Electronic component model acquisition method based on time-sharing fusion imaging, medium and product

Abstract

The invention provides an electronic component model acquisition method based on time-sharing fusion imaging, a medium and a product, and relates to the technical field of 3D imaging. The method comprises the steps that a plurality of light sources are utilized to irradiate a target electronic element one by one, images of the target electronic element under irradiation of different light sources are collected, colors of light emitted by the different light sources are different, and the angles of the different light sources relative to the target electronic element are different; according to the embodiment of the invention, the image of the target electronic component can be obtained through a multi-color multi-angle time-sharing fusion imaging mode, the matching degree of the three-dimensional model and the target electronic component is improved, the model precision is high, the color information of the electronic component can be accurately obtained, the equipment cost is low, and the implementation is easy. The model obtaining efficiency is high, and production requirements are effectively met.

Description

Technical Field

[0001] The present application relates to the field of 3D imaging technology. Specifically, the present application relates to a method, medium and product for obtaining an electronic component model based on time-sharing fusion imaging. Background Art

[0002] Surface Mount Technology (SMT), also known as surface mounting or surface mounting technology, is a circuit assembly technology that mounts leadless or short-lead surface mount components (SMC / SMD, also known as chip components in Chinese) on the surface of a printed circuit board (PCB) or other substrate, and then assembles them through soldering methods such as reflow soldering or dip soldering.

[0003] The miniaturization and high-density placement of surface-mounted (SMT) components are the current trends in electronics manufacturing, placing higher demands on SMT component inspection. Prior art uses laser scanning to obtain a three-dimensional model of the target electronic component during electronic component production. This model is then used to verify that parameters such as solder paste size and placement position meet the required specifications. While this method offers high accuracy, it is time-consuming, difficult to obtain color information, and the equipment is expensive, making it difficult to meet production requirements. Summary of the Invention

[0004] The present invention provides a method, medium, and product for acquiring electronic component models based on time-sharing fusion imaging. These methods address the time-consuming, inefficient, and high-cost nature of existing methods for acquiring three-dimensional models of electronic components. To achieve this goal, the present invention provides the following solutions.

[0005] According to one aspect of an embodiment of the present application, a method for acquiring an electronic component model based on time-sharing fusion imaging is provided, comprising: Utilizing multiple light sources to illuminate target electronic components one by one, and collecting images of the target electronic components under illumination by different light sources, wherein the light emitted by different light sources has different colors, and the angles of the different light sources relative to the target electronic components are different; A three-dimensional model of the target electronic component is generated according to the image.

[0006] In a possible implementation, the light source is disposed between the target electronic component and a camera, and the camera is used to capture an image of the target electronic component; Different light sources are at different heights relative to the target electronic component, and the light sources surround the optical axis of the camera.

[0007] In one possible implementation, each light source includes a plurality of partitions, the partitions surrounding the optical axis, and irradiating target electronic components one by one using the plurality of light sources includes: Determine the target light source currently emitting light according to the illumination sequence, wherein the illumination sequence includes the illumination sequence of the light sources and the illumination sequence of the subareas within the light sources; The subareas of the target light source are controlled to illuminate the target electronic components one by one according to the lighting sequence of the subareas in the light source.

[0008] In one possible implementation, generating a three-dimensional image of the target electronic component according to the image includes: Acquiring three-dimensional coordinate information of the surface of the target electronic component according to the image, and extracting color features of the target electronic component using the image; A three-dimensional model of the target electronic component is constructed according to the three-dimensional coordinate information and the color information.

[0009] In one possible implementation, acquiring three-dimensional coordinate information of the surface of the target electronic component according to the image includes: Acquire illumination information corresponding to the image, the illumination information including at least one of light color, illumination direction, distance between the camera and the target electronic component, incident light intensity, reflectivity, and reflected light intensity; Determining a height function of the surface of the target electronic component, and obtaining an error function corresponding to the height function according to the illumination information; The height function is iteratively optimized based on the error function to obtain a height value of the surface of the target electronic component, where the error function is the sum of errors of images corresponding to multiple light sources.

