AOI detection mechanism of die bonder

Abstract

The invention relates to the technical field of die bonders, in particular to an AOI detection mechanism of a die bonder, which comprises a workbench, a transmission assembly and an AOI detection assembly, a first vertical frame and a second vertical frame are arranged on the workbench, a limiting plate is arranged at the tail end of the first vertical frame, a Y-axis displacement mechanism is arranged on the limiting plate, and a Y-axis displacement mechanism is arranged on the Y-axis displacement mechanism. A first connecting plate is arranged at the output end of the Y-axis displacement mechanism, a second connecting plate is arranged on the outer side of the AOI detection assembly, the front end of the first connecting plate is connected with the second connecting plate, and the AOI detection assembly comprises a camera, a lens group, a light source and an annular light source. The AOI detection assembly can realize high-precision detection, particularly greatly enhances the recognition capability for fine defects, ensures the high-quality standard of a final product, is simple and compact in structure, reduces complex assembly parts, improves the flexibility of equipment and widens the application range, is skillfully arranged at the tail end of the top of the transmission assembly, and is convenient to use. The space is saved, and the overall integration level of the equipment is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of die bonders, and particularly to an AOI detection mechanism for a die bonder. Background Art

[0002] With the continuous improvement of the requirements for product quality and production efficiency in the electronic manufacturing industry, traditional manual quality inspection methods have been difficult to meet the needs of modern production. Especially in the field of semiconductor packaging, the die bonder, as one of the key devices, plays a crucial role in the chip packaging process. However, traditional die bonders lack efficient automated detection means, resulting in low production efficiency and unstable product quality.

[0003] Most existing die bonders rely on manual inspection or simple mechanical detection devices to ensure the accuracy of chip mounting. This not only increases the labor cost, but also due to the existence of human factors, false judgments and missed detections are likely to occur, affecting the quality of the final product. In addition, although some detection schemes using basic photoelectric sensors can improve the detection efficiency to a certain extent, their detection accuracy is limited and cannot meet the identification requirements for subtle defects. Summary of the Invention

[0004] The present invention aims to at least solve the technical problems existing in the prior art. For this purpose, the present invention provides an AOI detection mechanism for a die bonder, which has the characteristics of simple structure, easy adjustment, high integration, etc., and can effectively achieve precise detection of chips.

[0005] An AOI detection mechanism for a die bonder according to some embodiments of the present invention includes a workbench, a transmission assembly, and an AOI detection assembly. A first vertical frame and a second vertical frame are provided on the workbench. A limit plate is provided at the end of the first vertical frame. A Y-axis displacement mechanism is provided on the limit plate. A first connecting plate is provided at the output end of the Y-axis displacement mechanism. A second connecting plate is provided outside the AOI detection assembly. The front end of the first connecting plate is connected to the second connecting plate. The AOI detection assembly includes a camera, a lens group, a light source, and an annular light source. The camera, the lens group, the light source, and the annular light source are arranged in sequence from top to bottom. The transmission assembly is provided on the second vertical frame. The AOI detection assembly is provided at the top end of the tail of the transmission assembly.

[0006] An AOI detection mechanism for a die bonder according to some embodiments of the present invention has at least the following beneficial effects:

[0007] Through integrating a high-resolution camera, an optimally designed lens group, and an appropriate light source, this AOI detection mechanism can achieve high-precision detection. In particular, its ability to identify minute defects is greatly enhanced, ensuring the high-quality standards of the final products. The design of this detection mechanism takes into account the convenience in actual production. Its structure is simple and compact, reducing complex assembly components. The configuration of the Y-axis displacement mechanism and the connecting plate enables the AOI detection component to be precisely position-adjusted as needed to adapt to the detection requirements of chips of different specifications, enhancing the flexibility and applicable range of the equipment. The entire AOI detection component is ingeniously placed at the top end of the transmission component and is stably installed through the connection of the first connecting plate and the second connecting plate, saving space and improving the overall integration of the equipment.

