Dual-frequency dual-polarization duplex phased array for multi-standard communication

Abstract

The invention discloses a dual-frequency dual-polarization duplex phased array for multi-standard communication, aims to solve the technical bottleneck of the existing millimeter wave phased array in frequency band compatibility, polarization diversity and duplex operation, and comprises a millimeter wave broadband dual-polarization end-on-fire antenna and a dual-frequency dual-polarization duplex phased array architecture. According to the phased array established by the invention, four sets of independent beam forming systems are integrated on a single printed circuit board and correspond to a first frequency band vertical polarization channel, a first frequency band horizontal polarization channel, a second frequency band vertical polarization channel and a second frequency band horizontal polarization channel respectively, and concurrent transmission and independent beam control of dual-frequency-band and dual-polarization signals are supported. The phased array realizes two-dimensional expandability based on a brick-shaped framework, can be used for constructing a planar array, and is suitable for a large-scale deployment scene. The compact size and low-cost scheme provides a high-integration, high-flexibility and high-reliability communication solution for B5G / 6G multi-standard scenes such as intelligent transportation, industrial Internet of Things and smart home.

Description

Technical Field

[0001] The present invention belongs to the field of wireless communication, and particularly relates to a dual-band, dual-polarization, duplex and scalable phased array technology. Background Art

[0002] With the rapid evolution of Beyond 5G (B5G) and 6th Generation (6G) mobile communication technologies, the millimeter-wave band has become the core technical support for realizing frontier applications such as intelligent transportation, industrial Internet of Things, and remote healthcare due to its characteristics of ultra-large bandwidth and ultra-high transmission rate. However, the high path loss and weak penetrability of millimeter-wave signals pose severe challenges to the coverage and reliability of communication systems, which makes phased array technology a key means to improve system performance through dynamic beamforming.

[0003] Traditional millimeter-wave phased arrays are mostly based on single-band and single-polarization designs. Although they have been initially applied in 5G networks, they are difficult to meet the higher requirements of B5G / 6G multi-standard scenarios for spectral efficiency, multi-user concurrency, and low latency. In the prior art, the design of dual-band phased arrays still faces multiple technical bottlenecks: the spatially separated radiation structures can cover different frequency bands, but they result in too large physical sizes and are difficult to be deployed in space-constrained scenarios such as vehicle-mounted devices or small base stations; while the single-aperture broadband design reduces the volume, but is limited by the complexity of the broadband feeding network and cannot support the inter-band isolation required for frequency-division duplexing. It can only switch the transceiver state through time-division duplexing, resulting in a significant reduction in spectral utilization. At the same time, most existing dual-band phased arrays adopt single-polarization designs and cannot utilize vertical and horizontal polarization diversity to improve communication capacity and anti-interference ability. Although a few dual-polarization schemes attempt to cover dual frequency bands, they are difficult to meet the stringent requirements of millimeter-wave multi-standard communication due to problems such as insufficient antenna bandwidth and low polarization isolation.

[0004] There are significant deficiencies in the existing millimeter-wave phased array technology in terms of dual-band and dual-polarization integration, duplex mode compatibility, scalability, and cost control. The trade-off between space and performance, the limitation of spectral efficiency, the lack of polarization diversity, and the lack of expansion ability make the existing solutions difficult to meet the requirements of future communication systems for high density, high flexibility, and high reliability. Therefore, there is an urgent need for a compact, highly integrated, scalable phased array architecture that supports dual-band, dual-polarization, and duplex operation to break through technical bottlenecks and provide practical solutions for scenarios such as intelligent transportation and industrial Internet of Things. Summary of the Invention

[0005] Technical Problem: This invention addresses the limitations of traditional phased array designs in supporting multi-band, multi-polarization, and duplex operation, as well as their inability to meet the high data rate, wide coverage, and multi-scenario application requirements of future communication systems. This invention discloses a dual-band, dual-polarization, duplex phased array for multi-standard communications, aiming to provide an efficient, compact, and versatile solution for multi-standard communications. Through innovative system architecture and antenna design, this invention achieves support for dual-band, dual-polarization, and duplex operation within a single phased array system, providing a new technical approach for improving the performance and adaptability of communication systems.

