 100 or when using BaTiO3 as the material for the dielectric layer, the electrostrictive phenomenon may be further enhanced.

[0041] On the other hand, when a voltage is applied to the multilayer electronic component 100, the following deformations may occur: The multilayer electronic component 100 may expand in the first direction and may contract in the second and third directions. In addition, the stress caused by the deformation of the multilayer electronic component 100 may concentrate on the boundary between the region where the electrostatic capacitance is formed and the region where the electrostatic capacitance is not formed, which may cause cracks to occur in the multilayer electronic component 100.

[0042] Refer to Figure 6A, the inner electrode layer 121 may include a first electrode pattern 11 and a second electrode pattern 12. The first electrode pattern 11 is connected to the third surface 3, and the second electrode pattern 12 is spaced apart from the first electrode pattern 11 in the third direction and is connected to the fourth surface 4. In the present disclosure, "a certain electrode pattern is connected to a certain surface" means that the electrode pattern extends to the surface. Refer to Figure 6A and Figure 4 , the first electrode pattern 11 and the second electrode pattern 12 may be spaced apart from each other by a distance W1 in the third direction. The distance W1 by which the first electrode pattern 11 and the second electrode pattern 12 are spaced apart from each other in the third direction is not particularly limited. However, when the ratio of the distance W1 by which the first electrode pattern 11 and the second electrode pattern 12 are spaced apart from each other in the third direction to the widths of the edge portions 114 and 115 (i.e., the dimensions of the edge portions 114 and 115 in the third direction) is greater than 1 and less than 2.8, the stress remaining in the main body 110 can be minimized. In this case, Figure 6A the widths of the edge portions 114 and 115 shown in

[0043] may refer to the width in the third direction of the region between the two ends of the inner electrode layer 121 in the third direction and the fifth surface and the sixth surface. Figure 6B , the floating electrode layer 122 may include a third electrode pattern 13, and the third electrode pattern 13 is spaced apart from the third surface 3 and the fourth surface 4.

[0044] A capacitance may be formed in the region where the first electrode pattern 11 and the third electrode pattern 13 overlap each other in the first direction and in the region where the second electrode pattern 12 and the third electrode pattern 13 overlap each other in the first direction. Specifically, refer to Figure 4 , the region where the first electrode pattern 11 and the third electrode pattern 13 overlap each other in the first direction may be referred to as a first capacitance forming portion Ac1, and the region where the second electrode pattern 12 and the third electrode pattern 13 overlap each other in the first direction may be referred to as a second capacitance forming portion Ac2. The first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 may be spaced apart from each other in the third direction, and the region where the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 are spaced apart from each other in the third direction may include a region where no capacitance is formed. This may be the result of separating the capacitance forming portions in the third direction due to the first electrode pattern 11 and the second electrode pattern 12 being arranged to be spaced apart from each other in the third direction.

[0045] On the other hand, as a whole, this structure corresponds to a structure in which a plurality of capacitors are connected in series and then connected in parallel, which can achieve the effect of distributed voltage, thereby reducing the electrostriction phenomenon of the multilayer electronic component.

[0046] Refer to Figure 7, the main body 110 can be formed by repeatedly stacking the inner electrode layer and the floating electrode layer in the first direction with the dielectric layer 111 interposed therebetween. The covering portions 112 and 113 can be provided on the upper surface and the lower surface in the first direction of the region where the inner electrode layer and the floating electrode layer are repeatedly stacked in the first direction and the dielectric layer 111 is interposed between the inner electrode layer and the floating electrode layer.

[0047] There is no particular limitation on the material for forming the first electrode pattern 11, the second electrode pattern 12, and the third electrode pattern 13, and a material having excellent conductivity can be used. For example, the first electrode pattern 11, the second electrode pattern 12, and the third electrode pattern 13 can include at least one selected from the group consisting of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0048] The first electrode pattern 11, the second electrode pattern 12, and the third electrode pattern 13 can be formed by printing a conductive paste on a ceramic green sheet, and the printing method can be a screen printing method or a gravure printing method, but the present disclosure is not limited thereto.

[0049] There is no particular limitation on the average thickness of the inner electrode layer.

[0050] In order to achieve miniaturization and high capacitance of the multilayer electronic component 100, the average thickness of the inner electrode layer can be 0.35 µm or less, and in order to improve the reliability of the multilayer electronic component 100 at high temperature and high voltage, the average thickness of the inner electrode layer can be 3 µm or more.

