164 results about "Impedance properties" patented technology

Disclosed is a memory module and a method of calibrating an impedance of a semiconductor memory device of the memory module, where the memory module includes semiconductor memory devices each having a separate terminal for calibrating impedance characteristics, and a reference resistor commonly connected to the separate terminals, such that the number of reference resistors used in calibration of impedance characteristics of an off-chip driver or an on-die termination circuit of the semiconductor memory device is reduced.

Programmable impedance devices and methods of fabricating the devices are disclosed. The programmable impedance devices exhibit non-volatile tunable impedance properties. A programmable impedance device includes a first electrode, a second electrode and a programmable material disposed between the two electrodes. The programmable material may be disposed at a junction between the first and second electrodes.

A system, method and program product for determining the in-place engineering properties such as density and moisture content of many varieties of engineering materials, are disclosed. The invention also includes a database, material model and sensor model for use with the above-described aspects. In one embodiment, the invention determines a compaction indication of the material based on an effect of impedance characteristics of the material on an electrical field, and corrects the compaction indication for at least one of a sensor depth-sensitivity inaccuracy and a compaction process inaccuracy. The compaction indication is determined based on a material model, and the corrections are based on mathematical and empirical models of the compaction process and the sensor.

Disclosed is a memory module and a method of calibrating an impedance of a semiconductor memory device of the memory module, where the memory module includes semiconductor memory devices each having a separate terminal for calibrating impedance characteristics, and a reference resistor commonly connected to the separate terminals, such that the number of reference resistors used in calibration of impedance characteristics of an off-chip driver or an on-die termination circuit of the semiconductor memory device is reduced.

A process for curing a natural or synthetic rubber includes the measuring of curing conditions by dielectric or impedance means to produce a process curve (impedance property data versus time) followed by analyzing the process curve with a software algorithm which defines and statistically quantifies the correlation between the process curve and the desired part properties. The correlation relationship is applied in real time to end the curing process at the optimum time and to produce rubber parts of uniform quality and with reduced process cycle time.

The invention provides a foreign body detection method and system based on an impedance characteristic. The method comprises the steps that a detection coil is laid in an area to be detected, wherein the detection coil is connected with a capacitor element to form a resonant circuit, and a high frequency carrier signal is loaded on the resonant circuit; a resonant current signal on the resonant circuit is collected; other induction signals outside the frequency band of the high frequency carrier signal are filtered out; and finally, amplitude and phase analysis is carried out on the filtered resonant current signal to determine whether a foreign body is in the area to be detected. The method has the advantages that the impedance change of the detection coil is correspondingly acquired by detecting the change of the phase and amplitude of the resonant current signal, so as to judge whether a foreign matter exists. The method has the advantages of low cost and good effect. The original system is changed less. Especially for a wireless power transmission system, without affecting the efficiency of the original system, the method and system can be well adapted to foreign body detection in a variety of magnetic fields to improve the safety of the wireless power transmission system.

A method and test structures are disclosed for characterizing interconnects of an integrated circuit. The method provides a set of test structures and determines a unit impedance property of each test structure, desirably using S-parameter measurements. A reference impedance data set is then formulated that characterizes the impedance of an integrated circuit manufacturing technology and that can be used to characterize the impedance of interconnects of the chip made by the technology. Each test structure desirably comprises a ground grid and a signal line, and is characterized by values of a set of predetermined attributes such as layer location of the respective ground grid, grid density, layer association, width and length of the respective signal line.

A method and test structures are disclosed for characterizing interconnects of an integrated circuit. The method provides a set of test structures and determines a unit impedance property of each test structure, desirably using S-parameter measurements. A reference impedance data set is then formulated that characterizes the impedance of an integrated circuit manufacturing technology and that can be used to characterize the impedance of interconnects of the chip made by the technology. Each test structure desirably comprises a ground grid and a signal line, and is characterized by values of a set of predetermined attributes such as layer location of the respective ground grid, grid density, layer association, width and length of the respective signal line.

A digital based two wire proximity transmitter system and a method for calibrating the system, wherein the transmitter includes a customized linearization table uniquely generated during calibration to take into account the unique impedance properties of a particular probe / coaxial cable configuration. During calibration, the probe is positioned adjacent a calibration target. The calibration target is selected to have the same material characteristics as the target to be monitored during actual operation of the transmitter in the field. At a fixed distance between the probe and calibration target, the resonant frequency of the probe / cable system is determined. Thereafter, utilizing this resonant frequency to excite the probe, the voltage response of the probe / cable system is determined as the distance between the probe and the target material is incrementally changed. The voltage output is used to build a table for incremental distances, wherein each distance is characterized by a non-linear output that has been equated to a linear output. This uniquely generated table is subsequently downloaded into the transmitter for reference during monitoring.

