Method and system for automatically generating constellation satellite grounding large graph and automatically marking impedance

Abstract

The invention provides a constellation satellite grounding large graph automatic generation and impedance automatic labeling method and system, and the method comprises the steps: automatically recognizing circuit elements and a connection relation thereof through software, converting the circuit elements into a format compatible with simulation software, and carrying out the preliminary current backflow analysis and detailed current density and heat distribution simulation. Impedance characteristics are measured through a network analyzer, an ideal impedance matching network is calculated, environmental factors are added, and the identified impedance matching network and the calculated impedance matching network are compared and adjusted. And finally, converting the 2D grounding large graph into a 3D grounding structure, and designing a multi-layer and multi-dimensional grounding network through three-dimensional printing and material parameter simulation. According to the method, the satellite grounding large graph can be automatically drawn through software, the comparison impedance is automatically marked, optimization is carried out through simulation data, and the drawing efficiency and reliability can be obviously improved.

Description

Technical Field

[0001] The present invention relates to the field of automatic mapping technology, and in particular to a method and system for automatically generating a large ground map of a constellation satellite and automatically marking impedances. Background Art

[0002] The design of grounding networks for constellation satellites has always faced extremely harsh environmental challenges. Satellites operating in space must withstand extreme temperature fluctuations, radiation, and a complex electromagnetic environment, placing extremely high demands on the stability and reliability of the grounding network.

[0003] However, existing design methods rely primarily on the manual drawing and analysis of two-dimensional planar diagrams, which are unable to accurately simulate and match the various parameters in the actual environment. Designers need to manually identify circuit components and their connections, and then draw large grounding diagrams one by one. This is not only an extremely tedious process, but also prone to errors, time-consuming and labor-intensive. Due to the lack of comprehensive consideration of the actual environment, traditional methods often appear to be inadequate when dealing with complex multi-level and multi-dimensional grounding structures. They are unable to fully consider key parameters such as the material's conductivity, magnetic permeability, and electromagnetic compatibility, resulting in the final designed grounding network potentially experiencing performance instability in actual applications.

[0004] Existing methods typically analyze current density and heat distribution through finite element analysis (FEA). However, this process is complex and prone to errors due to the need to manually convert circuit models and define material properties and boundary conditions. For impedance matching calculations, designers typically use network analyzers to measure the impedance characteristics of devices and connecting wires, then verify them through manual calculations and simulation software. This is not only time-consuming but also prone to calculation and simulation errors that affect the accuracy of the final results. Furthermore, these methods struggle to effectively simulate and adapt to the extreme environmental conditions encountered by satellites in space, resulting in large errors in the grounding network in actual applications and an inability to guarantee its reliability and stability.

[0005] Therefore, the market needs a method for automatically generating large-scale ground maps of constellation satellites and automatically marking impedances, which can accurately simulate and match actual environmental parameters, significantly reduce design errors, and ensure that the grounding network maintains excellent performance in harsh environments. Summary of the Invention

[0006] In view of the defects in the prior art, the purpose of the present invention is to provide a method and system for automatically generating a large ground map of constellation satellites and automatically marking impedances.

[0007] According to the present invention, a method for automatically generating a large ground map of a constellation satellite and automatically marking impedances includes:

[0008] Step S1: The software automatically identifies the circuit elements in the grounding diagram and the corresponding connection relationships of the circuit elements through the interface data sheet;

[0009] Step S2: converting the identification results into a format compatible with circuit simulation software to perform preliminary current return analysis;

[0010] Step S3: Obtain detailed current density and heat distribution results through FEA analysis;

[0011] Step S4: Using a network analyzer to measure the impedance characteristics of the device and the connecting wires, calculating an ideal impedance matching network, and then adjusting the ideal impedance matching network by configuring environmental parameters;

[0012] Step S5: comparing the identified actual matching network with the calculated matching network, automatically adjusting and marking the impedance in the graph;

[0013] Step S6: Convert the grounding map into a 3D grounding structure, and design the grounding network into a multi-level, multi-dimensional structure with the help of 3D printing technology and simulation settings of material parameters.