[0051] The method for measuring the average thickness of the inner electrode layer is not particularly limited. For example, the average thickness of the inner electrode layer can be obtained as follows: for each of a total of five inner electrode layers in the inner electrode layer extracted from an image of a width direction and thickness direction cross-section (W-T cross-section) cut from the center in the length direction of the main body 110 (including the inner electrode layer at the center in the thickness direction in each of the capacitance forming portions Ac1 and Ac2 and two inner electrode layers upward and two inner electrode layers downward based on this inner electrode layer), five points are equally spaced based on the point where the center line in the width direction and the center line in the thickness direction of each of the capacitance forming portions Ac1 and Ac2 intersect (that is, the reference point determined based on this intersection point and two points to the left and two points to the right centered on the reference point), and then the thickness of each point is measured and averaged.

[0052] Refer to Figures 2 to 4 , the main body 110 can include covering portions 112 and 113 provided above and below the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 in the first direction.

[0053] The covering parts 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on the upper and lower surfaces of the first capacitor forming part Ac1 and the second capacitor forming part Ac2 respectively in the thickness direction (the first direction), and can be substantially used to prevent damage to the internal electrode due to physical stress and / or chemical stress.

[0054] The covering parts 112 and 113 do not include internal electrodes and can include the same dielectric material as that of the dielectric layer 111. That is to say, the covering parts 112 and 113 can include ceramic materials, for example, barium titanate (BaTiO3)-based ceramic materials.

[0055] In addition, the thickness of the covering parts 112 and 113 does not need to be particularly limited. For example, the average thickness of the covering parts 112 and 113 can be 10 µm to 300 µm. The average thickness of the covering parts 112 and 113 can refer to the dimension in the first direction and can be a value obtained by averaging the dimensions in the first direction of the covering parts 112 or 113 measured at five points equidistantly spaced from each other above or below the first capacitor forming part Ac1, the second capacitor forming part Ac2, and the non-capacitor forming part.

[0056] The edge parts 114 and 115 can be provided on one side surface of the first capacitor forming part Ac1 and one side surface of the second capacitor forming part Ac2.

[0057] Referring to Figure 4 , the edge parts 114 and 115 can be provided on two outer side surfaces of the first capacitor forming part Ac1 and the second capacitor forming part Ac2 that face away from each other in the width direction. Specifically, the edge parts 114 and 115 can include a first edge part 114 and a second edge part 115. The first edge part 114 is provided on the side surface of the first capacitor forming part Ac1 that is far from the second capacitor forming part Ac2 in the third direction, and the second edge part 115 is provided on the side surface of the second capacitor forming part Ac2 that is far from the first capacitor forming part Ac1 in the third direction.

[0058] As Figure 3 , Figure 4 , Figure 5A and Figure 5B shown, the edge parts 114 and 115 can refer to: in the cross section obtained by cutting the main body 110 in the width direction - thickness direction, the regions between the two ends of the internal electrode layer 121 or the floating electrode layer 122 in the third direction and the outer surface of the main body 110.

[0059] The edge parts 114 and 115 can be substantially used to prevent damage to the internal electrode due to physical stress and / or chemical stress.

[0060] The edge portions 114 and 115 can be formed by not coating the conductive paste in the regions of the green ceramic sheet where the edge portions are to be formed when coating the conductive paste on the green ceramic sheet to form the first electrode pattern to the third electrode pattern.

[0061] In addition, in order to suppress the step difference, the edge portions 114 and 115 can be formed by, after stacking the dielectric layer 111, the inner electrode layer 121, and the floating electrode layer 122 to obtain a stacked body, cutting the stacked body so that the inner electrode layer 121 and the floating electrode layer 122 are exposed on two outer surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 that face each other in the third direction (width direction), and stacking a single dielectric layer or two or more dielectric layers on the two outer surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 that face each other in the third direction (width direction) in the third direction (width direction).

[0062] In addition, the widths of the edge portions 114 and 115 do not need to be particularly limited. For example, the widths of the edge portions 114 and 115 can be 5 µm to 300 µm.

