Floating ball linkage type PCB electroplating bath liquid level mechanical adjusting device

Abstract

The invention relates to the technical field of circuit board electroplating, in particular to a floating ball linkage type PCB electroplating bath liquid level mechanical adjusting device which comprises an electroplating bath, a switch button, a connecting rod mechanism and a guide rail and further comprises a floating ball, a driving assembly, an annular plate assembly and a protection assembly. The floating ball is driven to rotate through the driving assembly, pitting corrosion caused by the fact that the bottom of the floating ball is still below the liquid level for a long time is avoided, meanwhile, the situation that the weight of the floating ball is affected after electroplating liquid attached to the upper side of the floating ball is condensed into solid is avoided, and therefore the accuracy of liquid level measurement and control of the floating ball is guaranteed; meanwhile, the floating ball is separated from the fluctuating liquid level through the annular plate assembly, so that the influence of liquid level fluctuation on the floating ball is reduced to a certain extent; in addition, protection airflow is formed on the surface, close to the liquid level, of the connecting rod mechanism through the protection assembly, so that the surface, close to the liquid level, of the connecting rod mechanism is dry and clean, and the situation that the liquid level control accuracy of the floating ball is affected due to the weight change caused by condensation of by-products is avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit board electroplating, and in particular to a float-linked PCB electroplating tank liquid level mechanical regulating device. Background Art

[0002] In the PCB electroplating process, the stability of the liquid level in the plating tank is a core factor in ensuring the uniformity of the plating layer, the quality of the hole metallization, and the safe operation of the equipment. As a common liquid level control device, the float-linked liquid level controller is widely used in various industrial tank level control applications, including electroplating tanks, due to its simple structure, easy installation, and relatively low cost. The core component of this device is the float, which is usually made of lightweight materials such as stainless steel, aluminum alloy, or polyimide, and is mostly in the shape of a hollow sphere. With half of the float immersed in the liquid and the other half floating on the liquid surface, the float is driven up and down by changes in the liquid level. The liquid level changes are then converted into electrical signals or mechanical actions through a connecting rod mechanism or sensor to regulate the inflow and outflow of the liquid and maintain liquid level stability.

[0003] However, in practice, due to the highly corrosive nature of the electroplating solution, the underside of the float is susceptible to pitting corrosion from prolonged immersion in the solution. This pitting corrosion can cause tiny holes or cracks on the float surface, reducing its structural strength and even causing it to leak or fall out. This not only directly affects the float's buoyancy and positioning accuracy, but also threatens the stability of the entire level control system.

[0004] Furthermore, because electricity flows through the plating bath during the electroplating process, the liquid level fluctuates constantly. This fluctuation not only introduces errors into the float's level detection results, but also causes the portion of the float above the liquid surface, along with the nearby connecting rod, to intermittently submerge into the plating bath. This causes byproducts (such as oxides and salts) to adhere to the float's surface and gradually solidify. The accumulation of these byproducts significantly increases its weight, causing the float to drop below its normal position, thus affecting the accuracy of liquid level control and potentially causing false alarms or malfunctions. These issues directly degrade the performance of float-linked mechanical level control devices for PCB plating tanks, compromising the accuracy and stability of level control and, in turn, negatively impacting the quality and efficiency of PCB electroplating production.

[0005] Therefore, a float-linked PCB electroplating tank liquid level mechanical adjustment device is proposed. Summary of the Invention

[0006] The object of the present invention is to provide a float-linked PCB electroplating tank liquid level mechanical adjustment device, which solves the problems of pitting corrosion caused by the bottom of the float remaining stationary below the liquid surface for a long time, and the weight change caused by the adhesion of by-products on the upper side of the float and the nearby connecting rod, thereby preventing the float from remaining stationary below or above the liquid surface for a long time. This can prevent pitting corrosion on the lower side of the float and condensation of by-products on the upper side of the float. The ring plate assembly isolates the liquid level fluctuations from the float, thereby reducing the influence of the liquid level fluctuations on the float level measurement. At the same time, a protective airflow is formed near the connecting rod mechanism near the liquid surface by the protective assembly, thereby preventing the electroplating liquid from condensing at this position and causing its weight to change.