The present invention relates to an electrolyte comprising a non-ionic surfactant and a lithium ion battery using the same, and more particularly, to a non-aqueous electrolyte for a lithium ion battery comprising a fluorine-based non-ionic surfactant. The lithium ion battery prepared according to the present invention uses an electrolyte comprising a fluorine-based non-ionic surfactant that is substituted with various functional groups at the end group as represented by a fluorine-based non-ionic surfactant represented by a Formula: wherein, R is hydrogen, an acetyl group, a methyl group or a benzoyl goup; and m and n are integers from 2 to 20. The surfactant can improve the interfacial property between an electrolyte and electrodes and impedance properties, and exhibits a high capacity and excellent charge / discharge properties.

Systems and methods for inspecting electrical conductivity in composite materials having conductive structures are disclosed. In one embodiment, a system of inspecting electrical conductivity in an electrical bonding region includes a coil coupled to an alternating current source that is configured to induce a current in a conductive structure within the region. A processor is coupled to the coil that is operable to detect an impedance property value from the coil that results from the current induced in the conductive structure.

A surface acoustic wave element 1 includes a substrate 2, an intermediate layer and a piezoelectric layer 4 laminated on the substrate 2, an IDT 5 disposed on the piezoelectric layer 4, a pair of reflectors 6 and 7 arranged on both sides of the IDT 5, and a protective layer 8 provided so as to cover the IDT 5 and the reflectors 6 and 7. The IDT 5, that is each of the electrode 5a and 5b, has a plurality of electrode fingers 51 juxtaposed with a prescribed spacing and the reflectors 6 and 7 have respectively a plurality of reflecting bodies 61 and 71. Further, the pitch Pr of the reflecting body of each reflector 6 and 7 is set to be smaller than the pitch Pt of the electrode finger of the IDT 5 and the ratio Pr / Pt is preferably set to be in the range of 0.7 to 0.9995. According to the surface acoustic wave element 1, the impedance characteristic and the insertion loss can be improved. Furthermore, electronic equipment having such surface acoustic wave element is provided.

The invention provides a ceramic electronic component having the low dielectric constant of a ceramic sintered body and excellent impedance properties in a GHz zone and capable of obtaining high impedance properties in a wide frequency range, and its manufacturing method. This ceramic electronic component is formed by forming a green compact which includes an electrode therein with a ceramic compound comprising a ceramic raw material, a binder and a spherical or granular combustible material having adhesiveness to the binder. The green compact is fired to form the ceramic sintered compact including the electrode and containing about 35 to 80 volume percent pores. The pores of the ceramic sintered compact are filled with resin or glass.

Systems and methods for inspecting electrical conductivity in composite materials having conductive structures are disclosed. In one embodiment, a system of inspecting electrical conductivity in an electrical bonding region includes a coil coupled to an alternating current source that is configured to induce a current in a conductive structure within the region. A processor is coupled to the coil that is operable to detect an impedance property value from the coil that results from the current induced in the conductive structure.

A single chip integrated circuit measuring circuit (1) for determining a characteristic of the impedance of an external complex impedance circuit (2) for facilitating characterization of the impedance of the complex impedance circuit (2) comprises a signal generating circuit (7) for generating a variable frequency stimulus signal for applying to the complex impedance circuit (2). A first receiving circuit (10) receives a response signal from the complex impedance circuit (2) in response to the stimulus signal and conditions the response signal. A first analog-to-digital converter (68) converts the conditioned response signal to a first digital output signal, which is read from the first analog-to-digital converter (68) through a first digital output port (14). The response signal from the complex impedance circuit (2) is a current signal, and a current to voltage converter circuit (64) converts the response signal to a voltage signal. A first RMS to DC level converting circuit (70) converts the AC voltage of the response signal to a DC voltage level, and a fourth multiplexer (67) selectively applies the voltage response signal or the DC voltage level signal to the first analog-to-digital converter (68), depending on whether it is desired that the first digital output signal should be indicative of the phase shift or amplitude change in the response signal relative to the stimulus signal. A second receiving circuit (20) receives the stimulus signal, and similarly converts the stimulus signal to a second digital output signal for facilitating comparison of the response signal with the stimulus signal.