[0008] For an AOI detection mechanism of a die bonder according to some embodiments of the present invention, a first fixing plate, a second fixing plate, a third fixing plate, and a fourth fixing plate are sequentially arranged on the second connecting plate from top to bottom. The camera is connected to the first fixing plate, the lens group is connected to the second fixing plate, the light source is connected to the third fixing plate, and the annular light source is connected to the fourth fixing plate.

[0009] For an AOI detection mechanism of a die bonder according to some embodiments of the present invention, a driving motor is arranged on the top of the second connecting plate. A lead screw is arranged at the output end of the driving motor. A lead screw nut is sleeved on the lead screw. A third connecting plate is arranged on the outer circumference of the lead screw nut. A fifth fixing plate is arranged on the outer side of the bottom of the third connecting plate. An air spraying pipe is arranged on the fifth fixing plate. A flexible pipe is arranged on the top of the air spraying pipe.

[0010] For an AOI detection mechanism of a die bonder according to some embodiments of the present invention, a side plate is arranged on the outer side of the first connecting plate. A slide rail is arranged on the outer side of the Y-axis displacement mechanism. A slider is arranged on the inner side of the side plate. The slider is slidably connected to the slide rail.

[0011] For an AOI detection mechanism of a die bonder according to some embodiments of the present invention, a code reader is arranged on the outer bottom of the Y-axis displacement mechanism. A coding scale is arranged on the outer bottom of the side plate. The code reader and the coding scale are correspondingly arranged. Two photoelectric switches are arranged on the outer bottom of the Y-axis displacement mechanism.

[0012] An AOI detection mechanism of a die bonder according to some embodiments of the present invention. The transfer mechanism includes a frame, a linear drive mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is provided at the front end of the frame, and a second connecting frame is provided at the front end of the first connecting frame. A first avoidance space is provided between the frame and the first connecting frame, and a second avoidance space is provided between the first connecting frame and the second connecting frame. The linear drive mechanism is disposed on the top of the frame, and the output end of the linear drive mechanism is connected to the lifting mechanism. The lifting mechanism is located within the first avoidance space, and the output end of the lifting mechanism is connected to the lifting platform. A connecting portion is provided at the rear end of the lifting platform, and a first avoidance groove is provided at the top of the connecting portion. The first connecting frame is located within the first avoidance groove, and the front end of the lifting platform extends into the second avoidance space.

[0013] An AOI detection mechanism of a die bonder according to some embodiments of the present invention. A first fixing plate is provided at the output end of the lifting mechanism, and a second fixing plate is provided at the bottom of the first fixing plate. Positioning blocks are provided on both sides of the rear end of the lifting platform, and a positioning groove is provided between the two positioning blocks. The bottom of the second fixing plate is connected to the bottom of the positioning groove.

[0014] An AOI detection mechanism of a die bonder according to some embodiments of the present invention. Gas connection ports are provided on the positioning blocks. First gas flow channels are provided at the left and right ends of the connecting portion. A second gas flow channel is provided at the rear end of the lifting platform. The second gas flow channel, a receiving space is provided in the middle of the lifting platform, and a plurality of receiving grooves are provided on the top of the lifting platform. The gas connection ports, the first gas flow channels, the second gas flow channel, the receiving space, and the receiving grooves are sequentially connected, and the receiving grooves are arranged in an array.

[0015] An AOI detection mechanism of a die bonder according to some embodiments of the present invention. The second gas flow channel is horizontally arranged, and the two first gas flow channels are respectively connected to the two ends of the second gas flow channel. A long strip-shaped notch is provided at the top of the first gas flow channel, and the receiving space is connected to the second gas flow channel through the notch.

[0016] An AOI detection mechanism of a die bonder according to some embodiments of the present invention. The dispensing function head and the height measuring function head are both located at the top of the second avoidance space.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, become apparent in part from the following description, or be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and be readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

[0019] Figure 1 It is a schematic structural diagram of an embodiment of the present invention.

[0020] Figure 2 It is a schematic structural diagram of the AOI detection component of the embodiment of the present invention Figure 1 。

[0021] Figure 3 It is a schematic structural diagram of the AOI detection component of the embodiment of the present invention Figure 2 。

[0022] Figure 4 It is a schematic structural diagram of the transmission component of the embodiment of the present invention.

