Deep learning-based tiny target defect identification model training method

Through deep learning methods of multi-scale feature fusion, spatial attention and multi-model fusion, combined with multi-source data and time series modeling, the missed detection and missed detection of micron- and sub-micron-level defects are solved, and efficient and reliable defect identification is achieved.

CN120451160AActive Publication Date: 2025-08-08TONGJI UNIV
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Patent Information

Application Number
CN202510948990.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-07-10
Publication Date
2025-08-08
Estimated Expiration
2045-07-10

AI Technical Summary

Technical Problem

When detecting micron- and sub-micron-level defects, the leakage detection rate is high and the misjudgment rate is high, making it difficult to meet the needs of modern wafer manufacturing with high yield and high productivity, especially in the context of complex circuits.

Method used

Multi-scale feature fusion and spatial attention are used to highlight weak targets, combined with layer-by-layer screening and secondary intensive training, through multi-model fusion and online dynamic tuning, defect identification is used using multi-source data such as infrared, X-ray or 3D morphology, time series modeling is introduced, and defect detection system with multi-modal and timing dimensions is constructed.

Benefits of technology

It significantly reduces the missed detection rate and false detection rate, improves the detection efficiency and adaptability of micron-level defects in the context of complex processes, and can reliably identify hidden or early cracks, forming a defect identification system with high sensitivity, reliability and significant scalability.

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Abstract

The invention discloses a deep learning-based small target defect recognition model training method, relates to the technical field of defect recognition model training, and aims at meeting small defect detection requirements, starting with high-resolution diversified data construction and accurate labeling, highlighting weak targets through multi-scale feature fusion and spatial attention, and realizing high-resolution target defect recognition. A hard case scene is processed in cooperation with layer-by-layer screening and secondary intensified training, real-time iterative optimization is achieved through multi-model fusion and online dynamic adjustment and optimization, finally, multi-mode and time sequence dimensions are expanded to capture deeper and dynamic defect information, the missing detection and false detection rate is greatly reduced, and the detection efficiency is improved. The detection efficiency and adaptability of micron-sized defects under a complex process background are improved; furthermore, by means of multi-source data such as infrared, X-ray or 3D morphology and a time sequence modeling means, multiple dimensions are fused, and hidden or early cracks are brought into a detection and prediction range, so that a high-reliability and evolvable intelligent recognition system for the tiny target defects is constructed.
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