[0010] In one possible implementation, the error function is expressed as:

[0011] Where, is the error function, c is the number of the light color, k is the number of the light direction, m is the total number of light colors, is the total number of lighting directions, is the reflected light intensity under the cth light color and kth light direction, is the reflectivity of the target electronic component to the cth light color, is the incident light intensity corresponding to the cth light color, is a function of height The partial derivative on the x-axis is, is the component of the light direction vector on the x-axis, is a function of height The partial derivative on the y-axis is, is the component of the light direction vector on the y-axis, is the component of the illumination direction vector on the z-axis, and the camera optical axis is the positive direction of the z-axis.

[0012] In one possible implementation, extracting the color feature of the target electronic component using the image includes: determining first reflected light intensity information of different positions of the target electronic component according to the three-dimensional coordinate information and the reflected light intensity, wherein the first reflected light intensity information includes reflected light intensities of the positions for different light colors; A texture image of the target electronic component is generated based on the first reflected light intensity information and the three-dimensional coordinate information.

[0013] According to one aspect of an embodiment of the present application, an embodiment of the present application provides a computer-readable storage medium having a computer program stored thereon, and the computer program implements the steps of the above-described method when executed.

[0014] According to one aspect of an embodiment of the present application, an embodiment of the present application provides a computer program product, including a computer program, which implements the steps of the above method when executed by a processor.

[0015] The beneficial effects of the technical solution provided by the embodiments of the present application are: The electronic component model acquisition method based on time-sharing fusion imaging provided in the present application utilizes multiple light sources to illuminate the target electronic component one by one, and collects images of the target electronic component under the illumination of different light sources. The light emitted by different light sources has different colors, and the angles of different light sources relative to the target electronic component are different; a three-dimensional model of the target electronic component is generated according to the image. The embodiment of the present application can acquire the image of the target electronic component through multi-color and multi-angle time-sharing fusion imaging, thereby improving the matching degree between the three-dimensional model and the target electronic component. The model has high accuracy and can accurately acquire the color information of the electronic component. The equipment cost is low and the model acquisition efficiency is high, effectively meeting production needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following is a brief introduction to the drawings required for describing the embodiments of the present application.

[0017] Figure 1 A flowchart of a method for acquiring an electronic component model based on time-sharing fusion imaging provided in an embodiment of the present application; Figure 2 A schematic diagram of the arrangement of the camera, light source, and target electronic components provided in an embodiment of the present application; Figure 3 A schematic diagram of a partition arrangement in a light source provided in an embodiment of the present application; Figure 4 A schematic diagram of obtaining a three-dimensional model provided in an embodiment of the present application; Figures 5a to 5d Chip images captured under different partitions of a blue light source provided in an embodiment of the present application; Figures 6a to 6d Chip images captured under different partitions of a green light source provided in an embodiment of the present application; Figures 7a to 7d Chip images captured under different partitions of the red light source provided in the embodiment of the present application; Figures 8a to 8c The embodiment of this application provides Figure 6a-Figure 7d The texture image obtained by the chip image; Figure 9 The embodiment of this application provides Figure 5a-Figure 8b The three-dimensional shape of the image is obtained. DETAILED DESCRIPTION

[0018] The following describes the embodiments of the present application in conjunction with the accompanying drawings. It should be understood that the embodiments described below in conjunction with the accompanying drawings are exemplary descriptions for explaining the technical solutions of the embodiments of the present application and do not constitute a limitation on the technical solutions of the embodiments of the present application.

[0019] Those skilled in the art will understand that, unless otherwise stated, the singular forms "a," "an," "said," and "the" used herein may also include plural forms. It should be further understood that the terms "including" and "comprising" used in the embodiments of the present application mean that the corresponding features can be implemented as the presented features, information, data, steps, operations, elements, and / or components, but do not exclude implementation as other features, information, data, steps, operations, elements, components, and / or combinations thereof supported by the present technical field. It should be understood that when we refer to an element as being "connected" or "coupled" to another element, the element can be directly connected or coupled to the other element, or it can refer to the element and the other element establishing a connection relationship through an intermediate element. In addition, the "connection" or "coupling" used herein may include wireless connection or wireless coupling. The term "and / or" used herein indicates at least one of the items defined by the term, for example, "A and / or B" indicates implementation as "A," or implementation as "A," or implementation as "A and B."

[0020] In order to make the objectives, technical solutions and advantages of this application clearer, the implementation methods of this application will be further described in detail below with reference to the accompanying drawings.

[0021] The following describes several exemplary embodiments to illustrate the technical solutions of the embodiments of the present application and the technical effects produced by the technical solutions of the present application. It should be noted that the following embodiments can refer to, draw on, or combine with each other, and the same terms, similar features, and similar implementation steps in different embodiments will not be repeated.