[0023] Figure 5 It is a side view of the transmission component of the embodiment of the present invention.

[0024] Figure 6 It is a schematic structural diagram of the lifting mechanism of the embodiment of the present invention.

[0025] Figure 7 It is a cross-sectional view of the lifting mechanism of the embodiment of the present invention.

[0026] Figure 8 is Figure 7 an enlarged view of part A in

[0027] Reference numerals: 1, workbench; 2, transmission component; 3, AOI detection component; 4, first vertical frame; 5, second vertical frame; 6, limiting plate; 7, Y-axis displacement mechanism; 8, first connecting plate; 9, second connecting plate; 10, camera; 11, lens group; 12, light source; 13, annular light source; 14, first fixing plate; 15, second fixing plate; 16, third fixing plate; 17, fourth fixing plate; 18, driving motor; 19, lead screw; 20, lead screw nut; 21, third connecting plate; 22, fifth fixing plate; 23, air jet pipe; 24, hose; 25, side plate; 26, slide rail; 28, code reader; 29, coding scale; 30, photoelectric switch; 31, frame; 32, linear driving mechanism; 33, lifting mechanism; 33, lifting platform; 35, first connecting frame; 36, second connecting frame; 37, first avoidance space; 38, second avoidance space; 39, connecting portion; 40, first avoidance groove; 41, first fixing plate; 42, second fixing plate; 43, positioning block; 44, positioning groove; 45, gas connection port; 46, first gas flow channel; 47, second gas flow channel; 48, long strip-shaped notch; 49, accommodating space; 50, receiving groove; 53, assembly plate; 54, first step portion; 55, second step portion; 56, third connecting plate; 57, second avoidance groove; 58, first boss; 59, second boss; 60, third connecting frame; 61, third avoidance groove. Detailed implementation manners

[0028] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0029] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as up, down, left, right, front, back, etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the modules or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0030] In the description of the present invention, if the first and second are described only for the purpose of distinguishing technical features, they should not be construed as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features or implicitly indicating the sequence of the indicated technical features.

[0031] In the description of the present invention, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0032] As Figures 1-8 shown, an AOI detection mechanism of a die bonder is provided in an embodiment of the present invention.

[0033] An AOI detection mechanism of a die bonder includes a workbench 1, a transmission component 2, and an AOI detection component 3. A first upright frame 4 and a second upright frame 5 are provided on the workbench 1. A limit plate 6 is provided at the tail end of the first upright frame 4. A Y-axis displacement mechanism 7 is provided on the limit plate 6. A first connecting plate 8 is provided at the output end of the Y-axis displacement mechanism 7. A second connecting plate 9 is provided outside the AOI detection component 3. The front end of the first connecting plate 8 is connected to the second connecting plate 9. The AOI detection component 3 includes a camera 10, a lens group 11, a light source 12, and an annular light source 13. The camera 10, the lens group 11, the light source 12, and the annular light source 13 are arranged in sequence from top to bottom. The transmission component 2 is provided on the second upright frame 5. The AOI detection component 3 is provided at the top tail end of the transmission component 2.

[0034] By integrating a high-resolution camera 10, an optimally designed lens group 11, and an appropriate light source 12, the AOI detection mechanism of the present invention can achieve high-precision detection. In particular, its ability to identify subtle defects is greatly enhanced, ensuring the high-quality standard of the final product. The design of this detection mechanism takes into account the convenience in actual production. Its structure is simple and compact, reducing complex assembly components. The configuration of the Y-axis displacement mechanism 7 and the connecting plate enables the AOI detection component 3 to be precisely adjusted in position as needed to adapt to the detection requirements of chips of different specifications, improving the flexibility and application range of the equipment. The entire AOI detection component 3 is ingeniously placed at the top tail end of the transmission component 2 and is stably installed through the connection of the first connecting plate 8 and the second connecting plate 9, saving space and improving the overall integration of the equipment.