[0063] The average widths of the edge portions 114 and 115 can refer to the average third direction dimensions of the regions where the inner electrode layer is spaced apart from the fifth surface and the average third direction dimensions of the regions where the inner electrode layer is spaced apart from the sixth surface, and can be values obtained by averaging the third direction dimensions of the edge portions 114 and 115 measured at five points equidistantly spaced from each other in the first direction on the side surfaces of the first capacitance forming portion Ac1 and the second capacitance forming portion Ac2 as described above.

[0064] The outer electrodes 130 and 140 can be provided on the third surface 3 and the fourth surface 4 of the main body 110.

[0065] The outer electrodes 130 and 140 can include a first outer electrode 130 and a second outer electrode 140 that are respectively provided on the third surface 3 and the fourth surface 4 of the main body 110 and are respectively connected to the first electrode pattern 11 and the second electrode pattern 12. Specifically, the first outer electrode 130 can be provided on the third surface 3 and connected to the first electrode pattern 11, and the second outer electrode 140 can be provided on the fourth surface 4 and connected to the second electrode pattern 12.

[0066] Although the exemplary embodiments of the present disclosure describe the structure of the multilayer electronic component 100 having two outer electrodes 130 and 140, the number and / or shape of the outer electrodes 130 and 140 can be changed according to the shape of the inner electrode layer and / or other purposes.

[0067] On the other hand, the outer electrodes 130 and 140 can be formed of any material such as metal as long as they have conductivity, and the specific material can be determined in consideration of electrical characteristics, structural stability, etc., and the outer electrodes 130 and 140 can also have a multilayer structure.

[0068] For example, the outer electrodes 130 and 140 may include an electrode layer provided on the main body 110 and a plating layer formed on the electrode layer.

[0069] For a more specific example of the electrode layer, the electrode layer may be a sintered electrode layer including a conductive metal and glass, or may be a resin-based electrode layer including a conductive metal and resin.

[0070] In addition, the electrode layer may have a form in which a sintered electrode layer and a resin-based electrode layer are sequentially formed on the main body. In addition, the electrode layer may be formed by transferring a sheet including a conductive metal to the main body, or may be formed by transferring a sheet including a conductive metal to the sintered electrode layer. In addition, the electrode layer may be formed as a plating layer, or may be a layer formed by using a deposition method such as a sputtering method or an atomic layer deposition (ALD) method.

[0071] The conductive metal included in the outer electrode layer may include a metal material having excellent conductivity and is not particularly limited. For example, the conductive metal may include one or more of nickel (Ni), copper (Cu), and their alloys.

[0072] The plating layer is used to improve the mounting characteristics. The type of the plating layer is not particularly limited, and may be a plating layer including one or more selected from the group consisting of Ni, Sn, Pd, and their alloys, and the plating layer may be formed of multiple layers.

[0073] For a more specific example of the plating layer, the plating layer may include a Ni plating layer or a Sn plating layer, or may be in a form in which a Ni plating layer and a Sn plating layer are sequentially formed on the electrode layer, or may be in a form in which a Sn plating layer, a Ni plating layer, and a Sn plating layer are sequentially formed. In addition, the plating layer may include multiple Ni plating layers and / or multiple Sn plating layers. In addition, the plating layer may be in a form in which a Ni plating layer and a Pd plating layer are sequentially formed on the electrode layer.

[0074] The size of the multilayer electronic component 100 does not need to be particularly limited. Since the multilayer electronic component 100 according to the present disclosure is advantageous for miniaturization and high capacitance, the multilayer electronic component 100 can be applied to small IT products, and since the multilayer electronic component 100 according to the present disclosure can ensure high reliability in various environments, the multilayer electronic component 100 can be applied to automotive electrical products that require high reliability.

[0075] Refer to Figure 5A, the multi-layer electronic component according to the comparative example includes: an inner electrode layer including a first electrode pattern 11' and a second electrode pattern 12' that are spaced apart from each other in a second direction and not spaced apart from each other in a third direction; and a floating electrode layer 13'. Additionally, in Figure 5A the illustration of the dielectric layer provided between the inner electrode layer and the floating electrode layer is omitted.

[0076] In the case of the multi-layer electronic component according to the comparative example, when a voltage is applied, stress may concentrate at the corners where electrode patterns of different polarities are stacked on top of each other, and the region where this stress concentration occurs is denoted as P' in Figure 5A .