[0022] The electronic component model acquisition method, medium and product based on time-sharing fusion imaging provided in this application are intended to solve at least one technical problem existing in the prior art.

[0023] Optionally, the device that executes the electronic component model acquisition method based on time-sharing fusion imaging of the present application can be a mobile phone, tablet computer, server, SMT patch equipment and other terminals that can collect target electronic component models and generate three-dimensional models.

[0024] Alternatively, as Figures 1-9 As shown, the electronic component model acquisition method based on time-sharing fusion imaging of the present application includes: S101: Utilize multiple light sources to illuminate target electronic components one by one, and collect images of the target electronic components illuminated by different light sources.

[0025] Optionally, the target electronic component can be a chip, SMT component, textile or other object that requires generating a three-dimensional model. The type of the target electronic component can be determined according to the actual environment. After obtaining the three-dimensional model, the target electronic component can be measured, processed, transported and other operations can be performed based on the actual needs of the three-dimensional model.

[0026] Optionally, the light emitted by the different light sources has different colors, and the different light sources have different angles relative to the target electronic component. Each light source can emit pure light of a specific color, such as three light sources each emitting red, green, and blue light. A larger number of light sources can also be provided, as long as the different light sources emit light of different colors.

[0027] In one embodiment, Figure 2 As shown, multiple light sources are provided, solder paste is provided on the side of the target electronic component, the light source can be provided between the target electronic component and the camera, and the camera is used to capture the image of the target electronic component provided with solder paste; different light sources have different heights relative to the target electronic component, and the light sources surround the optical axis of the camera.

[0028] Alternatively, the light source may be located at the same height as the camera lens, or above the camera. The relative positions of the camera and the light source may be determined based on image acquisition requirements, acquisition effects, and image acquisition environment.

[0029] Optionally, the number of cameras can be single or multiple. When there are multiple cameras, a 3D model can be constructed using images from each camera, and the 3D models corresponding to all cameras can be integrated to obtain a final 3D model of the target electronic component.

[0030] Optionally, the different light sources may be partially or completely located at the same height relative to the target electronic component. It is only necessary that the illumination angles of the light sources are different so as to capture images of various positions of the target electronic component as much as possible.

[0031] Alternatively, the light source can be an RGB light source or a light source emitting light of other specific wavelengths. The light color of the light source can be determined based on the type of target electronic component and image acquisition requirements. The light emitted by the light source illuminates the surface of the target electronic component, providing a basis for obtaining color information of the target electronic component and enhancing the surface features of the target electronic component.

[0032] Alternatively, the size of the light source may be determined according to the size of the target electronic component and the resolution requirement of the image.

[0033] In one embodiment, the minimum diameter of the light source may be twice the smallest feature size of the target electronic component to be inspected. For example, if the diameter of the solder joint to be inspected of the target electronic component is 0.1 mm, the minimum diameter of the light source may be greater than or equal to 0.2 mm.

[0034] Optionally, to avoid overlapping of light spots, the distance between adjacent light sources may be greater than 1.5 times the diameter of the light source, and the size difference between the light sources may be less than or equal to 20%.

[0035] Optionally, the light source can be annular, and the light source of each color includes multiple partitions, which surround the optical axis, and the target electronic components are illuminated one by one by using multiple light sources, including: determining the currently emitting target light source according to the lighting sequence, the lighting sequence includes the lighting sequence of the light source and the lighting sequence of the partitions in the light source; controlling the partitions of the target light source to illuminate the target electronic components one by one according to the lighting sequence of the partitions in the light source.

[0036] Optionally, the number of partitions of the light source can be 4, 6, 8, 10, or other numbers, and the number of partitions of different light sources can be the same or different. The colors of light emitted by different partitions of the same light source can be the same or different.

[0037] In one embodiment, Figure 3 As shown, the light source is an annular structure with eight sub-areas, designated as sub-areas 0 through 7. The optical axis of the camera used to capture images is located at the center of the annular structure. After determining the target light source currently being illuminated, the sub-areas of the target light source can be controlled to illuminate one by one in a clockwise direction. As each sub-area illuminates, the camera captures one or more images of the target electronic component.