[0014] Preferably, the step S1 includes: each large image represents a satellite, and is named "satellite model + grounding large image";

[0015] The ground is divided into chassis ground, structure ground and shield ground according to the position. The chassis ground and shield ground are finally connected to the structure ground.

[0016] The components of the constellation satellite ground map include structural ground connection objects and structural ground connection methods.

[0017] Preferably, the grounded circuit is divided into high frequency and low frequency according to its operating frequency. The low frequency circuit uses a single-point grounding method, and the high frequency circuit uses a multi-point grounding method. According to their locations, they are connected to the chassis ground, structural ground and shielding ground respectively, and the grounding method is marked in black font next to it. A unique identifier is set on each grounding point.

[0018] Preferably, step S2 includes: inputting the identified circuit elements and their connection relationships into circuit simulation software, defining the boundary conditions and working state of the circuit, running the simulation and obtaining the distribution results of current and voltage;

[0019] The step S3 includes: converting the circuit model into a geometric and physical model that can be understood by the FEA software, defining material properties and boundary conditions, performing meshing and running FEA simulation to obtain detailed current density and heat distribution results;

[0020] Step S6 includes: generating a 3D structure based on a 2D satellite ground map, setting the conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, surface roughness and texture of the grounding material, and 3D dimensions including shape parameters such as curvature radius, angle, length, and height; and finally configuring the temperature, humidity, mechanical stress, and electromagnetic interference in the real environment, and further optimizing through mathematical models and simulation software.

[0021] Preferably, the step S4 includes:

[0022] Step S4.1: Obtain source impedance and load impedance by measuring and analyzing with a network analyzer;

[0023] Step S4.2: Select an appropriate matching network topology based on the specific values of the source impedance and the load impedance and the frequency range;

[0024] Step S4.3: Normalize both the source impedance and the load impedance to a reference impedance of 50Ω;

[0025] Step S4.4: Determine the specific form of the matching network based on the normalized impedance.

[0026] According to the present invention, a system for automatically generating a large ground map of a constellation satellite and automatically marking impedances includes:

[0027] Module M1: The software automatically identifies the circuit elements in the grounding diagram and the corresponding connection relationships of the circuit elements through the interface data sheet;

[0028] Module M2: Converts the identification results into a format compatible with circuit simulation software and performs preliminary current return analysis;

[0029] Module M3: Obtain detailed current density and heat distribution results through FEA analysis;

[0030] Module M4: Use a network analyzer to measure the impedance characteristics of devices and connecting lines, calculate the ideal impedance matching network, and then adjust the ideal impedance matching network by configuring environmental parameters;

[0031] Module M5: compares the identified actual matching network with the calculated matching network, automatically adjusts it and marks the impedance in the graph;

[0032] Module M6: Convert the grounding diagram into a 3D grounding structure. With the help of 3D printing technology and simulation settings of material parameters, the grounding network is designed into a multi-level and multi-dimensional structure.

[0033] Preferably, the module M1 includes: each large image represents a satellite, named "satellite model + ground large image";

[0034] The ground is divided into chassis ground, structure ground and shield ground according to the position. The chassis ground and shield ground are finally connected to the structure ground.

[0035] The components of the constellation satellite ground map include structural ground connection objects and structural ground connection methods.

[0036] Preferably, the grounded circuit is divided into high frequency and low frequency according to its operating frequency. The low frequency circuit uses a single-point grounding method, and the high frequency circuit uses a multi-point grounding method. According to their locations, they are connected to the chassis ground, structural ground and shielding ground respectively, and the grounding method is marked in black font next to it. A unique identifier is set on each grounding point.

[0037] Preferably, the module M2 includes: inputting the identified circuit elements and their connection relationships into circuit simulation software, defining the boundary conditions and working state of the circuit, running the simulation and obtaining the distribution results of current and voltage;

[0038] The module M3 includes: converting the circuit model into a geometric and physical model that can be understood by the FEA software, defining material properties and boundary conditions, performing meshing and running FEA simulation to obtain detailed current density and heat distribution results;

[0039] The module M6 includes: generating a 3D structure based on a 2D satellite ground map, setting the conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, surface roughness and texture of the grounding material, and 3D dimensions including shape parameters such as curvature radius, angle, length and height. Finally, it configures the temperature, humidity, mechanical stress and electromagnetic interference in the real environment, and further optimizes it through mathematical models and simulation software.