[0077] When a voltage is applied to the multi-layer electronic component according to the comparative example, an electric field is formed in the first direction in the region where the first electrode pattern 11' and the floating electrode layer 13' are stacked on top of each other in the first direction, and an electric field is formed in the first direction in the region where the second electrode pattern 12' and the floating electrode layer 13' are stacked on top of each other in the first direction. Therefore, stress concentration region P' may be formed due to stress concentration at the interfaces between the capacitance forming portion and the edge portion and between the capacitance forming portion and the non-capacitance forming portion.

[0078] Referring to Figure 5B , the multi-layer electronic component according to the inventive example includes: an inner electrode layer 121 including a first electrode pattern 11 and a second electrode pattern 12 that are spaced apart in a second direction and spaced apart in a third direction; and a floating electrode layer 122. Additionally, in Figure 5B the illustration of the dielectric layer provided between the inner electrode layer and the floating electrode layer is omitted.

[0079] In Figure 5B the stress concentration region is denoted as P. Referring to Figure 5B , it can be confirmed that the distribution of the stress concentration region P is different from Figure 5A the distribution of the stress concentration region P'.

[0080] It can be expected that the difference in stress distribution is caused by the fact that the first electrode pattern 11' and the second electrode pattern 12' of the inner electrode layer of the multi-layer electronic component according to the comparative example are only spaced apart from each other in the second direction, while the first electrode pattern 11 and the second electrode pattern 12 of the inner electrode layer of the multi-layer electronic component according to the inventive example are spaced apart in the second direction and spaced apart from each other in the third direction.

[0081] Additionally, the multi-layer electronic component according to an exemplary embodiment of the present disclosure and the multi-layer electronic component according to another exemplary embodiment of the present disclosure can cancel out the action on Figure 5BThe stress on the stress concentration region P shown in

[0082] Specifically, referring to Figure 6B , the floating electrode layer 122 of the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure may include: a third electrode pattern 13 spaced apart from the third surface 3 and the fourth surface 4; a fourth electrode pattern 14 spaced apart from the third electrode pattern and connected to the third surface 3; and a fifth electrode pattern 15 spaced apart from the third electrode pattern 13 and connected to the fourth surface 4.

[0083] When the floating electrode layer 122 includes a third electrode pattern 13 spaced apart from the third surface 3 and the fourth surface 4, a fourth electrode pattern 14 spaced apart from the third electrode pattern 13 and connected to the third surface 3, and a fifth electrode pattern 15 spaced apart from the third electrode pattern 13 and connected to the fourth surface 4, an electric field in the second direction component may be formed between the third electrode pattern 13 and the fourth electrode pattern 14 and between the third electrode pattern 13 and the fifth electrode pattern 15. Additionally, as will be described later, an electric field in the second direction component may be formed between the first main body portion 11a and the second connection portion 12b and between the second main body portion 12a and the first connection portion 11b, and an electric field in the third direction component may be formed between the first main body portion 11a and the second main body portion 12a.

[0084] Therefore, compared with the conventional case where the floating electrode layer 122 only includes the third electrode pattern 13 separated from the third surface 3 and the fourth surface 4 such that tensile stress is concentrated in the first direction and compressive stress is concentrated in the second and third directions, since the multi-layer electronic component 100 according to an exemplary embodiment of the present disclosure can generate compressive stress in the first direction and can generate tensile stress in the second and third directions, the stress acting on Figure 5B the stress concentration region P shown in can be offset, thereby improving the reliability (including BDV characteristics) of the multi-layer electronic component 100.

[0085] In some exemplary embodiments, the first electrode pattern 11 may be spaced apart from the fourth surface 4, and the second electrode pattern 12 may be spaced apart from the third surface 3. Therefore, the first electrode pattern 11 and the second electrode pattern 12 may have different polarities.

[0086] In some exemplary embodiments, the first electrode pattern 11 and the second electrode pattern 12 may be spaced apart from the fifth surface 5 and the sixth surface 6, and the third electrode pattern 13, the fourth electrode pattern 14, and the fifth electrode pattern 15 may be spaced apart from the fifth surface 5 and the sixth surface 6. Therefore, the inner electrode layer 121 and the floating electrode layer 122 may not be exposed to the side surfaces of the main body 110 that face each other in the third direction, thereby improving the moisture resistance reliability of the multi-layer electronic component 100.