[0038] In one embodiment, when the number of partitions is 4 and the light sources are blue, green, and red, the collected chip image can be as follows: Figure 5a-Figure 7d As shown, the chip image is collected when each light source is illuminated by a partition. Figure 5a-5d These are chip images captured under the sequential illumination of the first to fourth subareas of the blue light source. Figure 6a-6d These are chip images captured under sequential illumination from the first to fourth subareas of the green light source. Figure 7a-7d These are chip images captured under the sequential illumination of the first to fourth subareas of the red light source.

[0039] Optionally, the light source's illumination can be controlled by a time-sharing control module. This module, connected to the light source, prevents simultaneous illumination from different light sources and coordinates their operating timing. Through precise timing control, the module enables light sources emitting different colors to illuminate an object at different times. Specifically, the light source can illuminate 1ms before the camera captures the image and continue illuminating until the camera exposure ends. The camera then captures the image at the corresponding moment the light source illuminates, achieving multi-color, multi-angle, time-sharing imaging.

[0040] In one embodiment, the time-sharing control module may include a microcontroller for controlling the on / off timing of each light source partition. The light source's lighting timing error may be set to less than 1 microsecond. The light source may include three light sources: red, green, and blue. During image acquisition, the red light source may be turned on first, triggering camera exposure 5ms after it is turned on. After each partition of the red light source finishes emitting light, the red light source is turned off, and then the green light source is switched on. This cycle of turning on each light source and capturing images is repeated until image acquisition is complete.

[0041] Optionally, the time-sharing control module can use a hardware trigger signal (such as GPIO) to trigger the light source or camera to work synchronously to ensure the consistency of data acquisition.

[0042] In one embodiment, when capturing images, the target electronic component is placed on a platform, and the camera and light source parameters are adjusted. These parameters include light intensity, camera exposure time, and focal length. These parameters can be determined based on image acquisition requirements, 3D model accuracy requirements, and other conditions. After parameter adjustment, the time-sharing control module sequentially triggers the different light sources to illuminate. Each light source illuminates the camera, and the camera captures the object accordingly. For example, the red light source is first activated, and the camera captures a set of electronic component models illuminated by red light. Then, the light source is switched to green, and the camera captures the image again. This process continues until all light sources are illuminated, resulting in images of the target electronic component under different lighting conditions. Specifically, the light source can be an annular RGB light source with 12 segments, a diameter of 50 mm, and 80 mm spacing between adjacent light sources. The camera can be equipped with a 20-megapixel CMOS sensor, a frame rate of 30 fps, and a telecentric lens. The camera exposure time can be 10 ms for each segment when each light source is activated. If there are three light sources, each with four segments, the total imaging period is 120 ms.

[0043] S102: Generate a three-dimensional model of the target electronic component according to the image.

[0044] Optionally, generating a three-dimensional image of a target electronic component based on an image includes: obtaining three-dimensional coordinate information of the target electronic component's surface based on the image, extracting color features of the target electronic component using the image; and constructing a three-dimensional model of the target electronic component based on the three-dimensional coordinate information and color information. The three-dimensional coordinate information can be obtained by using parallax between images at different illumination angles, and the color information can be determined by using images obtained under different light sources. A three-dimensional model of the target electronic component is obtained based on the color information and three-dimensional coordinate information.

[0045] Optionally, after acquiring the image, the image may be preprocessed, wherein the preprocessing includes denoising, correction and other processing methods to reduce noise in the image.

[0046] Optionally, obtaining three-dimensional coordinate information of the surface of the target electronic component based on the image includes: obtaining lighting information corresponding to the image, the lighting information including at least one of light color, lighting direction, distance between the camera and the target electronic component, incident light intensity, reflectivity, and reflected light intensity; determining a height function of the surface of the target electronic component, and obtaining an error function corresponding to the height function based on the lighting information; iteratively optimizing the height function based on the error function to obtain a height value of the surface of the target electronic component, the error function being the sum of errors of images corresponding to multiple light sources.

[0047] Optionally, the error function is expressed as:

[0048] Where, is the error function, c is the number of the light color, k is the number of the light direction, m is the total number of light colors, is the total number of lighting directions, is the reflected light intensity under the cth light color and kth light direction, is the reflectivity of the target electronic component to the cth light color, is the incident light intensity corresponding to the cth light color, is a function of height The partial derivative on the x-axis is, is the component of the light direction vector on the x-axis, is a function of height The partial derivative on the y-axis is, is the component of the light direction vector on the y-axis, is the component of the illumination direction vector on the z-axis, and the camera optical axis is the positive direction of the z-axis.