[0040] Preferably, the module M4 includes:

[0041] Module M4.1: Obtain source impedance and load impedance through measurement and analysis with a network analyzer;

[0042] Module M4.2: Select the appropriate matching network topology based on the specific values of source and load impedances and the frequency range;

[0043] Module M4.3: Normalize both source and load impedances to a 50Ω reference impedance.

[0044] Module M4.4: Determine the specific form of the matching network based on the normalized impedance.

[0045] Compared with the prior art, the present invention has the following beneficial effects:

[0046] 1. The present invention uses software to automatically identify circuit elements and their connection relationships in the grounding diagram through interface data sheets, which not only reduces the time and errors of manual operation, but also ensures the correct identification and processing of circuit elements and connection relationships.

[0047] 2. The present invention obtains detailed current density and heat distribution results through finite element analysis (FEA), and uses a network analyzer to measure the impedance characteristics of devices and connecting wires to calculate the ideal impedance matching network. It can accurately analyze the current and heat distribution of the circuit and ensure the reliability and effectiveness of the design.

[0048] 3. This invention converts a large grounding diagram into a 3D grounding structure. Using 3D printing technology and material parameter simulation, the grounding network is designed into a multi-layered, multi-dimensional structure. This not only enhances the three-dimensionality and complexity of the grounding design, but also optimizes the conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, and shape parameters of the grounding material through simulation, making the design more suitable for practical application requirements. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Other features, objects and advantages of the present invention will become more apparent upon reading the detailed description of non-limiting embodiments with reference to the following drawings:

[0050] Figure 1 It is a schematic flow chart of the working method of the present invention. DETAILED DESCRIPTION

[0051] The present invention will be described in detail below with reference to specific embodiments. The following examples will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those skilled in the art, several changes and improvements can be made without departing from the scope of the present invention. These all fall within the scope of protection of the present invention.

[0052] The present invention uses information technology to automatically generate a large ground map of constellation satellites, and combines it with the simulation of the actual harsh environment of satellites in space to achieve accurate design and optimization of the large ground map of constellation satellites and impedance annotation.

[0053] Example 1

[0054] According to the present invention, a method for automatically generating a large ground map of a constellation satellite and automatically marking impedance is provided. Figure 1 As shown, including:

[0055] Step S1: The software automatically identifies the circuit elements and their corresponding connections in the ground diagram using the interface data sheet. Step S1 includes: Each diagram represents a satellite. That is, each satellite in the constellation can be represented by a ground diagram, named "Satellite Model + Ground Diagram." Ground is divided into chassis ground, structural ground, and shield ground based on location. Both the chassis ground and shield ground are ultimately connected to the structural ground. The constellation satellite ground diagram includes the structural ground connection target and structural ground connection method. Specifically, the chassis ground is the metal casing (housing) of the device directly connected to the earth via a grounding screw. The grounding location is typically the metal casing outside the device. It serves as the grounding electrical reference point between the device and the external environment, primarily for safety protection, leakage prevention, as a system reference potential point, and to help suppress electromagnetic interference (EMI). The housing serves as part of the shielding layer. The structural ground is the internal support frame of the device connected to the chassis ground via a grounding wire. The grounding location is typically the internal frame or support frame of the device, which is generally not directly exposed to the external environment. It is used to ground the internal mechanical support structure of the device and provide a stable electrical reference. The shielded ground is the shielding layer of the signal line (such as coaxial cable) connected to the ground plane on the circuit board through the ground terminal. The grounding location is generally the signal line shielding layer, shielding cover or circuit board area. It is a dedicated grounding for signal lines or shielding covers to prevent external electromagnetic interference from entering the circuit.

[0056] A database is created for the shell models and module names of the modules connected to the structure, and they are matched one by one through a lookup table mode. Different modules correspond to different icons and are marked next to them with text.