[0087] In some exemplary embodiments, the first electrode pattern 11 may include a first connection portion 11b and a first main portion 11a. The first connection portion 11b is in contact with the first external electrode 130. The first main portion 11a extends from the first connection portion 11b in a second direction, but is longer than the first connection portion 11b in the second direction and narrower than the first connection portion 11b in a third direction. And the second electrode pattern 12 may include a second connection portion 12b and a second main portion 12a. The second connection portion 12b is in contact with the second external electrode 140. The second main portion 12a extends from the second connection portion 12b in the second direction, but is longer than the second connection portion 12b in the second direction and narrower than the second connection portion 12b in the third direction.

[0088] The first connection portion 11b and the second connection portion 12b may respectively refer to the regions in contact with the first external electrode 130 and the second external electrode 140. Additionally, the first connection portion 11b and the second connection portion 12b may not overlap with the third electrode pattern 13 in a first direction.

[0089] At least a part of the first main portion 11a and at least a part of the second main portion 12a may respectively overlap with a part of the third electrode pattern 13 in the first direction, thereby forming a capacitance.

[0090] In addition, the first main portion 11a extends from the first connection portion 11b in the second direction, but has a length in the second direction that is longer than the first connection portion 11b and a width in the third direction that is narrower than the first connection portion 11b. And the second main portion 12a extends from the second connection portion 12b in the second direction, but has a length in the second direction that is longer than the second connection portion 12b and a width in the third direction that is narrower than the second connection portion 12b, such that an electric field component in the second direction can be formed between the first main portion 11a and the second connection portion 12b and an electric field component in the third direction can be formed between the first main portion 11a and the second main portion 12a.

[0091] Therefore, compared with Figure 5A the conventional case where the inner electrode layer shown in [reference] includes a first electrode pattern 11' connected to the third surface 3 and a second electrode pattern 12' connected to the fourth surface, which are spaced apart from each other in the second direction, and the lengths and widths of the main portion and the connection portion are generally constant, the multi-layer electronic component 100 according to the present embodiment can cancel the stress applied to the stress concentration region, thereby improving the reliability (including BDV characteristics) of the multi-layer electronic component 100.

[0092] On the other hand, in the case where the floating electrode layer 122 includes a third electrode pattern 13 spaced apart from the third surface 3 and the fourth surface 4, a fourth electrode pattern 14 spaced apart from the third electrode pattern 13 and connected to the third surface 3, and a fifth electrode pattern 15 spaced apart from the third electrode pattern 13 and connected to the fourth surface 4, the first electrode pattern 11 includes a first connection portion 11b in contact with the first outer electrode 130 and a first main portion 11a extending from the first connection portion 11b in the second direction but longer than the first connection portion 11b in the second direction and narrower than the first connection portion 11b in the third direction, and the second electrode pattern 12 includes a second connection portion 12b in contact with the second outer electrode 140 and a second main portion 12a extending from the second connection portion 12b in the second direction and longer than the second connection portion 12b in the second direction and narrower than the second connection portion 12b in the third direction, an effect of offsetting stress can be obtained in each of the inner electrode layer 121 and the floating electrode layer 122, so that the improvement effect of the reliability (including the BDV characteristic) of the multilayer electronic component 100 according to the present disclosure can be more remarkable.

[0093] In addition, the first main portion 11a may be spaced apart from the second connection portion 12b in the second direction, and the second main portion 12a may be spaced apart from the first connection portion 11b in the second direction. Therefore, the first electrode pattern 11 and the second electrode pattern 12 may also be spaced apart from each other in the second direction. In this case, when the distance in the second direction between the first main portion and the fourth surface is referred to as LM1, the distance in the second direction between the first main portion and the second connection portion is referred to as L1, the distance in the second direction between the second main portion and the third surface is referred to as LM2, and the distance in the second direction between the second main portion and the first connection portion is referred to as L2, if L1 / LM1 is less than 1 / 8, or if L2 / LM2 is less than 1 / 8, a short circuit may occur between the first electrode pattern 11 and the second electrode pattern 12, and if L1 / LM1 is greater than 1 / 3, or if L2 / LM2 is greater than 1 / 3, the bonding strength between the first connection portion 11b and the first outer electrode 130 and the bonding strength between the second connection portion 12b and the second outer electrode 140 may be weakened. Therefore, in the exemplary embodiment, L1 / LM1 may satisfy being greater than or equal to 1 / 8 and less than or equal to 1 / 3, and L2 / LM2 may satisfy being greater than or equal to 1 / 8 and less than or equal to 1 / 3. Thus, a short circuit between the first electrode pattern 11 and the second electrode pattern 12 can be prevented, and sufficient bonding strength between the connection portions 11b and 12b and the outer electrodes 130 and 140 can be ensured.