[0007] To achieve the above object, the present invention provides the following technical solutions: A float-linked PCB electroplating tank liquid level mechanical adjustment device includes an electroplating tank, a switch button, a connecting rod mechanism and a guide rail, the switch button is arranged on the upper side of the electroplating tank, the connecting rod mechanism is connected to the electroplating tank, the guide rail is connected to the inner wall of the electroplating tank, and the connecting rod mechanism cooperates with the guide rail. It also includes a float, a drive assembly, a ring plate assembly and a protective assembly, the drive assembly is connected to the connecting rod mechanism, the float is connected to the drive assembly, the ring plate assembly surrounds the outer ring of the float and is connected to the connecting rod mechanism, and the protective assembly is connected to the inside of the connecting rod mechanism; the drive assembly drives the float to rotate horizontally, and at the same time drives the ring plate assembly to rotate around the float, and the drive assembly prompts the protective assembly to blow air to the surface of the connecting rod mechanism above the liquid level.

[0008] Because current flows through the electroplating tank, the liquid level constantly fluctuates. The guide rail and linkage mechanism restrict the float's vertical movement to a vertical axis. The aforementioned solution allows the float to rotate about its horizontal axis under the action of the drive assembly. This prevents the bottom of the float from remaining stationary below the liquid level for extended periods, which could lead to pitting corrosion. It also prevents plating solution adhering to the upper side of the float from condensing into solids and affecting the float's weight, thereby ensuring the float's accuracy in level measurement and control. Furthermore, a ring plate assembly surrounds the float's edge, shielding it from the fluctuating liquid surface and thus reducing the impact of liquid level fluctuations on the float. Furthermore, since the linkage near the float is intermittently immersed in the electroplating solution, to prevent condensation of byproducts on its surface and affecting the overall weight, the drive assembly intermittently drives a protective airflow near the linkage, allowing any adhering plating solution to quickly flow downward into the electroplating tank. This keeps the surface of the linkage near the liquid level dry and clean, preventing changes in its weight from affecting the float's accuracy in level control.

[0009] Preferably, the driving assembly includes a driving motor and a driving rod, the driving motor is connected in a connecting rod mechanism, the driving rod is connected to an output end of the driving motor, and the driving rod passes through a float and is fixedly connected to the float.

[0010] Through the above solution, the drive motor drives the drive rod to rotate. Because the drive rod is connected to the float, the float will rotate about the drive rod as the axis, thereby preventing the bottom of the float from remaining stationary below the liquid surface for a long time and causing pitting corrosion. It also slows down the rate at which the electroplating liquid adhering to the upper side of the float solidifies, thereby reducing its impact on the buoyancy of the float, thereby ensuring the accuracy of the float in liquid level measurement and control.

[0011] Preferably, the ring plate assembly includes a retaining ring and a sliding rod, the sliding rod is connected to the connecting rod mechanism, the outer ring of the retaining ring is provided with a sliding rail, and the retaining ring is connected to the sliding rod via the sliding rail.

[0012] With the above solution, the relative positions of the retaining ring and the float are maintained by the sliding rod. When the float floats on the liquid surface, the retaining ring is always at the same horizontal height as the liquid surface. At the same time, the uppermost side of the retaining ring is higher than the liquid surface, while the lowermost side is lower than the liquid surface. This allows the retaining ring to separate the fluctuating liquid surface from the float, thereby reducing the impact of liquid surface fluctuations on the float.

[0013] Preferably, the retaining ring is installed at a height below the driving rod, and the inner diameter of the retaining ring is smaller than the diameter of the floating ball.

[0014] Through the above solution, since the height of the retaining ring is lower than the driving rod, that is, its height is also lower than the rotation axis of the float, in order to enable the retaining ring to contact the surface of the float, by setting the inner diameter of the retaining ring to be smaller than the diameter of the float, the retaining ring can scrape off the by-product crystals condensed and protruding from the surface of the float while the float rotates, thereby avoiding their influence on the weight of the float, thereby ensuring the accuracy of liquid level control; in addition, the retaining ring can also avoid liquid splashing caused by the rotation of the float.

[0015] Preferably, a gear 1 is provided on the driving rod, a gear ring is provided on the upper side of the retaining ring, the gear 1 is engaged with the gear ring, and a plurality of scrapers are connected in an array on the lower side of the retaining ring, and the width of the scrapers gradually decreases from the inner ring to the outer ring of the retaining ring.