[0057] According to the operating frequency of the grounded circuit, it is divided into high frequency and low frequency. The low frequency circuit uses a single-point grounding method, and the high frequency circuit uses a multi-point grounding method. It is connected to three types of ground according to its location, and the grounding method is marked in black font next to it. A unique identifier is set on each grounding point.

[0058] Step S2: Convert the identification results into a format compatible with the circuit simulation software and perform a preliminary current backflow analysis. The step S2 includes: inputting the identified circuit elements and their connection relationships into the circuit simulation software, defining the boundary conditions and working state of the circuit, running the simulation and obtaining the distribution results of current and voltage. Specifically, the analysis process includes the following: 1) Automatically generate a circuit description file through the software, and convert it into a file format supported by the circuit simulation software (such as SPICE, etc.), correctly and in detail describing each related circuit element and its parameter connection relationship. 2) Import the circuit into the selected simulation software and adjust the component parameters or connection relationship as needed. 3) Define the boundary conditions and working state, configure the simulation parameters, and select the appropriate solver options to ensure the accuracy and computational efficiency of the simulation results. 4) Run the software simulation to obtain and analyze the current flow at each node, especially the current distribution on the ground wire or power line, and generate icons for analysis.

[0059] Step S3: Obtain detailed current density and heat distribution results through FEA analysis. Step S3 includes: converting the circuit model into a geometric and physical model that the FEA software can understand, defining material properties and boundary conditions, performing meshing, and running FEA simulation to obtain detailed current density and heat distribution results.

[0060] Step S4: Use a network analyzer to measure the impedance characteristics of the device and the connecting line, calculate the ideal impedance matching network, and then adjust the ideal impedance matching network by configuring environmental parameters. Step S4 includes:

[0061] Step S4.1: Obtain the source impedance and load impedance by measuring and analyzing with a network analyzer.

[0062] Step S4.2: Select an appropriate matching network topology based on the specific values of the source impedance and the load impedance and the frequency range.

[0063] Step S4.3: Normalize both the source impedance and the load impedance to a reference impedance of 50Ω.

[0064] Step S4.4: Determine the specific form of the matching network based on the normalized impedance.

[0065] The parameter values of the specific components of the matching network are calculated based on the normalized impedance. The calculated matching network is simulated using HFSS (High Frequency Structure Simulator, known as high-frequency structure simulator in Chinese), and the impedance matching effect is verified by observing the performance of the matching network within the actual operating frequency range. After the ideal impedance matching network is determined, the temperature and humidity coefficients need to be considered, and appropriate component materials need to be selected. The simulation results also need to consider the effects of temperature and humidity coefficients: select components with suitable temperature coefficients (such as tantalum capacitors that have a lower temperature coefficient of about 50ppm / °C, which is suitable for use in a wider temperature range); evaluate the effects of humidity sensitivity (such as whether the selected components can maintain stable performance in a high temperature environment to avoid parameter drift due to moisture absorption).

[0066] Take appropriate shielding measures to prevent electromagnetic interference, and select appropriate mechanical supports for components based on the high vibration coefficient. The main steps of the HFSS verification process include: 1) Create an HFSS project; 2) Import matching network parameters; 3) Set simulation parameters; 4) Run the simulation and analyze the results; 5) Adjust the design (if necessary). The following is an expanded explanation:

[0067] First, create a geometric model of the matching network in HFSS software. Add matching network parameters (such as the inductor L and capacitor C values for specific components), set material properties and excitation sources, define the operating frequency range (generally determined based on the actual operating PINL range), and set the simulation type to S-parameter analysis to facilitate observation of the reflection and transmission coefficients. Next, perform a frequency domain simulation to analyze the frequency response of the reflection and transmission coefficients, that is, their performance within the target frequency band.

[0068] Finally, analyze the simulation results. If the results show that the performance does not meet the requirements, adjust the component parameters to iteratively optimize the matching performance.

[0069] Step S5: Compare the identified actual matching network with the calculated matching network, automatically adjust and mark the impedance in the graph.