The invention relates to the technical field of power electronics, in particular to a ripple analysis-based electrolytic capacitor life calculation method. The method comprises the steps of solving current ripples of an electrolytic capacitor under different frequencies by utilizing double Fourier series, and solving electrolytic capacitor life in combination with impedance characteristics of the electrolytic capacitor and an inner temperature rise-based electrolytic capacitor model. Specifically, the method comprises the steps of A, calculating an effective value of each harmonic current in a buck circuit; B, giving out the electrolytic capacitor model and performing calculation through the effective value of the harmonic current and equivalent series resistance (ESR) of the electrolytic capacitor at a harmonic frequency by utilizing an iterative algorithm to obtain an inner temperature rise of the electrolytic capacitor; and C, substituting the inner temperature rise of the electrolytic capacitor into an electrolytic capacitor life formula and performing calculation to obtain the electrolytic capacitor life. According to the method, the electrolytic capacitor life model is combined with system parameters, so that the influence of inductance in a main circuit on the electrolytic capacitor life is analyzed; and the life calculation of the electrolytic capacitor is closely combined with the impedance properties of the electrolytic capacitor, so that the electrolytic capacitor life can be accurately solved.

A database is compiled of values of the frequency fNM corresponding to the minimum reactance Z″MIN (Nyquist minimum) versus temperature TL over a selected range of temperatures for a probe immersed in a sample of the fluid to be monitored and excited by an a.c. voltage and the frequency swept over a range to cover both bulk fluid and electrode interface impedance characteristics. The probe is then excited in situ and the temperature measured. The Nyquist minimum is then determined from the database and the current measured on the low frequency (interfacial) side of the Nyquist minimum. The angle Θ of the rate of change of resistance Z″ with respect to resistance Z′ and magnitude of the impedance ZS is then determined from the current measurement; and, the fluid condition Ψ determined from a previously compiled database of values of Ψ, ZS and Θ.

A circuit board has a first signal layer having a set of conductors, a second signal layer having a conductive plane and a non-conductive region, and a third signal layer having a conductive region that mirrors the non-conductive region of the second signal layer. The circuit board further includes a first separating layer having non-conductive material which is disposed between the first signal layer and the second signal layer, and a second separating layer having non-conductive material which is disposed between the second signal layer and the third signal layer. Accordingly, traces within the first signal layer and overlying the conductive plane of the second signal layer will have a first impedance, while traces within the first signal layer and overlying the non-conductive region of the second signal layer and the conductive region of the third signal layer will have a second impedance that is different than the first impedance.

The invention discloses a digitized intelligent ultrasonic power source and a use method thereof. A PWM (Pulse Width Modulation) drive pulse signal is directly produced by a microprocessor and is adjusted by a rear-level circuit to be used for driving an ultrasonic transducer; a voltage adjustable power source is adjusted, and the output power of the ultrasonic power source is controlled; the current of a power frequency mains supply and the voltage of the voltage adjustable power source are monitored in real time, and the work state of the ultrasonic power source is adjusted; the voltage of an impedance matching circuit and the current of a resonance matching circuit are sampled in real time, and the frequency of the PWM drive pulse signal is dynamically adjusted through analyzing the impedance characteristic by the microprocessor so as to realize a dynamic matching process, ensure that the transducer always works at a resonance point and output the maximal available power. According to the digitized intelligent ultrasonic power source and the use method thereof, the ultrasonic power is adjustable, the matching mode is simple, the precision is higher, a circuit is simple, the safety and the reliability are realized, the cost is low, and the application prospect is wider.

This invention discloses a broad band high attenuation common mode conductive electromagnetic interference parallel mixed filter including a passive common mode filter inductor LCM, the input end of which is serial to the output of the HF current inductor LCT to make up of an active filter and a passive filter, the passive common mode filter inductor is serial to a noise source device to filter the HF electromagnetic noise effectively and correct the source impedance property of the device, in which, the output of the operational amplifier is parallel to the resistor by two high voltage ceramic condensers to be connected to the input of a small passive common mode inductor and works at the open loop state, the input of which is serial to the network side of the device by a HF current mutual inductor.

The invention discloses a grid-connected inverter frequency coupling impedance characteristic extraction method based on multi-sine-wave signal injection. The method comprises the steps: adopting an impedance measuring device based on a model predictive control method to realize the low-impedance characteristic in a broadband range; decomposing the multi-input and multi-output frequency coupling impedance characteristics of the grid-connected inverter into four single-input and single-output subsystems and performing independent measurement; measuring the broadband frequency coupling impedancecharacteristics of the grid-connected inverter through one-time signal injection, so enough measurement precision and rapidity are ensured. Compared with an existing frequency coupling impedance characteristic extraction method, the frequency coupling impedance characteristic extraction method has the advantages that the impedance characteristic extraction efficiency is remarkably improved whilethe measurement precision is guaranteed, and faster and more efficient frequency coupling impedance characteristic extraction can be achieved.