[0006] Technical solution: A dual-frequency dual-polarization duplex phased array for multi-standard communication of the present invention includes multiple independent beamforming systems integrated on a third printed circuit board, corresponding to the first frequency band vertical polarization, the first frequency band horizontal polarization, the second frequency band vertical polarization and the second frequency band horizontal polarization channels respectively; a dual-polarization end-fire antenna is provided at one end of the third printed circuit board, and the radiation units of the dual-polarization end-fire antenna array are linearly arranged along the side of the third printed circuit board; a duplexer module is also provided on the third printed circuit board, one end of the duplexer module is connected to the common port of the dual-polarization end-fire antenna array through the first feeder, the second feeder, the third feeder and the fourth feeder respectively, and the other end of the duplexer module is used to separate the first frequency band and the second frequency band signals and route them to the corresponding beamforming network; the beamforming network is connected to the multi-pin socket through the horizontally polarized first frequency band RF connector and the horizontally polarized second frequency band RF connector respectively.

[0007] The phased array supports frequency division duplex (FDD) and time division duplex (TDD) modes. In FDD mode, signals in the first and second frequency bands are transmitted and received concurrently via a duplexer module, with the duplexer's stopband suppression characteristics ensuring isolation between frequency bands. In TDD mode, the output end is connected to a horizontally polarized first frequency band beamforming chip, a horizontally polarized second frequency band beamforming chip, a vertically polarized second frequency band beamforming chip, and a vertically polarized second frequency band beamforming chip to switch the transmit and receive states, supporting time multiplexing operations within the same frequency band.

[0008] The phased array can independently control four beamforming systems to generate independent beams of vertical polarization in the first frequency band, horizontal polarization in the first frequency band, vertical polarization in the second frequency band, and horizontal polarization in the second frequency band. The beam pointing, polarization mode, and frequency band selection are dynamically configured through an external controller to achieve flexible adaptation of the communication link.

[0009] The phased array supports expansion in two dimensions. When expanding along the first dimension, the sizes of the first printed circuit board, the second printed circuit board, and the third printed circuit board can be increased to accommodate more antenna units. The spacing between each unit ensures that no grating lobes are generated during beam scanning based on the characteristics of the operating frequency band. When expanding along the second dimension, multiple first printed circuit boards, second printed circuit boards, and third printed circuit boards are connected in parallel through side connectors. The expanded planar array supports two-dimensional beam scanning, and the scanning range is determined by the unit spacing and the array scale.

[0010] The third printed circuit board is an active circuit board, adopting a multi-layer symmetrical stacked structure. The horizontally polarized and vertically polarized first and second frequency band RF front-end feeding networks are mirror-symmetrical structures along the transverse section of the third printed circuit board. The digital control network and DC power supply network of the horizontally polarized and vertically polarized beamforming networks are also mirror-symmetrical structures along the transverse section of the third printed circuit board.

[0011] The beamforming network uses a multi-channel commercial chip; the output end is connected to a horizontally polarized first-band beamforming chip, a horizontally polarized second-band beamforming chip, a vertically polarized second-band beamforming chip, and a vertically polarized second-band beamforming chip. Each chip integrates a digitally controlled phase shifter, a digitally controlled attenuator, and a radio frequency switch, and communicates with an external controller through a digital interface.

[0012] The duplexer module is composed of a broadband power divider and a first frequency band filter and a second frequency band filter. The power divider adopts a coplanar waveguide design and includes a power divider input end, a first output end, a second output end, a power divider arm, and an isolation resistor. The power divider input end is vertically connected to the middle of the first output end and the second output end of the power divider through the power divider arm, and the isolation resistor is located between the first output end and the second output end of the power divider. The first frequency band filter and the second frequency band filter are soldered to a third printed circuit board using a surface mounting method. Their passbands correspond to the first frequency band and the second frequency band respectively, and their stopbands cover the other frequency band to achieve signal isolation between the frequency bands. The input ends of the first frequency band filter and the second frequency band filter are connected to the first output end and the second output end of the power divider through an impedance matching network, and the output ends are connected to the horizontally polarized first frequency band beamforming chip, the horizontally polarized second frequency band beamforming chip, the vertically polarized second frequency band beamforming chip, and the vertically polarized second frequency band beamforming chip.

[0013] The input end of the power divider is connected to the common feed port of the dual-polarized end-fire antenna, the first output end and the second output end of the power divider are connected to the corresponding beamforming network through the first frequency band filter and the second frequency band filter respectively, the length of the power divider arm is optimized to a quarter wavelength according to the center frequency to achieve broadband matching, and the isolation resistor is integrated on the surface layer of the third printed circuit board to improve isolation.