[0070] Step S6: Convert the large grounding image into a 3D grounding structure. Using 3D printing technology and material parameter simulation, the grounding network is designed into a multi-layered, multi-dimensional structure. Step S6 involves generating a 3D structure based on the 2D satellite grounding image. The 3D structure can be configured with the grounding material's electrical conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, surface roughness and texture, and 3D dimensions including curvature radius, angle, length, and height. Finally, the system configures the temperature, humidity, mechanical stress, and electromagnetic interference of the real environment, and further optimizes the design using mathematical models and simulation software.

[0071] This invention uses information technology to automatically generate and label impedances for a constellation satellite ground plane diagram, significantly improving the efficiency and accuracy of the design process. First, software automatically identifies circuit components and their connections within the ground plane diagram using interface data sheets. These identification results are converted into a format compatible with circuit simulation software for preliminary current return analysis. This process not only reduces manual operation time and errors, but also ensures the correct identification and processing of circuit components and connections.

[0072] Based on this preliminary analysis, finite element analysis (FEA) is used to obtain detailed current density and thermal distribution results. A network analyzer is used to measure the impedance characteristics of the components and connecting wires to calculate the ideal impedance matching network. This combination of steps enables us to accurately analyze the circuit's current and thermal distribution, ensuring the reliability and effectiveness of the design. Subsequently, by comparing the actual matching network with the calculated matching network, the system automatically adjusts the matching network and annotates the impedance on the grounding diagram, further enhancing the design's intelligence and reducing manual intervention.

[0073] Furthermore, the present invention converts a large grounding diagram into a 3D grounding structure, utilizing 3D printing technology and simulation settings of material parameters to design the grounding network into a multi-level, multi-dimensional structure. This not only enhances the three-dimensionality and complexity of the grounding design, but also optimizes the conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, and shape parameters of the grounding material through simulation, making the design more in line with practical application requirements. By configuring the temperature, humidity, mechanical stress, and electromagnetic interference in a real environment, and combining mathematical models and simulation software for optimization, the present invention can ensure the stability and performance of the grounding network under different environmental conditions.

[0074] In summary, the present invention improves the design efficiency, accuracy and intelligence level in constellation satellite grounding design through automated processing and precise simulation analysis, reduces human errors, and ensures the reliability and adaptability of the design.

[0075] Example 2

[0076] The present invention also provides a system for automatically generating a large constellation satellite ground map and automatically labeling impedances. The system for automatically generating a large constellation satellite ground map and automatically labeling impedances can be implemented by executing the process steps of the method for automatically generating a large constellation satellite ground map and automatically labeling impedances. That is, those skilled in the art can understand the method for automatically generating a large constellation satellite ground map and automatically labeling impedances as a preferred implementation of the system for automatically generating a large constellation satellite ground map and automatically labeling impedances.

[0077] According to the present invention, a system for automatically generating a large ground map of a constellation satellite and automatically marking impedances includes:

[0078] Module M1: The software automatically identifies the circuit elements in the grounding diagram and the corresponding connection relationships of the circuit elements through the interface data sheet. The module M1 includes: each large diagram represents a satellite, named "satellite model + grounding diagram". The ground is divided into chassis ground, structural ground and shielding ground according to the location, and the chassis ground and shielding ground are finally connected to the structural ground. The components of the constellation satellite grounding diagram include the structural ground connection object and the structural ground connection method. According to the operating frequency of the grounded circuit, it is divided into high frequency and low frequency. The low-frequency circuit uses a single-point grounding method, and the high-frequency circuit uses a multi-point grounding method. It is connected to the chassis ground, structural ground and shielding ground according to its location, and the grounding method is marked in black font next to it. A unique identifier is set for each grounding point.

[0079] Module M2: Converts the identification results into a format compatible with circuit simulation software and performs preliminary current return analysis. Module M2 includes: inputting the identified circuit elements and their connection relationships into the circuit simulation software, defining the circuit's boundary conditions and operating states, running the simulation, and obtaining the current and voltage distribution results.