[0016] Through the above scheme, while the driving rod drives the float to rotate, the gear on the driving rod drives the retaining ring to rotate by engaging with the gear ring. On the one hand, different positions of the retaining ring can participate in the scraping operation, which can prevent one side of the retaining ring from adhering to too many by-products after scraping the crystals for a long time, thereby affecting the subsequent scraping effect. On the other hand, the scraper can reduce the adhesion of the crystals, separate them and throw them out by the centrifugal force generated by the rotating retaining ring, thereby avoiding their influence on the liquid level measurement of the float. In addition, during the rotation process, the scraper can also cause the surrounding fluid to move toward the area away from the retaining ring, thereby offsetting the fluctuation of the surrounding liquid level to a certain extent, thereby further reducing the influence of the liquid level fluctuation on the float.

[0017] Preferably, a mounting cavity and an air cavity are provided inside the connecting rod mechanism; the driving rod is located in the mounting cavity and is connected to gear 2, and the tooth coverage angle on gear 2 is greater than one hundred and eighty degrees but less than three hundred and sixty degrees; the protective component includes a gear rod, a plug plate, a compression spring and an air outlet, the gear rod is located in the mounting cavity and cooperates with the gear, the plug plate is connected to the gear rod and is provided inside the air cavity, the compression spring is connected to the upper side of the plug plate and is connected to the inner wall of the air cavity, the air outlet is opened on the connecting rod mechanism and is connected to the air cavity, the air outlet is opened at a lower position of the air cavity, and the opening of the air outlet is set to face downward.

[0018] Through the above solution, when gear two rotates and engages with the gear rod, the gear rod will drive the plug plate to move upward and compress the compression spring. When gear two rotates close to the gear rod to an area without teeth, the gear rod is instantly reset under the action of the compression spring. At the same time, the plug plate squeezes all the gas in the air cavity under it out of the air outlet, thereby forming a protective airflow. The gas is blown to the surface of the connecting rod to prevent excessive electroplating liquid from adhering to its surface and condensing, which affects the detection effect of the float.

[0019] Preferably, the connecting rod mechanism is further provided with a plurality of vent holes, which are communicated with the air cavity and are located above the air cavity.

[0020] With the above solution, the air pressure in the air cavity on the upper side of the plug plate is balanced with the outside air pressure through the vent hole, thereby avoiding the situation where the plug plate cannot be moved upward due to excessive pressure.

[0021] Compared with the prior art, the present invention has the following beneficial effects: 1. A float-linked mechanical liquid-level adjustment device for a PCB electroplating tank of the present invention uses a drive assembly to cause the float to rotate, thereby preventing pitting corrosion caused by the bottom of the float remaining stationary below the liquid surface for a long period of time. This also prevents the electroplating solution adhering to the upper side of the float from condensing into a solid and affecting the weight of the float, thereby ensuring the accuracy of the float in liquid-level measurement and control. Furthermore, the float is separated from the fluctuating liquid surface by a ring plate assembly, thereby reducing the impact of liquid-level fluctuations on the float to a certain extent. Furthermore, a protective airflow is formed on the surface of the connecting rod mechanism near the liquid surface by a protective assembly, keeping the surface of the connecting rod mechanism near the liquid surface dry and tidy, thereby preventing weight changes due to condensation of by-products, which could affect the accuracy of the float in liquid-level control.

[0022] 2. The present invention provides a float-linked mechanical liquid level adjustment device for a PCB electroplating tank. A retaining ring is provided. On the one hand, the retaining ring is used to isolate the float, thereby preventing the area where the float is located at the liquid level from contacting the surrounding fluctuating liquid surface, thereby reducing the influence of the fluctuating liquid surface on the float to a certain extent. On the other hand, due to the inner diameter of the retaining ring and its relative position to the float, the retaining ring can scrape off by-product crystals that condense and protrude from the surface of the float while the float rotates, thereby preventing them from affecting the weight of the float and ensuring the accuracy of liquid level control. In addition, the retaining ring can also prevent liquid splashing caused by the rotation of the float.