[0014] The dual-polarized end-fire antenna array includes a first printed circuit board, a second printed circuit board, and a third printed circuit board as a middle active circuit board, which are symmetrically arranged as radiating plates. The surface of the radiating plate has a groove structure of a predetermined geometric shape. After metallization treatment, the metal groove is formed. The metal groove and the surface printed metal structure of the middle active circuit board together constitute a vertically polarized and horizontally polarized radiator.

[0015] The dual-polarized end-fire antenna array has a multi-layer stacked structure with a central active circuit board, which integrates a first substrate-integrated coaxial line feed network distributed on different metal layers and a second substrate-integrated coaxial line feed network, which are respectively connected to horizontally polarized / vertically polarized beamforming networks and a horizontal Γ-shaped probe and a vertical Γ-shaped probe. The horizontal Γ-shaped probe and the vertical Γ-shaped probe are spatially orthogonal and maintain a horizontal distance to ensure polarization isolation. The radiating plate is aligned and fixed with the central active circuit board to form a seamlessly integrated three-dimensional antenna structure.

[0016] Beneficial Effects: This invention provides a dual-band, dual-polarization, duplex phased array for B5G / 6G multi-standard communications. Through innovative architecture design, antenna technology, and duplexing solutions, it achieves the technical goal of supporting dual-band, dual-polarization, and duplex operation in a single system. The system features wideband operation, independent beam scanning, concurrent multi-beam generation, and high scalability. This not only improves the performance and flexibility of the communication system but also provides new ideas and solutions for the future development of wireless communication technologies, possessing significant technical value and application potential. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a three-dimensional schematic diagram of the dual-frequency dual-polarization duplex phased array provided by the present invention;

[0018] Figure 2 This is a schematic diagram of the stacked structure of the dual-frequency dual-polarization duplex phased array active circuit board provided by the present invention;

[0019] Figure 3 This is a principle block diagram of the dual-frequency dual-polarization duplex phased array system provided by the present invention;

[0020] Figure 4 It is a three-dimensional schematic diagram of the broadband power splitter of the duplexer module provided by the present invention;

[0021] Figure 5 This is a three-dimensional schematic diagram of a dual-polarization broadband end-fire antenna unit provided by the present invention;

[0022] Figure 6 This is a partial schematic diagram of the feeding probe of the dual-polarization broadband end-fire antenna provided by the present invention;

[0023] Figure 7 It is a schematic diagram of expanding the dual - frequency, dual - polarization duplex phased array provided by the present invention into an 8×8 planar array;

[0024] Figure 8 It is the simulation and measured results of the S - parameters and gain curves of the dual - polarization broadband end - fire antenna element provided by the present invention;

[0025] Figure 9 It is the simulation and test results of the E - plane and H - plane radiation patterns at different frequencies within the band of the dual - polarization broadband end - fire antenna element provided by the present invention;

[0026] Figure 10 It is the simulation and test results of the beam scanning of the dual - frequency, dual - polarization duplex phased array provided by the present invention, including: the beam scanning results of the horizontally polarized beam in the first frequency band in the first frequency band, the beam scanning results of the vertically polarized beam in the first frequency band in the first frequency band, the beam scanning results of the horizontally polarized beam in the second frequency band in the second frequency band, and the beam scanning results of the vertically polarized beam in the second frequency band in the second frequency band;

[0027] Figure 11 It is the test results of the equivalent isotropic radiated power of the four beams of the dual - frequency, dual - polarization duplex phased array provided by the present invention;

[0028] Figure 12 It is the test results of the constellation diagram and error vector magnitude of the four beams of the dual - frequency, dual - polarization duplex phased array provided by the present invention.