[0049] Optionally, the origin of the coordinate system formed by the x-axis, y-axis, and z-axis may be the optical center of the camera, and the coordinate system may be a Cartesian coordinate system, with the target electronic component located on the plane z = d, where d is the distance between the camera and the plane where the object to be measured is located.

[0050] Optionally, when obtaining the illumination direction information, the angle between the camera optical axis and the illumination direction of each light source partition and the camera azimuth are obtained, and each component of the illumination direction vector is obtained based on the angle and the camera azimuth.

[0051] In one embodiment, the angle (tilt angle) between the camera optical axis and the illumination direction is , c is the number of the light color emitted by the light source, k is the number of the light direction, and the camera azimuth is , convert the angle and the camera azimuth into radians: , Correspondingly, the light direction vector The components are:

[0052]

[0053]

[0054] In one embodiment, the surface of the target electronic component may be a Lambertian surface, and for each light color, the reflected light intensity satisfy .in is the reflectivity of the object surface for that light color, is the incident light intensity corresponding to the light color, is the normal vector of the object surface, c is the light color number (such as c=1 for red, c=2 for green, c=3 for blue), m is the total number of light colors, and k is the light source angle number.

[0055] Optionally, the height function is a height function of the target electronic component surface, which can be expressed as The normal vector of the target electronic component surface can be expressed as At a small slope (such as a slope less than 10 degrees), the surface of the target electronic component is close to horizontal, and the vertical vector is close to 1, that is, , .

[0056] In one embodiment, when gradient descent is used for iterative optimization, the height function is discretized into a pixel-level matrix, where each pixel in the matrix corresponds to a point on the surface of the target electronic component. The height value of each pixel can be iteratively optimized by gradient descent, so that the error function Convergence. Determine the coordinate information (such as height value) of each point on the surface of the target electronic component based on the iteration results. ), the partial derivative of the error function is obtained by the finite difference method: , , Represents a pixel ( ) corresponding coordinate information (height value), Represents a pixel ( ) corresponding coordinate information (height value), Represents a pixel ( ) corresponding coordinate information (height value), in (i.e. the difference between the x and y coordinates of the ith pixel and the i+1th pixel is 1), then the error function is about The partial derivative of Learning rate The initial value can be set to 0.01. If the error exceeds the convergence threshold after each iteration, Halve the maximum number of iterations The convergence threshold will be set according to the image resolution (e.g., if the resolution is 1000*1000 pixels, K=500). The initial value can be set to 0.00001. Initialize the height value matrix of the object surface (that is, the pixel-level matrix obtained by discretization) , the size of the matrix is the same as the image size, and all elements in the matrix are set to 0, that is, , The number of iterations can be K. For each pixel ( ), calculated according to the following formula:

[0057] Where, Represents the kth iteration. Use the gradient descent formula to update the height value. The gradient descent formula is: , Indicates the height value of pixel (i, j) after the kth iteration. Calculate the sum of the height changes of all pixels. Or the maximum number of iterations is reached, the iteration is stopped, otherwise the next iteration is continued. After the iteration converges, the height value matrix Each element in This is the height value of the corresponding pixel. Through these height values, combined with the coordinates of the pixel , the three-dimensional coordinate information of the target electronic component surface can be constructed ( ), thereby obtaining the three-dimensional shape information of the target electronic component.

[0058] Optionally, to improve the convergence speed and stability during the gradient descent optimization process, the Adam optimizer can be used to dynamically adjust α to accelerate convergence and add a momentum term (β = 0.9) to reduce oscillations.

[0059] Optionally, the color characteristics of the target electronic component are extracted using an image, including: determining first reflected light intensity information of different positions of the target electronic component based on three-dimensional coordinate information and reflected light intensity, the first reflected light intensity information including the reflected light intensity of the position for different light colors; and generating a texture image of the target electronic component based on the first reflected light intensity information and three-dimensional coordinate information.

[0060] In one embodiment, since the reflectivity of light at different locations on the surface of the target electronic component may vary, after obtaining the three-dimensional coordinate information of the surface of the target electronic component, the reflectivity of the surface of the object for each light color can be inferred by the Lambertian reflection model. The incident light intensity of each light color The reflected light intensity can be pre-determined by calibration experiment using a photometer. It can also be obtained by measurement. We can get: , Represents the reflectivity of point (x, y) under the cth light color. If the same light color illuminates the same point at different angles, the resulting reflectivity varies. These reflectivities can be weighted averaged to calculate the reflectivity for that light color, improving the accuracy of the reflectivity calculation.