[0080] Module M3: Obtain detailed current density and thermal distribution results through FEA analysis. Module M3 includes converting the circuit model into a geometric and physical model that the FEA software can understand, defining material properties and boundary conditions, meshing, and running FEA simulations to obtain detailed current density and thermal distribution results.

[0081] Module M4: Use a network analyzer to measure the impedance characteristics of devices and connecting cables, calculate an ideal impedance matching network, and then adjust the ideal impedance matching network by configuring environmental parameters. Module M4 includes: Module M4.1: Obtain source impedance and load impedance through measurement and analysis with a network analyzer. Module M4.2: Select an appropriate matching network topology based on the specific values of the source and load impedances and the frequency range. Module M4.3: Normalize both the source and load impedances to a 50Ω reference impedance. Module M4.4: Determine the specific form of the matching network based on the normalized impedances.

[0082] Module M5: Compare the identified actual matching network with the calculated matching network, automatically adjust and mark the impedance in the graph.

[0083] Module M6: Converts the grounding map into a 3D grounding structure. Leveraging 3D printing technology and material parameter simulation, the grounding network is designed into a multi-layered, multi-dimensional structure. Module M6 involves generating a 3D structure based on the 2D satellite grounding map. The 3D structure is then configured with the grounding material's electrical conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, surface roughness and texture, and 3D dimensions including curvature radius, angle, length, and height. Finally, the system configures the temperature, humidity, mechanical stress, and electromagnetic interference of the real environment, and further optimizes the structure using mathematical models and simulation software.

[0084] Those skilled in the art will appreciate that, in addition to implementing the system and its various devices, modules, and units provided by the present invention in purely computer-readable program code, it is entirely possible to implement the same functions of the system and its various devices, modules, and units provided by the present invention in the form of logic gates, switches, application-specific integrated circuits, programmable logic controllers, and embedded microcontrollers by logically programming the method steps. Therefore, the system and its various devices, modules, and units provided by the present invention can be considered a hardware component, and the devices, modules, and units included therein for implementing various functions can also be considered as structures within the hardware component; the devices, modules, and units for implementing various functions can also be considered as both software modules implementing the method and structures within the hardware component.

[0085] The above describes specific embodiments of the present invention. It should be understood that the present invention is not limited to the specific embodiments described above, and that those skilled in the art may make various changes or modifications within the scope of the claims, without affecting the essence of the present invention. Unless there is a conflict, the embodiments of this application and the features in the embodiments may be combined with each other in any manner.

Claims

1. A method for automatically generating a large ground map of a constellation satellite and automatically marking impedances, characterized in that: include: Step S1: The software automatically identifies the circuit elements in the grounding diagram and the corresponding connection relationships of the circuit elements through the interface data sheet; Step S2: converting the identification results into a format compatible with circuit simulation software to perform preliminary current return analysis; Step S3: Obtain detailed current density and heat distribution results through FEA analysis; Step S4: Using a network analyzer to measure the impedance characteristics of the device and the connecting wires, calculating an ideal impedance matching network, and then adjusting the ideal impedance matching network by configuring environmental parameters; Step S5: comparing the identified actual matching network with the calculated matching network, automatically adjusting and marking the impedance in the graph; Step S6: Convert the grounding map into a 3D grounding structure, and design the grounding network into a multi-level, multi-dimensional structure with the help of 3D printing technology and simulation settings of material parameters.

2. The method for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 1, characterized in that: The step S1 includes: each large image represents a satellite, and is named "satellite model + ground map"; The ground is divided into chassis ground, structure ground and shield ground according to the position. The chassis ground and shield ground are finally connected to the structure ground. The components of the constellation satellite ground map include structural ground connection objects and structural ground connection methods.

3. The method for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 2, characterized in that: According to the operating frequency of the grounded circuit, it is divided into high frequency and low frequency. The low frequency circuit uses a single-point grounding method, and the high frequency circuit uses a multi-point grounding method. According to their location, they are connected to the chassis ground, structural ground and shielding ground respectively, and the grounding method is marked in black font next to it. A unique identifier is set for each grounding point.