[0029] In the figure: there are the first printed circuit board 1, the second printed circuit board 2, the third printed circuit board 3, the dual - polarization end - fire antenna 4, the positioning through - hole 5, the first feeder 6, the second feeder 7, the third feeder 8, the fourth feeder 9, the duplexer module 10, the beamforming network 11, the first - frequency - band RF connector for horizontal polarization 12, the second - frequency - band RF connector for horizontal polarization 13, and the multi - pin socket 14;

[0030] Vertically polarized first-band RF connector 15, vertically polarized second-band RF connector 16, horizontally polarized first-band beamforming chip 17, horizontally polarized second-band beamforming chip 18, vertically polarized second-band beamforming chip 19, vertically polarized second-band beamforming chip 20, power divider 21, first-band filter 22, second-band filter 23, horizontal Γ-shaped probe 24, metallized through-hole 25, square patch 26, power divider input 2 7. Power divider first output end 28, power divider second output end 29, power divider arm 30, isolation resistor 31, metal slot structure 32, first metallized hole array 33, quasi-coaxial vertical transfer structure 34, first vertical RF connector 35, second vertical RF connector 36, Γ-shaped probe 37 in the vertical direction, first substrate integrated coaxial line feeding network 38, second substrate integrated coaxial line feeding network 39, second metallized hole array 40, dual-polarization broadband end-fire antenna unit 41, PCB module 42. DETAILED DESCRIPTION

[0031] The technical solutions and beneficial effects of the present invention will be described in detail below with reference to the accompanying drawings.

[0032] like Figure 1 This embodiment is a dual-frequency, dual-polarization, duplex phased array for B5G / 6G multi-standard communications.

[0033] Reference Figure 1, the phased array of this embodiment includes multiple sets of independent beamforming systems integrated on the third printed circuit board 3, corresponding to the first-band vertical polarization, first-band horizontal polarization, second-band vertical polarization, and second-band horizontal polarization channels respectively; a dual-polarized end-fire antenna 4 is provided at one end of the third printed circuit board 3, and the radiation units of the dual-polarized end-fire antenna 4 array are linearly arranged along the side of the third printed circuit board 3; a duplexer module 10 is also provided on the third printed circuit board 3. One end of the duplexer module 10 is connected to the common port of the dual-polarized end-fire antenna 4 array through the first feeder 6, the second feeder 7, the third feeder 8, and the fourth feeder 9 respectively. The other end of the duplexer module 10 is used to separate the first-band and second-band signals and route them to the corresponding beamforming network 11; the beamforming network 11 is respectively connected to the first-band RF connector 12 for horizontal polarization and the second-band RF connector 13 for horizontal polarization through the multi-pin socket 14 to construct a 1×4 linear array. After arranging the positioning through holes 5 on the printed circuit board, the radiation board and the active circuit board can be accurately aligned and fixed through mechanical fixing components to form a seamless three-dimensional antenna structure. The first feeder 6, the second feeder 7, the third feeder 8, and the fourth feeder 9 connected to the horizontal polarization ports of the dual-polarized antenna array are connected to the beamforming networks 11 of the first band and the second band through the duplexer module 10. The RF signal is connected to the RF cable through the first RF connector 12 and the second RF connector 13, and the DC power supply and the digital control circuit are connected to the external control component through the multi-pin socket 14. The vertical polarization feeding, duplexer module, connectors, and the beamforming networks of the first band and the second band are distributed on the other surface of the active circuit board.

[0034] Refer to Figure 2 , Figure 3 and Figure 4The phased array in this embodiment uses two commercial multi-channel beamforming chips, operating in the first and second frequency bands, respectively. The horizontally polarized first-band beamforming chip 17 and the horizontally polarized second-band beamforming chip 18 are surface-mounted on the top surface of the active circuit board; the vertically polarized second-band beamforming chip 19 and the vertically polarized second-band beamforming chip 20 are surface-mounted on the bottom surface of the active circuit board. The common RF port of the beamforming system is connected to an RF connector via a coplanar waveguide transmission line to terminate the RF cable. The horizontally polarized first-band RF connector 12 and the horizontally polarized second-band RF connector 13 are mounted on the top surface of the active circuit board; the vertically polarized first-band RF connector 15 and the vertically polarized second-band RF connector 16 are mounted on the bottom surface of the active circuit board. The duplex module consists of a first-band filter 22, a second-band filter 23, and a broadband Wilkinson power divider 21. The power divider input 27 is connected to the dual-polarization antenna's feed port. The power divider's first and second outputs 28 and 29 are connected to the corresponding beamforming systems through first and second frequency band filters, respectively. The power divider utilizes a coplanar waveguide design. The length of the power divider arm 30 is optimized based on the center frequency to achieve broadband matching. The isolation resistor 31 is surface-mounted on the PCB.