An impedance tuning and optimization technique is described wherein an impedance interface is dynamically tuned prior to applying transmit power to the circuit. A coupled signal injected into the antenna port is used to optimize the tuning state of a tuning component such that the impedance properties of the circuit are optimized prior to application of transmit power. A coupled or injected signal at an alternate frequency band can be utilized to determine tuning state or parameters at the frequency of interest by first tuning at the frequency of the coupled or injected signal and then accessing a data base containing information that relates tuning parameters across multiple frequency bands for various levels of antenna de-tuning. A time-savings is realized when the tuning circuit is optimized prior to activation or use of the transmit / receive path.

In a method for designing a semiconductor integrated device, there are prepared a first power supply cell having a first decoupling capacitance and a second power supply cell having a second decoupling capacitance larger than the first decoupling capacitance. One of the first and second power supply cells is arranged in each of power supply cell areas of an input / output circuit area of the semiconductor integrated device in accordance with frequency-to-impedance characteristics at a predetermined point of input / output buffers of the input / output circuit area between first and second power supply lines thereof and frequency-to-noise current characteristics of the input / output buffers of the input / output circuit area between the first and second power supply lines.

The invention discloses a multi-temperature impedance characteristic sensing cable, and a temperature detector using the sensing cable; the sensing cable is composed of 2 to 6 metal conductors, recoverable insulating layers with different temperature impedance characteristics, as well as 1 to 2 layers of outer jackets; each metal conductor sequentially comprises 1 to 2 insulation layers which are twisted into ropes; the twisted ropes are arranged in the 1 to 2 layers of outer jackets; the temperature detector is composed of a temperature sensing interface unit, sensing cables corresponding to the temperature impedance characteristics, and the cable terminal units; and the temperature sensing interface unit is mainly composed of a signal amplification and linearization circuit, an analog / digital conversion circuit, a microprocessor circuit (MCU), a display and operation circuit, a pulse output circuit and a timer circuit. The temperature detector can achieve the differential temperature, stationary temperature or differential stationary temperature alarm of the low, medium, high temperature ranges.

An electrode of an implantable medical lead is coated with a polymeric composition that includes (i) a terpolymer formed from monomer subunits consisting essentially of vinyl acetate, alkyl methyl acrylate and n-vinyl pyrrolidone; (ii) a copolymer formed from monomer subunits consisting essentially of vinyl acetate and alkyl methacrylate; and (iii) polyvinyl pyrrolidone. The coating does not substantially adversely affect impedance properties of the electrode.

The invention belongs to the field of power electronics and aims at providing a high voltage isolating switch power and a plurality of output isolated switch power systems. The switch power is inputted by AC power sources, inputted into a filter capacitor in parallel after being isolated and rectified by a transformer to change the impedance property, and then outputted by a conventional high frequency switch convertor; and the regulation direction of the switch power is opposite to the conventional direction. Output is divided into a voltage mode and a current mode; and an energy storage value of an output filter capacitor or inductance is higher than that of an input filter capacitor. The circuit and control method adopted by the voltage isolating switch power and the plurality of outputisolated switch power systems have the characteristics of compact structure, simple circuit, high working efficiency and low mutual interference among a plurality of auxiliary power sources, which are especially applicable to distributed auxiliary power supply needing high voltage and superhigh voltage insulated isolation, and can be applied in high voltage power electronic equipment. The high voltage isolating switch power and the plurality of output isolated switch power systems can also directly obtain electric energy from transmission lines of a power system, and assist to supply power for the power electronic equipment in an intelligent grid system.

The disclosed modeling method for equivalent capacitor model comprises: selecting equivalent parameter and desired condition for impedance calculation and decision respectively, which can avoid defect by simple calculation method. This invention can meet different simulation precision request, fit to variable capacitors, and benefit to simulation result analysis.

The invention discloses a bypass circuit of low noise amplifier. The low noise amplifier and the bypass circuit have a common radio frequency input end, and the output ends of the both are connected to the same changeover switch to form a common radio frequency output end; the low noise amplifier has at least one amplification tube; the bypass circuit is connected with at least one PIN tube, and one end of the PIN tube is connected with the bypass circuit to form a connecting end; the connecting end is connected with the radio frequency input end through 1 / 4 of wavelength; and the other end of the PIN tube is grounded. Preferably, the amplification tube has high input impedance property and strong reflection characteristic of radio frequency signal in the case of interruption of power supply. Therefore, the bypass circuit of low noise amplifier can greatly reduce volumes of the low noise amplifier and the bypass circuit thereof, decrease cost and improve reliability.