[0094] There is no particular limitation on the method for measuring each of the second-direction distances LM1 between the first main body portion and the fourth surface, the second-direction distance L1 between the first main body portion and the second connection portion, the second-direction distance LM2 between the second main body portion and the third surface, and the second-direction distance L2 between the second main body portion and the first connection portion.

[0095] In the first-direction and second-direction cross sections polished to the 1 / 4 position of the multilayer electronic component in the third direction such that the first main body portion 11a and the second connection portion 12b are simultaneously exposed, L1 and LM1 can be: the average values of the corresponding values measured by a scanning electron microscope (SEM) or an optical microscope (OP) in the inner electrode layers of two or more layers disposed in the upper part in the first direction and the inner electrode layers of two or more layers disposed in the lower part in the first direction, based on the first main body portion 11a centered in the first direction.

[0096] In the first-direction and second-direction cross sections polished to the 3 / 4 position of the multilayer electronic component in the third direction such that the second main body portion 12a and the first connection portion 11b are simultaneously exposed, L2 and LM2 can be: the average values of the corresponding values measured by a scanning electron microscope (SEM) or an optical microscope (OP) in the inner electrode layers of two or more layers disposed in the upper part in the first direction and the inner electrode layers of two or more layers disposed in the lower part in the first direction, based on the second main body portion 12a centered in the first direction.

[0097] In the exemplary embodiment, the corners of the first main body portion and the corners of the second main body portion may have a rounded shape, and the corners of the third electrode pattern may have a rounded shape. Accordingly, the phenomenon of stress concentration at specific positions of the electrode pattern can be alleviated. Therefore, the improvement effect of the reliability (including the BDV characteristic) of the multilayer electronic component 100 according to the exemplary embodiment of the present disclosure can be further enhanced.

[0098] In the exemplary embodiment, the dielectric layer 111 may include Ba and Ti. When the dielectric layer 111 is formed of a paraelectric dielectric corresponding to Class I of the Electronic Industries Association (EIA), even when a voltage is applied, the electrostrictive phenomenon may occur slightly or rarely. When the dielectric layer 111 is formed of a ferroelectric dielectric corresponding to EIA Class II, for example, when the dielectric layer 111 includes Ba and Ti, deformation due to the electrostrictive phenomenon may occur to a measurable degree, and such deformation may cause stress to be generated inside the multilayer electronic component 100.

[0099] In addition, according to an exemplary embodiment of the present disclosure, even when the dielectric layer 111 includes Ba and Ti, the stress applied to the region where stress is concentrated can be cancelled out. That is, when the dielectric layer 111 includes Ba and Ti, the improvement effect of the reliability (including BDV characteristics) according to the exemplary embodiment of the present disclosure can be more significant.

[0100] Hereinafter, a multilayer electronic component 100 according to another exemplary embodiment of the present disclosure will be described, but descriptions overlapping with those of the multilayer electronic component 100 according to the above-described embodiment of the present disclosure will be omitted.

[0101] Various examples of the multilayer electronic component according to some exemplary embodiments of the present disclosure can also be applied to the multilayer electronic component according to another exemplary embodiment of the present disclosure to be described below.

[0102] The floating electrode layer 122 of the multilayer electronic component 100 according to another exemplary embodiment of the present disclosure may include a third electrode pattern 13 spaced apart from the third surface 3 and the fourth surface 4. The first electrode pattern 11 may include a first connection portion 11b in contact with the first external electrode 130 and a first main portion 11a extending from the first connection portion 11b in the second direction but longer than the first connection portion 11b in the second direction and narrower than the first connection portion 11b in the third direction. The second electrode pattern 12 may include a second connection portion 12b in contact with the second external electrode 140 and a second main portion 12a extending from the second connection portion 12b in the second direction but longer than the second connection portion 12b in the second direction and narrower than the second connection portion 12b in the third direction.

[0103] The first connection portion 11b and the second connection portion 12b may respectively refer to regions in contact with the first external electrode 130 and the second external electrode 140. In addition, the first connection portion 11b and the second connection portion 12b may not overlap the third electrode pattern 13 in the first direction.

