Ceramic electronic component and manufacturing method thereof

A technology of electronic components and manufacturing methods, applied to printed circuit components, fixed capacitor components, transformer/inductor components, etc., can solve the problems of reduced reliability, increased and reduced water absorption, and reduce the dielectric Constant, enhanced tensile strength, high mechanical strength effect

Inactive Publication Date: 2003-10-15
MURATA MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] However, in the foamed ferrite sintered body disclosed in JP-A-55-526300, increasing the porosity lowers the mechanical strength of the molded body, so there is a problem that it is difficult to ensure the required flexural strength as an electronic component material.
[0009] Also, in the ceramic electronic component of JP-A-11-67575, considering that if the content ratio of pores exceeds 30% by volume, the flexural strength of the ceramic element body will decrease, and since the content ratio of pores is 3 to 30% by volume Therefore, the range of specific permittivity reduction is limited, and in fact, it cannot fully meet the requirements for ceramic electronic components with higher characteristics in recent years.
[0010] In addition, in the ceramic electronic component disclosed in JP-A-11-67575, there is a problem that the reliability is lowered because the pores contained in the ceramics easily enter water and the water absorption rate increases.

Method used

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  • Ceramic electronic component and manufacturing method thereof
  • Ceramic electronic component and manufacturing method thereof
  • Ceramic electronic component and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0066] Embodiment 1 Production of ceramic sintered body with pores

[0067] In Embodiment 1, a method for forming a ceramic sintered body having pores will be described.

[0068] (1) First, in order to obtain a NiZnCu ferrite material having a magnetic permeability μ of 400, oxide raw materials of nickel, zinc, and copper were mixed and fired at 800° C. for 1 hour.

[0069] (2) Then, it was pulverized by a ball mushroom machine and dried to obtain a ferrite raw material (oxide mixed powder) having an average particle diameter of about 2 μm.

[0070] (3) Then, to the ferrite raw material obtained, commercially available spherical polymers were added in various proportions as shown in Table 1 [this embodiment 1 is a spherical burnt material composed of cross-linked polystyrene (average particle diameter = 8 μm, trade name: TECHPOLYMER, manufactured by Sekisui Plastics Co., Ltd. (SEKISUI PLASTICS CO., LTD.) Add solvent, binder, and dispersant to mix, manufacture and prepare cer...

Embodiment approach 2

[0096] Embodiment 2 Production of ceramic sintered body with pores

[0097] (1) As in the above-mentioned Embodiment 1, the pore ratio was adjusted by changing the amount of the mixed organic material, and the same ceramic sintered body as obtained in (5) of of Embodiment 1 was produced.

[0098] (2) Next, an epoxy resin having a dielectric constant of 3.4 was impregnated into the pores of the ceramic sintered body, and heated to 150° C. to cure the epoxy resin.

[0099] In this way, the dielectric constant, magnetic permeability, flexural strength, and water absorption of the ceramic sintered body filled with resin in the pores were measured. The results are shown in Table 2.

[0100] sample

serial number

spherical poly

Heping

Average particle size

(μm)

porosity

diameter

(μm)

porosity

Rate

(%)

fill the void with glass

water absorption

(%)

Flexural strength

Spend

(MPa...

Embodiment approach 3

[0118] (1) A porous ferrite (ceramic sintered body) having a porosity of 60 vol % was fabricated by the same method as in the first and second embodiments described above.

[0119] (2) Then, impregnate the porous ferrite in a solution that dilutes an epoxy resin with a dielectric constant of 3.4 to a viscosity of 300mPa·s and 500mPa·s with an organic solvent, and then heat it at 150°C for 30 minutes to cure epoxy resin.

[0120] Then, the porosity, dielectric constant, and flexural strength of the epoxy resin-impregnated and cured porous ferrite thus obtained were measured.

[0121]For impregnating a solvent-free epoxy resin with a dielectric constant of 8.4 and a viscosity of 5000mpa·s and curing the same sample, measure the porosity, dielectric constant and flexural strength. The results are shown in Table 3.

[0122] Filler

Porosity

(vol%)

Dielectric constant

Flexural strength

(MPa)

before filling

60

6.6

20

Fil...

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Abstract

The invention provides a ceramic electronic component having the low dielectric constant of a ceramic sintered body and excellent impedance properties in a GHz zone and capable of obtaining high impedance properties in a wide frequency range, and its manufacturing method. This ceramic electronic component is formed by forming a green compact which includes an electrode therein with a ceramic compound comprising a ceramic raw material, a binder and a spherical or granular combustible material having adhesiveness to the binder. The green compact is fired to form the ceramic sintered compact including the electrode and containing about 35 to 80 volume percent pores. The pores of the ceramic sintered compact are filled with resin or glass.

Description

technical field [0001] The present invention relates to a ceramic electronic component and a manufacturing method thereof, in particular to a ceramic electronic component such as an inductor which has excellent impedance characteristics in a high-frequency region such as the GHz region and which can obtain high impedance over a wide frequency range, and a manufacturing method thereof. Background technique [0002] In recent years, with the increase in frequency of electric appliances, inductors, LC composite parts, LR composite parts, LCR composite parts, etc. that can cope with high frequencies in the GHz region are required. [0003] However, in inductors for high-frequency regions, the stray capacitance generated in coils and parallel lines has a great influence on the inductor, especially in the GHz region, the influence of small stray capacitance of about 1 / 100pF to 1 / 10pF on the inductor Big. Therefore, if it is desired to reduce the stray capacitance to ensure desire...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01F1/22H01F17/00H01F17/04H03H7/01H05K1/03
CPCH03H7/0115H01F17/045H01F1/22H05K1/0306H01F2017/0026H01F17/0013H03H2001/0085Y10T29/43H01G4/12
Inventor 内田胜之河端利夫大槻健彦杉谷昌美西井基坂本幸夫立花薰
Owner MURATA MFG CO LTD
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