[0035] An AOI detection mechanism of a die bonder according to this embodiment. On the second connecting plate 9, a first fixing plate 14, a second fixing plate 15, a third fixing plate 16, and a fourth fixing plate 17 are sequentially arranged from top to bottom. The camera 10 is connected to the first fixing plate 14, the lens group 11 is connected to the second fixing plate 15, the light source 12 is connected to the third fixing plate 16, and the annular light source 13 is connected to the fourth fixing plate 17. Specifically, the first fixing plate 14 to the fourth fixing plate 17 sequentially arranged on the second connecting plate 9 provide a stable and adjustable installation position for the camera 10, the lens group 11, the light source 12, and the annular light source 13. This layered design not only helps the precise alignment of each component but also facilitates maintenance and replacement, improving the reliability and maintenance convenience of the equipment.

[0036] An AOI detection mechanism of a die bonder according to this embodiment. A driving motor 18 is arranged on the top of the second connecting plate 9. A lead screw 19 is arranged at the output end of the driving motor 18. A lead screw nut 20 is sleeved on the lead screw 19. A third connecting plate 21 is arranged on the outer periphery of the lead screw nut 20. A fifth fixing plate 22 is arranged on the outer side of the bottom of the third connecting plate 21. An air spray pipe 23 is arranged on the fifth fixing plate 22. A hose 24 is arranged on the top of the air spray pipe 23. Specifically, the moving mechanism composed of the driving motor 18, the lead screw 19, and the lead screw nut 20 can achieve the precise displacement of the fifth fixing plate 22 and the air spray pipe 23 thereon, which is used to remove dust or foreign objects in the detection area, ensuring the cleanliness of the detection environment and thus improving the accuracy of the detection result.

[0037] An AOI detection mechanism of a die bonder according to this embodiment. A side plate 25 is arranged on the outer side of the first connecting plate 8. A slide rail 26 is arranged on the outer side of the Y-axis displacement mechanism 7. A slider (not shown) is arranged on the inner side of the side plate 25. The slider is slidably connected to the slide rail 26. Specifically, the slide rail 26 arranged on the outer side of the Y-axis displacement mechanism 7 cooperates with the slider on the inner side of the side plate 25 to provide a stable and precise moving mode, enhancing the stability during the operation of the equipment, effectively reducing the influence of mechanical vibration on the detection process, and improving the detection accuracy.

[0038] An AOI detection mechanism of a die bonder according to this embodiment. A code reader 28 is provided at the outer bottom of the Y-axis displacement mechanism 7. A coding scale 29 is provided at the outer bottom of the side plate 25. The code reader 28 and the coding scale 29 are correspondingly arranged. Two photoelectric switches 30 are provided at the outer bottom of the Y-axis displacement mechanism 7. Specifically, the combination of the code reader 28 and the coding scale 29 provided at the outer bottom of the Y-axis displacement mechanism 7 can monitor and feedback the position information of the first connecting plate 8 in real time. The photoelectric switches 30 are used to limit its stroke range, ensuring the safety and accuracy of the equipment operation, improving the automation degree, and also enhancing the control accuracy and response speed of the system. It can be understood that the two photoelectric switches 30 correspond to the width range of the transmission mechanism.

[0039] An AOI detection mechanism of a die bonder according to this embodiment. The transmission mechanism includes a frame 31, a linear drive mechanism 32, a lifting mechanism 33, and a lifting platform 34. A first connecting frame 35 is provided at the front end of the frame 31. A second connecting frame 36 is provided at the front end of the first connecting frame 35. A first avoidance space 37 is provided between the frame 31 and the first connecting frame 35. A second avoidance space 38 is provided between the first connecting frame 35 and the second connecting frame 36. The linear drive mechanism 32 is provided on the top of the frame 31. The output end of the linear drive mechanism 32 is connected to the lifting mechanism 33. The lifting mechanism 33 is located in the first avoidance space 37. The output end of the lifting mechanism 33 is connected to the lifting platform 34. A connecting portion 39 is provided at the rear end of the lifting platform 34. A first avoidance groove 40 is provided at the top of the connecting portion 39. The first connecting frame 35 is located in the first avoidance groove 40. The front end of the lifting platform 34 extends into the second avoidance space 38. Specifically, by designing the first avoidance space 37 and the second avoidance space 38, the linear drive mechanism 32 and the lifting mechanism 33 are prevented from directly contacting the track or other fixed components during operation, thereby greatly reducing the possibility of metal dust generated by friction and mechanical vibration, helping to prevent semiconductor products from being contaminated, ensuring that their electrical performance is not affected, protecting the chips from the risk of falling due to vibration, and thus improving the quality of the final product, reducing the maintenance cost. At the same time, a first avoidance groove 40 is provided at the connecting portion at the rear end of the lifting platform 34, and the first connecting frame 35 is located therein, so that the overall structure does not occupy the space at the bottom of the frame, and the avoidance is carried out skillfully, which is beneficial to the arrangement of various components at the bottom of the frame.