[0104] At least a part of the first main portion 11a and at least a part of the second main portion 12a may overlap a part of the third electrode pattern 13 in the first direction to form an electrostatic capacitance.

[0105] In addition, the first main body portion 11a may extend from the first connecting portion 11b in the second direction, but may be longer than the first connecting portion 11b in the second direction and narrower than the first connecting portion 11b in the third direction, and the second main body portion 12a may extend from the second connecting portion 12b in the second direction, but may be longer than the second connecting portion 12b in the second direction and narrower than the second connecting portion 12b in the third direction, such that an electric field in the second direction component can be formed between the first main body portion 11a and the second connecting portion 12b and an electric field in the third direction component can be formed between the first main body portion 11a and the second main body portion 12a.

[0106] Therefore, compared with Figure 5A the conventional case where the inner electrode layer shown in includes the first electrode pattern 11' connected to the third surface 3 and the second electrode pattern 12' connected to the fourth surface which are spaced apart from each other in the second direction and the lengths and widths of the main body portion and the connecting portion are substantially constant, the multi-layer electronic component 100 according to the present embodiment can cancel the stress applied to the stress concentration region, thereby improving the reliability (including the BDV characteristic) of the multi-layer electronic component 100.

[0107] Although the exemplary embodiments of the present disclosure have been described in detail above, the scope of the present disclosure is not limited to the above embodiments and the drawings, but is defined by the appended claims. Therefore, those of ordinary skill in the art can make various substitutions, modifications or variations without departing from the scope of the present disclosure defined by the appended claims, and these substitutions, modifications or variations should be construed as being included within the scope of the present disclosure.

[0108] In addition, the expression "exemplary embodiment" used in the present disclosure does not mean the same exemplary embodiment, but is provided to emphasize and explain different characteristics. The embodiments presented above do not exclude the implementation of combinations of features with another embodiment. For example, although the content described in a specific embodiment is not described in another embodiment, unless there is a description contrary to or contradictory to the content in another embodiment, the content can be understood as a description related to another embodiment.

[0109] In the present disclosure, the terms are only used to describe specific embodiments and are not intended to limit the present disclosure. Unless otherwise clearly specified in the context, the singular form may also include the plural form.

Claims

1. A multilayer electronic component comprising: a body, comprising a dielectric layer, an inner electrode layer and a floating electrode layer, the inner electrode layer and the floating electrode layer being alternately arranged in a first direction, the dielectric layer being interposed between the inner electrode layer and the floating electrode layer, and the body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the third direction; as well as At least two external electrodes are respectively arranged on the third surface and the fourth surface, wherein the inner electrode layer comprises a first electrode pattern and a second electrode pattern, the first electrode pattern being connected to the third surface, the second electrode pattern being spaced apart from the first electrode pattern in the third direction and connected to the fourth surface, and The floating electrode layer includes a third electrode pattern, a fourth electrode pattern, and a fifth electrode pattern, the third electrode pattern being spaced apart from the third surface and the fourth surface, the fourth electrode pattern being spaced apart from the third electrode pattern and connected to the third surface, and the fifth electrode pattern being spaced apart from the third electrode pattern and connected to the fourth surface.

2. The multilayer electronic component according to claim 1, wherein The first electrode pattern is spaced apart from the fourth surface, and the second electrode pattern is spaced apart from the third surface.

3. The multilayer electronic component according to claim 1, wherein: The first, second, third, fourth, and fifth electrode patterns are spaced apart from the fifth and sixth surfaces of the body.

4. The multilayer electronic component according to claim 1, wherein: The first electrode pattern includes: a first connection portion contacting one of the external electrodes located on the third surface; and a first body portion extending from the first connection portion along the second direction and having a length longer than the first connection portion in the second direction and a width narrower than the first connection portion in the third direction, and The second electrode pattern includes: a second connecting portion, which contacts the external electrode located on the fourth surface among the external electrodes; and a second main body portion, which extends from the second connecting portion along the second direction and has a length longer than the second connecting portion in the second direction and a width narrower than the second connecting portion in the third direction.