[0023] 3. A float-linked mechanical liquid level adjustment device for a PCB electroplating tank of the present invention drives the retaining ring to rotate around the float by cooperating with gear 1 and the gear ring. On the one hand, different positions of the retaining ring can all participate in the scraping operation, thereby avoiding prolonged use of a specific area for scraping and affecting its service life. On the other hand, centrifugal force is provided by the rotation of the retaining ring, thereby throwing out the crystallized by-products scraped off and adhering to the lower side of the retaining ring. In addition, during the rotation of the scraper, the surrounding fluid can also be moved toward the area away from the retaining ring, thereby offsetting the fluctuation of the surrounding liquid level to a certain extent, thereby further reducing the impact of the liquid level fluctuation on the float. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a structural diagram of the location of the float of the present invention; Figure 2 This is a structural diagram of the relative positions of the switch button and the connecting rod mechanism of the present invention; Figure 3 This is a structural diagram of the positional relationship between the float and the ring plate assembly of the present invention; Figure 4 It is a structural schematic diagram of the ring plate assembly of the present invention; Figure 5 This is a structural diagram of the matching relationship between the gear 1 and the gear ring of the present invention; Figure 6 This is a schematic diagram of the structure of the gear 2 and the gear rod in the present invention; Figure 7 This is a structural diagram of the installation position of the protection component of the present invention in the connecting rod mechanism; Figure 8 This is a diagram of the gas flow state after the plug plate of the present invention is pressed down.

[0025] In the figure: 1. Electroplating tank; 2. Switch button; 3. Connecting rod mechanism; 4. Guide rail; 5. Float; 6. Drive assembly; 601. Drive motor; 602. Drive rod; 603. Gear 1; 604. Gear 2; 7. Ring plate assembly; 701. Retaining ring; 702. Slide rod; 703. Slide rail; 704. Gear ring; 705. Scraper; 8. Protective assembly; 801. Gear rod; 802. Plug plate; 803. Compression spring; 804. Air outlet; 805. Vent; 9. Mounting cavity; 10. Air cavity. DETAILED DESCRIPTION

[0026] The following will clearly and completely describe the technical solutions in the embodiments of the present invention in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0027] See also Figures 1 to 8 The present invention provides a float-linked PCB electroplating tank liquid level mechanical adjustment device, the technical solution is as follows: For details, please refer to Figure 1 、 Figure 2 and Figure 3 A float-linked PCB electroplating tank liquid level mechanical adjustment device includes an electroplating tank 1, a switch button 2, a connecting rod mechanism 3 and a guide rail 4. The switch button 2 is arranged on the upper side of the electroplating tank 1. Pressing the switch button 2 can replenish the electroplating liquid into the electroplating tank 1. When the liquid level in the electroplating tank 1 drops to a certain level, pressing the switch button 2 to replenish the electroplating liquid into the electroplating tank 1 to ensure the electroplating effect of the PCB board. The connecting rod mechanism 3 is connected to the electroplating tank 1. The connecting rod mechanism 3 is "L" shaped as a whole. The electroplating tank 1 is slidably connected, and a pressure block is provided above the switch button 2. When the connecting rod mechanism 3 is affected by the float 5 and moves downward, the pressure block can press the switch button 2 downward to control the replenishment of the electroplating solution. Since the current is passed through the electroplating tank 1, the liquid level will fluctuate continuously. The guide rail 4 is connected to the inner wall of the electroplating tank 1, and the connecting rod mechanism 3 cooperates with the guide rail 4, that is, the connecting rod mechanism 3 slides up and down in the guide rail 4, so that the guide rail 4 can only move the float 5 in the vertical direction and prevent it from shaking left and right. It also includes a float 5, a drive assembly 6, a ring plate assembly 7 and a protective assembly 8. The drive assembly 6 is connected to the connecting rod mechanism 3, and the float 5 is connected to the drive assembly 6. The interior of the float 5 is a hollow structure, so that it can float on the liquid surface of the electroplating solution. The drive assembly 6 drives the float 5 to rotate horizontally. In this way, the bottom of the float 5 is prevented from being stationary below the liquid surface for a long time and pitting corrosion occurs. At the same time, the electroplating solution adhering to the upper side of the float 5 is prevented from condensing into a solid and affecting the weight of the float 5, thereby ensuring the accuracy of the float 5 for liquid level measurement and control. The ring plate assembly 7 surrounds the outer ring of the float 5 and is connected to the connecting rod mechanism 3, thereby isolating the float 5 from the fluctuating liquid surface, thereby reducing the influence of the liquid surface fluctuation on the float 5 to a certain extent; the protective assembly 8 is connected to the inside of the connecting rod mechanism 3, and the driving assembly 6 is used to intermittently drive the protective assembly 8 to form a protective airflow near the connecting rod mechanism 3, so that the adhered electroplating liquid flows quickly downward into the electroplating tank 1, and keeps the surface of the connecting rod mechanism 3 near the liquid surface dry and tidy, so as to avoid its weight change affecting the accuracy of the liquid level control of the float 5.