[0040] An AOI detection mechanism of a die bonder according to this embodiment. A first fixing plate 41 is provided at the output end of the lifting mechanism 33. A second fixing plate 42 is provided at the bottom of the first fixing plate 41. Positioning blocks 43 are provided on both sides of the rear end of the lifting platform 34. A positioning groove 44 is provided between the two positioning blocks 43. The bottom of the second fixing plate 42 is connected to the bottom of the positioning groove 44. Specifically, by providing a gas connection port on the positioning block 43 and providing first and second gas flow channels, a receiving space and a receiving groove on the lifting platform 34 to form a complete gas flow path, the chip can be adsorbed in the receiving groove, greatly improving the stability of chip transfer.

[0041] An AOI detection mechanism of a die bonder according to this embodiment. Gas connection ports 45 are provided on the positioning blocks 43. First gas flow channels 46 are provided at the left and right ends of the connecting portion 39. A second gas flow channel 47 is provided at the rear end of the lifting platform 34. The second gas flow channel 47 is horizontally arranged. The two first gas flow channels 46 are respectively communicated with the two ends of the second gas flow channel 47. A long strip-shaped notch 48 is provided at the top of the first gas flow channel 46. The receiving space 49 is communicated with the second gas flow channel 47 through the notch 48. A receiving space 49 is provided in the middle of the lifting platform 34. A plurality of receiving grooves 50 are provided at the top of the lifting platform 34. The gas connection port 45, the first gas flow channel 46, the second gas flow channel 47, the receiving space 49 and the receiving grooves 50 are sequentially communicated. The receiving grooves 50 are arranged in an array. Specifically, by providing a gas connection port 45 on the positioning block 43 and providing first and second gas flow channels 46, 47, a receiving space 49 and receiving grooves 50 on the lifting platform 34 to form a complete gas flow path, the chip can be adsorbed in the receiving grooves 50, greatly improving the stability of chip transfer.

[0042] An AOI detection mechanism of a die bonder according to this embodiment. Since the positioning blocks 43 in this embodiment are located on both sides of the positioning groove 44, the first gas flow channels 46 will be connected to both sides of the second gas flow channel 47, and the connecting portion 39 is provided with a first avoidance groove 40, and the first gas flow channels 46 need to be provided with corners. Therefore, the width L3 of the first gas flow channels 46 and the width L4 of the second gas flow channel 47 should be greater than the height L5 of the receiving space 49 to ensure the efficiency of sucking the gas in the receiving space 49 from the second gas flow channel 47 into the first gas flow channels 46 and finally sucking it out from the gas connection port 45. The size settings of the above flow channels and the receiving space 49 ensure the chip adsorption effect of this embodiment under the condition of providing the first avoidance groove 40.

[0043] An AOI detection mechanism of a die bonder according to this embodiment. The dispensing function head and the height measuring function head are both located at the top of the second avoidance space 38. Specifically, the design that the dispensing function head and the height measuring function head are both located at the top of the second avoidance space 38 not only makes full use of the space but also avoids interference between them, ensuring the efficient progress of dispensing and height measurement work and improving the overall work efficiency and product quality.