[0035] Reference Figure 5 In this embodiment, the surface of the radiation plate of the dual-polarized broadband end-fire magneto-electric dipole antenna unit is formed into a metal slot structure 32 of a specific geometric shape through PCB cutting and metallization processing. The structure includes two "L"-shaped structures and a partial vertical metal ground, presenting a "Π" shape with a certain height. The metal ground in other areas is formed by a first metallized hole array 33 to ensure that the connectivity of the dielectric substrate is not broken. The metal slot structure constitutes the two arms of the electric dipole under vertical polarization and horizontal polarization and a quarter-wavelength short-circuit patch of the magnetic dipole under horizontal polarization. This design ensures the continuity of the metal surface in all directions, thereby ensuring the continuity of the current in the vertical and horizontal directions, and achieving dual-polarized broadband performance. The two polarization feeding networks are connected to the first vertical RF connector 35 and the second vertical RF connector 36 installed on both sides of the active circuit board through a quasi-coaxial vertical transition structure 34, so as to be connected to an external coaxial cable for feeding and experimental testing.

[0036] Reference Figure 2 and Figure 6The two polarized radiations of the antenna in this embodiment are fed by a horizontal Γ-shaped probe 24 and a vertical Γ-shaped probe 37, respectively. These probes are formed on the feed board using a multilayer PCB mixing process and plated-through holes. They are connected to a first substrate-integrated coaxial feed network 38 and a second substrate-integrated coaxial feed network 39, distributed on different metal layers. The substrate coaxial lines are isolated in the horizontal plane by a second plated-through hole array 40. The active circuit board is constructed of eight metal layers, and its stacked structure exhibits a certain degree of symmetry in vertical sections, which facilitates active phased array design. The horizontally polarized feed probe and substrate-integrated coaxial transmission line are located on layer M4, the middle of the feed board in the vertical direction. This layout effectively stimulates horizontally polarized radiation and ensures that the radiation pattern does not tilt. The vertically polarized substrate-integrated coaxial transmission line is distributed on layer M7 and connected to a plated-through hole 25. This metallized via connects the bottom M8 layer and the top M1 layer, and together with the square patch 26 on the M1 layer, forms a vertically polarized Γ-shaped feed probe. Furthermore, the metallized via of the vertically polarized feed probe is spatially spaced a certain distance from the horizontally polarized feed probe on the M4 layer to ensure a certain level of polarization isolation.

[0037] Reference Figure 7 The phased array design of this embodiment supports scalability along two dimensions. When expanding along the first dimension, the PCB size can be increased to accommodate more dual-polarized broadband end-fire antenna elements 41. The element spacing is optimized based on the operating frequency band characteristics to ensure no significant interference during beam scanning. When expanding along the second dimension, multiple PCB modules 42 are connected in parallel via side connectors. The expanded planar array supports two-dimensional beam scanning, with the scanning range determined by both the element spacing and the array size.

[0038] To verify the authenticity and reliability of the dual-band, dual-polarization, duplex phased array provided by the present invention, a dual-polarization, broadband, end-fire, magnetoelectric dipole antenna operating at 24.8-40.3 GHz and a dual-band, dual-polarization, duplex phased array operating at 28 GHz / 38 GHz were fabricated according to the technical solution provided by the present invention. The designed antenna structure and the radiator of the phased array system both utilize two 1.524 mm thick RO 4350B dielectric substrates. The active circuit boards of both utilize a multi-layer dielectric substrate mixing process, sequentially comprising a 0.1 mm thick RO 4350B dielectric substrate, a 0.2 mm thick RO 4450F adhesive layer, a 0.2 mm thick RO 4003C dielectric substrate, a 0.1 mm thick TU-87PSLK adhesive layer, a 0.1 mm thick RO 4350B dielectric substrate, a 0.2 mm thick RO 4450F adhesive layer, and a 0.1 mm thick RO 4350B dielectric substrate.

[0039] Figures 8 to 9 The relevant performance simulations and actual test results of the example antenna are given. Figure 10 , Figure 11 , Figure 12 The relevant performance simulations and actual test results of the example phased array are given. It can be seen from the simulation and experimental results that the antenna provided by the present invention has advantages such as wide bandwidth, stable millimeter-wave dual-polarization broadband radiation gain, and high polarization isolation; the phased array provided by the present invention has advantages such as dual-frequency operation ability, wide-angle beam scanning, concurrent multi-beam generation ability, and two-dimensional scalability.