[0028] As an embodiment of the present invention, refer to Figure 2 and Figure 3 The drive assembly 6 includes a drive motor 601 and a drive rod 602. The drive motor 601 is connected to the connecting rod mechanism 3. The drive rod 602 is connected to the output end of the drive motor 601, and the drive rod 602 passes through the float 5 and is fixedly connected to the float 5. The drive motor 601 drives the drive rod 602 to rotate. Because the drive rod 602 is connected to the float 5, the float 5 will rotate around the drive rod 602 as the axis, thereby preventing the bottom of the float 5 from staying below the liquid surface for a long time and causing pitting corrosion, and slowing down the speed at which the electroplating liquid adhering to the upper side of the float 5 condenses into a solid, thereby reducing its influence on the buoyancy of the float 5, thereby ensuring the accuracy of the float 5 for liquid level measurement and control.

[0029] As an embodiment of the present invention, refer to Figure 3 、 Figure 4 and Figure 5, the ring plate assembly 7 includes a retaining ring 701 and a sliding rod 702, the sliding rod 702 is connected to the connecting rod mechanism 3, the outer ring of the retaining ring 701 is provided with a sliding rail 703, the retaining ring 701 is connected to the sliding rod 702 through the sliding rail 703, and the sliding rod 702 is used to maintain the relative position of the retaining ring 701 and the float 5. When the float 5 floats on the liquid surface, the retaining ring 701 is always at the same level as the liquid surface. At the same time, the uppermost side of the retaining ring 701 is higher than the liquid surface, while the lowermost side is lower than the liquid surface, so that the retaining ring 701 can separate the fluctuating liquid surface from the float 5, thereby reducing the influence of the liquid surface fluctuation on the float 5; the installation height of the retaining ring 701 is located below the driving rod 602, and the inner diameter of the retaining ring 701 is smaller than the diameter of the float 5, so that the retaining ring 701 can scrape off the by-product crystals condensed and protruding on the surface of the float 5 while the float 5 rotates, thereby preventing it from affecting the weight of the float 5, thereby ensuring the accuracy of liquid level control; A gear 1 603 is provided on the driving rod 602, and a gear ring 704 is provided on the upper side of the retaining ring 701. The gear 1 603 is engaged with the gear ring 704. While the driving rod 602 drives the float 5 to rotate, the gear 1 603 on the driving rod 602 drives the retaining ring 701 to rotate by engaging with the gear ring 704. A plurality of scrapers 705 are connected to the lower side of the retaining ring 701 in an array. During the rotation process, the scrapers 705 can also move the surrounding fluid toward an area away from the retaining ring 701, thereby offsetting the fluctuation of the surrounding liquid level to a certain extent, thereby further reducing the impact of the liquid level fluctuation on the float 5. The width of the scraper 705 gradually decreases from the inner circle to the outer circle of the retaining ring 701.

