Deep learning-based tiny target defect identification model training method
Through deep learning methods of multi-scale feature fusion, spatial attention and multi-model fusion, combined with multi-source data and time series modeling, the missed detection and missed detection of micron- and sub-micron-level defects are solved, and efficient and reliable defect identification is achieved.
Patent Information
- Application Number
- CN202510948990.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-10
- Publication Date
- 2025-08-08
- Estimated Expiration
- 2045-07-10
AI Technical Summary
When detecting micron- and sub-micron-level defects, the leakage detection rate is high and the misjudgment rate is high, making it difficult to meet the needs of modern wafer manufacturing with high yield and high productivity, especially in the context of complex circuits.
Multi-scale feature fusion and spatial attention are used to highlight weak targets, combined with layer-by-layer screening and secondary intensive training, through multi-model fusion and online dynamic tuning, defect identification is used using multi-source data such as infrared, X-ray or 3D morphology, time series modeling is introduced, and defect detection system with multi-modal and timing dimensions is constructed.
It significantly reduces the missed detection rate and false detection rate, improves the detection efficiency and adaptability of micron-level defects in the context of complex processes, and can reliably identify hidden or early cracks, forming a defect identification system with high sensitivity, reliability and significant scalability.