[0040] The above phased array system adopts a highly integrated brick-type architecture, integrating four independent beamforming systems on a single PCB. These four beamforming systems respectively correspond to the vertical polarization of the first frequency band, the horizontal polarization of the first frequency band, the vertical polarization of the second frequency band, and the horizontal polarization channel of the second frequency band. This integrated design significantly reduces the volume and complexity of the system, and at the same time realizes the close combination of the antenna element and the RF front-end through the multi-layer PCB process. The radiation elements of the phased array are linearly arranged along the side of the PCB to form a compact array structure, which can generate stable radiation gain in two different frequency bands, providing a flexible basic platform for multi-standard communication.

[0041] In the design of the radiation element of the above phased array, a dual-polarization end-fire antenna structure is adopted. This antenna is composed of symmetrically arranged radiation plates and an intermediate active circuit board. The surface of the radiation plate forms a groove structure with a specific geometric shape through the PCB cutting process. After metallization, it forms a radiator for vertical polarization and horizontal polarization together with the surface printed metal structure of the intermediate active circuit board. This design can achieve good impedance matching and high polarization isolation in a wide frequency band, ensuring the performance stability of the system under dual-band and dual-polarization operation. The radiation plate and the active circuit board are precisely aligned and fixed through mechanical fixing components to form a seamless integrated three-dimensional antenna structure, further improving the reliability and integration of the system.

[0042] The phased array system uses a duplexer module to achieve dual-band signal separation and routing. It consists of a broadband Wilkinson power divider and two bandpass filters. The broadband power divider's input receives the signal from the antenna's common port, while its output connects to the corresponding beamforming system via first-band and second-band filters, respectively. The power divider utilizes a coplanar waveguide design, with its splitter arm length optimized for broadband matching. Isolation resistors are integrated on the PCB surface to enhance inter-port isolation. The bandpass filter is soldered to the PCB using surface mount technology. Its passbands correspond to the first and second frequency bands, respectively, while its stopband covers the other frequency band, providing signal isolation between the two bands. The filter input is connected to the power divider output via an impedance matching network, while the output is connected to the feed port of the beamforming chip via an RF transmission line. This duplexer module design enables the system to support dual-band concurrent operation within a single aperture, while simultaneously implementing frequency division duplexing (FDD), thereby improving spectrum efficiency and communication flexibility.

[0043] The intermediate active circuit board of the above-mentioned phased array adopts a multi-layer stacked structure, integrating substrate-integrated coaxial lines and coplanar waveguide transmission line feeding networks distributed on different metal layers, respectively connecting the horizontally polarized and vertically polarized beamforming networks and "Γ"-shaped feeding probes. The vertically polarized and horizontally polarized feeding probes are orthogonally distributed in space and maintain a certain horizontal distance to ensure polarization isolation. This orthogonal layout effectively reduces interference between polarizations and ensures the independent processing capability of signals. In addition, the active circuit board adopts a multi-layer symmetrical stacked structure. The first-band and second-band RF front-end feeding networks of horizontally polarized and vertically polarized are distributed in a mirror-symmetrical manner along the transverse section of the PCB. The digital control network and DC power supply network of the beamforming network also follow a mirror-symmetrical design. Cross-layer interconnection is achieved between layers through blind and buried vias, which further optimizes the signal transmission path, reduces losses and improves the overall stability of the system.

[0044] The beamforming system included in the phased array utilizes multi-channel commercial chips to achieve high-precision beam steering. Each RF transmit and receive channel in the beamforming system is equipped with a digitally controlled phase shifter, a digitally controlled attenuator, and an RF switch. The chips are surface-mounted to the PCB and communicate with an external controller via a digital interface. This design enables the system to independently scan beams within the first and second frequency bands for both horizontal and vertical polarizations. By precisely adjusting the phase and amplitude of each element in the antenna array, coverage requirements in various communication scenarios can be met. The system supports independent control of four beamforming systems, generating independent beams for vertical polarization in the first frequency band, horizontal polarization in the first frequency band, vertical polarization in the second frequency band, and horizontal polarization in the second frequency band. Beam direction, polarization, and frequency band selection can be dynamically configured by an external controller, enabling flexible adaptation of the communication link.