[0030] As an embodiment of the present invention, refer to Figure 6 、 Figure 7 and Figure 8 , the interior of the connecting rod mechanism 3 is provided with a mounting cavity 9 and an air cavity 10; the driving rod 602 is located in the mounting cavity 9 and is connected to the second gear 604, and the coverage angle of the teeth on the second gear 604 is greater than one hundred and eighty degrees but less than three hundred and sixty degrees; therefore, when the teeth on the second gear 604 are engaged with the protective component 8, the protective component 8 can be driven to move, and when the contact position between the second gear 604 and the protective component 8 rotates to a part without teeth, the protective component 8 will lose the driving force and quickly reset, and the coverage angle of the teeth on the second gear 604 enables it to disengage from the protective component 8 after rotating a certain angle and then mesh with it, thereby realizing the reciprocating motion of the protective component 8; The protective assembly 8 includes a gear rod 801, a plug plate 802, a compression spring 803 and an air outlet 804. The gear rod 801 is located in the installation cavity 9 and cooperates with the gear. The plug plate 802 is connected to the gear rod 801 and is arranged inside the air cavity 10. The compression spring 803 is connected to the upper side of the plug plate 802 and is connected to the inner wall of the air cavity 10. When the gear 2 604 rotates and engages with the gear rod 801, the gear rod 801 will drive the plug plate 802 to move upward and compress the compression spring 803. The air outlet 804 is opened on the connecting rod mechanism 3 and is connected to the air cavity 10. When the gear 2 604 rotates to an area without teeth close to the gear rod 801, the gear rod 801 is instantly reset under the action of the compression spring 803, and at the same time, the plug plate 802 squeezes all the gas in the air cavity 10 below it out from the air outlet 804, thereby forming a protective gas The gas flows toward the surface of the connecting rod to prevent excessive plating liquid from adhering to the surface and condensing to affect the detection effect of the float 5; the air outlet 804 is provided at the lower position of the air cavity 10, and the opening of the air outlet 804 is downwardly facing; when the plug plate 802 moves upward, in order to prevent the plug plate 802 from being unable to move upward due to excessive pressure, a plurality of air vents 805 are further provided on the connecting rod mechanism 3, and the air vents 805 are connected to the air cavity 10 and are located at the upper position of the air cavity 10. When the plug plate 802 moves upward, the gas in the air cavity 10 above the plug plate 802 is squeezed out through the air vents 805, thereby balancing the air pressure in the air cavity 10 above the plug plate 802 with the outside world. The air pressure in the air cavity 10 above the plug plate 802 is balanced with the outside world through the air vents 805, thereby preventing the plug plate 802 from being unable to move upward due to excessive pressure.

[0031] The specific working principle is as follows: in order to prevent the lower side of the float 5 from being immersed in the electroplating solution for a long time and causing pitting corrosion, thereby reducing the structural strength of the float 5 and thus affecting the buoyancy and positioning accuracy of the float 5, this solution causes the float 5 to rotate by driving the assembly 6, thereby preventing a certain position of the float 5 from being stationary below the liquid surface for a long time. At the same time, after the float 5 rotates, it can also prevent the part above the liquid surface from adhering to the electroplating solution and condensing by-products, thereby affecting the quality of the float 5 and further affecting the buoyancy and positioning accuracy of the float 5. In addition, the ring plate assembly 7 is used to separate the float 5 from the fluctuating liquid surface, thereby reducing the impact of the liquid surface fluctuation on the float 5 to a certain extent, and the ring plate assembly 7 is used to scrape off the by-products that have condensed on the float 5. Specifically, the drive motor 601 drives the float 5 to rotate about the drive rod 602 via the drive rod 602. During this process, the same area of the float 5 will not remain stationary below the liquid surface for a long time, thereby preventing pitting corrosion in specific areas of the float 5 and affecting its normal use. On the other hand, the upper surface of the float 5 will be in constant motion and in contact with the electroplating liquid, thereby preventing the upper surface of the float 5 from being exposed to the air for a long time after being adhered to the electroplating liquid and drying out, thereby condensing into solid crystals, thereby reducing the impact of the plating liquid on the buoyancy of the float 5. When the float 5 rotates, one side of the float 5 moves from below the liquid level to above the liquid level, and this area will intersect with the retaining ring 701, so that the impurities adhering to the surface of the float 5 can be scraped off by the retaining ring 701, thereby preventing the impurities from affecting the weight of the float 5; at the same time, when the driving rod 602 drives the float 5 to rotate, it drives the retaining ring 701 to rotate through the engagement of the gear 1 603 and the gear ring 704, so that different positions of the retaining ring 701 can participate in the scraping operation, which can prevent one side of the retaining ring 701 from being scraped off for a long time. After the crystals are scraped off, the subsequent scraping effect is affected due to excessive adhesion of by-products. During this process, the scraped by-products are dispersed between the two adjacent scrapers 705 and thrown out with the centrifugal force generated when the retaining ring 701 rotates, avoiding their impact on the liquid level measurement of the float 5. In addition, the scraper can move the surrounding fluid toward the area away from the retaining ring 701 during the process of rotating with the retaining ring 701, thereby offsetting the fluctuation of the surrounding liquid level to a certain extent, thereby further reducing the impact of the liquid level fluctuation on the float 5.