[0044] An AOI detection mechanism of a die bonder according to this embodiment. A first fixing plate 41 is arranged at the output end of the linear driving mechanism 32. A second fixing plate 42 is arranged at the front end of the first fixing plate 41. The second fixing plate 42 extends into the first avoidance space 37. An assembly plate 53 is arranged at the bottom of the second fixing plate 42. The lifting mechanism 33 is arranged on the assembly plate 53. Specifically, the first fixing plate 41 and the second fixing plate 42 are arranged at the output end of the linear driving mechanism 32, making the installation of the lifting mechanism 33 more stable. At the same time, the second fixing plate 42 can extend into the first avoidance space 37 to ensure precise control during its operation and improve the reliability of the entire transmission mechanism.

[0045] An AOI detection mechanism of a die bonder according to this embodiment. A first step portion 54 is arranged at the top of one side of the first connecting plate 8 close to the second connecting plate 9. A second step portion 55 is arranged at the top of one side of the second connecting plate 9 close to the first connecting plate 8. The first step portion 54 and the second step portion 55 are arranged correspondingly. Specifically, corresponding step portions are arranged between the first connecting plate 8 and the second connecting plate 9, enabling the lifting platform 34 to move up and down between the two step portions and limiting the range of the forward and backward movement of the lifting platform 34.

[0046] An AOI detection mechanism of a die bonder according to this embodiment. The distance between the top of the first avoidance groove 40 and the bottom of the first connecting frame 35 is L1, and the height of the first step portion 54 and the second step portion 55 is L2, then L1 is less than L2. Specifically, L1 refers to the distance between the top of the first avoidance groove 40 and the bottom of the first connecting frame 35 when the lifting platform 34 is at the lowest position, that is, the maximum height that the lifting platform 34 can rise is less than the height of the first step portion 54 and the second step portion 55, ensuring that the lifting platform 34 is always located between the first step portion 54 and the second step portion 55.

[0047] An AOI detection mechanism of a die bonder according to this embodiment. A plurality of third connecting plates 56 are provided between the first connecting frame 35 and the second connecting frame 36. The bottom of each third connecting plate 56 is recessed upward to form a second avoidance groove 57. The second avoidance groove 57 is located at the top of the second avoidance space 38. Specifically, a plurality of third connecting plates 56 are provided between the first connecting frame 35 and the second connecting frame 36, and the bottom is recessed upward to form the second avoidance groove 57. Such a design not only ensures the stability of the connection but also provides an avoidance space to ensure that the chip will not contact the chip on the lifting platform 34 during chip transmission.

[0048] An AOI detection mechanism of a die bonder according to this embodiment. Two second vertical frames 5 are provided. First bosses 58 and second bosses 59 are respectively provided at the front and rear ends of the second vertical frame 5. A third connecting frame 60 is provided at the front end of the second connecting frame 36. The third connecting frame 60 is connected to the top of the first boss 58. Both ends of the machine frame 31 are respectively connected to the two second bosses 59. A third avoidance groove 61 is provided between the first boss 58 and the second boss 59. Both the first avoidance space 37 and the second avoidance space 38 are located at the top of the third avoidance groove 61. Specifically, the design of the first bosses 58 and second bosses 59 respectively provided at the front and rear ends of the vertical frame, and the third connecting frame 60 provides a solid basic support for the entire device. The formed third avoidance groove 61 can provide avoidance space for the lifting mechanism 33 and the lifting platform 34, that is, both the lifting mechanism 33 and the lifting platform 34 are within the third avoidance groove 61 and can slide smoothly without interference.

[0049] Although the embodiments of the present invention have been shown and described, those of ordinary skill in the art can understand that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principles and spirit of the present invention. The scope of the present invention is defined by the claims and their equivalents.

Claims

1. An AOI detection mechanism for a die bonder, characterized in that: It includes a workbench, a transmission component, and an AOI detection component. A first vertical frame and a second vertical frame are provided on the workbench. A limit plate is provided at the end of the first vertical frame. A Y-axis displacement mechanism is provided on the limit plate. A first connecting plate is provided at the output end of the Y-axis displacement mechanism. A second connecting plate is provided outside the AOI detection component. The front end of the first connecting plate is connected to the second connecting plate. The AOI detection component includes a camera, a lens group, a light source, and an annular light source. The camera, the lens group, the light source, and the annular light source are arranged in sequence from top to bottom. The transmission component is provided on the second vertical frame. The AOI detection component is provided at the top end of the tail of the transmission component.