[0061] After obtaining the reflectivity at different locations, the coordinates (x, y) of each point and the corresponding reflectivity Combined, the reflectivity to RGB formula is used to obtain the RGB color value of each point, that is, the color value of the texture image at point (x, y), thereby constructing the texture image of the object. The reflectivity to RGB formula is as follows: , ,

[0062] Where, Represents the reflectivity of point (x, y) for red, Indicates the maximum reflectivity of the target electronic component to red. Represents the reflectivity of point (x, y) for green, Indicates the maximum reflectivity of the target electronic component to green. Represents the reflectivity of the point (x, y) for blue, Indicates the maximum reflectivity of the target electronic component to the color blue. A 3D model of the target electronic component is established based on the 3D coordinates of each point on the surface of the target electronic component and the color corresponding to the 3D coordinates.

[0063] In one embodiment, Figure 4 Different light sources have different angles relative to the target electronic component. The images collected under different light sources and different partitions can be represented as (high angle L0...low angle Ln) according to the angle, light source, and time-sharing fusion processing. The three-dimensional shape and texture image formed by the coordinates of each position of the target electronic component are obtained, and the three-dimensional shape and texture image are fused to obtain the three-dimensional model of the target electronic component. Specifically, when the target electronic component is an FPGA chip, the chip images collected under different light sources can be as follows: Figures 5a-8c As shown, based on these images, the colors corresponding to different coordinates on the FPGA chip are obtained, thereby obtaining Figure 8a-8c The texture image shown, where Figure 8a The image can be based on Figure 5a-5d The image is obtained, Figure 8b The image can be based on Figure 6a-6d The image is obtained, Figure 8c The images can be based on Figures a to Figure 7d The image is obtained and then used Figures 5a-8c Generate the 3D shape of the FPGA chip from the image in .

[0064] The electronic component model acquisition method based on time-sharing fusion imaging provided in this application has the following advantages: Improve measurement accuracy: Through multi-color, multi-angle, time-sharing fusion imaging, reduce measurement blind spots and improve measurement accuracy for objects with complex shapes.

[0065] Achieve high-precision fusion of color and shape information: Accurately obtain the three-dimensional shape and true color information of objects to meet the needs of all-round digitization of objects.

[0066] Improve efficiency: Use time-sharing fusion imaging technology to reduce measurement time and data processing complexity, achieving fast and efficient 3D model acquisition.

[0067] Based on the same inventive concept, an embodiment of the present application provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by an electronic device / processor, it implements the steps of any method provided in the present application / implements the steps of various optional implementation methods of the method provided in the present application.

[0068] Based on the same inventive concept, an embodiment of the present application provides a computer program product, which includes a computer program, which, when executed by an electronic device / processor, implements the steps of any method provided in the present application / implements the steps of various optional implementation methods of the method provided in the present application.

[0069] Those skilled in the art will appreciate that the steps, measures, and schemes in the various operations, methods, and processes discussed in this application may be interchanged, modified, combined, or deleted. Furthermore, other steps, measures, and schemes in the various operations, methods, and processes discussed in this application may also be interchanged, modified, rearranged, decomposed, combined, or deleted. Furthermore, steps, measures, and schemes in the related art that are similar to those disclosed in this application may also be interchanged, modified, rearranged, decomposed, combined, or deleted.

[0070] In the description of the present application, the directions or positional relationships indicated by words such as "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", and "outside" are based on the exemplary directions or positional relationships shown in the accompanying drawings. They are for the convenience of describing or simplifying the description of the embodiments of the present application, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present application.

[0071] In the specification and claims of this application and the accompanying drawings, the terms "first," "second," "third," "fourth," "1," "2," and so on (if any) are used to distinguish similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that the terms used in this manner are interchangeable where appropriate, such that the embodiments of the present application described herein can be practiced in an order other than that shown or described.