[0032] In addition, the connecting rod mechanism 3 located near the float 5 will also be intermittently immersed in the liquid surface, so that electroplating liquid will remain on its surface. If it is not treated, by-product condensation will also easily occur, affecting the overall quality. Therefore, when the transmission rod rotates, the gears at both ends of the transmission rod will engage with the gear rod 801, and then drive the gear rod 801 to move upward and compress the compression spring 803 to accumulate force, and at the same time, the gas will be drawn into the air cavity 10 below the plug plate 802. Since the teeth on the gear do not cover 360 degrees, when it rotates to the part without teeth, the gear rod 801 will lose the power to move upward and move downward instantly under the action of the compression spring 803, and at the same time squeeze the gas in the air cavity 10 out from the outlet 804, so that the gas is blown to the surface of the connecting rod mechanism 3, so that its surface remains dry and avoids by-product condensation, thereby avoiding affecting the precise control of the liquid level by the float 5 due to weight changes.

[0033] While embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions, and variations may be made to these embodiments without departing from the principles and spirit of the invention, and that the scope of the invention is defined by the appended claims and their equivalents.

Claims

1. A float-linked PCB electroplating tank liquid level mechanical adjustment device, comprising an electroplating tank (1), a switch button (2), a connecting rod mechanism (3) and a guide rail (4), wherein the switch button (2) is arranged on the upper side of the electroplating tank (1), the connecting rod mechanism (3) is connected to the electroplating tank (1), and the guide rail (4) is connected to the inner wall of the electroplating tank (1), and the connecting rod mechanism (3) and the guide rail (4) are matched, characterized in that: The invention also includes a float (5), a drive assembly (6), a ring plate assembly (7) and a protective assembly (8), wherein the drive assembly (6) is connected to the connecting rod mechanism (3), the float (5) is connected to the drive assembly (6), the ring plate assembly (7) surrounds the outer ring of the float (5) and is connected to the connecting rod mechanism (3), and the protective assembly (8) is connected to the inside of the connecting rod mechanism (3); the drive assembly (6) drives the float (5) to rotate horizontally and drives the ring plate assembly (7) to rotate around the float (5), and the drive assembly (6) prompts the protective assembly (8) to blow air to the surface of the connecting rod mechanism (3) above the liquid surface.

2. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 1, characterized in that: The driving assembly (6) comprises a driving motor (601) and a driving rod (602), wherein the driving motor (601) is connected to the connecting rod mechanism (3), the driving rod (602) is connected to the output end of the driving motor (601), and the driving rod (602) passes through the floating ball (5) and is fixedly connected to the floating ball (5).

3. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 2, characterized in that: The ring plate assembly (7) comprises a retaining ring (701) and a sliding rod (702), wherein the sliding rod (702) is connected to the connecting rod mechanism (3), a sliding rail (703) is provided on the outer ring of the retaining ring (701), and the retaining ring (701) is connected to the sliding rod (702) via the sliding rail (703).

4. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 3, characterized in that: The mounting height of the retaining ring (701) is located below the driving rod (602), and the inner diameter of the retaining ring (701) is smaller than the diameter of the floating ball (5).

5. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 3, characterized in that: The driving rod (602) is provided with a gear 1 (603), the upper side of the retaining ring (701) is provided with a gear ring (704), the gear 1 (603) is meshed with the gear ring (704), and the lower side of the retaining ring (701) is connected to a plurality of scrapers (705) in an array, and the width of the scrapers (705) gradually decreases from the inner ring to the outer ring of the retaining ring (701).

6. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 3, characterized in that: The connecting rod mechanism (3) is provided with a mounting cavity (9) and an air cavity (10); the driving rod (602) is located in the mounting cavity (9) and is connected to a second gear (604); the tooth coverage angle of the second gear (604) is greater than one hundred and eighty degrees but less than three hundred and sixty degrees; the protective component (8) comprises a gear rod (801), a plug plate (802), a compression spring (803) and an air outlet (804); the gear rod (801) is located in the mounting cavity (9) and cooperates with the gear; the plug plate (802) is connected to the gear rod (801) and is provided in the air cavity (10); the compression spring (803) is connected to the upper side of the plug plate (802) and is connected to the inner wall of the air cavity (10); the air outlet (804) is opened on the connecting rod mechanism (3) and communicates with the air cavity (10).

7. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 6, characterized in that: The air outlet (804) is located at a lower position of the air cavity (10), and the opening of the air outlet (804) is arranged to face downward.

8. The float-linked PCB electroplating tank liquid level mechanical adjustment device according to claim 6, characterized in that: The connecting rod mechanism (3) is also provided with a plurality of vent holes (805), the vent holes (805) being in communication with the air cavity (10) and being located above the air cavity (10).

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