[0045] The above phased array supports two modes: frequency division duplex (FDD) and time division duplex (TDD). In the FDD mode, signals in the first frequency band and the second frequency band are concurrently transmitted and received through a duplexer module. The stopband rejection characteristic of the duplexer ensures isolation between the frequency bands. In the TDD mode, the transmit and receive states are switched by a radio frequency switch within the beamforming chip, supporting time-division multiplexing operations within the same frequency band. This dual-mode operation capability enables the system to flexibly switch operating modes in different application scenarios. For example, FDD is used in communications that require high real-time performance and low latency, while TDD is switched to when spectrum resources are limited, thereby significantly improving the system's throughput and response speed.

[0046] The above phased array design supports scalability in two dimensional directions. When expanding along the first dimension, more antenna elements can be accommodated by increasing the PCB size. The element spacing is optimized according to the characteristics of the operating frequency band to ensure no significant interference during beam scanning. When expanding along the second dimension, multiple PCB modules are connected in parallel through side connectors. The expanded planar array supports two-dimensional beam scanning, and the scanning range is determined by the element spacing and the array scale together. This modular design enables the system to adapt to different requirements from small-scale communication devices to large-scale base stations or satellite communication systems, demonstrating a broad application prospect.

[0047] The above phased array tightly integrates antenna elements, a beamforming system, a duplexer module, and radio frequency front-end routing on a single PCB through a multi-layer printed circuit board process. The multi-layer structure optimizes the signal transmission path, reduces signal loss, and improves the system's heat dissipation performance and mechanical stability at the same time. Key components in the system, such as beamforming chips and filters, all use commercial high-performance devices, ensuring the reliability and cost-effectiveness of the system. This highly integrated design not only simplifies the manufacturing process but also lays a foundation for the mass production and practical deployment of the system.

[0048] The above are only the preferred embodiments of the present invention, used to illustrate the technical idea of the present invention. The protection scope of the present invention cannot be limited by this. Without departing from the principle of the present invention, any changes made will fall within the protection scope of the present invention.

Claims

1. A dual-band, dual-polarization duplex phased array for multi-standard communication, characterized in that, The phased array includes multiple sets of independent beamforming systems integrated on the third printed circuit board (3), corresponding to the vertical polarization of the first frequency band, the horizontal polarization of the first frequency band, the vertical polarization of the second frequency band, and the horizontal polarization of the second frequency band channels respectively; one end of the third printed circuit board (3) is provided with a dual-polarized end-fire antenna (4), and the radiation units of the dual-polarized end-fire antenna (4) array are linearly arranged along the side of the third printed circuit board (3); a duplexer module (10) is also provided on the third printed circuit board (3), one end of the duplexer module (10) is connected to the common port of the dual-polarized end-fire antenna (4) array through the first feeder (6), the second feeder (7), the third feeder (8), and the fourth feeder (9) respectively, and the other end of the duplexer module (10) is used to separate the signals of the first frequency band and the second frequency band and route them to the corresponding beamforming network (11); the beamforming network (11) is connected to the multi-pin socket (14) through the first frequency band RF connector (12) with horizontal polarization and the second frequency band RF connector (13) with horizontal polarization respectively.

2. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, wherein: The phased array supports frequency division duplex (FDD) and time division duplex (TDD) modes; in the FDD mode, the signals of the first frequency band and the second frequency band are concurrently transmitted and received through the duplexer module, and the stopband rejection characteristics of the duplexer ensure isolation between frequency bands; in the TDD mode, the transmit and receive states are switched through the RF switches in the horizontal polarization first frequency band beamforming chip (17), the horizontal polarization second frequency band beamforming chip (18), the vertical polarization second frequency band beamforming chip (19), and the vertical polarization second frequency band beamforming chip (20), supporting time division multiplexing operations within the same frequency band.

3. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, wherein: The phased array independently controls four sets of beamforming systems to generate independent beams of vertical polarization of the first frequency band, horizontal polarization of the first frequency band, vertical polarization of the second frequency band, and horizontal polarization of the second frequency band. The beam direction, polarization mode, and frequency band selection are dynamically configured by an external controller to achieve flexible adaptation of the communication link.

4. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, characterized in that: The phased array supports expansion methods in two dimensional directions. When expanding in the first dimensional direction, the sizes of the first printed circuit board (1), the second printed circuit board (2), and the third printed circuit board (3) can be increased to accommodate more antenna elements, and the element spacing ensures no grating lobes are generated during beam scanning according to the characteristics of the operating frequency band. When expanding in the second dimensional direction, multiple first printed circuit boards (1), second printed circuit boards (2), and third printed circuit boards (3) are connected in parallel through side connectors; the expanded planar array supports two-dimensional beam scanning, and the scanning range is jointly determined by the element spacing and the array scale.

5. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, wherein: The duplexer module (10) is composed of a broadband power divider (21), a first-band filter (22), and a second-band filter (23); the power divider (21) adopts a coplanar waveguide design, and the power divider (21) includes a power divider input terminal (27), a first power divider output terminal (28), a second power divider output terminal (29), a power dividing arm (30), and an isolation resistor (31); wherein, the power divider input terminal (27) is vertically connected to the middle of the first power divider output terminal (28) and the second power divider output terminal (29) through the power dividing arm (30), and the isolation resistor (31) is located in the middle of the first power divider output terminal (28) and the second power divider output terminal (29); the first-band filter (22) and the second-band filter (23) are soldered to the third printed circuit board (3) by a surface mount method, and their passbands respectively correspond to the first band and the second band, and the stopband covers the other band to achieve signal isolation between bands; the input terminals of the first-band filter (22) and the second-band filter (23) are connected to the first power divider output terminal (28) and the second power divider output terminal (29) through an impedance matching network, and the output terminals are connected to the feeding ports of the first-band beamforming chip (17) with horizontal polarization, the second-band beamforming chip (18) with horizontal polarization, the second-band beamforming chip (19) with vertical polarization, and the second-band beamforming chip (20) with vertical polarization.

6. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 5, characterized in that: The power divider input terminal (27) is connected to the common feeding port of the dual-polarized end-fire antenna (4), and the first power divider output terminal (28) and the second power divider output terminal (29) are respectively connected to the corresponding beamforming networks (11) through the first-band filter (22) and the second-band filter (23). The length of the power dividing arm (30) is optimized to be a quarter wavelength according to the center frequency to achieve broadband matching, and the isolation resistor (31) is integrated on the surface layer of the third printed circuit board (3) to improve the isolation degree.

7. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, characterized in that: The third printed circuit board (3) is an active circuit board and adopts a multi-layer symmetric stacked structure. The first and second-band radio frequency front-end feeding networks with horizontal polarization and vertical polarization are mirror-symmetric structures along the transverse section of the third printed circuit board (3). The digital control network and the DC power supply network of the horizontal polarization and vertical polarization beamforming networks (11) are also mirror-symmetric structures along the transverse section of the third printed circuit board (3).

8. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, characterized in that: The beamforming network (11) adopts a multi-channel commercial chip; the first-band beamforming chip (17) with horizontal polarization, the second-band beamforming chip (18) with horizontal polarization, the second-band beamforming chip (19) with vertical polarization, and the second-band beamforming chip (20) with vertical polarization are all integrated with a numerically controlled phase shifter, a numerically controlled attenuator, and a radio frequency switch, and communicate with an external controller through a digital interface.

9. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 1, characterized in that: The dual-polarized end-fire antenna (4) array includes a first printed circuit board (1), a second printed circuit board (2) symmetrically arranged as radiation plates, and a third printed circuit board (3) as an intermediate active circuit board. The radiation plate surface has a groove structure (32) with a set geometric shape. After metallization, a metal groove is formed. The metal groove and the surface printed metal structure of the intermediate active circuit board together constitute radiators for vertical polarization and horizontal polarization.

10. The dual-band, dual-polarization duplex phased array for multi-standard communication according to claim 9, characterized in that, In the dual-polarized end-fire antenna (4) array, the intermediate active circuit board adopts a multi-layer stacked structure and integrates a first substrate integrated coaxial line feeding network (38) and a second substrate integrated coaxial line feeding network (39) distributed on different metal layers, which are respectively connected to a horizontal polarization / vertical polarization beamforming network (11), a Γ-shaped probe (24) in the horizontal direction, and a Γ-shaped probe (37) in the vertical direction. Among them, the Γ-shaped probe (24) in the horizontal direction and the Γ-shaped probe (37) in the vertical direction are orthogonal in space and maintain a horizontal distance to ensure polarization isolation. The radiation plate is aligned and fixed with the intermediate active circuit board to form a seamless integrated three-dimensional antenna structure.

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