[0072] It should be understood that, although each operation step is indicated by arrows in the flowchart of the embodiment of the present application, the order of implementation of these steps is not limited to the order indicated by the arrows. Unless otherwise clearly stated herein, in some implementation scenarios of the embodiment of the present application, the implementation steps in each flowchart can be performed in other orders according to demand. In addition, some or all of the steps in each flowchart can include multiple sub-steps or multiple stages based on actual implementation scenarios. Some or all of these sub-steps or stages can be executed at the same time, and each sub-step or stage in these sub-steps or stages can also be executed at different times respectively. Under different scenarios at the execution time, the execution order of these sub-steps or stages can be flexibly configured according to demand, and the embodiment of the present application does not limit this.

[0073] The above is only an optional implementation method for some implementation scenarios of this application. It should be pointed out that for ordinary technicians in this technical field, without departing from the technical concept of the solution of this application, the use of other similar implementation methods based on the technical ideas of this application also falls within the protection scope of the embodiments of this application.

Claims

1. A method for acquiring an electronic component model based on time-sharing fusion imaging, characterized in that: include: Utilizing multiple light sources to illuminate target electronic components one by one, and collecting images of the target electronic components under illumination by different light sources, wherein the light emitted by different light sources has different colors, and the angles of the different light sources relative to the target electronic components are different; A three-dimensional model of the target electronic component is generated according to the image.

2. The method for acquiring electronic component models based on time-sharing fusion imaging according to claim 1, characterized in that: The light source is provided between the target electronic component and a camera, and the camera is used to capture an image of the target electronic component; Different light sources are at different heights relative to the target electronic component, and the light sources surround the optical axis of the camera.

3. The method for acquiring electronic component models based on time-sharing fusion imaging according to claim 2, characterized in that: Each light source includes a plurality of partitions, and the partitions surround the optical axis. The method of irradiating target electronic components one by one using the plurality of light sources includes: Determine the target light source currently emitting light according to the illumination sequence, wherein the illumination sequence includes the illumination sequence of the light sources and the illumination sequence of the subareas within the light sources; The subareas of the target light source are controlled to illuminate the target electronic components one by one according to the lighting sequence of the subareas in the light source.

4. The method for acquiring electronic component models based on time-sharing fusion imaging according to claim 2, characterized in that: Generating a three-dimensional image of the target electronic component according to the image includes: Acquiring three-dimensional coordinate information of the surface of the target electronic component according to the image, and extracting color features of the target electronic component using the image; A three-dimensional model of the target electronic component is constructed according to the three-dimensional coordinate information and the color information.

5. The method for acquiring electronic component models based on time-sharing fusion imaging according to claim 4, characterized in that: The acquiring three-dimensional coordinate information of the surface of the target electronic component according to the image includes: Acquire illumination information corresponding to the image, the illumination information including at least one of light color, illumination direction, distance between the camera and the target electronic component, incident light intensity, reflectivity, and reflected light intensity; Determining a height function of the surface of the target electronic component, and obtaining an error function corresponding to the height function according to the illumination information; The height function is iteratively optimized based on the error function to obtain a height value of the surface of the target electronic component, where the error function is the sum of errors of images corresponding to multiple light sources.

6. The method for acquiring electronic component models based on time-sharing fusion imaging according to claim 5, characterized in that: The expression of the error function is: Where, is the error function, c is the number of the light color, k is the number of the light direction, m is the total number of light colors, is the total number of lighting directions, is the reflected light intensity under the cth light color and kth light direction, is the reflectivity of the target electronic component to the cth light color, is the incident light intensity corresponding to the cth light color, is a function of height The partial derivative on the x-axis is, is the component of the light direction vector on the x-axis, is a function of height The partial derivative on the y-axis is, is the component of the light direction vector on the y-axis, is the component of the illumination direction vector on the z-axis, and the camera optical axis is the positive direction of the z-axis.

7. The method for acquiring electronic component models based on time-sharing fusion imaging according to claim 5, characterized in that: The step of extracting the color feature of the target electronic component by using the image includes: determining first reflected light intensity information of different positions of the target electronic component according to the three-dimensional coordinate information and the reflected light intensity, wherein the first reflected light intensity information includes reflected light intensities of the positions for different light colors; A texture image of the target electronic component is generated based on the first reflected light intensity information and the three-dimensional coordinate information.

8. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed, the steps of the method according to any one of claims 1 to 7 are implemented.

9. A computer program product comprising a computer program, characterized in that When the computer program is executed by a processor, the steps of the method according to any one of claims 1 to 7 are implemented.

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