2. The AOI detection mechanism of a die bonder according to claim 1, characterized in that: A first fixing plate, a second fixing plate, a third fixing plate, and a fourth fixing plate are arranged in sequence from top to bottom on the second connecting plate. The camera is connected to the first fixing plate. The lens group is connected to the second fixing plate. The light source is connected to the third fixing plate. The annular light source is connected to the fourth fixing plate.

3. The AOI detection mechanism of a die bonder according to claim 1, characterized in that: A driving motor is provided at the top of the second connecting plate. A lead screw is provided at the output end of the driving motor. A lead screw nut is sleeved on the lead screw. A third connecting plate is provided on the outer periphery of the lead screw nut. A fifth fixing plate is provided on the outer side of the bottom of the third connecting plate. An air injection pipe is provided on the fifth fixing plate. A hose is provided at the top of the air injection pipe.

4. The AOI detection mechanism of a die bonder according to claim 1, characterized in that: A side plate is provided on the outer side of the first connecting plate. A slide rail is provided on the outer side of the Y-axis displacement mechanism. A slider is provided on the inner side of the side plate. The slider is slidably connected to the slide rail.

5. The AOI detection mechanism of a die bonder according to claim 4, characterized in that: A code reader is provided at the bottom outer side of the Y-axis displacement mechanism. A coding scale is provided at the bottom outer side of the side plate. The code reader is arranged corresponding to the coding scale. Two photoelectric switches are provided at the bottom outer side of the Y-axis displacement mechanism.

6. The AOI detection mechanism of a die bonder according to claim 1, characterized in that: The transmission mechanism includes a frame, a linear driving mechanism, a lifting mechanism, and a lifting platform. A first connecting frame is provided at the front end of the frame. A second connecting frame is provided at the front end of the first connecting frame. A first avoidance space is provided between the frame and the first connecting frame. A second avoidance space is provided between the first connecting frame and the second connecting frame. The linear driving mechanism is provided on the top of the frame. The output end of the linear driving mechanism is connected to the lifting mechanism. The lifting mechanism is located in the first avoidance space. The output end of the lifting mechanism is connected to the lifting platform. A connecting part is provided at the rear end of the lifting platform. A first avoidance groove is provided at the top of the connecting part. The first connecting frame is located in the first avoidance groove. The front end of the lifting platform extends into the second avoidance space.

7. The AOI detection mechanism of a die bonder according to claim 6, characterized in that: The output end of the lifting mechanism is provided with a first fixing plate. A second fixing plate is provided at the bottom of the first fixing plate. Positioning blocks are provided on both sides of the rear end of the lifting platform. A positioning groove is provided between the two positioning blocks. The bottom of the second fixing plate is connected to the bottom of the positioning groove.

8. The AOI detection mechanism of a die bonder according to claim 7, characterized in that: Gas connection ports are provided on the positioning blocks. First gas flow channels are provided at both the left and right ends of the connecting portion. A second gas flow channel is provided at the rear end of the lifting platform. In the second gas flow channel, a receiving space is provided in the middle of the lifting platform. A plurality of receiving grooves are formed at the top of the lifting platform. The gas connection ports, the first gas flow channels, the second gas flow channel, the receiving space and the receiving grooves are communicated in sequence. The receiving grooves are distributed in an array.

9. The AOI detection mechanism of a die bonder according to claim 8, characterized in that: The second gas flow channel is arranged horizontally. The two first gas flow channels are respectively communicated with both ends of the second gas flow channel. A long strip-shaped notch is provided at the top of the first gas flow channel. The receiving space is communicated with the second gas flow channel through the notch.

10. The AOI detection mechanism of a die bonder according to claim 6, characterized in that: Both the dispensing function head and the height measuring function head are located at the top of the second avoidance space.

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