4. The method for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 1, characterized in that: Step S2 includes: inputting the identified circuit elements and their connection relationships into circuit simulation software, defining the boundary conditions and working state of the circuit, running the simulation and obtaining the distribution results of current and voltage; The step S3 includes: converting the circuit model into a geometric and physical model that can be understood by the FEA software, defining material properties and boundary conditions, performing meshing and running FEA simulation to obtain detailed current density and heat distribution results; Step S6 includes: generating a 3D structure based on a 2D satellite ground map, setting the conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, surface roughness and texture of the grounding material, and 3D dimensions including shape parameters such as curvature radius, angle, length, and height; and finally configuring the temperature, humidity, mechanical stress, and electromagnetic interference in the real environment, and further optimizing through mathematical models and simulation software.

5. The method for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 1, characterized in that: The step S4 comprises: Step S4.1: Obtain source impedance and load impedance by measuring and analyzing with a network analyzer; Step S4.2: Select an appropriate matching network topology based on the specific values of the source impedance and the load impedance and the frequency range; Step S4.3: Normalize both the source impedance and the load impedance to a reference impedance of 50Ω; Step S4.4: Determine the specific form of the matching network based on the normalized impedance.

6. A system for automatically generating a large ground map of a constellation satellite and automatically marking impedances, characterized in that: include: Module M1: The software automatically identifies the circuit elements in the grounding diagram and the corresponding connection relationships of the circuit elements through the interface data sheet; Module M2: Convert the identification results into a format compatible with circuit simulation software and perform preliminary current return analysis; Module M3: Obtain detailed current density and heat distribution results through FEA analysis; Module M4: Use a network analyzer to measure the impedance characteristics of devices and connecting lines, calculate the ideal impedance matching network, and then adjust the ideal impedance matching network by configuring environmental parameters; Module M5: compares the identified actual matching network with the calculated matching network, automatically adjusts it and marks the impedance in the graph; Module M6: Convert the grounding diagram into a 3D grounding structure. With the help of 3D printing technology and simulation settings of material parameters, the grounding network is designed into a multi-level and multi-dimensional structure.

7. The system for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 6, characterized in that: The module M1 includes: each large image represents a satellite, named "satellite model + ground map"; The ground is divided into chassis ground, structure ground and shield ground according to the position. The chassis ground and shield ground are finally connected to the structure ground. The components of the constellation satellite ground map include structural ground connection objects and structural ground connection methods.

8. The system for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 7, characterized in that: According to the operating frequency of the grounded circuit, it is divided into high frequency and low frequency. The low frequency circuit uses a single-point grounding method, and the high frequency circuit uses a multi-point grounding method. According to their location, they are connected to the chassis ground, structural ground and shielding ground respectively, and the grounding method is marked in black font next to it. A unique identifier is set for each grounding point.

9. The system for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 6, characterized in that: The module M2 includes: inputting the identified circuit elements and their connection relationships into circuit simulation software, defining the boundary conditions and working state of the circuit, running the simulation and obtaining the distribution results of current and voltage; The module M3 includes: converting the circuit model into a geometric and physical model that can be understood by the FEA software, defining material properties and boundary conditions, performing meshing and running FEA simulation to obtain detailed current density and heat distribution results; The module M6 includes: generating a 3D structure based on a 2D satellite ground map, setting the conductivity, magnetic permeability, thermal conductivity, electromagnetic compatibility parameters, surface roughness and texture of the grounding material, and 3D dimensions including shape parameters such as curvature radius, angle, length and height. Finally, it configures the temperature, humidity, mechanical stress and electromagnetic interference in the real environment, and further optimizes it through mathematical models and simulation software.

10. The system for automatically generating a large ground map of a constellation satellite and automatically marking impedances according to claim 6, characterized in that: The module M4 includes: Module M4.1: Obtain source impedance and load impedance through measurement and analysis with a network analyzer; Module M4.2: Select the appropriate matching network topology based on the specific values of source and load impedances and the frequency range; Module M4.3: Normalize both source and load impedances to a 50Ω reference impedance. Module M4.4: Determine the specific form of the matching network based on the normalized impedance.

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