5. The multilayer electronic component according to claim 4, wherein: The first body portion is spaced apart from the second connection portion in the second direction, and the second body portion is spaced apart from the first connection portion in the second direction, and When the second direction distance between the first body portion and the fourth surface is referred to as LM1 and the second direction distance between the first body portion and the second connection portion is referred to as L1, and When the second direction distance between the second main body portion and the third surface is referred to as LM2 and the second direction distance between the second main body portion and the first connection portion is referred to as L2, L1 / LM1 satisfies greater than or equal to 1 / 8 and less than or equal to 1 / 3, and L2 / LM2 satisfies the condition that it is greater than or equal to 1 / 8 and less than or equal to 1 / 3.

6. The multilayer electronic component according to claim 4, wherein: The corners of the first body portion and the corners of the second body portion have a rounded shape, and Corners of the third electrode pattern have a rounded shape.

7. The multilayer electronic component according to claim 1, wherein: The dielectric layer includes Ba and Ti.

8. The multilayer electronic component according to claim 1, wherein The average thickness of the dielectric layer is 20 μm or more, or 0.35 μm or less.

9. A multilayer electronic component comprising: a body, comprising a dielectric layer and an inner electrode layer and a floating electrode layer, the inner electrode layer and the floating electrode layer being alternately arranged in a first direction, the dielectric layer being interposed between the inner electrode layer and the floating electrode, and the body having a first surface and a second surface opposite to each other in the first direction, a third surface and a fourth surface connected to the first surface and the second surface and opposite to each other in the second direction, and a fifth surface and a sixth surface connected to the first surface to the fourth surface and opposite to each other in the third direction; as well as At least two external electrodes are respectively arranged on the third surface and the fourth surface, The inner electrode layer includes a first electrode pattern and a second electrode pattern, the first electrode pattern is connected to the third surface, and the second electrode pattern is spaced apart from the first electrode pattern in the third direction and connected to the fourth surface. The floating electrode layer includes a third electrode pattern, the third electrode pattern is spaced apart from the third surface and the fourth surface, The first electrode pattern includes a first connection portion and a first main portion, the first connection portion contacts one of the external electrodes located on the third surface, the first main portion extends from the first connection portion along the second direction and has a length longer than the first connection portion in the second direction and a width narrower than the first connection portion in the third direction, and The second electrode pattern includes a second connecting portion and a second main body portion, the second connecting portion contacts the external electrode located on the fourth surface among the external electrodes, the second main body portion extends from the second connecting portion along the second direction and has a length longer than the second connecting portion in the second direction and a width narrower than the second connecting portion in the third direction.

10. The multilayer electronic component according to claim 9, wherein The first electrode pattern is spaced apart from the fourth surface, and the second electrode pattern is spaced apart from the third surface.

11. The multilayer electronic component according to claim 9, wherein The first electrode pattern and the second electrode pattern are spaced apart from the fifth surface and the sixth surface, and The third electrode pattern is spaced apart from the fifth surface and the sixth surface.

12. The multilayer electronic component according to claim 9, wherein The first body portion is spaced apart from the second connection portion in the second direction, and the second body portion is spaced apart from the first connection portion in the second direction, and When the second direction distance between the first body portion and the fourth surface is referred to as LM1 and the second direction distance between the first body portion and the second connection portion is referred to as L1, and When the second direction distance between the second main body portion and the third surface is referred to as LM2 and the second direction distance between the second main body portion and the first connection portion is referred to as L2, L1 / LM1 satisfies greater than or equal to 1 / 8 and less than or equal to 1 / 3, and L2 / LM2 satisfies the condition that it is greater than or equal to 1 / 8 and less than or equal to 1 / 3.

13. The multilayer electronic component according to claim 9, wherein: The corners of the first body portion and the corners of the second body portion have a rounded shape, and Corners of the third electrode pattern have a rounded shape.

14. The multilayer electronic component according to claim 9, wherein: The dielectric layer includes Ba and Ti.

15. The multilayer electronic component according to claim 9, wherein The average thickness of the dielectric layer is 20 μm or more, or 0.35 μm or less.

16. The multilayer electronic component according to claim 9, wherein The first electrode pattern and the second electrode pattern are spaced apart from the fifth surface and the sixth surface in the third direction, and a ratio of a distance between the first electrode pattern and the second electrode pattern in the third direction and a distance between the first electrode pattern and the second electrode pattern in the third direction and the fifth surface and the sixth surface is greater than 1 and less than 2.8.

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